TWI758314B - 對光穩定的透明黏著劑組合物及其使用方法 - Google Patents

對光穩定的透明黏著劑組合物及其使用方法 Download PDF

Info

Publication number
TWI758314B
TWI758314B TW106128781A TW106128781A TWI758314B TW I758314 B TWI758314 B TW I758314B TW 106128781 A TW106128781 A TW 106128781A TW 106128781 A TW106128781 A TW 106128781A TW I758314 B TWI758314 B TW I758314B
Authority
TW
Taiwan
Prior art keywords
formulation
range
nanoparticles
resin
acid
Prior art date
Application number
TW106128781A
Other languages
English (en)
Chinese (zh)
Other versions
TW201831631A (zh
Inventor
圃偉 劉
江波 歐陽
顧春華
Original Assignee
德商漢高股份有限及兩合公司
德商漢高智慧財產控股公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 德商漢高股份有限及兩合公司, 德商漢高智慧財產控股公司 filed Critical 德商漢高股份有限及兩合公司
Publication of TW201831631A publication Critical patent/TW201831631A/zh
Application granted granted Critical
Publication of TWI758314B publication Critical patent/TWI758314B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
    • C08F220/30—Esters containing oxygen in addition to the carboxy oxygen containing aromatic rings in the alcohol moiety
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
    • C08F220/30—Esters containing oxygen in addition to the carboxy oxygen containing aromatic rings in the alcohol moiety
    • C08F220/301—Esters containing oxygen in addition to the carboxy oxygen containing aromatic rings in the alcohol moiety and one oxygen in the alcohol moiety
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/08—Ingredients agglomerated by treatment with a binding agent
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/10—Encapsulated ingredients
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J167/00—Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
    • C09J167/06—Unsaturated polyesters having carbon-to-carbon unsaturation
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2237—Oxides; Hydroxides of metals of titanium
    • C08K2003/2241—Titanium dioxide
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2244—Oxides; Hydroxides of metals of zirconium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Physics & Mathematics (AREA)
  • Inorganic Chemistry (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW106128781A 2016-08-30 2017-08-24 對光穩定的透明黏著劑組合物及其使用方法 TWI758314B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
??PCT/CN2016/097272 2016-08-30
PCT/CN2016/097272 WO2018039897A1 (fr) 2016-08-30 2016-08-30 Compositions adhésives stables à la lumière présentant un indice de réfraction élevé et assemblages, articles et éléments électroluminescents correspondants
WOPCT/CN2016/097272 2016-08-30

Publications (2)

Publication Number Publication Date
TW201831631A TW201831631A (zh) 2018-09-01
TWI758314B true TWI758314B (zh) 2022-03-21

Family

ID=61299904

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106128781A TWI758314B (zh) 2016-08-30 2017-08-24 對光穩定的透明黏著劑組合物及其使用方法

Country Status (7)

Country Link
US (1) US11174419B2 (fr)
EP (1) EP3507337A4 (fr)
JP (1) JP7183159B2 (fr)
KR (1) KR102580536B1 (fr)
CN (1) CN109642144B (fr)
TW (1) TWI758314B (fr)
WO (1) WO2018039897A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109897132A (zh) * 2018-12-25 2019-06-18 昆明理工大学 一种具有阻燃功能的丙烯酸酯乳液及其制备方法
CN110093141A (zh) * 2019-05-06 2019-08-06 深圳市华星光电技术有限公司 用于柔性基板剥离的组合材料及其制备方法、柔性面板的制作方法
KR20210086896A (ko) 2019-12-31 2021-07-09 삼성디스플레이 주식회사 경화성 조성물, 상기 경화성 조성물의 제조 방법, 상기 경화성 조성물의 경화물, 상기 경화물의 제조 방법 및 상기 경화물을 포함한 장치
WO2021193724A1 (fr) * 2020-03-24 2021-09-30 日東電工株式会社 Composition adhésive sensible à la pression, adhésif sensible à la pression et feuille adhésive sensible à la pression
WO2021193723A1 (fr) * 2020-03-24 2021-09-30 日東電工株式会社 Feuille de couche intermédiaire, feuille de couche intermédiaire dotée d'un film protecteur, et stratifié optique

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012246455A (ja) * 2011-05-31 2012-12-13 Oji Holdings Corp 透明粘着剤、透明粘着層、粘着型光学部材および画像表示装置
TW201339222A (zh) * 2011-11-25 2013-10-01 Dai Ichi Kogyo Seiyaku Co Ltd 光學材料用樹脂組成物
TW201544564A (zh) * 2014-04-21 2015-12-01 Henkel IP & Holding GmbH 可固化之黏著劑組合物及其用途

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5646241A (en) 1995-05-12 1997-07-08 Quantum Materials, Inc. Bleed resistant cyanate ester-containing compositions
US5717034A (en) 1996-07-29 1998-02-10 Quantum Materials, Inc. Perfluorinated hydrocarbon polymer-filled adhesive formulations and uses therefor
US6387981B1 (en) * 1999-10-28 2002-05-14 3M Innovative Properties Company Radiopaque dental materials with nano-sized particles
US7169375B2 (en) * 2003-08-29 2007-01-30 General Electric Company Metal oxide nanoparticles, methods of making, and methods of use
US7090721B2 (en) * 2004-05-17 2006-08-15 3M Innovative Properties Company Use of nanoparticles to adjust refractive index of dental compositions
JP5564748B2 (ja) * 2007-11-15 2014-08-06 住友大阪セメント株式会社 屈折率調整光学部材用透明粘着剤と光学用透明粘着層及び屈折率調整光学部材用透明粘着剤の製造方法並びに光学用透明粘着層の製造方法
WO2009078129A1 (fr) * 2007-12-17 2009-06-25 Mitsui Chemicals, Inc. Composition de résine, élément transparent obtenu à partir de ladite composition de résine et son utilisation
JP5258332B2 (ja) * 2008-03-06 2013-08-07 日東電工株式会社 光散乱粘着剤組成物、光散乱粘着剤層、光散乱粘着シート、及びこれらを用いたバックライトシステム
JP2012062242A (ja) * 2010-08-20 2012-03-29 Nagase Chemtex Corp 複合酸化物微粒子及び光学材料
JP2012046673A (ja) * 2010-08-27 2012-03-08 Nippon Shokubai Co Ltd 光学用接着樹脂組成物
EP3795619A1 (fr) * 2011-05-13 2021-03-24 3M Innovative Properties Co. Monomères de (méth)acrylate de benzyle appropriés pour des films optiques microstructurés
JP6143338B2 (ja) * 2013-04-10 2017-06-07 大日精化工業株式会社 高屈折率ポリマー及びその製造方法
KR101587351B1 (ko) * 2013-05-31 2016-01-20 주식회사 엘지화학 광산란 점착 필름, 편광판 및 액정 표시 장치
EP2913355A1 (fr) * 2014-02-28 2015-09-02 AZ Electronic Materials (Germany) GmbH Matériau hybride pour applications optoélectroniques
DE102015220373A1 (de) * 2014-10-23 2016-04-28 Voco Gmbh Härtbares Dentalmaterial

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012246455A (ja) * 2011-05-31 2012-12-13 Oji Holdings Corp 透明粘着剤、透明粘着層、粘着型光学部材および画像表示装置
TW201339222A (zh) * 2011-11-25 2013-10-01 Dai Ichi Kogyo Seiyaku Co Ltd 光學材料用樹脂組成物
TW201544564A (zh) * 2014-04-21 2015-12-01 Henkel IP & Holding GmbH 可固化之黏著劑組合物及其用途

Also Published As

Publication number Publication date
EP3507337A1 (fr) 2019-07-10
KR102580536B1 (ko) 2023-09-22
US11174419B2 (en) 2021-11-16
KR20190045908A (ko) 2019-05-03
WO2018039897A1 (fr) 2018-03-08
JP2019532163A (ja) 2019-11-07
US20190218434A1 (en) 2019-07-18
JP7183159B2 (ja) 2022-12-05
CN109642144B (zh) 2022-09-02
EP3507337A4 (fr) 2020-04-08
CN109642144A (zh) 2019-04-16
TW201831631A (zh) 2018-09-01

Similar Documents

Publication Publication Date Title
TWI758314B (zh) 對光穩定的透明黏著劑組合物及其使用方法
US10913879B2 (en) Thermally conductive pre-applied underfill formulations and uses thereof
TWI790188B (zh) 改良熱固性聚合物樹脂之效能性質的方法
US10242923B2 (en) Formulations containing mixed resin systems and the use thereof for wafer-level underfill for 3D TSV packages
TWI778976B (zh) 用於塗布與間隙填充應用之含石墨烯材料
TWI777922B (zh) 含障壁膜之結構及其於三維直通矽穿孔（３ｄ ｔｓｖ）封裝之預施用底部填充膜之用途
WO2016196936A1 (fr) Formulations à interface thermoconductrice et procédés correspondants
US10927249B2 (en) Resin compositions for underfill film for three dimensional through silica via (TSV) packages and compositions useful for the preparation thereof
KR102563013B1 (ko) 다층 물품에 대한 워크라이프 개선 및 그의 제조 및 사용 방법
WO2018170371A1 (fr) Composés polyaromatiques et résines à indice de réfraction élevé, stables à la lumière et résistantes au jaunissement les contenant