CN1770956A

CN1770956A - Method for making circuit board

Info

Publication number: CN1770956A
Application number: CN 200410088519
Authority: CN
Inventors: 邹镜华
Original assignee: Advanced Semiconductor Engineering Inc
Current assignee: Advanced Semiconductor Engineering Inc
Priority date: 2004-11-05
Filing date: 2004-11-05
Publication date: 2006-05-10
Anticipated expiration: 2024-11-05
Also published as: CN100455162C

Abstract

This invention relates to circuit board process method, which comprises the following steps: a, providing one baseboard with at least one surface of one conductive layer, wherein, the baseboard has at least one hole coated with one metal layer; b, filling with one isolation materials into the hole; c, dividing the hole and isolation materials; d, etching the hole wall metal part; e, removing the isolation materials to Remove the un-plane remaining metal on the cutting plane to prevent metal layer edge.

Description

The manufacture method of circuit board

Technical field

The present invention relates to a kind of manufacture method of circuit board, particularly a kind of manufacture method with circuit board of through hole.

Background technology

Has plated-through-hole (Plated Through Hole, PTH) circuit board is more and more wider in application now, for example for the side of electrical connection circuit plate, way commonly used is for to offer plurality of through holes on this side, and electroplates the layer of metal layer with as contact on the hole wall of these through holes.In general, these through holes that are formed at the circuit board side must be through a cutting step.

With reference to figure 1, show the schematic diagram that is positioned at the through hole of circuit board side commonly used.By finding out among the figure, have plurality of through holes 12 on the side of this common circuit plate 1, these through holes 12 can stay burr (burr) 13 in forming process simultaneously.

Referring to figs. 2 to Fig. 4, show the schematic diagram that forms the through hole of circuit board side commonly used.At first, as shown in Figure 2, a forming-tool 18 with direction of arrow A rotation simultaneously with direction of arrow B near a through hole 14.Then, as shown in Figure 3, when these forming-tool 18 these through holes 14 of contact, can cut off the front side of hole wall 15 earlier and form a forward position (leading edge) 17, after in case this forward position 17 forms, the adhesion strength of only remaining this metal level 16 of the power that can keep out this forming-

tool

18 and 15 of this hole walls, and heat that this forming-tool 18 is produced by these through hole 14 backs can make the metal level 16 that is positioned at this forward position 17 be torn to break away from this forward position 17, this is the hypodynamic relation of adhesion because of 17 in metal level 16 and forward position.At last, as shown in Figure 4, when this forming-tool 18 by behind this through hole 14, promptly form the through hole 12 among Fig. 1, and the metal level that is positioned at this forward position 17 can be bent, and formed the burr 13 among Fig. 1.

The shortcoming of these burr 13 is that it obviously can influence and is electrically connected, for example short circuit (shortcircuit) or loose contact, moreover it can influence the contact test.

Therefore, be necessary to provide the manufacture method of the circuit board of a kind of innovation and rich progressive to solve the problems referred to above.

Summary of the invention

Main purpose of the present invention provides a kind of manufacture method of circuit board, this manufacture method is at the metal level of removing with etching mode behind the cutting process on a fraction of through-hole wall, to remove this metal level irregular kish on cut surface, prevent the generation of burr.

Another object of the present invention provides a kind of manufacture method of circuit board, and it comprises:

(a) provide a substrate, the upper and lower surface of this substrate has a conductive layer, and this substrate has at least one through hole, is coated with layer of metal on the hole wall of this through hole;

(b) fill up an insulating material in this through hole;

(c) cut apart this through hole and this insulating material;

(d) part of metal on this through hole hole wall of etching; And

(e) remove this insulating material.

Description of drawings

Fig. 1 shows the schematic diagram that is positioned at the through hole of circuit board side commonly used;

Fig. 2 to Fig. 4 shows the schematic diagram that forms the through hole of circuit board side commonly used;

Fig. 5,6,6a, 7 to 9,9a and 10 to Figure 12 show the schematic diagram of method of manufacturing circuit board first embodiment of the present invention; And

Figure 13,14,14a and 15 show the schematic diagram of method of manufacturing circuit board second embodiment of the present invention to Figure 23.

Embodiment

To Figure 12, show the schematic diagram of method of manufacturing circuit board first embodiment of the present invention with reference to figure 5.With reference to figure 5, a substrate 2 at first is provided, the center of this substrate 2 is a core substrate (core) 21, and its upper and lower surface all has a conductive layer 22 (a for example Copper Foil (copper foil)).

Then, with reference to figure 6, on this substrate 2, form at least one through hole 23, the mode that forms this through hole 23 is a usual manner, such as machine drilling method (mechanical drilling), laser ablation method (laserablation), photochemical reaction method (photochemical reaction) or plasma etching method (plasma etching) etc.With reference to figure 6a, the schematic top plan view of displayed map 6, in this figure be with two rows totally six to wait through holes 23 be example.

Then, with reference to figure 7, electroplate a metal level 24 on the hole wall of this through hole 23, this electro-plating method can be conventional methods such as electroless-plating or Direct Electroplating.In the present embodiment, the material of this metal level is a copper.

Then, with reference to figure 8, the substrate after the patterning process is carried out in demonstration, this patterning process is a conventional process, it comprises: paste photoresistance, exposure imaging, etching, removing photoresistance etc., and then, make this conductive layer 22 and this metal level 24 form the metallic circuit (trace) 25 of patterning.

Then, with reference to figure 9, fill up an insulating material 26 in this through hole 23, the material of this insulating material 26 can be the printing ink that can divest.

Then, with reference to figure 9a, the schematic top plan view of displayed map 9.Be to cut apart these through holes 23 and these insulating material 26 on this substrate 2 in this figure along line of cut 27.

With reference to Figure 10, the sectional perspective schematic diagram of the substrate 2 of displayed map 9a after cutting, can make metal level 24 this through hole 23 hole walls in cutting process be difficult for produce burr owing to add the cause of these insulating material 26 this moment.Yet better way is to carry out a microetch (micro-etching) process at this metal level 24 again behind cutting process, to remove the kish of these metal level 24 surface irregularities, as shown in figure 11.

At last, remove these insulating material 26, the circuit board that gets final product requiredly with through hole, as shown in figure 12.Moreover, if necessary, can carry out following steps again: cover a welding resisting layer (soldermask) on the metallic circuit 25 of this patterning, this welding resisting layer of removing part is with this metallic circuit of exposed portions serve and electroplate a nickel/gold layer in this metallic circuit that exposes, the position of pin (figure) for example.

In the present embodiment, electroplate this metal level 24 and promptly carry out the patterning process behind the hole wall of this through hole 23, yet be understandable that, this patterning process can (be that Fig. 9 a) carries out afterwards at this cutting step also.

With reference to figures 13 to Figure 23, show the schematic diagram of method of manufacturing circuit board second embodiment of the present invention.With reference to Figure 13, a substrate 3 at first is provided, the center of this substrate 3 is a core substrate (core) 31, and its upper and lower surface all has a conductive layer 32 (a for example Copper Foil (copper foil)).

Then, with reference to Figure 14, on this substrate 3, form at least one through hole 33, the mode that forms this through hole 33 is a usual manner, such as machine drilling method (mechanical drilling), laser ablation method (laser ablation), photochemical reaction method (photochemical reaction) or plasma etching method (plasma etching) etc.With reference to figure 14a, show the schematic top plan view of Figure 14, in this figure be with two rows totally six to wait through holes 33 be example.

Then, with reference to Figure 15, electroplate a metal level 34 on the hole wall of this through hole 33, this electro-plating method can be conventional methods such as electroless-plating or Direct Electroplating.In the present embodiment, the material of this first metal layer is a copper.

Then, with reference to Figure 16, the substrate after the patterning process is carried out in demonstration, this patterning process is a conventional process, it comprises: paste photoresistance, exposure imaging, etching, removing photoresistance etc., and then, make this conductive layer 32 and this metal level 34 form the metallic circuit (trace) 35 of patterning.

Then, with reference to Figure 17, cover a welding resisting layer (solder mask) 37 on the metallic circuit 35 of this patterning.

Then, with reference to Figure 18, remove the step of this welding resisting layer 37 of part with this metallic circuit 35 of exposed portions serve.

Then, with reference to Figure 19, fill up an insulating material 36 in this through hole 33, the material of this insulating material 36 can be the printing ink that can divest.In the present embodiment, fill up an insulating material 36 in the step of this through hole 33 after removing this welding resisting layer 37 partly this metallic circuit 35 with exposed portions serve, yet in other is used, also can this welding resisting layer 37 of removing part with these metallic circuit 35 back Direct Electroplating one nickel/gold of exposed portions serve layer on the ad-hoc location of this pattern metal circuit 25.

Then, with reference to Figure 20, cover one deck dry film 38 on this welding resisting layer 37.

Then, cut apart these through holes 33 and these insulating material 36 on this substrate 3 along predetermined line of cut (not shown).

With reference to Figure 21, show the sectional perspective schematic diagram of substrate 3 after cutting of Figure 20, can make metal level 34 this through hole 33 hole walls in cutting process be difficult for produce burr owing to add the cause of these insulating material 36 this moment.Yet better way is to carry out a microetch (micro-etching) process at the metal level on this cut surface 34 again behind the cutting process, to remove the kish of these metal level 34 surface irregularities, as shown in figure 22.

At last, remove these insulating material 36 and this dry film 38, the circuit board with through hole 3 that gets final product requiredly, as shown in figure 23.Moreover, if necessary, can electroplate a nickel/gold layer on the ad-hoc location of this pattern metal circuit 35, for example the position of pin (figure).

The foregoing description only is explanation principle of the present invention and effect thereof, and unrestricted the present invention, so the those skilled in the art makes amendment to the foregoing description and changes and still do not break away from spirit of the present invention.Interest field of the present invention should be listed as above-mentioned claim.

Claims

1. the manufacture method of a circuit board, it comprises:

(a) provide a substrate, at least one surface of this substrate has a conductive layer, and this substrate has at least one through hole, is coated with a metal level on the hole wall of this through hole;

(b) fill up an insulating material in this through hole;

(c) cut apart this through hole and this insulating material;

(d) part of metal on this through hole hole wall of etching; And

(e) remove this insulating material.

2. method according to claim 1, wherein the material of this conductive layer is a copper.

3. method according to claim 1, wherein the material of this metal level is a copper.

4. method according to claim 1, wherein step (a) comprises that further this conductive layer of a patterning makes it become the step of a metallic circuit (trace).

5. method according to claim 4, wherein step (a) comprises that further one covers a welding resisting layer (solder mask) in the step of the metallic circuit of this patterning.

6. method according to claim 5, wherein step (a) comprises that further one removes the step of this welding resisting layer of part with this metallic circuit of exposed portions serve.

7. method according to claim 6, wherein step (a) comprises that further one electroplates the step of this metallic circuit that exposes.

8. method according to claim 7, wherein the plated material of step (a) is nickel/gold.

9. method according to claim 6, wherein step (a) comprises that further one covers one deck dry film (dry film) to cover the step of this metallic circuit that exposes.

10. method according to claim 9, wherein step (e) comprises that further one removes the step of this dry film (dryfilm).

11. method according to claim 10, wherein step (e) comprises that further one electroplates the step of this metallic circuit that exposes.

12. method according to claim 11, wherein the plated material of step (e) is nickel/gold.

13. method according to claim 1, wherein step (e) comprises that further this conductive layer of a patterning makes it become the step of a metallic circuit (trace).

14. method according to claim 13, wherein step (e) comprises that further one covers a welding resisting layer (solder mask) in the step of the metallic circuit of this patterning.

15. method according to claim 14, wherein step (e) comprises that further one removes the step of this welding resisting layer of part with this metallic circuit of exposed portions serve.

16. method according to claim 15, wherein step (e) comprises that further one electroplates the step of this metallic circuit that exposes.

17. method according to claim 16, wherein the plated material of step (e) is nickel/gold.