KR100673761B1 - Organic light-emitting display device and the preparing method of the same - Google Patents

Organic light-emitting display device and the preparing method of the same Download PDF

Info

Publication number
KR100673761B1
KR100673761B1 KR1020050123216A KR20050123216A KR100673761B1 KR 100673761 B1 KR100673761 B1 KR 100673761B1 KR 1020050123216 A KR1020050123216 A KR 1020050123216A KR 20050123216 A KR20050123216 A KR 20050123216A KR 100673761 B1 KR100673761 B1 KR 100673761B1
Authority
KR
South Korea
Prior art keywords
organic light
light emitting
emitting diode
integrated circuit
substrate
Prior art date
Application number
KR1020050123216A
Other languages
Korean (ko)
Inventor
허세준
Original Assignee
삼성에스디아이 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성에스디아이 주식회사 filed Critical 삼성에스디아이 주식회사
Priority to KR1020050123216A priority Critical patent/KR100673761B1/en
Application granted granted Critical
Publication of KR100673761B1 publication Critical patent/KR100673761B1/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/126—Shielding, e.g. light-blocking means over the TFTs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
    • H01L27/1244—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits for preventing breakage, peeling or short circuiting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/302—Details of OLEDs of OLED structures

Abstract

An organic light-emitting display device and a method for manufacturing the same are provided to prevent a driver integrated circuit and an organic light emitting diode from being corroded. An organic light emitting display device includes a substrate(110), an organic light emitting diode(120) formed in a first region on the substrate(110), a driver IC(130) connected to the organic light emitting diode(120) by a signal line and mounted in a second region on the substrate(110), and a sealing substrate(140) to seal up the organic light emitting diode(120) and the driver IC(130). Pad electrodes are formed at a longitudinal end of the signal line, and the driver IC(130) is connected to the respective pad electrodes. Between a bump and the pad electrodes, an anisotropy conductive film is provided and electrically connected. The number of the driver IC(130) is the plural. The signal line includes a scan line to transmit a scan signal and a data line to transmit a data signal.

Description

유기발광 표시장치 및 그 제조방법{Organic light-emitting display device and the preparing method of the same}Organic light-emitting display device and the preparing method of the same

도 1은 종래의 COG 방식의 유기발광 표시장치의 단면도.1 is a cross-sectional view of a conventional COG organic light emitting display device.

도 2는 본 발명의 일실시예에 따른 유기발광 표시장치의 단면도.2 is a cross-sectional view of an organic light emitting display device according to an embodiment of the present invention.

도 3는 본 발명의 일실시예에 따른 유기발광 표시장치의 평면도.3 is a plan view of an organic light emitting display device according to an exemplary embodiment of the present invention.

도 4는 도 3의 A부분의 패드부분 도면.4 is a view of a pad portion of part A of FIG.

<도면의 주요부분에 대한 간단한 설명><Brief description of the main parts of the drawing>

10 : 기판 20 : 유기발광 다이오드10 substrate 20 organic light emitting diode

30 : 구동집적회로 40 : 봉지기판30: driving integrated circuit 40: sealing substrate

110 : 기판 120 : 유기발광 다이오드 110 substrate 120 organic light emitting diode

130 : 구동집적회로 140 : 봉지기판130: driving integrated circuit 140: sealing substrate

본 발명은 유기발광 표시장치에 관한 것으로, 보다 상세하게는 구동집적회로가 봉지기판 내 형성되는 유기발광 표시장치에 관한 것이다.The present invention relates to an organic light emitting display device, and more particularly, to an organic light emitting display device in which a driving integrated circuit is formed in a sealing substrate.

유기발광 표시장치는 서로 대향하는 전극 사이에 유기발광층을 위치시켜, 양 전극 사이에 전압을 인가하면, 한 쪽 전극에서 주입된 전자와 다른 쪽 전극에서 주입된 정공이 유기발광층에서 결합하고, 이때의 결합을 통해 발광층의 발광분자가 일단 여기된 후 기저상태로 돌아가면서 방출되는 에너지를 빛으로 발광시키는 평판표시장치의 하나이다.In the organic light emitting display, when the organic light emitting layer is positioned between the electrodes facing each other, and a voltage is applied between both electrodes, electrons injected from one electrode and holes injected from the other electrode are combined in the organic light emitting layer. It is one of the flat panel display devices that emits energy emitted by light when the light emitting molecules of the light emitting layer are excited and then return to the ground state through bonding.

이러한 발광 원리를 가지는 유기발광 표시장치는 시인성이 우수하고, 경량화, 박막화를 도모할 수 있고, 저전압으로 구동될 수 있어 차세대 디스플레이로 주목받고 있다.An organic light emitting display device having such a light emission principle is attracting attention as a next-generation display because of its excellent visibility, weight reduction, thin film thickness, and low voltage operation.

유기발광 표시장치를 구동하기 위해서는 구동집적회로가 구비되어야 하는데, 구동집적회로를 최근 기판상에 직접 실장하는 방식, 즉 칩온글래스(COG : Chip On Glass)방식이 보급되고 있고, 도 1은 이러한 COG방식의 유기발광 표시장치를 도시하고 있다.In order to drive an organic light emitting display device, a driving integrated circuit must be provided. A method of directly mounting a driving integrated circuit on a substrate, that is, a chip on glass (COG) method has been widely used, and FIG. 1 shows such a COG. The organic light emitting display device is shown.

이에 따르면, 유기발광 표시장치는 크게 기판(10), 유기발광 다이오드(20), 봉지기판(40), 구동집적회로(30)를 포함하여 구성된다. 즉, 기판(10) 상의 제 1 영역에 유기발광 다이오드(20)가 구비되고, 유기발광 다이오드(20)에 신호라인을 전달하는 구동집적회로(30)가 제 2 영역에 구비된다. 이 때, 봉지기판(40)은 제 1 영역상의 유기발광 다이오드(20)를 밀봉하는 데, 유기발광 다이오드(20)는 수분에 취약하여 수분으로부터 보호하여야 하기 때문이다. Accordingly, the organic light emitting diode display includes a substrate 10, an organic light emitting diode 20, an encapsulation substrate 40, and a driving integrated circuit 30. That is, the organic light emitting diode 20 is provided in the first region on the substrate 10, and the driving integrated circuit 30 for transmitting a signal line to the organic light emitting diode 20 is provided in the second region. At this time, the sealing substrate 40 seals the organic light emitting diode 20 on the first region, because the organic light emitting diode 20 is vulnerable to moisture and must be protected from moisture.

그러나, 이러한 COG타입의 유기발광 표시장치는 유기발광 다이오드는 보호되나, 구동집적회로가 이물질, 오염, 습기로 인해 유발되는 부식에 무방비로 노출되는 문제점이 있다. However, in the COG type organic light emitting display device, although the organic light emitting diode is protected, there is a problem that the driving integrated circuit is exposed unprotected to corrosion caused by foreign substances, pollution and moisture.

본 발명은 상기한 문제점을 해결하기 위하여 안출된 것으로서, 본 발명의 목적은 구동집적회로의 장착구조를 변경하여, 구동집적회로의 부식을 방지하고 동시에 유기발광 표시장치의 데드 스페이스(dead space)를 감소시키는 유기발광 표시장치를 제공하는 데 있다. SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to change the mounting structure of the driving integrated circuit, to prevent corrosion of the driving integrated circuit, and at the same time to reduce dead space of the organic light emitting display device. An organic light emitting display device is provided.

본 발명의 일측면에 따른 유기발광 표시장치는 기판; 상기 기판 상의 제 1 영역에 형성되는 유기발광 다이오드; 상기 유기발광 다이오드와 신호라인으로 연결되며, 상기 기판상의 제 2 영역에 실장되는 구동집적회로(DRIVER IC); 및 상기 유기발광 다이오드 및 상기 구동집적회로(DRIVER IC)를 밀봉하는 봉지기판을 포함하여 구성되는 것을 특징으로 한다. An organic light emitting display device according to an aspect of the present invention includes a substrate; An organic light emitting diode formed in a first region on the substrate; A driver integrated circuit connected to the organic light emitting diode and a signal line and mounted in a second region on the substrate; And an encapsulation substrate sealing the organic light emitting diode and the driver integrated circuit.

또한, 본 발명의 다른 측면에 따른 유기발광 표시장치는 유기발광 다이오드 및 상기 유기발광 다이오드에 전기적으로 연결되는 신호라인이 형성된 기판을 제공하는 단계; 상기 신호라인의 종단에 형성된 패드전극에 구동집적회로를 COG법으로 실장하는 단계; 및 상기 유기발광 다이오드 및 구동집적회로를 봉지기판으로 밀봉하는 단계를 포함하여 구성되는 것을 특징으로 한다. In addition, the organic light emitting display device according to another aspect of the present invention comprises the steps of providing an organic light emitting diode and a substrate formed with a signal line electrically connected to the organic light emitting diode; Mounting a driving integrated circuit by a COG method on a pad electrode formed at an end of the signal line; And sealing the organic light emitting diode and the driving integrated circuit with an encapsulating substrate.

이하에서는 본 발명에 따른 유기발광 표시장치의 일실시예를 도 2 및 도 3을 참조하면서 보다 상세히 설명한다. 이에 따르면, 유기발광 표시장치는 유기발광 다이오드(120) 및 구동집적회로(130)를 포함하는 기판(110), 및 봉지기판(140)을 포함하여 구성된다. Hereinafter, an embodiment of an organic light emitting display device according to the present invention will be described in more detail with reference to FIGS. 2 and 3. Accordingly, the organic light emitting diode display includes a substrate 110 including an organic light emitting diode 120 and a driving integrated circuit 130, and an encapsulation substrate 140.

기판(110)은 유기발광 다이오드(120)가 형성되는 제 1 영역과 구동집적회로(130)가 형성되는 제 2 영역으로 구획되며, 유기발광 다이오드(120)는 서로 대향한 한 쌍의 전극과, 상기 전극들 사이에 게재된 것으로 적어도 유기발광층을 포함하는 유기발광소자를 포함한다. 이 때, 유기발광소자는 수동구동형 또는 능동구동형의 어느 형태를 취하든 제한되지 않는다. 또한, 본 실시예에서 유기발광소자의 재료, 구성등은 제한되지 않으므로 이에 대한 상세한 설명은 생략한다.The substrate 110 is divided into a first region in which the organic light emitting diode 120 is formed and a second region in which the driving integrated circuit 130 is formed, and the organic light emitting diode 120 includes a pair of electrodes facing each other, The organic light emitting device includes at least one organic light emitting layer as interposed between the electrodes. At this time, the organic light emitting element is not limited to take any form of passive driving type or active driving type. In addition, the material, the configuration, and the like of the organic light emitting device are not limited in this embodiment, and thus detailed description thereof is omitted.

유기발광 다이오드(120)는 후술할 구동집적회로(130)와 신호라인으로 연결되는데, 유기발광 다이오드(120)와 구동집적회로(130)를 연결하는 신호라인은 스캔신호를 전달하는 스캔라인(123)과, 데이터신호를 전달하는 데이터라인(125)이 있다. 신호라인(123, 125)의 각 종단에는 구동집적회로(130)와의 접촉을 위한 패드전극(미도시)이 형성된다. The organic light emitting diode 120 is connected to the driving integrated circuit 130 and a signal line, which will be described later. The signal line connecting the organic light emitting diode 120 and the driving integrated circuit 130 is a scan line 123 for transmitting a scan signal. And a data line 125 for transmitting a data signal. Pad electrodes (not shown) for contact with the driving integrated circuit 130 are formed at each end of the signal lines 123 and 125.

신호라인(123, 125)은 다양한 방법으로 기판(110)상에서 연장되어 구동(130)칩으로 연결될 수 있다. 예컨데, 본 실시예에서 데이터라인(125)은 유기발광 다이오드에서 수직으로 연장되어 구동집적회로(130)로 연결되고, 스캔라인(123)은 수평으로 연장되어, 데이터라인이 연결되는 구동집적회로(130)의 반대측으로 연결되나 이에 제한되는 것은 아니다.The signal lines 123 and 125 may extend on the substrate 110 in various ways and be connected to the driving 130 chip. For example, in the present embodiment, the data line 125 extends vertically from the organic light emitting diode and is connected to the driving integrated circuit 130, and the scan line 123 extends horizontally to connect the data integrated line. 130, but is not limited thereto.

구동집적회로(130)는 제 1 영역의 측면에 위치하는 제 2 영역에 형성되고, 데이터신호와 주사신호 또는 아이콘 신호등를 전달하는 신호라인으로 전기적으로 유기발광 다이오드에 연결되는데, 유기발광 다이오드가 형성된 화소부에 적어도 하나이상의 반도체 소자가 형성될 경우 이는 반도체 소자의 소스/드레인 및 게이트 전극과 전기적으로 연결되게 된다. The driving integrated circuit 130 is formed in a second region located on the side of the first region, and is electrically connected to the organic light emitting diode as a signal line for transmitting data signals, scan signals, or icon signals. When at least one semiconductor element is formed in the portion, it is electrically connected to the source / drain and gate electrodes of the semiconductor element.

한편, 도 4는 도 3의 A부분에 대한 도면으로 구동집적회로가 기판상에 형성되는 패드부 및 신호선을 나타내는데, 이에 따르면, 구동집적회로(130)는 패드전극들과 전기적으로 연결되는 범프들(133, 135)을 구비한다. 패드전극과 구동집적회로(130)의 범프(133, 135)들은 서로 대향되게 형성되며, 패드전극과 범프(133, 135) 사이에 이방성 도전필름등의 도전물질이 게재되어 유기전계 발광다이오드(120)와 구동집적회로(130)는 전기적으로 연결된다. Meanwhile, FIG. 4 is a view illustrating a portion A of FIG. 3 and illustrates a pad portion and a signal line on which a driving integrated circuit is formed on a substrate, whereby the driving integrated circuit 130 is bumps electrically connected to the pad electrodes. 133 and 135 are provided. Bumps 133 and 135 of the pad electrode and the driving integrated circuit 130 are formed to face each other, and an organic material such as an anisotropic conductive film is disposed between the pad electrode and the bumps 133 and 135 so that the organic light emitting diode 120 ) And the driving integrated circuit 130 are electrically connected.

이 때, 하나 또는 그 이상의 구동집적회로(130)가 구비될 수 있는데, 구동집적회로(130)는 신호라인의 종류에 따라 별개로 제어하거나, 신호라인을 특정수만큼 제어하도록 구비될 수 있다. 또한, 구동집적회로(130)는 외부입력신호를 전달하는 입력라인(140)을 더 구비할 수 있음을 당업자는 인식할 것이다.In this case, one or more driving integrated circuits 130 may be provided, and the driving integrated circuits 130 may be separately controlled according to the type of the signal lines, or may be provided to control the signal lines by a specific number. In addition, those skilled in the art will recognize that the driving integrated circuit 130 may further include an input line 140 for transmitting an external input signal.

본 실시예의 봉지기판(140)은 종래 제 1 영역의 유기발광 다이오드(120)만을 밀봉한 것과 달리, 제 2 영역에 위치한 구동집적회로(140)까지 밀봉한다. 봉지기판(140)의 재료는 금속, 유리, 및 플라스틱등이 사용될 수 있으며 본 실시예에서 봉지기판(140)은 캡형으로 형성되어 있으나, 판형으로도 형성될 수 있다. 판형의 경우, 봉지기판(140)과 밀착하게될 기판의 가장자리부가 돌출되어 봉지기판과 기판 사이에 위치하게되는 유기발광 다이오드가 형성될 공간을 확보하여야 할 것이다. The encapsulation substrate 140 according to the present exemplary embodiment seals up to the driving integrated circuit 140 located in the second region, unlike the conventional organic light emitting diode 120 only sealed in the first region. The material of the encapsulation substrate 140 may be metal, glass, plastic, or the like. In the present embodiment, the encapsulation substrate 140 is formed in a cap shape, but may also be formed in a plate shape. In the case of the plate-shaped, the edge portion of the substrate to be in close contact with the sealing substrate 140 will be protruded to secure a space in which the organic light emitting diode to be positioned between the sealing substrate and the substrate.

봉지기판(140)과 기판(110) 사이에는 소정의 공간이 형성되며, 상기 공간은 질소-리치(rich) 상태로 형성되거나, 아르곤 등의 불활성기체로 충전되어 산소 분율을 저하시킬 수 있다. A predetermined space is formed between the encapsulation substrate 140 and the substrate 110, and the space may be formed in a nitrogen-rich state or filled with an inert gas such as argon to lower the oxygen fraction.

봉지기판(140)과 기판(110)사이의 접착제는 열경화형, 화학경화형, 자외선경화형등의 재료가 있으며, 비제한적이나 경화성이 높은 자외선경화형을 사용하는 것이 바람직하다. The adhesive between the sealing substrate 140 and the substrate 110 may be made of a material such as a thermosetting type, a chemical curing type, or an ultraviolet curing type. It is preferable to use an ultraviolet curing type that is not limited but has high curability.

한편, 봉지수단에는 흡습재(150)가 더 포함될 수 있다. 흡습재(150)는 봉지기판(140)과 기판(110)사이의 공간에 침투한 수분을 제거하는 수단으로서, 알칼리 금속 산화물, 알칼리토류 금속 산화물, 금속 할로겐화물, 금속 황산염, 금속 과염소산염 및 오산화인등이 사용될 수 있고, 또한 폴리머 나노 파티클층(PNPL)으로 형성할 수 있다.Meanwhile, the encapsulation means may further include a hygroscopic material 150. The hygroscopic material 150 is a means for removing moisture penetrating into the space between the sealing substrate 140 and the substrate 110, the alkali metal oxide, alkaline earth metal oxide, metal halide, metal sulfate, metal perchlorate and pentoxide Phosphorous light may be used, and may also be formed of polymer nanoparticle layer (PNPL).

이하에서는 본 발명에 따른 유기발광 표시장치의 일실시예에 따라 제조하는 방법을 설명한다.Hereinafter, a method of manufacturing according to an embodiment of an organic light emitting display device according to the present invention will be described.

먼저, 기판(110) 상의 제 1 영역에 유기발광 다이오드(120) 및 상기 유기발광 다이오드(120)의 제 1 및 제 2 전극에 전기적으로 연결되는 신호라인을 형성한다. 이 때, 신호라인(123, 125)의 종단에는 구동집적회로(130)가 연결될 수 있도록 패드전극를 형성한다. 신호라인(123, 125)은 제 1 영역의 유기발광 다이오드(120)에서 제 2 영역의 구동집적회로(130)로 연결되는데, 도 3에서 도시한 실시예에서는 데이터라인(125)이 제 1 영역에 가까운 측으로 연장되고, 스캔라인(123)이 양측으로 분할되면서 연장되어, 제 1 영역에 먼 측으로 반원을 그리면서 연장되나 이에 제한되는 것은 아니다. First, the organic light emitting diode 120 and a signal line electrically connected to the first and second electrodes of the organic light emitting diode 120 are formed in the first region on the substrate 110. In this case, pad electrodes are formed at ends of the signal lines 123 and 125 so that the driving integrated circuit 130 may be connected. The signal lines 123 and 125 are connected to the driving integrated circuit 130 in the second area from the organic light emitting diode 120 in the first area. In the embodiment shown in FIG. 3, the data line 125 is connected to the first area. It extends to the side close to, and is extended while the scan line 123 is divided into both sides, extending the half circle to the far side in the first area, but is not limited thereto.

다음으로, 상기 패드전극와 대향되는 범프(133, 135)를 구비한 구동집적회로(130)를 상기 패드전극에 직접 실장한다(COG법). 예컨데, 패드전극 상에 도전볼과 이를 함유한 수지로 이루어진 이방성 도전필름(Anisotropic Conductive Film)을 위치시키고, 구동집적회로(130)를 패드전극에 압착시킨다. 이로써, 구동집적회로(130)의 저면에 구비된 범프(133, 135)는 도전물질을 통해 패드전극와 전기적으로 연결된다. Next, a driving integrated circuit 130 having bumps 133 and 135 facing the pad electrodes is directly mounted on the pad electrodes (COG method). For example, an anisotropic conductive film made of a conductive ball and a resin containing the same is placed on the pad electrode, and the driving integrated circuit 130 is pressed onto the pad electrode. As a result, the bumps 133 and 135 provided on the bottom surface of the driving integrated circuit 130 are electrically connected to the pad electrode through the conductive material.

다음으로, 상기 유기발광 다이오드(120) 및 구동집적회로(130)를 봉지기판(140)으로 밀봉한다. 밀봉시에는 접착제를 사용하는 데, 접착제를 바르고, 봉지기판을 덮은 후 자외선을 조사하여 경화시키는 것이 바람직하다. Next, the organic light emitting diode 120 and the driving integrated circuit 130 are sealed with the sealing substrate 140. When sealing, an adhesive is used. It is preferable to apply an adhesive, to cover the sealing substrate, and to harden by irradiating ultraviolet rays.

본 발명은 상기 실시예들을 기준으로 주로 설명되어졌으나, 발명의 요지와 범위를 벗어나지 않고 많은 다른 가능한 수정과 변형이 이루어질 수 있다. 예컨데, 예컨데, 스캔라인이 일측으로 연장되는 것도 가능하고, 구동집적회로가 다수개로 구비될 경우, 상기 구동집적회로가 있는 방향으로 여러방법으로 연장되면서 형성가능할 것이다. Although the present invention has been described primarily with reference to the above embodiments, many other possible modifications and variations can be made without departing from the spirit and scope of the invention. For example, the scan line may be extended to one side, and when a plurality of driving integrated circuits are provided, the scan lines may be formed in various ways in the direction in which the driving integrated circuits are provided.

본 발명에 따른 유기발광 표시장치는 COG법으로 구동집적회로를 실장하는 유기발광 표시장치에 있어서, 유기발광 다이오드 뿐만아니라, 구동집적회로를 부식으로부터 보호하는 효과가 있다. The organic light emitting display device according to the present invention has an effect of protecting not only the organic light emitting diode but also the driving integrated circuit from corrosion in the organic light emitting display device in which the driving integrated circuit is mounted by the COG method.

또한, 구동집적회로를 봉지기판 내부에 형성함으로써, 기구적인 강도를 확보함과 동시에 유기발광 표시장치의 데드 스페이스를 감소시켜, 기판 내 셀수를 증가시키고 이로써 제조원가를 절감시킬 수 있는 효과가 있다.In addition, by forming the driving integrated circuit inside the encapsulation substrate, it is possible to secure mechanical strength and reduce the dead space of the organic light emitting display device, thereby increasing the number of cells in the substrate and thereby reducing the manufacturing cost.

전술한 발명에 대한 권리범위는 이하의 청구범위에서 정해지는 것으로써, 명 세서 본문의 기재에 구속되지 않으며, 청구범위의 균등범위에 속하는 변형과 변경은 모두 본 발명의 범위에 속할 것이다. The scope of the above-described invention is defined in the following claims, not bound by the description in the specification body, all modifications and variations that fall within the equivalent scope of the claims will fall within the scope of the invention.

Claims (8)

기판;Board; 상기 기판 상의 제 1 영역에 형성되는 유기발광 다이오드;An organic light emitting diode formed in a first region on the substrate; 상기 유기발광 다이오드와 신호라인으로 연결되며, 상기 기판상의 제 2 영역에 실장되는 구동집적회로(DRIVER IC); 및A driver integrated circuit connected to the organic light emitting diode and a signal line and mounted in a second region on the substrate; And 상기 유기발광 다이오드 및 상기 구동집적회로(DRIVER IC)를 밀봉하는 봉지기판을 포함하여 구성되는 유기발광 표시장치.And an encapsulation substrate sealing the organic light emitting diode and the driver IC. 제 1 항에 있어서,The method of claim 1, 상기 신호라인의 종단에는 패드전극가 형성되고, 상기 구동집적회로는 상기 각 패드전극에 연결되는 범프를 구비하는 것을 특징으로 하는 유기발광 표시장치. A pad electrode is formed at an end of the signal line, and the driving integrated circuit includes a bump connected to each of the pad electrodes. 제 2 항에 있어서,The method of claim 2, 상기 범프와 상기 패드전극 사이에는 이방성 도전필름이 구비되어 전기적으로 연결되는 것을 특징으로 하는 유기발광 표시장치.And an anisotropic conductive film provided between the bump and the pad electrode and electrically connected thereto. 제 1 항에 있어서,The method of claim 1, 상기 구동집적회로는 복수개로 구비되는 유기발광 표시장치.And a plurality of driving integrated circuits. 제 1 항에 있어서,The method of claim 1, 상기 신호라인은 스캔신호를 전달하는 스캔라인, 데이터신호를 전달하는 데이터라인을 포함하는 것을 특징으로 하는 유기발광 표시장치.The signal line may include a scan line for transmitting a scan signal and a data line for transmitting a data signal. 제 5 항에 있어서,The method of claim 5, 상기 스캔라인은 상기 구동집적회로의 제 1 영역에 가까이 위치한 상기 범퍼에 연결되고, 상기 데이터라인은 상기 구동집적회로의 제 1 영역에 멀리 위치한 상기 범퍼에 연결되는 것을 특징으로 하는 유기발광 표시장치.And the scan line is connected to the bumper located near the first area of the driving integrated circuit, and the data line is connected to the bumper located far from the first area of the driving integrated circuit. 제 1 항에 있어서,The method of claim 1, 상기 봉지기판에는 흡습재가 더 부착되는 것을 특징으로 하는 유기발광 표시장치.And an absorbent material further attached to the encapsulation substrate. 유기발광 다이오드 및 상기 유기발광 다이오드에 전기적으로 연결되는 신호라인이 형성된 기판을 제공하는 단계;Providing a substrate having an organic light emitting diode and a signal line electrically connected to the organic light emitting diode; 상기 신호라인의 종단에 형성된 패드전극에 구동집적회로를 칩온글래스(COG)법으로 실장하는 단계; 및Mounting a driving integrated circuit on a pad electrode formed at an end of the signal line by a chip on glass (COG) method; And 상기 유기발광 다이오드 및 구동집적회로를 봉지기판으로 밀봉하는 단계를 포함하여 구성되는 유기발광 표시장치의 제조방법.And sealing the organic light emitting diode and the driving integrated circuit with an encapsulation substrate.
KR1020050123216A 2005-12-14 2005-12-14 Organic light-emitting display device and the preparing method of the same KR100673761B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020050123216A KR100673761B1 (en) 2005-12-14 2005-12-14 Organic light-emitting display device and the preparing method of the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020050123216A KR100673761B1 (en) 2005-12-14 2005-12-14 Organic light-emitting display device and the preparing method of the same

Publications (1)

Publication Number Publication Date
KR100673761B1 true KR100673761B1 (en) 2007-01-24

Family

ID=38014731

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020050123216A KR100673761B1 (en) 2005-12-14 2005-12-14 Organic light-emitting display device and the preparing method of the same

Country Status (1)

Country Link
KR (1) KR100673761B1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20120045037A (en) * 2009-07-31 2012-05-08 오스람 옵토 세미컨덕터스 게엠베하 Method for producing a component with at least one organic material and component with at least one organic material
CN111862872A (en) * 2019-04-30 2020-10-30 三星显示有限公司 Display apparatus and method of manufacturing the same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20120045037A (en) * 2009-07-31 2012-05-08 오스람 옵토 세미컨덕터스 게엠베하 Method for producing a component with at least one organic material and component with at least one organic material
KR101642372B1 (en) 2009-07-31 2016-07-25 오스람 오엘이디 게엠베하 Method for producing a component with at least one organic material and component with at least one organic material
CN111862872A (en) * 2019-04-30 2020-10-30 三星显示有限公司 Display apparatus and method of manufacturing the same

Similar Documents

Publication Publication Date Title
KR100662992B1 (en) Driver ic of organic light-emitting display device and the preparing method of the same
KR100732808B1 (en) Preparing method of organic light-emitting display device
KR102045244B1 (en) Flexible display device
KR100673765B1 (en) Organic light-emitting display device and the preparing method of the same
KR100745328B1 (en) Organic light-emitting display device and the manufacturing method of the same
KR100688795B1 (en) Organic light-emitting display device and the preparing method of the same
KR100671638B1 (en) Organic light emitting display device
US9064708B2 (en) Display panel, chip on film and display device including the same
KR101041146B1 (en) Display device
KR102048467B1 (en) Organic light emitting diode display device
KR100732816B1 (en) Organic light-emitting display and the preparing method of the same
KR20120068380A (en) Display device and organic light emitting diode display
KR20100001275A (en) Organic light emitting diode display and method for manufacturing the smae
US9093443B2 (en) Tape package and flat panel display device including the same
US9626897B2 (en) Organic light emitting diode display device and method of manufacturing the same
KR20130053280A (en) Chip on glass type flexible organic light emitting diodes
KR101980761B1 (en) Display device having saftly electric connection with flexible printed circuit board
US20180375062A1 (en) Display device and manufacturing method thereof
JP4272447B2 (en) Organic light emitting display
KR102088867B1 (en) Organic light emitting diode display device and fabricating method of the same
KR100673761B1 (en) Organic light-emitting display device and the preparing method of the same
KR101468154B1 (en) Organic light emitting display device
KR100934155B1 (en) Double-sided organic light emitting display device
KR20090121500A (en) Organic light emitting display device
TWI751707B (en) Organic EL device

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20130102

Year of fee payment: 7

FPAY Annual fee payment

Payment date: 20140102

Year of fee payment: 8

FPAY Annual fee payment

Payment date: 20141231

Year of fee payment: 9

LAPS Lapse due to unpaid annual fee