JPH0152151B2 - - Google Patents
Info
- Publication number
- JPH0152151B2 JPH0152151B2 JP22848885A JP22848885A JPH0152151B2 JP H0152151 B2 JPH0152151 B2 JP H0152151B2 JP 22848885 A JP22848885 A JP 22848885A JP 22848885 A JP22848885 A JP 22848885A JP H0152151 B2 JPH0152151 B2 JP H0152151B2
- Authority
- JP
- Japan
- Prior art keywords
- abrasive
- plating
- layer
- abrasive grain
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007747 plating Methods 0.000 claims description 107
- 239000006061 abrasive grain Substances 0.000 claims description 103
- 239000000758 substrate Substances 0.000 claims description 37
- 239000002245 particle Substances 0.000 claims description 24
- 238000000227 grinding Methods 0.000 claims description 23
- 238000000034 method Methods 0.000 claims description 22
- 239000006185 dispersion Substances 0.000 claims description 18
- 238000004519 manufacturing process Methods 0.000 claims description 15
- 239000007788 liquid Substances 0.000 claims description 14
- 239000000203 mixture Substances 0.000 claims description 13
- 239000011230 binding agent Substances 0.000 claims description 4
- 238000005530 etching Methods 0.000 claims description 2
- 238000007493 shaping process Methods 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 79
- 229910003460 diamond Inorganic materials 0.000 description 22
- 239000010432 diamond Substances 0.000 description 22
- 238000005520 cutting process Methods 0.000 description 8
- 238000011282 treatment Methods 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 230000000873 masking effect Effects 0.000 description 5
- 238000005406 washing Methods 0.000 description 5
- 230000001680 brushing effect Effects 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 238000003754 machining Methods 0.000 description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 3
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 3
- 239000004327 boric acid Substances 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- LNOPIUAQISRISI-UHFFFAOYSA-N n'-hydroxy-2-propan-2-ylsulfonylethanimidamide Chemical compound CC(C)S(=O)(=O)CC(N)=NO LNOPIUAQISRISI-UHFFFAOYSA-N 0.000 description 3
- 239000002356 single layer Substances 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 229910000859 α-Fe Inorganic materials 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000005238 degreasing Methods 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 244000235115 Alocasia x amazonica Species 0.000 description 1
- YTAHJIFKAKIKAV-XNMGPUDCSA-N [(1R)-3-morpholin-4-yl-1-phenylpropyl] N-[(3S)-2-oxo-5-phenyl-1,3-dihydro-1,4-benzodiazepin-3-yl]carbamate Chemical compound O=C1[C@H](N=C(C2=C(N1)C=CC=C2)C1=CC=CC=C1)NC(O[C@H](CCN1CCOCC1)C1=CC=CC=C1)=O YTAHJIFKAKIKAV-XNMGPUDCSA-N 0.000 description 1
- 238000005282 brightening Methods 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- IIACRCGMVDHOTQ-UHFFFAOYSA-M sulfamate Chemical compound NS([O-])(=O)=O IIACRCGMVDHOTQ-UHFFFAOYSA-M 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、複数の砥粒層を有する研削砥石製造
方法に係り、特に、切断もしくは溝切り加工用の
砥石であつて、切れ味の良い砥粒層で刃先部を構
成し、チツピングが少なく、良い仕上げ面を得る
ことができる砥粒層で前記刃先部の側部を構成し
た複数層の砥粒層を有する研削砥石製造方法に関
するものである。Detailed Description of the Invention [Field of Industrial Application] The present invention relates to a method for manufacturing a grinding wheel having a plurality of abrasive grain layers, and particularly to a grinding wheel for cutting or grooving, which has good sharpness. The present invention relates to a method for manufacturing a grinding wheel having a plurality of abrasive grain layers in which the cutting edge portion is made up of grain layers, and the side portions of the cutting edge portion are made up of abrasive grain layers that can provide a good finished surface with less chipping. .
従来の切断もしくは溝切り用の砥石は、１種類
の砥粒層で構成された１層構造を有するものであ
り、その刃先部と該刃先部の側部とは同一の砥粒
層によつて形成されていた。
Conventional grindstones for cutting or grooving have a one-layer structure composed of one type of abrasive grain layer, and the blade edge and the sides of the blade edge are made of the same abrasive grain layer. had been formed.
この従来の砥石で、たとえば高い加工精度が要
求されるビデオの磁気ヘツドに用いられるフエラ
イトに溝入れ加工を行うには以下の工程が必要で
あつた。
In order to use this conventional grindstone to groove ferrite used in the magnetic heads of videos, which require high processing accuracy, the following steps were required.
即ち、まず、加工速度を重視した溝入れ加工用
砥石で溝入れ加工を行ない、次に、微細砥粒から
なる仕上げ用砥石を用いてこの溝入れ加工により
生じたチツピングを除去するとともに該溝の側面
に仕上げ加工を施して目的とする磁気ヘツドの溝
を得ていた。 That is, first, grooving is performed using a grooving whetstone that emphasizes machining speed, and then a finishing whetstone made of fine abrasive grains is used to remove chipping caused by this grooving and to remove the grooves. The desired groove for the magnetic head was obtained by finishing the side surface.
このため、迅速な加工が困難であるとともに、
加工コストもかさむという欠点があつた。 For this reason, quick processing is difficult, and
The disadvantage was that the processing cost was high.
本発明の目的は、このような溝入れ加工を１工
程で行うことができる複数の砥粒層を有する新規
な研削砥石の製造方法を提供することにある。 An object of the present invention is to provide a novel method for manufacturing a grinding wheel having a plurality of abrasive grain layers that can perform such grooving in one step.
本発明は、めつき基板上に砥粒を分散させた複
数種類のめつき液を用いて順次重ねて分散めつき
処理を施すことにより積層構造の砥粒層を形成
し、次に、前記基板を除去して積層構造の砥粒層
を得、然る後に、この砥粒層を砥石の形状に整形
する工程から成るもので、これにより、複数の砥
粒層を有する研削砥石の製造を容易かつ迅速に行
うことを可能にしている。
In the present invention, an abrasive grain layer having a laminated structure is formed by applying a dispersion plating process to a plating substrate using a plurality of types of plating solutions in which abrasive grains are dispersed, and then plating the abrasive grains on the plating substrate. The process consists of removing the abrasive grains to obtain a layered layer of abrasive grains, and then shaping this abrasive grain layer into the shape of a grinding wheel. This makes it easy to manufacture a grinding wheel with multiple layers of abrasive grains. and allows it to be done quickly.
本発明の第１実施例を以下に説明する。 A first embodiment of the present invention will be described below.
まず、その工程の要点は、次のとおりである。 First, the main points of the process are as follows.
ａ めつき金属にたいして剥離性を有する基板の
砥石原型形状をなす部分を残して他の部分をマ
スキングする。a. Mask off the part of the substrate that is releasable to the plated metal, leaving the part that forms the shape of the grindstone prototype, and masking the other parts.
ｂ 前記基板に脱脂等の清浄化処理を施す。b. Performing cleaning treatment such as degreasing on the substrate.
ｃ 砥粒を分散させた第１のめつき液を用いて前
記基板に分散めつきを施し、第１の砥粒層を形
成する。c. Perform dispersion plating on the substrate using a first plating solution in which abrasive grains are dispersed to form a first abrasive grain layer.
ｄ 前記基板にブラツシング等を含む水洗処理を
施す。d. The substrate is subjected to a water washing process including brushing.
ｅ 砥粒を分散させた第２のめつき液を用いて前
記基板に分散めつきを施し、前記第１の砥粒層
に重ねて第２の砥粒層を形成する。e Dispersion plating is applied to the substrate using a second plating solution in which abrasive grains are dispersed, and a second abrasive layer is formed over the first abrasive layer.
ｆ 前記基板にブラツシング等を含む水洗処理を
施す。f. The substrate is subjected to a water washing process including brushing.
ｇ 前記第１のめつき液を用いて前記基板に分散
めつきを施し、前記第２の砥粒層に重ねて第３
の砥粒層を形成する。g Dispersion plating is applied to the substrate using the first plating solution, and a third abrasive layer is applied over the second abrasive grain layer.
form an abrasive layer.
ｈ 前記基板にブラツシングを含む水洗処理を施
す。h. Performing water washing treatment including brushing on the substrate.
ｉ 前記基板から前記砥粒層を剥離して、乾燥す
る。i Peel off the abrasive grain layer from the substrate and dry it.
ｊ 前記剥離した砥粒層にパンチング加工をして
砥石形状に整形する。j The peeled abrasive grain layer is punched and shaped into a grindstone shape.
ｋ 前記砥粒層に真円出し加工、ドレツシング加
工を加え、仕上げ処理を施して砥石製品を得
る。k. The abrasive grain layer is subjected to rounding processing, dressing processing, and finishing treatment to obtain a grindstone product.
上述の各工程における詳細は以下の通りであ
る。 Details of each of the above steps are as follows.
即ち、前記基板はステンレス鋼の板材の表面に
不働態化皮膜を形成したものであり、この表面に
めつき層を形成した場合、該めつき層を容易に剥
離することができる性質を有している。 That is, the substrate is a stainless steel plate material with a passivation film formed on the surface, and when a plating layer is formed on this surface, it has the property that the plating layer can be easily peeled off. ing.
又、これに施すマスキング及び脱脂等の清浄化
処理もしくは水洗処理は従来通常行なわれている
公知の方法によつて行う。 Further, cleaning treatments such as masking and degreasing or washing with water are performed by conventionally known methods.
又、前記砥粒を分散させた第１のめつき液の組
成は下記の通りである。 The composition of the first plating solution in which the abrasive grains are dispersed is as follows.
スルフアミン酸Ni……450ｇ／１
塩 化 Ni ……10ｇ／１
ホ ウ 酸 ……30／
光 沢 剤 ……少量
ピツト防止剤 ……少量
PH ……4.0
分散砥粒の種類 ……ダイヤ粒
分散砥粒の粒径 ……２〜4μｍ
分散砥粒の濃度 ……300ｇ／１
この第１のめつき液を用いた分散めつき処理の
手順を第１図を参照にして説明する。 Ni sulfamic acid...450g/1 Ni chloride...10g/1 Boric acid...30/ Brightening agent...small amount Anti-pitting agent...small amount PH...4.0 Type of dispersion abrasive grains...Diamond grain dispersion abrasive Particle size of the particles: 2 to 4 μm Concentration of the dispersed abrasive particles: 300 g/1 The procedure for dispersion plating using this first plating solution will be explained with reference to FIG.
図中１はめつき槽であり、該めつき槽１に前記
第１のめつき液２を収容する。 In the figure, 1 is a plating tank, and the first plating liquid 2 is stored in the plating tank 1.
次に、このめつき液２に陽極を構成する電極板
３、陰極を構成する基板４及び撹拌手段５を浸け
る。 Next, the electrode plate 3 constituting the anode, the substrate 4 constituting the cathode, and the stirring means 5 are immersed in this plating solution 2.
尚、この場合、前記基板４の表面は砥石原型部
分６を除いた他の部分をマスキング材７によつて
覆つている。第２図はこのようにマスキングがな
された基板４の正面図を示すものである。 In this case, the surface of the substrate 4 except for the grindstone prototype portion 6 is covered with a masking material 7. FIG. 2 shows a front view of the substrate 4 masked in this manner.
ついで、前記めつき槽１に備え付けられている
図示しない温度コントロール手段によつて前記め
つき液２の温度をコントロールしつつ、前記撹拌
手段５を図中矢印ｐで示されるように回転させつ
つ、前記電極板３にプラスの電気を、前記基板４
にマイナスの電気をそれぞれ通じて、分散めつき
を施す。 Next, while controlling the temperature of the plating liquid 2 by a temperature control means (not shown) provided in the plating tank 1, and rotating the stirring means 5 as shown by arrow p in the figure, Apply positive electricity to the electrode plate 3, and apply positive electricity to the substrate 4.
Distributed plating is applied by passing negative electricity through each.
このときのめつき条件は以下の通りである。 The plating conditions at this time are as follows.
浴 温 ……50℃
陰極電流密度……3A／ｄm2
めつき時間 ……10分
これにより、前記基板４の表面には以下の組成
を有する第１の砥粒層が形成される。 Bath temperature: 50° C. Cathode current density: 3 A/dm 2 Plating time: 10 minutes As a result, a first abrasive layer having the following composition is formed on the surface of the substrate 4.
ダイヤ含有量……10Vol％
めつき厚さ ……7μｍ
次に、前記基板４にブラツシング等を含む水洗
処理を施し、然る後、前記めつき槽１のめつき液
を入れ換えて該めつき槽１に第２のめつき液を収
容し、前記第１の砥粒層を形成した場合と同様の
方法により分散めつき処理を行ない、前記第１の
砥粒層に重ねて第２の砥粒層を形成する。 Diamond content: 10 Vol% Plating thickness: 7 μm Next, the substrate 4 is subjected to a washing process including brushing, etc. After that, the plating solution in the plating tank 1 is replaced and the plating tank is removed. 1 contains a second plating solution and performs a dispersion plating process in the same manner as in the case of forming the first abrasive grain layer, and then deposits second abrasive grains on top of the first abrasive grain layer. form a layer.
この場合、第２のめつき液の組成、分散させる
砥粒及びめつき条件は以下の通りである。 In this case, the composition of the second plating solution, the abrasive grains to be dispersed, and the plating conditions are as follows.
めつき液の組成……前記第１のめつき液と同じ
砥粒の種類 ……ダイヤ粒
砥粒の粒径 ……８〜20μ
砥粒の濃度 ……150ｇ／１
浴 温 ……50℃
陰極電流密度 ……3A／ｄm2
めつき時間 ……90分
こうして形成された第２の砥粒層の組成は次の
通りである。 Composition of plating solution...same as the first plating solution Type of abrasive grains...Diamond grains Particle size of abrasive grains...8 to 20μ Concentration of abrasive grains...150g/1 Bath temperature...50℃ Cathode Current density: 3 A/dm 2 Plating time: 90 minutes The composition of the second abrasive layer thus formed is as follows.
ダイヤ含有量……25Vol％
砥粒層の厚さ……70μｍ
このめつき処理が終了したら、再び水洗処理を
施す。 Diamond content: 25 Vol% Abrasive grain layer thickness: 70 μm After this plating process is completed, wash with water again.
然る後、再び、前記第１のめつき液を用いて前
記基板に分散めつき処理を施して前記第２の砥粒
層に重ねて第３の砥粒層を形成する。 Thereafter, the first plating solution is used again to perform a dispersion plating treatment on the substrate to form a third abrasive layer overlapping the second abrasive layer.
このときのめつき条件、形成される砥粒層等
は、前記第１の砥粒層を形成する場合と同じであ
る。 The plating conditions, the abrasive layer formed, etc. at this time are the same as those for forming the first abrasive layer.
次に、こうして得られた砥粒層を前記基板から
剥離し、水洗乾燥処理を施してからパンチング加
工により砥石の形状に整形する。 Next, the abrasive layer thus obtained is peeled off from the substrate, washed with water and dried, and then punched into the shape of a grindstone.
更に、これに真円加工を施すとともに、前記剥
離した面及び刃先を構成する部位にドレツシング
加工を加え、洗浄して砥石製品を得る。 Further, this is processed into a perfect circle, and the peeled surface and the portion constituting the cutting edge are subjected to dressing processing and washed to obtain a grindstone product.
第３図は、こうして得られた砥石の１部拡大断
面図である。 FIG. 3 is a partially enlarged sectional view of the grindstone thus obtained.
図中１０は第２の砥粒層であり、この第２の砥
粒層１０の両側部には第１の砥粒層１１及び第３
の砥粒層１２が形成されている。 In the figure, 10 is a second abrasive grain layer, and on both sides of this second abrasive grain layer 10 are a first abrasive grain layer 11 and a third abrasive grain layer.
An abrasive layer 12 is formed.
この場合、前記砥石の半径Ro＝50mm、第２の
砥粒層１０の厚さt1＝70μｍ、第１の砥粒層１１
及び第３の砥粒層１２の厚さt2＝7μｍである。 In this case, the radius Ro of the grindstone is 50 mm, the thickness t 1 of the second abrasive layer 10 is 70 μm, and the first abrasive layer 11 is
And the thickness t 2 of the third abrasive grain layer 12 is 7 μm.
この砥石で、切断もしくは溝入れ研削を行う場
合、前記第２の砥粒層１０外周部が研削を行なう
刃先となるが、この砥粒層１０に含まれるダイヤ
砥粒の粒径が８〜20μｍと大きく、かつ、含有量
も25Vol％と多いので、極めて能率良く高速度の
研削をおこなうことができる。 When cutting or grooving with this grindstone, the outer peripheral part of the second abrasive grain layer 10 becomes the cutting edge for grinding, but the diameter of the diamond abrasive grains contained in this abrasive grain layer 10 is 8 to 20 μm. Because it is large and has a high content of 25 Vol%, it is possible to perform extremely efficient and high-speed grinding.
一方、前記第２の砥粒層１０の両側部は第１の
砥粒層１１及び第３の砥粒層１２によつて形成さ
れており、これら第１の砥粒層１１及び第３の砥
粒層１２に含まれるダイヤ砥粒の粒径が２〜4μ
ｍと小さく、かつ、その含有量を10Vol％と少な
いから、該第１及び第３の砥粒層によつて研削さ
れる切断部側面もしくは溝部側面にはチツピング
が生じないとともに仕上げ精度の高い仕上げ面が
得られる。 On the other hand, both sides of the second abrasive layer 10 are formed by a first abrasive layer 11 and a third abrasive layer 12. The particle size of the diamond abrasive grains contained in the grain layer 12 is 2 to 4μ
Since the grain size is as small as m and the content is as low as 10 Vol%, chipping does not occur on the side surfaces of the cut part or groove part ground by the first and third abrasive grain layers, and a finish with high finishing accuracy is achieved. A surface is obtained.
本実施例の砥石によつて実際に研削加工を行つ
た結果、ダイヤ砥粒の粒径が８〜20μｍを有する
従来の単層構造砥石に比べてチツピングが1/4で
仕上げ面粗さも良好でしかも加工速度は同等であ
つた。 As a result of actual grinding using the grinding wheel of this example, the chipping was 1/4 and the finished surface roughness was also good compared to a conventional single-layer structure grinding wheel with diamond abrasive grains having a particle size of 8 to 20 μm. Moreover, the machining speed was the same.
従つて、この砥石で溝入れ加工を行なうと溝の
側面部に仕上げ加工を加える必要がなく、例えば
従来２工程で行なつていたビデオのフエライトヘ
ツドの溝入れ加工等の精密加工を１工程でしかも
高度で行なうことができる。 Therefore, when grooving with this grindstone, there is no need to add finishing to the side surfaces of the groove, and for example, precision machining such as grooving the ferrite head of a video, which was conventionally done in two steps, can be done in one step. And it can be done at high altitudes.
前記実施例の方法によれば、前記の通り極めて
有用でかつ新規な砥石を比較的簡単にかつ迅速に
得ることができる。 According to the method of the embodiment, as described above, a very useful and novel grindstone can be obtained relatively easily and quickly.
また、前記各砥粒層の組成を加工目的に応じて
変える場合には、分散させる砥粒の種類、量もし
くは粒径またはめつき液の組成もしくはめつき条
件を変えるだけで良く、何等の設備の変更も必要
としないから多品種の砥石を効率良くローコスト
で製造できる。 In addition, when changing the composition of each abrasive grain layer according to the processing purpose, it is only necessary to change the type, amount, or particle size of the abrasive grains to be dispersed, the composition of the plating liquid, or the plating conditions. Since no changes are required, a wide variety of grindstones can be manufactured efficiently and at low cost.
更に、この方法では、前記基板から剥離した面
の砥粒を露出させる工程を仕上げ工程におけるド
レツシング工程の際に兼ねておこなつており、単
独の砥粒露出工程を省略しているから、工程が単
純である。 Furthermore, in this method, the step of exposing the abrasive grains on the surface peeled off from the substrate is also performed during the dressing step in the finishing step, and the individual abrasive grain exposing step is omitted, so that the process is simplified. It's simple.
次に、本発明の第２の実施例につき説明する。
ここの実施例では前記第１の実施例における第１
及び第２のめつき液に分散させる砥粒が異なる他
は前記第１の実施例と同じである。 Next, a second embodiment of the present invention will be described.
In this embodiment, the first
This embodiment is the same as the first embodiment except that the abrasive particles dispersed in the second plating solution are different.
即ち、第２のめつき液に分散させるダイヤ粒を
第１のめつき液に分散させるダイヤ粒よりも高強
度でかつ耐破砕性の高いものとしている点だけが
異なる。 That is, the only difference is that the diamond particles dispersed in the second plating solution have higher strength and fracture resistance than the diamond particles dispersed in the first plating solution.
具体的には以下の通りである。 Specifically, the details are as follows.
第１のめつき液に分散させる砥粒
ダイヤ粒径……４〜6μｍ
濃 度 ……200ｇ／１
ダイヤ種 ……東名ダイヤIRM
（商品名）
めつき時間 ……15分
第２のめつき液に分散させる砥粒
ダイヤ粒径、濃度……前記と同じ
ダ イ ヤ 種 ……東名ダイヤIMM
（商品名）
こうして得られた砥石によれば、IMM粒から
なる従来の単層構造の砥石に比較してチツピング
が20％少なく、切断面粗さも良好であつた。Abrasive grains to be dispersed in the first plating solution Diamond particle size...4-6μm Concentration...200g/1 Diamond type...Tomei Diamond IRM (product name) Plating time...15 minutes Second plating solution Abrasive grains to be dispersed Diamond particle size, concentration...same as above Diamond type...Tomei Diamond IMM (trade name) According to the grinding wheel obtained in this way, compared to the conventional single-layer structure grinding wheel made of IMM grains. The chipping was reduced by 20%, and the roughness of the cut surface was also good.
本発明の第３の実施例は、前記第２のめつき液
に分散させる砥粒の濃度を前記第１のめつき液に
分散させる砥粒の濃度よりも高くし、前記第２の
砥粒層に含まれる砥粒含有量を第１及び第３の砥
粒層に含まれる砥粒含有量に比べて高くした場合
である。 In a third embodiment of the present invention, the concentration of abrasive particles dispersed in the second plating liquid is higher than the concentration of abrasive particles dispersed in the first plating liquid, and the second abrasive particles are dispersed in the second plating liquid. This is a case where the abrasive grain content contained in the layer is made higher than the abrasive grain content contained in the first and third abrasive grain layers.
即ち、具体的には以下の通りである。 That is, specifically, it is as follows.
第１のめつき液に分散させる砥粒
ダイヤ粒径……８〜20μｍ
濃 度 ……50ｇ／１
めつき時間……30分
第２のめつき液に分散させる砥粒
ダイヤ粒径……前記と同じ
濃 度 ……150ｇ／１
めつき時間……90分
これによつて、得られる砥石の各砥粒層の組成
は以下の通りである。Abrasive grains dispersed in the first plating solution Diamond particle size...8 to 20 μm Concentration...50 g/1 Plating time...30 minutes Abrasive particles dispersed in the second plating solution Diamond particle size...the above Same as Concentration...150g/1 Plating time...90 minutes As a result, the composition of each abrasive grain layer of the resulting whetstone is as follows.
第１及び第３の砥粒層
ダイヤ含有量……10Vol％
めつき厚さ ……20μｍ
第２の砥粒層
ダイヤ含有量……25Vol％
めつき厚さ ……90μｍ
この砥石によれば、第１の砥粒層のみからなる
従来の単層構造の砥石に比較してチツピングが10
％少なく、切断面粗さも良好であつた。1st and 3rd abrasive grain layer Diamond content...10Vol% Plating thickness...20μm 2nd abrasive grain layer Diamond content...25Vol% Plating thickness...90μm According to this grindstone, Chipping is reduced by 10% compared to a conventional single-layer structure whetstone consisting of only 1 layer of abrasive grains.
%, and the roughness of the cut surface was also good.
本発明の第４の実施例は前記第１のめつき液の
組成及びめつき条件を前記第２めつき液と異なら
しめて、前記第２の砥粒層の結合剤を前記第１及
び第３の砥粒層の結合剤よりも高硬度かつ高強度
にしたものである。 In a fourth embodiment of the present invention, the composition and plating conditions of the first plating solution are different from those of the second plating solution, and the binder of the second abrasive layer is mixed with the binder of the first and third abrasive grain layers. It has higher hardness and strength than the binder in the abrasive layer.
即ち、具体的には、以下の通りである。 That is, specifically, it is as follows.
第１のめつき液組成
スルフアミン酸Ni……450ｇ／１
塩 化 Ni ……10ｇ／１
ホ ウ 酸 ……30ｇ／１
ピツト防止剤 ……少量
PH ……4.0
ダイヤ粒径 ……４〜6μｍ
ダイヤ粒濃度 ……300ｇ／１
この第１のめつき液によるめつき処理の条件は
以下の通りである。First plating liquid composition Ni sulfamate...450g/1 Ni chloride...10g/1 Boric acid...30g/1 Pitting prevention agent...small amount PH...4.0 Diamond particle size...4-6μm Diamond Grain concentration: 300 g/1 The conditions for plating with this first plating solution are as follows.
浴 温 ……50℃
陰極電流密度……3A／ｄm2
めつき時間 ……15分
第２のめつき液組成
スルフアミン酸Ni……450ｇ／１
スルフアミン酸Co……50ｇ／１
塩 化 Ni ……10ｇ／１
ホ ウ 酸 ……30ｇ／１
ピツト防止剤 ……少量
PH ……4.0
ダイヤ粒、濃度 ……第２のめつき液と同じ
この第２のめつき液によるめつき処理条件は、
めつき時間が120分である他は前記第１のめつき
液によるめつき処理条件と同じである。 Bath temperature...50℃ Cathode current density...3A/dm Second plating time...15 minutes Second plating solution composition Ni sulfamic acid...450g/1 Co sulfamic acid...50g/1 Ni chloride... 10g/1 Boric acid...30g/1 Pitting prevention agent...Small amount PH...4.0 Diamond grains, concentration...Same as the second plating solution The plating processing conditions using this second plating solution are as follows:
The plating conditions were the same as those for the first plating solution except that the plating time was 120 minutes.
この方法によつて得られた砥石の各砥粒層の硬
度は下記の通りである。 The hardness of each abrasive grain layer of the grindstone obtained by this method is as follows.
第１の砥粒層……Hv＝200
第２の砥粒層……Hv＝500
こうして得られた砥石によつてフエライトの切
断加工試験を行つた結果、Hv＝500の単層の砥粒
層からなる従来の砥石による場合に比較してチツ
ピングが30％少なく、かつ切断面粗さも良好であ
つた。尚、以上の実施例にあつては第２の砥粒層
の両側面に第１及び第２の砥粒層を形成して３層
構造とする例について述べたが、加工用途によつ
ては、第２の砥粒層のいずれか一方の側面にのみ
他の砥粒層を形成して２層構造に形成するだけで
良い場合がある。 First abrasive grain layer...Hv=200 Second abrasive grain layer...Hv=500 As a result of conducting a ferrite cutting test using the grindstone thus obtained, a single abrasive grain layer with Hv=500 was found. Chipping was 30% less than when using a conventional grinding wheel made of 30% carbon dioxide, and the roughness of the cut surface was also good. In the above embodiment, the first and second abrasive grain layers are formed on both sides of the second abrasive grain layer to form a three-layer structure, but depending on the processing application, In some cases, it is sufficient to form another abrasive grain layer only on one side of the second abrasive grain layer to form a two-layer structure.
この場合には、前記実施例における第３の砥粒
層を形成する工程を省略すればよい。 In this case, the step of forming the third abrasive grain layer in the embodiment described above may be omitted.
次に、第５の実施例として前記基板から剥離し
た砥粒層の剥離面から砥粒を露出させる工程を省
略しない場合について述べる。 Next, as a fifth embodiment, a case will be described in which the step of exposing the abrasive grains from the peeled surface of the abrasive layer peeled off from the substrate is not omitted.
この実施例においては、上述の第１実施例の工
程における前記基板にマスキングをする工程から
積層された砥粒層を前記基板より剥離するまでの
工程、即ち、前記ａ〜ｉまでの工程は同じであ
り、このｉの工程と次のｊとの工程との間に前記
剥離された砥粒層の剥離面にエツチング処理をす
る工程が加えられるだけである。 In this example, the steps from masking the substrate to peeling off the laminated abrasive grain layer from the substrate in the steps of the first example described above, that is, the steps a to i are the same. Between this step i and the next step j, only a step of etching the peeled surface of the peeled abrasive layer is added.
又、これら、各工程の詳細は前記第１〜第４実
施例と同じであるので、その説明は省略する。 Further, since the details of each of these steps are the same as those in the first to fourth embodiments, the explanation thereof will be omitted.
この実施例によれば、前記第１〜第４実施例の
場合に比較して１工程多くなるため、その分製造
が繁雑となるが、前記剥離面の砥粒の露出をエツ
チング処理によつて行つていることから、前記第
１〜第４の各実施例におけるドレツシングによる
場合に比べて砥粒の露出度合を微妙に加減するこ
とができる。 According to this embodiment, the number of steps is one more than in the first to fourth embodiments, which makes the manufacturing process that much more complicated. Because of this, the degree of exposure of the abrasive grains can be finely adjusted compared to the case of dressing in each of the first to fourth embodiments.
尚、上述の各実施例ではめつき方法として電気
めつきによる場合について述べたが、本発明はこ
れに限られることなく、無電解めつきによる場合
も含む。 In each of the above-described embodiments, the plating method is electroplating, but the present invention is not limited to this, and also includes electroless plating.
無電解めつきによれば、めつき時間を多く要す
るが、砥粒層に多量の砥粒を含ませる等の場合に
有利である。 Although electroless plating requires a long plating time, it is advantageous when a large amount of abrasive grains are contained in the abrasive grain layer.
以上、詳述したように、本発明は、めつき金属
にたいして剥離性を有する基板に砥粒を分散させ
た複数種類のめつき液を用いて順次重ねて分散め
つき処理を施すことにより積層構造の砥粒層を形
成し、次に、この砥粒層を前記基板から剥離し、
然る後に、この剥離した砥粒層を砥石の形状に整
形するとともに、仕上げ処理を施して砥石製品を
得る工程から成るもので、これにより、複数の砥
粒層を有し、切断面粗さの良好な高精度加工を１
工程でおこなうことができる新規かつ有用な研削
砥石を、容易迅速に製造することを可能にすると
ともに、加工用途に応じた多種類の砥石を能率よ
くかつ比較的ローコストに製造することを可能と
している。
As described in detail above, the present invention provides a laminated structure by applying a dispersion plating treatment to plating metal by sequentially stacking the plated metal using a plurality of types of plating solutions in which abrasive grains are dispersed on a removable substrate. forming an abrasive grain layer, then peeling off this abrasive grain layer from the substrate,
After that, the peeled abrasive grain layer is shaped into the shape of a whetstone and subjected to finishing treatment to obtain a whetstone product. Good high precision machining 1
It not only makes it possible to easily and quickly manufacture new and useful grinding wheels that can be used in processes, it also makes it possible to manufacture many types of grinding wheels according to processing applications efficiently and at relatively low cost. .
第１図及び第２図は本発明の実施例における分
散めつき処理を説明するための図、第３図は前記
実施例の製造方法によつて製造した砥石製品の断
面図である。
１……めつき槽、２……第１のめつき液、３…
…電極棒、４……基板、５……撹拌手段、６……
砥石原型形状をなす部位、７……マスキング材、
１０……第２の砥粒層、１１……第１の砥粒層、
１２……第３の砥粒層。
1 and 2 are diagrams for explaining the dispersion plating process in the embodiment of the present invention, and FIG. 3 is a sectional view of a grindstone product manufactured by the manufacturing method of the embodiment. 1...Plating tank, 2...First plating liquid, 3...
... Electrode rod, 4 ... Substrate, 5 ... Stirring means, 6 ...
Part forming the grindstone prototype shape, 7... Masking material,
10... Second abrasive layer, 11... First abrasive layer,
12...Third abrasive layer.
Claims (1)
めつき液を用いて順次重ねて分散めつき処理を施
すことにより積層構造の砥粒層を形成し、次に、
前記基板を除去して砥粒層のみを得、然る後に、
この砥粒層を砥石の形状に整形して砥石製品を得
ることを特徴とした複数の砥粒層を有する研削砥
石製造方法。 ２ 以下の工程からなる特許請求の範囲第１項記
載の複数に砥粒層を有する研削砥石製造方法。 Ａ 砥粒を分散させた第１のめつき液を用いてめ
つき基板に分散めつきを施して第１の砥粒層を
形成する。 Ｂ 砥粒を分散させた第２のめつき液を用いて前
記基板に分散めつきを施し、前記第１の砥粒層
に重ねて第２の砥粒層を形成する。 Ｃ 前記砥粒を分散させた第１のめつき液を用い
て前記基板に分散めつきを施し、前記第２の砥
粒層に重ねて第３の砥粒層を形成する。 Ｄ 前記基板を除去し前記積層構造に形成された
砥粒層を得る。 Ｅ 前記砥粒層に円形加工をして砥石形状に整形
する。 ３ 以下の工程からなる特許請求の範囲第１項記
載の複数の砥粒層を有する研削砥石製造方法。 Ａ 砥粒を分散させた第１のめつき液を用いて前
記基板に分散めつきを施して第１の砥粒層を形
成する。 Ｂ 砥粒を分散させた第２のめつき液を用いて前
記基板に分散めつきを施し、前記第１の砥粒層
に重ねて第２の砥粒層を形成する。 Ｃ 前記砥粒を分散させた第１のめつき液を用い
て前記基板に分散めつきを施し、前記第２の砥
粒層に重ねて第３の砥粒層を形成する。 Ｄ 前記基板を除去し前記積層構造に形成された
砥粒層を得る。 Ｅ 前記砥粒層の剥離面にエツチング処理を施し
て表面に砥粒を露出させる。 Ｆ 前記剥離した砥粒層に円形加工等をして砥石
形状に整形する。 ４ 前記第２のめつき液に分散させる砥粒の粒径
が前記第１のめつき液に分散させる砥粒の粒径よ
りも大きいものであることを特徴とした特許請求
の範囲第２項または第３項記載の複数の砥粒層を
有する研削砥石製造方法。 ５ 前記第２のめつき液に分散させる砥粒が前記
第１のめつき液に分散させる砥粒よりも高強度で
破砕されにくいものであることを特徴とした特許
請求の範囲第２項または第３項記載の複数の砥粒
層を有する研削砥石製造方法。 ６ 前記第２のめつき液によつて形成される第２
の砥粒層の砥粒含有量が前記第１のめつき液によ
つて形成される第１及び第３の砥粒層の砥粒含有
量よりも大であるように前記第１のめつき液と第
２のめつき液との組成を選定してあることを特徴
とした特許請求の範囲第２項または第３項記載の
複数の砥粒層を有する研削砥石製造方法。 ７ 前記第２のめつき液によつて形成される第２
の砥粒層の結合剤硬度及び強度が前記第１のめつ
き液によつて形成される第１及び第３の砥粒層の
結合剤よりも高くなるように前記第１のめつき液
と第２のめつき液との組成を選定してあることを
特徴とした特許請求の範囲第２項または第３項記
載の複数の砥粒層を有する研削砥石製造方法。[Claims] 1. A layered layer of abrasive grains is formed by applying a dispersion plating process to a plating substrate using a plurality of types of plating solutions in which abrasive grains are dispersed, and then ,
The substrate is removed to obtain only the abrasive layer, and then,
A method for producing a grinding wheel having a plurality of abrasive grain layers, characterized in that a grindstone product is obtained by shaping this abrasive grain layer into the shape of a whetstone. 2. A method for producing a grinding wheel having a plurality of abrasive grain layers according to claim 1, which comprises the following steps. A A first abrasive layer is formed by performing dispersion plating on a plating substrate using a first plating solution in which abrasive grains are dispersed. B. Perform dispersion plating on the substrate using a second plating solution in which abrasive grains are dispersed, and form a second abrasive layer overlapping the first abrasive layer. C. Perform dispersion plating on the substrate using a first plating solution in which the abrasive particles are dispersed, and form a third abrasive layer overlapping the second abrasive layer. D. The substrate is removed to obtain the abrasive grain layer formed in the laminated structure. E: The abrasive grain layer is processed into a circular shape to form a whetstone shape. 3. A method for manufacturing a grinding wheel having a plurality of abrasive grain layers according to claim 1, which comprises the following steps. A: Apply dispersion plating to the substrate using a first plating solution in which abrasive grains are dispersed to form a first abrasive grain layer. B. Perform dispersion plating on the substrate using a second plating solution in which abrasive grains are dispersed, and form a second abrasive layer overlapping the first abrasive layer. C. Perform dispersion plating on the substrate using a first plating solution in which the abrasive particles are dispersed, and form a third abrasive layer overlapping the second abrasive layer. D. The substrate is removed to obtain the abrasive grain layer formed in the laminated structure. E Etching is performed on the peeled surface of the abrasive grain layer to expose the abrasive grains on the surface. F The peeled abrasive grain layer is shaped into a whetstone shape by performing circular processing or the like. 4. Claim 2, characterized in that the particle size of the abrasive grains dispersed in the second plating liquid is larger than the particle size of the abrasive particles dispersed in the first plating liquid. Alternatively, the method for manufacturing a grinding wheel having a plurality of abrasive grain layers according to item 3. 5. Claim 2, wherein the abrasive grains dispersed in the second plating solution have higher strength and are less likely to be crushed than the abrasive grains dispersed in the first plating solution. 4. A method for manufacturing a grinding wheel having a plurality of abrasive grain layers according to item 3. 6 a second plate formed by the second plating liquid;
the first plating so that the abrasive grain content of the abrasive grain layer is greater than the abrasive grain content of the first and third abrasive grain layers formed by the first plating solution; 4. A method for manufacturing a grinding wheel having a plurality of abrasive grain layers according to claim 2 or 3, characterized in that the compositions of the liquid and the second plating liquid are selected. 7. A second plate formed by the second plating liquid.
with the first plating solution such that the binder hardness and strength of the abrasive layer are higher than those of the first and third abrasive layers formed by the first plating solution. A method for producing a grinding wheel having a plurality of abrasive grain layers according to claim 2 or 3, characterized in that the composition of the second plating solution is selected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22848885A JPS6288571A (en) | 1985-10-14 | 1985-10-14 | Manufacture of grinding wheel having plurality of grain layer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22848885A JPS6288571A (en) | 1985-10-14 | 1985-10-14 | Manufacture of grinding wheel having plurality of grain layer |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25932490A Division JPH0825143B2 (en) | 1990-09-28 | 1990-09-28 | Electroformed grindstone |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6288571A JPS6288571A (en) | 1987-04-23 |
| JPH0152151B2 true JPH0152151B2 (en) | 1989-11-07 |
Family
ID=16877246
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22848885A Granted JPS6288571A (en) | 1985-10-14 | 1985-10-14 | Manufacture of grinding wheel having plurality of grain layer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6288571A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7073496B2 (en) * | 2003-03-26 | 2006-07-11 | Saint-Gobain Abrasives, Inc. | High precision multi-grit slicing blade |
| CN103567896B (en) * | 2012-07-24 | 2016-11-23 | 沈阳中科超硬磨具磨削研究所 | A kind of mill leading screw electroplating abrasion wheel manufacture method |
-
1985
- 1985-10-14 JP JP22848885A patent/JPS6288571A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6288571A (en) | 1987-04-23 |
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