TWI749419B - 電子零件安裝裝置 - Google Patents

電子零件安裝裝置 Download PDF

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Publication number
TWI749419B
TWI749419B TW108144871A TW108144871A TWI749419B TW I749419 B TWI749419 B TW I749419B TW 108144871 A TW108144871 A TW 108144871A TW 108144871 A TW108144871 A TW 108144871A TW I749419 B TWI749419 B TW I749419B
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TW
Taiwan
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core
electronic component
cover member
pressurized
pressurizing
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TW108144871A
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English (en)
Chinese (zh)
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TW202030819A (zh
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石井正明
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日商朝日科技股份有限公司
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  • Supply And Installment Of Electrical Components (AREA)
  • Die Bonding (AREA)
TW108144871A 2019-02-09 2019-12-09 電子零件安裝裝置 TWI749419B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019022173A JP6762578B2 (ja) 2019-02-09 2019-02-09 電子部品実装装置
JP2019-022173 2019-02-09

Publications (2)

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TW202030819A TW202030819A (zh) 2020-08-16
TWI749419B true TWI749419B (zh) 2021-12-11

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TW108144871A TWI749419B (zh) 2019-02-09 2019-12-09 電子零件安裝裝置

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JP (1) JP6762578B2 (ja)
TW (1) TWI749419B (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115594715B (zh) * 2022-10-03 2023-05-30 青岛艾科生物科技有限公司 一种靶向线粒体的查尔酮衍生物及其应用

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011003646A (ja) * 2009-06-17 2011-01-06 Panasonic Corp 部品圧着装置及び方法
JP2016507164A (ja) * 2013-02-06 2016-03-07 ボッシュマン テクノロジーズ ビーヴイ 半導体ダイ封入又は実装方法及び対応する半導体ダイ封入又は実装装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09213754A (ja) * 1996-01-30 1997-08-15 Matsushita Electric Ind Co Ltd 電子部品の熱圧着装置および熱圧着方法
JP5660740B2 (ja) * 2013-03-14 2015-01-28 アルファーデザイン株式会社 電子部品の接合方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011003646A (ja) * 2009-06-17 2011-01-06 Panasonic Corp 部品圧着装置及び方法
JP2016507164A (ja) * 2013-02-06 2016-03-07 ボッシュマン テクノロジーズ ビーヴイ 半導体ダイ封入又は実装方法及び対応する半導体ダイ封入又は実装装置

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Publication number Publication date
JP6762578B2 (ja) 2020-09-30
JP2020129626A (ja) 2020-08-27
TW202030819A (zh) 2020-08-16

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