TWI761004B - 圖案檢查裝置及圖案檢查方法 - Google Patents
圖案檢查裝置及圖案檢查方法 Download PDFInfo
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- TWI761004B TWI761004B TW109146610A TW109146610A TWI761004B TW I761004 B TWI761004 B TW I761004B TW 109146610 A TW109146610 A TW 109146610A TW 109146610 A TW109146610 A TW 109146610A TW I761004 B TWI761004 B TW I761004B
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
- G06T7/001—Industrial image inspection using an image reference approach
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
- G01N23/22—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
- G01N23/225—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion
- G01N23/2251—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion using incident electron beams, e.g. scanning electron microscopy [SEM]
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
- G06T7/0006—Industrial image inspection using a design-rule based approach
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/10—Segmentation; Edge detection
- G06T7/12—Edge-based segmentation
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/60—Analysis of geometric attributes
- G06T7/62—Analysis of geometric attributes of area, perimeter, diameter or volume
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/10—Image acquisition modality
- G06T2207/10056—Microscopic image
- G06T2207/10061—Microscopic image from scanning electron microscope
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30148—Semiconductor; IC; Wafer
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Quality & Reliability (AREA)
- Geometry (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Length-Measuring Devices Using Wave Or Particle Radiation (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020-003015 | 2020-01-10 | ||
| JP2020003015 | 2020-01-10 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW202141176A TW202141176A (zh) | 2021-11-01 |
| TWI761004B true TWI761004B (zh) | 2022-04-11 |
Family
ID=76787917
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW109146610A TWI761004B (zh) | 2020-01-10 | 2020-12-29 | 圖案檢查裝置及圖案檢查方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US12205272B2 (https=) |
| JP (1) | JP7326480B2 (https=) |
| TW (1) | TWI761004B (https=) |
| WO (1) | WO2021140866A1 (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021140866A1 (ja) * | 2020-01-10 | 2021-07-15 | 株式会社ニューフレアテクノロジー | パターン検査装置及びパターン検査方法 |
| JP7608298B2 (ja) | 2021-08-23 | 2025-01-06 | 株式会社ニューフレアテクノロジー | 検査装置及び検査方法 |
| CN218931028U (zh) * | 2022-12-14 | 2023-04-28 | 广东九纵智能科技有限公司 | 用于多轴联动检测有限角度的二轴旋转装置 |
| CN118392834B (zh) * | 2024-06-27 | 2024-09-10 | 国鲸科技(广东横琴粤澳深度合作区)有限公司 | 一种用于集成电路透明柔性基板的检测方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002001596A1 (fr) | 2000-06-27 | 2002-01-03 | Ebara Corporation | Appareil d'inspection d'un faisceau de particules charge et procede de production d'un dispositif utilisant cet appareil |
| TW201027029A (en) * | 2008-12-26 | 2010-07-16 | Advantest Corp | Pattern measuring apparatus and pattern measuring method |
| US20130105691A1 (en) * | 2011-10-26 | 2013-05-02 | Advantest Corporation | Pattern measurement apparatus and pattern measurement method |
Family Cites Families (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61251705A (ja) * | 1985-04-30 | 1986-11-08 | Sumitomo Metal Ind Ltd | パタ−ン検査方法及び装置 |
| TW393681B (en) * | 1998-06-11 | 2000-06-11 | United Microelectronics Corp | Method for checking a correction pattern |
| US6326618B1 (en) * | 1999-07-02 | 2001-12-04 | Agere Systems Guardian Corp. | Method of analyzing semiconductor surface with patterned feature using line width metrology |
| US7817844B2 (en) * | 1999-08-26 | 2010-10-19 | Nanogeometry Research Inc. | Pattern inspection apparatus and method |
| JP4827269B2 (ja) * | 2004-02-23 | 2011-11-30 | 株式会社 Ngr | パターン検査装置および方法 |
| JP4223979B2 (ja) * | 2004-03-16 | 2009-02-12 | 株式会社日立ハイテクノロジーズ | 走査型電子顕微鏡装置及び走査型電子顕微鏡装置における装置としての再現性能評価方法 |
| JP4174504B2 (ja) * | 2005-08-31 | 2008-11-05 | アドバンスド・マスク・インスペクション・テクノロジー株式会社 | 試料検査装置、試料検査方法及びプログラム |
| JP5063071B2 (ja) * | 2006-02-14 | 2012-10-31 | 株式会社ニューフレアテクノロジー | パタン作成方法及び荷電粒子ビーム描画装置 |
| JP4074643B2 (ja) * | 2006-03-27 | 2008-04-09 | 株式会社アドバンテスト | 線幅測定調整方法及び走査型電子顕微鏡 |
| JP2008071928A (ja) * | 2006-09-14 | 2008-03-27 | Nuflare Technology Inc | 描画パターンのリサイズ方法及び荷電粒子ビーム描画方法 |
| JP4943304B2 (ja) | 2006-12-05 | 2012-05-30 | 株式会社 Ngr | パターン検査装置および方法 |
| JP5162314B2 (ja) * | 2008-04-25 | 2013-03-13 | 東京エレクトロン株式会社 | 基板の処理方法、プログラム、コンピュータ記憶媒体及び基板処理システム |
| JP4970569B2 (ja) | 2010-06-17 | 2012-07-11 | 株式会社東芝 | パターン検査装置およびパターン検査方法 |
| US8669523B2 (en) | 2011-05-25 | 2014-03-11 | Kla-Tencor Corporation | Contour-based defect detection using an inspection apparatus |
| JP5743955B2 (ja) | 2012-05-28 | 2015-07-01 | 株式会社日立ハイテクノロジーズ | パターン検査装置およびパターン検査方法 |
| JP6431786B2 (ja) * | 2015-02-25 | 2018-11-28 | 株式会社ニューフレアテクノロジー | 線幅誤差取得方法、線幅誤差取得装置および検査システム |
| JP6446297B2 (ja) * | 2015-03-09 | 2018-12-26 | 株式会社ニューフレアテクノロジー | 検査装置 |
| JP6515013B2 (ja) * | 2015-11-05 | 2019-05-15 | 株式会社ニューフレアテクノロジー | 検査装置および検査方法 |
| KR102349124B1 (ko) * | 2017-06-06 | 2022-01-10 | 에이에스엠엘 네델란즈 비.브이. | 측정 방법 및 장치 |
| JP2019120654A (ja) * | 2018-01-11 | 2019-07-22 | 株式会社ニューフレアテクノロジー | 検査方法 |
| JP7072844B2 (ja) * | 2018-03-30 | 2022-05-23 | 東レエンジニアリング先端半導体Miテクノロジー株式会社 | ウェハパターンのエッジと基準パターンのエッジとの乖離量と基準パターンのスペース幅との関係を示す補正線を生成する方法および装置、並びにコンピュータ読み取り可能な記録媒体 |
| JP7171378B2 (ja) * | 2018-11-15 | 2022-11-15 | 株式会社ニューフレアテクノロジー | マルチ電子ビーム検査装置及びマルチ電子ビーム検査方法 |
| JP7241570B2 (ja) * | 2019-03-06 | 2023-03-17 | 株式会社ニューフレアテクノロジー | マルチ電子ビーム検査装置及びマルチ電子ビーム検査方法 |
| WO2021140866A1 (ja) * | 2020-01-10 | 2021-07-15 | 株式会社ニューフレアテクノロジー | パターン検査装置及びパターン検査方法 |
| JP7442375B2 (ja) * | 2020-04-06 | 2024-03-04 | 株式会社ニューフレアテクノロジー | マルチ電子ビーム検査装置及びマルチ電子ビーム検査方法 |
| JP7409988B2 (ja) * | 2020-07-29 | 2024-01-09 | 株式会社ニューフレアテクノロジー | パターン検査装置及び輪郭線同士のアライメント量取得方法 |
| JP2024082122A (ja) * | 2022-12-07 | 2024-06-19 | キヤノン株式会社 | 情報処理装置、その制御方法、及びプログラム |
-
2020
- 2020-12-17 WO PCT/JP2020/047233 patent/WO2021140866A1/ja not_active Ceased
- 2020-12-17 JP JP2021569801A patent/JP7326480B2/ja active Active
- 2020-12-29 TW TW109146610A patent/TWI761004B/zh active
-
2022
- 2022-06-07 US US17/805,734 patent/US12205272B2/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002001596A1 (fr) | 2000-06-27 | 2002-01-03 | Ebara Corporation | Appareil d'inspection d'un faisceau de particules charge et procede de production d'un dispositif utilisant cet appareil |
| TW201027029A (en) * | 2008-12-26 | 2010-07-16 | Advantest Corp | Pattern measuring apparatus and pattern measuring method |
| US20130105691A1 (en) * | 2011-10-26 | 2013-05-02 | Advantest Corporation | Pattern measurement apparatus and pattern measurement method |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202141176A (zh) | 2021-11-01 |
| JPWO2021140866A1 (https=) | 2021-07-15 |
| JP7326480B2 (ja) | 2023-08-15 |
| US12205272B2 (en) | 2025-01-21 |
| WO2021140866A1 (ja) | 2021-07-15 |
| US20220301138A1 (en) | 2022-09-22 |
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