JPH04111776A - Porous multilayer electrodeposition grindstone and manufacture thereof - Google Patents

Abstract

PURPOSE:To prevent chipping by setting a mean cell diameter of a mesh of a resin porous body to 3 to 100 times the mean size of super abrasive grains, and further forming air holes partly in a metal plating phase in each cell. CONSTITUTION:A resin porous body 14, which is formed of three-dimensional mesh structure of non-orientation with a mean cell diameter of a mesh of the structure 3 to 100 times the mean size of a superabrasive grain 13, is fixed onto a forming surface of an abrasive grain layer 11 having conductivity of a base material(base metal)10. Next, the base material 10 is immersed in electrolytic plating liquid to deposit a metal plating phase 12 in an abrasive grain layer forming surface while dispersing the superabrasive grains formed of a conductive film in the surface, and the porous abrasive grain layer 11, in which the superabrasive grains 13 are dispersed in a multilayer state in the inside of the resin porous body 14, is formed to obtain a desired electrodeposition grindstone.

Description

[Detailed Description of the Invention] "Industrial Application Field - The present invention relates to an electrodeposited grindstone and a method for manufacturing the same, and in particular,
When grinding in surface contact with the workpiece, it prevents clogging of the abrasive grain layer and increases the efficiency of supplying the grinding fluid.
Concerning improvements to improve sharpness.

"Prior Art J" FIG. 13 is an enlarged cross-sectional view of an abrasive grain layer showing an example of a conventional electrodeposited grindstone.

Reference numeral 1 in the figure indicates alloys of various shapes, and a large number of superabrasive grains 2 are fixed in a single layer on the abrasive grain layer forming surface IA of this base metal 1 via a metal plating phase 3.

To form the metal plating phase 3, an electrolytic plating method is usually used. For example, when manufacturing a wheel-type electrodeposited grindstone having an abrasive grain layer on the outer circumferential surface, first, the base metal 1, which has been masked except for the outer circumferential surface IA, is immersed in an electrolytic plating solution, and the outer circumferential surface IA with at least a portion thereof facing upward and horizontally.

Then, superabrasive grains 2 are sown on this horizontal surface, the base metal 1 is connected to a power supply cathode, and electricity is applied between the horizontal surface and an anode placed opposite to precipitate the metal plating phase 3, and the superabrasive grains are Fix 2. This operation is repeated over the entire circumference of the outer circumferential surface IA while rotating the base metal 1 intermittently to form a uniform monolayer abrasive grain layer.

``Problems to be Solved by the Invention'' However, the above-mentioned electroplated grindstone is particularly suitable for applications where surface contact with the workpiece is performed, such as double-head grinding, creep feed grinding, rotary transformer grinding, and polishing surface plates. The following drawbacks were noticeable in the polishing method used, the polishing method using a curve generator, etc., and improvements were needed.

■ Since the super abrasive grains 2 are firmly fixed by the dense and hard metal plating phase 3, when grinding a particularly hard and brittle work material, the individual ultra-low rL2 particles will cut into the work material. The impact is large, causing minute chips (chipping) on the machined surface.
occurs, resulting in a decrease in surface roughness and processing accuracy.

(2) Since the surface of the metal plating phase 3 is dense and flat, the effect of discharging chips generated during grinding from the grinding part along with the movement of the grinding wheel (chip discharging performance) is small.

■ When used in wet grinding, for the same reason as in ■, it is difficult to supply the grinding fluid to the grinding part, and the cooling and lubrication effects and chip discharge effects of the grinding fluid cannot be obtained sufficiently.

Furthermore, the method for manufacturing an electrodeposited grindstone described above has the following drawbacks.

■ Since the abrasive grain layer is formed by repeating local plating intermittently, the thickness of the plating phase may be affected by variations in the scattering density of superabrasive grains 2 by hand, variations in plating time and plating conditions, etc. Due to non-uniformity, the abrasive grain distribution density in the abrasive grain layer tends to become non-uniform, which causes variations in the sharpness and life of each part of the abrasive grain layer, causing uneven wear and abnormal vibration of the grindstone.

■ Since the superabrasive grains 2 are placed on the surface to be plated and the plating solution is electrodeposited in a static state without stirring, the supply of metal ions to the surface to be plated tends to be insufficient. Therefore, the plating current cannot be increased, and the plating operation takes time, resulting in poor productivity and high manufacturing costs.

■ If the superabrasive grains 2 can be electrodeposited in multiple layers, the life of the grinding wheel can be extended, but in the above method, if the electrodeposition is not performed on the base metal, variations in the abrasive grain distribution density will accumulate and the use It is not possible to form a layer of abrasive grains with sufficient precision. Therefore, the current situation is that only a single layer of abrasive grains is formed, and there is a problem that the life of the grinding wheel is short.

"Means for Solving the Problems" The present invention has been made to solve the above problems, and firstly, the porous multilayer electrodeposited grindstone of the present invention has superabrasive grains formed on a base material in a metal plating phase. A multi-layered abrasive grain layer is provided, and a resin porous body having a non-directional three-dimensional network structure is embedded in the metal plating phase, and the average cell of the network of this resin porous body is The diameter is 3 to 100 times the average particle diameter of the superabrasive grains.
The metal plating phase in each cell is characterized in that pores are partially formed in the metal plating phase in each cell.

On the other hand, the method for manufacturing a porous multilayer electrodeposited grindstone according to claim 2 of the present invention includes:
A porous resin body having a non-directional three-dimensional network structure with an average cell diameter of 3 to 100 times the average particle diameter of the superabrasive grains is fixed, and the base material is immersed in an electrolytic plating solution. , a porous resin material in which superabrasive grains with a conductive film formed on the surface are dispersed, a metal plating phase is precipitated on the surface on which the abrasive grain layer is formed, and superabrasive grains are dispersed in multiple layers inside a porous resin body. It is characterized by forming a layer of abrasive grains.

In addition, when forming the abrasive grain layer, the superabrasive grains on which the conductive film is formed are dispersed on the surface on which the abrasive grain layer is formed, with air bubbles partially retained in the cells of the porous resin body. The metal plating phase may be made more porous by precipitating the metal plating phase.

Further, in the manufacturing method according to claim 4 of the present invention, a non-directional three-dimensional network structure is formed on the conductive abrasive layer forming surface of the base material, and the average cell diameter of the network is the superabrasive grain layer. A porous resin body having an average particle diameter of 3 to 100 times is fixed,
The base material is immersed in an electrolytic plating solution, and with air bubbles partially retained in the cells of the resin porous material, a metal plating phase is precipitated on the abrasive layer forming surface while dispersing the superabrasive grains, and the resin porous material is It is characterized by forming a porous abrasive grain layer in which superabrasive grains are dispersed in multiple layers inside the mass.

"Function" In the porous multilayer electrodeposited grindstone of the present invention, a three-dimensional network-like resin porous body is formed inside the abrasive grain layer, and since the abrasive grain layer has appropriate elasticity, individual The contact impact between the superabrasive grains and the workpiece material is alleviated by the elastic deformation of the surrounding metal plating phase, making it possible to prevent chipping.

In addition, pores are formed in the metal plating phase within the cells of the resin porous material, and some of the pores are exposed to the grinding surface due to the force, and the resin porous material exposed on the surface of this abrasive grain layer is worn away, forming recesses. Therefore, these act as chip pockets and discharge the chips generated in the grinding section along with the movement of the grinding wheel, resulting in high chip discharge performance and less clogging of the abrasive grain layer. Therefore, good grinding efficiency can be obtained even in applications where grinding is carried out in surface contact with a workpiece.

Furthermore, when performing wet grinding, the porous resin body has water absorption properties and many pores are formed in the metal plating phase, so the grinding fluid spreads through the porous resin body through these pores, causing the grinding fluid to flow through the porous resin body. Since the liquid freely enters and exits the abrasive grain layer, the grinding fluid can be efficiently supplied to the grinding section. At the same time, the grinding fluid that adheres to or is sucked into the porous resin body effectively removes the heat inside the abrasive grain layer, resulting in high cooling efficiency.

On the other hand, according to the manufacturing method of the present invention, superabrasive grains are retained in individual cells of the porous resin body during electrolytic plating, so that superabrasive grains are retained not only on the horizontal surface of the alloy but also on almost the entire surface on which the abrasive grain layer is formed. At the same time, it is possible to electrodeposit superabrasive grains. Moreover, since the electrolytic plating solution can be forcibly supplied to the surface to be plated during electrodeposition, the electrodeposition speed can be improved.

In addition, since the distribution density of superabrasive grains in the resin porous body is almost constant depending on the average cell diameter, the abrasive grain layer at any part is affected by the abrasive grain content, the degree of lamination of abrasive grains, and the metal plating phase. The thickness and porosity of the abrasive grains are equalized, making it possible to easily form highly precise multilayer abrasive grain layers that were previously difficult to manufacture.

Furthermore, in the method of claim 2, since the metal coating is formed on the surface of the superabrasive grains, the metal plating phase precipitates with pores remaining between each superabrasive grain, making the metal plating phase even more porous. It is possible to easily produce a grindstone with improved quality and improved chip evacuation and cooling efficiency.

"Example" Figures 1 and 2 show a first example of a porous multilayer electrodeposited grindstone according to the present invention, with Figure 1 being an overall front view and Figure 2 being an enlarged cross-sectional view of an abrasive grain layer. It is.

This porous multilayer electrodeposited grindstone has an abrasive grain layer II having a constant thickness formed over the entire circumference on the outer peripheral surface of a wheel-shaped base metal (base material) indicated by reference numeral 10 in the figure.

As shown in FIG. 2, the abrasive grain layer 11 has Ni, Go
.

Or in the metal plating phase 12 made of these alloys,
A large number of superabrasive grains 13 such as diamond or CBN are dispersed uniformly and in a multilayered manner, and the metal plating phase 12 includes:
A resin porous body 14 having a non-directional three-dimensional network structure is buried over the entire area, and this resin porous body 14
There are many pores 15 in the metal plating phase 12 in the cell.
It is partially formed.

The average cell diameter DI of the network of the resin porous body 14 is the superabrasive grain I.
3 to 100 times the average particle diameter D2 of No. 3, more preferably 5 to 100 times
It is said to be 30 times more. Note that the term cell here is
This is a substantially spherical portion surrounded by a network-like porous resin body 14. If the average cell diameter is less than three times the average particle diameter, it will be difficult for the superabrasive grains 13 to penetrate into individual cells during electrodeposition, resulting in uneven distribution density of the superabrasive grains 13 within each cell. , the cutting edge density varies on the surface of the abrasive layer, making the sharpness of the whetstone unstable. Moreover, if it is larger than 100 times, the distribution density of the resin porous body 14 exposed on the surface of the abrasive grain layer is too small, and the pores 15 are difficult to form, so the chip pocket formation effect is reduced and the chip discharge performance is improved. The effectiveness and grinding fluid supply efficiency decreases.

The resin porous body 14 is made by highly foaming a resin using a foaming agent, and specifically, polyurethane foam, which is easy to mold and inexpensive, is suitable.

Specifically, "Fx Pearlite SF" manufactured by Brideston Co., Ltd. is suitable because it has high communication between cells and excellent hydrophilicity and water retention.

The average particle diameter DI of the superabrasive grains 13 is determined depending on the purpose of use of the grindstone. The thickness of the abrasive grain layer 11 is arbitrary, or preferably at least twice the average cell diameter. If it is twice or more, the flow of the grinding fluid in the plane direction through the pores 15 and the porous resin body 14 will be improved.

Further, it is desirable that the ratio of the pores 15 to the entire abrasive grain layer 11 (porosity) is about 5 to 50 vol%. 5v
If o is less than 1%, a sufficient grinding fluid supply effect cannot be obtained, and if it is more than 50voI%, the abrasive grain retention will decrease.

According to the porous multilayer electrodeposited grindstone having such a structure,
Since the three-dimensional network-like resin porous body 14 is uniformly embedded inside the abrasive grain layer 11, the abrasive grain layer 11 has appropriate elasticity and can withstand the impact when the individual superabrasive grains 13 cut. The surrounding metal plating phase 12 is elastically deformed and relaxed. Due to this effect, even when grinding a hard and brittle workpiece, chipping of the workpiece can be prevented and the finished surface roughness and precision can be improved.

Further, on the surface of the abrasive grain layer 11, some of the pores I5 are opened and the exposed resin porous body 14 is worn out to form recesses, so these recesses act as chip pockets, and the grinding surface The chips generated during grinding are discharged as the grindstone rotates. Therefore, even when used in applications where there is surface contact with the workpiece, it has high chip evacuation properties, is less likely to become clogged, provides good grinding efficiency, and can reduce the frequency of dressing, thereby extending the service life of the grinding wheel. Shortening can be prevented.

In addition, when performing wet grinding, the grinding fluid freely enters and exits the abrasive layer 11 through the surface layer of the hydrophilic porous resin body 14 or through the pores 15, so that a part of it It flows to the grinding section, allowing effective supply of grinding fluid. At the same time, the grinding fluid removes heat from the abrasive grain layer 11 from inside, so the cooling effect is extremely high, and it is possible to prevent burn-out due to overheating of the abrasive grain layer 11.

Next, a method for manufacturing the porous multilayer electrodeposited grindstone will be described with reference to FIGS. 3 to 5.

In this method, first, insulating masking is performed on both sides of a metal base lO, and a constant masking is applied to form a non-directional three-dimensional network structure over the entire outer circumferential surface as shown in Fig. 3. A thick, belt-shaped porous resin body 14 is fixed. As for the fixing method, the porous resin body 14 and the base metal 1O are attached and fixed from the sides using insulating tape for masking, or they are fixed using a masking jig.

Alternatively, the resin porous body 14 may be formed into a ring shape having an inner diameter slightly smaller than the outer diameter of the base metal lO, and the base metal 10 may be press-fitted inside this resin porous body 14 and fixed to each other. . In this case, since no seams occur in the porous resin body 14,
It has the advantage of preventing uneven electrodeposition due to seams.

The range of the average cell diameter D1 of the network of the resin porous body I4 includes:
In addition to the reasons mentioned above, there are also manufacturing reasons.

That is, since the cell diameter of this type of resin porous body 14 varies to a certain extent, if the value is less than 3 times the above value, many small cells are generated into which the superabrasive grains 13 are difficult to enter.
The variation in the distribution density of the superabrasive grains 13 increases. Also, 100
If it is larger than twice as much, the holding force of the superabrasive grains 13 by the cells during plating described later becomes small, and the superabrasive grains 13 are
The effect of holding the material on the outer peripheral surface of the material decreases.

The thickness of the resin porous body 14 is preferably thicker than the desired abrasive grain layer 11 and is preferably 0.5 to 20 yrx.

Q: The super abrasive grains I3 cannot be held sufficiently when tightening thinner than 5xm. Also, if it is thicker than 20yz, the resin porous body 14
It is difficult for the superabrasive grains I3 to penetrate to the outer peripheral surface of the base metal, making electrodeposition difficult.

In addition, in order to adjust the content rate of the pores 15, the porous resin body may be subjected to a surfactant treatment or the like in advance.

When the surface active treatment is applied, the adhesion density of air bubbles during electrodeposition is reduced, and the content of pores 15 can be reduced. If reverse water repellency treatment is performed, the adhesion density of air bubbles will be increased and the content of pores 15 will be increased.

Next, this base metal IO is immersed in an electrolytic plating solution to precipitate the metal plating phase 12 on the outer peripheral surface of the alloy while dispersing the superabrasive grains 13 inside the resin porous body 14. Super abrasive grain inside! A multilayer abrasive grain layer 11 is formed.

FIG. 4 shows an example of a plating apparatus. Inside the plating tank 20, a rotating shaft 21 supporting the base metal 1O is arranged horizontally, and on both sides of the base metal 1O there are two pairs of rotating shafts parallel to the rotating shaft 2I. An anode plate 22 is arranged.

A drain port 23 is formed at the center of the lower end of the plating tank 20, and the collected superabrasive grains and plating solution M are pumped through the pump 24.
The resin is pressurized and sprayed from the nozzle 25 onto the outer circumferential surface of the porous resin body I4.

Further, the base metal lO is connected to the cathode of the power source through the rotating shaft 21, while the anode plate 22 is connected to the anode through a lead wire. Note that the power source used may be a DC power source, a pulse power source, or an AC power source with a DC bias applied.

After setting the apparatus, a predetermined amount of superabrasive particles are dispersed in the plating solution M, and the plating solution M is stirred using an ultrasonic stirrer (not shown), and the resin porous body I is mixed with the pump 24.
While spraying the plating solution M containing the superabrasive grains 13 onto the base metal 10, the base metal 10 is rotated at a constant speed and energized. Then, the superabrasive grains 13 sprayed from the nozzle 25 become a porous resin material! The metal particles penetrate into the individual cells of 4, a portion of which is held in contact with the outer circumferential surface of the alloy, and is also incorporated into the metal plating phase I2 deposited on the outer circumferential surface of the base metal 10. In this case, base metal 10
Since the superabrasive grains 13 do not fall from the resin porous body 14 even at the lower end of the superabrasive grains 13, embedding into the metal plating phase 12 proceeds simultaneously over the entire outer peripheral surface of the alloy.

Moreover, since electrodeposition proceeds with air bubbles attached inside some of the cells, the air bubbles remain in the metal plating phase 12 and form pores 15. Therefore, these pores 1
A portion of the resin porous body 14 is exposed on the inner surface of the pore 5, and a portion of the pores 15 are in communication with each other.

When the abrasive grain layer 11 of a desired thickness is formed, the power supply is stopped, and the base metal 10 is removed from the apparatus and washed with water. Furthermore, if necessary, the grinding wheel is trued or dressed to shape or sharpen the outer peripheral surface of the abrasive grain layer 11, and the resin porous body 14 protruding from the abrasive grain layer 11 is removed, and the porous electrodeposited grinding wheel is obtain.

According to such a manufacturing method, since the superabrasive grains 13 are held in each cell of the resin porous body 14 during electrolytic plating, the superabrasive grains 13 are simultaneously applied not only to the upper end portion of the base metal 10 but also to the entire outer peripheral surface. Since the particles 13 can be electrodeposited and the electrolytic plating solution M can be forcibly supplied to the outer peripheral surface of the alloy, the plating speed can be increased and productivity is high.

Furthermore, the retention density of the superabrasive grains 13, the distribution density of air bubbles, and the precipitation rate of the metal plating phase 12 within the resin porous body 14 are maintained approximately constant according to the average cell diameter D1. The abrasive grain layer 11 in any part has a porosity, abrasive grain content,
The degree of lamination of abrasive grains and the thickness of the metal plating phase 12 are equalized. Therefore, it is possible to easily form a multi-layered abrasive grain layer with high precision, which has been difficult to manufacture in the past, and it is possible to significantly extend the life of the grinding wheel compared to a conventional single-layered abrasive grain layer.

Furthermore, the porous resin body 14 such as polyurethane foam has a porosity and a cell diameter that can be adjusted over a wide range.
Another advantage is that the resin porous body 14 having an arbitrary cell diameter and porosity can be easily formed depending on the use of the grindstone.

Note that in the manufacturing method of the above embodiment, the resin porous body 14 was simply fixed to the outer periphery of the base metal 10.
As shown in the figure, electrodeposition may be performed after disk-shaped mask plates 30 made of a non-conductive material are fixed in contact with both axial ends of the base metal 10 and the porous resin body 14, respectively. The outer diameter of the mask plate 30 is a porous resin material! The diameter is the same as or larger than the outer peripheral surface of No. 4.

If such a mask plate 30 is used, the abrasive grain layer becomes the base metal lO
It is not formed to protrude in the axial direction from the end face.

Moreover, FIG. 7 shows a modification of the mask plate 30,
In this example, an annular stepped portion 31 having a relatively small diameter is formed around the entire circumference of the outer peripheral portion of the surface of the mask plate 30 that faces the base metal 10 . The outer diameter of these annular step portions 31 is slightly smaller than the outer diameter of the base metal IO. And each mask board 3
The resin porous body 14 is fixed between the annular step portions 31 of 0,
Perform electrodeposition.

According to this manufacturing method, the abrasive grain layer 11 is formed in a state in which it slightly protrudes from both axial end surfaces of the base metal 10. Therefore, when such a grindstone is used for, for example, groove grinding, these protruding portions are formed on the base metal 10. A groove is formed in the workpiece to be slightly wider than the thickness of IO, and a gap is created between the workpiece and the base metal 10 to prevent them from coming into contact with each other. Therefore, an increase in grinding resistance due to such friction can be prevented, and the supply of grinding fluid to the grinding section and the discharge of chips are improved, and the effect of reducing machining damage to the workpiece material can also be obtained.

Next, FIG. 8 is an enlarged cross-sectional view showing the abrasive grain layer 11 of the porous multilayer electrodeposited grindstone of the second embodiment. In this grindstone, a conductive film 32 is formed on the surface of each superabrasive grain 13, and in the metal plating phase 12, pores 33 other than the pores 15 caused by air bubbles during electrodeposition are adjacent to each other. A new feature is that a large number of superabrasive grains 13 are formed between each superabrasive grain 13.

7. To manufacture such a grindstone, in the manufacturing method described above, a conductive film 32 is formed on the superabrasive grains I3 in advance,
After that, just do exactly the same operation as above. Then, the metal plating phase 12 is formed by the base metal lO as in the case of the manufacturing method described above.
It does not precipitate only on the top, but also sequentially deposits on the conductive film 32 of the superabrasive grains 13 that is conductive to the base metal lO,
Since the superabrasive grains 13 are crosslinked with each other by the metal plating phase 12, pores 33 remain partially between the superabrasive grains 13, and the metal plating phase 12 becomes porous.

The material of the conductive film 32 includes Ni, Co, and C.
Metals that can be easily formed into a film by electroless plating, such as u, or conductive ceramics, such as Cr+Ct, can be used. Further, instead of forming the conductive coating 32 on all the superabrasive grains 13, it is also possible to mix some of the superabrasive grains 13 without coating and perform electrodeposition. If you do this,
The distribution density of the pores 33 can be adjusted by adjusting the mixing ratio of the uncoated superabrasive grains.

According to the above-mentioned grindstone, in addition to the network-like resin porous body 14, a large number of pores 33 are formed in the metal plating phase 12,
Since some of these communicate with each other and with the pores 15, the effect of the above embodiment becomes even more remarkable, and it is possible to further improve the cooling effect of the grindstone and the chip discharge performance.

Note that in order to form the pores 33 in the metal plating phase 12,
In addition to the above method, it is also possible to mix the superabrasive grains 13 and metal powder during electrodeposition, and then electrodeposit them together on the alloy. However, in this case, since metal powder is mixed in,
The holding power of the superabrasive grains 13 by the metal plating phase 12 tends to decrease.

Since the proportion of pores 33 in the metal plating phase 12 decreases as the rotation speed of the base metal 10 increases, the porosity can be adjusted by adjusting the rotation speed of the base metal 10.

The porosity can also be adjusted by turning off the pump 24.

Next, FIGS. 9 and 10 are diagrams showing other embodiments of the manufacturing method of the present invention. The manufacturing method described so far is
In both cases, plating was performed by placing the base metal IO and the anode plate 22 facing each other during electrodeposition. The porous anode plate 34.35 is fixed in contact with the entire surface, and the base metal 10 is connected to the power supply cathode and the porous anode plate 34.35 is connected to the power supply anode as shown in Figure 1. , is characterized in that electrodeposition is performed while rotating the base metal lO.

The porous anode plate 34 shown in FIG. 9 is a mesh body made of an insoluble metal having a large number of openings larger than the grain size of the superabrasive grains 13. Specifically, the porous anode plate 34 shown in FIG. Expanded metal, which is made by forming many cuts in a plate and stretching it, or a perforated plate, in which many holes smaller than through holes are formed by pressing, are used.

Note that the insoluble metal refers to a metal that is not eluted during electrolytic plating, such as platinum or platinized titanium.

If the porous anode plate 34 is insoluble, anode slime will not be generated from the porous anode plate 34 during electrodeposition, and only the plating surface will be roughened, and the porous anode plate 34 will not be consumed, so the current density can be kept constant. It can be used repeatedly.

According to this manufacturing method, the thickness of the porous resin body 14 ensures an accurate distance between the outer peripheral surface of the base metal lO and the porous anode plate 34, so that the current density on the outer peripheral surface of the alloy It is also constant on the plated surface of the part.

This is particularly suitable when the outer circumferential surface of the alloy is not a simple cylinder. For example, when the axial cross-sectional shape of the outer peripheral surface of the base metal 10 is concave or convex (such as a full-sized grindstone), a simple flat anode plate as shown in FIG. 4 is used.
There is a problem in that the distance between the outer peripheral surface of the alloy and the anode plate is not constant, and the thickness of the abrasive grain layer is inevitably uneven due to uneven current density.

However, according to the manufacturing method shown in FIG. 9, the current density can be made uniform over the entire surface of the base metal 1O, regardless of the shape of the outer peripheral surface.

In the case of FIG. 9, a large number of openings may be formed in the resin porous body 14. In that case, a dense abrasive grain layer without the resin porous body 14 is formed inside these openings, while a porous abrasive grain layer 11 having the resin porous body 14 is formed in other parts.

Therefore, by changing the ratio of openings, it is possible to change the distribution ratio of the dense abrasive grain layer and the porous abrasive grain layer, and finely adjust the sharpness of the grindstone.

On the other hand, the manufacturing method shown in FIG. 1θ uses a porous anode plate 35 formed by forming a large number of openings 35A in a flexible insoluble conductive plate.

In this example, as shown in FIG. 12, the current density during plating decreases relatively in the part facing the opening 35A, and the abrasive grain 1! A relatively thin concave portion 11B is formed in the ill, while a convex portion 11 has a substantially constant thickness in other parts.
A, the recess JIB becomes a chip pocket, which has the advantage of increasing grinding fluid supply performance and chip discharge performance.

Furthermore, conventionally, in order to obtain a grindstone having concave portions in the abrasive grain layer, it was common to fix a large number of abrasive layer chips to an alloy in parallel, but in such a method, the abrasive grain layer It was not possible to secure a large bonding area between the chip and the alloy, and there was a great risk that the chip would fall off. On the other hand, in the grindstone as shown in FIG. 12, since the concave portions 11B having a gently curved surface are integrally formed between the convex portions 11A, the convex portions 11A are greatly reduced due to the presence of these concave portions 11B. It is possible to eliminate the risk of damage or falling off of the abrasive grain layer.

In addition, in the method of FIG. 1θ, the porous resin body 14 is
An opening may be formed that matches each opening 35A. In that case, the concave portion IIB of the abrasive grain layer 11 is
Since the abrasive grain layer is dense and free of particles 4, the reinforcing effect described above becomes even more pronounced.

The grindstone of the present invention is particularly useful for grinding in surface contact with a workpiece, such as double-headed grinding, creep feed grinding,
Rotary transformer grinding, polishing using a polishing surface plate, polishing using a curve generator, etc. are suitable, but they may of course be used for purposes other than those mentioned above, and the shape of the base material (base metal) may be adjusted according to the purpose. The shape of the abrasive layer and the shape of the abrasive layer may be changed as desired. For example, instead of the wheel type shown, a cup type,
It may be of any shape, such as a block type, a complete grindstone type, or a double-headed grindstone type. Alternatively, an alloy made of a non-conductive material, in which only the outer peripheral surface is made of a conductive material, can also be used.

Further, instead of the base metal 10, a conductive and flexible sheet material such as a thin metal plate may be used as the base material.
A sheet material in which a conductive film is formed on a non-conductive sheet may also be used.

Furthermore, it is a porous resin material! 4 is partially attached to the outer circumferential surface of the base metal 10 using an adhesive tape or the like, electrodeposition is performed, and grooves and recesses are formed in the abrasive grain layer 11 without depositing the metal plating phase 12 at these attachment points. It is also possible to further improve the chip discharge performance.

"Experiment example" Next, the effects of the present invention will be demonstrated by giving experimental examples.

(Experimental Example 1) Straight type grindstones corresponding to those shown in FIGS. 1 and 2 were created by the following method.

Outer diameter 200M11X inner diameter 40111Ix by machine cutting
After forming a disc-shaped base metal (made of SS41) with a width of 15 iz and performing cleaning treatment such as degreasing, an outer diameter of 215 mz x inner diameter of 1
An annular polyurethane foam measuring 95×I×width 15zz was fitted around the outer periphery of the alloy.

This polyurethane foam is Everlight SFJ rHR-50 manufactured by Brideston Co., Ltd., and the number of cells is 47 to 53/25 tttm.

In addition, a thin layer of "Schuelly Bright" manufactured by Mitsubishi Metals Co., Ltd. was applied to the polyurethane foam as a water and oil repellent.

Next, mask plates were fixed to both axial end faces of the alloy as shown in FIG. This mask board has an outer diameter of 215xxx
It is an acrylic plate with an inner diameter of 40xyx and a wall thickness of 5ju.

After fixing the alloy to a rotating shaft connected to a power source cathode, electrodeposition was performed as shown in FIG.

The electrodeposition conditions were as follows.

Electrolytic plating solution: medium concentration Ni sulfamate bath pH of plating solution: 4.0 Temperature of plating solution = 50°C Dispersion amount of diamond abrasive grains in plating solution: ll/ρl/particle size of medium abrasive grains: #140 rotation Rotation speed of shaft: 30 rpm Circulation rate of plating solution: 5ρ/min.

Total plating current value = 3A Under these conditions, plating was carried out until the thickness of the abrasive grain layer reached 5.5RII, and the alloy was removed from the plating bath and washed with water, and then trued and dressed to remove it from the abrasive grain layer. The porous resin material was removed to obtain a porous multilayer electrodeposited grindstone.

(Experimental Example 2) The only difference from Experimental Example 1 was that a 3 μl thick Ni film was formed on the same superabrasive as above using electroless plating and then used for electrodeposition. A porous multilayer electrodeposited grindstone was prepared using all the same conditions as in Experimental Example 1.

(Comparative Example) After insulating masking was applied to the side surface of the same base metal as in Experimental Example 1, this alloy was immersed in the same plating solution as above, and #140 diamond abrasive grains were sprinkled on the upper outer peripheral surface of the alloy. Plating is carried out for a time, the alloy is rotated slightly, and electrodeposition is repeated again in the order of abrasive grain dispersion - plating - base metal rotation, -
Diamond abrasive grains were temporarily fixed on the entire outer peripheral surface of the alloy.

Subsequently, a metal plating phase was further deposited while the alloy was continuously rotated at a low speed, and electrodeposition was completed when the thickness of the metal plating phase reached 70% of the abrasive grain diameter.

The alloy was then taken out, washed with water, and dried to obtain a single-layer electrodeposited grindstone.

(Comparative Method and Results) A grinding test was conducted on 92% Altos material using the above 3N grindstone. The grinding conditions are described below.

Work material: 92% Al! O5 100izx100x shoulder x 5JIR Grinding wheel peripheral speed: 1500x/win.

Table feed speed: 10x/min.

Cross speed: 2 xx/pass Grinding wheel cutting depth: 0.03xx Then, the power consumption of the grinding machine for each grinding wheel and the surface roughness of the workpiece after grinding were measured. The results are shown in Table 1.

Note that Experiment 1 represents Experiment Example 1, and Experiment 2 represents Experiment Example 2.

Table 1 "Effects of the Invention" As explained above, according to the porous multilayer electrodeposited grindstone of the present invention, the following excellent effects can be obtained.

■ A three-dimensional network-like flexible resin porous material is embedded throughout the abrasive grain layer, and the abrasive grain layer has appropriate elasticity, so it absorbs the impact when the individual superabrasive grains collide with the workpiece. It is relaxed by the elastic deformation of the surrounding metal plating phase, and chipping can be prevented.

■ The end face of the porous resin body exposed on the surface of the abrasive grain layer wears out as it is ground, creating a recess, and it is metal.

Since some of the pores formed in the grinding phase are exposed on the grinding surface, each of these acts as a chip pocket, and the chips generated in the grinding part are discharged with the movement of the grinding wheel.
Excellent chip evacuation, and clogging of the abrasive grain layer is less likely to occur. Therefore, the number of times of dressing is reduced, and the life of the grinding wheel can be extended.

■ When performing wet grinding, the grinding fluid freely enters and exits the abrasive grain layer through the pores in the abrasive grain layer and the porous resin body, and is retained therein, so that part of the fluid flows out onto the grinding surface. , efficient grinding fluid supply is possible. In addition, since the grinding fluid removes the heat inside the abrasive grain layer at this time, the cooling effect is extremely high.

On the other hand, according to the method for manufacturing a porous multilayer electrodeposited grindstone of the present invention, the following effects can be obtained.

■ During electrolytic plating, superabrasive grains are retained within individual cells of the network structure of the porous resin material, so superabrasive grains can be electrodeposited not only on the horizontal surface of the base material but also on the entire surface on which the abrasive grain layer will be formed. can be done. Furthermore, since the electrolytic plating solution can be forcibly supplied to the surface to be plated, the plating speed can be increased, resulting in high productivity.

■ The adhesion density of air bubbles, the retention density of superabrasive grains, and the precipitation rate of metal plating phase within the porous resin body are approximately constant depending on the average cell diameter, so the abrasive grain layer in any part is The content, degree of lamination of abrasive grains, porosity, and thickness of the metal plating phase are equalized, making it possible to easily form a multilayered abrasive grain layer with high precision, which was previously difficult to manufacture.

■ When superabrasive grains with a conductive film formed on the surface are used as superabrasive grains, the metal plating phase will precipitate with pores remaining between each superabrasive grain, so the metal plating phase will further increase. It becomes porous and can further improve chip discharge performance and cooling efficiency.

[Brief explanation of the drawing]

FIG. 1 is a front view showing a first embodiment of a porous multilayer electrodeposited grindstone according to the present invention, and FIG. 2 is an enlarged cross-sectional view of its abrasive grain layer.
Figures 3 and 4 are front views showing the manufacturing method of the grindstone;
FIG. 5 is an enlarged cross-sectional view of the resin porous body attached to the alloy. Further, FIGS. 6 and 7 are longitudinal cross-sectional views showing a modification of the method of fixing the porous resin body in the above method, and FIG. 8 is a grindstone showing a second embodiment of the porous multilayer electrodeposited grindstone of the present invention. 9 and 1O are longitudinal cross-sectional views showing other different embodiments of the method of the present invention; FIG. 1I is an explanatory view showing an electrodeposition method using the same method; FIG. The figure is an explanatory diagram showing the effect of the method shown in Fig. 1θ. On the other hand, FIG. 13 is an enlarged cross-sectional view of an abrasive grain layer showing a conventional electrodeposited grindstone. 10... Base metal (base material), 11... Abrasive grain layer, 12...
- Metal plating phase, I3 - Super abrasive grain, I4... Resin porous body, 15... Pore, 20... Plating tank, 21...
Rotating shaft, 22...Anode plate, 24...Pump, 25.
... Nozzle, M ... Electrolytic plating solution, DI ... Average cell diameter, 30 ... Mask plate, 32 ... Conductive film, 3
3... Pores, 34.35... Porous anode plate.

Claims (4)

[Claims] (1) An electrodeposited grindstone having an abrasive grain layer formed by dispersing superabrasive grains in a multilayered manner in a metal plating phase on a base material, wherein the metal plating phase includes a non-directional three-layer A resin porous body having a dimensional network structure is embedded, and the average cell diameter of the network of this resin porous body is 3 to 100 times the average particle diameter of the superabrasive grains, and the metal plating inside each cell is A porous multilayer electrodeposited grindstone characterized by the fact that pores are partially formed in the phase. (2) A non-directional three-dimensional network structure is formed on the conductive abrasive layer forming surface of the base material, and the average cell diameter of the network is 3 to 100 times the average particle diameter of the superabrasive grains. After fixing the resin porous body, the base material is immersed in an electrolytic plating solution, and a metal plating phase is precipitated on the surface on which the abrasive grain layer is formed while dispersing superabrasive grains on which a conductive film is formed on the surface. A method for manufacturing a porous multilayer electrodeposited grindstone, which comprises forming a porous abrasive grain layer in which superabrasive grains are dispersed in a multilayered manner inside a porous resin body. (3) When forming the abrasive grain layer, the superabrasive grains on which the conductive film is formed are dispersed while partially retaining air bubbles in the cells of the resin porous body. 3. The method for manufacturing a porous multilayer electrodeposited grindstone according to claim 2, wherein the metal plating phase is further made porous by precipitating a metal plating phase on the forming surface. (4) A non-directional three-dimensional network structure is formed on the conductive abrasive layer forming surface of the base material, and the average cell diameter of the network is 3 to 100 times the average particle diameter of the superabrasive grains. After fixing the resin porous body, the base material is immersed in an electrolytic plating solution, with air bubbles partially retained in the cells of the resin porous body,
A metal plating phase is precipitated on the surface on which the abrasive layer is formed while dispersing superabrasive grains, thereby forming a porous abrasive layer in which superabrasive grains are dispersed in multiple layers inside the porous resin body. A method for manufacturing a porous multilayer electrodeposited grindstone.