TWI743190B - Cutter - Google Patents
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- TWI743190B TWI743190B TW106131110A TW106131110A TWI743190B TW I743190 B TWI743190 B TW I743190B TW 106131110 A TW106131110 A TW 106131110A TW 106131110 A TW106131110 A TW 106131110A TW I743190 B TWI743190 B TW I743190B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D35/00—Tools for shearing machines or shearing devices; Holders or chucks for shearing tools
- B23D35/001—Tools for shearing machines or shearing devices; Holders or chucks for shearing tools cutting members
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D19/00—Shearing machines or shearing devices cutting by rotary discs
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/04—Headstocks; Working-spindles; Features relating thereto
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B45/00—Means for securing grinding wheels on rotary arbors
- B24B45/006—Quick mount and release means for disc-like wheels, e.g. on power tools
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/02—Tubes; Rings; Hollow bodies
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- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
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- Organic Chemistry (AREA)
- Polishing Bodies And Polishing Tools (AREA)
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Abstract
對於高集中度的電鑄砥粒層會劇烈消耗這樣的切削對象,抑制切削刀的刀尖的變形同時予以良好地切削。 For the highly concentrated electroformed cementitious grain layer, such a cutting object will be consumed severely, and the deformation of the cutting edge of the cutting tool can be suppressed and the cutting can be performed well.
切削刀(30)具有藉由以鍍覆予以固定而成的電鑄砥粒層來形成之環狀的切刃部(31),切刃部由藉由集中度高的砥粒層來形成之中央電鑄砥粒層(32)、與藉由集中度比中央電鑄砥粒層還低的砥粒層來形成之外側電鑄砥粒層(33)所構成,而形成為可切削使用了由鐵基底的金屬磁性粒子與有機系黏結劑所構成之壓粉材料的電感器(I)。 The cutting blade (30) has a ring-shaped cutting edge portion (31) formed by an electroformed stone particle layer fixed by plating, and the cutting edge portion is formed by a highly concentrated stone particle layer The central electroformed cementite layer (32), and the outer electroformed cementite layer (33) formed by the concentration of the central electroformed cementite layer is lower than that of the central electroformed cementite layer, and are formed to be machinable for use. Inductor (I) of pressed powder material composed of iron-based metal magnetic particles and organic binder.
Description
本發明有關切削板狀物之切削刀。 The present invention relates to a cutter for cutting plate objects.
半導體元件工程中,會使用適合半導體晶圓的切削之切削刀。一般而言,切削刀會有隨著砥粒層的集中度變高而減少消耗之傾向。作為切削刀,有人提出一種在寬幅方向的中央為低集中度的電鑄層、在寬幅方向的兩外側為高集中度的電鑄層所層積而成之多層刀(例如參照專利文獻1)。專利文獻1記載的層積刀,係集中度低的中央的電鑄層先磨耗而刀尖成為凹形狀,藉此讓切削時產生的切削屑躲入凹形狀,而具備抑制毛邊產生等的功能。
In semiconductor device engineering, cutting tools suitable for the cutting of semiconductor wafers are used. Generally speaking, the cutting tool has a tendency to reduce consumption as the concentration of the stone layer becomes higher. As a cutting blade, a multilayer blade has been proposed in which a low-concentration electroformed layer in the center of the width direction and a high-concentration electroformed layer on both outer sides of the width direction are laminated (for example, refer to Patent Literature 1). The laminated tool described in
[專利文獻1]日本特開2002-331464號公報 [Patent Document 1] JP 2002-331464 A
如上述般,低集中度的電鑄層容易消耗,因此為避免刀尖圓鈍變形,會採取將切削刀全體以高集中度的電鑄層形成這樣的手段。然而,依切削對象的素材不同,有時高集中度的電鑄層會比低集中度的電鑄層還劇烈消耗。例如,當切削使用了由鐵基底的金屬磁性粒子(鐵球)與有機系黏結劑所構成之壓粉材料的電感器(inductor)的情形下,若以高集中度的切削刀切削則消耗劇烈,會成為和通常的切削消耗特性相異之結果,而有無法穩定切削之問題。 As mentioned above, the electroformed layer with low concentration is easy to be consumed. Therefore, in order to avoid blunt tip deformation, a method of forming the entire cutter with a highly concentrated electroformed layer is adopted. However, depending on the material to be cut, sometimes the electroformed layer with high concentration is more intensively consumed than the electroformed layer with low concentration. For example, when cutting an inductor (inductor) using a powder material composed of metal magnetic particles (iron balls) on an iron base and an organic binder, cutting with a high-concentration cutter will consume a lot of energy. , It will be different from the usual cutting consumption characteristics, and there is a problem of instability in cutting.
本發明有鑑於此點而研發,目的之一在於提供一種切削刀,對於高集中度的電鑄砥粒層會劇烈消耗這樣的切削對象,能夠抑制刀尖的變形同時良好地切削。 The present invention was developed in view of this point, and one of the objectives is to provide a cutting tool, which can severely consume the cutting object for the highly concentrated electroformed cement particle layer, and can suppress the deformation of the tool tip while cutting well.
本發明一個態樣之切削刀,係用來切削板狀物之藉由電鑄砥粒層而形成之切削刀,該電鑄砥粒層係環狀的切刃部將砥粒以鍍覆予以固定而成,其中,環狀的切刃部,由中央電鑄砥粒層與形成於中央電鑄砥粒層的兩側之外側電鑄砥粒層所構成,外側電鑄砥粒層是藉由集中度比中央電鑄砥粒層還低的砥粒層來形成。 One aspect of the cutting blade of the present invention is a cutting blade formed by an electroformed cementite layer for cutting a plate. The electroformed cementite layer is a ring-shaped cutting edge portion that coats the cementite The ring-shaped cutting edge is composed of the central electroformed cementite layer and the outer electroformed cementite layer formed on both sides of the central electroformed cementite layer. The outer electroformed cementite layer is formed by It is formed by a layer of iron particles whose concentration is lower than that of the central electroformed iron particles layer.
按照此構成,外側電鑄砥粒層的集中度比中央電鑄砥粒層還低,因此於切削集中度高的砥粒層會劇烈消耗這樣的板狀物時,切刃部的兩外側的外側電鑄砥粒層會比切刃部的中央的中央電鑄砥粒層還難以消耗。故,難 以在切刃部的兩外側造出R形狀,會抑制切刃部圓鈍變形。此外,藉由中央電鑄砥粒層與外側電鑄砥粒層之集中度差,來抑制中央電鑄砥粒層及外側電鑄砥粒層的一體性消耗,藉此切刃部會難以圓鈍變形。像這樣,能夠抑制切削刀的切刃部的變形同時良好地切削板狀物。 According to this structure, the concentration of the outer electroformed cementite layer is lower than that of the central electroformed cementite layer. Therefore, when the high-cutting concentration of the cementite layer consumes such a plate, the two outer sides of the cutting edge The outer electroformed cementite layer is more difficult to consume than the central electroformed cementite layer at the center of the cutting blade. Therefore, it is difficult By creating R shapes on both outer sides of the cutting blade, blunt deformation of the cutting blade can be suppressed. In addition, due to the poor concentration of the central electroformed cementite layer and the outer electroformed cementite layer, the integrated consumption of the central electroformed cementite layer and the outer electroformed cementite layer is suppressed, thereby making it difficult to round the cutting edge. Blunt deformation. In this way, it is possible to cut the plate-like object well while suppressing the deformation of the cutting edge portion of the cutting blade.
本發明一個態樣之切削刀中,該板狀物,為使用了由鐵基底的金屬磁性粒子與有機系黏結劑所構成之壓粉材料的電感器。 In one aspect of the cutting blade of the present invention, the plate is an inductor using a powder material composed of iron-based metal magnetic particles and an organic binder.
本發明一個態樣之切削刀中,該外側電鑄砥粒層,以集中度5~135來形成,該中央電鑄砥粒層,以比該外側電鑄砥粒層還高15以上的集中度來形成。 In one aspect of the cutting tool of the present invention, the outer electroformed cementite layer is formed with a concentration of 5 to 135, and the central electroformed cementite layer has a concentration that is 15 or more higher than that of the outer electroformed cementite layer. Degree to form.
本發明一個態樣之切削刀中,該外側電鑄砥粒層的厚度,以10μm~切刃部的厚度的1/3厚度來形成。 In one aspect of the cutting blade of the present invention, the thickness of the outer electroformed cement particle layer is formed in a thickness of 10 μm to 1/3 of the thickness of the cutting edge portion.
按照本發明,外側電鑄砥粒層是藉由集中度比中央電鑄砥粒層還低的研磨粒層來形成,因此於切削集中度高的砥粒層會劇烈消耗這樣的板狀物時,能夠抑制刀尖的變形同時良好地切削。 According to the present invention, the outer electroformed cement grain layer is formed by an abrasive grain layer whose concentration is lower than that of the central electroformed cement grain layer. Therefore, the high concentration of cutting of the abrasive grain layer will consume such a plate material severely. , It is possible to cut well while suppressing the deformation of the nose.
以下參照所附圖面,說明本實施形態。圖1為本實施形態之切削手段的分解立體圖。圖2為比較例之切削刀的說明圖。另,圖1中,為便於說明,係省略記載覆蓋切削刀的外周之輪護罩。此外,切削手段,只要是供本實施形態之切削刀裝配之構成即可,不限定於圖1所示之構成。 Hereinafter, this embodiment will be described with reference to the drawings. Fig. 1 is an exploded perspective view of the cutting means of the embodiment. Fig. 2 is an explanatory diagram of a cutting blade of a comparative example. In addition, in FIG. 1, for convenience of description, the description of the wheel guard covering the outer circumference of the cutter is omitted. In addition, the cutting means is not limited to the structure shown in FIG. 1 as long as it has a structure to which the cutting blade of this embodiment can be assembled.
如圖1所示,在切削裝置,設有切削夾盤平台(未圖示)上的板狀物之切削手段1。切削手段1,例如為空氣心軸(air spindle),隔著壓縮空氣相對於心軸外殼11將旋轉心軸12以浮動狀態支撐。旋轉心軸12的先端部分13從心軸外殼11的先端部分突出,在此旋轉心軸12的先端部分13安裝有刀座架21。刀座架21,具有圓筒狀的軸套部22、及從軸套部22的周面朝徑方向外側擴展之裝配部23。
As shown in Fig. 1, the cutting device is provided with a cutting means 1 for cutting a plate on a chuck platform (not shown). The cutting means 1 is, for example, an air spindle, and supports the rotating
在軸套部22的背面側,形成有裝配至旋轉心軸12的先端部分13的推拔面之嵌合孔(未圖示)。在軸套部22的表面側,以和嵌合孔接連之方式形成有圓形凹部24。在旋轉心軸12的先端部分13形成有母螺牙14,在嵌進嵌合孔的狀態下,旋轉心軸12的先端部分13會從圓形凹部24側露出。又,固定螺桿15插進軸套部22的圓形凹部24,固定螺桿15鎖緊於從圓形凹部24側露出的旋轉心軸12的母螺牙14,藉此,刀座架21被固定於旋轉心軸12的先端部分13。 [0016] 此外,在裝配部23,形成有供無輪轂型的切削刀30裝配之裝配面25。切削刀30,藉由安裝於刀座架21之圓環形狀的固定板26而朝裝配部23的裝配面25被推壓。在此狀態下,軸套部22的先端側從固定板26的開口27突出,環狀的固定螺帽29鎖緊於形成於軸套部22的先端側的外周面之公螺牙28。又,安裝於旋轉心軸12之切削刀30高速旋轉,板狀物被切削刀30切入,藉此板狀物被分割成各個晶片。 [0017] 如圖2A所示,比較例之切削刀40,係被成形為將鑽石砥粒以電鑄結合劑黏固而成之薄的圓環形狀。一般而言,於半導體晶圓W等板狀物之切削時,若砥粒的集中度低則砥粒的消耗劇烈,因此會使用由高集中度的電鑄砥粒層所構成之切削刀40。此外,當切斷切割膠帶T上的半導體晶圓W的情形下,切割膠帶T太薄而無法以切削刀40深入切進半導體晶圓W。因此,主要是使用切削刀40的刀尖來切削半導體晶圓W。 [0018] 不過,如圖2B所示,作為切削對象的板狀物,存在有使用了由鐵基底的金屬磁性粒子(鐵球)與有機系黏結劑所構成之壓粉材料的電感器I。將此電感器I以上述的切削刀40切削,結果明明是高集中度的電鑄砥粒層,但卻發生切削刀40的消耗量劇烈之問題。此處,本件申請人調查了電感器I與電鑄砥粒層的集中度之關係,發現了和通常的半導體晶圓W等板狀物相反之切削消耗特性,亦即,相較於高集中度的電鑄砥粒層而言,在低集中度的電鑄砥粒層消耗量會變少。 [0019] 推測這是因為若砥粒的集中度太高,則結合劑會變少而每1個砥粒的保持力會減弱,加上電感器I內的金屬磁性粒子的目(mesh)堵塞增大而摩擦力增加的緣故。更詳細地說,推測是若砥粒的集中度高則結合劑所造成的砥粒的保持力弱,因切削時的摩擦力會增加,會因為具延展性的金屬磁性粒子而造成砥粒從切削刀40被拔下之狀況。像這樣,依板狀物的種類不同,反而使用集中度低的電鑄砥粒層的切削刀,會減少砥粒的消耗而難以在切刃部造出R形狀。 [0020] 因此,如圖2C所示,於電感器I等板狀物之切削時,考慮使用由低集中度的電鑄砥粒層所構成之單層構造的切削刀50。然而,切削刀50的消耗雖會因低集中度的電鑄砥粒層而變少,但隨著切削持續,砥粒會逐漸從切削刀50脫落。然後,在切削刀50的角側開始造出R形狀,R形狀逐漸變大,藉此導致刀尖全體圓鈍變形。若以變得圓鈍的刀尖來切削電感器I,則會在分割後的晶片形成裙形狀,而無法維持在穩定的製品加工尺寸。 [0021] 鑑此,本實施形態之切削刀30(參照圖3),係形成為將寬幅方向的中央做成高集中度的砥粒層,將寬幅方向的兩外側做成低集中度的砥粒層而成之多層構造。即使以切削刀30切削電感器I,切削刀30的寬幅方向的兩外側的砥粒層也難以消耗,而即使外側的砥粒層消耗,因砥粒層的厚度薄,故R形狀不會變大。如此一來,於切削電感器I等板狀物時會抑制刀尖圓鈍變形,不會在分割後的晶片的側面形成裙形狀,能夠維持在穩定的製品加工尺寸。 [0022] 以下參照圖3,說明本實施形態之切削刀。圖3為本實施形態之切削刀的截面模型圖。 [0023] 如圖3A所示,切削刀30的切刃部31,是形成為藉由鍍覆將砥粒固定而成之環狀的電鑄砥粒層,而可切削使用了由鐵基底的金屬磁性粒子與有機系黏結劑所構成之壓粉材料的電感器I(參照圖3B)。另,作為切削刀30的砥粒,例如使用5μm~100μm的鑽石砥粒、CBN砥粒。切刃部31,為由寬幅方向的中央的中央電鑄砥粒層32與中央電鑄砥粒層32的左右兩側的外側電鑄砥粒層33所構成之多層構造,各外側電鑄砥粒層33相較於中央電鑄砥粒層32是以集中度低的砥粒層來形成。因此,於電感器I之切削時,比高集中度的中央電鑄砥粒層32還低集中度的外側電鑄砥粒層33會變得難以消耗。 [0024] 如圖3B所示,電感器I在愈高集中度處愈會使砥粒脫落,因此於電感器I之切削時高集中度的中央電鑄砥粒層32會消耗,另一方面低集中度的外側電鑄砥粒層33消耗會被抑制。此時,切刃部31的角部分是由外側電鑄砥粒層33形成,因此切刃部31的角部分的消耗會被抑制而難以造出R形狀。藉由反覆實施電感器I之切削,外側電鑄砥粒層33會逐漸消耗而開始在切刃部31的角部分造出R形狀,但在外側電鑄砥粒層33造出的R形狀不會變得太大。 [0025] 這是因為在外側電鑄砥粒層33及中央電鑄砥粒層32發生了砥粒的集中度差,外側電鑄砥粒層33和中央電鑄砥粒層32的消耗速度相異而不會一體地消耗之緣故。外側電鑄砥粒層33及中央電鑄砥粒層32個別地消耗,因此即使開始在外側電鑄砥粒層33造出R形狀,於薄寬幅的外側電鑄砥粒層33內R形狀也會受到抑制。像這樣,藉由外側電鑄砥粒層33與中央電鑄砥粒層32之層積構造來製造出消耗速度的速度差,藉此抑制外側電鑄砥粒層33及中央電鑄砥粒層32的一體性消耗而切刃部31會變得難以圓鈍變形。 [0026] 另,外側電鑄砥粒層33,只要形成為於板狀物切削時消耗量會急遽增加之基準的集中度以下即可。例如,當切削電感器I的情形下,若電鑄砥粒層的集中度超過135則消耗量會急遽增加,因此外側電鑄砥粒層33是以集中度5以上、較佳為集中度45以上,且集中度135以下、較佳為集中度90以下來形成。此外,中央電鑄砥粒層32,為避免於板狀物切削時和外側電鑄砥粒層33一體地消耗,只要以比外側電鑄砥粒層33的集中度還高的集中度來形成即可。 [0027] 具體而言,若中央電鑄砥粒層32的集中度太接近外側電鑄砥粒層33的集中度,則無異於單層刀,就算身為多層刀,切刃部31仍會圓鈍突出。另一方面,若中央電鑄砥粒層32的集中度比外側電鑄砥粒層33的集中度還高太多,則中央電鑄砥粒層32會消耗過度而切刃部31的中央會窪陷成凹狀。因此,考量切刃部31的角部分的消耗情形及中央部分的消耗情形,在切刃部31會一直維持略平坦形狀而被消耗之程度內,將中央電鑄砥粒層32的集中度形成為比外側電鑄砥粒層33的集中度還高。 [0028] 例如,當切削電感器I的情形下,若集中度差低於15則即使是多層刀仍會劇烈變成R形狀,因此中央電鑄砥粒層32是以比外側電鑄砥粒層33還高15以上的集中度、較佳是高60以上的集中度來形成。此外,若集中度差超過200則中央電鑄砥粒層32會消耗過度,因此中央電鑄砥粒層32與外側電鑄砥粒層33之集中度差是抑制在200以下、較佳是集中度差為150以下。像這樣,將切削刀30做成為集中度相異之多層構造,藉此個別地調整角部分和中央部分的消耗情形。 [0029] 另,若外側電鑄砥粒層33的厚度低於10μm則身為砥粒層的功能會消失,若外側電鑄砥粒層33的厚度超過切刃部31的厚度的1/3,則切刃部31的角部分R形狀會變得太大。因此,外側電鑄砥粒層33的厚度是形成為10μm以上、較佳為15μm以上,且厚度為切刃部31的厚度的1/3以下、較佳為1/4以下。藉由使用這樣的多層構造的切削刀30,於電感器I之切削時會抑制切刃部31圓鈍變形,可良好地持續切削多數個電感器I。 [0030] (實驗例) 以下說明實驗例。實驗例中,作為切削刀,準備了鑽石砥粒的平均粒徑20μm,且電鑄砥粒層為集中度5、30、45、75、90、105、135、150而厚度300μm的複數個單層刀,測定了以各切削刀切削電感器時之刀消耗量。實驗中,準備了長度140×寬幅140×厚度0.9mm的假電感器,對於集中度相異的每一切削刀以心軸旋轉數20000rpm、饋送速度25mm/sec、加工線數100線實施了切削加工。如此一來,得到了如圖4所示般的結果。 [0031] 如圖4所示,在集中度5、30、45、75、90、105、135的切削刀,隨著集中度變高而消耗量變大,但看不出大幅的變化。另一方面,在集中度150的切削刀,比起集中度135以下的切削刀,消耗量急遽地增加了。像這樣,得知了於切削電感器時,在集中度135以下的電鑄砥粒層,切削刀的消耗會受抑制,在超過了集中度135的電鑄砥粒層,切削刀的消耗會變多。故,多層刀,較佳是藉由相對難以消耗之集中度135以下的電鑄砥粒層來形成兩外側,藉由相對容易消耗之集中度150以上的電鑄砥粒層來形成內側。 [0032] 接下來,使用單層刀與多層刀,反覆對於電感器之切削,觀察了切刃部的截面形狀。作為單層刀,使用了由高集中度(集中度180)的電鑄砥粒層所構成之單層刀。作為多層刀,使用了在高集中度(集中度150)的中央電鑄砥粒層的兩外側層積低集中度(集中度90)的一對外側電鑄砥粒層而成之多層刀。單層刀及多層刀的總厚各自做成300μm,多層刀的中央電鑄砥粒層及一對外側電鑄砥粒層的厚度各自形成為200μm、50μm。 [0033] 如圖5所示,單層刀,於修整(dress)剛完成後的切刃部的截面形狀僅有略微變化,但於第1片電感器之切削後,切刃部的截面形狀明顯地圓鈍了。像這樣,單層刀僅加工了第1片電感器就造出R而變得無法使用。另,此處是以高集中度的單層刀加工,若低集中度的單層刀加工,可抑制切刃部的消耗。但,即使以低集中度的單層刀加工,由於反覆切削,料想在早期階段就會圓鈍變形。 [0034] 另一方面,多層刀,於修整剛完成後幾乎看不出切刃部的截面形狀的變化,於第1片電感器之切削後,切刃部的截面形狀略微變化了之後,切刃部的截面形狀便沒有再圓鈍變化。像這樣,多層刀雖切刃部會略微變形,但難以在切刃部造出R形狀,能夠穩定持續切削複數個(本實驗中為18片)電感器。此外,外側電鑄砥粒層與中央電鑄砥粒層之集中度差受到適度地調整,因此不會僅有切刃部的中央深入消耗而是維持了穩定的形狀。 [0035] 如以上般,按照本實施形態之切削刀30,外側電鑄砥粒層33的集中度比中央電鑄砥粒層32還低,因此於切削集中度高的砥粒層會劇烈消耗這樣的電感器I時,外側電鑄砥粒層33會比中央電鑄砥粒層32還難以消耗。故,難以在切刃部31的兩外側造出R形狀,會抑制切刃部31圓鈍變形。此外,藉由中央電鑄砥粒層32與外側電鑄砥粒層33之集中度差,來抑制中央電鑄砥粒層32及外側電鑄砥粒層33的一體性消耗,藉此切刃部31會難以圓鈍變形。像這樣,能夠抑制切削刀的切刃部的變形同時良好地切削電感器I。 [0036] 另,本實施形態中,作為切削對象的板狀物是示例說明了電感器,但不限定於電感器等的電子零件。切削對象的板狀物,只要是集中度愈低則砥粒層愈難消耗,而集中度愈高則砥粒層愈變得易消耗這樣的物即可。 [0037] 此外,本實施形態中,作為切削刀是示例說明了無輪轂型的墊片狀(washer)刀,但不限定於此構成。切削刀,亦可為將切刃部固定於輪轂基台之輪轂狀刀。 [0038] 此外,本實施形態中,切削刀是以中央電鑄砥粒層與一對外側電鑄砥粒層之3層構造來形成,但不限定於此構成。切削刀,只要形成為包含中央電鑄砥粒層與一對外側電鑄砥粒層之多層構造即可,例如亦可形成為在中央電鑄砥粒層與一對外側電鑄砥粒層之間更設置電鑄砥粒層而成之5層構造。 [0039] 此外,雖說明了本實施形態及變形例,但作為本發明的其他實施形態,亦可為將上述實施形態及變形例予以全體地或部分地組合而成者。 [0040] 此外,本發明之實施形態不限定於上述的實施形態及變形例,在不脫離本發明的技術性思想的意旨之範圍內亦可做各式各樣的變更、置換、變形。甚至,若因技術的進歩或衍生之其他技術,而能夠以別的方式實現本發明之技術性思想,則亦可用該方法來實施。是故,申請專利範圍,涵括本發明的技術性思想之範圍內可能包含之所有的實施形態。 [0041] 此外,本實施形態中,說明了將本發明運用於切削刀之構成,但亦可運用於對於高集中度的電鑄砥粒層會劇烈消耗這樣的切削對象能夠抑制刀尖的變形同時良好地加工之其他加工具。 [產業利用性] [0042] 如以上說明般,本發明,具有對於高集中度的電鑄砥粒層會劇烈消耗這樣的切削對象能夠抑制刀尖的變形同時良好地切削之效果,特別是對於切削使用了由鐵基底的金屬磁性粒子與有機系黏結劑所構成之壓粉材料的電感器之切削刀而言係為有用。On the back side of the
[0043]30‧‧‧切削刀31‧‧‧切刃部32‧‧‧中央電鑄砥粒層33‧‧‧外側電鑄砥粒層I‧‧‧電感器(板狀物)[0043] 30‧‧‧
[圖1]本實施形態之切削手段的分解立體圖。 [Fig. 1] An exploded perspective view of the cutting means of this embodiment.
[圖2A~2C]比較例之切削刀的說明圖。 [Fig. 2A~2C] The explanatory diagram of the cutting tool of the comparative example.
[圖3A~3B]本實施形態之切削刀的截面模型圖。 [Figures 3A~3B] Cross-sectional model diagrams of the cutting blade of this embodiment.
[圖4]集中度與消耗量之關係示意圖。 [Figure 4] Schematic diagram of the relationship between concentration and consumption.
[圖5]切削刀的切刃部的截面形狀的變化示意圖。 [Fig. 5] A schematic view of the change in the cross-sectional shape of the cutting edge portion of the cutting blade.
31:切刃部 31: Cutting edge
32:中央電鑄砥粒層 32: Central electroformed stone layer
33:外側電鑄砥粒層 33: Outer electroformed stone layer
I:電感器(板狀物) I: Inductor (plate)
T:切割膠帶 T: Cutting tape
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JPH0730279Y2 (en) * | 1987-03-17 | 1995-07-12 | 三菱マテリアル株式会社 | Electroformed thin blade grindstone |
JPH0825143B2 (en) * | 1990-09-28 | 1996-03-13 | 三菱マテリアル株式会社 | Electroformed grindstone |
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JP2003179004A (en) * | 2001-12-12 | 2003-06-27 | Hitachi Ltd | Method for manufacturing semiconductor device and dicing device usable for the method |
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KR100556189B1 (en) * | 2004-12-30 | 2006-03-06 | 이화다이아몬드공업 주식회사 | Cutting segment for cutting tool and cutting tools |
JP4779580B2 (en) * | 2005-11-02 | 2011-09-28 | 三菱マテリアル株式会社 | Electroformed thin blade whetstone |
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JP4685952B2 (en) * | 2009-06-19 | 2011-05-18 | 義純 福井 | Winding integrated mold coil and method for manufacturing winding integrated mold coil |
US20150183131A1 (en) * | 2013-12-27 | 2015-07-02 | Chee Seng Foong | Semiconductor wafer dicing blade |
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