JPH0825143B2 - Electroformed grindstone - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to an electroformed abrasive having a plurality of abrasive grain layers, and in particular, it is a grindstone for cutting or grooving and has excellent sharpness. The cutting edge is made up of layers, so there is less checking,
The present invention relates to an electroformed whetstone having a plurality of abrasive grain layers that constitute a side portion of the cutting edge portion with an abrasive grain layer capable of obtaining a good finished surface.

"Prior Art" A conventional cutting or grooving grindstone has a one-layer structure composed of one type of abrasive grain layer, and the blade tip portion and the side portion of the blade tip portion have the same grindstone. It was formed by a grain layer.

[Problems to be Solved by the Invention] With this conventional grindstone, for example, the following steps were required to perform grooving processing on ferrite used in a magnetic head of a video that requires high processing accuracy.

That is, first, grooving is performed with a grooving grindstone that places importance on machining speed, and then a finishing grindstone made of fine abrasive grains is used to remove chipping caused by this grooving and Finishing processing was applied to the side surface to obtain the target magnetic head groove.

For this reason, there are drawbacks that rapid processing is difficult and processing costs are high.

An object of the present invention is to provide a novel electroformed grindstone having a plurality of abrasive grain layers capable of performing such grooving in one step.

"Means for Solving the Problems" In order to solve the above problems, the electroformed grindstone according to claim 1 of the present invention is a first formed by dispersion plating.
A disc-shaped electroformed grindstone having a rectangular cross section in which a second abrasive grain layer is formed on each side of the abrasive grain layer by a dispersion plating process to have a three-layer structure in the thickness direction. The abrasive grain content of the second abrasive grain layer is lower than the abrasive grain content of the first abrasive grain layer.

Further, the grain size of the abrasive grains contained in the second abrasive grain layer may be smaller than the grain size of the abrasive grains contained in the first abrasive grain layer.

The electroformed grindstone according to claim 3 of the present invention has a thickness obtained by forming second abrasive grain layers on both side surfaces of the first abrasive grain layer formed by dispersion plating treatment by dispersion plating treatment, respectively. A disc-shaped electroformed grindstone having a rectangular cross section having a three-layered structure in the direction, wherein the mechanical strength of the abrasive grains contained in the second abrasive grain layer is the same as that of the first abrasive grain layer. It is characterized by being lower than the mechanical strength of the abrasive grains contained.

The electroformed grindstone according to claim 4 of the present invention has a second abrasive grain layer formed on each side surface of the first abrasive grain layer formed by the dispersion plating treatment by the dispersion plating treatment to obtain a thickness A disc-shaped electroformed grindstone having a rectangular cross section having a three-layered structure in the direction, in which the hardness and strength of the binder forming the second abrasive grain layer is the same as that of the first abrasive grain layer. It is characterized by being lower than the hardness and strength of the binder to be formed.

[Operation] When grooving is performed using the electroformed grindstone according to claims 1 to 4 of the present invention, the first abrasive grain layer mainly grinds in the depth direction of the groove to perform grooving. Since the second abrasive grain layer grinds the side surface of the groove efficiently, it is possible to carry out high-speed grooving while maintaining good cutting surface roughness with small chipping.

Further, when performing grooving, the cutting powder generated in the groove loses its escape and its pressure increases, and a phenomenon occurs in which the outer peripheral cylindrical surface of the grindstone wears in a deeper concave shape in the central portion in the thickness direction. In the electroformed grindstone according to any one of claims 1 to 4, the first abrasive grain layer located in the central portion in the width direction has a higher abrasive grain content than the second abrasive grain layer, and Since the abrasive grains are made large, or the mechanical strength of the abrasive grains is made high, or the hardness and strength of the binder are made high, the wear balance between the first abrasive layer and the second abrasive layer is balanced. As a result, the outer peripheral cylindrical surface of the grindstone does not wear into a deeper concave shape toward the central portion in the thickness direction, and thus a groove having a rectangular cross section can be processed at high speed.

"Embodiment" FIG. 1 shows a first embodiment of the present invention, in which reference numeral 1 indicates an electroformed grindstone. This electroformed grindstone 1
Is a thin disc, and is located at the center of the first
And the second abrasive grain layers 4 and 5 formed on both sides of the first abrasive grain layer 3 have a three-layer structure. Further, the radius R ₀ of the electroformed grindstone 1 = 50 mm, the first abrasive grain layer 3
Thickness t ₁ = 70 μm, the thickness t 2 of the second abrasive layers 4, 5 t ₁ = 7 μm
m.

The first abrasive grain layer 3 contains superabrasive grains having a relatively large grain size, and the second abrasive grain layers 4 and 5 are superabrasive grains contained in the first abrasive grain layer 3. It contains superabrasive grains having a smaller particle diameter than that of the above.

The term "superabrasive grains" as used herein refers to diamond grains, cubic boron nitride (CBN) grains, or the like.

Next, a method of manufacturing the electroformed grindstone having the above structure will be described.

 First, the main points of the process are as follows.

a A part of the substrate having a releasability with respect to the plated metal is formed, and the other part is masked.

b The substrate is subjected to a cleaning process such as degreasing.

c The second plating layer is formed by subjecting the substrate to dispersion plating by using a first plating solution in which abrasive particles are dispersed.

d The substrate is washed with water including brushing.

e Dispersion plating is applied to the substrate by using a second plating solution in which abrasive grains are dispersed, and the second plating liquid is superposed on the second abrasive grain layer 4 to form a first coating.
The abrasive grain layer 3 is formed.

f The substrate is washed with water including brushing.

g Dispersive plating is applied to the substrate using the first plating solution, and the second abrasive layer 5 is formed on the first abrasive layer 3 so as to be superposed thereon.

h The substrate is washed with water including brushing.

i The abrasive grain layer having a three-layer structure is peeled from the substrate and dried.

j The peeled abrasive grain layer is punched to be shaped into a grindstone.

k A rounding process and a dressing process are applied to the abrasive grain layer and a finishing process is performed to obtain an electroformed grindstone according to the present invention.

 Details of each of the above steps are as follows.

That is, the substrate has a passivation film formed on the surface of a stainless steel plate material, and has a property that when the plating layer is formed on this surface, the plating layer can be easily peeled off. ing.

Further, the cleaning treatment such as masking and degreasing or the washing treatment applied to this is performed by a conventionally known method.

The composition of the first plating solution in which the abrasive grains are dispersed is as follows.

Sulfamic acid Ni …… 450g / l Ni chloride ………………………… 10g / l Boric acid ………………………… 30g / l Brightener ………………………… Small amount of pit inhibitor ……………… Small amount of PH ………………………… 4.0 Types of dispersed abrasive grains ……………… Diamond grain size of dispersed abrasive grains ……………… 2 to 4 μm Concentration of dispersed abrasive grains 300 g / l The procedure of the dispersion plating treatment using the first plating liquid will be described with reference to FIG.

In the figure, reference numeral 10 is a plating tank in which the first plating solution 12 is stored.

Next, the electrode plate 3 forming the anode, the substrate 14 forming the cathode, and the stirring means 15 are dipped in the plating solution 12.

In this case, the surface of the substrate 14 is covered with a masking material 17 except for the grindstone prototype portion 16.
FIG. 3 shows a front view of the substrate 14 thus masked.

Then, while controlling the temperature of the plating solution 12 by a temperature control means (not shown) provided in the plating tank 10, the stirring means 15 is moved to the arrow p in the figure.
While rotating as shown by, the positive electricity to the electrode plate 13, the negative electricity to the substrate 14, respectively,
Apply dispersion plating.

 The plating conditions at this time are as follows.

Bath temperature ………………………… 50 ℃ Cathode current density ………… 3A / dm ² Plating time …………… 10 minutes As a result, the surface of the substrate 14 The second abrasive grain layer 4 having the composition is formed.

Diamond content: 10 Vol% Plating thickness: 7 μm Next, the substrate 4 was washed with water including brushing, and then the plating bath 10 was plated. The second plating solution is stored in the plating tank 10 by exchanging the plating solution, and the dispersion plating treatment is performed by the same method as in the case where the second abrasive grain layer 4 is formed. First abrasive grain layer 3 overlaid on grain layer 4
To form.

In this case, the composition of the second plating solution, the abrasive grains to be dispersed, and the plating conditions are as follows.

Composition of plating solution: Same as the above-mentioned first plating solution Type of abrasive grain: Diamond grain Size of abrasive grain: 8 to 20 μm Concentration …………………… 150g / l Bath temperature ………………………… 50 ℃ Plating time ……………… 90 minutes Composition of the first abrasive layer 3 thus formed Is as follows.

Diamond content ……………… 25Vol% Abrasive grain layer thickness ……………… 70μm After this plating process, wash again.

After that, the substrate is again formed using the first plating solution.
14 is subjected to a dispersion plating treatment to form a second abrasive grain layer 5 on the first abrasive grain layer 3.

The plating conditions and the abrasive grain layer formed at this time are the same as in the case of forming the first abrasive grain layer 3.

Next, the three-layered abrasive grain layer thus obtained is applied to the substrate.
It is peeled from 14, washed with water and dried, and then shaped into the shape of a grindstone by punching.

Further, this is subjected to perfect circular processing, and dressing processing is applied to the peeled surface and the portion constituting the cutting edge, followed by washing to obtain an electroformed grindstone 1 according to the present invention as shown in FIG.

When cutting or grooving grinding is performed with this electroformed grindstone 1, the outer peripheral portion of the first abrasive grain layer 3 serves as the cutting edge, and the grain size of the diamond abrasive grains contained in this abrasive grain layer 3 Is 8 ~
Since it is as large as 20 μm and the content is as large as 25 Vol%,
High-speed grinding can be performed extremely efficiently.

On the other hand, both side portions of the first abrasive grain layer 3 have the second abrasive grain layer 4 on both sides.
And 5 and the particle diameter of the diamond abrasive grains contained in the second abrasive grain layers 4 and 5 is as small as 2 to 4 μm, and the content thereof is also as small as 10 Vol%, No chipping occurs on the side surface of the cut portion or the side surface of the groove portion ground by the abrasive grain layers 4 and 5, and
A finished surface with high finishing accuracy can be obtained.

As a result of actually performing grinding with the electroformed grindstone 1 of this example, chipping is 1/4 and finished surface roughness is good as compared with the conventional single-layer structure grindstone having a diamond abrasive grain size of 8 to 20 μm. Moreover, the processing speed was the same.

Therefore, in the electroformed grindstone 1 of this embodiment, when performing the grooving, it is not necessary to finish the side surface of the groove, and for example, the grooving of the ferrite head of the video which has been conventionally performed in two steps. Precision processing such as can be performed in one step and at high speed.

Further, according to the method for manufacturing the electroformed grindstone 1 of this embodiment,
As described above, a very useful and novel grindstone can be obtained relatively easily and quickly.

Furthermore, when changing the composition of each abrasive grain layer according to the processing purpose, it suffices to change the type, amount or particle size of the abrasive grains to be dispersed, the composition of the plating solution or the plating conditions, and any equipment Since it is not necessary to change, it is possible to efficiently manufacture various types of electroformed grindstones at low cost.

In addition, in this method, the step of exposing the abrasive grains on the surface separated from the substrate 14 is also performed during the dressing step in the finishing step, and the single abrasive grain exposing step is omitted. Is simple.

Next, a second embodiment of the electroformed grindstone of the present invention will be described.
In the electroformed grindstone of this example, the content of the abrasive grains (diamond grains) contained in the first abrasive grain layer 3 in FIG. 1 is the content of the diamond grains contained in the second abrasive grain layers 4 and 5. The amount is set higher than the amount, and the other types of abrasive grains, the grain size of the abrasive grains, the mechanical strength of the abrasive grains, and the like are set to be equal.

In such an electroformed whetstone, when the dispersion plating treatment is performed, the concentration of diamond particles dispersed in the second plating solution in the manufacturing method of the first embodiment is dispersed in the first plating solution. It is manufactured by setting the concentration higher than the grain concentration, setting the plating time in the second plating solution longer than the plating time in the first plating solution, and setting the other conditions equally.

 The specific conditions for the dispersion plating process are as follows.

Abrasive grains dispersed in the first plating solution Diamond particle size …………………… 8 to 20 μm Concentration ………………………… 50g / l Plating time …………… 30 minutes Abrasive grains to be dispersed in the second plating solution Diamond particle size …………………… Same as above Concentration ………………………… 150g / l Plating time …………… 90 minutes The composition of each abrasive grain layer of the resulting grindstone is as follows.

First abrasive grain layer Diamond content ……………… 25Vol% Plating thickness ……………… 90μm Second abrasive grain diamond content ……………… 10Vol% Plating thickness ………………… 20μm The electroformed grindstone with the above structure has 10% less chipping than the conventional grindstone with a single layer structure consisting only of the second abrasive layer.
There was little and the cut surface roughness was also good.

Next, a third embodiment of the electroformed grindstone of the present invention will be described.
In the electroformed grindstone of this example, the mechanical strength such as the crushing strength of the abrasive grains (diamond grains) contained in the first abrasive grain layer 3 in FIG. 1 is contained in the second abrasive grain layers 4 and 5. The mechanical strength of the diamond grains is set to be higher, and the types of other abrasive grains, the grain size of the abrasive grains, the content of the abrasive grains, and the like are set to be equal.

In such an electroformed grindstone, when the dispersion plating treatment is performed, the diamond grains dispersed in the second plating liquid in the manufacturing method of the first embodiment are more than the diamond grains dispersed in the first plating liquid. Also has high mechanical strength,
It is manufactured by setting other conditions equally.

 The specific conditions for the dispersion plating process are as follows.

Abrasive grains dispersed in the first plating solution Diamond particle size …………………… 4 to 6 μm Concentration …………………… 200g / l Diamond type ……………… Tomei diamond IRM (product name) Plating time …………………… 15 minutes Abrasive grains dispersed in the second plating solution Diamond grain size (concentration) ………… Same as above Diamond type …………………… Tomei Diamond IMM (trade name) The electroformed grindstone with the above-described structure has less chipping and a better cut surface roughness than the conventional single-layer grindstone made of IMM grains.

Next, a fourth embodiment of the electroformed grindstone of the present invention will be described.
In the electroformed grindstone of this embodiment, the binder hardness and strength of the first abrasive grain layer 3 in FIG. 1 is set higher than the binder hardness and strength of the second abrasive grain layers 4 and 5, and The types of abrasive grains, the grain size of the abrasive grains, the mechanical strength of the abrasive grains, etc. are set to be equal.

Such an electroformed grindstone is manufactured by making the composition of the first plating solution and the plating conditions different from those of the second plating solution during the dispersion plating treatment.

 The specific conditions for the dispersion plating process are as follows.

First plating solution composition Ni sulfamate: 450g / l Ni chloride: 10g / l Boric acid: 30g / l Pit preventer: …… Small amount of PH ………………………… 4.0 Diamond grain size …………………… 4 ～ 6μm Diamond grain concentration ………… 300g / l Plating with this first plating solution The processing conditions are as follows.

Bath temperature ……………………………… 50 ℃ Cathode current density ……………… 3A / dm ² Plating time ………………… 15 minutes Second plating solution composition Ni sulfamate … 450g / l Sulfamic acid Co ……… 50g / l Ni chloride ………………………… 10g / l Boric acid ………………………… 30g / l Pit preventive agent ……………… Small amount PH ………………………… 4.0 Diamond grain, concentration ………… Same as the first plating solution The plating treatment condition with this second plating solution is that the plating time is 120 minutes. Others are the same as the plating treatment conditions with the first plating solution.

The hardness of each abrasive grain layer of the electroformed grindstone obtained by this method is as follows.

1st abrasive grain layer ……………… Hv = 500 2nd abrasive grain layer ……………… Hv = 200 As a result of conducting a ferrite cutting test with the electroformed grindstone thus obtained, Hv = The chipping was 30% less and the cut surface roughness was better than that of a conventional grindstone consisting of 500 single-layered abrasive grains.

In addition, in the above-mentioned 1st-4th Example, although the 2nd abrasive grain layer was each formed in the both side surfaces of the 1st abrasive grain layer, the example which set it as 3 layer structure was described, but depending on a processing application. The second abrasive grain layer may be formed only on one side surface of the first abrasive grain layer to form a two-layer structure, or four or more abrasive grain layers may be formed in layers.

Furthermore, in each of the above-described embodiments, the case where an electroformed grindstone having a plurality of abrasive grain layers is manufactured by the dispersion plating treatment by electric plating, but it may be manufactured by electroless plating. The electroless plating requires a long plating time, but is advantageous when the abrasive grain layer contains a large amount of abrasive grains.

[Advantages of the Invention] As described above, when grooving is performed using the electroformed grindstone of the present invention, grinding in the depth direction of the groove is performed by the first abrasive grain layer, and grinding of the groove side surface is performed. Is performed by the second abrasive grain layer, it is possible to perform high-speed grooving while maintaining good cutting surface roughness with small chipping.

In addition, even when the shavings generated in the grooves lose their escape and the pressure increases when performing the grooving process, in the electroformed grindstone of the present invention, the first abrasive grain layer located at the center in the width direction is Since the abrasive grain content is increased, the abrasive grains are increased, the mechanical strength of the abrasive grains is increased, and the hardness and strength of the binder are increased for the two abrasive grain layers, The wear of the abrasive grain layer and the second abrasive grain layer is balanced, and the outer peripheral cylindrical surface of the grindstone is not worn in a concave shape deeper toward the center in the width direction, so that grooving can be performed at high speed.

[Brief description of drawings]

FIG. 1 is a sectional view of an electroformed grindstone according to an embodiment of the present invention, FIG. 2 is an explanatory view for explaining dispersion plating treatment, and FIG.
It is a front view of the substrate with which masking was performed. 1 ... Electroformed grindstone, 3 ... first abrasive grain layer, 4,5 ... second abrasive grain layer, 10 ... plating tank, 12 ... first plating solution, 13 ...
… Electrode plate, 14… Substrate, 15… Stirring means, 16… Whetstone prototype part, 17… Masking material.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor, Kazuyoshi Adachi, 1-297 Kitabukuro-cho, Omiya-shi, Saitama, Central Research Laboratory, Mitsubishi Metals Co., Ltd. (56) References JP 59-142067 (JP, A) JP 48-9389 (JP, A) Actually opened 59-109455 (JP, U) Actually opened 60 -103656 (JP, U) Actual public Sho 53-13991 (JP, Y2)

Claims (4)

[Claims] 1. A second abrasive grain layer is formed on both side surfaces of a first abrasive grain layer formed by dispersion plating by dispersion plating to form a three-layer structure in the thickness direction. A disc-shaped electroformed grindstone having a rectangular cross section, wherein the content of abrasive grains in the second abrasive layer is lower than the content of abrasive grains in the first abrasive layer. An electroformed grindstone. 2. The electroforming according to claim 1, wherein the abrasive grains contained in the second abrasive grain layer are smaller than the abrasive grains contained in the first abrasive grain layer. Whetstone. 3. A second abrasive grain layer is formed on both side surfaces of the first abrasive grain layer formed by the dispersion plating treatment by the dispersion plating treatment to form a three-layer structure in the thickness direction. A disk-shaped electroformed grindstone having a rectangular cross section, wherein the mechanical strength of the abrasive grains contained in the second abrasive grain layer is greater than the mechanical strength of the abrasive grains contained in the first abrasive grain layer. An electroformed grindstone characterized by being also lowered. 4. A second abrasive grain layer is formed on both side surfaces of a first abrasive grain layer formed by dispersion plating by dispersion plating to form a three-layer structure in the thickness direction. A disk-shaped electroformed grindstone having a rectangular cross section, wherein the hardness and strength of the binder forming the second abrasive grain layer is greater than the hardness and strength of the binder forming the first abrasive grain layer. An electroformed grindstone characterized by being lowered.