JPS6333988B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to the improvement of electrodeposited grindstones, and in producing the electrodeposition grindstones, hydrophilic groups are added to abrasive grains such as diamond or cubic boron nitride through cationic surface activation. The aim is to control the amount of eutectoid abrasive grains to a fixed amount by improving the dispersion in the plating bath, and to manufacture an electrodeposited grindstone that matches the grinding performance.

The conventional manufacturing method for electrodeposited grindstones is to simply suspend abrasive grains such as 1 diamond in a plating bath while stirring, deposit the abrasive grains on a base metal placed below the plating bath, and then There is a method of bonding using electrolytic plating and removing excess abrasive grains. With this method, it is impossible to adjust the blending ratio of abrasive grains such as diamond.
2. There is also a method of performing electrolytic plating by applying chemical copper plating or chemical nickel plating to abrasive grains such as diamond in advance and suspending it in an electroplating bath while stirring, but in this method, the first step is It cannot be said that the adhesion of chemical plating to the abrasive grains is good, and the bonding strength is poor. There is a method of bonding three abrasive grains to a base metal using a well-known adhesive, first applying chemical plating as a base plating, and then performing electrolytic plating to fix the abrasive grains.
However, the adhesive does not have heat resistance, and the adhesive strength weakens due to the heat generated during grinding. In addition, since chemical plating and electroplating are applied to the abrasive grain surface, post-dressing processing is always required to expose the ground surface.

In addition to the many drawbacks of the conventional method of manufacturing electrodeposited grindstones, there is also the problem that the optimal method has not yet been established.

The present invention makes abrasive grains such as diamond hydrophilic,
The purpose is to uniformly disperse it in the plating bath. In addition, in order to deposit on the cathode in an electrolytic plating bath, electrophoresis to the cathode must be good. Cationic surfactants are suitable as those that satisfy the above conditions. This is based on the fact that cationic surfactant molecules generate cations in aqueous solution. In each of the following Examples, a primary amine derivative, a quaternary ammonium salt, or the like was used as the cationic surfactant, and it was confirmed that similar effects could be obtained in each case. Approximately 1g of abrasive grains such as diamond, particle size 3-30μ
was stirred in about 50 c.c. of a cationic surfactant for several hours to wrap the surface of the abrasive grains in the surfactant and make them hydrophilic. When adding to the plating bath, the above-mentioned solution was used.

Examples will be described below.

Example 1 When the material of the base metal was iron, copper, or copper alloy, a diamond whetstone was manufactured using the following plating bath after performing the usual pretreatment process.

Bath composition Nickel sulfate Nickel chloride Borate Lauric Sodium sulfate Diamond abrasive solution *240g/ 45g/ 30g/ 0.5g/ 10~50c.c./ *Diamond/cationic surfactant = 1g/
50c.c. Conditions PH: 2~4 Temperature: 40~50℃ Current density: 1~5A/dm ² Stirring: Magnetic stirrer If the base metal is stainless steel, use the above plating bath.
Before plating, a base plating was performed using the following nickel chloride bath.

Bath composition Nickel chloride hydrochloric acid 240g/120g/ Conditions PH: 2.0 Temperature: 20~30℃ Current density: 3~5A/dm ² hours: 1 minute The relationship between the amount of diamond added and the amount of diamond deposited against the current density was Shown in Figure 1. However, in the case of diamond whetstones, the concentration level is usually 100 when the diamond weight is 4.4 carats/cm ³ , so the values are shown accordingly. Figure 2 shows the difference between when the plating bath is stirred and when it is not stirred. As can be seen from FIG. 1, the amount of diamond deposited tends to increase as the amount of diamond added and the current density increase.
FIG. 2 shows that there is almost no difference between the presence and absence of stirring, and the dispersion effect of the cationic surfactant is remarkable.

Example 2 In Example 1, a nickel plating bath generally called a Watt bath was shown, but a diamond grindstone can also be manufactured using a sulfamic acid nickel plating bath. The conditions are shown below.

Bath composition: Nickel sulfamate, nickel chloride, saccharin borate, soda diamond abrasive solution 450g/10g/30g/1g/10~50c.c./Conditions PH: 1~4 Temperature: 50~60℃ Current density: 1~10A/dm ² Stirring: Magnetic stirrer The results were almost the same as in the Watt bath.

Example 3 In Examples 1 and 2, nickel plating was shown, but copper plating is also possible.

Bath composition Copper sulfate sulfate diamond abrasive grain liquid 200g/ 100g/ 10~50c.c./ Conditions Temperature: 25~30℃ Current density: 1~5A/dm ² Examples 4 Inner and outer diameters of rigid thin plate materials such as stainless steel First, punch out by photo etching process as shown in Fig. 3 to prevent burrs and warpage. Design the whetstone pattern and produce the screen printing plate. Plating resist ink is screen printed in the shape shown in FIGS. 4a and 4b. However, the ink used at this time is a plating resist ink having alkali resistance and acid resistance, and is sufficiently cured with heat after printing. Next, electrolytic degreasing and pickling are performed in the same way as normal plating pretreatment. Perform base nickel plating under the following conditions.

Bath composition Nickel chloride hydrochloric acid 240g/120g/Conditions PH: 2.0 Temperature: 20-30°C Current density: 3-5A/dm ² hours: 1 minute Pickling is performed immediately. Composite plating is performed under the conditions shown below. However, at this time, it is necessary to add about 1 g of abrasive grains such as diamond, with a particle size of 3 to 30 μm, into about 50 c.c. of a cationic surfactant and stir it for several hours to make it hydrophilic. This solution is referred to as a diamond abrasive grain solution.

Bath composition: Nickel sulfate, Nickel chloride, Borate, Lauric acid, Sodium sulfate, Diamond abrasive grain solution 240-360g/ 45-70g/ 30-40g/ 0.5-2g/ 10-50c.c./ Conditions PH: 2-4 Temperature: 40-50℃ Current Density: 1 to 5 A/dm ² or more Although not described in the examples, this method is also possible for plating chromium, zinc, etc. in addition to nickel and copper, and as the abrasive grains, cubic boron nitride, other than diamond, It is also applicable to silicon carbide and the like.

The present invention shown in each of the above embodiments has the following remarkable effects.

1. The amount of abrasive grains such as diamond deposited can be controlled.

2 Good adhesion due to eutectoid plating with metal ions.

3 Thick plating is possible.

4 Various types of whetstones can be manufactured.

5. It is possible to manufacture shapes with good grinding performance.

[Brief explanation of the drawing]

Figure 1 shows the amount of diamond deposited, Figure 2 shows the effect of the cationic surfactant, Figure 3 is a cross-sectional view of the electrodeposited grinding wheel base, and Figures 4 a and b show the electrodeposited grindstone. It is a sectional view showing a compound plating part.

Claims (1)

[Claims] 1. Microabrasive grains such as diamond or cubic boron nitride are made hydrophilic with a cationic surfactant, dispersed in an electroplating bath of nickel or copper, and electrolyzed to form a base metal on the cathode. A method for producing an electroplated grindstone, which is characterized in that it is produced by simultaneously depositing metal and abrasive grains on top.