JPH01271117A - Wire for wire saw - Google Patents

Abstract

PURPOSE:To enable the cutting of high speed by providing the metal plating layer in the thickness of the specified % range of the average grain diameter of an abrasive grain on the surface of a metal wire and forming the part more than the specified, at least of the thickness of this metal plating layer by the alloy plating layer contg. Ni-P, Co-P, etc. CONSTITUTION:The metal plating layer 4 in the thickness of 50-150% of the averaged grain size of an abrasive grain 2 on the surface of the metal wire of a piano wire, stainless steel wire, etc., the part of >=10% at least of the thickness of this metal plating layer 4 is formed by the alloy plating layer 3 contg. Ni-P, Co-P, etc., and the wire 5 for a wire saw is made. The body having higher putting speed and longer service life is thus obtd.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a wire for a wire saw used for cutting hard materials such as semiconductors and ceramics.

[Conventional technology and its problems]

Conventionally, when cutting hard materials such as semiconductors and ceramics with wire tools, the main method is to apply pressure to the material to be cut while applying a certain tension to piano wire, and to supply grinding fluid containing abrasive grains to the cutting section. The wire was cut by moving the wire back and forth.

In this method, since the surface of the piano wire is clean, fewer abrasive particles are drawn between the wire and the material to be cut.
There are problems in that the holding force is weak and the cutting speed is low.

Further, a wire grindstone is known in which abrasive grains are coated on the surface of a thin wire by plating.

This wire is generally coated with abrasive grains by electroplating, and although the deposition rate is relatively high, the abrasive grain content is low and the abrasive grain retention is low. Particularly when cutting thin wires with a diameter of less than 1 inch, there is a problem in that the abrasive grains must be held evenly in fractions, making it difficult to increase the cutting speed.

[Means to solve the problem]

Kibatsu gA solves the above problems and provides a wire for wire saws that can cut at a higher speed than conventional wires and has a longer life.

The wire for wire saws of the present invention has SIC, AQ, -s tC! on the surface of metal wires such as piano wires and stainless steel wires. BN
, Cu, Ni, Ni in which abrasive grains such as diamond are dispersed
- Forming a metal plating layer such as P%Co-P%Ni-B,
Furthermore, Ni-P, Co-P, Ni-C on the surface
By coating an alloy containing 5 to 15% o-P#P by electroless plating or electroplating, the abrasive grains on the wire surface are coated with one or eight types of metal plating.

The lower plating layer is for depositing abrasive grains on the wire surface, and may be any material that allows composite plating of metal and abrasive grains, such as Ni, Ni-P%Ou, etc., by electroplating or electroless plating. Can be coated.

The alloy plating layer containing pf: s~15% is intended to further strengthen the holding power of abrasive grains, and the P content is 5~15%.
It becomes amorphous in the range of , and compared to plated films of Cu, Ni, etc., a plated film with higher hardness and smoothness can be obtained, and a wire with a higher cutting speed and a long life with less chance of abrasive grains falling off can be obtained. It is.

The wire of the present invention does not necessarily need to have two metal plating layers as described above, but can retain abrasive grains with one layer of metal plating by composite plating of P-containing alloy and abrasive grains. Alternatively, after abrasive grains are deposited on a P-containing alloy in fractions, the gaps between the abrasive grains may be filled with various metal platings.

In addition, the total thickness of the metal plating layer is 50-15 of the average grain size of the abrasive grains.
A thickness of 0% is suitable, and a wire with the best cutting speed can be obtained especially when the thickness is 70 to I%.

Note that if the thickness is less than 50% of the average grain size of the abrasive grains, the abrasive grain holding power is small and the abrasive grains are likely to fall off. Moreover, when it exceeds 150%, the number of abrasive grains completely embedded in the metal plating increases, and the cutting speed decreases.

In addition, the thickness of the alloy plating layer containing P must be at least 10% of the total plating thickness. If the thickness is less than 10%, the effect of a high hardness and smooth plating film cannot be obtained, and the cutting speed and lifespan will be reduced. is inferior.

〔Example〕

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a wire for a wire saw according to the present invention will be described below with reference to the drawings.

As shown in Figure 1, a piano wire with a diameter of α115 (1
), an electrolytic Ni-P plating layer (3) with a thickness t of 5μ in which trio or diamond abrasive grains (2) with an average grain size of 25P are dispersed is formed on the surface of the A wire fIl for a wire saw with a coating layer thickness T of 20μ is formed by forming a layer (4) on each of the following materials with a thickness of 15μ.
was configured.

In the above structure, the plating conditions for the Ni--P plating on the lower layer and various plating on the upper layer are as follows.

Lower layer Ni-P plating conditions Bath composition Nickel sulfate 240 l/l Nickel chloride 459! /l! Hydrolic acid
809/1 phosphoric acid 1! l L? /f' temperature
60℃ Current density 8A/dm'Sic Diamond a degree 30y/I! Wires for wire saws and wires obtained according to the various examples above
A glass cutting test was carried out using the cutting test apparatus shown in FIG. 2 using 6).

In addition, 10 wires (5) are fixed to the wire fixing part (0), and the sample is placed on the j-ma table (7) & the glass plate 181.
The glass was cut by reciprocating it at a speed of 5 m/In1n for 1,511 hours, and the weight loss of the glass during that time was measured.The results are shown in the following table.

As shown in Figure 1, the cutting speed of the wire of the present invention is more than 5 times that of the comparative example, and when the special upper layer is made of Ni-P, the cutting speed of 1W is much lower. It is something.

〔Effect of the invention〕

The wire for wire saws of the present invention binds abrasive grains using Meida's plating method, and further retains them with alloy plating i3 containing 5 to 15% of hard and smooth skin 11531 and two-banded P. A wire with high grain retention and resistant to falling off can be obtained.

Therefore, hard materials such as semi-woven bodies and ceramics can be cut at high speed.

Furthermore, since the abrasive grains are retained, the life of the wire tool can be extended over the entire life of the wire tool.

[Brief explanation of the drawing]

FIG. 1 is a partially broken sectional view showing an embodiment of a wire for a wire saw according to the present invention, and FIG. 2 is a schematic diagram of a cutting test device. (1)... Piano wire (2)... Abrasive grain (3)... Ni-P metal, key 1 (4)... Plating layer (δ)... Wire for wire saw (6)... ...Wire fixing part (7)...Sample S! Yudai (8)...Glass plate diagram 1

Claims (2)

[Claims] (1) In wires with abrasive grains coated on the surface of metal wires such as piano wires and stainless steel wires, a metal plating layer with a thickness of 50 to 150% of the average particle diameter of the abrasive grains is provided on the surface of the metal wire. ,
A wire for a wire saw, wherein at least 10% or more of the thickness of the metal plating layer is formed of an alloy plating layer containing P, such as Ni-P or Co-P. (2) The wire for a wire saw according to claim 1, wherein the P content in the alloy plating layer is 5 to 15%.