TWI754077B - 電漿處理裝置 - Google Patents

電漿處理裝置 Download PDF

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Publication number
TWI754077B
TWI754077B TW107121413A TW107121413A TWI754077B TW I754077 B TWI754077 B TW I754077B TW 107121413 A TW107121413 A TW 107121413A TW 107121413 A TW107121413 A TW 107121413A TW I754077 B TWI754077 B TW I754077B
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TW
Taiwan
Prior art keywords
electrode
substrate
plasma processing
processing apparatus
electrode portion
Prior art date
Application number
TW107121413A
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English (en)
Chinese (zh)
Other versions
TW201921483A (zh
Inventor
南雅人
佐佐木芳彦
齊藤均
町山
Original Assignee
日商東京威力科創股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication of TW201921483A publication Critical patent/TW201921483A/zh
Application granted granted Critical
Publication of TWI754077B publication Critical patent/TWI754077B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32458—Vessel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32541—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3244—Gas supply means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32458—Vessel
    • H01J37/32477—Vessel characterised by the means for protecting vessels or internal parts, e.g. coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32568—Relative arrangement or disposition of electrodes; moving means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Plasma Technology (AREA)
  • Drying Of Semiconductors (AREA)
TW107121413A 2017-07-06 2018-06-22 電漿處理裝置 TWI754077B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-133016 2017-07-06
JP2017133016A JP6969182B2 (ja) 2017-07-06 2017-07-06 プラズマ処理装置

Publications (2)

Publication Number Publication Date
TW201921483A TW201921483A (zh) 2019-06-01
TWI754077B true TWI754077B (zh) 2022-02-01

Family

ID=64989932

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107121413A TWI754077B (zh) 2017-07-06 2018-06-22 電漿處理裝置

Country Status (4)

Country Link
JP (1) JP6969182B2 (ja)
KR (1) KR102121655B1 (ja)
CN (1) CN109216148B (ja)
TW (1) TWI754077B (ja)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020093058A (ja) * 2018-12-12 2020-06-18 株式会社三洋物産 遊技機
JP2020093042A (ja) * 2018-12-12 2020-06-18 株式会社三洋物産 遊技機
JP2020093057A (ja) * 2018-12-12 2020-06-18 株式会社三洋物産 遊技機
JP2020093036A (ja) * 2018-12-12 2020-06-18 株式会社三洋物産 遊技機
JP2020093054A (ja) * 2018-12-12 2020-06-18 株式会社三洋物産 遊技機
JP2020093059A (ja) * 2018-12-12 2020-06-18 株式会社三洋物産 遊技機
JP2020093060A (ja) * 2018-12-12 2020-06-18 株式会社三洋物産 遊技機
JP2020093055A (ja) * 2018-12-12 2020-06-18 株式会社三洋物産 遊技機
JP2020093047A (ja) * 2018-12-12 2020-06-18 株式会社三洋物産 遊技機
JP2020093056A (ja) * 2018-12-12 2020-06-18 株式会社三洋物産 遊技機
JP2020093041A (ja) * 2018-12-12 2020-06-18 株式会社三洋物産 遊技機
JP2020093043A (ja) * 2018-12-12 2020-06-18 株式会社三洋物産 遊技機
JP2020093046A (ja) * 2018-12-12 2020-06-18 株式会社三洋物産 遊技機
JP2020093037A (ja) * 2018-12-12 2020-06-18 株式会社三洋物産 遊技機
KR20210115025A (ko) * 2019-03-01 2021-09-24 닛폰 하츠죠 가부시키가이샤 스테이지 및 스테이지 제작 방법
CN112017936B (zh) * 2019-05-28 2024-05-31 东京毅力科创株式会社 等离子体处理装置
KR102524433B1 (ko) * 2019-11-27 2023-04-24 도시바 미쓰비시덴키 산교시스템 가부시키가이샤 활성 가스 생성 장치
WO2022054481A1 (ja) * 2020-09-08 2022-03-17 日本発條株式会社 ステージおよびその作製方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101609779A (zh) * 2008-06-19 2009-12-23 东京毅力科创株式会社 聚焦环以及等离子体处理装置
CN105097405A (zh) * 2014-05-12 2015-11-25 东京毅力科创株式会社 等离子体处理装置和应用于等离子体处理装置的排气构造
KR20160091210A (ko) * 2015-01-22 2016-08-02 주식회사 원익아이피에스 기판지지대 및 그가 설치된 기판처리장치

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0730468A (ja) 1993-07-15 1995-01-31 Hitachi Ltd フィールドバスの受信方式
US6039836A (en) * 1997-12-19 2000-03-21 Lam Research Corporation Focus rings
JP2001196309A (ja) * 2000-01-06 2001-07-19 Hitachi Ltd プラズマ処理装置
JP4421874B2 (ja) * 2003-10-31 2010-02-24 東京エレクトロン株式会社 プラズマ処理装置及びプラズマ処理方法
JP4361045B2 (ja) 2005-10-12 2009-11-11 パナソニック株式会社 プラズマ処理装置及びプラズマ処理方法
JP5094307B2 (ja) * 2007-09-25 2012-12-12 株式会社アルバック プラズマ処理装置
KR101171422B1 (ko) * 2008-06-19 2012-08-06 도쿄엘렉트론가부시키가이샤 포커스 링 및 플라즈마 처리 장치
JP5539436B2 (ja) * 2012-04-26 2014-07-02 パナソニック株式会社 プラズマ処理装置及びプラズマ処理方法
JP6377975B2 (ja) * 2014-06-23 2018-08-22 新光電気工業株式会社 基板固定装置
JP6540022B2 (ja) * 2014-12-26 2019-07-10 東京エレクトロン株式会社 載置台及びプラズマ処理装置
JP6578215B2 (ja) * 2015-04-03 2019-09-18 株式会社ジャパンディスプレイ プラズマ処理装置、シールドリング、及び、シールドリング用部材

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101609779A (zh) * 2008-06-19 2009-12-23 东京毅力科创株式会社 聚焦环以及等离子体处理装置
CN105097405A (zh) * 2014-05-12 2015-11-25 东京毅力科创株式会社 等离子体处理装置和应用于等离子体处理装置的排气构造
KR20160091210A (ko) * 2015-01-22 2016-08-02 주식회사 원익아이피에스 기판지지대 및 그가 설치된 기판처리장치

Also Published As

Publication number Publication date
KR102121655B1 (ko) 2020-06-10
JP6969182B2 (ja) 2021-11-24
CN109216148A (zh) 2019-01-15
KR20190005750A (ko) 2019-01-16
CN109216148B (zh) 2021-01-19
TW201921483A (zh) 2019-06-01
JP2019016697A (ja) 2019-01-31

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