TWI764611B - Antenna manufacturing method and structure for the same - Google Patents

Abstract

An antenna manufacturing method and structure for the same includes: preparing a substrate having a metal layer on each of the front side and back side of the substrate. A plurality of rows of through holes arranged longitudinally are drilled in the substrate. Copper metal material is electroplated on the metal layer of the substrate and the walls of the through holes to form a conductive layer. An etching technique is used to form a circuit layer electrically connected to the through holes on the metal layer and the conductive layer of the substrate. The circuit layer includes a plurality of oblique line segments and a plurality of lateral line segments. The ink is printed on the substrate and covers the oblique line segments and the horizontal line segments of the circuit layer to form a solder resist layer. The solder resist layer only exposes the circuit layer of the through holes. Electroplate tin metal material on the exposed conductive layers of the through holes on the substrate to form the electrode layer for welding the antenna.

Description

Antenna manufacturing method and structure thereof

The present invention relates to an antenna, in particular to a manufacturing method and structure of a chip antenna capable of receiving and transmitting signals.

With the development of wireless communication technology, electronic products such as notebook computers, mobile phones, personal digital assistants (PDAs) and other portable electronic devices are all designed and developed towards thinness and lightness .

A multi-band antenna structure currently used in electronic devices on the market has a chip antenna and a substrate. The chip antenna is made of ceramic material into a square substrate, and the radiator is fabricated on the surface of the substrate by printing technology or lithography and wet etching technology . When the chip antenna is electrically connected to the carrier board, the radiator of the chip antenna is electrically connected to the microstrip line on the carrier board. After the microstrip line is electrically connected to the copper coaxial cable, the After receiving the signal, the radiating metal part transmits the signal to the copper coaxial cable through the microstrip line, and then the copper coaxial cable is transmitted to the main board of the electronic device for processing, so as to achieve the purpose of communication.

Since the radiation system on the above-mentioned chip antenna is manufactured by printing technology or lithography and wet etching technology, although the volume of the chip antenna is much smaller than that of the traditional antenna, the stability of the past chip antenna in the process is poor, resulting in the manufacture of The defect rate of the outgoing chip antenna also increases, and after the wafer line is manufactured, there are too many remaining materials, which leads to a waste of materials and an increase of manufacturing costs.

Therefore, the main purpose of the present invention is to provide a new manufacturing method and structure, which can improve the process stability of the chip antenna, improve the manufacturing yield of the chip antenna, and increase the utilization rate of materials.

In order to achieve the above-mentioned object, the present invention provides a method for manufacturing an antenna, comprising: preparing a substrate with a metal layer on the front surface and the back surface of the substrate. A plurality of rows of longitudinally arranged through holes are drilled at the relevant positions of the substrate where the antenna is intended to be manufactured. A conductive layer is formed by electroplating copper metal material on the metal layer on the front and back surfaces of the substrate and the hole walls of the through holes. A circuit layer electrically connected to the through holes is formed on the metal layer and the conductive layer on the front and back sides of the substrate by etching technology, and the circuit layer includes a plurality of oblique line segments and a plurality of transverse line segments . The ink is printed on the substrate and covers the oblique line segments and the transverse line segments of the circuit layer on the front and back of the substrate to form a solder resist layer, which exposes only the circuit layers of the through holes. A tin metal material is electroplated on the conductive layer of the exposed through holes on the front and back of the substrate by electroplating technology, so as to form an electrode layer for soldering the antenna.

In one embodiment of the present invention, the substrate is a printed circuit board.

In an embodiment of the present invention, the diameter of the through holes is 0.15mm.

In one embodiment of the present invention, the etching manufacturing technique is wet chemical etching or dry laser light.

In an embodiment of the present invention, the oblique line segments are composed of a first oblique line segment and a second oblique line segment, and the transverse line segments are composed of a first transverse line segment, a second transverse line segment and a third transverse line segment Consists of horizontal line segments.

In an embodiment of the present invention, the first oblique line segment among the oblique line segments is electrically connected to the second through hole in the first row on the front surface of the substrate and the first through hole in the second row, and the second oblique line segment is electrically connected to the third through hole of the first row and the second through hole of the second row; the first transverse line segment of the transverse line segments is electrically connected to the substrate The first through hole of the first row and the first through hole of the second row on the back side, and the second transverse line segment is electrically connected to the second through hole of the first row and the second through hole of the second row. A second through hole, the third lateral line segment is electrically connected to the third through hole of the first row and the third through hole of the second row.

In an embodiment of the present invention, after the oblique line segments and the lateral line segments are electrically connected to the through holes on the front and back surfaces of the substrate, the circuit layer forms a spiral through the substrate.

In one embodiment of the present invention, the ink is a black or white insulating material.

In one embodiment of the present invention, it further includes cutting and manufacturing, taking the center point of the through holes in each row as a longitudinal cutting line, and taking the third through holes in each row and the first adjacent one another. The gaps between the through holes are horizontal cutting lines, which are cut in alignment with the vertical and horizontal cutting lines on the substrate, ie, a single antenna is formed so that the through holes form side holes.

In an embodiment of the present invention, the side hole is semicircular.

In order to achieve the above object, the present invention further provides an antenna structure, comprising: a substrate, a solder mask layer and an electrode layer. The substrate has two correspondingly parallel first long sides, second long sides and two short sides, and a plurality of side holes and a side hole and a side hole are respectively provided on the first long side and the second long side. A circuit layer electrically connected with side holes, each of the side holes has a conductive layer, the conductive layer is electrically connected with the circuit layer, and the circuit layer includes a plurality of oblique line segments and a plurality of transverse line segments; The solder resist layer is disposed on the front and back surfaces of the substrate to cover the oblique line segments and the transverse line segments of the circuit layer, and the solder resist layer only exposes the circuit layer on the side holes. The electrode layer is disposed on the conductive layer of the side holes exposed on the front and back surfaces of the substrate to form an electrode layer for antenna welding.

In an embodiment of the present invention, the oblique line segments are composed of a first oblique line segment and a second oblique line segment, and the transverse line segments are composed of a first transverse line segment, a second transverse line segment and a third transverse line segment Consists of horizontal line segments.

In an embodiment of the present invention, a first oblique line segment of the oblique line segments is electrically connected to the second side hole of the first long side of the front surface of the substrate and the first side edge of the second long side The hole, and the second oblique line segment are electrically connected to the third side hole of the first long side and the second side hole of the second long side; the first transverse line segment of the transverse line segments is The first side hole of the first long side on the back of the substrate is electrically connected to the first side hole of the second long side, and the second transverse line segment is electrically connected to the second side hole of the first long side. a side hole and the second side hole of the second long side, the third transverse line segment is electrically connected to the third side hole of the first long side and the third side hole of the second long side side holes.

In an embodiment of the present invention, the oblique line segments and the transverse line segments are electrically connected to the side holes on the front and back surfaces of the substrate, so that the circuit layer forms a spiral through the substrate.

In one embodiment of the present invention, the substrate is a printed circuit board.

In an embodiment of the present invention, the side holes are semicircular.

In one embodiment of the present invention, the solder resist layer is an insulating material of black or white ink.

In an embodiment of the present invention, the conductive layer is made of copper metal material.

In an embodiment of the present invention, the electrode layer is made of tin metal material.

Hereby, the technical content and detailed description of the present invention are described as follows in conjunction with the drawings:

Please refer to FIG. 1 , which is a schematic diagram of the antenna manufacturing process of the present invention; meanwhile, refer to the schematic structural diagrams of the semi-finished products of each step in FIGS. 2-9 . As shown in the figure, in the antenna manufacturing method of the present invention, firstly, in step S100, a substrate 1 is prepared, and the substrate 1 has a metal layer 11 on the front surface and the back surface (as shown in FIG. 2 ). In this figure, the substrate 1 is a printed circuit board.

Step S102 , drilling and manufacturing, using a processing tool to drill a plurality of rows of longitudinally arranged through holes 12 on the substrate 1 at the relevant positions where the antenna 10 (as shown in FIG. 3 ) is to be manufactured, and the substrate 1 on the side of the through holes 12 is drilled. There is a drill hole 13 for machine alignment (as shown in Figure 3). In this figure, the diameter of the through holes 12 is 0.15 mm.

Step S104 , electroplating manufacturing, a conductive layer 2 is formed on the metal layers 11 on the front and back surfaces of the substrate 1 and the walls of the through holes 12 by using a copper metal material through electroplating technology (as shown in FIG. 4 ).

Step S106 , manufacturing by exposure, development, and etching technology, using wet chemical etching or dry laser direct imaging etching (laser direct imaging, LDI) technology, the metal layer 11 and the conductive layer on the front and back of the substrate 1 Layer 2 forms a circuit layer 21 electrically connected to the through holes 12 . The circuit layer (radiation layer) 21 includes a plurality of oblique line segments 211 and a plurality of transverse line segments 212 . The oblique line segments 211 are composed of a first oblique line segment 211a and a second oblique line segment 211b, and the transverse line segments 212 are composed of a first transverse line segment 212a, a second transverse line segment 212b and a third transverse line segment 212c composition. The first oblique line segment 211a of the oblique line segments 211 is used to electrically connect the second through holes 12b in the first row on the front surface of the substrate 1 and the first through holes 12d in the second row, and the second oblique line segment 211a. The line segment 211b is electrically connected to the third through hole 12c of the first row and the second through hole 12e of the second row. The first transverse line segment 212a of the transverse line segments 212 is used to electrically connect the first through holes 12a of the first row and the first through holes 12d of the second row on the back surface of the substrate 1 . The second transverse line segment 212b is electrically connected to the second through holes 12b of the first row and the second through holes 12e of the second row. The third transverse line segment 212c is electrically connected to the third through holes 12c of the first row and the third through holes 12f of the second row (as shown in FIGS. 5a-5c ). By analogy, the electrical connection of all the through holes 12 of the entire substrate 1 is completed. And, after the oblique line segments 211 and the lateral line segments 212 are electrically connected to the through holes 12a, 12b, 12c, 12d, 12e and 12f on the front and back surfaces of the substrate 1, the circuit layer 21 is formed into a spiral. through the substrate 1 .

Step S108 , manufacturing the solder mask. After the circuit layer 21 is manufactured, black or white ink is printed on the substrate 1 through printing technology, and covers the oblique line segments of the circuit layer 21 on the front and back of the substrate 1 . 211 and the lateral line segments 212 form a solder mask 3 (as shown in Figures 6a-6c), and the printed solder mask 3 only exposes the circuit layers 21 on the through holes 12a, 12b, 12c, 12d, 12e and 12f . In this drawing, the black or white ink is an insulating material.

Step S110, electrode layer fabrication, after the above-mentioned solder mask layer 3 is fabricated, tin metal material is electroplated on the exposed through holes 12a, 12b, 12c, 12d, 12a, 12b, 12c, 12d, On the conductive layers 2 of 12e and 12f, an electrode layer 4 that can be soldered to the antenna 10 is formed (as shown in FIG. 7).

Step S112, cutting and manufacturing. After the above-mentioned electrode layer 4 is manufactured, the center point of the through holes 12 in each row is taken as the longitudinal cutting line A, and the third through holes 12c in each row The gap between a through hole 12a is a transverse cutting line B (as shown in FIG. 8 ). After cutting with a cutting tool aligned with the longitudinal and transverse cutting lines A and B on the substrate 1, a single piece as shown in FIG. 9 is formed. In the antenna 10 , the through holes 12 a , 12 b , 12 c , 12 d , 12 e and 12 f also form semicircular side holes 121 .

Please refer to FIGS. 2-9 , which are schematic structural diagrams of semi-finished products in each step of the present invention. As shown in the figure, the antenna structure 10 of the present invention includes: a substrate 1 , a solder resist layer 3 and an electrode layer 4 .

The substrate 1 has two corresponding parallel first long sides 14 , second long sides 15 and two short sides 16 , and a plurality of side holes are respectively provided on the first and second long sides 14 and 15 121 (in this embodiment, three side holes are taken as an example) and a circuit layer 21 electrically connected to the side holes 121 . Each of the side holes 121 has a conductive layer 2 . The conductive layer 2 is electrically connected to the circuit layer 21 . The circuit layer 21 includes a plurality of oblique line segments 211 and a plurality of transverse line segments 212 . The oblique line segments 211 are composed of a first oblique line segment 211a and a second oblique line segment 211b, and the transverse line segments 212 are composed of a first transverse line segment 212a, a second transverse line segment 212b and a third transverse line segment 212c composition. The first oblique line segment 211a in the oblique line segments 211 is used to electrically connect the second through hole (second side hole) 12b of the first long side 14 on the front surface of the substrate 1 with the second long side 15 The first through hole (the first side hole) 12d and the second oblique line segment 211b are electrically connected to the third through hole (the third side hole) 12c of the first long side 14 and the third through hole (the third side hole) 12c. The second through hole (the second side hole) 12e of the two long sides 15 . The first transverse line segment 212a of the transverse line segments 212 is electrically connected to the first through hole (first side hole) 12a of the first long side 14 on the back of the substrate 1 and the first side hole 12a of the second long side 15 A through hole (the first side hole) 12d. The second transverse line segment 212b is electrically connected to the second through hole (second side hole) 12b of the first long side 14 and the second through hole (second side hole) of the second long side 15 )12e. The third transverse line segment 212c is electrically connected to the third through hole (third side hole) 12c of the first long side 14 and the third through hole (third side hole) of the second long side 15 )12f (as shown in Figures 5a-5c). By analogy, the electrical connection of all the through holes 12 of the entire substrate 1 is completed. And, after the oblique line segments 211 and the lateral line segments 212 are electrically connected to the through holes (the side holes) 12a, 12b, 12c, 12d, 12e and 12f on the front and back of the substrate 1, The circuit layer 21 is formed to penetrate the substrate 1 in a spiral shape. In this figure, the substrate 1 is a printed circuit board; the side holes are semicircular.

The solder resist layer 3 is printed with black ink on the front and back of the substrate 1 through printing technology, and covers the oblique line segments 211 and the transverse line segments 212 of the circuit layer 21 to form the solder resist layer 3 (as shown in FIG. 6 a ). -6c), the printed solder mask layer 3 only exposes the circuit layer 21 on the through holes (the side holes) 12a, 12b, 12c, 12d, 12e and 12f. In this drawing, the black or white ink is an insulating material.

The electrode layer 4 is electroplated with a tin metal material on the conductive layer 2 of the exposed through holes (the side holes) 12a, 12b, 12c, 12d, 12e and 12f on the front and back surfaces of the substrate 1 by electroplating technology to form the electrode layer 4 which can be soldered to the antenna 10 .

The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the scope of implementation of the present invention. That is, all equivalent changes and modifications made according to the scope of the patent application of the present invention are all covered by the patent scope of the present invention.

Step S100 - Step S112

10: Antenna

1: Substrate

11: Metal layer

12, 12a, 12b, 12c, 12d, 12e, 12f: through holes

13: Drilling

14: The first long side

15: Second Long Side

16: Short side

2: Conductive layer

21: circuit layer

211: Oblique line segment

211a: first oblique line segment

211b: Second oblique line segment

212: Horizontal line segment

212a: first transverse line segment

212b: Second horizontal line segment

212c: Third horizontal line segment

3: Solder mask

4: Electrode layer

A: Vertical cutting line

B: Horizontal cutting line

FIG. 1 is a schematic diagram of the manufacturing process of the antenna of the present invention;

FIG. 2 is a schematic side view of the substrate of the present invention;

Fig. 3 is a schematic diagram of the structure of drilling on the substrate of Fig. 2;

FIG. 4 is a schematic side cross-sectional view of the structure fabricated by the electroplated conductive layer of FIG. 3;

Figures 5a-5c are schematic diagrams of the structure of exposure, development and etching in Figure 4;

Figures 6a-6c are schematic diagrams of the fabrication of the solder mask electrode layer in Figures 5a-5c;

Fig. 7 is a schematic diagram of the tin-plating manufacturing structure in Fig. 6c;

Fig. 8 is a schematic diagram of cutting the completed antenna on the substrate after tin plating of the present invention;

FIG. 9 is a schematic structural diagram of a single antenna after being cut in FIG. 8 .

Step S100 - Step S112

Claims (15)

A method for manufacturing an antenna, comprising: a), preparing a substrate with a metal layer on the front and back of the substrate; Through hole; c), electroplating copper metal material on the metal layer on the front and back of the substrate and the hole wall of the through holes to form a conductive layer; d), by etching manufacturing technology, on the front and back of the substrate The metal layer and the conductive layer form a circuit layer electrically connected with the through holes. The circuit layer includes a plurality of oblique line segments and a plurality of lateral line segments, and the oblique line segments are formed by a first oblique line. A line segment and a second oblique line segment are formed, the transverse line segments are composed of a first transverse line segment, a second transverse line segment and a third transverse line segment, and the first oblique line segment among the oblique line segments is electrically connected to the The second through hole of the first row on the front side of the substrate is electrically connected to the first through hole of the second row, and the second oblique line segment is electrically connected to the third through hole of the first row and the second row. the second through hole in the horizontal line segment; the first horizontal line segment in the lateral line segments is electrically connected to the first through hole in the first row on the back of the substrate and the first through hole in the second row, the The second lateral line segment is electrically connected to the second through hole of the first row and the second through hole of the second row, and the third lateral line segment is electrically connected to the third through hole of the first row and the third through hole of the second row; e), printing ink on the substrate, and covering the oblique line segments and the transverse line segments of the circuit layer on the front and back of the substrate to form a solder mask, the The solder mask layer only exposes the circuit layers of the through holes; f), electroplating tin metal material on the conductive layers of the exposed through holes on the front and back of the substrate through electroplating technology to form electrodes for the antenna soldering Floor. The antenna manufacturing method as described in claim 1, wherein the substrate in step a is a printed circuit board. The antenna manufacturing method according to claim 1, wherein the diameter of the through holes in step b is 0.15 mm. The antenna manufacturing method as described in claim 1, wherein the etching manufacturing technique in step d is wet chemical etching or dry laser light. The antenna manufacturing method as described in claim 1, wherein after the oblique line segments and the transverse line segments are electrically connected to the through holes on the front and back surfaces of the substrate, the circuit layer is formed into a spiral shape. through the substrate. The antenna manufacturing method as described in claim 1, wherein the ink in step e is a black or white insulating material. The antenna manufacturing method as described in item 1 of the claimed scope, further comprising step g after step f. In the cutting and manufacturing of step g, the center point of the through holes in each row is used as a longitudinal cutting line, And take the gap between the third through hole in each row and another adjacent first through hole as a transverse cutting line to align with the longitudinal and transverse cutting lines on the substrate, that is, to form a single antenna such that The through holes form side holes. The antenna manufacturing method as described in claim 7, wherein the side hole is semicircular. An antenna structure, comprising: a substrate having two correspondingly parallel first long sides, second long sides and two short sides, each of the first long side and the second long side is provided with a plurality of Side holes and a circuit layer electrically connected to the side holes, each of the side holes has a conductive layer, the conductive layer is electrically connected to the circuit layer, and the circuit layer includes a plurality of oblique directions Line segments and a plurality of transverse line segments, the oblique line segments are composed of a first oblique line segment and a second oblique line segment, and the transverse line segments are composed of a first transverse line segment, a second transverse line segment and a third transverse line segment It is composed of line segments, and the first oblique line segment among the oblique line segments is electrically connected to the second side hole of the first long side of the front surface of the substrate and the first side hole of the second long side, and the second side hole of the second long side. The oblique line segment is electrically connected to the third side hole of the first long side and the second side hole of the second long side a side hole; the first transverse line segment of the transverse line segments is electrically connected to the first side hole of the first long side on the back of the substrate and the first side hole of the second long side, The second transverse line segment is electrically connected to the second side hole of the first long side and the second side hole of the second long side, and the third transverse line segment is electrically connected to the first long side the third side hole and the third side hole of the second long side; a solder mask layer is arranged on the front and back of the substrate to cover the oblique line segments and the lines of the circuit layer A horizontal line segment, the solder mask layer only exposes the circuit layers on the side holes; an electrode layer is attached to the conductive layer on the exposed side holes on the front and back of the substrate to form antenna soldering electrode layer. The antenna structure as described in claim 9, wherein the oblique line segments and the transverse line segments are electrically connected to the side holes on the front and back surfaces of the substrate, so that the circuit layer forms a helical penetration the substrate. The antenna structure as described in claim 9, wherein the substrate is a printed circuit board. The antenna structure according to claim 9, wherein the side holes are semicircular. The antenna structure according to claim 9, wherein the solder resist layer is an insulating material made of black or white ink. The antenna structure according to claim 9, wherein the conductive layer is made of copper metal material. The antenna structure according to claim 9, wherein the electrode layer is made of tin metal material.

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