KR900002094B1 - Method for preparing nickel printing plate - Google Patents

Abstract

A method for prepg. nickel printing plate comprises (a) making an exact copy of photosensitive synthetic resin printing plate with a copper plate (cp), (b) recopying with a nickel plate (NP) from the CP, (c) filling concave part of the NP with a metal, (d) sepg. the NP from the CP, and (e) grinding to flat the NP. The NP has 0.7mm thickness, and shows below 0.32mm relief.

Description

Manufacturing method of nickel plate printing plate for dry flat printing

1 is a cross-sectional view of a state in which copper is transferred after a silver film layer is formed on a printed disc made of a photosensitive synthetic resin plate.

FIG. 2 is a cross-sectional view of a state in which a nickel layer is formed on a coin plate produced by the process shown in FIG. 1 and nickel is transferred to form a nickel plate.

3 is a cross-sectional view of a state in which copper is entirely filled in the back recess of the nickel plate plate after the process shown in FIG.

4 is a cross-sectional view of a state in which the whole filling layer transferred to the back of the nickel plate is ground and smoothed.

* Explanation of symbols for main parts of the drawings

1: photosensitive synthetic resin plate 1 ', 7': wire part

2: silver film layer 3: iron plate support

4: support plate 5: full board

6: silver film coating 7: nickel plate

8: full charge layer 8 ': charging part

The present invention relates to a method that can be produced using the Nickel electrodeposition process for iron plate printing plate that does not require timely water.

Conventionally, in order to improve the sharpness and increase the uniformity of thin lines in printing banknotes, printing plates are generally used as photosensitive synthetic resin plates. However, such printing plates are generally expensive, and the thickness of printed lines is about 1 million sheets. The present invention is to provide a method capable of providing a nickel-iron plate printing plate that can be substituted for such a photosensitive resin printing plate.

Conventional dry flat plate printing plate materials include brass plates, zinc plates, photosensitive synthetic resin plates, all of which are manufactured and used by the corrosion method. However, when nickel metal is used, it is almost impossible to use the nickel method. It has been applied only to plates.

This is also because when Nickel metal is used as an offset plate, it is difficult to form deeper relief depth in the limited plate thickness of the printing plate, and thus it is difficult to make close contact, bending, and fitting on the printing.

That is, the iron plate printing plate should have a very deep relief depth, but when forming the iron plate printing plate with a nickel plate, it is extremely difficult to set the relief depth to 0.2 mm or more. The iron plate printing plate should be rolled on the round plate of the printing machine and bent to be closely adhered to it. Therefore, the printing plate should have a thickness that is easy to bend closely. In the case of the Nickel printing plate, the proper head thickness is 0.7mm including the depth of the wire part. . However, in the case of Nickel printing plates of such a thickness, when the relief depth was set to 0.2 mm or more and curved to hang on the printing plate of the printing machine, the boundary between the line part and the non-line part was broken. Therefore, it was impossible to manufacture a Nickel printing plate having a deep relief depth. Therefore, the present invention uses a nickel plate with high strength and durability as a sheet material, while enhancing the depth and relief of the wire part while deepening the relief depth of the wire part so that ink does not get on the non-fire line and thus deepening the depth of the wire part. In order to provide a method for manufacturing a nickel plate printing plate that does not bend the printing plate when bending to close the plate to be described in detail by the accompanying drawings as follows.

The surface of the photosensitive synthetic resin plate (1) known to depict the line to be printed is subjected to a surface treatment for transfer. In other words, in order to degrease with a degreasing solution and a neutral detergent and to form a hydrophilic surface, a solution of sulfuric acid, phosphoric acid and dichromic acid chromate is evenly coated on the surface and left for 1 minute, followed by washing with water. After the activation process, a susceptibility treatment is performed to adsorb a strong reducing power metal salt mixed with first tin chloride and hydrochloric acid to the surface, followed by washing with water to form a silver film layer 2 for imparting conductivity to the surface.

Water rinsing is carried out in the middle while simultaneously spraying the silver nitrate solution and the hydrazine sulfate solution as a reducing agent until silver is completely reduced and precipitated on the production surface. After the silver film is finished, it is washed with water and dried naturally.

After the surface treatment for the whole embryo is completed, the albumin and boric acid are pulverized, mixed and dissolved in distilled water immediately before being put into the coin shell bath to separate the disc from the coin. Wet the water with a uniform coating on the surface and immediately add it to the copper plating bath to replicate the coin plate. Originally, the photosensitive synthetic resin plate (1) attached to the iron plate support (3) on the back side to maintain the form of the plate, when it is put into the copper plating bath as it is, the iron plate support (3) is dissolved in the solution of the bath. Therefore, in order to prevent this, it is preferable to attach the solution penetration preventing support plate 4 on the back surface so that the solution does not touch the iron plate support 3.

When the original Taetae disc is placed in the Taetae bath, the transfer is performed. If the depth of the caustic part (1 ') of the Taetae disc becomes 0.25mm or more, the hydrogen gas generated during electrodeposition will hover between the deep depths and disturb the activities of the copper ions. It was found that the homogeneous state was difficult. Therefore, the present invention was to be carried out in a high speed pre-taking tank in which the solution is active from the beginning for uniform adhesion of copper ions, and the current density was also adjusted step by step over time.

In addition, the thickness of copper plating should be kept at least 5mm to prevent the warpage deformation caused by the bending of the plate and the stress of Nickel metal when the electrode is separated from the electrode.

After completion of the previous transfer plate (5), it is separated from the original plate and subjected to surface treatment. Then, silver nitrate is subjected to a silver film coating (6) for silver coating prepared by dissolving sodium cyanide and sodium sulfite anhydrous in distilled water, followed by separating solution treatment Nickel taekwondo plate (7) is duplicated by putting into keltaetazo.

The thickness of the nickel plate plate 7 is about 0.7 mm including the depth of the wire 7 '. After the Nickel Plate (7) is completed, the Nickel Plate solution attached to the plate is completely washed away from the Coin Plate plate, and immediately moistened to prevent the formation of oxide film on the back side. Coin operation is performed to transfer copper to the back surface of the nickel plate 2 as shown in FIG. 3 to form the filling layer 8.

The transfer filling layer 8 transferred to the back of the nickel transfer plate 7 is preferably formed of copper in consideration of ease of bending and destable stability, but may be made of other metals. In this way, when the back side coin formation work forming the front side filling layer 8 on the back side of the nickle plate 7 is completed, the back plate grinding process is used to separate the coin plate and the nick plate and finish the printing plate. Do it. That is, as shown in FIG. 4, the whole charge filling layer 8 is ground to smooth the back surface of the nick plate. Then, the charging part 8 'is formed in the recessed part of the back surface of the wire part 7'. Nickel state printing plate according to the present invention can form a depth of the line portion up to 0.32mm, so that ink does not adhere to the non-firing portion, it is extremely easy to print and look at the back side of the printing plate according to the shape of the line portion 7 ' 8 '), it is very easy to apply a thin cellophane paper (called "staining") on the very back part of the print result, that is, the area with less ink.

Claims (4)

After replicating the printing plate made of photosensitive synthetic resin with copper plate, transfer the copper plate again with Nickel, and transfer the back plate of Nickel plate with metal in the transferred state. A method for manufacturing a nickel plate printing plate for dry flat printing, characterized in that. The method of manufacturing a nickel plate printing plate for dry flat printing according to claim 1, wherein the printing plate made of the photosensitive synthetic resin is formed by adhering an iron plate to a back side thereof and adhering a solution penetration preventing support plate to the back side. The method of manufacturing a nickel plate printing plate for dry flat printing according to claim 1, wherein the plate thickness of the nickel plate is 0.7 mm and the relief depth of the double wire part is 0.32 mm or less. The method for producing a nickel plate printing plate for dry flat printing according to claim 1, wherein the metal to be filled in the back recess of the nickel plate is copper.

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