TWI751707B - Organic EL device - Google Patents

Organic EL device Download PDF

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TWI751707B
TWI751707B TW109131985A TW109131985A TWI751707B TW I751707 B TWI751707 B TW I751707B TW 109131985 A TW109131985 A TW 109131985A TW 109131985 A TW109131985 A TW 109131985A TW I751707 B TWI751707 B TW I751707B
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desiccant
substrate
sealing substrate
organic
space portion
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TW202139496A (en
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新山剛宏
井出慎司
江澤拓
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日商双葉電子工業股份有限公司
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
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Abstract

一實施形態之有機EL器件(1)具備:元件基板(2);元件(4),設置於元件基板(2)上;乾燥劑(7),設置於元件基板(2)上,並且覆蓋元件(4);及密封基板(3),相對於元件基板(2)對置配置,並且密封元件(4)。在乾燥劑(7)與密封基板(3)之間形成有空間部(10)。An organic EL device (1) according to an embodiment includes: an element substrate (2); an element (4) provided on the element substrate (2); and a desiccant (7) provided on the element substrate (2) and covering the element (4); and a sealing substrate (3), which is disposed opposite to the element substrate (2), and seals the element (4). A space portion (10) is formed between the desiccant (7) and the sealing substrate (3).

Description

有機EL器件Organic EL Devices

本掲示係有關一種有機EL器件。The present disclosure relates to an organic EL device.

一直以來,已知有將有機EL材料(EL:Electro-Luminescence(電致發光))用作發光物質之有機EL器件。有機EL器件具有有機EL元件。有機EL元件包含一對電極和夾在一對電極之間之有機EL材料。有機EL元件有時受水分的影響。在有機EL元件中,有時例如因水的附著而電極氧化或發生剝離。因此,在有機EL器件中,實施抑制水進入到有機EL元件中之各種對策。Conventionally, organic EL devices using an organic EL material (EL: Electro-Luminescence) as a light-emitting substance are known. The organic EL device has organic EL elements. The organic EL element includes a pair of electrodes and an organic EL material sandwiched between the pair of electrodes. Organic EL elements are sometimes affected by moisture. In the organic EL element, for example, the electrode may be oxidized or peeled due to adhesion of water. Therefore, in organic EL devices, various countermeasures are taken to suppress the entry of water into the organic EL element.

在專利文獻1中記載有一種使用捕水劑之有機電子器件。有機電子器件具備:元件基板,由玻璃基板構成;元件,形成於元件基板上;密封基板,與元件基板對置配置,並且覆蓋元件;及密封劑,將密封基板固定於元件基板。密封基板由擴孔加工玻璃形成。在藉由密封基板的擴孔加工而形成之凹部設置有捕水劑。如此,有機電子器件具備設置於密封基板的凹部之捕水劑。有機電子器件具有中空密封结構,在該中空密封结構中,以在元件基板上的元件與捕水劑之間形成有空間之狀態密封元件。Patent Document 1 describes an organic electronic device using a water scavenger. The organic electronic device includes: an element substrate formed of a glass substrate; an element formed on the element substrate; a sealing substrate disposed opposite the element substrate and covering the element; and a sealant for fixing the sealing substrate to the element substrate. The sealing substrate is formed of expanded glass. A water catching agent is provided in the concave portion formed by the hole expansion process of the sealing substrate. In this way, the organic electronic device includes the water scavenger provided in the concave portion of the sealing substrate. The organic electronic device has a hollow sealing structure in which the element is sealed in a state where a space is formed between the element on the element substrate and the water scavenger.

在專利文獻2中記載有有機EL元件。有機EL元件具備:元件基板;密封基板,與元件基板對置配置;及積層體,設置於元件基板上,並且藉由有機層被夾在一對電極之間而形成。在積層體與密封基板之間填充有填充劑,密封基板經由密封劑固定於元件基板。有機EL元件在內部不具有空間。有機EL元件具有填充密封结構,在該填充密封结構中,以在內部填充有作為乾燥劑發挥作用之填充劑之狀態密封積層體。In Patent Document 2, an organic EL element is described. The organic EL element includes: an element substrate; a sealing substrate arranged to face the element substrate; and a laminate provided on the element substrate and formed by sandwiching an organic layer between a pair of electrodes. A filler is filled between the laminate and the sealing substrate, and the sealing substrate is fixed to the element substrate via the sealing agent. The organic EL element has no space inside. The organic EL element has a filling and sealing structure in which the laminate is sealed in a state where a filler functioning as a desiccant is filled inside.

[專利文獻1]日本特開2012-38659號公報 [專利文獻2]日本特開2014-201574號公報[Patent Document 1] Japanese Patent Laid-Open No. 2012-38659 [Patent Document 2] Japanese Patent Laid-Open No. 2014-201574

前述有機電子器件具有中空密封结構,在該中空密封结構中,以在元件與捕水劑之間形成有空間之狀態密封元件。在中空密封结構中,元件基板上的元件暴露在形成於密封基板與元件基板之間之空間中。因此,從密封劑進入密封基板的內側之水分直接附著於元件,因此存在無法從水分充分保護元件之現狀。The aforementioned organic electronic device has a hollow sealing structure in which the element is sealed in a state where a space is formed between the element and the water catching agent. In the hollow sealing structure, the elements on the element substrate are exposed in the space formed between the sealing substrate and the element substrate. Therefore, the moisture that has entered the inner side of the sealing substrate from the sealant directly adheres to the element, and therefore, there is a situation in which the element cannot be sufficiently protected from the moisture.

前述有機EL元件具有填充密封结構,在該填充密封结構中,以在內部填充有乾燥劑之狀態密封元件。在填充密封结構中,從密封劑進入到密封基板的內側之水分附著於乾燥劑,因此可抑制水分直接附著於元件。然而,在填充密封结構中,乾燥劑相對於從密封劑進入之水分之有效面積小。亦即,在填充密封结構中,從密封劑進入之水分將要附著之乾燥劑的面積小。因此,在乾燥劑的有限之區域中進行捕水,因此存在無法充分有效利用乾燥劑之現狀。The aforementioned organic EL element has a filling and sealing structure in which the element is sealed in a state in which a desiccant is filled therein. In the filling and sealing structure, the moisture entering from the sealant to the inner side of the sealing substrate adheres to the desiccant, so that the direct adhesion of moisture to the element can be suppressed. However, in a fill seal structure, the effective area of the desiccant with respect to moisture entering from the sealant is small. That is, in the filling and sealing structure, the area of the desiccant to which the moisture entering from the sealant will adhere is small. Therefore, since water is captured in a limited area of the desiccant, there is a situation in which the desiccant cannot be fully utilized effectively.

在填充密封结構中,在乾燥劑的有限之區域中進行捕水,因此必須將填充於密封劑與元件之間之乾燥劑的區域確保為較寬。因此,必須將用於填充乾燥劑之空間確保為較寬。填充密封结構具有如下结構:在元件與密封基板之間未形成有空間,密封基板、乾燥劑及元件彼此密接。因此,在貼合等情況下受到外力時,該外力經由密封基板及乾燥劑傳遞到元件,因此存在因外力的影響而元件容易受損之問題。In the filling and sealing structure, the water is trapped in a limited area of the desiccant, so the area of the desiccant filled between the sealant and the element must be widened. Therefore, it is necessary to secure a wide space for filling the desiccant. The filling and sealing structure has a structure in which no space is formed between the element and the sealing substrate, and the sealing substrate, the desiccant, and the element are in close contact with each other. Therefore, when an external force is applied during bonding or the like, the external force is transmitted to the element via the sealing substrate and the desiccant, and thus there is a problem that the element is easily damaged due to the influence of the external force.

本掲示之目的在於提供一種能夠從水分充分保護元件,能夠充分有效利用乾燥劑,並且不易受外力的影響之有機EL器件。The purpose of this disclosure is to provide an organic EL device that can sufficiently protect the element from moisture, can fully and effectively utilize a desiccant, and is less susceptible to external forces.

本掲示之有機EL器件具備:元件基板;元件,設置於元件基板上;乾燥劑,設置於元件基板上,並且覆蓋元件;及密封基板,相對於元件基板對置配置,並且密封元件,在乾燥劑與密封基板之間形成有空間部。The organic EL device of the present disclosure includes: an element substrate; an element provided on the element substrate; a desiccant provided on the element substrate and covering the element; A space portion is formed between the agent and the sealing substrate.

在該有機EL器件中,設置於元件基板上之元件被乾燥劑覆蓋。因此,進入到密封基板的內側之水分附著於乾燥劑,因此能夠從水分保護元件。亦即,藉由元件被乾燥劑覆蓋,能夠避免水分直接附著於元件,因此能夠從水分充分保護元件。在密封基板的內側形成有空間部,該空間部設置於乾燥劑與密封基板之間。因此,藉由乾燥劑在密封基板的內側暴露於空間部,能夠將所進入之水分將要附著之乾燥劑的面積確保為較寬,因此能夠充分有效利用乾燥劑。而且,可以用少量的乾燥劑得到充分的捕水效果,因此能夠減小用於乾燥劑之空間。並且,藉由在密封基板與乾燥劑之間形成空間部,能夠使賦予到密封基板的外力难以傳遞到乾燥劑及元件,因此能夠提高對外力之耐性。因此,能夠使得不易受外力的影響。In this organic EL device, the element provided on the element substrate is covered with a desiccant. Therefore, the moisture that has entered the inner side of the sealing substrate adheres to the desiccant, so that the element can be protected from the moisture. That is, by covering the element with the desiccant, it is possible to prevent moisture from directly adhering to the element, so that the element can be sufficiently protected from moisture. A space portion is formed on the inner side of the sealing substrate, and the space portion is provided between the desiccant and the sealing substrate. Therefore, by exposing the desiccant to the space portion on the inner side of the sealing substrate, the area of the desiccant to which the incoming moisture adheres can be secured to be wide, and thus the desiccant can be fully utilized. Furthermore, a sufficient water trapping effect can be obtained with a small amount of the desiccant, so that the space for the desiccant can be reduced. In addition, by forming a space portion between the sealing substrate and the desiccant, the external force applied to the sealing substrate can be less likely to be transmitted to the desiccant and the element, so that the resistance to the external force can be improved. Therefore, it is possible to make it less susceptible to external force.

密封基板可以由金屬製成。在該情況下,能夠使水分难以向密封基板的內側通過,並且能夠提高作為密封基板之強度。並且,由金屬製成之密封基板具有撓性,因此能夠提高對彎曲之耐性。另外,當密封基板由金屬製成時,能夠藉由拉深(drawing)加工來成型密封基板的內表面,因此能夠減少加工等中所花費之成本。The sealing substrate may be made of metal. In this case, it is possible to make it difficult for moisture to pass through to the inside of the sealing substrate, and the strength as a sealing substrate can be improved. Furthermore, since the sealing substrate made of metal has flexibility, the resistance to bending can be improved. In addition, when the sealing substrate is made of metal, the inner surface of the sealing substrate can be molded by drawing processing, so that the cost incurred in processing and the like can be reduced.

密封基板的厚度可以為10μm以上且100μm以下。在該情況下,藉由密封基板的厚度為10μm以上,能夠確保密封基板的強度,因此在進行加工等時能夠避免在密封基板中形成孔。藉由密封基板的厚度為100μm以下,能夠避免密封基板變得過硬,因此能夠輕鬆地進行密封基板的加工。The thickness of the sealing substrate may be 10 μm or more and 100 μm or less. In this case, since the strength of the sealing substrate can be ensured by making the thickness of the sealing substrate 10 μm or more, it is possible to avoid the formation of holes in the sealing substrate during processing or the like. Since the thickness of the sealing substrate is 100 μm or less, the sealing substrate can be prevented from becoming too hard, so that the processing of the sealing substrate can be easily performed.

空間部的厚度可以為5μm以上。在該情況下,藉由空間部的厚度為5μm以上,能夠使進入到密封基板的內側之水分充分擴散於空間部。因此,能夠用乾燥劑更可靠地進行捕水,能夠更充分地有效利用乾燥劑。藉由空間部的厚度為5μm以上,能夠使外力难以進一步傳遞到乾燥劑及元件,因此有助於進一步提高強度。The thickness of the space portion may be 5 μm or more. In this case, since the thickness of the space portion is 5 μm or more, it is possible to sufficiently diffuse the moisture entering the inner side of the sealing substrate into the space portion. Therefore, the desiccant can more reliably capture water, and the desiccant can be used more effectively. When the thickness of the space portion is 5 μm or more, it is possible to make it difficult for the external force to be further transmitted to the desiccant and the element, thereby contributing to further improvement of the strength.

乾燥劑可以包含鹼土金屬和硬化性樹脂。在該情況下,藉由乾燥劑包含硬化性樹脂,能夠使乾燥劑進行硬化。藉由乾燥劑包含鹼土金屬,能夠提高對進入到密封基板的內側之水分的作為乾燥劑之捕水性。另外,能夠延長乾燥劑的壽命。 [發明效果]The desiccant may contain alkaline earth metals and hardening resins. In this case, when the desiccant contains a curable resin, the desiccant can be cured. When the desiccant contains an alkaline earth metal, it is possible to improve the water-capturing ability of the desiccant for the moisture that has entered the inner side of the sealing substrate. In addition, the life of the desiccant can be extended. [Inventive effect]

依本掲示,能夠從水分充分保護元件,能夠充分有效利用乾燥劑,並且能夠使得不易受外力的影響。According to the present disclosure, the element can be sufficiently protected from moisture, the desiccant can be effectively utilized, and it can be made less susceptible to external forces.

以下,參閱圖式對本掲示之有機EL器件的實施形態進行說明。在圖式的說明中,對相同或相當的要件標註相同之符號,並適當地省略重複說明。為了易於理解,圖式中有時將一部分簡化或誇張地描繪,尺寸比率等並不限定於圖式中所記載之尺寸比率者。Hereinafter, embodiments of the organic EL device of the present disclosure will be described with reference to the drawings. In the description of the drawings, the same or equivalent elements are denoted by the same symbols, and overlapping descriptions are appropriately omitted. In the drawings, a part of the drawings may be simplified or exaggerated for easy understanding, and dimensional ratios and the like are not limited to those described in the drawings.

本掲示之有機EL器件例如可以為無源驅動型且透視型的顯示裝置。在該情況下,有機EL器件能夠在兩面發光。然而,本掲示之有機EL器件亦可以為有源驅動方式的發光裝置。作為發光裝置,例如可以舉出為了對感光媒體進行曝光而發光之光學打印頭、以照明用發光之照明裝置、或進行標識顯示或顯示段圖案(segment pattern)之顯示裝置。本掲示之有機EL器件的形狀並不受特別限定。在本實施形態中,對呈矩形之有機EL器件1進行說明。The organic EL device of the present disclosure can be, for example, a passively driven and see-through display device. In this case, the organic EL device can emit light on both sides. However, the organic EL device of the present disclosure can also be an active-driven light-emitting device. Examples of the light emitting device include an optical print head that emits light for exposing a photosensitive medium, an illuminating device that emits light for illumination, and a display device that displays a mark or a segment pattern. The shape of the organic EL device disclosed herein is not particularly limited. In this embodiment, a rectangular organic EL device 1 will be described.

圖1係表示本實施形態之有機EL器件1的圖。圖2係有機EL器件1的剖面圖。如圖1及圖2所示,有機EL器件1具備元件基板2和積層於元件基板2之密封基板3,在元件基板2上沿著積層方向D1積層有密封基板3。有機EL器件1例如具備設置於元件基板2之元件4、從元件基板2與密封基板3之間沿著第1方向D2延伸之配線部5、將密封基板3固定於元件基板2之接著劑6及覆蓋元件4之乾燥劑7。FIG. 1 is a diagram showing an organic EL device 1 of the present embodiment. FIG. 2 is a cross-sectional view of the organic EL device 1 . As shown in FIGS. 1 and 2 , the organic EL device 1 includes an element substrate 2 and a sealing substrate 3 stacked on the element substrate 2 , and the sealing substrate 3 is stacked on the element substrate 2 along the stacking direction D1 . The organic EL device 1 includes, for example, an element 4 provided on the element substrate 2 , a wiring portion 5 extending along the first direction D2 from between the element substrate 2 and the sealing substrate 3 , and an adhesive 6 for fixing the sealing substrate 3 to the element substrate 2 . and the desiccant 7 covering the element 4 .

有機EL器件1具備設置於元件基板2的積體電路8和撓性印刷電路板(FPC:Flexible Print Circuit)9。在本掲示中,“覆蓋元件”係表示包覆元件者與該元件的至少一部分接觸,以避免元件的該一部分暴露。“覆蓋元件”包括覆蓋整個元件之情況及覆蓋元件的一部分之情況這兩種情況。The organic EL device 1 includes an integrated circuit 8 and a flexible printed circuit (FPC: Flexible Print Circuit) 9 provided on the element substrate 2 . In the present disclosure, "covering an element" means that one that covers the element is in contact with at least a portion of the element so as to prevent the portion of the element from being exposed. "Covering an element" includes both the case of covering the entire element and the case of covering a part of the element.

第1方向D2表示配線部5從元件基板2伸出之方向,例如與積層方向D1交叉(作為一例,正交)。在以下的說明中,將與積層方向D1及第1方向D2這兩者交叉(作為一例,正交)之方向作為第2方向D3而進行說明。然而,該些方向係為了便於說明者,並不限定各組件的形狀或配置的方向等。The first direction D2 represents the direction in which the wiring portion 5 protrudes from the element substrate 2 , and intersects (for example, orthogonal to) the build-up direction D1 , for example. In the following description, the direction which intersects (as an example, orthogonal to) both the lamination direction D1 and the first direction D2 will be described as the second direction D3. However, these directions are for convenience of description, and do not limit the shape of each component, the direction of arrangement, and the like.

在元件基板2上設置有元件4及配線部5。例如,元件基板2由玻璃製成。作為用於元件基板2的玻璃,可以舉出無鹼玻璃或鈉鈣玻璃。然而,元件基板2亦可以為由撓性材料(作為一例,塑膠材料)構成之薄膜狀基板。作為薄膜狀基板的材料,例如可以舉出聚對苯二甲酸乙二酯(PET)、聚萘二甲酸乙二醇酯(PEN)或聚醯亚胺。The element 4 and the wiring portion 5 are provided on the element substrate 2 . For example, the element substrate 2 is made of glass. As glass used for the element substrate 2, alkali-free glass or soda lime glass can be mentioned. However, the element substrate 2 may also be a thin-film substrate made of a flexible material (for example, a plastic material). As a material of a film-form board|substrate, polyethylene terephthalate (PET), polyethylene naphthalate (PEN), or polyimide is mentioned, for example.

元件基板2可以為玻璃基板或薄板玻璃,亦可以為樹脂薄膜,元件基板2的材料並不受特別限定。元件基板2可以具有透光性。例如,從積層方向D1觀察之元件基板2的形狀呈長方形。元件基板2例如具有沿第1方向D2延伸之一對長邊2b和沿第2方向D3延伸之一對短邊2c。元件基板2的厚度T6例如為10μm以上且50μm以下。然而,厚度T6的值並不限定於上述例。The element substrate 2 may be a glass substrate, a thin plate glass, or a resin film, and the material of the element substrate 2 is not particularly limited. The element substrate 2 may have light transmittance. For example, the shape of the element substrate 2 viewed from the build-up direction D1 is a rectangle. The element substrate 2 has, for example, a pair of long sides 2b extending in the first direction D2 and a pair of short sides 2c extending in the second direction D3. The thickness T6 of the element substrate 2 is, for example, 10 μm or more and 50 μm or less. However, the value of the thickness T6 is not limited to the above example.

密封基板3以與元件基板2對置配置之方式設置。從積層方向D1觀察之密封基板3的形狀呈長方形。密封基板3例如與元件基板2同樣具有沿第1方向D2延伸之一對長邊3g和沿第2方向D3延伸之短邊3h。例如,密封基板3的長邊3g的長度短於元件基板2的長邊2b的長度。因此,在密封基板3固定於元件基板2的狀態下,元件基板2的一部分從密封基板3暴露。例如,元件基板2的第1方向D2的一側暴露,在元件基板2的該暴露的部分設置有積體電路8、配線部5及FPC9。The sealing substrate 3 is provided so as to be opposed to the element substrate 2 . The shape of the sealing substrate 3 viewed from the lamination direction D1 is a rectangle. The sealing substrate 3 has, for example, a pair of long sides 3g extending in the first direction D2 and a short side 3h extending in the second direction D3 similarly to the element substrate 2 . For example, the length of the long side 3 g of the sealing substrate 3 is shorter than the length of the long side 2 b of the element substrate 2 . Therefore, in a state where the sealing substrate 3 is fixed to the element substrate 2 , a part of the element substrate 2 is exposed from the sealing substrate 3 . For example, one side of the element substrate 2 in the first direction D2 is exposed, and the integrated circuit 8 , the wiring portion 5 , and the FPC 9 are provided in the exposed portion of the element substrate 2 .

密封基板3例如由金屬製成。作為一例,密封基板3由SUS(不銹鋼)構成。在該情況下,能夠將SUS用作密封基板3的撓性材料。當密封基板3由薄膜狀的SUS基板形成時,能夠提高密封基板3的撓性。當元件基板2及密封基板3均由撓性材料構成時,能夠製成撓性的有機EL器件1。然而,密封基板3的材料亦可以為與SUS不同之金屬材料。密封基板3的材料例如亦可以為因鋼(Invar,鎳與鐵的合金)、鋁、鎳或鐵。The sealing substrate 3 is made of metal, for example. As an example, the sealing substrate 3 is made of SUS (stainless steel). In this case, SUS can be used as the flexible material of the sealing substrate 3 . When the sealing substrate 3 is formed of a film-like SUS substrate, the flexibility of the sealing substrate 3 can be improved. When both the element substrate 2 and the sealing substrate 3 are made of a flexible material, the flexible organic EL device 1 can be produced. However, the material of the sealing substrate 3 may be a metal material different from SUS. The material of the sealing substrate 3 may be, for example, Invar (Invar, an alloy of nickel and iron), aluminum, nickel, or iron.

密封基板3亦可以由金屬以外的材料構成。例如,密封基板3可以由玻璃製成或由塑膠製成。密封基板3的材料可以與元件基板2的材料相同,亦可以與元件基板2的材料不同。密封基板3可以具有透光性。密封基板3在與元件基板2對置之主面3b具有向遠離元件基板2之方向凹陷之凹部3c。The sealing substrate 3 may be formed of a material other than metal. For example, the sealing substrate 3 may be made of glass or plastic. The material of the sealing substrate 3 may be the same as the material of the element substrate 2 or may be different from the material of the element substrate 2 . The sealing substrate 3 may have light transmittance. The sealing substrate 3 has a concave portion 3 c recessed in a direction away from the element substrate 2 on the principal surface 3 b facing the element substrate 2 .

當從積層方向D1觀察時,凹部3c形成於包括密封基板3的中央之區域。從積層方向D1觀察之凹部3c的形狀例如為長方形。凹部3c具有沿第1方向D2延伸之長邊3d和沿第2方向D3延伸之短邊3f。當密封基板3由金屬製成時,密封基板3的凹部3c例如藉由拉深加工來形成。在該情況下,能夠減少密封基板3的製作中所花費之成本。當密封基板3由玻璃製成時,凹部3c例如藉由蝕刻加工或擴孔加工來形成。The concave portion 3 c is formed in a region including the center of the sealing substrate 3 when viewed from the build-up direction D1 . The shape of the recessed part 3c seen from the lamination direction D1 is, for example, a rectangle. The concave portion 3c has a long side 3d extending in the first direction D2 and a short side 3f extending in the second direction D3. When the sealing substrate 3 is made of metal, the concave portion 3c of the sealing substrate 3 is formed by, for example, drawing. In this case, the cost incurred in the production of the sealing substrate 3 can be reduced. When the sealing substrate 3 is made of glass, the concave portion 3c is formed by, for example, etching or hole expansion.

密封基板3的形成有凹部3c之部分的厚度(例如,積層方向D1的長度)T1例如為10μm以上且100μm以下。厚度T1的下限可以為15μm或20μm。厚度T1的上限可以為50μm、35μm或30μm。作為一例,厚度T1為15μm以上且35μm以下。在該情況下,能夠更可靠地维持密封基板3的強度,並且能夠避免水從密封基板3向密封基板3的內側通過。The thickness (for example, the length in the build-up direction D1 ) T1 of the portion of the sealing substrate 3 where the concave portion 3 c is formed is, for example, 10 μm or more and 100 μm or less. The lower limit of the thickness T1 may be 15 μm or 20 μm. The upper limit of the thickness T1 may be 50 μm, 35 μm or 30 μm. As an example, the thickness T1 is 15 μm or more and 35 μm or less. In this case, the strength of the sealing substrate 3 can be more reliably maintained, and the passage of water from the sealing substrate 3 to the inside of the sealing substrate 3 can be avoided.

凹部3c的深度T2例如為10μm以上且200μm以下。當密封基板3被拉深加工時,深度T2相當於密封基板3的拉深深度。深度T2的上限可以為100μm。深度T2的下限可以為15μm或20μm。然而,前述厚度T1及深度T2的值並不限於上述各例,可以適當地進行變更。The depth T2 of the recessed portion 3c is, for example, 10 μm or more and 200 μm or less. When the sealing substrate 3 is drawn, the depth T2 corresponds to the drawing depth of the sealing substrate 3 . The upper limit of the depth T2 may be 100 μm. The lower limit of the depth T2 may be 15 μm or 20 μm. However, the values of the aforementioned thickness T1 and depth T2 are not limited to the above-described examples, and may be appropriately changed.

元件4例如為藉由供給電流而發光之有機EL元件部。元件4設置於與密封基板3對置之元件基板2的主面2d。元件4設置於被元件基板2、密封基板3及接著劑6包圍之區域A。在元件4上例如設置有配置成矩阵狀之複數個有機EL元件4b和陰極分離層(未圖示)。The element 4 is, for example, an organic EL element portion that emits light by supplying a current. The element 4 is provided on the main surface 2 d of the element substrate 2 facing the sealing substrate 3 . The element 4 is provided in the area A surrounded by the element substrate 2 , the sealing substrate 3 and the adhesive 6 . On the element 4, for example, a plurality of organic EL elements 4b arranged in a matrix and a cathode separation layer (not shown) are provided.

各有機EL元件4b例如為具有陽極、陰極及夾持於陽極與陰極之間之有機發光層的發光元件。例如,在元件基板2的主面2d形成有有機EL元件4b的陽極。在該陽極上依序形成有有機EL元件4b的有機發光層及陰極。作為有機EL元件4b的陽極的材料,例如可以舉出ITO(銦錫氧化物)或IZO(銦鋅氧化物)等具有透光性之材料。Each organic EL element 4b is, for example, a light-emitting element having an anode, a cathode, and an organic light-emitting layer sandwiched between the anode and the cathode. For example, the anode of the organic EL element 4b is formed on the main surface 2d of the element substrate 2 . The organic light-emitting layer and the cathode of the organic EL element 4b are sequentially formed on the anode. As a material of the anode of the organic EL element 4b, the material which has translucency, such as ITO (indium tin oxide) and IZO (indium zinc oxide), is mentioned, for example.

有機EL元件4b的有機發光層除了包含發光材料之發光層以外,還可以具有電子注入層、電子傳輸層、電洞傳輸層及電洞注入層。該有機發光層的發光材料可以為低分子有機化合物,亦可以為高分子有機化合物。作為該發光材料,可以使用熒光材料,亦可以使用磷光材料。作為構成有機EL元件4b的陰極的導電層之材料(導電材料),例如可以使用鋁、銀、鹼土金屬(鎂、鈣等)或IZO(銦鋅氧化物)等具有透光性之材料。當向密封基板3側射出光時,陰極可以設定為具有透光性之厚度。The organic light-emitting layer of the organic EL element 4b may have an electron injection layer, an electron transport layer, a hole transport layer, and a hole injection layer in addition to the light-emitting layer containing the light-emitting material. The light-emitting material of the organic light-emitting layer may be a low molecular organic compound or a high molecular organic compound. As the light-emitting material, a fluorescent material or a phosphorescent material may be used. As the material (conductive material) of the conductive layer constituting the cathode of the organic EL element 4b, for example, a translucent material such as aluminum, silver, alkaline earth metals (magnesium, calcium, etc.) or IZO (indium zinc oxide) can be used. When light is emitted to the sealing substrate 3 side, the cathode can be set to have a thickness that is light-transmitting.

配線部5例如可以包括設置有複數個佈置配線之部分。配線部5在元件4與積體電路8之間包括將元件4及積體電路8彼此連接之配線。配線部5可以在積體電路8與FPC9之間包括將積體電路8及FPC9彼此連接之配線。配線部5可以與元件4的有機EL元件4b的陽極或陰極一起形成。配線部5所包括之佈置配線例如由單一或積層之金屬層構成。在該佈置配線的表面上例如可以設置有氧化矽膜或氮化矽膜等阻擋膜。The wiring portion 5 may include, for example, a portion provided with a plurality of wirings. The wiring portion 5 includes wiring between the element 4 and the integrated circuit 8 for connecting the element 4 and the integrated circuit 8 to each other. The wiring portion 5 may include wiring between the integrated circuit 8 and the FPC 9 to connect the integrated circuit 8 and the FPC 9 to each other. The wiring portion 5 may be formed together with the anode or the cathode of the organic EL element 4 b of the element 4 . The arrangement wiring included in the wiring portion 5 is composed of, for example, a single metal layer or a laminated metal layer. A barrier film such as a silicon oxide film or a silicon nitride film may be provided on the surface on which the wirings are arranged, for example.

圖3係沿著積層方向D1觀察元件基板2、密封基板3、元件4、接著劑6及乾燥劑7之示意性的III-III線剖面圖。如圖2及圖3所示,接著劑6例如為密封元件基板2與密封基板3之間的區域A之密封層。接著劑6作為用於確定區域A之側壁發挥作用。接著劑6在元件基板2的主面2d與密封基板3的主面3b之間設置成框狀。FIG. 3 is a schematic cross-sectional view taken along the line III-III of the element substrate 2 , the sealing substrate 3 , the element 4 , the adhesive 6 , and the desiccant 7 when viewed along the build-up direction D1 . As shown in FIGS. 2 and 3 , the adhesive 6 is, for example, a sealing layer for sealing the region A between the element substrate 2 and the sealing substrate 3 . The agent 6 then acts as a side wall for defining the area A. The adhesive agent 6 is provided in a frame shape between the main surface 2d of the element substrate 2 and the main surface 3b of the sealing substrate 3 .

例如,接著劑6可以覆蓋配線部5的佈置配線的一部分。作為一例,接著劑6呈從積層方向D1觀察時沿著主面2d的邊緣區域2f延伸之矩形框狀。邊緣區域2f為包括元件基板2的長邊2b及短邊2c的區域,邊緣區域2f的寬度W例如為1mm以上且2mm以下。然而,寬度W的值並不限於上述例,可以適當地進行變更。例示性的接著劑6包含紫外線硬化樹脂。作為一例,接著劑6可以為包含二氧化矽粒子的間隔物。For example, the adhesive 6 may cover a part of the arrangement wiring of the wiring portion 5 . As an example, the adhesive 6 has a rectangular frame shape extending along the edge region 2f of the main surface 2d when viewed in the lamination direction D1. The edge region 2f is a region including the long side 2b and the short side 2c of the element substrate 2, and the width W of the edge region 2f is, for example, 1 mm or more and 2 mm or less. However, the value of the width W is not limited to the above example, and can be appropriately changed. Exemplary adhesive 6 includes UV curable resin. As an example, the adhesive 6 may be a spacer including silica particles.

乾燥劑7覆蓋配置於元件基板2的主面2d上之元件4。乾燥劑7從積層方向D1、第1方向D2及第2方向D3覆蓋元件4。例如,元件4在元件基板2上不具有暴露之部位。乾燥劑7與元件4直接接觸,例如覆蓋整個元件4。在乾燥劑7的與元件4相反之一側設置有空間部10。空間部10介於密封基板3與乾燥劑7之間。The desiccant 7 covers the element 4 arranged on the main surface 2 d of the element substrate 2 . The desiccant 7 covers the element 4 from the lamination direction D1, the first direction D2, and the second direction D3. For example, the element 4 has no exposed portion on the element substrate 2 . The desiccant 7 is in direct contact with the element 4 , eg covers the entire element 4 . A space portion 10 is provided on the opposite side of the desiccant 7 from the element 4 . The space portion 10 is interposed between the sealing substrate 3 and the desiccant 7 .

乾燥劑7例如包含硬化性樹脂。乾燥劑7可以為液體狀,亦可以為凝膠狀。乾燥劑7例如為塗佈於元件4的塗佈型乾燥劑。乾燥劑7可以包含對元件4之化學損傷少的樹脂。乾燥劑7可以包含硬化後應力小的樹脂。在該情況下,能夠減少随著塗佈乾燥劑7而產生之對元件4之影響。The drying agent 7 contains, for example, a curable resin. The desiccant 7 may be liquid or gel. The desiccant 7 is, for example, a coating-type desiccant applied to the element 4 . The desiccant 7 may contain a resin with little chemical damage to the element 4 . The desiccant 7 may contain resin with low stress after hardening. In this case, the influence on the element 4 caused by the application of the drying agent 7 can be reduced.

乾燥劑7例如包含複數種硬化性樹脂。在該情況下,藉由包含複數種硬化性樹脂作為乾燥劑7的基础材料,能夠輕鬆地調整乾燥劑7的黏度。作為一例,乾燥劑7可以包含粉末乾燥劑。乾燥劑7的該粉末的粒徑例如為0.1μm以上且2.0μm以下。然而,乾燥劑7的粉末的粒徑並不限定於上述值。The drying agent 7 contains, for example, a plurality of curable resins. In this case, the viscosity of the desiccant 7 can be easily adjusted by including a plurality of types of curable resins as the base material of the desiccant 7 . As an example, the desiccant 7 may contain a powder desiccant. The particle size of the powder of the drying agent 7 is, for example, 0.1 μm or more and 2.0 μm or less. However, the particle size of the powder of the desiccant 7 is not limited to the above-mentioned value.

作為構成乾燥劑7之粉末乾燥劑,例如可以舉出包含無機化合物之乾燥劑。作為乾燥劑7中所包含之無機化合物,例如可以舉出鹼土金屬的氧化物。該鹼土金屬的氧化物例如包含氧化鍶(SrO)、氧化鈣(CaO)、氧化鎂(MgO)及氧化鋇(BaO)中的至少任一種。As a powder desiccant which comprises the desiccant 7, the desiccant containing an inorganic compound is mentioned, for example. As an inorganic compound contained in the drying agent 7, the oxide of an alkaline earth metal is mentioned, for example. The oxide of the alkaline earth metal includes, for example, at least any one of strontium oxide (SrO), calcium oxide (CaO), magnesium oxide (MgO), and barium oxide (BaO).

乾燥劑7可以包含SrO及CaO中的任一種,亦可以包含SrO及CaO這兩種。若比較SrO和CaO,則SrO具有捕水速度比CaO快的優點。另一方面,CaO具有所捕獲之水分M的容量大且壽命長的優點。因此,當乾燥劑7包含SrO和CaO這兩種時,能夠提高捕水速度,並且確保所捕獲之水分M的容量來延長作為乾燥劑7之壽命。The desiccant 7 may contain any one of SrO and CaO, or may contain both of SrO and CaO. Comparing SrO and CaO, SrO has the advantage of faster water capture rate than CaO. On the other hand, CaO has the advantages of a large capacity of the captured moisture M and a long life. Therefore, when the desiccant 7 contains both SrO and CaO, the water capturing speed can be increased, and the capacity of the captured moisture M can be ensured to prolong the life of the desiccant 7 .

當乾燥劑7包含SrO及CaO這兩種時,SrO與CaO的質量的比率例如為7:3。在該情況下,能夠適當地發挥SrO的捕水的高速性、以及利用CaO確保捕水容量及確保壽命之效果。然而,SrO與CaO的質量的比率例如亦可以為8:2或5:5等,可以適當地進行變更。When the desiccant 7 contains both SrO and CaO, the mass ratio of SrO and CaO is, for example, 7:3. In this case, the high speed of water capture by SrO, and the effects of securing water capture capacity and life by CaO can be appropriately exerted. However, the mass ratio of SrO and CaO may be, for example, 8:2, 5:5, or the like, and may be appropriately changed.

乾燥劑7的粉末SrO(或CaO)的濃度例如為70wt%以上。然而,該濃度可以為65wt%以上,亦可以為60wt%以上。在該情況下,能夠適度提高乾燥劑7的捕水速度及捕水容量。另外,乾燥劑7可以包含將金屬醇鹽作為捕水成分之液體狀乾燥劑,亦可以包含有機金屬。作為構成乾燥劑7之有機金屬,例如可以舉出鋁、鈦或鎂。當乾燥劑7包含有機金屬時,能夠提高捕水速度來進行更高效的捕水。如以上那樣例示之凝膠狀或液體狀的乾燥劑7以覆蓋元件基板2上的元件4之方式塗佈於元件4而以硬化之狀態密接於元件4。The concentration of powdered SrO (or CaO) in the drying agent 7 is, for example, 70 wt % or more. However, the concentration may be 65 wt % or more, or 60 wt % or more. In this case, the water-capturing speed and the water-capturing capacity of the desiccant 7 can be appropriately increased. In addition, the desiccant 7 may contain a liquid desiccant containing a metal alkoxide as a water capturing component, or may contain an organic metal. As the organometal constituting the desiccant 7, for example, aluminum, titanium, or magnesium can be mentioned. When the desiccant 7 contains an organometal, the water capture rate can be increased to perform more efficient water capture. The gel-like or liquid-like desiccant 7 exemplified above is applied to the element 4 so as to cover the element 4 on the element substrate 2 and adheres to the element 4 in a hardened state.

如上所述,在乾燥劑7與密封基板3之間形成有空間部10。空間部10例如包括位於乾燥劑7的積層方向D1側之第1空間部11、位於乾燥劑7與接著劑6之間之第2空間部12及與密封基板3的凹部3c的角部3j對置之第3空間部13。第1空間部11形成於密封基板3的主面3b與乾燥劑7的朝向積層方向D1的面7b之間。第2空間部12形成於接著劑6的朝向元件4側的內表面6b與乾燥劑7的側面7c之間。第3空間部13為設置於乾燥劑7的斜上方的區域,形成於乾燥劑7與凹部3c的角部3j之間。As described above, the space portion 10 is formed between the desiccant 7 and the sealing substrate 3 . The space portion 10 includes, for example, a first space portion 11 located on the side of the desiccant 7 in the lamination direction D1 , a second space portion 12 located between the desiccant 7 and the adhesive 6 , and a pair of corners 3j of the concave portion 3c of the sealing substrate 3 . Set aside the third space portion 13 . The first space portion 11 is formed between the main surface 3b of the sealing substrate 3 and the surface 7b of the desiccant 7 that faces the lamination direction D1. The second space portion 12 is formed between the inner surface 6b of the adhesive 6 facing the element 4 side and the side surface 7c of the desiccant 7 . The third space portion 13 is an area provided obliquely above the desiccant 7 , and is formed between the desiccant 7 and the corner portion 3j of the recessed portion 3c.

當從積層方向D1觀察時,第1空間部11形成於與乾燥劑7重疊之區域。當從積層方向D1觀察時,第1空間部11例如形成為矩形。第1空間部11在積層方向D1上具有厚度。然而,由於乾燥劑7具有粉末成分,因此在乾燥劑7的積層方向D1側的面7b形成有凹凸,有時面7b的一部分與密封基板3的主面3b接觸。The 1st space part 11 is formed in the area|region which overlaps with the desiccant 7 when it sees from the lamination direction D1. The first space portion 11 is formed, for example, in a rectangular shape when viewed from the stacking direction D1. The first space portion 11 has a thickness in the lamination direction D1. However, since the desiccant 7 has a powder component, unevenness is formed on the surface 7b of the desiccant 7 on the lamination direction D1 side, and a part of the surface 7b may come into contact with the main surface 3b of the sealing substrate 3 .

積層方向D1的第1空間部11的厚度T3由密封基板3的凹部3c的深度T2、接著劑6的積層方向D1的厚度T4及乾燥劑7的積層方向D1的厚度T5來決定。如上所述,凹部3c的深度T2例如為10μm以上且200μm以下。例如,第1空間部11的厚度T3為5μm以上。厚度T3的上限例如為250μm或100μm。The thickness T3 of the first space 11 in the lamination direction D1 is determined by the depth T2 of the recess 3c of the sealing substrate 3, the thickness T4 of the adhesive 6 in the lamination direction D1, and the thickness T5 of the desiccant 7 in the lamination direction D1. As described above, the depth T2 of the recessed portion 3c is, for example, 10 μm or more and 200 μm or less. For example, the thickness T3 of the first space portion 11 is 5 μm or more. The upper limit of the thickness T3 is, for example, 250 μm or 100 μm.

厚度T3可以為從形成於乾燥劑7的面7b之凹凸至密封基板3的主面3b為止的距離的平均值。厚度T3可以為8μm以上或10μm以上。作為一例,當接著劑6的厚度T4為20μm、深度T2為10μm以上且200μm以下時,乾燥劑7的厚度T5為25μm以上且215μm以下。然而,深度T2、厚度T3、厚度T4及厚度T5各自的值可以適當地進行變更。The thickness T3 may be the average value of the distances from the unevenness formed on the surface 7b of the desiccant 7 to the main surface 3b of the sealing substrate 3 . The thickness T3 may be 8 μm or more or 10 μm or more. As an example, when the thickness T4 of the adhesive 6 is 20 μm and the depth T2 is 10 μm or more and 200 μm or less, the thickness T5 of the drying agent 7 is 25 μm or more and 215 μm or less. However, the respective values of the depth T2, the thickness T3, the thickness T4, and the thickness T5 can be appropriately changed.

當從積層方向D1觀察時,第2空間部12及第3空間部13設置於第1空間部11的外側。當從積層方向D1觀察時,第2空間部12及第3空間部13呈包圍第1空間部11之框狀。第3空間部13從第2空間部12觀察時設置於與元件基板2相反之一側(例如,在圖2中為上側),位於接著劑6的斜上方。如以上,藉由形成第1空間部11、第2空間部12及第3空間部13,在乾燥劑7與密封基板3之間及乾燥劑7與接著劑6之間形成水分M的路徑L。The second space portion 12 and the third space portion 13 are provided outside the first space portion 11 when viewed from the stacking direction D1 . The second space portion 12 and the third space portion 13 have a frame shape surrounding the first space portion 11 when viewed from the stacking direction D1. The third space portion 13 is provided on the opposite side (eg, the upper side in FIG. 2 ) from the element substrate 2 when viewed from the second space portion 12 , and is positioned obliquely above the adhesive 6 . As described above, by forming the first space portion 11 , the second space portion 12 and the third space portion 13 , the path L of the moisture M is formed between the desiccant 7 and the sealing substrate 3 and between the desiccant 7 and the adhesive 6 . .

設想水分M從密封基板3及接著劑6的外部進入到空間部10之情況。在本實施形態中,水分M通過接著劑6進入到空間部10,從接著劑6進入之水分M進入到第2空間部12,並經由第3空間部13到達第1空間部11。例如,在第1空間部11,水分M沿第1方向D2及第2方向D3這兩個方向傳播及擴散,在傳播及擴散的期間被乾燥劑7捕獲。圖2的乾燥劑7的色彩深的部分7d示意性地示出乾燥劑7所捕水之部分。水分M不仅從第1空間部11接觸乾燥劑7,還從第2空間部12及第3空間部13接觸乾燥劑7,因此乾燥劑7能夠在寬面積中捕獲所進入之水分M。It is assumed that the moisture M enters the space portion 10 from the outside of the sealing substrate 3 and the adhesive 6 . In the present embodiment, the moisture M enters the space portion 10 through the adhesive 6 , the moisture M entered from the adhesive 6 enters the second space portion 12 , and reaches the first space portion 11 via the third space portion 13 . For example, in the first space portion 11 , the moisture M propagates and diffuses in both the first direction D2 and the second direction D3 , and is captured by the desiccant 7 during propagation and diffusion. The dark-colored portion 7d of the desiccant 7 in FIG. 2 schematically shows a portion where the desiccant 7 captures water. The moisture M contacts the desiccant 7 not only from the first space 11 but also from the second space 12 and the third space 13 , so that the desiccant 7 can capture the entered moisture M in a wide area.

接著,對從本實施形態之有機EL器件1得到之作用效果進行詳細說明。在有機EL器件1中,設置於元件基板2上之元件4被乾燥劑7覆蓋。因此,進入到密封基板3的內側之水分M附著於乾燥劑7,因此能夠從水分M保護元件4。在本實施形態中,乾燥劑7直接形成於元件4,因此進入到密封基板3的內側之水分M不會與元件4直接接觸。Next, the effects obtained from the organic EL device 1 of the present embodiment will be described in detail. In the organic EL device 1 , the element 4 provided on the element substrate 2 is covered with the desiccant 7 . Therefore, the moisture M that has entered the inner side of the sealing substrate 3 adheres to the desiccant 7 , so that the element 4 can be protected from the moisture M. In the present embodiment, since the desiccant 7 is formed directly on the element 4 , the moisture M entering the inner side of the sealing substrate 3 does not directly contact the element 4 .

因此,利用乾燥劑7能夠從包含水分M的異物保護元件4,因此能夠更有效地抑制随著水分M附著於元件4而產生之從元件4的緣部的發光不良(發光收縮)。因此,能夠實現包括元件4之有機EL器件1的長壽命化。在密封基板3的內側形成有空間部10,空間部10設置於乾燥劑7與密封基板3之間。因此,藉由乾燥劑7在密封基板3的內側暴露於空間部10,能夠將所進入之水分M將要附著之乾燥劑7的面積確保為較寬,因此能夠充分有效利用乾燥劑7。Therefore, the element 4 can be protected from the foreign matter containing the moisture M by the desiccant 7 , and therefore, poor light emission (light emission shrinkage) from the edge of the element 4 caused by the adhesion of the moisture M to the element 4 can be more effectively suppressed. Therefore, it is possible to achieve a longer lifetime of the organic EL device 1 including the element 4 . A space portion 10 is formed inside the sealing substrate 3 , and the space portion 10 is provided between the desiccant 7 and the sealing substrate 3 . Therefore, by exposing the desiccant 7 to the space portion 10 inside the sealing substrate 3 , the area of the desiccant 7 to which the incoming moisture M adheres can be secured to be wide, so that the desiccant 7 can be fully utilized.

可以用少量的乾燥劑7得到充分的捕水效果,因此能夠減小用於乾燥劑7之空間。還能夠減小第2空間部12及第3空間部13的部分。藉由在密封基板3與乾燥劑7之間形成空間部10,能夠使賦予到密封基板3之外力难以傳遞到乾燥劑7及元件4,因此能夠提高對外力之耐性。因此,能夠使得不易受外力的影響。A sufficient water trapping effect can be obtained with a small amount of the desiccant 7, so that the space for the desiccant 7 can be reduced. The portions of the second space portion 12 and the third space portion 13 can also be reduced. By forming the space portion 10 between the sealing substrate 3 and the desiccant 7 , the external force applied to the sealing substrate 3 can be less likely to be transmitted to the desiccant 7 and the element 4 , so that the resistance to external force can be improved. Therefore, it is possible to make it less susceptible to external force.

密封基板3可以由金屬製成。在該情況下,與密封基板由樹脂等構成的情況相比,能夠使水分M难以從密封基板3向密封基板3的內側通過,並且能夠提高作為密封基板3的強度。由金屬製成之密封基板3具有撓性,因此能夠提高對彎曲之耐性。當密封基板3由金屬製成時,能夠藉由拉深加工來形成密封基板3的凹部3c,因此能夠減少加工等中所花費之成本。The sealing substrate 3 may be made of metal. In this case, compared with the case where the sealing substrate is made of resin or the like, the moisture M can be prevented from passing from the sealing substrate 3 to the inside of the sealing substrate 3 , and the strength as the sealing substrate 3 can be improved. Since the sealing substrate 3 made of metal has flexibility, the resistance to bending can be improved. When the sealing substrate 3 is made of metal, the concave portion 3c of the sealing substrate 3 can be formed by drawing, so that the cost for processing and the like can be reduced.

密封基板3的厚度T1可以為10μm以上且100μm以下。在該情況下,藉由密封基板3的厚度T1為10μm以上,能夠確保密封基板3的強度,因此在進行加工等時能夠避免在密封基板3中形成孔。藉由密封基板3的厚度T1為100μm以下,能夠避免密封基板3變得過硬,因此能夠輕鬆地進行密封基板3的加工。The thickness T1 of the sealing substrate 3 may be 10 μm or more and 100 μm or less. In this case, since the thickness T1 of the sealing substrate 3 is 10 μm or more, the strength of the sealing substrate 3 can be ensured, so that the formation of holes in the sealing substrate 3 can be avoided during processing or the like. By setting the thickness T1 of the sealing substrate 3 to be 100 μm or less, the sealing substrate 3 can be prevented from becoming too hard, so that the sealing substrate 3 can be easily processed.

空間部10的厚度T3可以為5μm以上。在該情況下,藉由空間部10的厚度T3為5μm以上,能夠使進入到密封基板3的內側之水分M充分擴散於空間部10。其结果,能夠更可靠地用乾燥劑7進行捕水,能夠更充分地有效利用乾燥劑7。藉由空間部10的厚度T3為5μm以上,能夠使外力难以進一步傳遞到乾燥劑7及元件4,因此有助於進一步提高強度。The thickness T3 of the space portion 10 may be 5 μm or more. In this case, since the thickness T3 of the space portion 10 is 5 μm or more, the water M that has entered the inner side of the sealing substrate 3 can be sufficiently diffused in the space portion 10 . As a result, the desiccant 7 can more reliably capture water, and the desiccant 7 can be used more effectively. By setting the thickness T3 of the space portion 10 to be 5 μm or more, it is possible to make it difficult for the external force to be further transmitted to the desiccant 7 and the element 4 , thereby contributing to a further increase in strength.

乾燥劑7可以包含鹼土金屬和硬化性樹脂。在該情況下,藉由乾燥劑7包含硬化性樹脂,能夠使乾燥劑7進行硬化。藉由乾燥劑7包含鹼土金屬,能夠提高對進入到密封基板3的內側之水分M的作為乾燥劑7之捕水性。另外,能夠延長乾燥劑7的壽命。The desiccant 7 may contain alkaline earth metal and curable resin. In this case, when the desiccant 7 contains a curable resin, the desiccant 7 can be cured. Since the desiccant 7 contains an alkaline earth metal, it is possible to improve the water-capturing ability of the desiccant 7 with respect to the moisture M that has entered the inner side of the sealing substrate 3 . In addition, the life of the desiccant 7 can be extended.

以上,對本掲示之有機EL器件的實施形態進行了說明。然而,本掲示並不限定於前述實施形態,在不變更各請求項中所記載之主旨的範圍內可以進行各種變形。亦即,有機EL器件的各部的形狀、大小、數量、材料及配置態樣可以在不變更上述主旨之範圍內適當地進行變更。The embodiments of the organic EL device disclosed herein have been described above. However, the present disclosure is not limited to the aforementioned embodiment, and various modifications can be made within the scope of not changing the gist described in each claim. That is, the shape, size, number, material, and arrangement of each part of the organic EL device can be appropriately changed within a range that does not change the above-mentioned gist.

例如,在前述的實施形態中,對如下例子進行了說明:在由金屬製成之密封基板3的情況下,藉由拉深加工來形成凹部3c,在由玻璃製成之密封基板3的情況下,藉由蝕刻加工來形成凹部3c。然而,形成密封基板的凹部之方法亦可以為拉深加工或蝕刻加工以外的方法。For example, in the aforementioned embodiment, the case of forming the recessed portion 3c by drawing in the case of the sealing substrate 3 made of metal has been described, and in the case of the sealing substrate 3 made of glass , the concave portion 3c is formed by etching. However, the method of forming the concave portion of the sealing substrate may be a method other than the drawing process or the etching process.

在前述實施形態中,對包括第1空間部11、第2空間部12及第3空間部13之空間部10進行了說明。在該情況下,乾燥劑7的與元件基板2接觸之面以外的面(例如,包括1個面7b及4個側面7c之5個面)暴露於空間部10,因此能夠將乾燥劑7的捕水面積確保為更大,可得到更高的捕水效果。然而,空間部的结構並不限於包括第1空間部11、第2空間部12及第3空間部13。空間部例如可以為不具有第2空間部12及第3空間部13中的至少任一個之空間部。另外,關於空間部的形狀等,亦可以適當地進行變更。In the aforementioned embodiment, the space portion 10 including the first space portion 11 , the second space portion 12 , and the third space portion 13 has been described. In this case, surfaces other than the surface of the desiccant 7 that is in contact with the element substrate 2 (for example, five surfaces including one surface 7b and four side surfaces 7c) are exposed to the space portion 10, so that the desiccant 7 can be exposed to The catchment area is ensured to be larger, and a higher catchment effect can be obtained. However, the structure of the space portion is not limited to including the first space portion 11 , the second space portion 12 , and the third space portion 13 . The space portion may be, for example, a space portion that does not have at least one of the second space portion 12 and the third space portion 13 . Moreover, the shape etc. of a space part can also be changed suitably.

1:有機EL器件 2:元件基板 2b:長邊 2c:短邊 2d:主面 2f:邊緣區域 3:密封基板 3b:主面 3c:凹部 3d:長邊 3f:短邊 3g:長邊 3h:短邊 3j:角部 4:元件 4b:有機EL元件 5:配線部 6:接著劑 6b:內表面 7:乾燥劑 7b:面 7c:側面 7d:部分 8:積體電路 9:FPC 10:空間部 11:第1空間部 12:第2空間部 13:第3空間部 A:區域 D1:積層方向 D2:第1方向 D3:第2方向 L:路徑 M:水分 W:寬度1: Organic EL Devices 2: Component substrate 2b: Long side 2c: Short side 2d: main face 2f: edge area 3: Seal the substrate 3b: main side 3c: Recess 3d: long side 3f: Short side 3g: long side 3h: Short side 3j: Corner 4: Components 4b: Organic EL element 5: Wiring Department 6: Adhesive 6b: inner surface 7: Desiccant 7b: face 7c: Side 7d: Part 8: Integrated circuit 9: FPC 10: Space Department 11: 1st Space Division 12: 2nd Space Division 13: Division 3 Space A: area D1: Lamination direction D2: 1st direction D3: 2nd direction L: path M: moisture W: width

圖1係示意性地表示實施形態之有機EL器件的圖。 圖2係表示圖1的有機EL器件的元件基板、元件、乾燥劑及密封基板的剖面圖。 圖3係圖2的III-III線剖面圖。FIG. 1 is a diagram schematically showing an organic EL device according to an embodiment. FIG. 2 is a cross-sectional view showing an element substrate, an element, a desiccant, and a sealing substrate of the organic EL device of FIG. 1 . FIG. 3 is a cross-sectional view taken along line III-III of FIG. 2 .

1:有機EL器件1: Organic EL Devices

2:元件基板2: Component substrate

2d:主面2d: main face

2f:邊緣區域2f: edge area

3:密封基板3: Seal the substrate

3b:主面3b: main side

3c:凹部3c: Recess

3j:角部3j: Corner

4:元件4: Components

4b:有機EL元件4b: Organic EL element

6:接著劑6: Adhesive

6b:內表面6b: inner surface

7:乾燥劑7: Desiccant

7b:面7b: face

7c:側面7c: Side

7d:部分7d: Part

10:空間部10: Space Department

11:第1空間部11: 1st Space Division

12:第2空間部12: 2nd Space Division

13:第3空間部13: Division 3 Space

D1:積層方向D1: Lamination direction

D2:第1方向D2: 1st direction

A:區域A: area

L:路徑L: path

M:水分M: moisture

T1,T3,T4,T5,T6:厚度T1,T3,T4,T5,T6: Thickness

T2:深度T2: Depth

Claims (5)

一種有機EL器件,其係具備:元件基板;元件,設置於前述元件基板上;乾燥劑,設置於前述元件基板上,並且覆蓋前述元件;及密封基板,相對於前述元件基板對置配置,並且密封前述元件,在前述乾燥劑與前述密封基板之間形成有空間部。 An organic EL device comprising: an element substrate; an element provided on the element substrate; a desiccant provided on the element substrate and covering the element; and a sealing substrate disposed opposite to the element substrate, and The element is sealed, and a space portion is formed between the desiccant and the sealing substrate. 如請求項1所述之有機EL器件,其中前述密封基板由金屬製成。 The organic EL device according to claim 1, wherein the aforementioned sealing substrate is made of metal. 如請求項1或請求項2所述之有機EL器件,其中前述密封基板的厚度為10μm以上且100μm以下。 The organic EL device according to claim 1 or claim 2, wherein the thickness of the sealing substrate is 10 μm or more and 100 μm or less. 如請求項1或請求項2所述之有機EL器件,其中前述空間部的厚度為5μm以上。 The organic EL device according to claim 1 or claim 2, wherein the thickness of the space portion is 5 μm or more. 如請求項1或請求項2所述之有機EL器件,其中前述乾燥劑包含鹼土金屬和硬化性樹脂。 The organic EL device according to claim 1 or claim 2, wherein the desiccant contains an alkaline earth metal and a curable resin.
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