JP2017107978A - Sheet peeling device and peeling method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a sheet peeling device capable of detecting damage on an adherend reliably.SOLUTION: A sheet peeling device 10 includes holding means 20 for holding an adhesive sheet AS pasted to an adherend WF, tension application means 30 for peeling the adhesive sheet AS from the adherend WF by applying a tension to the adhesive sheet AS held by the holding means 20, and first detection means 40 capable of detecting damage on the adherend WF, by detecting a fragment thereof adhering to the adhesive sheet AS peeled from the adherend WF.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a sheet peeling apparatus and a peeling method.

  2. Description of the Related Art Conventionally, there has been known a sheet peeling apparatus that can peel an adhesive sheet affixed to an adherend and detect that the adherend is damaged by the peeling (see, for example, Patent Document 1).

JP 2012-64850 A

  However, the conventional sheet peeling apparatus as described in Patent Document 1 is configured to detect breakage of the adherend based on the appearance of the adherend from which the adhesive sheet has been peeled. There is an inconvenience that damage due to destruction cannot be detected. Interlaminar fracture means that when a force is applied to the adherend toward the outside in the thickness direction, the adherend is separated and broken at an intermediate portion in the thickness direction.

  The objective of this invention is providing the sheet | seat peeling apparatus and peeling method which can detect the failure | damage of a to-be-adhered body reliably.

  In order to achieve the above object, the sheet peeling apparatus of the present invention is a sheet peeling apparatus for peeling an adhesive sheet attached to an adherend, and holding means for holding the adhesive sheet attached to the adherend. Tension applying means for applying tension to the adhesive sheet held by the holding means to peel the adhesive sheet from the adherend, and the adherend adhered to the adhesive sheet peeled from the adherend A configuration is adopted in which a first detection means capable of detecting breakage of the adherend is detected by detecting a broken piece.

  At this time, the sheet peeling apparatus of the present invention includes a second detection unit that detects the appearance of the adherend, and based on the detection result of the first detection unit and the detection result of the second detection unit, It is preferable that the adherend is configured to be capable of detecting damage due to interlaminar fracture.

  On the other hand, the sheet peeling method of the present invention is a sheet peeling method for peeling an adhesive sheet attached to an adherend, and a holding step for holding the adhesive sheet attached to the adherend, and the holding step. Applying a tension to the held adhesive sheet to release the adhesive sheet from the adherend, and detecting fragments of the adherend adhered to the adhesive sheet peeled from the adherend And a first detection step of detecting breakage of the adherend is employed.

  According to the present invention as described above, since the first detection means detects the fragments of the adherend adhered to the adhesive sheet peeled from the adherend, there is no interlaminar fracture of the adherend as in the prior art. Since damage can be detected as well as damage due to interlaminar fracture of the adherend, damage to the adherend can be reliably detected.

  At this time, if the second detection means for detecting the appearance of the adherend is provided, the detection result of the first detection means and the detection result of the second detection means are collated, thereby causing an interlayer breakdown of the adherend. Damage can be detected more reliably.

The side view of the sheet peeling apparatus which concerns on one Embodiment of this invention. (A)-(B) is operation | movement explanatory drawing of a sheet peeling apparatus. (A)-(C) are operation | movement explanatory drawings of a sheet peeling apparatus.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
In this embodiment, the X axis, the Y axis, and the Z axis are orthogonal to each other, the X axis and the Y axis are axes in a predetermined plane, and the Z axis is an axis that is orthogonal to the predetermined plane. To do. Furthermore, in the present embodiment, when viewed from the front side in FIG. 1 parallel to the Y axis, when indicating the direction, “up” is the arrow direction of the Z axis and “down” is the opposite direction, “ The “left” is the arrow direction of the X axis, “right” is the opposite direction, “front” is the front direction in FIG. 1 parallel to the Y axis, and “rear” is the opposite direction.

  In FIG. 1, a sheet peeling apparatus 10 is an apparatus for peeling an adhesive sheet AS attached to a semiconductor wafer (hereinafter simply referred to as “wafer”) WF as an adherend, and is attached to the wafer WF. Holding means 20 for holding the adhesive sheet AS, tension applying means 30 for applying tension to the adhesive sheet AS held by the holding means 20 and peeling the adhesive sheet AS from the wafer WF, and adhesion peeled from the wafer WF A first detection unit 40 capable of detecting breakage of the wafer WF by detecting a fragment of the wafer WF adhering to the sheet AS, and a second detection unit 50 detecting the appearance of the wafer WF are provided.

  The holding means 20 sandwiches the wound peeling tape PT rotatably and the peeling tape PT supported by the tape supporting means 21 is sandwiched between the tape supporting means 21 and the peeling means PT. The feeding means 22 for applying a feeding force or a winding force to the tape PT, the lead holding means 23 for holding the lead end portion of the peeling tape PT, and assisting the lead holding means 23 to hold the peeling tape PT. A holding auxiliary means 24; a pressing means 25 for pressing and attaching the peeling tape PT held by the lead holding means 23 to the adhesive sheet AS; and a cutting means 26 for cutting the peeling tape PT. The adhesive sheet AS is held via the PT.

The tape support means 21 is supported on the free end side of a rotating arm 21B that can rotate about a rotating shaft 21A, and feeds the rotating arm 21B and a supporting roller 21C that supports the wound peeling tape PT. And a spring 21D as an urging means for urging in the direction of the means 22.
The feeding means 22 includes a feeding roller 22B that is driven by a rotation motor 22A as a driving device.
The lead holding means 23 is accommodated in an accommodating means 23C supported by an output shaft 23B of a linear motion motor 23A as a driving device, and through a suction hole 23E formed in an adsorption surface 23D which is a bottom surface of the accommodating means 23C. A suction means 23F such as a vacuum pump or a vacuum ejector for adsorbing and holding the peeling tape PT is provided.
The holding auxiliary means 24 includes an auxiliary roller 24C that is supported by an output shaft 24B of a direct acting motor 24A as a driving device and makes the peeling tape PT contact the suction surface 23D.
The pressing means 25 is supported by a slider 25B of a linear motor 25A as a driving device accommodated in the accommodating means 23C, and is provided with a pressing head 25C provided so as to be able to project and retract from the bottom surface of the accommodating means 23C, a coil heater, and a heat pipe. Heating means 25D on the heating side.
The cutting means 26 includes a cutting blade 26C that is supported by a slider 26B of a linear motor 26A as a driving device housed in the housing means 23C and is provided so as to protrude and retract from the bottom surface of the housing means 23C.

The tension applying means 30 includes a moving means 31 for relatively moving the peeling tape PT and the wafer WF, a guiding means 32 for guiding the adhesive sheet AS peeled from the wafer WF in a predetermined direction, and an adhesive sheet attached to the wafer WF. And a pressing means 33 for pressing the AS in the direction of the wafer WF.
The moving unit 31 is supported by a slider 31B of a linear motor 31A as a driving device, and includes a table 31D having a support surface 31C that can suck and hold the wafer WF by a decompression unit (not shown) such as a decompression pump or a vacuum ejector.
The guide means 32 includes a guide roller 32C supported by a slider 32B of a linear motor 32A as a driving device.
The pressing means 33 includes a linear motion motor 33C as a driving device supported by an output shaft 33B of a linear motion motor 33A as a driving device, and a pressing roller 33E supported by an output shaft 33D of the linear motion motor 33C. Yes.

  The first detection means 40 and the second detection means 50 are each configured by an imaging means such as a camera or an optical sensor, and the second detection means 50 has an appearance such as the outer edge shape of the wafer WF or the in-plane shape of the wafer WF. It is provided so that it can be detected.

In the above sheet peeling apparatus 10, a procedure for peeling the adhesive sheet AS attached to the wafer WF will be described.
First, after the operator sets the peeling tape PT as shown by a solid line in FIG. 1, each member stands by at an initial position. With respect to the sheet peeling apparatus 10 shown by a solid line in FIG. A signal for starting automatic operation is input through an input means such as. Then, the holding means 20 drives the suction means 23F and sucks and holds the peeling tape PT on the suction surface 23D. Then, when the wafer WF is placed on the support surface 31C in a state where the adhesive sheet AS is placed upward by a conveyance means (not shown) such as a human hand or an articulated robot or a belt conveyor, the tension applying means 30 is a decompression means (not shown). To start holding the wafer WF by suction. Thereafter, the tension applying unit 30 drives the linear motor 31A to move the table 31D in the right direction, and the left end portion of the adhesive sheet AS is positioned directly below the pressing head 25C as indicated by a two-dot chain line in FIG.

  Next, the holding means 20 drives the linear motion motor 24A, and as shown by a two-dot chain line in FIG. 1, after the auxiliary roller 24C is retracted from below the accommodating means 23C, the rotation motor 22A and the linear motion motor 23A are moved. Driven and lowers the accommodating means 23C to a predetermined position directly above the adhesive sheet AS while feeding the peeling tape PT. Thereafter, the holding means 20 drives the linear motor 25A, and as shown in FIG. 2A, the pressing head 25C is lowered, and the peeling tape PT is pressed and stuck to the left end portion of the adhesive sheet AS. At this time, the holding means 20 may drive the heating means 25D to heat the peeling tape PT. When the application of the peeling tape PT to the adhesive sheet AS is completed, the holding unit 20 stops driving the suction unit 23F, drives the linear motor 25A and the linear motion motor 23A, and initially sets the pressing head 25C and the housing unit 23C. Return to position.

  Thereafter, the tension applying means 30 drives the linear motion motors 33A and 33C, and as shown in FIG. Press with the specified pressing force. Next, the tension applying means 30 drives the linear motors 31A and 32A to move the table 31D in the left direction and move the guide roller 32C in the right direction. Thereby, as shown in FIG. 3A, the adhesive sheet AS is peeled off from the wafer WF while being wound around the pressing roller 33E.

Here, during the peeling of the adhesive sheet AS, the first detection means 40 drives the imaging means, the optical sensor, etc., and the surface (adhesive surface) that is bonded to the wafer WF in the adhesive sheet AS peeled from the wafer WF is inspected. To detect the presence or absence of debris on the wafer WF. As a result, it is possible not only to detect breakage of the wafer WF without interlaminar fracture, but also to detect damage due to interlaminar fracture of the wafer WF.
In the present embodiment, the following detection may be performed using not only the first detection means 40 but also the second detection means 50. That is, during the peeling of the adhesive sheet AS, the first and second detection means 40 and 50 respectively drive the imaging means and the optical sensor, and the detection result of the first detection means 40 and the detection result of the second detection means 50 are displayed. Based on this, damage due to interlayer breakage of the wafer WF may be detected. In this case, the first detection means 40, for example, the position of the adhesive sheet AS such as the position of the V-notch formed on the wafer WF, the position of the adhesive sheet AS attached to the orientation flat, or the peeling start position of the adhesive sheet AS. With the predetermined position as the sheet reference position, the position of the piece of wafer WF adhering to the adhesive sheet AS is stored as the coordinate position in the orthogonal biaxial direction. In addition, the second detection unit 50 uses, for example, a predetermined position of the wafer WF such as the position of the V notch formed on the wafer WF, the position of the orientation flat, and the peeling start position of the adhesive sheet AS as the wafer reference position. The appearance of the wafer WF is stored at the coordinate position in the orthogonal biaxial direction. The positional relationship between the sheet reference position and the wafer reference position is stored in advance by the sheet peeling apparatus 10. Then, the sheet peeling apparatus 10 collates the coordinate position of the fragment of the wafer WF attached to the adhesive sheet AS with the coordinate position of the appearance of the wafer WF. Thereby, if there is no damage in the appearance of the wafer WF detected by the second detection means 50 at a position corresponding to the position of the debris of the wafer WF detected by the first detection means 40, the interlayer of the wafer WF at that position. Damage due to destruction has occurred, and the damage can be detected.
When damage to the wafer WF is detected as described above, for example, the sheet peeling apparatus 10 turns on a warning lamp, emits a warning sound, or stops the automatic operation of the sheet peeling apparatus 10. An operator can be notified of the breakage of the wafer WF.

  As shown in FIG. 3B, when the peeling of the adhesive sheet AS is completed, the tension applying means 30 stops driving the linear motors 31A and 32A and the decompression means (not shown), and then the holding means 20 is a linear motion motor. 24A and the suction means 23F are driven, the auxiliary roller 24C is returned to the initial position, and the peeling tape PT is sucked and held by the suction surface 23D. Thereafter, the holding means 20 drives the linear motor 26A, and as shown in FIG. 3C, the cutting blade 26C is moved up and down to cut the peeling tape PT, and the manual sheet or the transfer means (not shown) collects the adhesive sheet AS. To do. When the entire adhesive sheet AS is peeled from the wafer WF, a manual or unillustrated transfer means transfers the wafer WF on the table 31D to the next process, and then each means drives each drive device, After returning to the initial position, the same operation is repeated thereafter.

  According to the embodiment as described above, the first detection means 40 detects the fragments of the wafer WF adhering to the adhesive sheet AS peeled from the wafer WF. In addition to being able to detect, it is also possible to detect damage due to interlayer breakdown of the wafer WF, so that damage to the wafer WF can be reliably detected.

  As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this. That is, the invention has been illustrated and described with particular reference to certain specific embodiments, but without departing from the spirit and scope of the invention, Various modifications can be made by those skilled in the art in terms of material, quantity, and other detailed configurations. In addition, the description of the shape, material, and the like disclosed above is exemplary for ease of understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded the limitation of some or all of such restrictions is included in this invention.

For example, the holding means 20 may have a configuration in which a single-sheet peeling tape is pressed against the adhesive sheet AS.
The tape support means 21 may support the peeling tape PT without being biased in the direction of the feeding means 22, and in this case, the feeding means 22 is a pinch roller that sandwiches the peeling tape PT with the feeding roller 22B. Should be adopted.
The lead holding means 23 is configured to hold the peeling tape PT by chuck means such as a mechanical chuck or a chuck cylinder, coulomb force, adhesive, adhesive, magnetic force, Bernoulli adsorption or the like instead of or in combination with the suction means 23F. Can be adopted.
The holding auxiliary means 24 can employ a configuration in which the peeling tape PT is brought into contact with the suction surface 23D by spraying a rod-like member, a plate-like member, or air instead of or in combination with the auxiliary roller 24C.
The holding auxiliary means 24 may be omitted as long as the peeling tape PT after peeling of the adhesive sheet AS can be held only by the lead holding means 23.
The pressing means 25 can employ a pressing member made of blade material, rubber, resin, sponge, air blowing, or the like, instead of or in combination with the pressing head 25C, and the peeling tape PT is bonded to pressure sensitive adhesive. In the case of a sheet, the heating means 25D may or may not be provided.
At least one of the pressing means 25 and the cutting means 26 may not be accommodated in the accommodating means 23C, and the linear motors 25A and 26A may be supported by a frame (not shown).
The biasing means may employ rubber or resin instead of or in combination with the spring 21D.
When the peeling tape PT is attached to the adhesive sheet AS by another device, the holding means 20 includes the tape support means 21, the feeding means 22, the lead holding means 23, the holding auxiliary means 24, the pressing means 25, and the cutting means 26. In place of them, a configuration may be adopted in which the peeling tape PT attached to the adhesive sheet AS is held by a drive device, suction holding, or the like.
The holding means 20 may directly hold the adhesive sheet AS by a driving device or suction holding without using the peeling tape PT.
The cutting means 26 may employ other configurations such as a laser cutter, a thermal cutter, an air cutter, and a compressed water cutter instead of or in combination with the cutting blade 26C.
When the peeling tape PT is cut by another device, the cutting means 26 may not be provided in the present invention, or the peeling tape PT may not be cut.

The tension applying unit 30 may peel the adhesive sheet AS by at least one of the driving of the feeding unit 22, the driving of the linear motor 31A, and the driving of the linear motor 32A.
The tension applying means 30 may fix the table 31D and move the holding means 20 or the like, or may move both the means and the table 31D.
The moving means 31 may be configured to support the wafer WF by chuck means such as a mechanical chuck or a chuck cylinder, Coulomb force, adhesive, adhesive, magnetic force, Bernoulli adsorption or the like.
The guiding means 32 may guide the adhesive sheet AS so that the opposite surfaces of the surface that has been in contact with the wafer WF face each other, or the adhesive sheet AS is not folded in half. The adhesive sheet AS may or may not be induced.
The guiding means 32 may employ a rod-shaped member, a plate-shaped member, or the like instead of or in combination with the guiding roller 32C, or may guide the adhesive sheet AS by air blowing or the like.
The tension applying unit 30 may apply tension to the peeling tape PT by moving the wafer WF and the tape supporting unit 21 in place of the guide roller 32C.
When the wafer WF is moved by another apparatus, the moving unit 31 may not be provided.
The pressing means 33 may or may not press the adhesive sheet in the direction of the wafer WF by using a plate member or air blowing instead of or in combination with the pressing roller 33E.

The first detecting means 40 is an adhesive sheet from the surface of the adhesive sheet AS that is not bonded to the wafer WF (the surface opposite to the adhesive surface), the front side or the rear side of the adhesive sheet AS that is peeled off from the wafer WF, etc. The debris of the wafer WF attached to the AS may be detected, or the press roller 33E may be eliminated, and the debris of the wafer WF attached to the adhesive sheet AS peeled from the wafer WF may be detected.
The sheet peeling apparatus 10 captures, as an image, a piece of the wafer WF attached to the adhesive sheet AS with the first detection unit 40 as a reference, and the second detection unit 50 uses the wafer reference position as a reference. The appearance may be captured as an image, and the images may be overlapped (matched) to detect breakage of the wafer WF due to interlayer breakdown.
The sheet peeling apparatus 10 may detect breakage of the wafer WF that does not involve interlaminar breakdown from detection of at least one of the first detection unit 40 and the second detection unit 50.
The first and second detection means 40 and 50 may be contact type sensors such as limit switches, acoustic wave (ultrasonic) sensors, pressure sensors, magnetic sensors, and the like. The means 50 may be composed of the same type or different types.
The second detection means 50 may detect the appearance of the wafer WF from the lower surface side of the wafer WF, the front side or the rear side of the wafer WF, or may not be adopted.

  In addition, the material, type, shape, and the like of the adhesive sheet AS, the peeling tape PT, and the adherend in the present invention are not particularly limited. For example, the adhesive sheet AS and the peeling tape PT may be circular, elliptical, polygonal, such as a triangle or a quadrangle, or other shapes, or may be adhesive forms such as pressure-sensitive adhesiveness and heat-sensitive adhesiveness. Adhesion in the case where a heat-sensitive adhesive type is adopted may be provided with a heating means such as an appropriate coil heater for heating the adhesive sheet AS or the peeling tape PT, or the heating side of the heat pipe. What is necessary is just to adhere | attach by an appropriate method. In addition, such an adhesive sheet AS and a peeling tape PT are, for example, a single layer having only an adhesive layer, an intermediate layer between the base sheet and the adhesive layer, and an upper surface of the base sheet. It may be a three-layer or more layer having a cover layer, or a so-called double-sided adhesive sheet that can peel the substrate sheet from the adhesive layer. It may be a layer having an intermediate layer or a single layer or a multilayer having no intermediate layer. Examples of the adherend include, for example, foods, resin containers, semiconductor wafers such as silicon semiconductor wafers and compound semiconductor wafers, circuit board, information recording substrates such as optical disks, glass plates, steel plates, ceramics, wood plates or resin plates, Arbitrary forms of members and articles can also be targeted. In addition, the adhesive sheet AS is replaced with a functional and intended reading, for example, any information label, decorative label, protective sheet, dicing tape, die attach film, die bonding tape, recording layer forming resin sheet, etc. Arbitrary sheets, films, tapes and the like can be attached to any adherend as described above.

The means and steps in the present invention are not limited in any way as long as they can perform the operations, functions, or steps described with respect to those means and steps. The process is not limited at all. For example, as long as the holding means can hold the adhesive sheet affixed to the adherend, there is no limitation as long as it is within the technical scope in light of the common general technical knowledge at the time of filing ( Description of other means and steps is omitted).
The drive device in the embodiment includes an electric device such as a rotation motor, a linear motion motor, a linear motor, a single axis robot, an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. In addition to these, a combination of them directly or indirectly may be employed (some of them overlap with those exemplified in the embodiment).

DESCRIPTION OF SYMBOLS 10 ... Sheet | seat peeling apparatus 20 ... Holding means 30 ... Tension providing means 40 ... 1st detection means 50 ... 2nd detection means AS ... Adhesive sheet WF ... Wafer (to-be-adhered body)

Claims (3)

A sheet peeling device for peeling an adhesive sheet attached to an adherend,
Holding means for holding the adhesive sheet affixed to the adherend;
Tension applying means for applying tension to the adhesive sheet held by the holding means and peeling the adhesive sheet from the adherend;
A sheet comprising: first detection means capable of detecting breakage of the adherend by detecting fragments of the adherend adhered to the adhesive sheet peeled from the adherend. Peeling device.   A second detecting means for detecting the appearance of the adherend, and detecting breakage of the adherend due to interlaminar breakdown based on the detection result of the first detecting means and the detection result of the second detecting means; The sheet peeling apparatus according to claim 1, wherein the sheet peeling apparatus is configured to be possible. A sheet peeling method for peeling an adhesive sheet affixed to an adherend,
Holding step of holding the adhesive sheet affixed to the adherend;
Applying tension to the adhesive sheet held in the holding process to release the adhesive sheet from the adherend,
A first detection step of detecting breakage of the adherend by detecting fragments of the adherend adhered to the adhesive sheet peeled from the adherend. Method.

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