TWI755490B - Separation device and separation method - Google Patents

Separation device and separation method Download PDF

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TWI755490B
TWI755490B TW107106777A TW107106777A TWI755490B TW I755490 B TWI755490 B TW I755490B TW 107106777 A TW107106777 A TW 107106777A TW 107106777 A TW107106777 A TW 107106777A TW I755490 B TWI755490 B TW I755490B
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adhesive sheet
holding member
holding
held
energy
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TW107106777A
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TW201901769A (en
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杉下芳昭
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日商琳得科股份有限公司
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67132Apparatus for placing on an insulating substrate, e.g. tape
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304Mechanical treatment, e.g. grinding, polishing, cutting
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/185Joining of semiconductor bodies for junction formation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67092Apparatus for mechanical treatment

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
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Abstract

本發明之課題係提供一種可以防止以保持構件保持之黏接片的被保持領域黏接在該保持構件之離間裝置及離間方法。   本發明之解決手段為一種離間裝置,其特徵係具備:在一方之面(AS1)與另一方之面(AS2)之至少一方,將黏貼複數被黏接體(CP)或被分割成複數的被黏接體(CP)之黏接片(AS)的端部以保持構件(22)予以保持之複數保持手段(20),與使保持黏接片(AS)的端部之保持手段(20)相對移動、對黏接片(AS)賦予張力而將被黏接體(CP)的相互間隔擴大之離間手段(30);黏接片(AS),係藉由被賦予指定的能量(UV)使其黏接力降低,具備對黏接片(AS)賦予指定的能量(UV)之賦予能量手段(50);保持構件(22),係作成由抵接在黏接片(AS)之一方之面(AS1)側之一方側保持構件(22A)、及抵接在黏接片(AS)之另一方之面(AS2)側之另一方側保持構件(22B)挾入並保持黏接片(AS)的端部之構成;賦予能量手段(50),係在以保持構件(22)挾入之前,對以一方側保持構件(22A)及另一方側保持構件(22B)挾入之黏接片(AS)的被保持領域賦予指定的能量(UV)。An object of the present invention is to provide a separation device and a separation method that can prevent the held area of the adhesive sheet held by the holding member from being adhered to the holding member. The solution of the present invention is a separation device, which is characterized by having: on at least one of one side (AS1) and the other side (AS2), a plurality of adherends (CP) or divided into a plurality of A plurality of holding means (20) for holding the end of the adhesive sheet (AS) of the body to be adhered (CP) by the holding member (22), and holding means (20) for holding the end of the adhesive sheet (AS) ) relative movement, imparting tension to the adhesive sheet (AS) to expand the mutual interval of the adhered body (CP) (30); the adhesive sheet (AS) is provided with a specified energy (UV ) to reduce its adhesive force, and is provided with energy imparting means (50) for imparting a predetermined energy (UV) to the adhesive sheet (AS); the holding member (22) is formed by abutting on one side of the adhesive sheet (AS). One side holding member (22A) on the side of the surface (AS1) and the other side holding member (22B) on the side of the other surface (AS2) of the adhesive sheet (AS) sandwich and hold the adhesive sheet The structure of the end portion of (AS); the energy imparting means (50) is used to adhere to the one side holding member (22A) and the other side holding member (22B) before being held by the holding member (22). The retained area of the tab (AS) imparts a specified energy (UV).

Description

離間裝置及離間方法Separation device and separation method

本發明係有關離間裝置及離間方法。The present invention relates to a separation device and a separation method.

從前,已知將黏貼在黏接片的複數被黏接體的相互間隔擴大之離間裝置(例如,參照專利文獻1)。 [先前技術文獻] [專利文獻]Conventionally, there has been known a separation device that widens the mutual interval of a plurality of adherends pasted on an adhesive sheet (for example, refer to Patent Document 1). [Prior Art Literature] [Patent Literature]

[專利文獻1]日本特開2016-127124號公報[Patent Document 1] Japanese Patent Laid-Open No. 2016-127124

[發明所欲解決之課題][The problem to be solved by the invention]

然而,在如專利文獻1記載之類的從前的離間裝置,係以下支撐構件22(保持構件)與上支撐構件24(保持構件)保持黏接片AS(黏接片),對該黏接片賦予張力而將晶片CP(被黏接體)之相互間隔擴大之構成,因而,以保持構件保持之黏接片的黏接面黏接在該保持構件,招來不易自保持構件拆卸黏接片之不便、或必需供拆掉附著在保持構件的接著劑用之作業之不便。However, in the conventional separation device as described in Patent Document 1, an adhesive sheet AS (adhesive sheet) is held by a lower support member 22 (holding member) and an upper support member 24 (holding member), and the adhesive sheet The structure of applying tension to expand the mutual interval of the wafers CP (adhered bodies), therefore, the adhesive surface of the adhesive sheet held by the holding member is adhered to the holding member, and it is difficult to remove the adhesive sheet from the holding member. Inconvenience, or inconvenience of having to remove the adhesive attached to the holding member.

本發明之目的係提供一種可以防止以保持構件保持之黏接片的被保持領域黏接在該保持構件之離間裝置及離間方法。 [供解決課題之手段]An object of the present invention is to provide a separation device and a separation method that can prevent the holding area of the adhesive sheet held by the holding member from being adhered to the holding member. [Means for solving problems]

本發明係採用申請專利範圍所記載之構成。 [發明之效果]The present invention adopts the constitution described in the scope of the patent application. [Effect of invention]

根據本發明,因為在以保持構件挾入之前,賦予能量手段會對黏接片的被保持領域賦予指定的能量,所以,對於藉由被賦予指定的能量使其黏接力降低之黏接片,可以防止以保持構件保持之黏接片的被保持領域黏接在該保持構件。   此外,賦予能量手段,如具備第1賦予能量手段與第2賦予能量手段,則可以藉第2賦予能量手段重點地降低黏接片的被保持領域的黏接力,可以更確實地防止被保持領域黏接在保持構件。According to the present invention, the energy imparting means imparts predetermined energy to the area to be held of the adhesive sheet before being held by the holding member, so that the adhesive sheet whose adhesive force is reduced by the application of the predetermined energy, The held area of the adhesive sheet held by the holding member can be prevented from sticking to the holding member. In addition, if the energy imparting means is provided with the first energy imparting means and the second energy imparting means, the second energy imparting means can focus on reducing the adhesive force of the held area of the adhesive sheet, and can prevent the held area more reliably. Adhesive to the holding member.

以下,根據圖式說明本發明之實施形態。   又,本實施形態之X軸、Y軸、Z軸係具有每個都正交的關係,X軸及Y軸係設為指定平面內之軸,Z軸則設為正交於前述指定平面之軸。再者,於本實施形態,係以從與Y軸平行的箭頭BD方向來看之場合作為基準,未舉出基準的圖而顯示方向之場合,設定「上」為Z軸的箭頭方向而「下」為其逆方向,「左」為X軸的箭頭方向而「右」為其逆方向,「前」為Y軸的箭頭方向而「後」為其逆方向。Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, the X-axis, Y-axis, and Z-axis of the present embodiment have a relationship of being orthogonal to each other, and the X-axis and Y-axis are set as the axes in the designated plane, and the Z-axis is set as the axis orthogonal to the above-mentioned designated plane. axis. Furthermore, in the present embodiment, the case where viewed from the direction of the arrow BD parallel to the Y-axis is taken as the reference, and when the direction is displayed without citing the reference, "up" is set as the direction of the arrow on the Z-axis and "up" Down is the opposite direction, "Left" is the arrow direction of the X axis and "Right" is the opposite direction, "Front" is the arrow direction of the Y axis and "Back" is the opposite direction.

本發明之離間裝置10,係具備:在一方之面AS1將被黏貼複數被黏接體CP之黏接片AS的端部以保持構件22保持之複數保持手段20,使保持黏接片AS的端部之保持手段20相對移動、對黏接片AS賦予張力使被黏接體CP的相互間隔擴大之離間手段30,可以檢知被黏接體CP的相互間隔或各被黏接體CP的全體的集合形狀等之攝影機或投影機等攝影手段、光學感測器或音波感測器等各種感測器等之檢知手段40,與對黏接片AS賦予作為指定的能量之紫外線UV之賦予能量手段50。   又,黏接片AS,係採用層積藉由對基材片之一方之面賦予紫外線UV,而使其黏接力降低之接著劑層。The separation device 10 of the present invention is provided with a plurality of holding means 20 for holding the ends of the adhesive sheets AS to which the plurality of adherends CP are adhered by the holding member 22 on the one hand AS1, so that the ends of the adhesive sheets AS are held by the holding members 22. The holding means 20 at the ends move relatively, and the separation means 30 that apply tension to the adhesive sheet AS to widen the mutual interval of the adherends CP can detect the mutual interval of the adherends CP or the distance between the adherends CP. Photographic means 40 such as a camera or a projector such as an overall collective shape, detection means 40 such as various sensors such as an optical sensor or a sonic sensor, and ultraviolet rays UV that impart predetermined energy to the adhesive sheet AS. Grants 50 energy means. In addition, the adhesive sheet AS is an adhesive layer in which the adhesive force is reduced by applying ultraviolet UV to one surface of the base sheet.

保持手段20,係具備作為驅動機器之回動馬達21、與保持黏接片AS之保持構件22。   保持構件22,係作成以抵接在黏接片AS之一方之面AS1側之一方側保持構件22A,及被支撐在離間手段30、抵接在黏接片AS之另一方之面AS2之另一方側保持構件22B挾入並保持黏接片AS的端部之構成。   又,一方側保持構件22A,被支撐在另一方側保持構件22B上所支撐之回動馬達21的輸出軸21A。The holding means 20 includes a reversing motor 21 as a driving device, and a holding member 22 for holding the adhesive sheet AS. The holding member 22 is formed to be in contact with one side holding member 22A on the side of one surface AS1 of the adhesive sheet AS, and the other is supported by the separation means 30 and abuts against the other surface AS2 of the adhesive sheet AS. The one side holding member 22B sandwiches and holds the end portion of the adhesive sheet AS. In addition, the one side holding member 22A is supported by the output shaft 21A of the reversing motor 21 supported by the other side holding member 22B.

離間手段30,係具備作為驅動機器之線性馬達31,與被支撐在其滑件31A、於上面側支撐另一方側保持構件22B之保持臂32。The separation means 30 includes a linear motor 31 as a driving device, and a holding arm 32 supported by the slider 31A and supporting the other side holding member 22B on the upper surface side.

賦予能量手段50係具備:對黏接片AS之被黏貼複數被黏接體CP之被黏接體黏接領域CE賦予紫外線UV之第1賦予能量手段51,與對以保持構件22保持之黏接片AS的被保持領域HE賦予紫外線UV之第2賦予能量手段52。   第1賦予能量手段51,係具備位置於被保持在保持手段20的黏接片AS下方之被黏接體黏接領域用紫外線發光源51A。   第2賦予能量手段52,係具備被支撐在保持臂32上之支架52A,與被支撐在支架52A、位置於被保持在保持手段20的黏接片AS的端部上方之被保持領域用紫外線發光源52B。The energy imparting means 50 is provided with: a first energy imparting means 51 for imparting ultraviolet UV to the adhesive sheet AS to the adherends of the plurality of adherends CP, the adherends, the adhesive field CE, and the adhesive to hold the holding member 22. The second energy imparting means 52 for imparting ultraviolet UV to the retained area HE of the tab AS. The first energy imparting means 51 is provided with an ultraviolet light emitting source 51A for the area to be adhered which is positioned below the adhesive sheet AS held by the holding means 20. The second energy imparting means 52 includes a holder 52A supported by the holding arm 32 , and ultraviolet rays for the held area supported by the holder 52A and positioned above the end of the adhesive sheet AS held by the holding means 20 . Light source 52B.

說明上述之離間裝置10的動作。   首先,對於各構件於圖1(A)、(B)中實線所示的初期位置待機之離間裝置10,該離間裝置10之使用者(以下,簡稱「使用者」)透過操作面板或個人電腦等未圖示的操作手段而將自動運轉開始之訊號輸入。之後,在作業者、或者驅動機器或輸送帶等未圖示之搬送手段將被黏貼複數被黏接體CP之黏接片AS載置於另一方側保持構件22B上時,在以保持構件22挾入之前,賦予能量手段50對以一方側保持構件22A及另一方側保持構件22B挾入之黏接片AS的被保持領域HE賦予紫外線UV。亦即,在黏接片AS被載置於另一方側保持構件22B上時,賦予能量手段50則驅動被保持領域用紫外線發光源52B,如圖1(B)所示,對被保持領域HE賦予紫外線UV而使該被保持領域HE的黏接力降低。The operation of the above-mentioned separation device 10 will be described. First, for the separation device 10 in which each component is in standby at the initial position indicated by the solid line in FIGS. 1(A) and (B), the user of the separation device 10 (hereinafter referred to as “user”) uses the operation panel or the personal A computer or other operating means not shown in the figure inputs a signal for the start of automatic operation. After that, when an operator or a conveying means such as a driving machine or a conveyor belt, which is not shown in the figure, places the adhesive sheets AS to which the plurality of to-be-adhered bodies CP are pasted on the other side holding member 22B, the holding member 22 Before being sandwiched, the energy imparting means 50 imparts ultraviolet rays UV to the held area HE of the adhesive sheet AS sandwiched by the one-side holding member 22A and the other-side holding member 22B. That is, when the adhesive sheet AS is placed on the other side holding member 22B, the energy imparting means 50 drives the ultraviolet light emitting source 52B for the held area, as shown in FIG. The adhesive force of the held area HE is reduced by applying ultraviolet rays.

其次,保持手段20驅動各回動馬達21,如圖2(A)所示,以一方側保持構件22A與另一方側保持構件22B保持黏接片AS的端部之後,離間手段30驅動各線性馬達31,使保持手段20相互離間,對黏接片AS賦予張力並將被黏接體CP的相互間隔擴大。此時,各被黏接體CP,有因黏接片AS的變形等,而使相互間隔未擴大到指定的間隔之情形。於是,以檢知手段40之檢知結果為基礎,離間手段30驅動各線性馬達31,以各被黏接體CP的相互間隔成為指定間隔之方式,使各保持手段20個別地移動。Next, the holding means 20 drives each reversing motor 21, and as shown in FIG. 2(A), after holding the end of the adhesive sheet AS with the one side holding member 22A and the other side holding member 22B, the separating means 30 drives each linear motor 31. The holding means 20 are separated from each other, tension is applied to the adhesive sheet AS, and the mutual interval of the adherends CP is widened. At this time, the mutual intervals between the adherends CP may not expand to a predetermined interval due to deformation of the adhesive sheet AS or the like. Then, based on the detection result of the detection means 40, the separation means 30 drives each linear motor 31, and moves each holding means 20 individually so that the mutual interval of each to-be-adhered body CP becomes a predetermined interval.

之後,賦予能量手段50驅動被黏接體黏接領域用紫外線發光源51A,如圖2(B)所示,對被黏接體黏接領域CE賦予紫外線UV而使黏接片AS對被黏接體CP的黏接力降低。其次,利用拾取裝置或搬送裝置等未圖示之被黏接體取出手段,將所有的被黏接體CP或者指定量的被黏接體CP從黏接片AS拆卸時,離間手段30驅動各線性馬達31,使各個滑件31A復歸到初期位置後,保持手段20驅動回動馬達21,使一方側保持構件22A復歸到初期位置。之後,作業者、或者未圖示的搬送手段,將殘留在另一方側保持構件22B上的黏接片AS摘除,以下反覆上述同樣的動作。After that, the energy imparting means 50 drives the ultraviolet light emitting source 51A for the bonding area of the adherend, as shown in FIG. 2(B), to apply ultraviolet UV to the bonding area CE of the adherend, so that the adhesive sheet AS will The adhesive force of the bonded CP decreases. Next, when all the to-be-adhered bodies CP or a predetermined amount of the to-be-adhered body CP are detached from the adhesive sheet AS by the unillustrated to-be-adhered body take-out means such as a pick-up device or a conveying device, the separating means 30 drives each wire After the sex motor 31 returns each slider 31A to the initial position, the holding means 20 drives the return motor 21 to return the one side holding member 22A to the initial position. After that, an operator or a conveying means not shown removes the adhesive sheet AS remaining on the other side holding member 22B, and the same operation as described above is repeated below.

根據以上之類的離間裝置10,因為在以保持構件22挾入之前,賦予能量手段50會對黏接片AS的被保持領域HE賦予紫外線UV,所以,對於藉由被賦予紫外線UV使其黏接力降低之黏接片AS,可以防止以保持構件22保持之黏接片AS的被保持領域HE黏接在該保持構件22。According to the separation device 10 as described above, the energy imparting means 50 imparts ultraviolet UV to the held area HE of the adhesive sheet AS before being held by the holding member 22 . The adhesive sheet AS with reduced contact force can prevent the holding area HE of the adhesive sheet AS held by the holding member 22 from being adhered to the holding member 22 .

本發明之手段及程序,只要可以實現針對該等手段及程序說明之動作、功能或程序則並未限定,更不以前述實施形態所示之單一實施形態的構成物或程序為任何限定。例如,賦予能量手段,只要可以對黏接片賦予指定的能量,對照於申請案當初的技術常識、在其技術範圍內者則並未限定(其他的手段及程序亦同)。The means and programs of the present invention are not limited as long as they can realize the actions, functions, or programs described with respect to the means and programs, and are not limited to the components or programs of a single embodiment shown in the foregoing embodiments. For example, the energy imparting means is not limited as long as the specified energy can be imparted to the adhesive sheet, compared with the technical common sense at the beginning of the application and within the technical scope (the same applies to other means and procedures).

本發明之離間裝置,也可以如圖3(A)所示,作成具備:保持手段20,於黏接片AS之比起被黏接體黏接領域CE更加外側之、被保持領域HE的內側抵接在該黏接片AS之抵接手段60,使保持黏接片AS的端部之保持手段20及抵接手段60相對移動、對黏接片AS賦予張力並使被黏接體CP的相互間隔擴大之離間手段30A,檢知手段40,與賦予能量手段50之離間裝置10A。   又,在離間裝置10A,以與離間裝置10同等的構成具有同等的功能者,附上與該離間裝置10相同圖號並省略其構成說明、簡略化動作說明。As shown in FIG. 3(A), the separating device of the present invention may be provided with: the holding means 20 on the inner side of the held area HE, which is more outside the adhesive sheet AS than the to-be-adhered body adhesion area CE The abutting means 60 abutting on the adhesive sheet AS, the holding means 20 and the abutting means 60 holding the end of the adhesive sheet AS are moved relative to each other, tension is applied to the adhesive sheet AS, and the adherend CP is moved. The separation means 30A, the detection means 40 , and the energy imparting means 50 are separated from each other by increasing the distance from each other. In addition, in the separation device 10A, those with the same structure and the same function as the separation device 10 are assigned the same reference numerals as the separation device 10, and the description of the structure and the description of the operation are omitted.

抵接手段60,係具備被支撐在底板BP上之圓筒狀抵接構件61,在抵接構件61內部的底板BP上支撐著被黏接體黏接領域用紫外線發光源51A。   離間手段30A,係具備被支撐在底板BP上之作為驅動機器之直動馬達33,與被支撐在其輸出軸33A、於上面側支撐另一方側保持構件22B及支架52A之保持臂34。The contact means 60 includes a cylindrical contact member 61 supported on the base plate BP, and supports the ultraviolet light emitting source 51A for the area to be adhered on the base plate BP inside the contact member 61 . The separating means 30A is provided with a linear motor 33 as a driving device supported on the base plate BP, and a holding arm 34 supported on the output shaft 33A thereof and supporting the other side holding member 22B and the bracket 52A on the upper surface side.

此類之離間裝置10A,係與離間裝置10同樣作法並在被黏貼複數被黏接體CP的黏接片AS被載置於另一方側保持構件22B上時,賦予能量手段50則驅動被保持領域用紫外線發光源52B,如圖3(A)所示,對被保持領域HE賦予紫外線UV而使被保持領域HE的黏接力降低。於是,保持手段20驅動回動馬達21,如圖3(B)所示,以一方側保持構件22A與另一方側保持構件22B保持黏接片AS的端部之後,離間手段30A驅動直動馬達33,使保持手段20下降並使保持手段20及抵接手段60相對移動,對黏接片賦予張力並將被黏接體CP的相互間隔擴大。其後,與離間裝置10同樣作法,賦予能量手段50驅動被黏接體黏接領域用紫外線發光源51A,使黏接片AS對被黏接體CP的黏接力降低之後,未圖示的被黏接體取出手段將各被黏接體CP搬送至別的程序。於是,在利用未圖示的被黏接體取出手段,而將被黏接體CP從黏接片AS拆卸時,各手段則驅動各個驅動機器,使各構件復歸到初期位置後,將殘留在另一方側保持構件22B上的黏接片AS拆卸,以下反覆進行上述同樣的動作。This type of separation device 10A is performed in the same manner as the separation device 10, and when the adhesive sheets AS to which the plurality of adherends CP are attached are placed on the other side holding member 22B, the energy imparting means 50 is driven to be held. As shown in FIG. 3(A) , the area-use ultraviolet light emitting source 52B applies ultraviolet UV to the held area HE to reduce the adhesive force of the held area HE. Then, the holding means 20 drives the reversing motor 21, and as shown in FIG. 3(B), after holding the end of the adhesive sheet AS with the one side holding member 22A and the other side holding member 22B, the separating means 30A drives the direct motion motor 33. The holding means 20 is lowered, the holding means 20 and the contact means 60 are moved relatively, and tension is applied to the adhesive sheet to widen the mutual interval of the adherends CP. Thereafter, in the same manner as in the separation device 10, the energy supply means 50 drives the ultraviolet light emitting source 51A for the bonding area of the adherend to reduce the adhesion force of the adhesive sheet AS to the adherend CP, and the unillustrated The adherend removal means conveys each adherend CP to another process. Therefore, when the adherend CP is detached from the adhesive sheet AS by means of taking out the adherend, which is not shown in the figure, each means drives each drive device to return each member to the initial position, and then remains in the The adhesive sheet AS on the other side holding member 22B is removed, and the same operation as described above is repeated below.

即使利用此類之離間裝置10A,也能得到與離間裝置10同樣的效果。Even with such a separation device 10A, the same effects as those of the separation device 10 can be obtained.

保持手段20,可以是在另一方之面AS2、或一方之面AS1及另一方之面AS2雙方之面保持被黏貼複數被黏接體CP之黏接片AS的端部之構成,抑或以機械式夾頭或夾持筒等抓持手段、庫侖力、接著劑、黏著劑、磁力、白努利(Bernoulli)吸附、驅動機器等保持黏接片AS的端部之構成。   保持手段20,離間裝置10之場合,例如,可以形成以往右方移動的該保持手段20作成1體、往左方移動的該保持手段20作成1體之2體之構成,例如,抑或以形成往右方、左方及其他方向移動的3體以上之構成。   保持手段20,離間裝置10A之場合,可以是1體或2體以上。The holding means 20 may be configured to hold the ends of the adhesive sheets AS to which the plurality of adherends CP are adhered on the other side AS2, or the sides of the one side AS1 and the other side AS2, or mechanically. The structure of holding the end of the adhesive sheet AS by means of gripping means such as a chuck or a holding cylinder, Coulomb force, adhesive, adhesive, magnetic force, Bernoulli adsorption, driving machine, etc. In the case of the holding means 20 and the separation device 10, for example, the holding means 20 that moves to the right can be formed as one body, and the holding means 20 that move to the left can be formed into two bodies. It consists of 3 or more bodies that move to the right, left and other directions. In the case of the holding means 20 and the separating device 10A, there may be one or two or more.

離間手段30、30A並非複數而是單數亦可,該場合,例如,離間裝置10,係作成以1體的線性馬達的2個滑件,分別1體一體支撐保持手段20,將被黏接體CP的相互間隔擴大之構成,抑或將被黏接體CP的相互間隔僅於1軸方向(例如,X軸方向或Y軸方向等)擴大之構成。   離間手段30,可以是將相互間隔朝3軸以上的方向(例如,X軸方向、Y軸方向及其他軸方向)擴大之構成,例如,作成使朝X軸方向移動之複數保持手段20分別朝Y軸方向移動之構成(使朝Y軸方向移動之複數保持手段20分別朝X軸方向移動之構成),可以將被黏接體CP的相互間隔擴大,抑或無法動作使被黏接體CP的相互間隔成為指定間隔之構成。   離間手段30A,亦可藉由停止或移動保持手段20、且移動抵接手段60,而使保持手段20及抵接手段60相對移動,對黏接片AS賦予張力而將被黏接體CP的相互間隔擴大。   離間手段30、30A,亦可作業者操作按鈕或桿等,來驅動線性馬達31、直動馬達33,該場合,例如,構成將依照檢知手段40的檢知結果顯示於監視器或檢出器等顯示器,亦可以根據該顯示器所顯示之檢知結果使被黏接體CP的相互間隔成為指定間隔之方式,或者,以各被黏接體CP全體的集合形狀相對於基礎全體的集合形狀成為相似關係之方式,使作業者驅動線性馬達31、直動馬達33。The separation means 30 and 30A are not plural but may be singular. In this case, for example, the separation device 10 is made of two sliders of a linear motor of one body, each of which integrally supports the holding means 20 and holds the body to be adhered. A configuration in which the mutual interval between CPs is widened, or a configuration in which the mutual interval between the adherends CP is widened only in one axis direction (eg, the X-axis direction, the Y-axis direction, etc.). The separating means 30 may be configured to widen the distance from each other in directions of three or more axes (for example, the X-axis direction, the Y-axis direction, and the other axis directions). The configuration of moving in the Y-axis direction (the configuration in which the plurality of holding means 20 moving in the Y-axis direction is moved in the X-axis direction respectively) can widen the mutual interval of the adherend CP, or make it impossible to move the adherend CP. The mutual interval constitutes the specified interval. The separating means 30A may stop or move the holding means 20 and move the abutting means 60, so that the holding means 20 and the abutting means 60 are relatively moved, and tension is applied to the adhesive sheet AS, so that the adhesion of the adherend CP can be adjusted. The distance from each other expands. The separation means 30 and 30A may be operated by the operator to drive the linear motor 31 and the linear motor 33 by operating a button, a lever, or the like. In this case, for example, the detection result by the detection means 40 may be displayed on the monitor or the detection result. A display such as a device can also be used to make the mutual interval of the adherend CP a predetermined interval according to the detection result displayed on the display, or the collective shape of the whole of each to-be-adhered body CP relative to the collective shape of the entire base can be used. In a similar manner, the operator drives the linear motor 31 and the linear motor 33 .

檢知手段40,也可以是作業者的目視,例如,可以構成作業者利用目視,操作按鈕或桿等使被黏接體CP的相互間隔成為指定間隔,或者,使各被黏接體CP全體的集合形狀相對於基礎全體的集合形狀成為相似關係,並驅動線性馬達31、直動馬達33,抑或不在本發明之離間裝置10、10A所具備。The detection means 40 may be the visual inspection of the operator. For example, the operator may operate a button, a lever, or the like to set the mutual interval between the adherends CP to a predetermined interval, or make each adherend CP as a whole. The aggregate shape of the base unit is in a similar relationship with the aggregate shape of the entire base, and drives the linear motor 31 and the linear motor 33, or may not be provided in the separation devices 10 and 10A of the present invention.

賦予能量手段50,作為第1賦予能量手段51,而採用對黏接片AS之一方之面AS1側及另一方之面AS2側之至少一方賦予紫外線UV之構成,亦可以此類之構成之第1賦予能量手段51也對被保持領域HE賦予紫外線UV而使黏接片AS對一方側保持構件22A或另一方側保持構件22B之黏接力降低,抑或不具有第1賦予能量手段51。   賦予能量手段50,作為第2賦予能量手段52,而採用對黏接片AS之一方之面AS1側及另一方之面AS2側之至少一方賦予紫外線UV之構成,亦可以此類之構成之第2賦予能量手段52對被保持領域HE賦予紫外線UV而使黏接片AS對一方側保持構件22A或另一方側保持構件22B之黏接力降低。又,於前述實施形態所示之離間裝置10、10A,賦予能量手段50從另一方側保持構件22B側對黏接片AS的被保持領域HE賦予紫外線UV之場合,以紫外線可透過之構件構成該另一方側保持構件22B或保持臂34等即可。   賦予能量手段50,可以是以所有波長的電磁波(例如X光或紅外線等)作為能量賦予黏接片AS,抑或以被加熱或冷卻的氣體或液體等流體等作為能量賦予黏接片AS,因應黏接片AS之構成而任何可以使該黏接片AS的黏接力降低之能量皆可,可以是對黏接片AS全體或部分地賦予能量之構成,而作為被黏接體黏接領域用紫外線發光源51A或被保持領域用紫外線發光源52B,也可以採用任何LED(Light Emitting Diode、發光二極體)、高壓水銀燈、低壓水銀燈、金屬鹵化物燈、氙氣燈、鹵素燈等,抑或採用斟酌組合該等之光源。   第1賦予能量手段51,於並未將被黏接體CP的相互間隔擴大之狀態下對黏接片AS照射紫外線UV亦可。The energy imparting means 50, as the first energy imparting means 51, employs a configuration in which ultraviolet rays UV are applied to at least one of the one surface AS1 side and the other surface AS2 side of the adhesive sheet AS, and the first configuration of such a configuration is also possible. The energy imparting means 51 also imparts ultraviolet rays UV to the held area HE to reduce the adhesive force of the adhesive sheet AS to the one side holding member 22A or the other side holding member 22B, or does not have the first energy imparting means 51 . The energy imparting means 50, as the second energy imparting means 52, adopts a configuration in which ultraviolet rays UV are applied to at least one of the side AS1 on one side and the side AS2 on the other side of the adhesive sheet AS. 2. The energy imparting means 52 imparts ultraviolet rays UV to the held area HE to reduce the adhesive force of the adhesive sheet AS to the one-side holding member 22A or the other-side holding member 22B. In addition, in the separating apparatuses 10 and 10A shown in the above-mentioned embodiments, when the energy imparting means 50 applies ultraviolet rays UV to the holding area HE of the adhesive sheet AS from the other side holding member 22B side, it is constituted by a member that is permeable to ultraviolet rays. The other side holding member 22B, the holding arm 34 or the like may be used. The energy imparting means 50 may use electromagnetic waves of all wavelengths (such as X-rays or infrared rays) as energy to impart energy to the adhesive sheet AS, or use fluids such as heated or cooled gas or liquid as energy to impart energy to the adhesive sheet AS. The structure of the adhesive sheet AS can be any energy that can reduce the adhesive force of the adhesive sheet AS. It can be a structure that imparts energy to the whole or part of the adhesive sheet AS, and is used in the field of bonding of the adherend. The ultraviolet light emitting source 51A or the ultraviolet light emitting source 52B for the protected area can also be any LED (Light Emitting Diode, light emitting diode), high pressure mercury lamp, low pressure mercury lamp, metal halide lamp, xenon lamp, halogen lamp, etc., or use Consider combining these light sources. The first energy imparting means 51 may irradiate the adhesive sheet AS with ultraviolet rays UV in a state where the distance between the adherends CP is not widened.

抵接手段60,除了角筒狀或橢圓筒狀等,亦可採用圓柱、角柱、橢圓柱等其他形狀之抵接構件61。The abutting means 60 can be formed of abutting members 61 having other shapes such as a column, a square column, and an elliptical column, in addition to a rectangular cylindrical shape or an elliptical cylindrical shape.

本發明之黏接片AS及被黏接體CP之材質、種類別、形狀等並未特別限定。例如,黏接片AS,只要是藉由被賦予能量而使其黏接力降低則並無任何限定,感壓黏接性、感熱黏接性等之黏接形態者亦可。再者,黏接片AS或被黏接體CP,例如,可以是圓形、橢圓形、三角形或四角形等多角形,其他形狀亦可。此外,黏接片AS,例如,可以是只有接著劑層的單層者、在基材與接著劑層之間具有中間層者、在基材的上面具有蓋層等3層以上者,進而,可以將基材從接著劑層剝離之所謂雙面黏接片之類者亦可,這樣的雙面黏接片,可以是具有單層或複層的中間層者、或沒有中間層之單層或複層者。此外,作為被黏接體CP,例如,可以是食品、樹脂容器、矽半導體晶圓或化合物半導體晶圓等之半導體晶圓,半導體晶片、電路基板、光碟等資訊記錄基板、玻璃板、鋼板、陶器、木板或樹脂等單體物,抑或該等2個以上所形成之複合物,能以任意形態的構件或物品等作為對象。又,黏接片AS,也可以換成功能性的、用途性的讀法,例如,資訊記載用標籤、裝飾用標籤、保護片、切割膠帶、裸晶貼膜、晶粒黏著膠帶、記錄層形成樹脂片等任意片、薄膜、膠帶等。   被黏接體CP,可以是預先在黏接片AS上複數存在者,抑或於利用離間手段30、30A、其他機構或人手等賦予外力之時點而被分割成複數,在黏接片AS上複數存在之類的被分割而成為複數者。作為此類之被分割而成為複數之被黏接體CP,例如,對半導體晶圓或基板等照射雷射,先在該半導體晶圓或基板等形成線狀或格子狀等脆弱的脆弱層,或在對黏接片AS賦予張力、或在對半導體晶圓或基板等直接或間接地賦予外力之時點而個片化,成為複數被黏接體CP者,或例如,以切割刃切入樹脂或玻璃板等,先在該樹脂或玻璃板等形成沒有貫通於線狀或格子狀等的表背之切入或排孔等之切斷預定線,或在對黏接片AS賦予張力、或在對樹脂或玻璃板等直接或間接地賦予外力之時點加以個片化,形成複數被黏接體CP等,並無任何限定。The material, type, shape, etc. of the adhesive sheet AS and the adherend CP of the present invention are not particularly limited. For example, the adhesive sheet AS is not limited at all as long as the adhesive force is reduced by being energized, and it may be in an adhesive form such as pressure-sensitive adhesiveness and heat-sensitive adhesiveness. Furthermore, the adhesive sheet AS or the adherend CP may be, for example, a polygonal shape such as a circle, an ellipse, a triangle, or a quadrangle, and other shapes are also possible. In addition, the adhesive sheet AS may be, for example, a single layer of only the adhesive layer, one having an intermediate layer between the substrate and the adhesive layer, and one having three or more layers such as a cap layer on the upper surface of the substrate, and further, A so-called double-sided adhesive sheet that can peel the substrate from the adhesive layer is also acceptable. Such a double-sided adhesive sheet can be a single-layer or multi-layer intermediate layer, or a single layer without an intermediate layer. or stratified. In addition, as the adherend CP, for example, a food, a resin container, a semiconductor wafer such as a silicon semiconductor wafer or a compound semiconductor wafer, an information recording substrate such as a semiconductor chip, a circuit board, an optical disc, a glass plate, a steel plate, A single substance such as pottery, wood, or resin, or a composite of two or more of these can be used as a target for members or articles of any form. In addition, the adhesive sheet AS can also be replaced with functional and useful readings, such as labels for information recording, labels for decoration, protective sheets, dicing tapes, bare die stickers, die attach tapes, and recording layer formation. Resin sheets and other arbitrary sheets, films, tapes, etc. The to-be-adhered body CP may exist in plural on the adhesive sheet AS in advance, or may be divided into plural numbers when an external force is applied by the separating means 30, 30A, other mechanisms, or human hands, and the plural numbers may be present on the adhesive sheet AS. Beings and the like are divided into plurals. As such a plurality of bonded bodies CP divided into a plurality, for example, a semiconductor wafer or a substrate is irradiated with a laser, and a fragile fragile layer such as a line or a lattice is first formed on the semiconductor wafer or substrate. Or when tension is applied to the adhesive sheet AS, or when an external force is directly or indirectly applied to a semiconductor wafer or substrate, it is individualized to become a plurality of adherends CP, or, for example, a cutting edge is used to cut into the resin or Glass plates, etc., are first formed in the resin or glass plate, etc., without cutting lines or rows of holes penetrating through the front and back of the line or lattice shape, etc., or before applying tension to the adhesive sheet AS, or in the There is no limitation on the timing of applying external force directly or indirectly to resins, glass plates, etc., into individual pieces to form a plurality of adherends CP and the like.

前述實施形態之驅動機器,可以採用回動馬達、直動馬達、線性馬達、單軸機器手臂、多關節機器手臂等之電動機器、空氣壓缸、油壓缸、無桿汽缸及回轉式汽缸等致動器等之外,也可以採用直接或間接地組合該等之驅動機器。The driving machine of the above-mentioned embodiment can use electric machines such as rotary motors, direct motion motors, linear motors, single-axis robot arms, multi-joint robot arms, etc., air cylinders, hydraulic cylinders, rodless cylinders, and rotary cylinders, etc. In addition to actuators and the like, it is also possible to use a drive machine that directly or indirectly combines these.

10、10A‧‧‧離間裝置20‧‧‧保持手段22‧‧‧保持構件22A‧‧‧一方側保持構件22B‧‧‧另一方側保持構件30、30A‧‧‧離間手段50‧‧‧賦予能量手段51‧‧‧第1賦予能量手段52‧‧‧第2賦予能量手段60‧‧‧抵接手段AS‧‧‧黏接片AS1‧‧‧一方之面AS2‧‧‧另一方之面CE‧‧‧被黏接體黏接領域CP‧‧‧被黏接體HE‧‧‧被保持領域UV‧‧‧紫外線(指定之能量)10. 10A‧‧‧Separation device 20‧‧‧holding means 22‧‧‧holding member 22A‧‧‧one side holding member 22B‧‧‧other side holding member 30, 30A‧‧‧separating means 50‧‧‧provided Energy Means 51‧‧‧First Energy Means52‧‧‧Second Energy Means60‧‧‧Abutting Means AS‧‧‧Adhesive Sheets AS1‧‧‧One Side AS2‧‧‧Another Side CE ‧‧‧Attachment area CP‧‧‧Attachment HE‧‧‧Retaining area UV‧‧‧Ultraviolet (specified energy)

圖1(A)係關於本發明之實施形態之離間裝置之平面圖。(B)係圖1(A)之側面圖。   圖2(A)、(B)係關於本發明之實施形態之離間裝置之動作說明圖。   圖3(A)、(B)係本發明之其他例之說明圖。Fig. 1(A) is a plan view of a separation device according to an embodiment of the present invention. (B) is a side view of FIG. 1(A). 2(A) and (B) are diagrams for explaining the operation of the separating device according to the embodiment of the present invention. 3(A) and (B) are explanatory diagrams of other examples of the present invention.

10‧‧‧離間裝置 10‧‧‧Separation device

20‧‧‧保持手段 20‧‧‧Maintaining Means

21‧‧‧回動馬達 21‧‧‧Reversing motor

21A‧‧‧輸出軸 21A‧‧‧Output shaft

22‧‧‧保持構件 22‧‧‧Maintaining member

22A‧‧‧一方側保持構件 22A‧‧‧One side holding member

22B‧‧‧另一方側保持構件 22B‧‧‧The other side holding member

30‧‧‧離間手段 30‧‧‧ Means of alienation

31‧‧‧驅動線性馬達 31‧‧‧Drive Linear Motor

31A‧‧‧滑件 31A‧‧‧Slide

32‧‧‧保持臂 32‧‧‧Retaining Arm

40‧‧‧檢知手段 40‧‧‧Detection methods

50‧‧‧賦予能量手段 50‧‧‧Empowering Means

51‧‧‧第1賦予能量手段 51‧‧‧The first means of empowering energy

51A‧‧‧紫外線發光源 51A‧‧‧UV light source

52‧‧‧第2賦予能量手段 52‧‧‧Second Energy Empowerment Means

52A‧‧‧支架 52A‧‧‧Bracket

52B‧‧‧被保持領域用紫外線發光源 52B‧‧‧UV light source for protected areas

AS‧‧‧黏接片 AS‧‧‧adhesive sheet

AS1‧‧‧一方之面 AS1‧‧‧One Side

AS2‧‧‧另一方之面 AS2‧‧‧The other side

BD‧‧‧箭頭 BD‧‧‧arrow

CE‧‧‧被黏接體黏接領域 CE‧‧‧Adhering body bonding field

CP‧‧‧被黏接體 CP‧‧‧adhered body

HE‧‧‧被保持領域 HE‧‧‧Retained area

UV‧‧‧紫外線(指定之能量) UV‧‧‧UV (specified energy)

Claims (5)

一種離間裝置,其特徵係具備:   在一方之面與另一方之面之至少一方,將黏貼複數被黏接體或被分割成複數的被黏接體之黏接片的端部以保持構件予以保持之複數保持手段,與   使保持前述黏接片的端部之前述保持手段相對移動、對前述黏接片賦予張力而將前述被黏接體的相互間隔擴大之離間手段;   前述黏接片,係藉由被賦予指定的能量使其黏接力降低,   具備對前述黏接片賦予前述指定的能量之賦予能量手段;   前述保持構件,係作成由抵接在前述黏接片之一方之面側之一方側保持構件、及抵接在前述黏接片之另一方之面側之另一方側保持構件挾入並保持前述黏接片的端部之構成;   前述賦予能量手段,係在以前述保持構件挾入之前,對以前述一方側保持構件及另一方側保持構件挾入之前述黏接片的被保持領域賦予前述指定的能量。A separation device, which is characterized by comprising: on at least one of one side and the other side, the ends of a plurality of adherends or an end portion of an adhesive sheet that is divided into a plurality of adherends are held by a holding member. The plurality of holding means for holding and the holding means for holding the end of the adhesive sheet are relatively moved to apply tension to the adhesive sheet to widen the mutual interval between the adherends; The above-mentioned adhesive sheet, The adhesive force is reduced by being imparted with a predetermined energy, and an energy imparting means for imparting the predetermined energy to the adhesive sheet is provided; A structure in which one side holding member and the other side holding member abutting on the other surface side of the adhesive sheet sandwich and hold the end of the adhesive sheet; the energy imparting means is connected to the holding member Before being held in, the above-mentioned predetermined energy is given to the held area of the above-mentioned adhesive sheet held by the above-mentioned one side holding member and the other side holding member. 一種離間裝置,其特徵係具備:   在一方之面與另一方之面之至少一方,將黏貼複數被黏接體或被分割成複數的被黏接體之黏接片的端部以保持構件予以保持之保持手段,   於前述黏接片之比起被黏貼前述複數被黏接體之被黏接體黏接領域更外側、即前述保持手段保持之被保持領域的內側抵接在該黏接片之抵接手段,與   使保持前述黏接片的端部之前述保持手段及前述抵接手段相對移動、對前述黏接片賦予張力而將前述被黏接體的相互間隔擴大之離間手段;   前述黏接片,係藉由被賦予指定的能量使其黏接力降低,   具備對前述黏接片賦予前述指定的能量之賦予能量手段;   前述保持構件,係作成由抵接在前述黏接片之一方之面側之一方側保持構件、及抵接在前述黏接片之另一方之面側之另一方側保持構件挾入並保持前述黏接片的端部之構成;   前述賦予能量手段,係在以前述保持構件挾入之前,對以前述一方側保持構件及另一方側保持構件挾入之前述黏接片的被保持領域賦予前述指定的能量。A separation device, which is characterized by comprising: on at least one of one side and the other side, the ends of a plurality of adherends or an end portion of an adhesive sheet that is divided into a plurality of adherends are held by a holding member. The holding means for holding is in contact with the adhesive sheet on the outer side of the adhesive sheet than the adherend area to which the plurality of adherends are adhered, that is, the inside of the held area held by the holding means The abutting means is a separation means for relatively moving the holding means and the abutting means for holding the end of the adhesive sheet, and applying tension to the adhesive sheet to expand the mutual interval between the adherends; The adhesive sheet is provided with a predetermined energy to reduce its adhesive force, and is provided with energy imparting means for imparting the predetermined energy to the adhesive sheet; The holding member is formed by contacting one of the adhesive sheets. One side holding member on the surface side and the other side holding member abutting on the other surface side of the adhesive sheet sandwich and hold the end of the adhesive sheet; The energy imparting means is attached to Before being held by the holding member, the predetermined energy is given to the held area of the adhesive sheet held by the one side holding member and the other side holding member. 如申請專利範圍第1或2項記載之離間裝置,其中   前述賦予能量手段係具備:對前述黏接片之被黏貼前述複數被黏接體之被黏接體黏接領域賦予前述指定的能量之第1賦予能量手段,與對以前述保持構件保持之前述黏接片的被保持領域賦予前述指定的能量之第2賦予能量手段。The separation device according to claim 1 or 2, wherein the energy imparting means is provided with a means of imparting the specified energy to the adherend area of the adherend to which the plurality of adherends are adhered to the adhesive sheet. The first energy imparting means and the second energy imparting means for imparting the predetermined energy to the held area of the adhesive sheet held by the holding member. 一種離間方法,其特徵係具有:   在一方之面與另一方之面之至少一方,將黏貼複數被黏接體或被分割成複數的被黏接體之黏接片的端部以複數保持手段之各個保持構件予以保持之保持程序,與   使保持前述黏接片的端部之前述保持手段相對移動、對前述黏接片賦予張力而將前述被黏接體的相互間隔擴大之離間程序;   前述黏接片,係藉由被賦予指定的能量使其黏接力降低,   具有對前述黏接片賦予前述指定的能量之賦予能量程序;   前述保持構件,係作成由抵接在前述黏接片之一方之面側之一方側保持構件、及抵接在前述黏接片之另一方之面側之另一方側保持構件挾入並保持前述黏接片的端部之構成;   前述賦予能量程序,係在以前述保持構件挾入之前,對以前述一方側保持構件及另一方側保持構件挾入之前述黏接片的被保持領域賦予前述指定的能量。A separation method, which is characterized by the following: On at least one of one side and the other side, the ends of the adhesive sheets that adhere a plurality of adherends or are divided into a plurality of adherends are held by a plurality of holding means The holding procedure of holding each holding member is a separation procedure of relatively moving the holding means for holding the end of the adhesive sheet, applying tension to the adhesive sheet, and expanding the mutual interval between the adherends; The adhesive sheet is provided with a predetermined energy to reduce its adhesive force, and has an energy imparting program for imparting the predetermined energy to the adhesive sheet; the holding member is formed by abutting on one of the adhesive sheets. The structure of one side holding member on the surface side and the other side holding member abutting on the other surface side of the above-mentioned adhesive sheet sandwiching and holding the end of the above-mentioned adhesive sheet; Before being held by the holding member, the predetermined energy is given to the held area of the adhesive sheet held by the one side holding member and the other side holding member. 一種離間方法,其特徵係具備:   在一方之面與另一方之面之至少一方,將黏貼複數被黏接體或被分割成複數的被黏接體之黏接片的端部以複數保持手段之各個保持構件予以保持之保持程序,與   使在前述黏接片之比起被黏貼前述複數被黏接體之被黏接體黏接領域更外側、即前述保持手段保持之被保持領域的內側抵接於該黏接片之抵接手段,及保持前述黏接片的端部之前述保持手段相對移動,對前述黏接片賦予張力而將前述被黏接體的相互間隔擴大之離間程序;   前述黏接片,係藉由被賦予指定的能量使其黏接力降低,   具有對前述黏接片賦予前述指定的能量之賦予能量程序;   前述保持構件,係作成由抵接在前述黏接片之一方之面側之一方側保持構件、及抵接在前述黏接片之另一方之面側之另一方側保持構件挾入並保持前述黏接片的端部之構成;   前述賦予能量程序,係在以前述保持構件挾入之前,對以前述一方側保持構件及另一方側保持構件挾入之前述黏接片的被保持領域賦予前述指定的能量。A separation method, which is characterized by comprising: on at least one of the one side and the other side, the ends of the adhesive sheets that adhere a plurality of adherends or are divided into a plurality of adherends are held by a plurality of holding means The holding procedure for holding each of the holding members is to make the area of the adherend to which the plurality of adherends are adhered on the outside of the adhesive sheet, that is, the inside of the area to be held held by the holding means. The abutting means abutting against the adhesive sheet and the holding means for holding the end of the adhesive sheet are relatively moved to apply tension to the adhesive sheet to expand the distance between the adherends; The above-mentioned adhesive sheet is provided with a predetermined energy to reduce its adhesive force, and has an energy imparting program for imparting the above-mentioned predetermined energy to the above-mentioned adhesive sheet; One side holding member on one face side and the other side holding member abutting on the other face side of the adhesive sheet sandwich and hold the end of the adhesive sheet; The energy imparting process is: Before being held by the holding member, the predetermined energy is given to the held area of the adhesive sheet held by the one side holding member and the other side holding member.
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