JP2001107260A - Electrodepositing tool - Google Patents
Electrodepositing toolInfo
- Publication number
- JP2001107260A JP2001107260A JP32311099A JP32311099A JP2001107260A JP 2001107260 A JP2001107260 A JP 2001107260A JP 32311099 A JP32311099 A JP 32311099A JP 32311099 A JP32311099 A JP 32311099A JP 2001107260 A JP2001107260 A JP 2001107260A
- Authority
- JP
- Japan
- Prior art keywords
- abrasive grains
- tool
- electroless plating
- plating
- electrodeposition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Chemically Coating (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、電着工具に係り、
更に詳しくは、砥粒が脱落し難く、耐久性に優れた電着
工具の砥粒の保持固定構造に係るものである。TECHNICAL FIELD The present invention relates to an electrodeposition tool,
More specifically, the present invention relates to a structure for holding and fixing abrasive grains of an electroplated tool, which is hard to fall off and has excellent durability.
【０００２】[0002]
【従来の技術】電着工具とは、軸材の周りに付着させた
砥粒を電着金属で軸材の周りに埋めて固定したものであ
る。砥粒粒子の５０％以上は電着金属に埋没されてお
り、先端部を露出させて使用する。電着工具の砥粒は電
着金属に埋めこまれて物理的に保持固定されているだけ
であるので、砥粒が脱落しやすい欠点がある。砥粒の保
持力を大きくするためには、砥粒と電着金属の界面の接
触面積をいかに大きくするかがポイントになる。現状の
電着工具では、電着金属と砥粒の界面の状況は図２のよ
うになっており、矢印で示す部分に隙間ができている。
この隙間の発生が砥粒脱落の大きな原因となっている。
脱落を防止するためには矢印部分の隙間をなくして図１
に示すような構造にする必要があるが、現在まで解決す
る方法は見出されていない。2. Description of the Related Art An electrodeposition tool is a tool in which abrasive grains adhered around a shaft are buried and fixed around the shaft with an electrodeposited metal. At least 50% of the abrasive particles are buried in the electrodeposited metal, and the tip is exposed and used. Since the abrasive grains of the electrodeposition tool are merely embedded and physically held and fixed in the electrodeposited metal, there is a disadvantage that the abrasive grains are easily dropped. The key to increasing the holding power of the abrasive grains is how to increase the contact area at the interface between the abrasive grains and the electrodeposited metal. In the current electrodeposition tool, the state of the interface between the electrodeposited metal and the abrasive grains is as shown in FIG. 2, and a gap is formed in a portion indicated by an arrow.
The formation of this gap is a major cause of the abrasive grains falling off.
In order to prevent dropping, the gap between the arrow parts is eliminated and FIG.
However, no solution has been found to date.
【０００３】[0003]
【発明が解決しようとする課題】本発明はかかる問題に
鑑みてなされたもので、電着メッキ時、上記した隙間の
発生を防止し、砥粒に電着金属を隙間なく密着させるこ
とができる新規な構造の電着工具を提供せんとするもの
である。SUMMARY OF THE INVENTION The present invention has been made in view of such a problem, and can prevent the above-mentioned gap from occurring during electrodeposition plating, and can make the electrodeposited metal adhere to the abrasive grains without any gap. It is intended to provide an electrodeposition tool having a new structure.
【０００４】[0004]
【課題を解決するための手段】本発明者は上記課題に関
して鋭意研究した結果次の知見を得た。すなわち、 電着工具の砥粒表面に予め無電解メッキ膜を被覆し、
この無電解メッキ膜を介して電着金属で電着固定する
と、砥粒と電着金属の間に隙間が発生しないこと。 無電解メッキ膜としてはニッケル系無電解メッキが最
も好ましいこと。 無電解メッキ膜の厚さが０．００１〜５０μｍが最も
好ましいこと。 以上の知見を得た。本発明は以上の知見を基になされた
ものである。Means for Solving the Problems The present inventors have made intensive studies on the above problems and have obtained the following findings. That is, the surface of the abrasive grains of the electrodeposition tool is coated with an electroless plating film in advance,
When the electrodeposited metal is fixed by electrodeposition via the electroless plating film, no gap is generated between the abrasive grains and the electrodeposited metal. The most preferred electroless plating film is nickel-based electroless plating. Most preferably, the thickness of the electroless plating film is 0.001 to 50 μm. The above findings were obtained. The present invention has been made based on the above findings.
【０００５】[0005]
【発明の実施の形態】本発明の電着工具の砥粒２は図１
に示す様に、表面に無電解メッキ膜４が被覆されてお
り、この無電解メッキ膜が電着金属３と結合されている
のが特徴である。従来工具のような隙間がなくなり、接
触面積が大きくなることにより、砥粒の脱落がなくなり
耐久性が大幅に向上する。DESCRIPTION OF THE PREFERRED EMBODIMENTS The abrasive grains 2 of the electrodeposition tool of the present invention are shown in FIG.
As shown in (1), the surface is coated with an electroless plating film 4, and this electroless plating film is characterized by being bonded to the electrodeposited metal 3. By eliminating the gap as in the conventional tool and increasing the contact area, the abrasive grains do not fall off and the durability is greatly improved.
【０００６】電着砥粒は、ダイヤモンド、ＢＮ，Ｓｉ
Ｃ，ＷＣ，ＳｉＯ２，グラファイト、ＳｉＮ、ＳｉＣ−
Ｃｕ，ＳｉＣ−Ａｌ、その他全ての砥粒を粒度を問わず
使用できる。Electrodeposited abrasive grains include diamond, BN, Si
C, WC, SiO 2, graphite, SiN, SiC-
Cu, SiC-Al, and all other abrasive grains can be used regardless of particle size.
【０００７】無電解メッキは、ニッケル系、銅系、コバ
ルト系のメッキが有効であり、特にニッケル系の無電解
メッキ、たとえば、Ｎｉ−Ｂ系、Ｎｉ−Ｐ系等が好まし
い。メッキ厚みは、０．００１〜５０μｍが好ましい。
図１のような隙間のない構造にするためには、メッキ厚
さは０．００１μｍ以上必要である。メッキ厚が上限を
越えると加工中にメッキ膜に亀裂が発生して砥粒が脱落
することがあり好ましくない。As the electroless plating, nickel-based, copper-based, and cobalt-based plating are effective, and particularly, nickel-based electroless plating, for example, Ni-B-based or Ni-P-based plating is preferable. The plating thickness is preferably 0.001 to 50 μm.
In order to obtain a structure having no gap as shown in FIG. 1, the plating thickness needs to be 0.001 μm or more. If the plating thickness exceeds the upper limit, cracks may occur in the plating film during processing and abrasive grains may fall off, which is not preferable.
【０００８】本発明では砥粒全面無電解メッキされてい
るので、軸材に電着固定した時、砥粒突出部も電着金属
で覆われている。したがって使用時、必要に応じて突出
部を覆う電着金属をドレッシングあるいは化学的エッチ
ングして除去し、砥粒を露出させる。In the present invention, since the entire surface of the abrasive grains is electrolessly plated, when the electrode is fixed to the shaft material by electroplating, the projections of the abrasive grains are also covered with the electrodeposited metal. Therefore, at the time of use, the electrodeposited metal covering the protruding portion is removed by dressing or chemical etching as necessary, thereby exposing the abrasive grains.
【０００９】電着金属は、ニッケル、コバルト、鉄系金
属等を適宜使用できるが、最も好ましいのは、ニッケル
系金属である。As the electrodeposited metal, nickel, cobalt, iron-based metal and the like can be appropriately used, and most preferably, nickel-based metal is used.
【００１０】砥粒は種付けメッキ法で基材（軸材）に一
旦種付けした後、砥粒の周囲を電着金属で埋めて固定す
る。種付けメッキとしては、メッキ液に砥粒を懸濁、分
散させてメッキ液と共に共析させる方法、あるいは多孔
質容器の中に砥粒を収めて電気メッキ液に沈め、軸材を
砥粒の中に差込んで埋めて電気メッキして、電着金属で
砥粒を軸材に種付けする方法等、この種の用途に使用さ
れる方法は全て採用できる。[0010] After the abrasive grains are once seeded on the base material (shaft material) by a seed plating method, the periphery of the abrasive grains is filled with an electrodeposited metal and fixed. As seed plating, abrasive grains are suspended and dispersed in a plating solution and co-deposited with the plating solution, or the abrasive grains are placed in a porous container, submerged in an electroplating solution, and the shaft material is placed in the abrasive grains. Any of the methods used for this type of application, such as a method of inserting and filling an electrode and electroplating and seeding the shaft with an electrodeposited metal, can be adopted.
【００１１】[0011]
【実施例】実施例１（ダイヤモンド電着ドリル） 砥粒：粒度 １００メッシュのダイヤモンド砥粒 無電解メッキ：ダイヤモンド砥粒を公知の方法で脱脂、
センシタイジング処理、アクチベーター処理を行ってか
ら、下記組成の無電解メッキを使って砥粒の表面にＮｉ
−Ｂを概ね０．２μｍ無電解メッキした。 無電解Ｎｉ−Ｂメッキ液の組成 硫酸ニッケル３０ｇ／ｌ，ホウ酸３０ｇ／ｌ、塩化アン
モニウム３０ｇ／ｌ、ロッセル塩３０ｇ／ｌ、ジメチル
アミンボラン３ｇ／ｌ、ＰＨ５．５、浴温６０℃ 種付けメッキ：ガラス繊維製の多孔質坩堝にダイヤモン
ド砥粒を入れて、下記組成のＮｉメッキ液に沈め、砥粒
の中に直径１０ｍｍの鉄製軸材を差込んで電流密度０．
２Ａ／ｄｍ２で３０分電気メッキした。 種付けメッキ液の組成 硫酸ニッケル２４０ｇ／ｌ，塩化ニッケル４０ｇ／ｌ、
ホウ酸４０ｇ／ｌ，ＰＨ４．２、浴温５５℃ 次に、ダイヤモンド砥粒を種付けした軸材をメッキ液か
ら引き上げ、余分に付着した砥粒を刷毛で落とした後、
仮付した砥粒の周囲を下記組成のＮｉメッキ液を使用し
て電流密度０．５Ａ／ｄｍ２で２時間メッキして砥粒の
周りにＮｉを肉盛して、砥粒を軸材に固定した。 肉盛用電気メッキ液の組成 硫酸ニッケル２４０ｇ／ｌ，塩化ニッケル４５ｇ／ｌ、
ホウ酸４０ｇ／ｌ，応力減少剤（ワールドメタル社製：
ゼロオール）２０ｍｌ／ｌ、ＰＨ４．２、浴温５５℃ 砥粒の周囲は隙間なくＮｉで肉盛され、砥粒の突出部に
もＮｉが被覆されていた。 評価テスト 砥粒の突出部に被覆されたＮｉをドレッシングして除去
した後、アルミナセラミックの研磨に使用して性能を評
価した。延べ７００時間、砥粒が脱落することなく使用
できた。一方従来の工具では延べ７０時間で砥粒が脱落
して使用不可になった。本発明構造は砥粒の脱落防止と
耐久性の向上に顕著な効果があることを確認できた。EXAMPLES Example 1 (Electrodeposited diamond drill) Abrasive grains: diamond abrasive grains of 100 mesh particle size Electroless plating: degreasing diamond abrasive grains by a known method,
After performing the sensitizing treatment and the activator treatment, the surface of the abrasive grains is coated with Ni using electroless plating having the following composition.
-B was electrolessly plated at about 0.2 μm. Composition of electroless Ni-B plating solution Nickel sulfate 30 g / l, boric acid 30 g / l, ammonium chloride 30 g / l, Rossel salt 30 g / l, dimethylamine borane 3 g / l, PH 5.5, bath temperature 60 ° C. seed plating : Put diamond abrasive grains in a porous crucible made of glass fiber, submerge in Ni plating solution having the following composition, insert an iron shaft having a diameter of 10 mm into the abrasive grains, and set current density to 0.
Electroplated at 2 A / dm 2 for 30 minutes. Composition of seed plating solution Nickel sulfate 240 g / l, nickel chloride 40 g / l,
Boric acid 40 g / l, PH 4.2, bath temperature 55 ° C. Next, the shaft material seeded with diamond abrasive grains is pulled up from the plating solution, and excess abrasive grains are dropped with a brush.
The periphery of the temporarily attached abrasive grains is plated at a current density of 0.5 A / dm 2 for 2 hours using a Ni plating solution having the following composition, and Ni is built up around the abrasive grains, and the abrasive grains are used as a shaft material. Fixed. Composition of overlaying electroplating solution Nickel sulfate 240g / l, nickel chloride 45g / l,
Boric acid 40 g / l, stress reducing agent (manufactured by World Metal Corporation:
(Zeroall) 20 ml / l, PH 4.2, bath temperature 55 ° C. The surroundings of the abrasive grains were overlaid with Ni without gaps, and the protrusions of the abrasive grains were also coated with Ni. Evaluation Test After the Ni coated on the protruding portions of the abrasive grains was removed by dressing, the performance was evaluated by polishing alumina ceramics. A total of 700 hours could be used without abrasive particles falling off. On the other hand, in the case of the conventional tool, the abrasive grains fell off in a total of 70 hours, and became unusable. It was confirmed that the structure of the present invention has a remarkable effect on preventing the abrasive grains from falling off and improving the durability.
【００１２】実施例２（ＢＮ電着ドリル） 砥粒：粒度８０メッシュのＣＢＮ砥粒 無電解メッキ：実施例１と同様に脱脂、センシタイザ
ー、アクチベーター処理した後、下記組成の無電解Ｎｉ
−Ｐメッキ液を使用してＢＮ砥粒の表面にＮｉ−Ｐを
０．０５μｍ無電解メッキした。 無電解Ｎｉ−Ｐメッキ液の組成 硫酸ニッケル２０ｇ／ｌ，クエン酸ナトリウム３０ｇ／
ｌ，次亜リン酸ナトリウム１５ｇ／ｌ，ＰＨ８．９，浴
温４０℃ 種付けメッキ：上記無電解メッキしたＢＮ砥粒を５ｗｔ
％懸濁、分散させた下記組成のＮｉメッキ液の中に直径
１０ｍｍのステンレス鋼製の軸材をいれて、電流密度
０．２Ａ／ｄｍ２で３０分メッキした。 種付けメッキ液の組成 スルファミン酸ニッケル４００ｇ／ｌ，塩化ニッケル１
０ｇ／ｌ，ホウ酸４０ｇ／ｌ，ＰＨ４．０，温度６０℃ 次に軸材を種付けメッキ液から引上げ、余分に付着した
砥粒を洗浄して落した後、種付けした砥粒の周囲を下記
組成のＮｉメッキ液を使用して電流密度０．５Ａ／ｄｍ
２で２時間メッキして肉盛固定した。 肉盛用電気メッキ液の組成 スルファミン酸ニッケル４００ｇ／ｌ，塩化ニッケル２
０ｇ／ｌ、ホウ酸４０ｇ／ｌ，応力減少剤（ワールドメ
タル社製：ゼロオール）２０ｍｌ／ｌ、ＰＨ４．０、浴
温６０℃ 砥粒の周囲は隙間なくＮｉで肉盛され、砥粒の突出部に
もＮｉが厚覆されていた。砥粒の突出部に被覆されたＮ
ｉをドレッシングして除去した後、超硬合金の研磨に使
用して性能を評価した。延べ５００時間、砥粒が脱落す
ることなく使用できた。一方、従来の工具では延べ２０
時間で砥粒が脱落して使用不可になった。本発明構造は
砥粒の脱落防止と耐久性の向上に顕著な効果があること
を確認できた。Example 2 (BN electrodeposited drill) Abrasive grains: CBN abrasive grains having a particle size of 80 mesh Electroless plating: After degreasing, sensitizing, and activator treatment as in Example 1, electroless Ni having the following composition
Using a -P plating solution, Ni-P was electrolessly plated on the surface of the BN abrasive grains at 0.05 m. Composition of electroless Ni-P plating solution Nickel sulfate 20 g / l, sodium citrate 30 g /
1, sodium hypophosphite 15 g / l, PH 8.9, bath temperature 40 ° C. Seeding plating: 5 wt% of the above electroless plated BN abrasive
A stainless steel shaft having a diameter of 10 mm was placed in a Ni plating solution having the following composition, which was suspended and dispersed in a%, and plated at a current density of 0.2 A / dm 2 for 30 minutes. Composition of seed plating solution Nickel sulfamate 400g / l, Nickel chloride 1
0 g / l, boric acid 40 g / l, pH 4.0, temperature 60 ° C. Next, the shaft material was pulled up from the plating solution, and extra-adhered abrasive grains were washed and dropped. Current density 0.5A / dm using Ni plating solution of composition
Then , plating was performed for 2 hours, and the overlay was fixed. Composition of overlaying electroplating solution Nickel sulfamate 400g / l, nickel chloride 2
0 g / l, boric acid 40 g / l, stress reducing agent (World Metal Co., Ltd .: Zerool) 20 ml / l, PH 4.0, bath temperature 60 ° C. The portion was also overlaid with Ni. N coated on protruding part of abrasive grains
After dressing and removing i, it was used for polishing a cemented carbide to evaluate its performance. A total of 500 hours could be used without the abrasive particles falling off. On the other hand, a total of 20
The abrasive particles fell off in a time, and became unusable. It was confirmed that the structure of the present invention has a remarkable effect in preventing the abrasive grains from falling off and improving the durability.
【００１３】[0013]
【発明の効果】以上詳記したように、本発明は電着工具
の砥粒の脱落防止に顕著な効果を有し工具の耐久性と品
質の向上に多大の貢献をなすものである。As described in detail above, the present invention has a remarkable effect in preventing the abrasive grains from dropping out of the electrodeposited tool, and makes a great contribution to the improvement of the durability and quality of the tool.
【図１】図１は本発明工具の電着構造を説明した図であ
る。FIG. 1 is a diagram illustrating an electrodeposition structure of a tool according to the present invention.
【図１】図２は従来工具の電着構造を説明した図であ
る。FIG. 1 is a diagram illustrating an electrodeposition structure of a conventional tool.
１…軸材 ２…砥粒 ３…電着金属 ４…無電解メッキ層 DESCRIPTION OF SYMBOLS 1 ... Shaft material 2 ... Abrasive grain 3 ... Electrodeposited metal 4 ... Electroless plating layer
【手続補正書】[Procedure amendment]
【提出日】平成１２年１月２７日（２０００．１．２
７）[Submission date] January 27, 2000 (2000.1.2
7)
【手続補正１】[Procedure amendment 1]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】図面の簡単な説明[Correction target item name] Brief description of drawings
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【図面の簡単な説明】[Brief description of the drawings]
【図１】図１は本発明工具の電着構造を説明した図であ
る。FIG. 1 is a diagram illustrating an electrodeposition structure of a tool according to the present invention.
【図２】図２は従来工具の電着構造を説明した図であ
る。FIG. 2 is a diagram illustrating an electrodeposition structure of a conventional tool.
【符号の説明】 １…軸材 ２…砥粒 ３…電着金属 ４…無電解メッキ層[Explanation of Signs] 1 ... shaft material 2 ... abrasive grains 3 ... electrodeposited metal 4 ... electroless plating layer
Claims (3)
属で該軸材に保持固定した構造からなる電着工具におい
て、該砥粒は、表面に無電解メッキ膜を被覆され、該無
電解メッキ膜を介して電着固定されてなることを特徴と
する電着工具。1. An electrodeposition tool having a structure in which abrasive grains adhered to the surface of a tool shaft are held and fixed to the shaft with an electrodeposited metal, wherein the surface of the abrasive grains is coated with an electroless plating film. And an electrodeposition tool fixed by electrodeposition via the electroless plating film.
キである請求項１に記載の電着工具。2. The electrodeposition tool according to claim 1, wherein said electroless plating is nickel-based electroless plating.
５０μｍである請求項１あるいは２に記載の電着工具。3. The method according to claim 1, wherein said electroless plating film has a thickness of 0.001 to 0.001.
3. The electrodeposited tool according to claim 1, which has a thickness of 50 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32311099A JP2001107260A (en) | 1999-10-06 | 1999-10-06 | Electrodepositing tool |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32311099A JP2001107260A (en) | 1999-10-06 | 1999-10-06 | Electrodepositing tool |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2001107260A true JP2001107260A (en) | 2001-04-17 |
Family
ID=18151201
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP32311099A Pending JP2001107260A (en) | 1999-10-06 | 1999-10-06 | Electrodepositing tool |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001107260A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003084717A1 (en) * | 2002-04-11 | 2003-10-16 | Showa Denko, K. K. | Metal-coated abrasives, grinding wheel using metal-coated abrasives and method of producing metal-coated abrasives |
| KR100599349B1 (en) * | 2002-04-11 | 2006-07-12 | 쇼와 덴코 가부시키가이샤 | Metal-coated abrasives, grinding wheel using metal-coated abrasives and method of producing metal-coated abrasives |
| JP2006181701A (en) * | 2004-12-28 | 2006-07-13 | Asahi Diamond Industrial Co Ltd | Electro-deposited wire tool and manufacturing method thereof |
| JP2007109767A (en) * | 2005-10-12 | 2007-04-26 | Mitsubishi Materials Corp | Cmp conditioner and its manufacturing method |
| JP2007152485A (en) * | 2005-12-05 | 2007-06-21 | Kanai Hiroaki | Manufacturing method of saw wire |
| JP2007203443A (en) * | 2006-02-06 | 2007-08-16 | Univ Kanagawa | Method of producing electro-deposited grindstone, and electro-deposited grindstone produced by the method |
| KR101214922B1 (en) | 2010-12-03 | 2012-12-24 | 이화다이아몬드공업 주식회사 | mehtod for partially forming thin film on diamond, and the diamond abrasive grain and diamond tool manufactured thereby |
| JP2014223711A (en) * | 2013-05-17 | 2014-12-04 | 勝行 戸津 | Driver bit |
| KR101777181B1 (en) | 2017-05-15 | 2017-09-12 | 세계연마 주식회사 | Electrodeposition method for manufacturing non-slip |
-
1999
- 1999-10-06 JP JP32311099A patent/JP2001107260A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003084717A1 (en) * | 2002-04-11 | 2003-10-16 | Showa Denko, K. K. | Metal-coated abrasives, grinding wheel using metal-coated abrasives and method of producing metal-coated abrasives |
| KR100599349B1 (en) * | 2002-04-11 | 2006-07-12 | 쇼와 덴코 가부시키가이샤 | Metal-coated abrasives, grinding wheel using metal-coated abrasives and method of producing metal-coated abrasives |
| JP2006181701A (en) * | 2004-12-28 | 2006-07-13 | Asahi Diamond Industrial Co Ltd | Electro-deposited wire tool and manufacturing method thereof |
| JP2007109767A (en) * | 2005-10-12 | 2007-04-26 | Mitsubishi Materials Corp | Cmp conditioner and its manufacturing method |
| JP2007152485A (en) * | 2005-12-05 | 2007-06-21 | Kanai Hiroaki | Manufacturing method of saw wire |
| JP2007203443A (en) * | 2006-02-06 | 2007-08-16 | Univ Kanagawa | Method of producing electro-deposited grindstone, and electro-deposited grindstone produced by the method |
| KR101214922B1 (en) | 2010-12-03 | 2012-12-24 | 이화다이아몬드공업 주식회사 | mehtod for partially forming thin film on diamond, and the diamond abrasive grain and diamond tool manufactured thereby |
| JP2014223711A (en) * | 2013-05-17 | 2014-12-04 | 勝行 戸津 | Driver bit |
| KR101777181B1 (en) | 2017-05-15 | 2017-09-12 | 세계연마 주식회사 | Electrodeposition method for manufacturing non-slip |
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