TWI751347B - Blade cover - Google Patents
Blade cover Download PDFInfo
- Publication number
- TWI751347B TWI751347B TW107121470A TW107121470A TWI751347B TW I751347 B TWI751347 B TW I751347B TW 107121470 A TW107121470 A TW 107121470A TW 107121470 A TW107121470 A TW 107121470A TW I751347 B TWI751347 B TW I751347B
- Authority
- TW
- Taiwan
- Prior art keywords
- pipeline
- semi
- cutting
- cylindrical
- block
- Prior art date
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C9/00—Appurtenances of abrasive blasting machines or devices, e.g. working chambers, arrangements for handling used abrasive material
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Dicing (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Turbine Rotor Nozzle Sealing (AREA)
- Auxiliary Devices For Machine Tools (AREA)
- Handling Of Sheets (AREA)
- Harvester Elements (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
[課題]可抑制切割液漏液,並能夠以便宜的方式製造。[解決手段]一種刀片蓋,具備供給切割液的切割液供給噴嘴(101)。切割液供給噴嘴具備:噴出切割液的管路(110);以及夾持該管路的基端(110c)側的第一塊體(107)、第二塊體(108)、夾持手段(113)。第一塊體具備:收納管路的基端側的收納室(119);以及於收納室的延伸方向延伸的第一半圓柱凹部(123)。第二塊體具備:與第一半圓柱凹部相向,且成為與該管路直徑相同的內徑的第二半圓柱凹部(124);以及由該第二半圓柱凹部之內壁突出形成的凸部(133)。將收納管路於收納室,並以夾持手段而藉著第一半圓柱凹部及第二半圓柱凹部夾持管路時,以凸部將管路形變並且管路受擠壓延伸,管路的基端側形成膨脹薄片(S)。[Problem] The leakage of cutting fluid can be suppressed, and it can be manufactured inexpensively. [Solution] A blade cover including a cutting liquid supply nozzle (101) for supplying cutting liquid. The cutting fluid supply nozzle is provided with: a pipeline (110) for ejecting the cutting fluid; and a first block (107), a second block (108), and a holding means ( 113). The first block includes: a storage chamber (119) on the proximal end side of the storage conduit; and a first semi-cylindrical recess (123) extending in the extending direction of the storage chamber. The second block includes: a second semi-cylindrical recess (124) facing the first semi-cylindrical recess and having the same inner diameter as the pipe diameter; and a protrusion formed by protruding from the inner wall of the second semi-cylindrical recess Ministry (133). When the storage pipeline is placed in the storage chamber, and the pipeline is clamped by the first semi-cylindrical concave part and the second semi-cylindrical concave part by means of clamping means, the pipeline is deformed by the convex part and the pipeline is squeezed and extended, and the pipeline The base end side of the formed expanded sheet (S).
Description
本發明係關於一種具備將切割液供給至切割刀片的切割液供給噴嘴的刀片蓋。The present invention relates to a blade cover provided with a cutting liquid supply nozzle for supplying cutting liquid to a cutting blade.
半導體元件的製造製程當中,在大致圓板形狀的晶圓表面上以格子狀形成分割預定線、並且在分割預定線所劃分的區域中形成元件等。而且,晶圓係被切割裝置沿著分割預定線而切割,分割為一個個的半導體晶片。基於切割裝置的切割加工中,使高速旋轉的切割刀片沿著晶圓的分割預定線切入。切割加工中,係透過切割液供給噴嘴而將切割液供給至切割刀片的側面,以進行切割屑的清洗或是加工部分的冷卻以及潤滑等。In the manufacturing process of a semiconductor element, a line to be divided is formed in a lattice shape on the surface of a substantially disc-shaped wafer, and an element or the like is formed in a region divided by the line to be divided. Then, the wafer is diced along the planned dividing line by the dicing device, and divided into individual semiconductor wafers. In the dicing process by a dicing device, a dicing blade rotating at a high speed is cut along a line where the wafer is to be divided. In the dicing process, the cutting fluid is supplied to the side surface of the cutting blade through the cutting fluid supply nozzle to clean the cutting debris, cool and lubricate the processed part, and the like.
切割裝置中,切割液供給噴嘴配設於覆蓋切割刀片所形成的刀片蓋,並夾著切割刀片而平行於切割刀片的切割方向,並且,相對保持晶圓的保持台的保持面平行地用兩條管路配設。此外,切割液供給噴嘴將多個噴出口並排排列於切割進給方向,多個噴出口以垂直於兩條管路的延伸方向朝向切割刀片的兩側面噴出切割液。In the dicing device, the dicing liquid supply nozzle is arranged on the blade cover formed by covering the dicing blade, and is parallel to the dicing direction of the dicing blade with the dicing blade sandwiched therebetween, and is parallel to the holding surface of the holding table holding the wafer. Pipeline configuration. In addition, the cutting liquid supply nozzle has a plurality of jetting ports arranged side by side in the cutting feeding direction, and the plurality of jetting ports jets the cutting liquid toward both side surfaces of the cutting blade in a direction perpendicular to the extending direction of the two pipelines.
作為切割裝置中的切割液供給噴嘴,除了專利文獻1中所揭示的,與形成塊狀的刀片蓋形一體成型的類型之外,還有於專利文獻2中所揭示的,將流通著切割液的管線連接至刀片蓋而形成的類型。 [習知技術文獻] [專利文獻]As the cutting fluid supply nozzle in the dicing device, in addition to the type disclosed in
[專利文獻1] 日本特開2010-46726號公報 [專利文獻2] 日本特開2011-114220號公報[Patent Document 1] Japanese Patent Laid-Open No. 2010-46726 [Patent Document 2] Japanese Patent Laid-Open No. 2011-114220
[發明所欲解決的課題] 前種類型的切割液供給噴嘴雖然切割液供給噴嘴對刀片蓋的固定狀態良好,但是需要由單一塊體切割出刀片蓋與切割液供給噴嘴的製程,製造成本變得昂貴。[Problems to be Solved by the Invention] Although the cutting liquid supply nozzle of the former type is well secured to the blade cover, it requires a process for cutting the blade cover and the cutting liquid supply nozzle from a single piece, which increases the manufacturing cost. expensive.
另一方面,後種類型的切割液供給噴嘴,由於係將管狀構件連接至刀片蓋,因此可以較前種類型還要容易以便宜的方式製造,但容易從其連接部分產生切割液漏液。此外,也需要將管路調整成與切割進給方向平行等作業,該作業較為繁雜,成為負擔的可能性較高。On the other hand, the latter type of cutting fluid supply nozzle, which connects the tubular member to the blade cover, can be manufactured in an inexpensive manner more easily than the former type, but is prone to leakage of cutting fluid from its connection portion. In addition, work such as adjusting the pipeline to be parallel to the cutting feed direction is also required, which is complicated and likely to become a burden.
本發明係鑒於上述各點所完成者,其目的之一在於提供一種刀片蓋,可抑制切割液漏液,並免去管路方向的調整作業等而能夠以便宜的方式製造。The present invention has been made in view of the above-mentioned points, and one of its objects is to provide a blade cover which can suppress leakage of cutting fluid and can be manufactured inexpensively without any work for adjusting the piping direction.
[解決課題的技術手段] 本發明一態樣的刀片蓋,其特徵為:配設於旋轉自如地支撐主軸的主軸殼的前端,覆蓋安裝於主軸上的切割刀片,且具備配設為於切割刀片的切割進給方向上延伸而夾著切割刀片,並將切割液供給至切割刀片的兩側面的切割液供給噴嘴,切割液供給噴嘴具備:管路,將噴出切割液的多個噴出口排列於該切割進給方向,由一邊的端部供給切割液,而另一邊的端部具備密封部;兩個第一塊體與第二塊體,夾持管路的一邊的端部側的外壁;以及夾持手段,以第一塊體與第二塊體夾持管路;其中,第一塊體具備:圓柱狀的收納室,具有由管路的一邊的端部容納預定長度,且以比管路的直徑還要大的內徑所形成的底部;第一半圓柱凹部,於收納室的延伸方向延伸形成;以及供給路徑,連通收納室的底部與切割液供給源,第二塊體具備:第二半圓柱凹部,與第一半圓柱凹部相向,且以與管路直徑相同的內徑所形成;凸部,由第二半圓柱凹部的內壁突出形成,將該管路收納於收納室,並使管路的一邊的端部接觸至底部,藉由夾持手段,第一塊體的第一半圓柱凹部與第二塊體的第二半圓柱凹部夾持管路,第二半圓柱凹部的凸部將該管路形變並且管路受擠壓延伸,收納於收納室的管路的一邊的端部側形成膨脹薄片。[Technical Means for Solving the Problem] A blade cover according to an aspect of the present invention is characterized in that it is disposed at the front end of a main shaft housing that rotatably supports a main shaft, covers a cutting blade attached to the main shaft, and includes a blade cover disposed for cutting A cutting liquid supply nozzle extending in the cutting feed direction of the blade so as to sandwich the cutting blade and supply the cutting liquid to both side surfaces of the cutting blade. In this cutting feed direction, the cutting fluid is supplied from one end portion, and the other end portion is provided with a sealing portion; the two first blocks and the second block sandwich the outer wall of one end side of the pipeline. and clamping means for clamping the pipeline with the first block body and the second block body; wherein the first block body is provided with: a cylindrical storage chamber having a predetermined length accommodated by an end of one side of the pipeline, and a bottom formed by an inner diameter larger than the diameter of the pipeline; a first semi-cylindrical recess extending in the extending direction of the storage chamber; and a supply path connecting the bottom of the storage chamber and the cutting fluid supply source, and the second block It has: a second semi-cylindrical concave part facing the first semi-cylindrical concave part and formed with the same inner diameter as the diameter of the pipeline; a convex part protruding from the inner wall of the second semi-cylindrical concave part, and the pipeline is accommodated in accommodating the chamber, and the end of one side of the pipeline is brought into contact with the bottom. By means of clamping means, the first semi-cylindrical recess of the first block and the second semi-cylindrical recess of the second block clamp the pipeline, and the second semi-cylindrical recess The convex part of the semi-cylindrical concave part deforms the pipe, and the pipe is pressed and extended, and an end part side of one side of the pipe accommodated in the storage chamber forms an expansion sheet.
若根據此構成,則可藉由兩個塊體夾持並保持管路,因此相較於將該些塊體一體切割成型的現有構造,製造負擔較小,可降低製造成本。此外,藉由第一塊體與第二塊體夾持管路,使得因凸部造成管路變形的同時也形成膨脹薄片,因此可抑制此些連接部分的切割液漏液。此外,由於可藉夾持管路來固定管路與各塊體的相對位置,因此可省略管路的位置以及方向的調整作業,並可通過減輕作業負擔來減少製造成本。According to this configuration, the pipeline can be sandwiched and held by the two blocks, and therefore, the manufacturing burden can be reduced compared to the conventional structure in which the blocks are integrally cut and molded, and the manufacturing cost can be reduced. In addition, the first block and the second block clamp the pipeline, so that the pipeline is deformed due to the convex portion, and the expansion sheet is also formed, so that the leakage of the cutting fluid in these connecting parts can be suppressed. In addition, since the relative position of the pipeline and each block can be fixed by clamping the pipeline, the adjustment work of the position and direction of the pipeline can be omitted, and the manufacturing cost can be reduced by reducing the work load.
本發明的刀片蓋可為:於第一半圓柱凹部中形成有第一凹部,於第二半圓柱凹部中形成有第二凹部,將第一半圓柱凹部與第二半圓柱凹部重疊時,第二凹部與第一凹部面對。The blade cover of the present invention may include: a first concave portion is formed in the first semi-cylindrical concave portion, a second concave portion is formed in the second semi-cylindrical concave portion, and when the first semi-cylindrical concave portion and the second semi-cylindrical concave portion are overlapped, the first concave portion is formed. The two concave portions face the first concave portion.
此外,本發明的刀片蓋可為:管路具備對應凸部的凹部。In addition, in the blade cover of the present invention, the pipeline may be provided with a concave portion corresponding to the convex portion.
[發明功效] 若根據本發明,則可藉凸部擠壓形變管路以形成膨脹薄片,因此可抑制切割液漏液,免去形成切割液供給噴嘴的管路調整作業等,並能夠以便宜的方式製造。[Effect of the Invention] According to the present invention, the expansion sheet can be formed by pressing and deforming the pipeline by the convex portion, so that the leakage of the cutting fluid can be suppressed, the pipeline adjustment work for forming the cutting fluid supply nozzle, etc. can be avoided, and the low cost way of manufacturing.
以下參照圖式說明本實施形態。圖1係使用涉及本實施形態中刀片蓋的切割裝置的立體圖。此外,涉及本實施形態的切割裝置並不限定於圖1中所示之構成。本發明只要是屬於能夠由刀片蓋供給切割液的同時以切割刀片切割晶圓的切割裝置,任何的切割裝置皆可適用。此外,於以下各圖中,X方向前側稱為+X側,裡側稱為-X側;Y方向前側稱為+Y側,裡側稱為-Y側;Z方向上側稱為+Z側,下側稱為-Z側。The present embodiment will be described below with reference to the drawings. FIG. 1 is a perspective view of a cutting device using a blade cover according to the present embodiment. In addition, the cutting apparatus concerning this embodiment is not limited to the structure shown in FIG. 1. FIG. The present invention can be applied to any dicing device as long as it is a dicing device capable of dicing a wafer with a dicing blade while supplying a dicing liquid from a blade cover. In addition, in the following figures, the front side in the X direction is referred to as the +X side, and the back side is referred to as the -X side; the front side in the Y direction is referred to as the +Y side, and the back side is referred to as the -Y side; the upper side in the Z direction is referred to as the +Z side , the lower side is called the -Z side.
如圖1所示,切割裝置1構成為:使由卡盤台12保持的晶圓W與切割手段14進行相對移動,藉此以切割晶圓W。晶圓W透過切割膠帶T而在由環狀框架F支撐的狀態下搬入切割裝置1。再者,晶圓W可為矽、砷化鎵等半導體晶圓,亦可為陶瓷、玻璃、藍寶石類的光學元件晶圓。此外,並不限於圓型晶圓,也可為CSP(Chip Size Package,晶片尺寸封裝)基板、QFN(Quad Flat Non-leaded Package,四方平面無引腳封裝)基板。As shown in FIG. 1 , the
切割裝置1的基台11上設置有切割進給手段13,其將卡盤台12於X方向上進行切割進給。切割進給手段13具有:配置於基台11上,與X方向平行的一對導軌31;以及可滑動地設置於一對導軌31上的馬達驅動的X軸台32。X軸台32的背面側上形成有未圖示的螺母部,滾珠螺桿33螺合於此螺母部。此外,連接於滾珠螺桿33一端部上的驅動馬達34被旋轉驅動,藉此使得卡盤台12沿著一對的導軌31並在成為切割刀片71的切割方向的X方向上切割進給。The
在X軸台32的上部,保持晶圓W的卡盤台12設置成可圍繞Z軸旋轉。卡盤台12的上表面形成有以多孔陶瓷材料組成的保持面,藉著於此保持面產生的負壓使得晶圓W被吸引保持住。卡盤台12的周圍設置有空氣驅動式的四個夾持部22,藉著各個夾持部22使得晶圓W的周圍的環狀框架F由四方被夾持固定住。基台11的上表面設置有門型的立壁部81,其以跨越卡盤台12的移動路線的方式站立設置。On the upper part of the X-axis table 32, the chuck table 12 holding the wafer W is provided so as to be rotatable around the Z-axis. The upper surface of the chuck table 12 is formed with a holding surface composed of a porous ceramic material, and the wafer W is attracted and held by the negative pressure generated by the holding surface. Four air-driven
立壁部81中設置有:分度進給手段15,其將切割手段14於Y方向上作分度進給;以及切入進給手段16,其將切割手段14於Z方向上切入進給。分度進給手段15具有:一對導軌51,其配置於立壁部81的前表面且平行於Y方向;以及Y軸台52,其可滑動地設置於一對導軌51上。切入進給手段16具有:一對導軌61,其配置於Y軸台52上且平行於Z方向;以及Z軸台62,其可滑動地設置於一對導軌61上。Z軸台62的下部設置有切割晶圓W的切割手段14。The
Y軸台52以及Z軸台62的背面側上,分別地形成有螺母部,滾珠螺桿53、63螺合於此些螺母部。在Y軸台52用的滾珠螺桿53、Z軸台62用的滾珠螺桿63的一端部上,分別地連接有驅動馬達64(Y軸用的驅動馬達未圖示)。藉著驅動馬達64旋轉驅動各個滾珠螺桿53、63,藉此切割手段14沿著導軌51於與X方向垂直的Y方向上分度進給,切割手段14沿著導軌61於接近及遠離晶圓W的Z方向上切入進給。Nut portions are formed on the rear sides of the Y-axis table 52 and the Z-axis table 62, respectively, and the
切割手段14係於從主軸殼75突起的主軸72(參考圖2)的前端上安裝切割刀片71所構成。於主軸殼75中,作為切割刀片71旋轉軸的主軸72旋轉自如地被支撐著的同時,也設置有使主軸72旋轉的馬達(未圖示)。此外,主軸殼75的前端側上,以使切割刀片71切進晶圓W的區域露出的方式,設置有圍繞切割刀片71的刀片蓋100。刀片蓋100具備切割液供給噴嘴101(圖1中省略,請參考圖2),其將切割液供給至於晶圓W之切割部分的切割刀片71兩側面。
The
圖2係本實施形態中刀片蓋的概略立體圖。如圖2所示,刀片蓋100具備噴嘴支撐塊103,其於-X側支撐一對的周圍噴射噴嘴102。此外,刀片蓋100具備蓋本體105,其覆蓋切割刀片71外圍的大致上半部,並從蓋本體105的+X側涵蓋下部而設置一對的切割液供給噴嘴101。切割液供給噴嘴101是以將切割刀片71夾在其中的方式設置兩組,並且以ZX面作為對稱面而呈面對稱的構造。切割液供給噴嘴101具備:第一塊體107及第二塊體108,其設置於蓋本體105的+X側上;以及L字型之管路110,其受到第一塊體107、第二塊體108支撐。
FIG. 2 is a schematic perspective view of the blade cover in this embodiment. As shown in FIG. 2 , the
管路110係藉由不銹鋼等金屬材所形成。管路110由各第一塊體107、第二塊體108延伸至下方,於途中部分彎曲,前端側於切割刀片71的切割進給方向(X方向)上延伸。管路110設置於由切割刀片71側面Y方向上距離預定距離之位置,並且以藉由兩組切割液供給噴嘴101的管路110將切割刀片71夾在其中的方式作配設。管路110當中,於切割進給方向上延伸的部分上排列形成有多個噴出口110a。於管路110朝上的基端(一邊的端部)透過連結部111連接至切割液供給源120(參考圖3),由切割液供給源120供給至管路110的切割液由噴出口110a噴出。藉此可由噴出口110a供給切割液至切割刀片71的兩側面,並進行切割部分的冷卻以及洗淨等。此外,管路110的前端(另一邊的端部)作為密封部110b而封閉住,防止切割液漏液的發生。
The
接著,參考圖3來對切割液供給噴嘴101的構造進行說明。圖3係表示本實施形態中切割液供給噴嘴的主要部分之概略分解立體圖。於此,在以下的說明當中,於Y方向並列的兩組切割液供給噴嘴101當中,對位於-Y側位置的切割液噴嘴101進行說明。此外,位於+Y側的切割液供給噴嘴101與位於-Y側位置的切割液供給噴嘴101為面對稱構造,在此省略其說明。
Next, the structure of the cutting
如圖3所示,切割液供給噴嘴101,係構成為:藉由兩個第一塊體107以及第二塊體108,將管路110的基端110c側的外壁由Y方向兩側以夾持手段113夾持(夾入)。
As shown in FIG. 3 , the cutting
第一塊體107設置成具備長方體狀的塊本體115以及下突出體116的形狀。其中,長方體狀的塊本體115於其上表面的面內中央部設置有連結部111,下突出體116係由塊本體115的下表面115a中+Y側的大致一半區域往下方突出。The
於第一塊體107的塊本體115當中,形成有與連結部111連通並延伸於下方的供給路徑118,此供給路徑118的下端與塊本體115的下表面115a之間形成有收納室119。收納室119設置為將塊本體115的下表面115a側打開。連結部111透過泵等來與供給切割液的切割液供給源120連接。In the
供給路徑118的上端側上形成有母螺紋118a,以能夠與連結部111的下端所形成的公螺紋111a螺合。供給路徑118係由比管路110直徑還小的內徑尺寸的圓柱狀之內壁面所形成。收納室119係由比管路110直徑還要稍微大些的內徑尺寸的圓柱狀之內壁面所形成,可自管路110的基端110c側收納預定的長度。供給路徑118與收納室119的中心軸位置係設在同一線上,而兩者的交界位置上因直徑尺寸不同而形成有段差。基於此段差,形成作為收納室119的上部中的內壁面的底部(頂表面)119a。收納室119的底部119a與管路110的基端110c之間,為了保有液密性而配設有O形環121。供給路徑118透過連結部111而將收納室119的底部119a與切割液供給源120連通。A
位於下突出體116的-Y側上且平行於ZX面的鉛直面116a中,以使該鉛直面116a往+Y側凹陷的方式形成第一半圓柱凹部123。第一半圓柱凹部123於收納室119的延伸方向(即上下方向)延伸而形成。第一半圓柱凹部123係基於內徑尺寸與管路110直徑相同的半圓柱狀的內壁面所形成,其半圓的中心軸位置設置為與收納室119的中心軸位置在同一線上。The first
第二塊體108形成為直方體狀,形成為可收納於下突出體116的鉛直面116a的上下寬幅中、以及塊本體115下表面115a的Y方向寬幅中的尺寸。第二塊體108形成於+Y側上平行於ZX面的鉛直面108a,此鉛直面108a與下突出體116之鉛直面116a相向。第二塊體108之鉛直面108a係以使該鉛直面108a往-Y側凹陷的方式形成第二半圓柱凹部124。第二半圓柱凹部124係基於內徑尺寸與管路110直徑相同的半圓柱狀的內壁面所形成,且以ZX面為對稱面而與第一半圓柱凹部123面對稱地形成。因此,將第一半圓柱凹部123與第二半圓柱凹部124重疊使其相向時,基於兩者而形成圓柱狀的內壁面。The
夾持手段113具備於Y方向延伸的兩條螺絲構件126(其中一條圖示省略)。第二塊體108當中,第二半圓柱凹部124的X方向兩側上,形成有使螺絲構件126插通的螺絲插通孔127。此外,夾持手段113於下突出體116的鉛直面116a中與各螺絲插通孔127相向的位置上具備有母螺絲孔128。於夾持手段113,將螺絲構件126插通螺絲插通孔127,並將螺絲構件126的前端螺入母螺絲孔128,藉此使得第二塊體108施於+Y側的力得以發揮。藉由此力使得管路110被第一塊體107及第二塊體108由Y方向兩側所夾持。
The clamping means 113 includes two screw members 126 (one of which is omitted from illustration) extending in the Y direction. In the
本實施形態中,藉著管路110被第一塊體107及第二塊體108所夾持,管路110以變形狀態而安裝於各第一塊體107、第二塊體108。關於此時使管路變形的構成,參考圖3加上圖4來進行以下說明。
In this embodiment, the
圖3中,於第一半圓柱凹部123的上下方向中央的預定寬幅中形成有第一凹部131,於第二半圓柱凹部124的上下方向中央部中且與第一凹部131相向的位置上,形成有第二凹部132。第一凹部131形成於第一半圓柱凹部123的X方向兩側,且對第一半圓柱凹部123與鉛直面116a的交叉部分倒角的方式使其凹陷形成。第二凹部132形成於第二半圓柱凹部124的X方向兩側,且對第二半圓柱凹部124與鉛直面108a交叉部分倒角的方式使其凹陷形成。在第二半圓柱凹部124上,凸部133形成於兩個第二凹部132之間,且凸部133是以使第二半圓柱凹部124內壁往+Y方向突出的方式形成。
In FIG. 3 , a
圖4係夾持管路使其變形的構成之平面剖面圖。如圖4所示,於第二塊體108當中,於第二塊體108當中,兩個第二凹部132之間連接形成凸部133,此些的內壁面於圖4剖面圖中形成為一個沿著假想圓C的圓弧狀。因此,凸部133的突出方向+Y方向的前端形狀形成為凹陷成圓弧狀。假想圓C的直徑尺寸形成為比第二半圓柱凹部124的直徑尺寸還要大。此外,假想圓C的中心係Y方向的位置較鉛直面108a還要往+Y側,且X方向的位置與第二半圓柱凹部124的半圓中心相同。假想圓C的最-Y側的位置,即凸部133的前端位置,是較第二半圓柱凹部124的最-Y側的位置還要往+Y側。
Fig. 4 is a plan cross-sectional view of a structure in which a pipeline is clamped and deformed. As shown in FIG. 4 , in the
使第一半圓柱凹部123與第二半圓柱凹部124重疊相向,則第一凹部131與第二凹部132面對。此時,第一凹部131相對於第二凹部132,以垂直於圖4紙面的ZX面作為對稱面而形成面對稱的形狀。因此,第一凹部131的內壁面於剖面圖中亦形成為圓弧狀。
The first semi-cylindrical
當以本實施形態的切割液供給噴嘴101連接管路110時,如圖3所示,將管路110的基端110c側由收納室119的下方插入並收納。此時,藉由管路
110的基端110c以及收納室119的底部119a將O形環121夾著,使O形環121介入而使得管路110的基端110c接觸底部119a。此外,可使用未圖示的治具等將管路110的水平部分對齊成平行於X方向。
When the
其後,藉由第一塊體107與第二塊體108將管路110的基端110c側的外壁由Y方向兩側夾持,並且使插通螺絲插通孔127的螺絲構件126旋入母螺絲孔128。藉此,管路110被第一半圓柱凹部123與第二半圓柱凹部124夾持。藉由此夾持,使得如圖5所示般,第二半圓柱凹部124的凸部133往+Y側將管路110擠壓形變,管路110的X方向兩側被擠壓延伸成進入第一凹部131及第二凹部132。基於前述擠壓形變、擠壓延伸,變形成管路110的Y方向寬幅縮小,X方向寬幅擴大,並且於管路110的基端110c側的預定區域中形成有膨脹薄片S。膨脹薄片S緊貼於各第一半圓柱凹部123、第二半圓柱凹部124中的第一凹部131、第二凹部132及凸部133,以確保此些構件的界面之液密性。
Then, the outer wall on the
此外,膨脹薄片S與第一凹部131、第二凹部132及凸部133嵌合,使得管路110相對各第一塊體107、第二塊體108被固定住。具體地說,管路110的圍繞Z軸旋轉受限制,此外,管路110往下方向的拔出受限制。於此,膨脹薄片S中,被凸部133壓形變(對應的)部分形成凹部Sa,被第一凹部131及第二凹部132擠壓延伸的部分形成凸部Sb。
In addition, the expansion sheet S is fitted into the first
如上所述,本實施形態的刀片蓋100中,由於以第一塊體107及第二塊體108來夾持管路110作連接,因此相較於將該些塊體一體切割成型的現有構造還要容易製造,並且可降低製造成本。
As described above, in the
此外,藉由膨脹薄片S可良好地防止管路110的連接部分的切割液漏液。此外,以治具等將管路110對齊夾持,並且形成膨脹薄片S,藉此可使得管路110的方向或是位置呈固定至預定位置之狀態。藉此,可省略使管路110平行於X方向、或是使噴出口110a相向於切割刀片71的側面之調整作業,藉此也能夠達成製造的簡易化、製造成本的削減。此外,於替換管路110時,亦可達到透過省略調整作業而降低作業的負擔。
In addition, by the expansion sheet S, the leakage of the cutting fluid at the connecting portion of the
此外,第一凹部131、第二凹部132、凸部133的形狀或是形成位置,只要是在可以形成與上述實施形態相同功能的膨脹薄片S的前提條件下,可以變更為其他的形狀、形成位置。In addition, the shapes and formation positions of the first
此外,本發明的實施形態並非限定於上述實施形態以及變形例,在不脫離本發明技術思想主旨的範圍內,可進行各種地改變、替換、變形。此外,若根據技術的進步或是衍生的其他技術,而能夠以其他方式來實現本發明的技術思想,亦可用其方法來實施。是以,申請專利範圍涵蓋本發明技術思想範圍內所能包含的所有實施形態。Further, the embodiments of the present invention are not limited to the above-described embodiments and modifications, and various changes, replacements, and modifications can be made without departing from the technical idea of the present invention. In addition, if the technical idea of the present invention can be realized in other ways according to the advancement of technology or other derived technologies, the method can also be used to implement it. Therefore, the scope of the patent application covers all embodiments that can be included within the scope of the technical idea of the present invention.
[產業上的可利用性] 如上說明般,本發明具有可抑制切割液漏液、能夠以便宜的方式製造之效果,尤其是對由刀片蓋供給切割液的同時以切割刀片切割晶圓的切割裝置有用。[Industrial Applicability] As described above, the present invention has the effect of suppressing the leakage of dicing liquid and being able to manufacture inexpensively, especially for dicing in which a wafer is diced with a dicing blade while supplying dicing liquid from a blade cover. The device is useful.
71‧‧‧切割刀片72‧‧‧主軸75‧‧‧主軸殼100‧‧‧刀片蓋101‧‧‧切割液供給噴嘴110‧‧‧管路110a‧‧‧噴出口110b‧‧‧密封部110c‧‧‧基端(一邊的端部)107‧‧‧第一塊體108‧‧‧第二塊體113‧‧‧夾持手段118‧‧‧供給路徑119‧‧‧收納室119a‧‧‧底部120‧‧‧切割液供給源123‧‧‧第一半圓柱凹部124‧‧‧第二半圓柱凹部131‧‧‧第一凹部132‧‧‧第二凹部133‧‧‧凸部S‧‧‧膨脹薄片Sa‧‧‧凹部Sb‧‧‧凸部71‧‧‧Cutting
圖1係使用涉及本實施形態中刀片蓋的切割裝置的立體圖。 圖2係涉及本實施形態中刀片蓋的概略立體圖。 圖3係表示本實施形態中切割液供給噴嘴的主要部分之概略分解立體圖。 圖4係夾持管路使其變形的構成之平面剖面圖。 圖5係夾持管路使其變形的狀態之平面剖面圖。FIG. 1 is a perspective view of a cutting device using a blade cover according to the present embodiment. FIG. 2 is a schematic perspective view of the blade cover in the present embodiment. FIG. 3 is a schematic exploded perspective view showing a main part of the cutting fluid supply nozzle in the present embodiment. Fig. 4 is a plan cross-sectional view of a structure in which a pipeline is clamped and deformed. Fig. 5 is a plan sectional view of a state in which the pipe is clamped and deformed.
101‧‧‧切割液供給噴嘴 101‧‧‧Cutting fluid supply nozzle
107‧‧‧第一塊體 107‧‧‧First block
108‧‧‧第二塊體 108‧‧‧Second block
108a‧‧‧鉛直面 108a‧‧‧Plumb face
110‧‧‧管路 110‧‧‧Piping
110c‧‧‧基端(一邊的端部) 110c‧‧‧Base end (end of one side)
111‧‧‧連結部 111‧‧‧Connections
111a‧‧‧公螺紋 111a‧‧‧Male thread
113‧‧‧夾持手段 113‧‧‧Clamping Means
115‧‧‧塊本體 115‧‧‧Block body
115a‧‧‧下表面 115a‧‧‧Lower surface
116‧‧‧下突出體 116‧‧‧Lower protrusion
116a‧‧‧鉛直面 116a‧‧‧Plumb face
118‧‧‧供給路徑 118‧‧‧Supply Path
118a‧‧‧母螺紋 118a‧‧‧Female thread
119‧‧‧收納室 119‧‧‧Storage Room
119a‧‧‧底部 119a‧‧‧Bottom
120‧‧‧切割液供給源 120‧‧‧Cutting fluid supply source
121‧‧‧O形環 121‧‧‧O-ring
123‧‧‧第一半圓柱凹部 123‧‧‧First semi-cylindrical recess
124‧‧‧第二半圓柱凹部 124‧‧‧Second semi-cylindrical recess
126‧‧‧螺絲構件 126‧‧‧Screw components
127‧‧‧螺絲插通孔 127‧‧‧Screw through hole
128‧‧‧母螺絲孔 128‧‧‧Female screw holes
131‧‧‧第一凹部 131‧‧‧First recess
132‧‧‧第二凹部 132‧‧‧Second recess
133‧‧‧凸部 133‧‧‧Protrusion
S‧‧‧膨脹薄片 S‧‧‧Expanded sheet
Sa‧‧‧凹部 Sa‧‧‧recess
Sb‧‧‧凸部 Sb‧‧‧ convex
+X、-X、+Y、-Y、+Z、-Z‧‧‧方向 +X, -X, +Y, -Y, +Z, -Z‧‧‧ directions
Claims (3)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017-123799 | 2017-06-26 | ||
JP2017123799A JP7105039B2 (en) | 2017-06-26 | 2017-06-26 | blade cover |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201905994A TW201905994A (en) | 2019-02-01 |
TWI751347B true TWI751347B (en) | 2022-01-01 |
Family
ID=64822773
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW107121470A TWI751347B (en) | 2017-06-26 | 2018-06-22 | Blade cover |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7105039B2 (en) |
KR (1) | KR102439063B1 (en) |
CN (1) | CN109108841B (en) |
TW (1) | TWI751347B (en) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07248082A (en) * | 1994-03-10 | 1995-09-26 | Fujii Gokin Seisakusho:Kk | Pipe connecting method, and pipe connecting device executing it |
JP2003059864A (en) * | 2001-08-20 | 2003-02-28 | Disco Abrasive Syst Ltd | Dicing device |
JP2013021256A (en) * | 2011-07-14 | 2013-01-31 | Disco Abrasive Syst Ltd | Cutting apparatus |
JP2013033802A (en) * | 2011-08-01 | 2013-02-14 | Disco Abrasive Syst Ltd | Cutting device |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2439642A (en) * | 1945-07-28 | 1948-04-13 | Mayfield C White | Adjustable hose holder |
JP2009285769A (en) * | 2008-05-28 | 2009-12-10 | Disco Abrasive Syst Ltd | Cutting device |
JP5399662B2 (en) | 2008-08-19 | 2014-01-29 | 株式会社ディスコ | Cutting equipment |
JP5437034B2 (en) | 2009-11-27 | 2014-03-12 | 株式会社ディスコ | Cutting equipment |
CN202622468U (en) * | 2012-04-11 | 2012-12-26 | 东营信盛车桥有限公司 | Lubricating device of automatic pin shaft machining tool |
CA2784109C (en) * | 2012-07-27 | 2019-06-18 | Nex Flow Air Products Corp. | Apparatus and method for cooling and lubrication |
JP5873833B2 (en) * | 2013-05-08 | 2016-03-01 | 日本ピラー工業株式会社 | Pipe connection device |
CN104791554B (en) * | 2015-04-17 | 2016-08-24 | 燕山大学 | Gas spring formula vibration damping pipe clamp |
-
2017
- 2017-06-26 JP JP2017123799A patent/JP7105039B2/en active Active
-
2018
- 2018-06-08 KR KR1020180065903A patent/KR102439063B1/en active IP Right Grant
- 2018-06-11 CN CN201810593461.2A patent/CN109108841B/en active Active
- 2018-06-22 TW TW107121470A patent/TWI751347B/en active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07248082A (en) * | 1994-03-10 | 1995-09-26 | Fujii Gokin Seisakusho:Kk | Pipe connecting method, and pipe connecting device executing it |
JP2003059864A (en) * | 2001-08-20 | 2003-02-28 | Disco Abrasive Syst Ltd | Dicing device |
JP2013021256A (en) * | 2011-07-14 | 2013-01-31 | Disco Abrasive Syst Ltd | Cutting apparatus |
JP2013033802A (en) * | 2011-08-01 | 2013-02-14 | Disco Abrasive Syst Ltd | Cutting device |
Also Published As
Publication number | Publication date |
---|---|
KR20190001511A (en) | 2019-01-04 |
TW201905994A (en) | 2019-02-01 |
CN109108841A (en) | 2019-01-01 |
KR102439063B1 (en) | 2022-08-31 |
CN109108841B (en) | 2021-09-24 |
JP2019005849A (en) | 2019-01-17 |
JP7105039B2 (en) | 2022-07-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7608523B2 (en) | Wafer processing method and adhesive tape used in the wafer processing method | |
US9925682B2 (en) | Cutting apparatus | |
US9396976B2 (en) | Cutting apparatus | |
US9455175B2 (en) | Conveying apparatus | |
TWI454356B (en) | Cutting device | |
US10297488B2 (en) | Workpiece support jig | |
US20160311127A1 (en) | Cutting apparatus and cutting method | |
JP5437034B2 (en) | Cutting equipment | |
TWI770322B (en) | cutting device | |
TWI669201B (en) | Cutting device | |
JP2016201421A (en) | Transfer tray of work-piece | |
TWI809103B (en) | cutting device | |
TWI797333B (en) | cutting device | |
TWI789474B (en) | Workpiece cutting method and chuck table of cutting device | |
TWI751347B (en) | Blade cover | |
KR20200085645A (en) | Holding method of workpieces and processing method of workpieces | |
TWI655053B (en) | Blade cover device | |
JP2015230935A (en) | Silicon wafer processing method | |
JP4986511B2 (en) | Cutting equipment | |
JP7152882B2 (en) | How to hold the workpiece unit | |
CN108568915B (en) | Cutting tool and mounting flange | |
JP2013135137A (en) | Method for holding plate-like object and method for processing plate-like object | |
TW202211312A (en) | Cutting device and method of cutting workpiece capable of reducing vibration of a cutting blade in comparison with the prior art | |
TW202101703A (en) | Holding apparatus capable of easily dismounting a workpiece from a holding table | |
TW202010042A (en) | Chuck table and wafer processing method including a holding surface, an outer peripheral suction hole and a suction path |