KR101777181B1 - Electrodeposition method for manufacturing non-slip - Google Patents
Electrodeposition method for manufacturing non-slip Download PDFInfo
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- KR101777181B1 KR101777181B1 KR1020170059873A KR20170059873A KR101777181B1 KR 101777181 B1 KR101777181 B1 KR 101777181B1 KR 1020170059873 A KR1020170059873 A KR 1020170059873A KR 20170059873 A KR20170059873 A KR 20170059873A KR 101777181 B1 KR101777181 B1 KR 101777181B1
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- base plate
- nickel
- electrodeposition
- abrasive
- plate
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- 238000004070 electrodeposition Methods 0.000 title claims abstract description 34
- 238000000034 method Methods 0.000 title claims abstract description 28
- 238000004519 manufacturing process Methods 0.000 title abstract description 12
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 36
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 18
- 239000003082 abrasive agent Substances 0.000 claims abstract description 12
- 238000007747 plating Methods 0.000 claims abstract description 12
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000004327 boric acid Substances 0.000 claims abstract description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 claims abstract description 7
- 238000005520 cutting process Methods 0.000 claims abstract description 7
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 claims abstract description 7
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 claims abstract description 7
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 claims abstract description 7
- 238000002156 mixing Methods 0.000 claims abstract description 5
- 238000004140 cleaning Methods 0.000 claims abstract description 4
- 239000003792 electrolyte Substances 0.000 claims abstract description 3
- 239000000843 powder Substances 0.000 claims description 14
- 239000000203 mixture Substances 0.000 claims description 7
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims description 6
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 6
- 239000008151 electrolyte solution Substances 0.000 claims description 4
- 238000005406 washing Methods 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 2
- 238000007781 pre-processing Methods 0.000 claims description 2
- 238000007788 roughening Methods 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 3
- 238000005219 brazing Methods 0.000 description 9
- 239000002245 particle Substances 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 229910052721 tungsten Inorganic materials 0.000 description 3
- 239000010937 tungsten Substances 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical group [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- QGLKJKCYBOYXKC-UHFFFAOYSA-N nonaoxidotritungsten Chemical compound O=[W]1(=O)O[W](=O)(=O)O[W](=O)(=O)O1 QGLKJKCYBOYXKC-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 238000007750 plasma spraying Methods 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 229910001930 tungsten oxide Inorganic materials 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
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Classifications
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1409—Abrasive particles per se
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/022—Electroplating of selected surface areas using masking means
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
- C25D5/36—Pretreatment of metallic surfaces to be electroplated of iron or steel
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
- E04F11/00—Stairways, ramps, or like structures; Balustrades; Handrails
- E04F11/02—Stairways; Layouts thereof
- E04F11/104—Treads
- E04F11/16—Surfaces thereof; Protecting means for edges or corners thereof
- E04F11/17—Surfaces
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Metallurgy (AREA)
- Architecture (AREA)
- Civil Engineering (AREA)
- Structural Engineering (AREA)
- Electroplating Methods And Accessories (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
본 발명은 전착도금 방법으로 베이스 판에 연바재를 견고하게 부착하고, 전착공정을 반복하여 베이스판에 연마재를 설정 높이로 부착할 수 있는 논슬립 전착 제조방법에 관한 것이다.
본 발명에 따른 논슬립 전착 제조방법은 (1) 베이스 판에 마킹 필름을 부착하고, 마킹 필름에 일정 형상을 도안하고, 베이스 판에 일정 형상이 노출되도록, 마킹 필름에 도안된 형상을 절취하는 마킹 단계(S101)와, (2) 마킹된 베이스판을 지그에 고정하고 표면을 세척하는 전처리 단계(S102)와, (3) 전처리된 베이스 판을 전착 탱크의 전해액에 잠기도록 수평하게 배치하고, 그 위에 연마재를 뿌리고, 베이스판에 -전극을 인가하고, 니켈판에 +전극을 인가함으로써, 베이스판의 노출 표면에 전착되는 니켈에 의해 연마재가 부착되는 전착 단계(S103)와, (4) 전착 탱크에 황산니켈, 염화니켈, 붕산 및 물을 추가하여 혼합한 후, 베이스판에 -전극을 인가하고, 전착 탱크의 니켈판에 +전극을 인가함으로써, 연마재가 부착된 베이판의 노출 표면에 니켈을 추가로 도금하는 플레이딩 단계(S104)와, (5) 베이스판의 노출 표면에 부착되는 연마재의 돌출높이가 설정값에 도달할 때까지 (3) 전착단계(S103)와 (4) 플레이팅 단계(S105)를 반복하는 단계(S105)와, (6) 연마재 부착공정이 완료되면, 연마재가 부착된 베이스판을 수세하고 건조하는 단계(S106)와, (7) 베이스판에서 마킹 필름을 제거하는 단계(S107)와, (8) 베이스판을 일정 규격으로 재단하여 제품을 완성하는 단계(S108)로 구성되는 것을 특징으로 한다.The present invention relates to a non-slip electrodeposition manufacturing method capable of firmly attaching a base material to a base plate by an electrodeposition plating method and attaching an abrasive material to a base plate at a set height by repeating an electrodeposition process.
The non-slip electrodeposition manufacturing method according to the present invention comprises the steps of (1) attaching a marking film to a base plate, designing a predetermined shape on the marking film, and cutting out a shape drawn on the marking film so that a predetermined shape is exposed on the base plate A pretreatment step S102 of fixing the marked base plate to the jig and cleaning the surface, and (3) a step of arranging the pretreated base plate horizontally so as to be immersed in the electrolyte of the electrodeposition tank, (S103) in which an abrasive is deposited on the exposed surface of the base plate by sprinkling abrasives, applying an electrode to the base plate and applying a positive electrode to the nickel plate, and (4) Nickel was added to the exposed surface of the base plate to which abrasives had been applied by adding an electrode to the base plate and then applying a positive electrode to the nickel plate of the electrodeposition tank after adding and mixing nickel sulfate, nickel chloride, boric acid and water. Plated with (3) the electrodeposition step (S103) and (4) the plating step (S105) until the projecting height of the abrasive applied to the exposed surface of the base plate reaches the set value, (S106); (7) removing the marking film from the base plate (S107); (7) removing the marking film from the base plate; And (8) completing the product by cutting the base plate to a predetermined standard (S108).
Description
본 발명은 논슬립 전착 제조방법에 관한 것으로서, 보다 상세하게는 전착도금 방법으로 베이스 판에 연마재를 견고하게 부착하고, 전착공정을 반복하여 베이스판에 연마재를 설정 높이로 부착할 수 있는 논슬립 전착 제조방법에 관한 것이다.The present invention relates to a non-slip electrodeposition manufacturing method, and more particularly, to a non-slip electrodeposition manufacturing method capable of attaching an abrasive material firmly to a base plate by an electrodeposition plating method, .
대한민국 특허 제10-1733944호(2017년 4월 28일, 등록)에 "논슬립 제조방법"이 소개되어 있다.Korean Patent No. 10-1733944 (registered on Apr. 28, 2017), "Non-slip manufacturing method" is introduced.
상기 논슬립 제조방법은 융재와; 제1 브레이징 분말 및 제2 브레이징 분말로 이루어지는 용접재와; 고경도 입자와; MMA(MethylMethacrylate) 수지;로 이루어지는 복합 조성물을 마련하는 S1단계,The non-slip fabrication method comprises: finishing; A welding material comprising a first brazing powder and a second brazing powder; High hardness particles; MMA (Methyl Methacrylate) resin;
상기 복합 조성물을 강판 상에 1차로 도포하여 가접합하는 S2단계, Step S2 in which the composite composition is first applied on a steel sheet and then joined together,
상기 가접합된 복합 조성물 상에 제1 브레이징 분말 및 제2 브레이징 분말로 이루어지는 용접재를 2차로 도포하는 S3단계, A step S3 of applying a second welding material composed of the first brazing powder and the second brazing powder onto the composite composition bonded together,
상기 S3단계를 거친 강판을 가열로에 넣고 브레이징하여 논슬립 패드를 마련하는 S4단계, Step S4 of inserting a non-slip pad by brazing the steel sheet obtained in step S3 into a heating furnace,
상기 S4단계를 거친 논슬립 패드 상에 주석 산화물과, 텅스텐 산화물을 증착하여 금속 산화물층을 형성하는 S4-1단계, Step S4-1 of forming a metal oxide layer by depositing tin oxide and tungsten oxide on the non-slip pad after step S4,
상기 논슬립 패드를 프레임에 부착하는 S5단계와, Attaching the non-slip pad to the frame,
상기 프레임 상에 형성된 축광홈에 축광안료와 수지가 혼합된 축광 조성물을 충진하는 S6단계를 포함하되, 상기 제1 브레이징 분말은 상기 제2 브레이징 분말보다 낮은 융점을 가지고, 상기 제2 브레이징 분말은 아연을 포함하며, 상기 S4-1단계의 금속 산화물층은 상기 제1 브레이징 분말의 융점 미만의 온도에서 증착이 이루어지는 스퍼터링(Sputtering) 방식으로 형성된다.And filling the luminous groove formed in the frame with a luminous composition comprising a phosphorescent pigment and a resin, wherein the first brazing powder has a melting point lower than that of the second brazing powder and the second brazing powder is zinc And the metal oxide layer in step S4-1 is formed by a sputtering method in which deposition is performed at a temperature lower than the melting point of the first brazing powder.
그러나, 상기 논슬립 제조방법은 프레임에서 논슬립 패드가 분리될 수 있고, 고경도 입자가 파묻히게 되어, 마찰 계수가 낮은 단점이 있다.However, in the non-slip manufacturing method, the non-slip pads can be separated from the frame, and the high hardness particles are buried, resulting in a low friction coefficient.
대한민국 실용신안등록 제20-0143171호(1999년 1월 20일, 등록)은 "계단턱에 설치되는 미끄럼 방지부재"가 소개되어 있다.Korean Utility Model Registration No. 20-0143171 (registered on January 20, 1999) discloses a "non-slip member provided on a stepped jaw ".
상기 계단턱에 설치되는 미끄럼 방지부재는 미끄럼 방지부재의 하측에는 직각을 갖는 알루미늄판을 길이 방향으로 형성하고 이 알루미늄판 내측면의 수평면과 수직면에는 공지의 양면 테이프가 접착되어 상기 단턱에 부착하고, 상기 알루미늄판의 외측면의 양측에는 만곡부를 형성하고 중앙에는 양측단에 탄원형홈을 형성하며, 중앙에는 완충공을 갖도록 복수의 레일이 돌출된 결합홈을 형성하며, 이 결합홈에는 상측면에 텅스텐의 입자가 점착되고, 양측단에는 타원형의 돌기부가 돌출된 미끄럼 방지판을 삽입하여 구성된다.The non-slip member provided on the step jaw includes a non-slip member having an underside of which an aluminum plate having a right angle is formed in the longitudinal direction and a known double-faced tape is adhered to the horizontal surface and the vertical surface of the inner surface of the aluminum plate, The aluminum plate has curved portions formed on both sides of its outer side, circular grooves formed at both ends of the center of the aluminum plate, a plurality of rails protruding to have buffer holes at the center thereof, The tungsten particles are adhered to each other, and both sides of the slip prevention plate are inserted with protruding oval protrusions.
그러나, 상기 계단턱에 설치되는 미끄럼 방지부재는 소위 프라즈마 용사방법으로 일컬어지는 입자접합방식으로 추후 텅스텐 입자가 잘 떨어져 나가는 단점이 있다.However, the non-slip member provided on the step jaw is disadvantageous in that the tungsten particles are easily separated from the tungsten particles due to the particle joining method called the so-called plasma spraying method.
따라서, 본 발명의 목적은 전착도금 방법으로 니켈에 의해 베이스판에 연마재가 견고하게 부착되고, 전착공정을 반복하여 베이스판에 연마재를 설정 높이로 부착할 수 있어, 연마재가 쉽게 탈락되지 않고, 논슬립의 내구성 및 내식성을 향상시킬 수 있는 논슬립 전착 제조방법을 제공하는 것이다.SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide an electrodeposition plating method in which an abrasive is firmly attached to a base plate by nickel, and an abrasive is attached to a base plate at a set height by repeating an electrodeposition process, Which is capable of improving the durability and corrosion resistance of the non-slip electrodeposition method.
상기와 같은 목적을 달성하기 위한 본 발명에 따른 논슬립 전착 제조방법은 (1) 베이스 판에 마킹 필름을 부착하고, 마킹 필름에 일정 형상을 도안하고, 베이스 판에 일정 형상이 노출되도록, 마킹 필름에 도안된 형상을 절취하는 마킹 단계(S101)와,In order to accomplish the above object, there is provided a method of producing non-slip electrodeposition according to the present invention, comprising the steps of: (1) attaching a marking film to a base plate; designing a predetermined shape on the marking film; A marking step (SlOl) of cutting out the drawn shape,
(2) 마킹된 베이스판을 지그에 고정하고 표면을 세척하는 전처리 단계(S102)와,(2) a preprocessing step (S102) of fixing the marked base plate to the jig and cleaning the surface,
(3) 전처리된 베이스 판을 전착 탱크의 전해액에 잠기도록 수평하게 배치하고, 그 위에 연마재를 뿌리고, 베이스판에 -전극을 인가하고, 니켈판에 +전극을 인가함으로써, 베이스판의 노출 표면에 전착되는 니켈에 의해 연마재가 부착되는 전착 단계(S103)와,(3) The pretreated base plate is placed horizontally so as to be immersed in the electrolyte of the electrodeposition tank, the abrasive is sprayed thereon, the - electrode is applied to the base plate, and the + electrode is applied to the nickel plate, An electrodepositing step (S103) in which an abrasive is deposited by electrodeposited nickel,
(4) 전착 탱크에 황산니켈, 염화니켈, 붕산 및 물을 추가하여 혼합한 후, 베이스판에 -전극을 인가하고, 전착 탱크의 니켈판에 +전극을 인가함으로써, 연마재가 부착된 베이판의 노출 표면에 니켈을 추가로 도금하는 플레이딩 단계(S104)와,(4) After adding nickel sulfate, nickel chloride, boric acid and water to the electrodeposition tank and mixing them, applying an electrode to the base plate, and applying a positive electrode to the nickel plate of the electrodeposition tank, A plating step (S104) of additionally plating nickel on the exposed surface,
(5) 베이스판의 노출 표면에 부착되는 연마재의 돌출높이가 설정값에 도달할 때까지 (3) 전착단계(S103)와 (4) 플레이팅 단계(S105)를 반복하는 단계(S105)와,(S105) repeating the electrodeposition step (S103) and (4) the plating step (S105) until (5) the projecting height of the abrasive adhered to the exposed surface of the base plate reaches the set value,
(6) 연마재 부착공정이 완료되면, 연마재가 부착된 베이스판을 수세하고 건조하는 단계(S106)와,(6) When the abrasive material attaching process is completed, washing and drying the base plate having the abrasive material attached thereto (S106)
(7) 베이스판에서 마킹 필름을 제거하는 단계(S107)와,(7) removing the marking film from the base plate (S107)
(8) 베이스판을 일정 규격으로 재단하여 제품을 완성하는 단계(S108)로 구성되는 것을 특징으로 한다.(8) completing the product by cutting the base plate to a predetermined standard (S108).
상기 베이스 판은 스테인레스 스틸, 동판, 전착용 PVC판 중 어느 하나인 것을 특징으로 한다.The base plate is characterized by being one of stainless steel, a copper plate, and a PVC plate for wearing.
(2) 전처리 단계(S102)는 알칼리성 탈지 - 수세- 산세척 - 수세 - 베이스판의 노출 표면을 거칠게 표면처리 - 수세 공정으로 진행되는 것을 특징으로 한다.(2) The pretreatment step (S102) is characterized in that the exposed surface of the alkaline degreasing-washing-acid cleaning-washing-washing base plate is roughened to the surface treatment-washing process.
상기 전해액은 황산니켈, 염화니켈 및 붕산과 물을 혼합한 것을 특징으로 한다.The electrolytic solution is characterized in that nickel sulfate, nickel chloride and boric acid are mixed with water.
상기 연마재는 세라믹 분말, 메탈 지르코니아 분말, 텅스텐 분말 중 어느 하나이거나 이것들을 2 이상 혼합한 혼합물인 것을 특징으로 한다.The abrasive may be a ceramic powder, a metal zirconia powder, or a tungsten powder, or a mixture of two or more thereof.
이것에 의해, 본 발명에 따른 논슬립 전착 제조방법은 니켈에 의해 베이스판에 연마재가 견고하게 부착되고, 전착공정을 반복하여 베이스판에 연마재를 설정 높이로 부착할 수 있으며, 연마재가 쉽게 탈락되지 않고, 논슬립의 내구성 및 내식성을 향상시킬 수 있는 효과가 있다.Thus, in the non-slip electrodeposition manufacturing method according to the present invention, the abrasive is firmly attached to the base plate by nickel, and the abrasive can be attached to the base plate at a set height by repeating the electrodeposition process, , The durability and the corrosion resistance of the non-slip can be improved.
도 1은 본 발명에 따른 노슬립 전착 제조방법을 도시한 순서도
도 2는 베이스 판에 연마재가 니켈에 의해 부착된 상태를 개략적으로 도시한 사시도
도 3은 베이스 판을 재단하여 제품을 완성한 예를 도시한 개략도 1 is a flow chart illustrating a method of manufacturing a furnace slip electrodeposition according to the present invention
2 is a perspective view schematically showing a state where an abrasive is attached to a base plate by nickel;
3 is a schematic view showing an example in which a product is completed by cutting a base plate
이하, 본 발명의 바람직한 실시예를 도면을 참조하여 상세하게 설명하기로 한다.Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings.
도 1을 참조하면, 본 발명에 따른 노슬립 전착 제조방법은 다음과 같은 공정으로 이루어진다.Referring to FIG. 1, the method for manufacturing a no slip electrodeposition according to the present invention comprises the following steps.
(1) 베이스 판에 마킹 필름을 부착하고, 마킹 필름에 일정 형상을 도안하고, 베이스 판에 일정 형상이 노출되도록, 마킹 필름에 도안된 형상을 절취한다(S101). - 이러한 공정을 소위 마킹 공정이라고 한다.(1) A marking film is attached to the base plate, a predetermined shape is drawn on the marking film, and a shape drawn on the marking film is cut so that a predetermined shape is exposed on the base plate (S101). - This process is called the marking process.
상기 베이스 판은 일반적으로 스테인레스 스틸이 주로 사용되지만, 여기에 한정되지 않고, 동판, 전착용 PVC판에도 적용될 수 있다. The base plate is generally made of stainless steel, but the present invention is not limited thereto, and can be applied to a copper plate and a full-wear PVC plate.
(2) 마킹된 베이스판을 지그에 고정하고 표면을 세척한다(S102). - 이러한 공정을 소위 전처리 공정이라 한다.(2) The marked base plate is fixed to the jig and the surface is cleaned (S102). - This process is called pretreatment process.
(3) 도 2에 도시된 것처럼, 전처리된 베이스 판(100)을 전착 탱크의 전해액에 잠기도록 수평하게 배치하고, 그 위에 연마재를 뿌리고, 베이스판에 -전극을 인가하고, 니켈판에 +전극을 인가함으로써, 베이스판의 노출 표면에 전착되는 니켈에 의해 연마재(110)가 부착된다(S103). - 이러한 공정을 소위 연마재 전착공정이라고 한다. 이때, 연마재는 도금된 니켈에 의해 분리될 우려가 배제된다.(3) As shown in Fig. 2, the pretreated
상기 전해액은 전착 탱크에 황산니켈, 염화니켈 및 붕산을 넣고 물과 혼합한 것이다. The electrolytic solution is prepared by adding nickel sulfate, nickel chloride, and boric acid to an electrodeposition tank and mixing with water.
여기서, 붕산은 PH 변화를 안정하게 해주는 완충제 역할을 한다.Here, boric acid acts as a buffer to stabilize the PH change.
상기 연마재는 세라믹 분말, 메탈 지르코니아 분말, 텅스텐 분말 중 어느 하나이거나 이것들을 2 이상 혼합한 혼합물일 수 있다.The abrasive may be a ceramic powder, a metal zirconia powder, or a tungsten powder, or a mixture of two or more thereof.
(4) 전착 탱크에 황산니켈, 염화니켈, 붕산 및 물을 추가하여 혼합한 후, 베이스판에 -전극을 인가하고, 전착 탱크의 니켈판에 +전극을 인가함으로써, 연마재가 부착된 베이판의 노출 표면에 니켈을 추가로 도금한다(S104). - 이러한 공정을 소위 플레이팅(plating) 공정이라고 한다.(4) After adding nickel sulfate, nickel chloride, boric acid and water to the electrodeposition tank and mixing them, applying an electrode to the base plate, and applying a positive electrode to the nickel plate of the electrodeposition tank, Nickel is further plated on the exposed surface (S104). - This process is called a so-called plating process.
(5) 베이스판의 노출 표면에 부착되는 연마재의 돌출높이가 설정값에 도달할 때까지 (3) 전착단계(S103)와 (4) 플레이팅 단계(S105)를 반복한다(S105).(5) Repeat the electrodeposition step (S103) and (4) the plating step (S105) until the projected height of the abrasive adhered to the exposed surface of the base plate reaches the set value (S105).
여기서, 돌출높이 설정값은 일반적으로 0.1㎜ ~0.5㎜ 이다.Here, the setting value of the protrusion height is generally 0.1 mm to 0.5 mm.
(6) 연마재 부착공정이 완료되면, 연마재가 부착된 베이스판을 수세하고 건조한다(S106).(6) When the abrasive material attaching step is completed, the base plate with the abrasive material is washed with water and dried (S106).
(7) 이후, 베이스판에서 마킹 필름을 제거한다(S107).(7) Then, the marking film is removed from the base plate (S107).
(8) 이후, 도 3에 도시된 것처럼, 베이스판을 일정 규격으로 재단하여 제품(200)을 완성한다(S108).(8) After that, as shown in Fig. 3, the base plate is cut to a certain standard to complete the product 200 (S108).
(2) 마킹된 베이스판을 지그에 고정하고 표면을 세척하는 전처리 단계에서는 알칼리성 탈지 - 수세- 산세척 - 수세 - 베이스판의 노출 표면을 거칠게 표면처리 - 수세 공정으로 진행된다. (2) In the pretreatment step of fixing the marked base plate to the jig and cleaning the surface, the exposed surface of the alkaline degreasing-rinsing-pickling-rinsing-base plate proceeds roughly to the surface treatment-rinsing process.
상기와 같은 본 발명에 따른 논슬립 전착 제조방법에 의해 제조된 논슬립은 충분한 미끄럼 저항값을 가지며, 연마재가 쉽게 탈락되지 않고, 내구성 및 내식성이 높은 장점이 있다.The non-slip fabric produced by the non-slip electrodeposition manufacturing method according to the present invention has a sufficient slip resistance value, the abrasive material is not easily detached, and the durability and corrosion resistance are high.
Claims (5)
(2) 마킹된 베이스판을 지그에 고정하고 표면을 세척하는 전처리 단계(S102)와,
(3) 전처리된 베이스 판을 전착 탱크의 전해액에 잠기도록 수평하게 배치하고, 그 위에 연마재를 뿌리고, 베이스판에 -전극을 인가하고, 니켈판에 +전극을 인가함으로써, 베이스판의 노출 표면에 전착되는 니켈에 의해 연마재가 부착되는 전착 단계(S103)와,
(4) 전착 탱크에 황산니켈, 염화니켈, 붕산 및 물을 추가하여 혼합한 후, 베이스판에 -전극을 인가하고, 전착 탱크의 니켈판에 +전극을 인가함으로써, 연마재가 부착된 베이판의 노출 표면에 니켈을 추가로 도금하는 플레이딩 단계(S104)와,
(5) 베이스판의 노출 표면에 부착되는 연마재의 돌출높이가 설정값에 도달할 때까지 (3) 전착단계(S103)와 (4) 플레이팅 단계(S105)를 반복하는 단계(S105)와,
(6) 연마재 부착공정이 완료되면, 연마재가 부착된 베이스판을 수세하고 건조하는 단계(S106)와,
(7) 베이스판에서 마킹 필름을 제거하는 단계(S107)와,
(8) 베이스판을 일정 규격으로 재단하여 제품을 완성하는 단계(S108)로 구성되는 것을 특징으로 하는 논슬립 전착 제조방법.
(1) a marking step (S101) of attaching a marking film to a base plate, designating a predetermined shape on the marking film, and cutting out a shape drawn on the marking film so that a predetermined shape is exposed on the base plate;
(2) a preprocessing step (S102) of fixing the marked base plate to the jig and cleaning the surface,
(3) The pretreated base plate is placed horizontally so as to be immersed in the electrolyte of the electrodeposition tank, the abrasive is sprayed thereon, the - electrode is applied to the base plate, and the + electrode is applied to the nickel plate, An electrodepositing step (S103) in which an abrasive is deposited by electrodeposited nickel,
(4) After adding nickel sulfate, nickel chloride, boric acid and water to the electrodeposition tank and mixing them, applying an electrode to the base plate, and applying a positive electrode to the nickel plate of the electrodeposition tank, A plating step (S104) of additionally plating nickel on the exposed surface,
(S105) repeating the electrodeposition step (S103) and (4) the plating step (S105) until (5) the projecting height of the abrasive adhered to the exposed surface of the base plate reaches the set value,
(6) When the abrasive material attaching process is completed, washing and drying the base plate having the abrasive material attached thereto (S106)
(7) removing the marking film from the base plate (S107)
(8) a step of cutting the base plate to a predetermined standard to complete the product (S108).
상기 베이스 판은 스테인레스 스틸, 동판, 전착용 PVC판 중 어느 하나인 것을 특징으로 하는 논슬립 전착 제조방법.
The method according to claim 1,
Wherein the base plate is one of a stainless steel, a copper plate, and a PVC plate.
(2) 전처리 단계(S102)는 알칼리성 탈지 - 수세- 산세척 - 수세 - 베이스판의 노출 표면을 거칠게 표면처리 - 수세 공정으로 진행되는 것을 특징으로 하는 논슬립 전착 제조방법.
The method according to claim 1,
(2) The pretreatment step (S102) is carried out by roughening the exposed surface of the alkaline degreasing-rinsing-pickling-rinsing-rinsing-base plate to a surface treatment-rinsing step.
상기 전해액은 황산니켈, 염화니켈 및 붕산과 물을 혼합한 것을 특징으로 하는 논슬립 전착 제조방법.
The method according to claim 1,
Wherein the electrolytic solution is a mixture of nickel sulfate, nickel chloride, and boric acid with water.
상기 연마재는 세라믹 분말, 메탈 지르코니아 분말, 텅스텐 분말 중 어느 하나이거나 이것들을 2 이상 혼합한 혼합물인 것을 특징으로 하는 논슬립 전착 제조방법.
The method according to claim 1,
Wherein the abrasive is a ceramic powder, a metal zirconia powder, or a tungsten powder, or a mixture of two or more thereof.
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001107260A (en) | 1999-10-06 | 2001-04-17 | World Metal:Kk | Electrodepositing tool |
| JP2003155575A (en) | 2001-11-16 | 2003-05-30 | Ngk Insulators Ltd | Composite material and method of producing the same |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001107260A (en) | 1999-10-06 | 2001-04-17 | World Metal:Kk | Electrodepositing tool |
| JP2003155575A (en) | 2001-11-16 | 2003-05-30 | Ngk Insulators Ltd | Composite material and method of producing the same |
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