TWI812992B - Substrate structure and manufacturing method thereof - Google Patents

Abstract

A substrate structure in which a recess is formed at boundary between a side surface and a top surface of a substrate body including a circuit portion, and an antenna body is formed in the recess, so that the antenna body and the side surface of the substrate body are coplanar, and the antenna body is exposed from the top surface of the substrate body to improve a performance of side antenna of the substrate structure.

Description

Substrate structure and manufacturing method

The present invention relates to a semiconductor device, and in particular to a substrate structure and a manufacturing method thereof.

Currently, wireless communication technology has been widely used in various consumer electronic products to receive or send various wireless signals. In order to meet the design requirements of consumer electronic products, the manufacturing and design of wireless communication modules are developed towards the needs of being light, thin, short and small. Among them, the side antenna (Side Antenna) has the characteristics of small size, light weight and manufacturing Due to its characteristics such as ease of use, it is widely used in wireless communication modules of electronic products such as cell phones.

As shown in FIG. 1 , a conventional radio frequency module 1 disposes a plurality of radio frequency chips 11 on a packaging substrate 10 , and then stacks an antenna substrate 12 on the packaging substrate 10 through conductive pillars 13 , and covers it with packaging glue 15 In each of the radio frequency chips 11, the antenna substrate 12 has an antenna layer 120 formed on its top surface 12a, and a side antenna 14 formed on its side surface 12c.

However, in the conventional radio frequency module 1, the side antenna 14 of the radio frequency module 1 needs to be manufactured by using laser drilling technology to form a hole on the side 12c of the antenna substrate 12, and then use photoresist and electroplating metal to fill the hole. There are holes on the side 12c of the antenna substrate 12, so the manufacturing cost is extremely high and the process time is lengthy.

Furthermore, after metal plating, when using a cutter to cut off the excess metal material on the side 12c of the antenna substrate 12, the cutter is likely to be worn and the manufacturing cost will be increased.

In addition, the top of the side antenna 14 is not exposed to the top surface 12a of the antenna substrate 12, so the directivity or intensity of signal transmission is hindered, making it difficult to improve the antenna performance.

Therefore, how to overcome the various problems of the above-mentioned conventional technologies has become an urgent issue to be solved.

In view of the shortcomings of the above-mentioned conventional technologies, the present invention provides a substrate structure, which includes: a substrate body having a first surface and a second surface opposite each other and side surfaces adjacent to the first and second surfaces, and the first surface A recess is formed at the interface between the surface and the side surface, wherein the substrate body system includes a circuit portion; and the antenna body is formed in the recessed portion, wherein the antenna body is coplanar and connected with the side surface of the substrate body. The first surface of the substrate body.

The present invention further provides a method for manufacturing a substrate structure, which includes: providing a full-layout substrate including a plurality of substrate bodies, and the substrate body system has a first surface and a second surface opposite to each other, wherein the substrate body system includes a circuit portion. ; Forming a recessed portion at the interface between any adjacent two of the plurality of substrate bodies, and the recessed portion does not penetrate the substrate body; forming an antenna body in the recessed portion; and performing a singulation process corresponding to the recessed portion on the full-layout substrate, To obtain a plurality of substrate structures, the substrate system defines side surfaces adjacent to the first surface and the second surface, and the antenna body is coplanar with the side surfaces of the substrate body and connected to the first surface of the substrate body.

In the aforementioned substrate structure and its manufacturing method, the antenna system is electrically connected to the circuit part.

In the aforementioned substrate structure and its manufacturing method, the substrate body further includes a ground portion electrically connected to the circuit portion. For example, the grounding part is formed by stacking multiple sections of conductors.

In the aforementioned substrate structure and its manufacturing method, the substrate body further includes an antenna structure arranged corresponding to the antenna body, so that the antenna body and the antenna structure transmit signals in a coupled manner. For example, the antenna structure is formed by stacking multiple sections of conductors.

In the aforementioned substrate structure and its manufacturing method, the substrate body further includes at least one signal port connected to the second surface and electrically connected to the circuit portion.

In the aforementioned substrate structure and its manufacturing method, the substrate body further includes at least one antenna portion connected to the first surface and electrically connected to the circuit portion.

It can be seen from the above that in the substrate structure and its manufacturing method of the present invention, the antenna body is mainly formed on the cutting path, so that after the singulation process, the antenna body is directly located on the side of the substrate body, and the antenna body is connected to the substrate The first surface of the body is coplanar with the side surface of the substrate body. Therefore, compared with the conventional technology, the present invention not only has a low manufacturing cost, but also can improve the antenna performance.

1: RF module

10:Packaging substrate

11:RF chip

12:Antenna substrate

12a:Top surface

12c,20c: side

120:Antenna layer

13:Conductive pillar

14: Side antenna

15: Encapsulating colloid

2,3:Substrate structure

2a:Substrate body

20:Insulation Department

20a: First surface

20b: Second surface

21: Line Department

210: Line layer

211:Conductive blind hole

22:Antenna Department

220a, 220b: signal port

221: First antenna layer

222: Second antenna layer

23: Grounding part

230,250: Conductor

24,34:antenna body

240: concave part

25:Antenna structure

29: Cutting Department

7:Drill

8:Full-layout substrate

9:Cutter

S: cutting path

Figure 1 is a schematic cross-sectional view of a conventional radio frequency module.

2A to 2E are schematic cross-sectional views of the manufacturing method of the substrate structure of the present invention.

Figure 3 is a schematic cross-sectional view of another aspect of Figure 2E.

The following describes the implementation of the present invention through specific embodiments. Those familiar with the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.

It should be noted that the structures, proportions, sizes, etc. shown in the drawings attached to this specification are only used to coordinate with the content disclosed in the specification for the understanding and reading of those familiar with the art, and are not used to limit the implementation of the present invention. limiting conditions, so it has no technical substantive significance, any structural modification, proportion Changes in the relationship or adjustments in size should still fall within the scope of the technical content disclosed in the present invention without affecting the effects that can be produced and the purposes that can be achieved by the present invention. At the same time, terms such as "upper", "left", "right", "first", "second" and "one" cited in this specification are only for the convenience of description and are not used to To limit the implementable scope of the present invention, changes or adjustments in the relative relationships shall also be regarded as the implementable scope of the present invention as long as the technical content is not substantially changed.

2A to 2E are schematic cross-sectional views of the manufacturing method of the substrate structure 2 of the present invention.

As shown in FIG. 2A , a full-width substrate 8 is provided that includes a plurality of substrate bodies 2 a . The substrate body 2 a is in the form of an antenna board and includes an insulation part 20 , a line part 21 and an antenna part 22 .

In this embodiment, the plurality of substrate bodies 2a are arranged in an array, and the joints between the substrate bodies 2a are defined as cutting portions 29.

The insulating part 20 has an opposite first surface 20a and a second surface 20b, and the insulating part 20 includes at least one insulating layer.

In this embodiment, the material forming the insulating layer is dielectric such as polybenzoxazole (PBO), polyimide (PI), prepreg (PP), etc. Material, or welding mask such as green paint, ink, etc.

The circuit portion 21 includes at least one circuit layer 210 formed on the insulating layer and a plurality of conductive blind holes 211 electrically connected to the circuit layer 210.

In this embodiment, the circuit layer 210 is a fan-out type redistribution layer (RDL), and the material forming the circuit layer 210 is copper.

Furthermore, a grounding portion 23 connecting the first surface 20a and the second surface 20b can be formed in the insulating portion 20 . For example, in conjunction with the circuit layer 210, an RDL process is used to form the ground portion 23 formed by stacking multiple sections of columnar or wall-shaped conductors 230.

In addition, an antenna structure 25 connecting the first surface 20a and the second surface 20b can be formed in the insulation part 20, so that the ground part 23 is located between the antenna structure 25 and the antenna part 22. For example, in conjunction with the circuit layer 210, an RDL process is used to form an antenna structure 25 composed of multiple sections of columnar or wall-shaped conductors 250 stacked on top of each other.

The antenna part 22 includes a set of first antenna layer 221 and a second antenna layer 222 that are separated from each other and correspondingly arranged on the insulating layer.

In this embodiment, the first antenna layer 221 and the second antenna layer 222 transmit signals in a coupled manner, so the layout position of the first antenna layer 221 corresponds to the layout of the second antenna layer 222 Location. For example, the first antenna layer 221 is located on the upper side of the insulating layer (or the first surface 20 a of the insulating part 20 ), and the second antenna layer 222 is located on the lower side of the insulating layer (or the insulating part 20 inner layer), and is electrically connected to the circuit layer 210 through the conductive blind hole 211, so the first antenna layer 221 and the second antenna layer 222 can generate radiation due to alternating voltage, alternating current or radiation changes. Energy, and the radiated energy is an electromagnetic field, so that the first antenna layer 221 and the second antenna layer 222 can be electromagnetically coupled to each other, so that the antenna signal can be transmitted between the first antenna layer 221 and the second antenna layer. 222 passed.

In addition, the thin and thin antenna portion 22 can be produced by sputtering, vaporing, electroplating, electroless plating, electroless plating, or foiling. For example, the antenna portion 22 and the circuit layer 210 can be manufactured using an RDL process.

In addition, the antenna part 22 further includes a signal port 220a, 220b connected to the second surface 20b of the insulating part 20, that is, a feed point, which is electrically connected to the circuit layer 210 through a conductive blind hole 211, so that part of the signal port Signals can be transmitted between 220a and the second antenna layer 222 through the line portion 21.

As shown in FIGS. 2B to 2C , at least one recess 240 is formed at the interface between the two substrate bodies 2 a (or the cutting portion 29 ), and the recess 240 does not penetrate the substrate body 2 a. Next, an antenna body 24 such as a metal layer is formed along the surface of the recess 240 so that the arrangement position of the antenna body 24 corresponds to the The antenna structure 25 is positioned so that the antenna body 24 and the antenna structure 25 transmit signals in a coupled manner.

In this embodiment, the recess 240 is formed at the junction between the first surfaces 20a of the two substrate bodies 2a using a drilling method (machine drill 7 as shown in Figure 2B), and the recess 240 is not connected to the substrate body. The second surface 20b of 2a.

Furthermore, the antenna body 24 does not need to fill the recess 240 . Alternatively, the antenna body 24 can fill the recess 240 as required.

As shown in FIG. 2D , a cutting process is performed on the full-layout substrate 8 along the cutting path S as shown in the figure (ie, corresponding to the concave portion 240 or the cutting portion 29 ) to obtain a plurality of substrate structures 2 , as shown in FIG. As shown in 2E, the substrate body 2a (or the insulating portion 20) defines a side surface 20c adjacent to the first surface 20a and the second surface 20b.

In this embodiment, the antenna body 24 is formed on the side 20c of the substrate body 2a and is connected to or exposed on the first surface 20a of the substrate body 2a to serve as a side antenna, and the antenna body 24 and the substrate body 2a The side surfaces 20c are coplanar.

Furthermore, part of the signal port 220b is electrically connected to the antenna structure 25 through the line part 21 to transmit signals to the antenna body 24. For example, the signal passes through the ground portion 23 from the leftmost and/or rightmost signal port 220b of the second surface 20b of the substrate body 2a through the line portion 21, and then is electrically connected to the antenna structure 25, so that the antenna The structure 25 inductively transmits the signal to the antenna body 24 on the side 20c of the substrate body 2a.

Furthermore, in other embodiments, as shown in FIG. 3 , the configuration of the antenna structure 25 of the substrate structure 3 can also be omitted, so that part of the signal port 220 b is electrically connected to the antenna body 34 through the line portion 21 . For example, the signal passes through the ground portion 23 from the leftmost and/or rightmost signal port 220b of the second surface 20b of the substrate body 2a, and then the signal is directly transmitted to the antenna body on the side 20c of the substrate body 2a. 34.

Therefore, the manufacturing method of the substrate structure of the present invention mainly uses the recess 240 to be formed on the cutting path S, so that after the singulation process, the antenna bodies 24, 34 are directly formed on the side 20c of the substrate body 2a. Compared with the conventional technology, the manufacturing method of the present invention does not require tedious laser drilling, upper resist layer, electroplating metal and other related processes after the single cutting process, thereby significantly reducing the manufacturing cost and shortening the process time.

Furthermore, during the cutting process of the substrate structure of the present invention, the cutter 9 shown in FIG. 2D can remove excess metal material in the recess 240, so that the antenna body 24, 34 and the substrate The side surfaces 20c of the main body 2a are coplanar, so there is no need to use the cutter 9 in the subsequent manufacturing process, thereby reducing the wear of the cutter 9 and reducing manufacturing costs.

In addition, the antenna bodies 24 and 34 are coplanar with the side surface 20c of the substrate body 2a, and the antenna bodies 24 and 34 are connected to or exposed on the first surface 20a of the substrate body 2a, thereby increasing the directivity of signal transmission. or strength to improve antenna efficiency.

The present invention also provides a substrate structure 2, 3, which includes: a substrate body 2a and at least one antenna body 24, 34 provided on the side 20c of the substrate body 2a.

The substrate body 2a has an opposite first surface 20a and a second surface 20b and a side surface 20c adjacent to the first and second surfaces 20a and 20b, and the interface between the first surface 20a and the side surface 20c is formed. There is at least one stepped recess 240 , in which the substrate body 2 a includes the circuit portion 21 .

The antenna bodies 24 and 34 are formed in the recess 240 and communicate with the first surface 20a of the substrate body 2a. The antenna body 24 is coplanar with the side surface 20c of the substrate body 2a and communicates with the substrate body 2a. the first surface 20a.

In one embodiment, the antenna bodies 24 and 34 are electrically connected to the circuit portion 21 .

In one embodiment, the substrate body 2 a further includes a ground portion 23 electrically connected to the circuit portion 21 . For example, the ground portion 23 is formed by stacking multiple sections of conductors 230 .

In one embodiment, the substrate body 2a further includes an antenna structure 25 arranged corresponding to the antenna body 24, so that the antenna body 24 and the antenna structure 25 transmit signals in a coupled manner. For example, the antenna structure 25 is formed by stacking multiple sections of conductors 250 .

In one embodiment, the substrate body 2a includes at least one signal port 220a, 220b connected to the second surface 20b, which is electrically connected to the circuit part 21.

In one embodiment, the substrate body 2a includes at least one antenna part 22 connected to the first surface 20a and electrically connected to the circuit part 21.

To sum up, the substrate structure and its manufacturing method of the present invention form a recess on the cutting path and fill the metal layer with the metal layer, so that after the singulation process, the antenna body is directly formed on the side of the substrate body, and the antenna body is formed. The antenna body is connected to the first surface of the substrate body and is coplanar with the side surface of the substrate body. Therefore, the substrate structure of the present invention not only has low manufacturing cost, but also improves antenna performance.

The above embodiments are used to illustrate the principles and effects of the present invention, but are not intended to limit the present invention. Anyone skilled in the art can make modifications to the above embodiments without departing from the spirit and scope of the invention. Therefore, the scope of rights protection of the present invention should be as listed in the patent application scope described below.

2:Substrate structure

2a:Substrate body

20:Insulation Department

20a: First surface

20b: Second surface

20c: side

21: Line Department

22:Antenna Department

220b:Signal port

23: Grounding part

24: Antenna body

240: concave part

25:Antenna structure

Claims (16)

A substrate structure includes: a substrate body having a first surface and a second surface that are opposite to each other and side surfaces adjacent to the first and second surfaces, wherein the substrate body system includes a circuit portion, and the first surface and the A recess is formed at the junction of the side surfaces, and the recess is not connected to the second surface; and the antenna body is formed in the recess and fills the recess, wherein the antenna body is coplanar with the side surface of the substrate body. Connected to the first surface of the substrate body. The substrate structure as claimed in claim 1, wherein the antenna system is electrically connected to the circuit part. The substrate structure of claim 1, wherein the substrate body further includes a ground portion electrically connected to the circuit portion. The substrate structure as claimed in claim 3, wherein the ground portion is formed by stacking multiple sections of conductors. The substrate structure as claimed in claim 1, wherein the substrate body further includes an antenna structure arranged corresponding to the antenna body, so that the antenna body and the antenna structure transmit signals in a coupled manner. The substrate structure as claimed in claim 5, wherein the antenna structure is formed by stacking multiple sections of conductors. The substrate structure as claimed in claim 1, wherein the substrate body further includes at least one signal port connected to the second surface and electrically connected to the circuit part. The substrate structure as claimed in claim 1, wherein the substrate body further includes at least one antenna part connected to the first surface and electrically connected to the circuit part. A method for manufacturing a substrate structure includes: A full-width substrate including a plurality of substrate bodies is provided, wherein the substrate body system includes a circuit portion and has an opposite first surface and a second surface; a recess is formed at the interface between adjacent two surfaces of the plurality of substrate bodies. , and the recessed portion does not penetrate the substrate body; an antenna body is formed in the recessed portion; and a cutting process is performed corresponding to the recessed portion on the full-page substrate to obtain a plurality of substrate structures, wherein the substrate body system defines an area adjacent to the first One surface and the side surface of the second surface, and the antenna body and the side surface of the substrate body are coplanar and connected to the first surface of the substrate body. The method for manufacturing a substrate structure as claimed in claim 9, wherein the antenna system is electrically connected to the circuit part. The method for manufacturing a substrate structure as claimed in claim 9, wherein the substrate body further includes a ground portion electrically connected to the circuit portion. The method for manufacturing a substrate structure as claimed in claim 11, wherein the ground portion is formed by stacking multiple sections of conductors. The method for manufacturing a substrate structure as described in claim 9, wherein the substrate body further includes an antenna structure arranged corresponding to the antenna body, so that the antenna body and the antenna structure transmit signals in a coupled manner. The method for manufacturing a substrate structure as claimed in claim 13, wherein the antenna structure is formed by stacking multiple sections of conductors. The method for manufacturing a substrate structure as claimed in claim 9, wherein the substrate body includes at least one signal port connected to the second surface and electrically connected to the circuit portion. The method for manufacturing a substrate structure as claimed in claim 9, wherein the substrate body includes at least one antenna part connected to the first surface and electrically connected to the circuit part.

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