TWI755490B - Separation device and separation method - Google Patents
Separation device and separation method Download PDFInfo
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/185—Joining of semiconductor bodies for junction formation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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Abstract
本發明之課題係提供一種可以防止以保持構件保持之黏接片的被保持領域黏接在該保持構件之離間裝置及離間方法。 本發明之解決手段為一種離間裝置,其特徵係具備:在一方之面(AS1)與另一方之面(AS2)之至少一方,將黏貼複數被黏接體(CP)或被分割成複數的被黏接體(CP)之黏接片(AS)的端部以保持構件(22)予以保持之複數保持手段(20),與使保持黏接片(AS)的端部之保持手段(20)相對移動、對黏接片(AS)賦予張力而將被黏接體(CP)的相互間隔擴大之離間手段(30);黏接片(AS),係藉由被賦予指定的能量(UV)使其黏接力降低,具備對黏接片(AS)賦予指定的能量(UV)之賦予能量手段(50);保持構件(22),係作成由抵接在黏接片(AS)之一方之面(AS1)側之一方側保持構件(22A)、及抵接在黏接片(AS)之另一方之面(AS2)側之另一方側保持構件(22B)挾入並保持黏接片(AS)的端部之構成;賦予能量手段(50),係在以保持構件(22)挾入之前,對以一方側保持構件(22A)及另一方側保持構件(22B)挾入之黏接片(AS)的被保持領域賦予指定的能量(UV)。An object of the present invention is to provide a separation device and a separation method that can prevent the held area of the adhesive sheet held by the holding member from being adhered to the holding member. The solution of the present invention is a separation device, which is characterized by having: on at least one of one side (AS1) and the other side (AS2), a plurality of adherends (CP) or divided into a plurality of A plurality of holding means (20) for holding the end of the adhesive sheet (AS) of the body to be adhered (CP) by the holding member (22), and holding means (20) for holding the end of the adhesive sheet (AS) ) relative movement, imparting tension to the adhesive sheet (AS) to expand the mutual interval of the adhered body (CP) (30); the adhesive sheet (AS) is provided with a specified energy (UV ) to reduce its adhesive force, and is provided with energy imparting means (50) for imparting a predetermined energy (UV) to the adhesive sheet (AS); the holding member (22) is formed by abutting on one side of the adhesive sheet (AS). One side holding member (22A) on the side of the surface (AS1) and the other side holding member (22B) on the side of the other surface (AS2) of the adhesive sheet (AS) sandwich and hold the adhesive sheet The structure of the end portion of (AS); the energy imparting means (50) is used to adhere to the one side holding member (22A) and the other side holding member (22B) before being held by the holding member (22). The retained area of the tab (AS) imparts a specified energy (UV).
Description
本發明係有關離間裝置及離間方法。The present invention relates to a separation device and a separation method.
從前,已知將黏貼在黏接片的複數被黏接體的相互間隔擴大之離間裝置(例如,參照專利文獻1)。 [先前技術文獻] [專利文獻]Conventionally, there has been known a separation device that widens the mutual interval of a plurality of adherends pasted on an adhesive sheet (for example, refer to Patent Document 1). [Prior Art Literature] [Patent Literature]
[專利文獻1]日本特開2016-127124號公報[Patent Document 1] Japanese Patent Laid-Open No. 2016-127124
[發明所欲解決之課題][The problem to be solved by the invention]
然而,在如專利文獻1記載之類的從前的離間裝置,係以下支撐構件22(保持構件)與上支撐構件24(保持構件)保持黏接片AS(黏接片),對該黏接片賦予張力而將晶片CP(被黏接體)之相互間隔擴大之構成,因而,以保持構件保持之黏接片的黏接面黏接在該保持構件,招來不易自保持構件拆卸黏接片之不便、或必需供拆掉附著在保持構件的接著劑用之作業之不便。However, in the conventional separation device as described in Patent Document 1, an adhesive sheet AS (adhesive sheet) is held by a lower support member 22 (holding member) and an upper support member 24 (holding member), and the adhesive sheet The structure of applying tension to expand the mutual interval of the wafers CP (adhered bodies), therefore, the adhesive surface of the adhesive sheet held by the holding member is adhered to the holding member, and it is difficult to remove the adhesive sheet from the holding member. Inconvenience, or inconvenience of having to remove the adhesive attached to the holding member.
本發明之目的係提供一種可以防止以保持構件保持之黏接片的被保持領域黏接在該保持構件之離間裝置及離間方法。 [供解決課題之手段]An object of the present invention is to provide a separation device and a separation method that can prevent the holding area of the adhesive sheet held by the holding member from being adhered to the holding member. [Means for solving problems]
本發明係採用申請專利範圍所記載之構成。 [發明之效果]The present invention adopts the constitution described in the scope of the patent application. [Effect of invention]
根據本發明,因為在以保持構件挾入之前,賦予能量手段會對黏接片的被保持領域賦予指定的能量,所以,對於藉由被賦予指定的能量使其黏接力降低之黏接片,可以防止以保持構件保持之黏接片的被保持領域黏接在該保持構件。 此外,賦予能量手段,如具備第1賦予能量手段與第2賦予能量手段,則可以藉第2賦予能量手段重點地降低黏接片的被保持領域的黏接力,可以更確實地防止被保持領域黏接在保持構件。According to the present invention, the energy imparting means imparts predetermined energy to the area to be held of the adhesive sheet before being held by the holding member, so that the adhesive sheet whose adhesive force is reduced by the application of the predetermined energy, The held area of the adhesive sheet held by the holding member can be prevented from sticking to the holding member. In addition, if the energy imparting means is provided with the first energy imparting means and the second energy imparting means, the second energy imparting means can focus on reducing the adhesive force of the held area of the adhesive sheet, and can prevent the held area more reliably. Adhesive to the holding member.
以下,根據圖式說明本發明之實施形態。 又,本實施形態之X軸、Y軸、Z軸係具有每個都正交的關係,X軸及Y軸係設為指定平面內之軸,Z軸則設為正交於前述指定平面之軸。再者,於本實施形態,係以從與Y軸平行的箭頭BD方向來看之場合作為基準,未舉出基準的圖而顯示方向之場合,設定「上」為Z軸的箭頭方向而「下」為其逆方向,「左」為X軸的箭頭方向而「右」為其逆方向,「前」為Y軸的箭頭方向而「後」為其逆方向。Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, the X-axis, Y-axis, and Z-axis of the present embodiment have a relationship of being orthogonal to each other, and the X-axis and Y-axis are set as the axes in the designated plane, and the Z-axis is set as the axis orthogonal to the above-mentioned designated plane. axis. Furthermore, in the present embodiment, the case where viewed from the direction of the arrow BD parallel to the Y-axis is taken as the reference, and when the direction is displayed without citing the reference, "up" is set as the direction of the arrow on the Z-axis and "up" Down is the opposite direction, "Left" is the arrow direction of the X axis and "Right" is the opposite direction, "Front" is the arrow direction of the Y axis and "Back" is the opposite direction.
本發明之離間裝置10,係具備:在一方之面AS1將被黏貼複數被黏接體CP之黏接片AS的端部以保持構件22保持之複數保持手段20,使保持黏接片AS的端部之保持手段20相對移動、對黏接片AS賦予張力使被黏接體CP的相互間隔擴大之離間手段30,可以檢知被黏接體CP的相互間隔或各被黏接體CP的全體的集合形狀等之攝影機或投影機等攝影手段、光學感測器或音波感測器等各種感測器等之檢知手段40,與對黏接片AS賦予作為指定的能量之紫外線UV之賦予能量手段50。 又,黏接片AS,係採用層積藉由對基材片之一方之面賦予紫外線UV,而使其黏接力降低之接著劑層。The
保持手段20,係具備作為驅動機器之回動馬達21、與保持黏接片AS之保持構件22。 保持構件22,係作成以抵接在黏接片AS之一方之面AS1側之一方側保持構件22A,及被支撐在離間手段30、抵接在黏接片AS之另一方之面AS2之另一方側保持構件22B挾入並保持黏接片AS的端部之構成。 又,一方側保持構件22A,被支撐在另一方側保持構件22B上所支撐之回動馬達21的輸出軸21A。The holding means 20 includes a reversing
離間手段30,係具備作為驅動機器之線性馬達31,與被支撐在其滑件31A、於上面側支撐另一方側保持構件22B之保持臂32。The separation means 30 includes a
賦予能量手段50係具備:對黏接片AS之被黏貼複數被黏接體CP之被黏接體黏接領域CE賦予紫外線UV之第1賦予能量手段51,與對以保持構件22保持之黏接片AS的被保持領域HE賦予紫外線UV之第2賦予能量手段52。 第1賦予能量手段51,係具備位置於被保持在保持手段20的黏接片AS下方之被黏接體黏接領域用紫外線發光源51A。 第2賦予能量手段52,係具備被支撐在保持臂32上之支架52A,與被支撐在支架52A、位置於被保持在保持手段20的黏接片AS的端部上方之被保持領域用紫外線發光源52B。The energy imparting means 50 is provided with: a first energy imparting means 51 for imparting ultraviolet UV to the adhesive sheet AS to the adherends of the plurality of adherends CP, the adherends, the adhesive field CE, and the adhesive to hold the
說明上述之離間裝置10的動作。 首先,對於各構件於圖1(A)、(B)中實線所示的初期位置待機之離間裝置10,該離間裝置10之使用者(以下,簡稱「使用者」)透過操作面板或個人電腦等未圖示的操作手段而將自動運轉開始之訊號輸入。之後,在作業者、或者驅動機器或輸送帶等未圖示之搬送手段將被黏貼複數被黏接體CP之黏接片AS載置於另一方側保持構件22B上時,在以保持構件22挾入之前,賦予能量手段50對以一方側保持構件22A及另一方側保持構件22B挾入之黏接片AS的被保持領域HE賦予紫外線UV。亦即,在黏接片AS被載置於另一方側保持構件22B上時,賦予能量手段50則驅動被保持領域用紫外線發光源52B,如圖1(B)所示,對被保持領域HE賦予紫外線UV而使該被保持領域HE的黏接力降低。The operation of the above-mentioned
其次,保持手段20驅動各回動馬達21,如圖2(A)所示,以一方側保持構件22A與另一方側保持構件22B保持黏接片AS的端部之後,離間手段30驅動各線性馬達31,使保持手段20相互離間,對黏接片AS賦予張力並將被黏接體CP的相互間隔擴大。此時,各被黏接體CP,有因黏接片AS的變形等,而使相互間隔未擴大到指定的間隔之情形。於是,以檢知手段40之檢知結果為基礎,離間手段30驅動各線性馬達31,以各被黏接體CP的相互間隔成為指定間隔之方式,使各保持手段20個別地移動。Next, the holding means 20 drives each reversing
之後,賦予能量手段50驅動被黏接體黏接領域用紫外線發光源51A,如圖2(B)所示,對被黏接體黏接領域CE賦予紫外線UV而使黏接片AS對被黏接體CP的黏接力降低。其次,利用拾取裝置或搬送裝置等未圖示之被黏接體取出手段,將所有的被黏接體CP或者指定量的被黏接體CP從黏接片AS拆卸時,離間手段30驅動各線性馬達31,使各個滑件31A復歸到初期位置後,保持手段20驅動回動馬達21,使一方側保持構件22A復歸到初期位置。之後,作業者、或者未圖示的搬送手段,將殘留在另一方側保持構件22B上的黏接片AS摘除,以下反覆上述同樣的動作。After that, the energy imparting means 50 drives the ultraviolet
根據以上之類的離間裝置10,因為在以保持構件22挾入之前,賦予能量手段50會對黏接片AS的被保持領域HE賦予紫外線UV,所以,對於藉由被賦予紫外線UV使其黏接力降低之黏接片AS,可以防止以保持構件22保持之黏接片AS的被保持領域HE黏接在該保持構件22。According to the
本發明之手段及程序,只要可以實現針對該等手段及程序說明之動作、功能或程序則並未限定,更不以前述實施形態所示之單一實施形態的構成物或程序為任何限定。例如,賦予能量手段,只要可以對黏接片賦予指定的能量,對照於申請案當初的技術常識、在其技術範圍內者則並未限定(其他的手段及程序亦同)。The means and programs of the present invention are not limited as long as they can realize the actions, functions, or programs described with respect to the means and programs, and are not limited to the components or programs of a single embodiment shown in the foregoing embodiments. For example, the energy imparting means is not limited as long as the specified energy can be imparted to the adhesive sheet, compared with the technical common sense at the beginning of the application and within the technical scope (the same applies to other means and procedures).
本發明之離間裝置,也可以如圖3(A)所示,作成具備:保持手段20,於黏接片AS之比起被黏接體黏接領域CE更加外側之、被保持領域HE的內側抵接在該黏接片AS之抵接手段60,使保持黏接片AS的端部之保持手段20及抵接手段60相對移動、對黏接片AS賦予張力並使被黏接體CP的相互間隔擴大之離間手段30A,檢知手段40,與賦予能量手段50之離間裝置10A。 又,在離間裝置10A,以與離間裝置10同等的構成具有同等的功能者,附上與該離間裝置10相同圖號並省略其構成說明、簡略化動作說明。As shown in FIG. 3(A), the separating device of the present invention may be provided with: the holding means 20 on the inner side of the held area HE, which is more outside the adhesive sheet AS than the to-be-adhered body adhesion area CE The abutting means 60 abutting on the adhesive sheet AS, the
抵接手段60,係具備被支撐在底板BP上之圓筒狀抵接構件61,在抵接構件61內部的底板BP上支撐著被黏接體黏接領域用紫外線發光源51A。 離間手段30A,係具備被支撐在底板BP上之作為驅動機器之直動馬達33,與被支撐在其輸出軸33A、於上面側支撐另一方側保持構件22B及支架52A之保持臂34。The contact means 60 includes a
此類之離間裝置10A,係與離間裝置10同樣作法並在被黏貼複數被黏接體CP的黏接片AS被載置於另一方側保持構件22B上時,賦予能量手段50則驅動被保持領域用紫外線發光源52B,如圖3(A)所示,對被保持領域HE賦予紫外線UV而使被保持領域HE的黏接力降低。於是,保持手段20驅動回動馬達21,如圖3(B)所示,以一方側保持構件22A與另一方側保持構件22B保持黏接片AS的端部之後,離間手段30A驅動直動馬達33,使保持手段20下降並使保持手段20及抵接手段60相對移動,對黏接片賦予張力並將被黏接體CP的相互間隔擴大。其後,與離間裝置10同樣作法,賦予能量手段50驅動被黏接體黏接領域用紫外線發光源51A,使黏接片AS對被黏接體CP的黏接力降低之後,未圖示的被黏接體取出手段將各被黏接體CP搬送至別的程序。於是,在利用未圖示的被黏接體取出手段,而將被黏接體CP從黏接片AS拆卸時,各手段則驅動各個驅動機器,使各構件復歸到初期位置後,將殘留在另一方側保持構件22B上的黏接片AS拆卸,以下反覆進行上述同樣的動作。This type of
即使利用此類之離間裝置10A,也能得到與離間裝置10同樣的效果。Even with such a
保持手段20,可以是在另一方之面AS2、或一方之面AS1及另一方之面AS2雙方之面保持被黏貼複數被黏接體CP之黏接片AS的端部之構成,抑或以機械式夾頭或夾持筒等抓持手段、庫侖力、接著劑、黏著劑、磁力、白努利(Bernoulli)吸附、驅動機器等保持黏接片AS的端部之構成。 保持手段20,離間裝置10之場合,例如,可以形成以往右方移動的該保持手段20作成1體、往左方移動的該保持手段20作成1體之2體之構成,例如,抑或以形成往右方、左方及其他方向移動的3體以上之構成。 保持手段20,離間裝置10A之場合,可以是1體或2體以上。The holding means 20 may be configured to hold the ends of the adhesive sheets AS to which the plurality of adherends CP are adhered on the other side AS2, or the sides of the one side AS1 and the other side AS2, or mechanically. The structure of holding the end of the adhesive sheet AS by means of gripping means such as a chuck or a holding cylinder, Coulomb force, adhesive, adhesive, magnetic force, Bernoulli adsorption, driving machine, etc. In the case of the holding means 20 and the
離間手段30、30A並非複數而是單數亦可,該場合,例如,離間裝置10,係作成以1體的線性馬達的2個滑件,分別1體一體支撐保持手段20,將被黏接體CP的相互間隔擴大之構成,抑或將被黏接體CP的相互間隔僅於1軸方向(例如,X軸方向或Y軸方向等)擴大之構成。 離間手段30,可以是將相互間隔朝3軸以上的方向(例如,X軸方向、Y軸方向及其他軸方向)擴大之構成,例如,作成使朝X軸方向移動之複數保持手段20分別朝Y軸方向移動之構成(使朝Y軸方向移動之複數保持手段20分別朝X軸方向移動之構成),可以將被黏接體CP的相互間隔擴大,抑或無法動作使被黏接體CP的相互間隔成為指定間隔之構成。 離間手段30A,亦可藉由停止或移動保持手段20、且移動抵接手段60,而使保持手段20及抵接手段60相對移動,對黏接片AS賦予張力而將被黏接體CP的相互間隔擴大。 離間手段30、30A,亦可作業者操作按鈕或桿等,來驅動線性馬達31、直動馬達33,該場合,例如,構成將依照檢知手段40的檢知結果顯示於監視器或檢出器等顯示器,亦可以根據該顯示器所顯示之檢知結果使被黏接體CP的相互間隔成為指定間隔之方式,或者,以各被黏接體CP全體的集合形狀相對於基礎全體的集合形狀成為相似關係之方式,使作業者驅動線性馬達31、直動馬達33。The separation means 30 and 30A are not plural but may be singular. In this case, for example, the
檢知手段40,也可以是作業者的目視,例如,可以構成作業者利用目視,操作按鈕或桿等使被黏接體CP的相互間隔成為指定間隔,或者,使各被黏接體CP全體的集合形狀相對於基礎全體的集合形狀成為相似關係,並驅動線性馬達31、直動馬達33,抑或不在本發明之離間裝置10、10A所具備。The detection means 40 may be the visual inspection of the operator. For example, the operator may operate a button, a lever, or the like to set the mutual interval between the adherends CP to a predetermined interval, or make each adherend CP as a whole. The aggregate shape of the base unit is in a similar relationship with the aggregate shape of the entire base, and drives the
賦予能量手段50,作為第1賦予能量手段51,而採用對黏接片AS之一方之面AS1側及另一方之面AS2側之至少一方賦予紫外線UV之構成,亦可以此類之構成之第1賦予能量手段51也對被保持領域HE賦予紫外線UV而使黏接片AS對一方側保持構件22A或另一方側保持構件22B之黏接力降低,抑或不具有第1賦予能量手段51。 賦予能量手段50,作為第2賦予能量手段52,而採用對黏接片AS之一方之面AS1側及另一方之面AS2側之至少一方賦予紫外線UV之構成,亦可以此類之構成之第2賦予能量手段52對被保持領域HE賦予紫外線UV而使黏接片AS對一方側保持構件22A或另一方側保持構件22B之黏接力降低。又,於前述實施形態所示之離間裝置10、10A,賦予能量手段50從另一方側保持構件22B側對黏接片AS的被保持領域HE賦予紫外線UV之場合,以紫外線可透過之構件構成該另一方側保持構件22B或保持臂34等即可。 賦予能量手段50,可以是以所有波長的電磁波(例如X光或紅外線等)作為能量賦予黏接片AS,抑或以被加熱或冷卻的氣體或液體等流體等作為能量賦予黏接片AS,因應黏接片AS之構成而任何可以使該黏接片AS的黏接力降低之能量皆可,可以是對黏接片AS全體或部分地賦予能量之構成,而作為被黏接體黏接領域用紫外線發光源51A或被保持領域用紫外線發光源52B,也可以採用任何LED(Light Emitting Diode、發光二極體)、高壓水銀燈、低壓水銀燈、金屬鹵化物燈、氙氣燈、鹵素燈等,抑或採用斟酌組合該等之光源。 第1賦予能量手段51,於並未將被黏接體CP的相互間隔擴大之狀態下對黏接片AS照射紫外線UV亦可。The energy imparting means 50, as the first energy imparting means 51, employs a configuration in which ultraviolet rays UV are applied to at least one of the one surface AS1 side and the other surface AS2 side of the adhesive sheet AS, and the first configuration of such a configuration is also possible. The energy imparting means 51 also imparts ultraviolet rays UV to the held area HE to reduce the adhesive force of the adhesive sheet AS to the one
抵接手段60,除了角筒狀或橢圓筒狀等,亦可採用圓柱、角柱、橢圓柱等其他形狀之抵接構件61。The abutting means 60 can be formed of abutting
本發明之黏接片AS及被黏接體CP之材質、種類別、形狀等並未特別限定。例如,黏接片AS,只要是藉由被賦予能量而使其黏接力降低則並無任何限定,感壓黏接性、感熱黏接性等之黏接形態者亦可。再者,黏接片AS或被黏接體CP,例如,可以是圓形、橢圓形、三角形或四角形等多角形,其他形狀亦可。此外,黏接片AS,例如,可以是只有接著劑層的單層者、在基材與接著劑層之間具有中間層者、在基材的上面具有蓋層等3層以上者,進而,可以將基材從接著劑層剝離之所謂雙面黏接片之類者亦可,這樣的雙面黏接片,可以是具有單層或複層的中間層者、或沒有中間層之單層或複層者。此外,作為被黏接體CP,例如,可以是食品、樹脂容器、矽半導體晶圓或化合物半導體晶圓等之半導體晶圓,半導體晶片、電路基板、光碟等資訊記錄基板、玻璃板、鋼板、陶器、木板或樹脂等單體物,抑或該等2個以上所形成之複合物,能以任意形態的構件或物品等作為對象。又,黏接片AS,也可以換成功能性的、用途性的讀法,例如,資訊記載用標籤、裝飾用標籤、保護片、切割膠帶、裸晶貼膜、晶粒黏著膠帶、記錄層形成樹脂片等任意片、薄膜、膠帶等。 被黏接體CP,可以是預先在黏接片AS上複數存在者,抑或於利用離間手段30、30A、其他機構或人手等賦予外力之時點而被分割成複數,在黏接片AS上複數存在之類的被分割而成為複數者。作為此類之被分割而成為複數之被黏接體CP,例如,對半導體晶圓或基板等照射雷射,先在該半導體晶圓或基板等形成線狀或格子狀等脆弱的脆弱層,或在對黏接片AS賦予張力、或在對半導體晶圓或基板等直接或間接地賦予外力之時點而個片化,成為複數被黏接體CP者,或例如,以切割刃切入樹脂或玻璃板等,先在該樹脂或玻璃板等形成沒有貫通於線狀或格子狀等的表背之切入或排孔等之切斷預定線,或在對黏接片AS賦予張力、或在對樹脂或玻璃板等直接或間接地賦予外力之時點加以個片化,形成複數被黏接體CP等,並無任何限定。The material, type, shape, etc. of the adhesive sheet AS and the adherend CP of the present invention are not particularly limited. For example, the adhesive sheet AS is not limited at all as long as the adhesive force is reduced by being energized, and it may be in an adhesive form such as pressure-sensitive adhesiveness and heat-sensitive adhesiveness. Furthermore, the adhesive sheet AS or the adherend CP may be, for example, a polygonal shape such as a circle, an ellipse, a triangle, or a quadrangle, and other shapes are also possible. In addition, the adhesive sheet AS may be, for example, a single layer of only the adhesive layer, one having an intermediate layer between the substrate and the adhesive layer, and one having three or more layers such as a cap layer on the upper surface of the substrate, and further, A so-called double-sided adhesive sheet that can peel the substrate from the adhesive layer is also acceptable. Such a double-sided adhesive sheet can be a single-layer or multi-layer intermediate layer, or a single layer without an intermediate layer. or stratified. In addition, as the adherend CP, for example, a food, a resin container, a semiconductor wafer such as a silicon semiconductor wafer or a compound semiconductor wafer, an information recording substrate such as a semiconductor chip, a circuit board, an optical disc, a glass plate, a steel plate, A single substance such as pottery, wood, or resin, or a composite of two or more of these can be used as a target for members or articles of any form. In addition, the adhesive sheet AS can also be replaced with functional and useful readings, such as labels for information recording, labels for decoration, protective sheets, dicing tapes, bare die stickers, die attach tapes, and recording layer formation. Resin sheets and other arbitrary sheets, films, tapes, etc. The to-be-adhered body CP may exist in plural on the adhesive sheet AS in advance, or may be divided into plural numbers when an external force is applied by the separating means 30, 30A, other mechanisms, or human hands, and the plural numbers may be present on the adhesive sheet AS. Beings and the like are divided into plurals. As such a plurality of bonded bodies CP divided into a plurality, for example, a semiconductor wafer or a substrate is irradiated with a laser, and a fragile fragile layer such as a line or a lattice is first formed on the semiconductor wafer or substrate. Or when tension is applied to the adhesive sheet AS, or when an external force is directly or indirectly applied to a semiconductor wafer or substrate, it is individualized to become a plurality of adherends CP, or, for example, a cutting edge is used to cut into the resin or Glass plates, etc., are first formed in the resin or glass plate, etc., without cutting lines or rows of holes penetrating through the front and back of the line or lattice shape, etc., or before applying tension to the adhesive sheet AS, or in the There is no limitation on the timing of applying external force directly or indirectly to resins, glass plates, etc., into individual pieces to form a plurality of adherends CP and the like.
前述實施形態之驅動機器,可以採用回動馬達、直動馬達、線性馬達、單軸機器手臂、多關節機器手臂等之電動機器、空氣壓缸、油壓缸、無桿汽缸及回轉式汽缸等致動器等之外,也可以採用直接或間接地組合該等之驅動機器。The driving machine of the above-mentioned embodiment can use electric machines such as rotary motors, direct motion motors, linear motors, single-axis robot arms, multi-joint robot arms, etc., air cylinders, hydraulic cylinders, rodless cylinders, and rotary cylinders, etc. In addition to actuators and the like, it is also possible to use a drive machine that directly or indirectly combines these.
10、10A‧‧‧離間裝置20‧‧‧保持手段22‧‧‧保持構件22A‧‧‧一方側保持構件22B‧‧‧另一方側保持構件30、30A‧‧‧離間手段50‧‧‧賦予能量手段51‧‧‧第1賦予能量手段52‧‧‧第2賦予能量手段60‧‧‧抵接手段AS‧‧‧黏接片AS1‧‧‧一方之面AS2‧‧‧另一方之面CE‧‧‧被黏接體黏接領域CP‧‧‧被黏接體HE‧‧‧被保持領域UV‧‧‧紫外線(指定之能量)10. 10A‧‧‧
圖1(A)係關於本發明之實施形態之離間裝置之平面圖。(B)係圖1(A)之側面圖。 圖2(A)、(B)係關於本發明之實施形態之離間裝置之動作說明圖。 圖3(A)、(B)係本發明之其他例之說明圖。Fig. 1(A) is a plan view of a separation device according to an embodiment of the present invention. (B) is a side view of FIG. 1(A). 2(A) and (B) are diagrams for explaining the operation of the separating device according to the embodiment of the present invention. 3(A) and (B) are explanatory diagrams of other examples of the present invention.
10‧‧‧離間裝置 10‧‧‧Separation device
20‧‧‧保持手段 20‧‧‧Maintaining Means
21‧‧‧回動馬達 21‧‧‧Reversing motor
21A‧‧‧輸出軸 21A‧‧‧Output shaft
22‧‧‧保持構件 22‧‧‧Maintaining member
22A‧‧‧一方側保持構件 22A‧‧‧One side holding member
22B‧‧‧另一方側保持構件 22B‧‧‧The other side holding member
30‧‧‧離間手段 30‧‧‧ Means of alienation
31‧‧‧驅動線性馬達 31‧‧‧Drive Linear Motor
31A‧‧‧滑件 31A‧‧‧Slide
32‧‧‧保持臂 32‧‧‧Retaining Arm
40‧‧‧檢知手段 40‧‧‧Detection methods
50‧‧‧賦予能量手段 50‧‧‧Empowering Means
51‧‧‧第1賦予能量手段 51‧‧‧The first means of empowering energy
51A‧‧‧紫外線發光源 51A‧‧‧UV light source
52‧‧‧第2賦予能量手段 52‧‧‧Second Energy Empowerment Means
52A‧‧‧支架 52A‧‧‧Bracket
52B‧‧‧被保持領域用紫外線發光源 52B‧‧‧UV light source for protected areas
AS‧‧‧黏接片 AS‧‧‧adhesive sheet
AS1‧‧‧一方之面 AS1‧‧‧One Side
AS2‧‧‧另一方之面 AS2‧‧‧The other side
BD‧‧‧箭頭 BD‧‧‧arrow
CE‧‧‧被黏接體黏接領域 CE‧‧‧Adhering body bonding field
CP‧‧‧被黏接體 CP‧‧‧adhered body
HE‧‧‧被保持領域 HE‧‧‧Retained area
UV‧‧‧紫外線(指定之能量) UV‧‧‧UV (specified energy)
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CN108878281B (en) | 2023-12-08 |
KR102408527B1 (en) | 2022-06-13 |
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