TWI764611B - Antenna manufacturing method and structure for the same - Google Patents
Antenna manufacturing method and structure for the sameInfo
- Publication number
- TWI764611B TWI764611B TW110108545A TW110108545A TWI764611B TW I764611 B TWI764611 B TW I764611B TW 110108545 A TW110108545 A TW 110108545A TW 110108545 A TW110108545 A TW 110108545A TW I764611 B TWI764611 B TW I764611B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- hole
- holes
- line segment
- line segments
- Prior art date
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Details Of Aerials (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
Description
本發明係有關一種天線,尤指一種具有接收及發射訊號的晶片天線的製造方法及其結構。The present invention relates to an antenna, in particular to a manufacturing method and structure of a chip antenna capable of receiving and transmitting signals.
隨著無線通訊科技的發展,電子產品例如筆記型電腦、行動電話、個人數位助理(PDA)等可攜式電子裝置均朝向輕薄化進行設計開發 。 With the development of wireless communication technology, electronic products such as notebook computers, mobile phones, personal digital assistants (PDAs) and other portable electronic devices are all designed and developed towards thinness and lightness .
目前市面上電子裝置內部所使用的多頻段的天線結構具有一晶片天線及一基板。該晶片天線係以陶瓷材料製造成一方形的基板,並以印刷技術或微影、濕式蝕刻技術將輻射體製造於該基板的表面上 。在該晶片天線在與該載板電性連結時,將該晶片天線的輻射體與載板上的微帶線進行電性連結,在該微帶線與銅軸電纜線電性連結後,該輻射金屬部在收到信號後,並將信號經微帶線傳給銅軸電纜線,再由銅軸電纜線傳給電子裝置的主機板進行處理,以達通訊之目的。 A multi-band antenna structure currently used in electronic devices on the market has a chip antenna and a substrate. The chip antenna is made of ceramic material into a square substrate, and the radiator is fabricated on the surface of the substrate by printing technology or lithography and wet etching technology . When the chip antenna is electrically connected to the carrier board, the radiator of the chip antenna is electrically connected to the microstrip line on the carrier board. After the microstrip line is electrically connected to the copper coaxial cable, the After receiving the signal, the radiating metal part transmits the signal to the copper coaxial cable through the microstrip line, and then the copper coaxial cable is transmitted to the main board of the electronic device for processing, so as to achieve the purpose of communication.
由於上述的晶片天線上的輻射體係透過印刷技術或微影、濕式蝕刻技術來製造,雖然晶片天線體積較傳統的天線縮小許多,但是過去的晶片天線在製程上的穩定性較差,致使所製造出來的晶片天線不良率也隨著提升,而且在晶片線製造後,所剩餘的材料過多,導致材料的浪費,也造成製造成本的增加。Since the radiation system on the above-mentioned chip antenna is manufactured by printing technology or lithography and wet etching technology, although the volume of the chip antenna is much smaller than that of the traditional antenna, the stability of the past chip antenna in the process is poor, resulting in the manufacture of The defect rate of the outgoing chip antenna also increases, and after the wafer line is manufactured, there are too many remaining materials, which leads to a waste of materials and an increase of manufacturing costs.
因此,本發明之主要目的,在於提供一新的製造方法及其結構,可以改善晶片天線製程穩定性,使該晶片天線製造良率提升,更增加了材料利用率。Therefore, the main purpose of the present invention is to provide a new manufacturing method and structure, which can improve the process stability of the chip antenna, improve the manufacturing yield of the chip antenna, and increase the utilization rate of materials.
為達上述之目的,本發明提供一種天線製造方法,包括:備有一基板,該基板的正面及背面上各具有一金屬層。在該基板所預定製造天線的相關位置上鑽製有複數排呈縱向排列的通孔。將銅金屬材料電鍍於該基板正面及背面的該金屬層及該些通孔的孔壁上形成一導電層。以蝕刻製造技術,於該基板正面及背面的該金屬層及該導電層形成一與該些通孔電性連結的線路層,該線路層包含有複數條的斜向線段及複數條的橫向線段。將油墨印刷於該基板,並覆蓋該基板正面及背面該線路層的該些斜向線段與該些橫向線段形成一防焊層,該防焊層僅使該些通孔的線路層外露。透過電鍍技術將錫金屬材料電鍍於該基板正面及背面外露的該些通孔的該導電層上,以形成該天線焊接的電極層。In order to achieve the above-mentioned object, the present invention provides a method for manufacturing an antenna, comprising: preparing a substrate with a metal layer on the front surface and the back surface of the substrate. A plurality of rows of longitudinally arranged through holes are drilled at the relevant positions of the substrate where the antenna is intended to be manufactured. A conductive layer is formed by electroplating copper metal material on the metal layer on the front and back surfaces of the substrate and the hole walls of the through holes. A circuit layer electrically connected to the through holes is formed on the metal layer and the conductive layer on the front and back sides of the substrate by etching technology, and the circuit layer includes a plurality of oblique line segments and a plurality of transverse line segments . The ink is printed on the substrate and covers the oblique line segments and the transverse line segments of the circuit layer on the front and back of the substrate to form a solder resist layer, which exposes only the circuit layers of the through holes. A tin metal material is electroplated on the conductive layer of the exposed through holes on the front and back of the substrate by electroplating technology, so as to form an electrode layer for soldering the antenna.
在本發明之一實施例中,該基板為印刷電路板。In one embodiment of the present invention, the substrate is a printed circuit board.
在本發明之一實施例中,該些通孔直徑為0.15mm。In an embodiment of the present invention, the diameter of the through holes is 0.15mm.
在本發明之一實施例中,蝕刻製造技術,以濕式的化學蝕刻或乾式的雷射光。In one embodiment of the present invention, the etching manufacturing technique is wet chemical etching or dry laser light.
在本發明之一實施例中,該些斜向線段由一第一斜向線段及一第二斜向線段組成,該些橫向線段由一第一橫向線段、一第二橫向線段及一第三橫向線段組成。In an embodiment of the present invention, the oblique line segments are composed of a first oblique line segment and a second oblique line segment, and the transverse line segments are composed of a first transverse line segment, a second transverse line segment and a third transverse line segment Consists of horizontal line segments.
在本發明之一實施例中,該些斜向線段中的該第一斜向線段係以電性連結該基板正面第一排的第二個通孔與第二排的第一個通孔,以及該第二斜向線段電係連結該第一排的第三個通孔與該第二排的第二個通孔;該些橫向線段中的該第一橫向線段係以電性連結該基板背面該第一排的第一個通孔與該第二排的該第一個通孔,該第二橫向線段電性連結該第一排的該第二個通孔與該第二排的該第二個通孔,該第三橫向線段電性連結該第一排的該第三個通孔與該第二排的第三個通孔。In an embodiment of the present invention, the first oblique line segment among the oblique line segments is electrically connected to the second through hole in the first row on the front surface of the substrate and the first through hole in the second row, and the second oblique line segment is electrically connected to the third through hole of the first row and the second through hole of the second row; the first transverse line segment of the transverse line segments is electrically connected to the substrate The first through hole of the first row and the first through hole of the second row on the back side, and the second transverse line segment is electrically connected to the second through hole of the first row and the second through hole of the second row. A second through hole, the third lateral line segment is electrically connected to the third through hole of the first row and the third through hole of the second row.
在本發明之一實施例中,該些斜向線段及該些橫向線段在電性連結該基板正面及背面的該些通孔後,使該線路層形成螺旋狀的貫穿該基板。In an embodiment of the present invention, after the oblique line segments and the lateral line segments are electrically connected to the through holes on the front and back surfaces of the substrate, the circuit layer forms a spiral through the substrate.
在本發明之一實施例中,該油墨為黑色或白色的絕緣材料。In one embodiment of the present invention, the ink is a black or white insulating material.
在本發明之一實施例中,更包含有切割製造,以每一排的該些通孔的中心點為縱向裁切線,以及以每一排的第三通孔與另一個相鄰的第一通孔之間的間隙為橫向裁切線,以對準該基板上的縱向及橫向裁切線裁切,即形成單一顆天線使得該些通孔形成側邊孔。In one embodiment of the present invention, it further includes cutting and manufacturing, taking the center point of the through holes in each row as a longitudinal cutting line, and taking the third through holes in each row and the first adjacent one another. The gaps between the through holes are horizontal cutting lines, which are cut in alignment with the vertical and horizontal cutting lines on the substrate, ie, a single antenna is formed so that the through holes form side holes.
在本發明之一實施例中,該側邊孔為半圓形。In an embodiment of the present invention, the side hole is semicircular.
為達上述之目的,本發明另提供一種天線結構,包括:一基板、一防焊層及一電極層。該基板具有二相對應平行的一第一長邊、一第二長邊及二短邊,於該第一長邊及該第二長邊上各設有複數個側邊孔及一與該側邊孔電性連結的線路層,該些側邊孔上各具有一導電層,該導電層與該線路層電性連結,該線路層包含有複數條的斜向線段及複數條的橫向線段;該防焊層設於該基板的正面及背面,以覆蓋該線路層的該些斜向線段與該些橫向線段,該防焊層僅使該些側邊孔上的線路層外露。該電極層設於該基板正面及背面上外露的該些側邊孔的該導電層上,以形成天線焊接的電極層。In order to achieve the above object, the present invention further provides an antenna structure, comprising: a substrate, a solder mask layer and an electrode layer. The substrate has two correspondingly parallel first long sides, second long sides and two short sides, and a plurality of side holes and a side hole and a side hole are respectively provided on the first long side and the second long side. A circuit layer electrically connected with side holes, each of the side holes has a conductive layer, the conductive layer is electrically connected with the circuit layer, and the circuit layer includes a plurality of oblique line segments and a plurality of transverse line segments; The solder resist layer is disposed on the front and back surfaces of the substrate to cover the oblique line segments and the transverse line segments of the circuit layer, and the solder resist layer only exposes the circuit layer on the side holes. The electrode layer is disposed on the conductive layer of the side holes exposed on the front and back surfaces of the substrate to form an electrode layer for antenna welding.
在本發明之一實施例中,該些斜向線段由一第一斜向線段及一第二斜向線段組成,該些橫向線段由一第一橫向線段、一第二橫向線段及一第三橫向線段組成。In an embodiment of the present invention, the oblique line segments are composed of a first oblique line segment and a second oblique line segment, and the transverse line segments are composed of a first transverse line segment, a second transverse line segment and a third transverse line segment Consists of horizontal line segments.
在本發明之一實施例中,該些斜向線段中的第一斜向線段係以電性連結該基板正面第一長邊的第二個側邊孔與第二長邊第一個側邊孔,以及該第二斜向線段電係連結該第一長邊的第三個側邊孔與該第二長邊的第二個側邊孔;該些橫向線段中的第一橫向線段係以電性連結該基板背面該第一長邊的第一個側邊孔與該第二長邊的該第一個側邊孔,該第二橫向線段電性連結該第一長邊的該第二個側邊孔與該第二長邊的該第二個側邊孔,該第三橫向線段電性連結該第一長邊的該第三個側邊孔與該第二長邊的第三個側邊孔。In an embodiment of the present invention, a first oblique line segment of the oblique line segments is electrically connected to the second side hole of the first long side of the front surface of the substrate and the first side edge of the second long side The hole, and the second oblique line segment are electrically connected to the third side hole of the first long side and the second side hole of the second long side; the first transverse line segment of the transverse line segments is The first side hole of the first long side on the back of the substrate is electrically connected to the first side hole of the second long side, and the second transverse line segment is electrically connected to the second side hole of the first long side. a side hole and the second side hole of the second long side, the third transverse line segment is electrically connected to the third side hole of the first long side and the third side hole of the second long side side holes.
在本發明之一實施例中,該些斜向線段與該些橫向線段在電性連結該基板正面及背面的該些側邊孔,使該線路層形成螺旋狀的貫穿該基板。In an embodiment of the present invention, the oblique line segments and the transverse line segments are electrically connected to the side holes on the front and back surfaces of the substrate, so that the circuit layer forms a spiral through the substrate.
在本發明之一實施例中,該基板為印刷電路板。In one embodiment of the present invention, the substrate is a printed circuit board.
在本發明之一實施例中,該些側邊孔為半圓形。In an embodiment of the present invention, the side holes are semicircular.
在本發明之一實施例中,該防焊層為黑色或白色油墨的絕緣材料。In one embodiment of the present invention, the solder resist layer is an insulating material of black or white ink.
在本發明之一實施例中,該導電層為銅金屬材料。In an embodiment of the present invention, the conductive layer is made of copper metal material.
在本發明之一實施例中,該電極層為錫金屬材料。In an embodiment of the present invention, the electrode layer is made of tin metal material.
茲有關本發明之技術內容及詳細說明,現配合圖式說明如下:Hereby, the technical content and detailed description of the present invention are described as follows in conjunction with the drawings:
請參閱圖1,係本明之天線製造流程示意圖;同時一併參閱圖2-9的各步驟的半成品結構示意圖。如圖所示:本發明之天線製造方法,首先,如步驟S100,備有一基板1,該基板1的正面及背面上具有一金屬層11(如圖2所示)。在本圖式中,該基板1為印刷電路板。Please refer to FIG. 1 , which is a schematic diagram of the antenna manufacturing process of the present invention; meanwhile, refer to the schematic structural diagrams of the semi-finished products of each step in FIGS. 2-9 . As shown in the figure, in the antenna manufacturing method of the present invention, firstly, in step S100, a
步驟S102,鑽孔製造,以加工機具於該基板1所預定製造天線10(如圖3)的相關位置上鑽製有複數排呈縱向排列的通孔12,該些通孔12側的基板1上具有一機台對位用鑽孔13 (如圖3所示)。在本圖式中,該些通孔12直徑為0.15mm。Step S102 , drilling and manufacturing, using a processing tool to drill a plurality of rows of longitudinally arranged through
步驟S104,電鍍製造,將銅金屬材料透過電鍍技術於該基板1正面及背面的金屬層11及該些通孔12的孔壁上形成一導電層2 (如圖4所示)。Step S104 , electroplating manufacturing, a
步驟S106,曝光、顯影、蝕刻技術製造,以濕式的化學蝕刻或乾式的雷射光直接成像蝕刻製造(laser direct imaging,LDI)技術,於該基板1正面及背面的該金屬層11及該導電層2形成一與該些通孔12電性連結的線路層21,該線路層(輻射層)21包含有複數條的斜向線段211及複數條的橫向線段212。該些斜向線段211由一第一斜向線段211a及一第二斜向線段211b組成,該些橫向線段212由一第一橫向線段212a、一第二橫向線段212b及一第三橫向線段212c組成。該些斜向線段211中的第一斜向線段211a係以電性連結該基板1正面第一排的第二個通孔12b與第二排的第一個通孔12d,以及該第二斜向線段211b電係連結該第一排的第三個通孔12c與該第二排的第二個通孔12e。該些橫向線段212中的第一橫向線段212a係以電性連結該基板1背面第一排的第一個通孔12a與第二排的第一個通孔12d。該第二橫向線段212b電性連結該第一排的第二個通孔12b與該第二排的第二個通孔12e。該第三橫向線段212c電性連結該第一排的第三個通孔12c與該第二排的第三個通孔12f(如圖5a-5c)。依此類推完成整個基板1所有通孔12的電性連結。且,在該些斜向線段211與該些橫向線段212在電性連結該基板1正面及背面的該些通孔12a、12b、12c、12d、12e及12f後,使該線路層21形成螺旋狀的貫穿該基板1。Step S106 , manufacturing by exposure, development, and etching technology, using wet chemical etching or dry laser direct imaging etching (laser direct imaging, LDI) technology, the
步驟S108,防焊層製造,在該線路層21製造完成後,透過印刷技術將黑色或白色的油墨印刷於該基板1,並覆蓋該基板1正面及背面該線路層21的該些斜向線段211與該些橫向線段212形成防焊層3(如圖6a-6c),印刷後的防焊層3僅讓該些通孔12a、12b、12c、12d、12e及12f上的線路層21外露。在本圖式中,該黑色或白色油墨為絕緣材料。Step S108 , manufacturing the solder mask. After the
步驟S110,電極層製造,在上述的該防焊層3製造完成後,透過電鍍技術將錫金屬材料電鍍於該基板1的正面及背面上外露的該些通孔12a、12b、12c、12d、12e及12f的該導電層2上,以形成可供天線10焊接的電極層4(如圖7)。Step S110, electrode layer fabrication, after the above-mentioned
步驟S112,切割製造,在上述的電極層4製造完成後,以每一排的通孔12的中心點為縱向裁切線A,以每一排的第三通孔12c與另一個相鄰的第一通孔12a之間的間隙為橫向裁切線B(如圖8),以裁切工具對準該基板1上的縱向及橫向裁切線A、B裁切後,即形成如圖9的單一顆天線10,同時也使得該些通孔12a、12b、12c、12d、12e及12f形成半圓形的側邊孔121。Step S112, cutting and manufacturing. After the above-mentioned
請參閱圖2-9,係本發明之各步驟的半成品結構示意圖。如圖所示﹕本發明之天線結構10,包括﹕一基板1、一防焊層3及一電極層4。Please refer to FIGS. 2-9 , which are schematic structural diagrams of semi-finished products in each step of the present invention. As shown in the figure, the
該基板1,其上具有二個相對應平行的第一長邊14、第二長邊15及二短邊16,於該第一、二長邊14、15上各設有複數個側邊孔121(在本實施例中以三個側邊孔為例)及一與該些側邊孔121電性連結的線路層21。該些側邊孔121上各具有一導電層2,該導電層2與該線路層21電性連結,該線路層21包含有複數條的斜向線段211及複數條的橫向線段212。該些斜向線段211由一第一斜向線段211a及一第二斜向線段211b組成,該些橫向線段212由一第一橫向線段212a、一第二橫向線段212b及一第三橫向線段212c組成。該些斜向線段211中的第一斜向線段211a係以電性連結該基板1正面第一長邊14的第二個通孔(第二個側邊孔)12b與第二長邊15的第一個通孔(第一個側邊孔)12d,以及該第二斜向線段211b電係連結該第一長邊14的第三個通孔(第三個側邊孔)12c與該第二長邊15的第二個通孔(第二個側邊孔)12e。該些橫向線段212中的第一橫向線段212a係以電性連結該基板1背面第一長邊14的第一個通孔(第一個側邊孔)12a與第二長邊15的第一個通孔(第一個側邊孔)12d。該第二橫向線段212b電性連結該第一長邊14的第二個通孔(第二個側邊孔)12b與該第二長邊15的第二個通孔(第二個側邊孔)12e。該第三橫向線段212c電性連結該第一長邊14的第三個通孔(第三個側邊孔)12c與該第二長邊15的第三個通孔(第三個側邊孔)12f(如圖5a-5c)。依此類推完成整個基板1所有通孔12的電性連結。且,在該些斜向線段211與該些橫向線段212在電性連結該基板1正面及背面的該些通孔(該些側邊孔)12a、12b、12c、12d、12e及12f後,使該線路層21形成螺旋狀的貫穿該基板1。在本圖式中,該基板1為印刷電路板;該些側邊孔為半圓形。The
該防焊層3,透過印刷技術將黑色油墨印刷於該基板1的正面及背面,並覆蓋該線路層21的該些斜向線段211與該些橫向線段212形成防焊層3(如圖6a-6c),印刷後的防焊層3僅讓該些通孔(該些側邊孔)12a、12b、12c、12d、12e及12f上的線路層21外露。在本圖式中,該黑色或白色油墨為絕緣材料。The solder resist
該電極層4,透過電鍍技術將錫金屬材料電鍍於該基板1正面及背面上外露的該些通孔(該些側邊孔)12a、12b、12c、12d、12e及12f的該導電層2上以形成可供天線10焊接的電極層4。The
上述僅為本發明之較佳實施例而已,並非用來限定本發明實施之範圍。即凡依本發明申請專利範圍所做的均等變化與修飾,皆為本發明專利範圍所涵蓋。The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the scope of implementation of the present invention. That is, all equivalent changes and modifications made according to the scope of the patent application of the present invention are all covered by the patent scope of the present invention.
步驟S100-步驟S112Step S100 - Step S112
10:天線10: Antenna
1:基板1: Substrate
11:金屬層11: Metal layer
12、12a、12b、12c、12d、12e、12f:通孔12, 12a, 12b, 12c, 12d, 12e, 12f: through holes
13:鑽孔13: Drilling
14:第一長邊14: The first long side
15:第二長邊15: Second Long Side
16:短邊16: Short side
2:導電層2: Conductive layer
21:線路層21: circuit layer
211:斜向線段211: Oblique line segment
211a:第一斜向線段211a: first oblique line segment
211b:第二斜向線段211b: Second oblique line segment
212:橫向線段212: Horizontal line segment
212a:第一橫向線段212a: first transverse line segment
212b:第二橫向線段212b: Second horizontal line segment
212c:第三橫向線段212c: Third horizontal line segment
3:防焊層3: Solder mask
4:電極層4: Electrode layer
A:縱向裁切線A: Vertical cutting line
B:橫向裁切線B: Horizontal cutting line
圖1,係本發明之天線製造流程示意圖﹔FIG. 1 is a schematic diagram of the manufacturing process of the antenna of the present invention;
圖2,係本發明之基板的側視示意圖﹔FIG. 2 is a schematic side view of the substrate of the present invention;
圖3,係在圖2的基板上進行鑽孔製造結構示意圖﹔Fig. 3 is a schematic diagram of the structure of drilling on the substrate of Fig. 2;
圖4,係在圖3的電鍍的導電層製造的結構側剖視示意圖﹔FIG. 4 is a schematic side cross-sectional view of the structure fabricated by the electroplated conductive layer of FIG. 3;
圖5a-5c,係在圖4進行曝光、顯影、蝕刻製造結構示意圖﹔Figures 5a-5c are schematic diagrams of the structure of exposure, development and etching in Figure 4;
圖6a-6c,係在圖5a-5c進行防焊電極層製造結構示意圖﹔Figures 6a-6c are schematic diagrams of the fabrication of the solder mask electrode layer in Figures 5a-5c;
圖7,係在圖6c進行鍍錫製造結構示意圖﹔Fig. 7 is a schematic diagram of the tin-plating manufacturing structure in Fig. 6c;
圖8,係本發明之鍍錫後,對基板上以完成的天線進行切割示意圖﹔Fig. 8 is a schematic diagram of cutting the completed antenna on the substrate after tin plating of the present invention;
圖9,係在圖8裁切後的單顆天線結構示意圖。FIG. 9 is a schematic structural diagram of a single antenna after being cut in FIG. 8 .
步驟S100-步驟S112 Step S100 - Step S112
Claims (15)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW110108545A TWI764611B (en) | 2021-03-10 | 2021-03-10 | Antenna manufacturing method and structure for the same |
CN202210208020.2A CN115084841B (en) | 2021-03-10 | 2022-03-04 | Antenna manufacturing method and structure thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW110108545A TWI764611B (en) | 2021-03-10 | 2021-03-10 | Antenna manufacturing method and structure for the same |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI764611B true TWI764611B (en) | 2022-05-11 |
TW202236735A TW202236735A (en) | 2022-09-16 |
Family
ID=82594214
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW110108545A TWI764611B (en) | 2021-03-10 | 2021-03-10 | Antenna manufacturing method and structure for the same |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN115084841B (en) |
TW (1) | TWI764611B (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201721966A (en) * | 2015-12-07 | 2017-06-16 | 昌澤科技有限公司 | Method for manufacturing chip signal element |
CN111355028A (en) * | 2020-03-13 | 2020-06-30 | 上海剑桥科技股份有限公司 | Dual-frequency PCB helical antenna |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3472678B2 (en) * | 1997-02-20 | 2003-12-02 | シャープ株式会社 | Antenna integrated microwave / millimeter wave circuit |
JP3843428B2 (en) * | 2002-10-31 | 2006-11-08 | ソニーケミカル&インフォメーションデバイス株式会社 | Chip-shaped antenna element, manufacturing method thereof, and printed circuit board mounted with antenna |
JP2005005985A (en) * | 2003-06-11 | 2005-01-06 | Sony Chem Corp | Antenna element and antenna mounting substrate |
CN100455162C (en) * | 2004-11-05 | 2009-01-21 | 日月光半导体制造股份有限公司 | Method for making circuit board |
CN1988251B (en) * | 2005-12-20 | 2012-02-08 | 财团法人工业技术研究院 | Method for producing radio frequency identifying antenna and its antenna structure |
KR100995589B1 (en) * | 2010-02-17 | 2010-11-22 | 에이큐 주식회사 | The helycal antenna and it method with 2d-type of file up |
JP6604178B2 (en) * | 2015-12-10 | 2019-11-13 | 株式会社村田製作所 | Antenna device and manufacturing method thereof |
CN108879083B (en) * | 2017-05-09 | 2020-05-26 | 昌泽科技有限公司 | Method for manufacturing chip signal element |
US11228087B2 (en) * | 2018-03-16 | 2022-01-18 | Sj Semiconductor (Jiangyin) Corporation | Antenna package structure and antenna packaging method |
CN109600939B (en) * | 2018-10-30 | 2019-09-20 | 庆鼎精密电子(淮安)有限公司 | The production method of thin type antenna circuit board |
CN112153811B (en) * | 2019-06-28 | 2022-07-26 | 鹏鼎控股(深圳)股份有限公司 | Circuit board and manufacturing method thereof |
-
2021
- 2021-03-10 TW TW110108545A patent/TWI764611B/en active
-
2022
- 2022-03-04 CN CN202210208020.2A patent/CN115084841B/en active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201721966A (en) * | 2015-12-07 | 2017-06-16 | 昌澤科技有限公司 | Method for manufacturing chip signal element |
CN111355028A (en) * | 2020-03-13 | 2020-06-30 | 上海剑桥科技股份有限公司 | Dual-frequency PCB helical antenna |
Also Published As
Publication number | Publication date |
---|---|
CN115084841B (en) | 2024-05-07 |
CN115084841A (en) | 2022-09-20 |
TW202236735A (en) | 2022-09-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN108879083B (en) | Method for manufacturing chip signal element | |
US20060186537A1 (en) | Delamination reduction between vias and conductive pads | |
US7877873B2 (en) | Method for forming a wire bonding substrate | |
US20050247481A1 (en) | Circuit board with quality-indicator mark and method for indicating quality of the circuit board | |
US10595411B2 (en) | Method for manufacturing chip signal elements | |
TWI764611B (en) | Antenna manufacturing method and structure for the same | |
TWI587573B (en) | Method for manufacturing chip signal element | |
JP2013078027A (en) | Patch antenna | |
WO2024109670A1 (en) | Circuit board assembly, and preparation method for circuit board assembly | |
KR101005641B1 (en) | A method of substrate manufacture that decreases the package resistance | |
JP2008263263A (en) | Antenna element and semiconductor device | |
TWI764612B (en) | Chip antenna manufacturing method and structure for the same | |
CN101587842A (en) | Chip packaging support plate and manufacture method thereof | |
US20230049806A1 (en) | Circuit board | |
CN212381457U (en) | Metallized carrier plate | |
CN114067694A (en) | Display mother board and preparation method thereof | |
US9433105B2 (en) | Method of fabricating printed circuit boards | |
TWI812992B (en) | Substrate structure and manufacturing method thereof | |
WO2022088413A1 (en) | Battery protection board, machining method therefor, and electronic device | |
TWI735019B (en) | Circuit board and method for making the same | |
TWI737425B (en) | Embedded circuit board and manufacturing method thereof | |
US20230282490A1 (en) | Carrier plate for preparing package substrate, package substrate structure and manufacturing method thereof | |
CN220693383U (en) | Circuit board and battery | |
WO2023220907A1 (en) | Circuit board, electronic device and method for forming the same | |
WO2022121555A1 (en) | Circuit board, method for manufacturing circuit board and electronic device |