CN115084841B - Antenna manufacturing method and structure thereof - Google Patents
Antenna manufacturing method and structure thereof Download PDFInfo
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- CN115084841B CN115084841B CN202210208020.2A CN202210208020A CN115084841B CN 115084841 B CN115084841 B CN 115084841B CN 202210208020 A CN202210208020 A CN 202210208020A CN 115084841 B CN115084841 B CN 115084841B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 20
- 239000000758 substrate Substances 0.000 claims abstract description 102
- 229910000679 solder Inorganic materials 0.000 claims abstract description 19
- 238000005516 engineering process Methods 0.000 claims abstract description 14
- 239000002184 metal Substances 0.000 claims abstract description 14
- 229910052751 metal Inorganic materials 0.000 claims abstract description 14
- 239000007769 metal material Substances 0.000 claims abstract description 12
- 238000009713 electroplating Methods 0.000 claims abstract description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 8
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229910052802 copper Inorganic materials 0.000 claims abstract description 8
- 239000010949 copper Substances 0.000 claims abstract description 8
- 238000007639 printing Methods 0.000 claims abstract description 8
- 238000005530 etching Methods 0.000 claims abstract description 7
- 238000003466 welding Methods 0.000 claims abstract description 5
- 238000000034 method Methods 0.000 claims description 17
- 238000005520 cutting process Methods 0.000 claims description 14
- 239000011810 insulating material Substances 0.000 claims description 6
- 238000003631 wet chemical etching Methods 0.000 claims description 3
- 238000010329 laser etching Methods 0.000 claims description 2
- GNFTZDOKVXKIBK-UHFFFAOYSA-N 3-(2-methoxyethoxy)benzohydrazide Chemical compound COCCOC1=CC=CC(C(=O)NN)=C1 GNFTZDOKVXKIBK-UHFFFAOYSA-N 0.000 claims 2
- FGUUSXIOTUKUDN-IBGZPJMESA-N C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 Chemical compound C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 FGUUSXIOTUKUDN-IBGZPJMESA-N 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 6
- 238000005553 drilling Methods 0.000 description 3
- 238000003384 imaging method Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000001039 wet etching Methods 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000001393 microlithography Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Details Of Aerials (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
An antenna manufacturing method and a structure thereof, wherein the antenna manufacturing method comprises the following steps: a substrate is provided, each of the front and back surfaces of the substrate having a metal layer thereon. An even number of rows of through holes which are longitudinally arranged are drilled in the substrate, and a plurality of groups of through holes are defined according to the size of a prefabricated single antenna. Electroplating copper metal material on the metal layer on the front and back of the substrate and the walls of the through holes to form a conductive layer. And forming a circuit layer electrically connected with the through holes on the metal layer and the conductive layer on the front and the back of the substrate by using an etching technology, wherein the circuit layer comprises a plurality of inclined line segments and a plurality of transverse line segments. Printing ink on the substrate and covering the oblique line segments and the transverse line segments of the circuit layer to form a solder mask layer, wherein the solder mask layer only exposes the conductive layers of the through holes. A tin metal material is electroplated on the exposed conductive layers of the plurality of through holes on the substrate by electroplating to form an electrode layer for antenna welding.
Description
Technical Field
The present invention relates to an antenna, and more particularly, to a method for manufacturing a chip antenna for receiving and transmitting signals and a structure thereof.
Background
With the development of wireless communication technologies, portable electronic devices such as notebook computers, mobile phones, personal Digital Assistants (PDAs) and the like are designed and developed towards light and thin.
The multi-band antenna structure used in the electronic device in the market currently has a chip antenna and a carrier. The chip antenna is a square substrate made of ceramic material, and the radiator is manufactured on the surface of the substrate by printing technology or micro-imaging and wet etching technology. When the chip antenna is electrically connected with the carrier plate, the radiator of the chip antenna is electrically connected with the microstrip line on the carrier plate, after the microstrip line is electrically connected with the copper axis cable, the radiating metal part receives signals and transmits the signals to the copper axis cable through the microstrip line, and then the signals are transmitted to the main board of the electronic device for processing through the copper axis cable, so that the purpose of communication is achieved.
The radiator on the wafer antenna is manufactured by printing technology or micro-lithography and wet etching technology, and the volume of the wafer antenna is reduced much than that of the traditional antenna, but the traditional wafer antenna has poor stability in the process, so that the reject ratio of the manufactured wafer antenna is improved, and after the wafer antenna is manufactured, excessive materials are remained, so that the waste of the materials is caused, and the manufacturing cost is increased.
Disclosure of Invention
Therefore, a main object of the present invention is to provide a new manufacturing method and structure thereof, which can improve the process stability of the chip antenna, and increase the manufacturing yield of the chip antenna and the material utilization.
In order to achieve the above object, the present invention provides a method for manufacturing an antenna, comprising the steps of: a substrate is provided, each of the front and back surfaces of the substrate having a metal layer thereon. An even number of rows of through holes which are longitudinally arranged are drilled at the relevant positions of the antenna preset to be manufactured on the substrate, each row of through holes comprises a plurality of through holes, every two adjacent rows of through holes are defined as a row of through holes, each row of through holes is respectively defined with a plurality of groups of through holes according to the size of a prefabricated single antenna, and each group of through holes comprises a plurality of first rows of through holes and a plurality of corresponding second rows of through holes. Copper metal material is electroplated on the metal layer on the front and back surfaces of the substrate and the walls of the through holes to form a conductive layer. And forming a circuit layer electrically connected with the through holes on the metal layer and the conductive layer on the front and the back of the substrate by using an etching manufacturing technology, wherein the circuit layer comprises a plurality of inclined line segments and a plurality of transverse line segments. Printing ink on the substrate, and covering the oblique line segments and the transverse line segments of the circuit layers on the front and back surfaces of the substrate to form a solder mask layer, wherein the solder mask layer only exposes the conductive layers of the through holes. And electroplating tin metal materials on the conductive layers of the plurality of through holes exposed on the front and back surfaces of the substrate by electroplating technology to form electrode layers for antenna welding.
In one embodiment of the present invention, the substrate is a printed circuit board.
In one embodiment of the invention, the diameter of the through hole is 0.15mm.
In one embodiment of the present invention, the etching fabrication technique is wet chemical etching or dry laser etching.
In an embodiment of the present invention, the plurality of diagonal line segments are composed of a plurality of first diagonal line segments and a plurality of second diagonal line segments, and the plurality of lateral line segments are composed of a plurality of first lateral line segments, a plurality of second lateral line segments and a plurality of third lateral line segments.
In an embodiment of the present invention, the plurality of first diagonal segments of the plurality of diagonal segments are electrically connected to the second first row of through holes and the first second row of through holes of each set of through holes on the front side of the substrate, and the plurality of second diagonal segments are electrically connected to the third first row of through holes and the second row of through holes of each set of through holes on the front side of the substrate; the first transverse line segments are electrically connected with the first row of through holes and the first second row of through holes in each group of through holes on the back surface of the substrate, the second transverse line segments are electrically connected with the second first row of through holes and the second row of through holes in each group of through holes on the back surface of the substrate, and the third transverse line segments are electrically connected with the third first row of through holes and the third second row of through holes in each group of through holes on the back surface of the substrate.
In an embodiment of the present invention, after the plurality of diagonal line segments and the plurality of lateral line segments are electrically connected to the plurality of through holes on the front surface and the back surface of the substrate, the circuit layer is formed to spirally penetrate the substrate.
In one embodiment of the invention, the ink is a black or white insulating material.
In an embodiment of the present invention, the method further includes a cutting step, wherein a line connecting the center points of the plurality of through holes in each row is formed as a longitudinal cutting line, and a line connecting the midpoints between the plurality of through holes in each row is formed as a transverse cutting line, so as to align the longitudinal and transverse cutting lines on the substrate, thereby forming a single antenna and forming a plurality of side holes.
In one embodiment of the invention, the side aperture is semi-circular.
In order to achieve the above object, the present invention further provides an antenna structure, comprising: a substrate, a solder mask layer and an electrode layer. The substrate is provided with two first long sides, a second long side and two short sides which are correspondingly parallel, a plurality of side holes are respectively arranged on the first long sides and the second long sides, circuit layers are arranged on the front surface and the back surface of the substrate, each of the plurality of side holes is provided with a conductive layer, the conductive layers are electrically connected with the circuit layers, and each circuit layer comprises a plurality of inclined line segments and a plurality of transverse line segments; the solder mask layer is arranged on the front and back surfaces of the substrate to cover the plurality of oblique line segments and the plurality of transverse line segments of the circuit layer, and only exposes the conductive layers on the plurality of side holes. The electrode layer is arranged on the conductive layer of the plurality of side holes exposed on the front and back surfaces of the substrate to form an electrode layer for antenna welding.
In an embodiment of the present invention, the plurality of diagonal segments are composed of a first diagonal segment and a second diagonal segment, and the plurality of lateral segments are composed of a first lateral segment, a second lateral segment and a third lateral segment.
In an embodiment of the present invention, a first oblique line segment of the plurality of oblique line segments is electrically connected to the second side hole of the first long side and the first side hole of the second long side of the front surface of the substrate, and the second oblique line segment is electrically connected to the third side hole of the first long side and the second side hole of the second long side of the front surface of the substrate; a first transverse line segment of the plurality of transverse line segments is electrically connected with a first side hole of a first long side and a first side hole of a second long side of the back surface of the substrate, a second transverse line segment is electrically connected with a second side hole of the first long side and a second side hole of the second long side of the back surface of the substrate, and a third transverse line segment is electrically connected with a third side hole of the first long side and a third side hole of the second long side of the back surface of the substrate.
In an embodiment of the present invention, the plurality of oblique line segments and the plurality of transverse line segments are electrically connected to the plurality of side holes on the front surface and the back surface of the substrate, so that the circuit layer forms a spiral penetrating the substrate.
In one embodiment of the present invention, the substrate is a printed circuit board.
In one embodiment of the present invention, the plurality of side holes are semicircular.
In an embodiment of the present invention, the solder mask layer is an insulating material of black or white ink.
In an embodiment of the present invention, the conductive layer is a copper metal material.
In an embodiment of the invention, the electrode layer is a tin metal material.
Drawings
Fig. 1 is a schematic diagram of an antenna manufacturing process according to the present invention;
FIG. 2 is a schematic side view of a substrate of the present invention;
FIG. 3 is a schematic view of a structure fabricated by drilling holes in the substrate of FIG. 2;
FIG. 4 is a schematic side cross-sectional view of a structure fabricated in the electroplated conductive layer of FIG. 3;
FIGS. 5a to 5c are schematic views of the structure of the exposure, development, etching process of FIG. 4;
Fig. 6a to 6c are schematic structural views of the fabrication of the solder mask electrode layer in fig. 5a to 5 c;
Fig. 7 is a schematic view of the structure of the tin plating process of fig. 6 c;
FIG. 8 is a schematic diagram showing the dicing of the completed antenna on the substrate after tinning in accordance with the present invention;
fig. 9 is a schematic diagram of a single antenna structure after the cut in fig. 8.
Symbol description in the drawings:
S100-S112; 10. an antenna; 1. a substrate; 11. a metal layer; 12. 12a, 12b, 12c, 12d, 12e, 12 f; 13. drilling holes; 14. a first long side; 15. a second long side; 16. short sides; 2. a conductive layer; 21. a circuit layer; 211. oblique line segments; 211a first diagonal line segment; 211b a second diagonal line segment; 212. a transverse line segment; 212a first transverse line segment; 212b a second transverse line segment; 212c a third transverse line segment; 3. a solder mask layer; 4. an electrode layer; a, cutting a line longitudinally; and B, cutting a line transversely.
Detailed Description
The technical content and detailed description of the present invention are now as follows in conjunction with the drawings:
Referring to fig. 1, a schematic diagram of an antenna manufacturing process according to the present invention is shown; also referring to the semi-finished structure schematic diagrams of the steps of fig. 2 to 9. As shown in the figure: in the antenna manufacturing method of the present invention, first, as shown in step S100, a substrate 1 is provided, and each of the front and back surfaces of the substrate 1 has a metal layer 11 (shown in fig. 2). In the present drawing, the substrate 1 is a printed circuit board.
In step S102, drilling is performed, an even number of rows of through holes 12 are drilled on the relevant position of the antenna 10 (fig. 3) scheduled to be manufactured on the substrate 1 by using a processing machine, each row of through holes includes a plurality of through holes 12, each two adjacent rows of through holes are defined as a row of through holes, each row of through holes is respectively defined with a plurality of groups of through holes according to the size of the prefabricated single antenna, as shown in fig. 3, a group of through holes is formed by through holes 12a, 12b, 12c, 12d, 12e and 12f, each group of through holes includes a plurality of first rows of through holes (three through holes 12a, 12b and 12c are shown in fig. 3) and a corresponding plurality of second rows of through holes (three through holes 12d, 12e and 12f are shown in fig. 3), and the substrate 1 on the side of the through holes 12 is provided with a machine alignment drill 13 (fig. 3). In the present figure, the through holes 12 have a diameter of 0.15mm.
In step S104, a conductive layer 2 is formed on the metal layer 11 on the front and back sides of the substrate 1 and the walls of the through holes 12 by electroplating (fig. 4).
In step S106, the metal layer 11 and the conductive layer 2 on the front and back sides of the substrate 1 are formed with a circuit layer 21 electrically connected to the through holes 12 by using wet chemical etching or dry laser direct imaging etching (LASER DIRECT IMAGING, LDI) technology, and the circuit layer (radiation layer) 21 includes a plurality of oblique line segments 211 and a plurality of transverse line segments 212. The oblique line segments 211 are composed of a plurality of first oblique line segments 211a and a plurality of second oblique line segments 211b, and the transverse line segments 212 are composed of a plurality of first transverse line segments 212a, a plurality of second transverse line segments 212b and a plurality of third transverse line segments 212 c. The first oblique line segments 211a of the oblique line segments 211 are electrically connected to the second first row of through holes 12b and the first second row of through holes 12d of each set of through holes on the front surface of the substrate 1, and the second oblique line segments 211b are electrically connected to the third first row of through holes 12c and the second row of through holes 12e of each set of through holes on the front surface of the substrate 1. A plurality of first lateral line segments 212a of the lateral line segments 212 are electrically connected to a first row of through holes 12a and a first row of through holes 12d of each group of through holes on the back surface of the substrate 1. The plurality of second lateral line segments 212b are electrically connected to the second first row of through holes 12b and the second row of through holes 12e in each set of through holes on the back surface of the substrate 1. The third lateral line segments 212c electrically connect the third first row of through holes 12c and the third second row of through holes 12f (see fig. 5a-5 c) of the groups of through holes on the back surface of the substrate 1. And so on to complete the electrical connection of all the through holes 12 of the whole substrate 1. After the oblique line segments 211 and the transverse line segments 212 are electrically connected to the through holes 12a, 12b, 12c, 12d, 12e and 12f on the front and back sides of the substrate 1, the circuit layer 21 is formed to spirally penetrate the substrate 1.
In step S108, after the circuit layer 21 is manufactured, black or white ink is printed on the substrate 1 by printing technology, and the oblique line segments 211 and the transverse line segments 212 covering the front and back surfaces of the substrate 1 are formed into a solder mask layer 3 (as shown in fig. 6a-6 c), and the printed solder mask layer 3 exposes only the conductive layers 2 on the through holes 12a, 12b, 12c, 12d, 12e and 12 f. In this figure, the black or white ink is an insulating material.
In step S110, after the above-mentioned solder mask layer 3 is manufactured, a tin metal material is electroplated on the conductive layer 2 exposed on the front and back surfaces of the substrate 1 by electroplating technology to form an electrode layer 4 (fig. 7) for soldering the antenna 10.
In step S112, after the electrode layer 4 is manufactured, the connection line of the center point of the through holes 12 in each row is formed as a longitudinal cutting line a, the connection line of the middle point between the through holes in each row is formed as a transverse cutting line B (as shown in fig. 8), and the cutting tool is aligned with the longitudinal and transverse cutting lines A, B on the substrate 1 to form a single antenna 10 as shown in fig. 9, and the through holes 12a, 12B, 12c, 12d, 12e and 12f are also formed into semicircular side holes 121.
Please refer to fig. 2-9, which are schematic diagrams of the semi-manufactured product structure of each step of the present invention. As shown in the drawing, the antenna 10 of the present invention includes a substrate 1, a solder mask layer 3 and an electrode layer 4.
The substrate 1 has two parallel first long sides 14, two second long sides 15 and two short sides 16, a plurality of side holes 121 (in this embodiment, three side holes are taken as an example) are respectively disposed on the first long sides 14 and the second long sides 15, and a circuit layer 21 is disposed on the front surface and the back surface of the substrate. Each of the side holes 121 has a conductive layer 2, and the conductive layer 2 is electrically connected to the circuit layer 21, and the circuit layer 21 includes a plurality of oblique line segments 211 and a plurality of transverse line segments 212. The oblique line segments 211 are composed of a first oblique line segment 211a and a second oblique line segment 211b, and the transverse line segments 212 are composed of a first transverse line segment 212a, a second transverse line segment 212b and a third transverse line segment 212 c. The first oblique line segment 211a of the oblique line segments 211 is electrically connected to the second through hole (the second side hole) 12b of the first long side 14 and the first through hole (the first side hole) 12d of the second long side 15 on the front surface of the substrate 1, and the second oblique line segment 211b is electrically connected to the third through hole (the third side hole) 12c of the first long side 14 and the second through hole (the second side hole) 12e of the second long side 15. A first transverse line segment 212a of the transverse line segments 212 is electrically connected to a first through hole (a first side hole) 12a of the first long side 14 and a first through hole (a first side hole) 12d of the second long side 15 on the back of the substrate 1. The second transverse line segment 212b electrically connects the second through hole (second side hole) 12b of the first long side 14 and the second through hole (second side hole) 12e of the second long side 15. The third transverse line segment 212c electrically connects the third through hole (third side hole) 12c of the first long side 14 and the third through hole (third side hole) 12f of the second long side 15 (see fig. 5a-5 c). And so on to complete the electrical connection of all the through holes 12 of the whole substrate 1. After the oblique line segments 211 and the lateral line segments 212 are electrically connected to the through holes (the side holes) 12a, 12b, 12c, 12d, 12e and 12f on the front and back sides of the substrate 1, the circuit layer 21 is formed to spirally penetrate the substrate 1. In the present figure, the substrate 1 is a printed circuit board; the side holes are semicircular.
The solder mask layer 3 is formed by printing black ink on the front and back surfaces of the substrate 1 and covering the oblique line segments 211 and the transverse line segments 212 of the circuit layer 21 by printing technology (as shown in fig. 6a-6 c), and the printed solder mask layer 3 only exposes the conductive layer 2 on the through holes (side holes) 12a, 12b, 12c, 12d, 12e and 12 f. In this figure, the black or white ink is an insulating material.
The electrode layer 4 is formed by electroplating a tin metal material on the conductive layer 2 of the exposed through holes (side holes) 12a, 12b, 12c, 12d, 12e and 12f on the front and back surfaces of the substrate 1 to form the electrode layer 4 for soldering the antenna 10.
The foregoing description is only of the preferred embodiments of the invention and is not intended to limit the scope of the invention. All such equivalent changes and modifications are intended to be covered by the scope of this invention.
Claims (19)
1. A method of manufacturing an antenna, comprising the steps of:
a) The method comprises providing a substrate having a metal layer on the front and back surfaces thereof;
b) An even number of rows of through holes which are longitudinally arranged are drilled at the relevant positions of the preset antenna manufactured by the substrate, each row of through holes comprises a plurality of through holes, every two adjacent rows of through holes are defined as a row of through holes, each row of through holes is respectively defined with a plurality of groups of through holes according to the size of the preset single antenna, and each group of through holes comprises a plurality of first rows of through holes and a plurality of corresponding second rows of through holes;
c) Electroplating copper metal material on the metal layer on the front and back surfaces of the substrate and the walls of the through holes to form a conductive layer;
d) Forming a circuit layer electrically connected with the through holes on the metal layer and the conductive layer on the front and the back of the substrate by using an etching manufacturing technology, wherein the circuit layer comprises a plurality of inclined line segments and a plurality of transverse line segments;
e) Printing ink on the substrate, and covering the oblique line segments and the transverse line segments of the circuit layers on the front and back surfaces of the substrate to form a solder mask layer, wherein the solder mask layer only exposes the conductive layers of the through holes;
f) And electroplating tin metal materials on the conductive layers of the plurality of through holes exposed on the front and back surfaces of the substrate by electroplating technology to form electrode layers for antenna welding.
2. The method of claim 1, wherein the substrate in step a) is a printed circuit board.
3. The method of manufacturing an antenna according to claim 1, wherein the diameter of the through hole in step b) is 0.15mm.
4. The method of claim 1, wherein the etching process in step d) is wet chemical etching or dry laser etching.
5. The method of claim 1, wherein the plurality of diagonal segments in the step d) are composed of a plurality of first diagonal segments and a plurality of second diagonal segments, and the plurality of transverse segments are composed of a plurality of first transverse segments, a plurality of second transverse segments and a plurality of third transverse segments.
6. The method of claim 5, wherein the plurality of first diagonal segments are electrically connected to the second first row of holes and the first second row of holes in each group of holes on the front surface of the substrate, and the plurality of second diagonal segments are electrically connected to the third first row of holes and the second row of holes in each group of holes on the front surface of the substrate; the plurality of first transverse line segments are electrically connected with a first row of through holes and a first second row of through holes in each group of through holes on the back surface of the substrate, the plurality of second transverse line segments are electrically connected with a second first row of through holes and a second row of through holes in each group of through holes on the back surface of the substrate, and the plurality of third transverse line segments are electrically connected with a third first row of through holes and a third second row of through holes in each group of through holes on the back surface of the substrate.
7. The method of claim 5, wherein the plurality of diagonal line segments and the plurality of lateral line segments form a spiral line extending through the substrate after electrically connecting the plurality of through holes on the front and back surfaces of the substrate.
8. The method of claim 1, wherein the ink in step e) is a black or white insulating material.
9. The method of claim 1, further comprising a step g) after the step f), wherein the cutting and manufacturing of the step g) forms a longitudinal cutting line with a line of a central point of the plurality of through holes in each row, and forms a transverse cutting line with a line of a middle point between the plurality of through holes in each row of the plurality of through holes, so as to align the longitudinal and transverse cutting lines on the substrate, i.e., form a single antenna such that the plurality of through holes form side holes.
10. The method of manufacturing an antenna of claim 9, wherein the side hole is semicircular.
11. An antenna structure comprising:
the circuit board comprises a substrate, a first connecting piece and a second connecting piece, wherein the substrate is provided with a first long side, a second long side and two short sides which are correspondingly parallel, a plurality of side holes are respectively arranged on the first long side and the second long side, circuit layers are arranged on the front surface and the back surface of the substrate, each of the plurality of side holes is provided with a conductive layer, the conductive layers are electrically connected with the circuit layers, and each circuit layer comprises a plurality of inclined line segments and a plurality of transverse line segments;
The solder mask layer is arranged on the front surface and the back surface of the substrate to cover the plurality of inclined line segments and the plurality of transverse line segments of the circuit layer, and only exposes the conductive layers on the plurality of side holes;
And the electrode layers are arranged on the conductive layers of the plurality of side holes exposed on the front and back surfaces of the substrate to form the electrode layers for antenna welding.
12. The antenna structure of claim 11, wherein the plurality of diagonal segments comprises a first diagonal segment and a second diagonal segment, and the plurality of lateral segments comprises a first lateral segment, a second lateral segment, and a third lateral segment.
13. The antenna structure of claim 12, wherein a first diagonal segment of the plurality of diagonal segments is electrically connected to a second side hole of the first long side and a first side hole of the second long side of the front surface of the substrate, and the second diagonal segment is electrically connected to a third side hole of the first long side and a second side hole of the second long side of the front surface of the substrate; a first transverse line segment of the plurality of transverse line segments is electrically connected with a first side hole of a first long side and a first side hole of a second long side of the back surface of the substrate, a second transverse line segment is electrically connected with a second side hole of the first long side and a second side hole of the second long side of the back surface of the substrate, and a third transverse line segment is electrically connected with a third side hole of the first long side and a third side hole of the second long side of the back surface of the substrate.
14. The antenna structure of claim 12, wherein the plurality of diagonal line segments and the plurality of lateral line segments are electrically connected to the plurality of side holes on the front and back surfaces of the substrate, such that the circuit layer is formed to spirally penetrate the substrate.
15. The antenna structure of claim 11, wherein the substrate is a printed circuit board.
16. The antenna structure of claim 11, wherein the plurality of side holes are semi-circular.
17. The antenna structure of claim 11, wherein the solder mask layer is an insulating material of black or white ink.
18. The antenna structure of claim 11, wherein the conductive layer is a copper metal material.
19. The antenna structure of claim 11, wherein the electrode layer is a tin metal material.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW110108545 | 2021-03-10 | ||
| TW110108545A TWI764611B (en) | 2021-03-10 | 2021-03-10 | Antenna manufacturing method and structure for the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115084841A CN115084841A (en) | 2022-09-20 |
| CN115084841B true CN115084841B (en) | 2024-05-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210208020.2A Active CN115084841B (en) | 2021-03-10 | 2022-03-04 | Antenna manufacturing method and structure thereof |
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| Country | Link |
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| CN (1) | CN115084841B (en) |
| TW (1) | TWI764611B (en) |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
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| TWI764611B (en) | 2022-05-11 |
| CN115084841A (en) | 2022-09-20 |
| TW202236735A (en) | 2022-09-16 |
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