TWI742726B - Test board and test chamber - Google Patents

Abstract

The present invention relates to a technique for adjusting the temperature of electronic components contained in a test chamber used for testing electronic components. According to the present invention, a supply duct for supplying temperature adjustment air to the storage space of the test chamber is formed by the guide portion, the discharge portion, and the connection portion, and the movement direction of the temperature adjustment air is changed at the connection portion, so that the storage space can be adjusted. Air is evenly supplied to each position of the accommodating space, and spray ducts for spraying air for temperature adjustment are provided in a state facing the test board one-to-one in the containing space, so as to achieve tight temperature control of electronic components, thereby improving the test reliability.

Description

Test board and test chamber

The present invention relates to a test board capable of loading electronic components and electrically connected to a testing machine, and a test chamber capable of adjusting the temperature of the electronic components connected to the test electromechanically after the test board is accommodated.

The electronic components produced are divided into good products and defective products after being tested by the testing machine, and then only good products are shipped.

Since electronic components can be used in a variety of environments, it is necessary to maintain a state of establishing a harsh, high-temperature temperature environment when testing electronic components. Therefore, a method is adopted in which the electronic components are housed in a storage space in a sealable test chamber, and the storage space is maintained in a harsh temperature environment, thereby applying thermal stress to the electronic components. Of course, the electronic component is connected to the testing machine in the state where it is located in the accommodating space. Of course, since the harsh temperature environment is not necessarily a high temperature environment, it may also be a low temperature environment, and the daily temperature environment may be normal temperature, so all equipment that can be tested for each situation is required.

In addition, the electrical connection distance between the testing machine and the electronic components should be as short as possible. The reason is that if the electrical connection distance between the testing machine and the electronic components is long, electrical signal distortion or noise may occur accordingly. Not only that, but data may also be lost, so it is difficult to ensure the reliability of the test.

Of course, even if the electrical connection distance between the testing machine and the electronic components is long, there will be tests that will not cause special problems, but there are also problems that may occur if the electrical connection distance between the testing machine and the electronic components is long. And it requires high-speed testing.

For example, in the case of a Burn In test with a long test time, even if the electrical connection distance between the tester and the electronic components is long, no special problems have occurred so far. Here, the burn-in test refers to a test performed in a state where a high temperature (85 degrees to 125 degrees) stress is applied to the electronic components in order to discover potential defects of the electronic components. The reason is that no high-speed test has been performed in the burn-in test step, and no need to perform it has occurred.

The burn-in test not only applies high temperatures, but also applies electrical stresses such as voltages and currents higher than the actual use conditions of electronic components and is performed for a long time. For such a burn-in test, a tester, burn-in board and burn-in chamber are required.

The burn-in board is a kind of test board that can be loaded with a plurality of electronic components and electrically connected to the testing machine, and has a mounting socket, a circuit, and a connector for electrically connecting the electronic components to the testing machine.

The burn-in chamber, as a kind of test chamber, has a storage space for accommodating a test board loaded with electronic components, and can establish a temperature environment for applying thermal stress to the electronic components contained in the storage space.

FIG. 1 illustrates a structure in which the burn-in board BIB contained in the burn-in chamber is electrically connected to the tester TESTER.

As shown with reference to Figure 1, in order to electrically connect the electronic component D to the tester TESTER, it is necessary to be equipped with the terminal for the socket S (refer to Figure 2), the circuit EC, the connector C, and the connecting component CE (existing in the cavity through the burning machine). The connecting part of the path of the wall of the chamber). That is, the distance for connecting the electronic component D to the connection circuit of the tester TESTER is long, and a plurality of connection elements are sandwiched therebetween. Therefore, it is impossible to perform a test that may cause a problem if the electrical connection distance between the tester TESTER and the electronic component D is long or a test that requires a quick and immediate response by the existing burn-in tester.

For example, for electronic components such as memory semiconductor elements, different from the past, a test project for electronic components has been added, which not only requires a simple ON/OFF operation level test, but also It is also necessary to test how fast data can be read or stored (for example, large-capacity data such as videos), how fast it can be displayed on the screen, and whether it can operate normally. Moreover, these tests need to be carried out in a very short time. For this reason, the connection distance between the electronic component and the test machine must be short. Therefore, in addition to the burn-in test system, other additional test systems are required, which leads to waste of resources, time and manpower.

Moreover, with the development of electronic components, it cannot be ruled out that the circuit EC of the burn-in board has the possibility of various electronic components required for testing. In this case, various electronic components are exposed to the harshness established in the storage space of the test chamber. Temperature environment, which may cause damage or shorten the life.

In addition, a test that requires a shorter time or a test due to an upgrade of an electronic component or an additional test project may require more precise control of the temperature of the electronic component. Since the temperature of the tested electronic component is related to the reliability of the test, the temperature conditions of each electronic component required in various tests need to be accurately managed so as not to exceed the allowable error range. [Prior Art Literature]

[Patent Literature] Korean authorized patent 10-1164116 Korean Published Patent 10-2003-0029266 Korean Published Patent 10-2005-0055685

The present invention has the objects as described below.

First, provide a technology that can prevent the circuit of the test board from being stimulated by the surrounding heat.

Second, to provide a technology related to a test chamber in which electronic components can be subjected to an auxiliary test different from the main test performed by the test machine while being accommodated in the test chamber.

Third, it provides a technology capable of appropriately transmitting a response signal from the electronic component to the testing machine even if noise or the like may occur on the connection circuit that electrically connects the test machine and the electronic component.

Fourth, to provide a technology that can realize instant temperature control of electronic components in consideration of the fact that the test can be performed quickly in a short time.

Fifth, it is to provide a technology that can test all the electronic components under the same temperature adjustment as possible even if the electronic components contained in the test chamber are located in a separate space.

The test board according to the first aspect of the present invention includes: a board main body, loaded with electronic components, and has a circuit for relaying electrical signals between the electronic components and the test machine; and a connector coupled to one side of the board main body to connect to The circuit is electrically connected, and is connected with the test machine, thereby electrically connecting the circuit to the test machine; and a mask material, in order to block the electronic components located in the circuit from external heat, and load the electronic The opposite side of the surface of the component forms a heat-insulating space, in which electronic components located in the circuit are exposed to the side of the heat-insulating space.

The circuit includes at least any one of the following configurations: an auxiliary test machine, which is electrically connected to the electronic components loaded on the board body, and then performs auxiliary tests for the electronic components that are different from the main test performed by the test machine Or an amplifier, which is electrically connected to the electronic component mounted on the board body, and then amplifies the response signal from the electronic component to the testing machine and sends it to the testing machine, where the response signal is applied to the testing machine Feedback of test signals to electronic components.

The mask material has: a supply hole for supplying temperature adjustment fluid to the heat-insulating space; and a recovery hole for recovering from the heat-insulating space for temperature adjustment of electronic components located in the circuit Fluid used for temperature adjustment.

The mask material may include a transfer plate for transferring cold air to the electronic component.

The transfer plate is a metal material with good thermal conductivity. In the mask material, the periphery of the transfer plate is made of an insulator, so that the cold air existing on the transfer plate is concentrated and conducted toward the electronic components located in the circuit. .

The test board according to the second aspect of the present invention includes: a board main body that carries electronic components and has a circuit for relaying electrical signals between the electronic components and the tester; and a connector coupled to one side of the board main body. It is electrically connected to the circuit and is also electrically connected to the testing machine, thereby electrically connecting the circuit to the testing machine, wherein the circuit includes at least any one of the following configurations: an auxiliary testing machine, and The electronic components of the board main body are electrically connected, and an auxiliary test different from the main test performed by the testing machine is performed for the electronic components; or an amplifier is electrically connected to the electronic components loaded on the board main body to enlarge The response signal from the electronic component to the testing machine is sent to the testing machine, and the response signal is a feedback to the test signal applied from the testing machine to the electronic component.

The test chamber according to the first aspect of the present invention includes: a chamber main body having a storage space that is open on one side and used to contain a test board loaded with electronic components; The temperature of the electronic component loaded on the test board of the main body, wherein the chamber main body has: a support rail for supporting the test board accommodated in the storage space, and the support rail is equipped to be divided into: In the first area, if the test board is accommodated in the accommodation space, the temperature of the accommodation space is adjusted by the temperature adjustment device; the second area is separated from the first area and the electronics loaded on the test board The component is exposed to the first area side, and the second area is blocked by the test board from air exchange with the first area.

The chamber body further includes: an injection pipe for injecting a temperature adjustment fluid for adjusting the temperature of the second area to the second area; and a suction pipe for sucking and passing through the second area The temperature adjustment fluid supplied by the injection pipe.

The test board is the test board mentioned above, and the chamber main body further includes: a supply pipe for supplying a temperature adjustment fluid of a predetermined temperature to the heat-insulating space on the test board; and a recovery pipe for recovering through The supply pipe supplies the fluid for temperature adjustment of the heat-insulating space.

The temperature of the first area, the heat-insulating space, and the second area can be controlled differently from each other. Or, when the high temperature test is performed, the temperature of the first zone can be controlled to be the highest, and the temperature of the thermal insulation space is lower than the temperature of the second zone. When the low temperature test is performed, the temperature of the first zone can be controlled The temperature is the lowest, and the temperature of the thermal insulation space is higher than or equal to the temperature of the second zone.

It also includes: an opening and closing door, which opens or closes the storage space by opening and closing one side of the chamber body, wherein the first area and the second area are opened to the side of the opening and closing door, and the opening and closing When the door is opened and closed, the first area and the second area are also opened or closed to the side of the opening and closing door.

The chamber body further includes: a buffer plate, which divides the second area into two parts, and further forms a heat insulation space toward the test plate side, and forms a buffer space toward the opposite side of the test plate.

The chamber main body further includes at least any one of the following structures: an auxiliary test machine, which is electrically connected to the test board housed in the storage space, and further performs the main tasks performed by the test machine for electronic components. Test different auxiliary tests; or an amplifier, which is electrically connected to the test board housed in the containing space, and then amplifies the response signal from the electronic component to the test machine and sends it to the test machine, where the response signal is In response to the feedback of the test signal applied from the tester to the electronic component, the auxiliary tester or the amplifier is exposed to the second area side.

The chamber body further includes: a transfer device for transferring the cold air of the temperature adjustment fluid to the electronic component located on the test board, and the transfer device is located in the second area.

The transfer device includes: a cooling plate for transferring cold air to the electronic components located on the test board; The contact between the cooling plate and the test board, so that the test board is in a state that can be removed from the receiving space.

The cooling plate is provided in plural, so that the plural cooling plates correspond to one test plate.

According to the present invention, there are effects as described below.

First, it can protect the circuit of the test board or other electronic components required for testing from the surrounding thermal stimuli, thereby preventing its damage and prolonging its life.

Second, the auxiliary test can be executed together with the main test, thereby saving resources and shortening the overall test time, thereby increasing the processing capacity.

Third, even if noise occurs, the response signal fed back from the electronic component can be appropriately input to the testing machine, thereby improving the reliability of the testing machine.

Fourth, the temperature of the electronic components can be quickly and appropriately controlled by the duct structure, and the electronic components on the test board can be cooled by heat conduction under the condition that the test board does not hinder the path into and out of the test chamber. Real-time and precise temperature control of electronic components such as machines, so that the test step time is short, thereby ensuring the reliability of the tests that need to be carried out quickly.

Fifth, the electronic components are cooled by the cooling plate and the conductive bumps corresponding to the respective electronic components, so that the thermal state of all the electronic components can be made uniform, so that the reliability of the test can be further improved.

The preferred embodiments according to the present invention will be described with reference to the drawings. For the sake of simplicity of the description, the description of the repetitive or substantially the same configuration is omitted or compressed as much as possible. ＜Explanation about the test board-an example of the test board equipped with a thermal insulation space＞

Fig. 2 is a plan perspective view of a test board TB that can be housed in a test chamber according to the present invention, Fig. 3 is a bottom perspective view of the test board TB in Fig. 2, and Fig. 4 (a) and (b) are respectively related to the figure 2 is a plan exploded perspective view and a bottom exploded perspective view of the test board TB. FIG. 5 is a conceptual side view of the test board TB in FIG. 2.

As shown in FIGS. 2 to 5, the test board TB includes a board main body BB, a connector C, an auxiliary tester AT, and a mask material SE.

The board main body BB can be loaded with electronic components, and includes a mounting socket S and a circuit board CB.

The mounting socket S mounts the electronic components to be tested, and is arranged in multiple rows and columns. In this embodiment, the sockets S are arranged in 8 rows in a manner of 12 in each row. Therefore, a total of 96 electronic components are mounted on the board main body BB in a state where one is mounted for each mounting socket S. Of course, the number of sockets S can be differently presented in each test board TB according to the embodiment.

The circuit board CB has a circuit EC (refer to FIG. 5) that relays electrical signals between the electronic components and the testing machine. The above-mentioned mounting socket S is electrically connected to the circuit EC, so that the electronic components mounted on the mounting socket S can pass through the circuit EC and Test the electromechanical connection.

The connector C is coupled to one side of the board main body BB to be electrically connected to the circuit EC and also to the testing machine, thereby electrically connecting the circuit EC to the testing machine. Therefore, if the connector C is connected to the testing machine, the electronic component is electrically connected to the testing machine by arranging the socket S, the circuit EC, the connector C, and the connecting component (refer to the prior art).

The auxiliary tester AT is provided on the bottom surface side of the circuit board CB so as to be exposed downward, and is electrically connected to the electronic components placed in the mounting socket S through the circuit EC, thereby performing auxiliary tests different from the main test performed by the tester . Here, the main test may be, for example, a burn-in test, and the auxiliary test may be, for example, a test on the electrical operation characteristics of the electronic component with a short test time. Such an auxiliary testing machine AT can generate a signal for auxiliary testing and apply it to the electronic component, and be implemented to directly send a response signal from the electronic component to the testing machine, or to amplify and send the response signal to the testing machine. Therefore, the auxiliary testing machine AT is preferably equipped with one for each installation socket S. However, according to the embodiment, as shown with reference to FIG. 4( b ), a situation in which one auxiliary testing machine AT corresponds to a plurality of installation sockets S can also be fully considered. Of course, as shown in Figure 4(b), in the case where one auxiliary test machine AT corresponds to a plurality of installation sockets S, in order to make the test conditions all the same, it is better to make the auxiliary test machine AT and the plurality of installation sockets The distances between are all the same. Moreover, since the auxiliary tester AT is electrically connected to the circuit EC, it can also be interpreted as an electronic component constituting the circuit EC.

The mask material SE is provided to form a heat-insulating space IS on the surface side where the auxiliary tester AT is located. Here, although the auxiliary tester AT is provided on the circuit board CB, it is provided on the surface opposite to the surface on which the socket S is installed where the electronic components are installed. Therefore, the thermal insulation space IS formed by the mask material SE is located in The opposite side of the part. Such a mask material SE has a supply hole SH and a recovery hole RH for supplying the temperature adjustment fluid to the heat insulation space IS and recovering the temperature adjustment fluid from the heat insulation space IS in order to adjust the temperature of the heat insulation space IS. Here, the temperature adjustment fluid may be room temperature air, room temperature dry air, a gas mixed with room temperature dry air and low temperature gas (LN2 gas), or a single low temperature gas, or the like. The reason for setting the types of fluids diversified in this way is that the test temperature can be various types such as high temperature, normal temperature, and low temperature, and the type of temperature adjustment fluid and the temperature of the temperature adjustment fluid can be different according to the above-mentioned various types of test temperature conditions. For example, if condensation is expected, dry air should be supplied, otherwise normal air is fine. In addition, in the case of normal temperature, the same fluid of the same temperature may be supplied the same at all injection positions, or fluids of different temperatures may be supplied according to the injection position. That is, according to the injection position (area), there may be a temperature difference or there may be no temperature difference.

For reference, although a supply device for supplying temperature adjustment fluid may be provided in the test chamber 100, a fluid supply system built in a factory with main equipment may also be used.

The supply hole SH is divided into two arrangements, and is formed in order to supply the temperature adjustment fluid to the heat-insulating space IS.

The recovery holes RH are arranged in such a way that each supply hole SH is allocated four, and a total of eight are divided into four each, and they are used to pass the temperature adjustment fluid used to adjust the temperature of the auxiliary tester AT through the supply holes SH flows into the heat-insulating space IS and is formed by collecting it to the supply device.

Considering the design of the piping for supplying and recovering the temperature adjustment fluid, the connection structure of the supply hole SH and the recovery hole RH and the piping (the structure in which the supply hole and recovery hole can be connected to their respective piping through a single installation work), etc., The above-mentioned supply hole SH and recovery hole RH are preferably formed in the same direction. Therefore, in order that the temperature adjustment fluid supplied to the thermal insulation space IS through the supply hole SH will not be directly recovered to the supply device through the recovery hole RH, the test board TB is preferably additionally equipped with a temperature capable of being supplied through the supply hole SH The supply pipe ST that is recovered after the adjustment fluid is supplied so as to spread over the entire heat-insulating space IS.

The supply pipe ST may be provided on the opposite side of the supply hole SH and the recovery hole RH to inject the fluid for temperature adjustment. In addition, the supply pipe ST may be provided so as to uniformly inject the temperature adjustment fluid into the thermal insulation space IS by forming a plurality of injection holes along the length direction of the supply pipe ST. Here, it can be better considered that a plurality of injection holes are formed at a position where the injection can be directly concentrated toward the auxiliary tester AT (or electronic components such as amplifiers). Of course, it can also be fully considered to design through the following indirect spray method: the temperature adjustment fluid supplied through the supply pipe ST is sprayed toward the bottom surface of the heat insulation space IS, so that the temperature of the entire heat insulation space IS is assimilated, and the electronic components are adjusted accordingly. temperature.

In addition, the supply hole SH and the recovery hole RH are preferably formed in the direction of the connector C side. The reason is that when the test board TB contained in the test chamber is pressurized to electrically connect the test board TB to the test machine, the supply hole SH and the recovery hole RH are also connected to the flow path of the pipe located in the test chamber, thereby Two jobs (electrical connection job and flow path connection job) can be performed together, so it is convenient and has a stable structure. That is, it is preferable to have the following arrangement structure: when the test board TB is installed in the test chamber, the test board TB is pushed so that the connector C is electrically connected to the test machine. At this time, the supply hole SH and the recovery hole RH can also be close The ground is connected to the flow path of the piping located in the test chamber.

According to the test board TB of the aforementioned structure, before or after the main test, or at a certain interruption time in the program of the main test (when the time required for the auxiliary test is ensured), the auxiliary test machine is executed at that time. Auxiliary test performed by AT. In the case of performing an auxiliary test in this way, the auxiliary tester AT generates a test signal and applies it to the electronic component, and sends the response signal fed back from the electronic component to the tester through the circuit EC and the connector C. At this time, the auxiliary testing machine AT can amplify the response signal and send it to the testing machine. Of course, according to the embodiment, it can also be fully considered that the auxiliary testing machine AT only plays a role of generating test signals and applying them to the electronic components, and the circuit EC is constructed in such a way that the response signals fed back from the electronic components are directly sent to the testing machine. .

For reference, the power required to drive the auxiliary tester AT can be received from the tester.

Next, the use of the test board TB will be described. If a plurality of test boards TB loaded with electronic components are accommodated in the test chamber, the supply hole SH and the recovery hole RH are closely connected to the flow path of the pipe provided in the test chamber, and the electronic components are connected to each other through the circuit EC and the connector C Test the electromechanical connection. In the aforementioned state, the main test can be performed by the testing machine, and as described above, the auxiliary test can also be performed by the auxiliary testing machine AT. In addition, in order to apply thermal stress to the electronic components, for example, since the storage space in the test chamber maintains a high-temperature environment, the temperature adjustment fluid is continuously supplied to the thermal insulation space IS and then recovered. Therefore, regardless of the temperature environment of the containing space in the test chamber, the auxiliary testing machine AT can maintain a proper temperature. For example, if referring to the burn-in test, the temperature of the electronic components is high for the main test, and since the auxiliary test machine AT may generate heat during the auxiliary test, it can be better considered to deal with this situation The low-temperature temperature adjustment fluid containing LN2 gas is supplied to the heat-insulating space IS.

In addition, the above embodiments describe the situation in which the auxiliary test machine AT generates the test signal. However, depending on the type of test, it can also be considered to be implemented as receiving an auxiliary test signal for auxiliary testing from the tester, and instead, an amplifier is formed in the circuit to amplify and amplify the response signal from the electronic component corresponding to the auxiliary test signal. Send to the testing machine. In other words, it may be fully considered to equip the circuit EC of the test board TB with an amplifier instead of the auxiliary test machine AT. ＜Explanation about the test chamber-An example of a thermal insulation space equipped in the test chamber＞

Although the above description of the test board TB describes the case where the heat insulation space is formed on the test board TB, the heat insulation space or buffer space used to protect the electronic components of the auxiliary testing machine can be located in the test chamber. The structure of the chamber is formed. In this case, although the test board TB may be equipped with a heat insulation space, it does not need to be equipped. The test chamber according to the present invention is divided into the following embodiments and explained. 1. Regarding the first embodiment of the test chamber

As shown in the schematic diagram of FIG. 6, the test chamber 100 according to this embodiment includes a chamber body 110, an opening and closing door 120 and a temperature adjusting device 130.

The chamber main body 110 has a housing space ES (dashed line inner area) for housing the test board TB loaded with electronic components. One side of the housing space ES (the front side in FIG. 6) is open, so that the test board TB can be supplied to the housing space ES or the test board TB can be recovered from the housing space ES. In addition, the test board TB accommodated in the housing space ES is connected to the testing machine through the connecting member. At this time, in order to tightly connect the test board TB and the test machine, the test board TB needs to be pushed and properly installed in the housing space ES. Such a chamber main body 110 is equipped with a support rail 111 and a partition plate 112.

The support rail 111 performs a role of guiding the movement of the test board TB when the test board TB is carried into or out of the storage space ES, and also performs a role of supporting the test board TB accommodated in the storage space ES.

The dividing plate 112 divides the housing space ES into a plurality of independent spaces SS. A plurality of independent spaces SS formed by such partition plates 112 can block air movement between each other, and can accommodate one test board TB in one independent space SS.

In addition, because the support rail 111 is provided between the upper and lower partition plates 112, as shown in the reference diagram of FIG. 7, if the test board TB is installed in the independent space SS, the independent space SS can place the test board TB in the middle It is divided into a first area 1S on the upper side and a second area 2S on the lower side. At this time, ideally, the first region 1S and the second region 2S are preferably separated into mutually thermally isolated regions where the exchange of air between each other is blocked. That is, each independent space SS is separated into a first area 1S and a second area 2S by the test board TB, the support rail 111, and the partition board 112, and the second area 2S located below the test board TB functions as a thermal insulation space. Of course, the electronic components (auxiliary tester or amplifier, etc.) located on the test board TB are exposed on the side of the second area 2S.

In this embodiment, since the second area 2S formed under the test board TB by the partition plate 112 opens toward the opening and closing door 120 side, when the opening and closing door 120 is closed, the opening and closing door 120 should also be able to be closed. For this reason, the opening and closing door 120 is equipped with a loading member 121, so that the independent space SS can be sealed by closing the opening and closing door 120. At the same time, the first area 1S and the second area 2S are also separated to cut off the heat caused by mutual convection. move. Therefore, in the state in which the test board TB is arranged in the independent space SS and the opening and closing door 120 is closed, the air movement between the first area 1S and the second area 2S is blocked, so that the first area 1S can function as an electronic device. The temperature of the component functions as a setting space, and the second area 2S can function as a heat-insulating space or a buffer space to the extent that it is not affected by the temperature of the setting space or is only affected by conduction or the like.

In addition, in order to adjust the temperature of the second region 2S that functions as a heat insulating space or a buffer space, the chamber body 110 is formed with injection holes IH and suction holes OH for supplying temperature adjustment fluid on the inner wall constituting the housing space ES. Accordingly, the chamber main body 110 is equipped with the injection pipe IP and the suction pipe OP.

Of course, the injection pipe IP is equipped to inject the temperature adjustment fluid for adjusting the temperature of the second area 2S into the second area 2S, and the suction pipe OP is provided to allow the supply device to suck from the second area 2S and supply it to the second area through the injection pipe IP. The temperature adjustment of the second zone 2S is equipped with fluid.

For reference, in this embodiment, since the partition plate 112 is prepared in the test chamber 100, the flow path formed by the pipes IP and OP located in the test chamber 100 can maintain a stable connection with the injection hole IH and the suction hole OH. State, so that the design for its formation position can be freely carried out. That is, the injection hole IH and the suction hole OH may be formed in opposite directions to each other, or may be provided in any direction in consideration of design with other structures. In addition, since the flow paths of the piping IP and OP are fixedly connected to the injection hole IH and the suction hole OH, it can be secured for supplying the temperature adjustment fluid to the thermal insulation space or the buffer space as the second region 2S. Stable flow path for recovery.

As described above, the opening and closing door 120 opens or closes the storage space ES by opening and closing the open side of the chamber body 110. Of course, when the test board TB is moved into or out of the storage space ES, the storage space ES must be open, and when the electronic components are tested, the storage space ES must be closed. In addition, in this embodiment, the independent space SS is separated into the first area 1S and the second area 2S by the test board TB. Of course, the first area 1S and the second area 2S are open toward the opening and closing door 120 and pass through the opening and closing door. When 120 is opened and closed, the first area 1S and the second area 2S are also opened or closed toward the opening and closing door 120 side.

The temperature adjustment device 130 adjusts the temperature of the electronic components exposed to the first area side by supplying temperature adjustment air to the first area. Such a temperature adjustment device 130 will be described in detail in the following table of contents.

The present embodiment as described above can be suitably applied to the case where it is equipped to expose the electronic components such as the auxiliary tester AT constituting the circuit EC toward the one surface (lower surface) side of the test board TB. The circuit EC or auxiliary tester AT here is the same as the above description about the test board TB. 2. The second embodiment

The test chamber 100 according to this embodiment also includes a chamber body 110, an opening and closing door 120, and a temperature adjusting device 130.

Similar to the first embodiment, the chamber body 110 includes a supporting rail 111 and a partition plate 112, and further includes an auxiliary testing machine 113.

The test chamber 100, the opening/closing door 120, the support rail 111, and the partition plate 112 in this embodiment have the same structure and function as in the first embodiment above, so the description thereof is omitted.

However, in this embodiment, as shown with reference to FIG. 8, the difference from the first embodiment is that the test chamber 100 is equipped with an auxiliary tester 113. Therefore, for the case according to the present embodiment, the circuit EC of the test board TB is not equipped with electronic components such as the auxiliary tester AT. However, when the test board TB is installed in the test chamber 100, the auxiliary tester 113 located in the test chamber 100 should have a connection structure that can be electrically connected to the circuit EC of the test board TB.

As an example of the connection structure, it may be the following structure: the circuit EC of the test board TB is equipped with flexible advance and retreat terminals, so that if the test board TB is installed in the housing space ES, the circuit EC of the test board TB and the auxiliary tester 113 electrical connection. Such a structure can consider the use of a ball plunger (Ball plunger) terminal and so on. Of course, it is also possible to fully consider arranging a terminal that can be flexibly moved forward and backward on the side of the auxiliary testing machine 113.

In addition, as another example of the connection structure, the following structure may be used: as shown schematically in FIG. 8, if the test board TB is mounted on the support rail 111 and enters the independent space SS, the test is assisted by a lift 114 such as a cylinder or a motor. The machine 113 rises, and the circuit EC of the test board TB is electrically connected to the auxiliary test machine 113. Therefore, for the case according to this example, the test chamber 100 needs to be equipped with a separate elevator 114 for raising and lowering the auxiliary testing machine 113.

As mentioned above in the additional description of the test board TB, in this embodiment, the auxiliary test machine 113 can also be replaced with an amplifier. 3. The third embodiment

The test chamber 100 according to this embodiment also includes a chamber body 110, an opening and closing door 120, and a temperature adjusting device 130. In addition, the chamber body 110 includes a supporting rail 111 and a partition plate 112. This embodiment is the same as the aforementioned first embodiment, but as shown in the schematic conceptual diagram of FIG. 9, the difference is that the test board TB has an auxiliary testing machine AT and a thermal insulation space IS according to the examples of FIGS. 2 to 5.

Therefore, in the case according to the present embodiment, the second region 2S formed between the test board TB and the partition board 112 functions as a buffer space for strengthening the heat insulation function of the heat insulation space IS. That is, the auxiliary tester AT equipped on the test board TB is not exposed to the buffer space as the second area 2S, but is only exposed to the thermal insulation space IS located on the test board TB.

The second region 2S as a buffer space performs a function of once blocking the movement of heat conducted from the independent space SS on the lower side to the test board TB installed in the independent space SS on the upper side through thermal conduction or the like. Here, the structure capable of conducting heat from the lower independent space SS to the upper independent space SS will be described later.

In addition, in the case according to this example, the test chamber 100 has a supply pipe SP and a recovery pipe for supplying the temperature adjustment fluid to the heat insulation space IS of the test board TB or recovering the temperature adjustment fluid from the heat insulation space IS The RP has an injection pipe IP and a suction pipe OP for supplying the temperature adjustment fluid to the second area 2S functioning as a buffer space or recovering the supplied temperature adjustment fluid from the second area 2S. Of course, for ease of explanation, the conceptual diagram of FIG. 9 shows that all the pipes SP, RP, IP, and OP are visible, but preferably, the supply pipe SP and the recovery pipe RP are connected to the supply holes SH and the test board TB of FIG. 2 The recovery hole RH is correspondingly equipped toward the connector C side of the test board TB.

According to an example, the temperature of the thermal insulation space IS exposed to the auxiliary testing machine AT is controlled at about 5 degrees, and the second area 2S that functions as a buffer space is controlled at room temperature or about 25 degrees, thereby saving energy. That is, the temperature of the temperature adjustment fluid injected into the second area 2S as the buffer space through the injection pipe IP is set to be lower than the temperature of the first area 1S and higher than the temperature adjustment supplied to the heat insulation space IS through the supply pipe SP Use the temperature of the fluid. Of course, even so, the temperature of multiple areas separated from each other can be the same or different from each other according to the temperature conditions used for testing or the heating conditions of electronic components such as the auxiliary tester AT or amplifier, etc. The type of temperature adjustment fluid supplied It can also be mixed appropriately according to the situation.

Of course, although it is also possible to omit the partition plate 112 as in the modification of FIG. 10 and to equip the heat insulation space IS and the buffer space AS in the test board TB, in this case, the thickness of the test board TB becomes too thick. Therefore, it may be difficult in terms of mobility, management, and position design of the piping to be installed in the test chamber 100.

Also, as shown in the modification of FIG. 11, the following structure can also be considered: the test board TB is not provided with the heat insulation space IS, and instead, the partition board 112 and the buffer board 115 are placed in the test chamber 100, so that the partition can be The hot space IS and buffer space AS are all equipped. ＜Explanation on the temperature control technology of electronic components＞

The above example focuses on techniques for adjusting the temperature of electronic components such as the auxiliary tester AT and 113. However, the temperature of the electronic component is closely related to the temperature adjustment of the electronic component placed in the mounting socket S. The temperature adjustment of the electronic components is performed by the temperature adjustment device 130, which will be described in more detail.

As mentioned in the prior art, electronic components are tested while maintaining a predetermined temperature environment. However, with the high integration and advancement of electronic components, more and more self-heating occurs in the electronic components, so even during the test, the demand for adjusting the temperature of the electronic components is increasing. In addition, as mentioned above, when an additional auxiliary tester AT, 113 or amplifier is configured, it is expected that the heat generated in the electronic component will affect the electronic components through conduction or the like. In addition, the storage space ES needs to be divided into independent spaces SS in which the movement of heat due to mutual convection is blocked, so that the temperatures of all electronic components to be contained must be controlled within the same range. Therefore, it is necessary to consider new technologies for more precise temperature control of the electronic components under test.

Generally, the electronic components placed on the test board TB installed in the housing space ES should be tested in a state controlled by a manually established temperature environment. Therefore, the test chamber 100 should be equipped with a temperature adjustment device 130 for adjusting the temperature of the electronic components mounted on the test board TB mounted on the chamber main body 110. Through such a temperature adjustment device 130, a manually adjusted temperature environment is established in the housing space ES. For this reason, as shown in the schematic diagram of FIG. 12, the following method has been adopted in the past: One side wall of the chamber 100 is sprayed toward the containing space ES (refer to the arrow), so that the air passes between the test plates TB to uniformly control the temperature of the entire containing space ES (refer to Patent Publication No. 10-2010-0093896). However, with the form shown in FIG. 12, since the air for temperature adjustment cannot be sprayed directly to the electronic components mounted on the mounting socket S, but moves to the upper side of the electronic components, it is impossible to directly and immediately achieve temperature adjustment. , And can only indirectly realize the shortcomings of temperature regulation.

In addition, according to the test chamber 100 described as an embodiment with respect to the above-mentioned test chamber 100, the housing space ES is divided into a plurality of independent spaces SS, and the independent space SS is divided into the upper side with the test board TB in the middle. The first area 1S and the second area 2S on the lower side. In addition, the electronic components placed in the mounting socket S are exposed toward the first area 1S on the upper side. Therefore, the temperature adjustment of the electronic components must be performed through the first zone 1S. Therefore, as in the aforementioned test chamber 100, the storage space ES is divided into a plurality of independent spaces SS, and the independent space SS is again divided by the test board TB, thereby providing a new form of temperature adjustment device that constitutes an important feature of the present invention. 130.

FIG. 13 illustrates a new form of temperature adjustment device 130 that can be applied to the test chamber 100.

Referring to FIG. 13, the temperature adjusting device 130 equipped in the test chamber 100 according to the present invention has an air supplier 131, a supply duct 132, a regulating plate, a spray duct 134 and a branch duct 135.

The air supplier 131 supplies air for temperature adjustment for adjusting the temperature of the storage space ES. Such an air supplier 131 supplies air for temperature adjustment from one side P1, and sucks air for temperature adjustment that has passed through the housing space ES from the other side P2.

The supply duct 132 is equipped for distributing and supplying the temperature adjustment air supplied from the air supplier 131 to a plurality of positions of the accommodating space ES, that is, positions corresponding to the respective independent spaces SS. As shown in the partial view of FIG. 14, such a supply conduit 132 can be divided into a discharge part 132a, a guide part 132b, a connection part 132c, and a re-entry part 132d.

The discharge portion 132a has discharge holes DH: DH ₁ , ..., DH ₂ for discharging the air for temperature adjustment, and the discharge holes DH are formed at positions corresponding to the respective independent spaces SS. For reference, the temperature adjustment air discharged through the discharge hole DH is supplied to the jet duct 134 through the branch duct 135 described later.

The guide portion 132b guides the temperature adjustment air from the air supplier 131 to the discharge portion 132a.

The connection part 132c connects the discharge part 132a and the guide part 132b so that the moving direction of the air moving in the discharge part 132a and the moving direction of the air moving in the guide part 132b are changed by 180 degrees.

For reference, as shown in the example of FIG. 15, the guide portion 132 b may not be provided, and the temperature adjustment air supplied from the air supplier 131 may directly enter the linear discharge portion 132 a blocked at the end. However, in the case of the example of FIG. 15, according to Bernoulli's theorem, it occurs between _{the area where the exhaust hole DH 1} close to the air supplier 131 is located and the area where the exhaust hole DH ₂ far away from the air supplier 131 is located. The air pressure difference between them is large, so it may be difficult to evenly distribute the temperature adjustment air to the respective injection ducts 134. That is, in the example of FIG. 15, since the farther away from the air supplier 131, the lower the speed of the temperature adjustment air and the greater the air pressure, the temperature adjustment air passing through the respective discharge holes DH ₁ , ..., DH ₂ is discharged There is a big difference in the amount. Of course, for the case of FIG. 15, if _{the sizes of the discharge holes DH 1} , ..., DH ₂ are formed differently or an adjustment plate is configured to adjust the sizes of the discharge holes DH ₁ , ..., DH ₂ , the size of the discharge holes DH 1, ..., DH 2 can be adjusted at a certain The discharge amount is controlled to a certain extent, but it may be difficult to control the flow of complicated temperature adjustment air _{only by adjusting the sizes of the discharge holes DH 1} ,..., DH _2.

Therefore, as shown in FIG. 14, in this embodiment, the design is such that the movement direction of the temperature adjustment air is changed by 180 degrees at the connecting portion 132c, and the movement of the temperature adjustment air in this area is stagnated. On the moving line of the temperature adjustment air, _{the air pressure in the area where the first discharge hole DH 1} is located and the area where the last discharge hole DH ₂ is located can be as uniform as possible.

The re-entry portion 132d is equipped to allow the temperature adjustment air _{to enter the guide portion 132b after passing through the last exhaust hole DH 2} to realize the circulation of the temperature adjustment air in the supply duct 132. By disposing the re-entry portion 132d in such a manner that the end of the discharge portion 132a is not closed as described above, the air pressure is further reduced on the air movement line _{in the area where the first discharge hole DH 1} is located and the area where the last discharge hole DH ₂ is located. Therefore, the air pressure in the area where all the discharge holes DH: DH ₁ , ..., DH _{2 are located can be more uniform.} For reference, as shown in FIG. 16, although the supply duct 132 is configured in a U-shape, air stagnation occurs at the connecting portion 132c that changes the direction of air movement, but because the last discharge hole DH ₂ is located the maximum pressure region, the amount of exhaust air outlet hole DH of from ₂ up to the last, in this case, the temperature deviation are housed in respective independent space SS electronic component may occur. Therefore, as shown in FIG. 14, in this embodiment, the end of the discharge portion 132a is opened and connected to the guide portion 132b, thereby reducing the air pressure in the area where the _{last discharge hole DH 2 is located according to Bernoulli's theorem.} All the discharge holes DH: _{The air pressure in the area where DH 1} , ..., DH ₂ is located can be uniform with each other.

In addition, the discharge portion 132a and the guide portion 132b are provided on one side together with the accommodation space ES as a reference, so that not only the overall width of the device can be reduced, but also the design of the reentry portion 132d can be simply solved. Of course, in terms of reducing the overall width of the device, preferably, the distance between the side discharge portion 132a and the receiving space ES is the same as the distance between the guiding portion 132b and the receiving space ES. That is, as shown, when viewed from the plane, the center line C from the discharge portion 132a of the housing space ₁ from the center line C ES ₂ up to a center line C from the guide portion 132b of the housing ₁ to the space 17 in FIG ES The distance to the center line C ₂ is designed to be the same. However, depending on the implementation, the distance between the discharge portion 132a and the storage space ES and the distance between the guide portion 132b and the storage space ES may be different by making the area of the flow path of the discharge portion 132a and the guide portion 132b different.

Next, referring to the partial view of FIG. 18 in which a part of the supply duct 132 is exploded, the adjustment plate 133 is equipped to perform the function of a valve for adjusting the size of the discharge hole DH. The reason is that even in the various arrangements mentioned above, there may still be a difference in air pressure in each area of the discharge portion 132a, so that the size of the discharge hole DH is individually adjusted to make the temperature adjustment air evenly distributed To the jet duct 134. That is, due to the complicated fluid dynamics in the discharge portion 132a, a difference in air pressure for each section may occur in the discharge hole DH, and for this reason, the amount of temperature adjustment air discharged from each discharge hole DH may be different from each other. Therefore, the size of the discharge hole DH is adjusted by the adjustment plate 133 (specifically, the discharge area of the air passing through the discharge hole is adjusted), so that the temperature adjustment air can be uniformly distributed to the ejection duct 134. Of course, if fluid mechanics is taken into consideration and the size of the discharge hole DH is formed differently depending on the position, the adjustment plate 133 can also be omitted. However, when the size of the discharge hole DH is formed differently, various variables such as flow rate, flow rate, and cross-sectional area of the flow path must be considered, and depending on the test temperature and environmental conditions, the flow rate or flow rate may act as a variable. This leads to poor testing. Therefore, a situation in which the size of the discharge hole DH is adjusted by the adjustment plate 133 can be considered better and easier.

In this embodiment, the operator can operate the adjusting plate 133 in a sliding manner to set the size of the discharge hole. Therefore, for such a setting, as shown in FIG. 18, it is illustrated that one side F of the supply duct 132 is removable. The situation is equipped in a different way. However, depending on the implementation situation, it is also conceivable to equip the supply duct 132 as an integral type, and equip the adjustment plate 133 to be automatically operated by a separate driving source.

As shown with reference to FIG. 19, the ejection ducts 134 are spaced apart from each other in the housing space ES at predetermined intervals, and are arranged on the plurality of test boards TB in a one-to-one facing manner. In this embodiment, an adjusting board 133 is accommodated in an independent space SS so as to face the test board TB located in the independent space SS. That is, the ejection surface of the ejection duct 134 that ejects the air for temperature adjustment is opposed to the surface on which the electronic component of the test board TB is installed (the surface on which the socket is installed). Such a jet duct 134 must jet the temperature adjustment air that has passed through the supply duct 131 and the branch duct 135 toward the test board TB. For this reason, as shown in FIG. 20, the substance corresponding to the electronic components loaded on the test board TB one-to-one in the ejection duct 134 is formed with ejection holes IH. According to this embodiment, as described with reference to FIG. 19, since the ejection duct 134 is located on the upper side of the independent space SS, if the independent space SS is separated by the test board TB, it will be located in the first area 1S and is different from the loading on the test board TB. The electronic components face each other. Therefore, the air ejected from the ejection duct 134 is ejected directly toward the electronic components, and only the temperature of the first region 1S of the independent space SS is adjusted. In this way, the air ejected from the ejection duct 134 is directly ejected toward the electronic component. Therefore, unlike the past, the temperature of the electronic component can be controlled at a relatively high speed. In addition, compared with the past, the first region 1S, which is a space where the temperature must be adjusted, is narrowed, and accordingly, it is possible to achieve faster temperature adjustment, thereby reducing energy consumption. In addition, the air injected to the first region 1S through the injection duct 134 moves to the recovery chamber RR located outside the independent space SS, and is thereafter recovered to the air supplier 131.

In addition, as shown in FIG. 20, the injection duct 134 is equipped with a guide member 134a that guides the movement of the temperature adjustment air so as to evenly distribute the inflowing temperature adjustment air to the injection holes IH for injection.

The guide member 134a includes a conversion plate TP and a securing plate GP.

The switching plate TP is provided to switch the direction of the temperature adjustment air flowing in the direction of the arrow a.

The securing plate GP blocks the temperature adjustment air so that it cannot pass through the corresponding position, so as to ensure the movement path so that the temperature adjustment air whose direction is changed by the conversion plate TP spreads over the entire area of the jet duct 134 (see b arrow ).

While the guide member 134a is provided as described above, as shown in FIG. 20, the injection hole IH is formed in an area other than the path (see arrow a) where the temperature adjustment air flows into the injection duct 134 and reaches the conversion plate TP. That is, the injection hole IH is not formed on the path (a arrow) of the temperature adjustment air flowing into the injection duct 134 to the conversion plate TP. Therefore, the temperature adjustment air that has flowed into the injection duct 134 changes the direction of movement by the switching plate TP, and as shown by the arrow b, bypasses the path blocked by the securing plate GP and flows through the entire injection surface where the injection hole IH is located. Therefore, the temperature adjustment air can be sprayed relatively uniformly through the respective spray holes IH.

The branch duct 135 is provided to provide a path for the temperature adjustment air discharged from the supply duct 132 through the discharge hole DH to move to the ejection duct 134. For this purpose, it is branched from the supply duct 132 in order to form the number of discharge holes DH. The flow path is equipped with multiple.

According to the aforementioned temperature adjustment device 130, the temperature adjustment air supplied by the air supplier 131 flows into the injection duct 134 through the supply duct 132 and the branch duct 135, and is then injected into the independent space SS through the injection hole IH. In addition, the temperature adjustment air injected into the independent space SS establishes a temperature environment in the independent space SS while adjusting the temperature of the electronic components, and then flows out to the outside, passes through the recovery chamber RR, and is recovered to the air supplier 131 again.

According to the above description, the insulated space IS of the test board TB or the second area 2S (used as an insulated space or buffer space) equipped in the test chamber 100 is separated from the first area 1S by the test board TB Described. However, the thermal insulation space IS or the second area 2S may also be affected by the thermal environment of the first area 1S established by the temperature adjusting device 130 or the temperature state of electronic components due to the small gaps or heat conduction that may exist in the test board TB. . Therefore, as mentioned above, in order to protect electronic components such as auxiliary testers AT and 113, the temperature of the thermal insulation space IS or the second area 2S needs to be controlled to a temperature different from that of the first area 1S.

For reference, the second area 2S of the independent space SS located on the upper side is separated from the first area 1S of the independent space SS located on the lower side by the dividing plate 112, but the high temperature heat of the first area 1S of the independent space SS located on the lower side It is also possible to move to the second region 2S of the independent space SS located on the upper side by conduction or the like. Therefore, it is preferable to provide the aforementioned buffer space so as not to be directly affected by the high temperature established in the first region 1S of the independent space SS located on the lower side. At this time, in order to save energy, the temperature of the buffer space may preferably be considered to be higher than the temperature of the thermal insulation space IS and lower than the temperature of the first region 1S.

According to the foregoing embodiment, as shown in FIG. 19, a structure in which one injection duct 134 is arranged in each independent space SS is adopted. However, as shown in FIG. 21, in the case where the storage space ES is not divided into individual spaces SS by the separate partition plate 112, the structure according to the present invention that has a structure that directly injects temperature adjustment air toward the electronic components can also be applied. Temperature adjustment device 130.

In addition, further referring to Figs. 19 and 21 above to observe the characteristics of the test chamber 100 according to the present invention, it can be seen that a plurality of test boards TB can be housed in the accommodating space ES in a form of being spaced apart from each other and arranged in the vertical direction, and The jet ducts 134 are arranged on the plurality of test boards TB in a one-to-one face-to-face manner. Therefore, the ejection duct 134 other than the ejection duct 134 located on one side (upper side in this embodiment) is located between the test plates TB adjacent to each other.

In addition, the temperature adjustment air passing through the discharge part 132a through the reentry part 132d may merge into the guide part 132b again after passing through the discharge part 132a. Therefore, a deviation may occur between the temperature of the temperature adjustment air supplied from the air supplier 131 and the temperature of the temperature adjustment air injected from the injection duct 134. In addition, if there is a deviation between the temperature of the temperature adjustment air at the two locations as described above, it may not be possible to test the electronic component under the actually required temperature condition. To prevent this, as shown with reference to FIG, 13 is preferably provided for sensing the temperature from the air supply 131 supply air temperature control with a first temperature sensor TS ₁ for sensing and ejection from _{The second temperature sensor TS 2} of the temperature of the air for temperature adjustment sprayed by the duct 134. In this case, _{the temperature deviation sensed by the two temperature sensors TS 1} and TS ₂ is continuously monitored, and the temperature of the temperature adjustment air supplied from the air supplier 131 is adjusted whenever necessary, so that it can be Control the temperature of electronic components more precisely. ＜References＞

As mentioned above, the first area 1S should be established as a temperature environment for adjusting the temperature of electronic components, and the thermal insulation space IS should be established as a temperature environment for adjusting the temperature of electronic components that generate heat such as auxiliary testers AT, 113 or amplifiers. . In addition, the buffer space AS (including an example in which the second region functions as a buffer space) needs to establish a temperature environment such that the thermal state of the first region 1S on the lower side does not affect the thermal insulation space IS.

Therefore, when considering various test temperature conditions, the first area 1S, the insulation space IS, and the buffer space AS (when the second area functions as a buffer space, the second area) must be able to be controlled to be different from each other temperature.

For example, according to the test temperature conditions, the temperature of each space 1S, IS, AS can be controlled in various forms.

When the high temperature test is performed, the temperature of the first region 1S may be the highest, and the temperature of the insulated space IS is the lowest. At this time, the temperature of the buffer space AS has a value between the temperature of the first region 1S and the temperature of the thermal insulation space IS.

However, when the low temperature test is performed, the temperature of the first region 1S is the lowest, and in order to prevent condensation, the temperature of the thermal insulation space IS should be controlled to be higher than the temperature of the first region 1S. At this time, since the buffer space AS is in contact with the first region 1S on the lower side, the temperature of the thermal insulation space IS needs to be controlled to be higher than the temperature of the buffer space AS, or at least the same as each other. Of course, in the low temperature test, in order to prevent condensation, it is necessary to supply dry temperature adjustment fluid to the insulated space IS.

In the above description, in order to adjust the temperature of the electronic component, a method of spraying the temperature adjustment fluid to the electronic component is adopted. However, more precise temperature control for electronic components may be required, and in this case, deformation of the test board TB and the test chamber 100 such as the modification described below may be required. <Modifications> 1. About the modification of the test board

As described with reference to the perspective view of FIG. 22 and the cross-sectional view of FIG. 23, the test board TB according to this modification example has an insulating space IS itself.

The test board TB according to this modification has a structure in which a mounting socket S is provided on the upper side of the circuit board CB, and an auxiliary tester AT (or other electronic components) is provided on the lower side of the circuit board CB. According to such a basic structure, the test board TB according to this modification further includes the heat conductor TE and the conductive bump CP, and the mask material SE also has characteristics.

The thermal conductor TE is a thermal pad made of a non-metallic material with excellent thermal conductivity, and is provided on the underside of the auxiliary tester AT. Such a thermal conductor TE is non-metallic and soft, and can compensate for errors caused by manufacturing tolerances or design tolerances of the structure of the corresponding test chamber 100 described later.

The conductive bump CP is made of a metallic material with excellent thermal conductivity, and is provided on the lower side of the heat conductor.

The above-mentioned heat conductor TE and the conductive bump CP are configured to conduct cold air from the cooling plate 141 (refer to FIG. 24) described later to the auxiliary tester AT. Therefore, although it can be equipped with a single structure of a single conductive member, as described later, in order to add shock absorption and cushioning functions, it is preferable to additionally constitute a non-metallic material and a soft heat conductor TE. In addition, the upper and lower thicknesses of the thermal conductor TE and the conductive protrusion CP may be reduced or increased corresponding to the upper and lower thickness of the auxiliary tester AT of the paired test board TB. For example, comparing (a) and (b) of Figure 23, as mentioned above, an amplifier AP can also be equipped instead of the auxiliary tester AT, depending on the type of electronic components to be tested, the type of testing machine, or the amplification Different electronic components can be used within the range of, and because their sizes and heights may all be different accordingly, it is possible to prevent problems caused by changes in the size of the electronic components by changing the upper and lower thicknesses of the thermal conductor TE and the conductive bump CP.

The mask material SE is basically equipped to form a heat-insulating space IS in the area where the auxiliary testing machine AT is located, and also has a function of transmitting cold air from the cooling plate 141 to the conductive protrusion CP. To this end, the mask material SE includes a transfer plate DP, an outer wall plate EP, and a partition plate GP.

The transfer plate DP transfers the cold air from the cooling plate 141 to the conductive protrusion CP, thereby finally transmitting the cold air to the auxiliary testing machine AT, and is made of a metal material with good thermal conductivity. Therefore, the conductive bump CP may have a structure formed integrally with the transmission plate DP. In this example, the reason why the heat conductor TE and the conductive bump CP are added instead of the structure in which the transfer plate DP directly contacts the lower surface of the auxiliary tester AT is to prevent the occurrence of when the cooling plate contacts the mask material SE. The damage of the auxiliary tester AT caused by the impact (the function of the heat conductor), and minimizes the loss of the cold air by concentrating the cold air (the function of the conductive bump). These reasons will be explained in detail later.

The outer wall plate EP, the transfer plate DP and the partition plate GP together form the heat insulation space IS, and in order to maintain rigidity, it can preferably be made of a metal material.

The partition plate GP is sandwiched between the transmission plate DP and the outer wall plate EP, thereby performing the function of preventing the cold air of the transmission plate DP from being transmitted to the outer wall plate EP. For this reason, the partition plate GP is preferably made of a non-conductive insulator material. That is, the mask material SE is equipped with a partition plate GP made of an insulator around the transfer plate DP, so that the cold air existing on the transfer plate DP does not escape to other positions and concentrates on the conductive bump CP toward the electronic component. The auxiliary test machine AT is conducted.

For reference, the mask material SE is equipped with a form in which the opposite groove FG is formed so that the side of the transmission plate DP contacting the cooling plate 141 at the lower part is located on the upper side with respect to the lower end, and the cooling plate 141 has the shape inserted into the opposite groove FG or from The structure where the opposite groove FG is detached. This will be explained in detail later. 2. Explanation of the additional composition of the test chamber

FIG. 24 illustrates a part of the test chamber 100 paired with the test board TB of FIG. 22.

The test chamber 100 of FIG. 24 is equipped with the transfer device 140 of the auxiliary tester AT for transferring the cold air of the temperature adjustment fluid from the supply device to the test board TB. The transfer device 140 is located in the second area 2S of the first area 1S and the second area 2S that the independent space SS is divided by the test board TB. Here, the supply device may be a cooler, and the temperature adjustment fluid may be low-temperature nitrogen.

The transfer device 140 includes a cooling plate 141, an elastic member 142, a support frame 143 and a lift 144.

The cooling plate 141 is formed with a movement path MR through which the temperature adjustment fluid passes, and the cooling plate 141 is made of a metal material with good thermal conductivity. Therefore, it has a structure in which the cooling plate 141 is cooled when the low-temperature temperature adjustment fluid passes through the movement path MR. Here, one side of the movement path MR is connected to the injection pipe IP, and the other side is connected to the suction pipe OP. At this time, the injection pipe IP and the suction pipe OP are preferably equipped to have flexibility that can be flexibly bent. The reason is that the lifting operation by the elevator 144 should not be disturbed.

The upper end of the elastic member 142 is in contact with the cooling plate 141, and the lower end is in contact with the supporting frame 143, so as to elastically support the cooling plate 141 relative to the supporting frame 143.

The support frame 143 supports the elastic member 142. And, the upper surface of the support frame 143 is separated from the lower surface of the cooling plate 141 by a predetermined distance d. Therefore, the lower surface of the cooling plate 141 does not directly contact the upper surface of the support frame 143.

The elevator 144 raises and lowers the support frame 143, and finally the partitioned cooling plate 141 is raised and lowered by the elastic member 142. 3. Job description

First, as shown in FIG. 24, if the test board TB is inserted into the test chamber 100, the independent space SS is divided into a first area 1S and a second area 2S. At this time, during the procedure of inserting the test board TB into the test chamber 100, the cooling plate 141 is kept in a descending state, so the test board TB can be properly inserted into the independent space of the test chamber 100 without the interference of the cooling plate 141 SS.

After that, when a test for electronic components is performed, the elevator 144 operates to raise the cooling plate 141, and as shown in FIG. 25, the cooling plate 141 is in contact with the transfer plate DP. In this procedure, the elastic member 142 absorbs the contact impact of the cooling plate 141 and the transfer plate DP, thereby preventing damage to the auxiliary tester AT or other structures located on the test plate TB. Moreover, even when the level of the transmission plate DP is reduced due to assembly manufacturing tolerances, the elastic member 142 compensates for it, so as to achieve close contact between the transmission plate DP and the cooling plate 141, thereby increasing the transmission force of cold air.

If the electronic component is tested and the temperature of the auxiliary tester AT rises, the supply device supplies the cooling fluid accordingly. If the cooling plate 141 is cooled by the cooling fluid, the cold air of the cooling plate 141 passes through the transfer plate DP and conducts The bump CP and the thermal conductor TE are transferred to the auxiliary tester AT. Accordingly, the temperature of the auxiliary testing machine AT drops to an appropriate level.

After that, when the test ends, the elevator 144 is operated to lower the cooling plate 141, and the test board TB is in a state where it can be detached from the independent space SS and removed from the test board TB.

In addition, in the above embodiment, a case where one test board TB is equipped with one cooling plate 141 is exemplified. However, as shown in FIG. 26, it can be considered that one test board TB is equipped with a plurality of corresponding small cooling plates 141a. , 141b, 141c, 141d, 141e, 141f. That is, the plane area of each of the plurality of small cooling plates 141a, 141b, 141c, 141d, 141e, and 141f is smaller than the plane area of the test board TB. 141a, 141b, 141c, 141d, 141e, 141f, even if there are various mechanical tolerances, a plurality of small cooling plates 141a, 141b, 141c, 141d, 141e, 141f can be elastically supported by the elastic member 142, so that the transmission plate DP and The close contact between the cooling plates 141a, 141b, 141c, 141d, 141e, and 141f is closer.

As mentioned above, although the present invention has been specifically described based on the embodiments with reference to the drawings, the above-mentioned embodiments only illustrate the preferred embodiments of the present invention. Therefore, it should not be understood that the present invention is limited to the above-mentioned embodiments. The scope of rights of the invention should be understood in accordance with the scope of the patent application and its equivalent scope.

TB: Test board BB: Board body EC: Circuit AT: auxiliary testing machine C: Connector SE: Mask material DP: transfer board IS: insulated space 100: test chamber 110: Chamber body ES: containment space SS: Independent space 120: open and close the door 130: Temperature adjustment device 131: Air Supply 132: Supply Conduit 132a: discharge part 132b: boot part 132c: connecting part 132d: Re-enter the part DH: Drain hole 134: Jet Conduit 134a: guide parts TP: Conversion board GP: Ensure board IH: Jet hole 135: Branch catheter 140: transfer device

Fig. 1 is a reference diagram for explaining the connection structure of a tester and an electronic component in a burn-in test.

Fig. 2 is a plan perspective view of the test board.

FIG. 3 is a perspective view of the bottom surface of the test board of FIG. 2.

Fig. 4 is an exploded perspective view of the test board of Fig. 2.

Fig. 5 is a conceptual side view of the test board of Fig. 2.

Fig. 6 is a front perspective view of a test chamber according to an embodiment.

FIG. 7 is a reference diagram for explaining an independent space located in the test chamber of FIG. 6.

8 and 9 are reference diagrams for explaining a test chamber according to another embodiment.

10 and 11 are reference diagrams for explaining modification examples of the test board and the test chamber.

Fig. 12 is a reference diagram for explaining a prior art related to temperature adjustment of electronic components.

Fig. 13 is a partial perspective view of a temperature adjusting device equipped in the test chamber according to the present invention.

Fig. 14 is a partial view of a supply duct applied to the temperature adjustment device of Fig. 13.

15 and 16 are reference diagrams for explaining the advantages of the supply duct of FIG. 14.

Fig. 17 is a reference diagram for explaining the position of the supply duct of Fig. 14.

Fig. 18 is a partial exploded perspective view of the supply duct of Fig. 14.

Fig. 19 is a reference diagram for explaining the arrangement relationship between the supply duct and the storage space of Fig. 14.

Fig. 20 is a partial exploded perspective view of a spray duct applied to the temperature adjustment device of Fig. 13.

FIG. 21 is a reference diagram for explaining another example of a test chamber to which the temperature adjustment device of FIG. 13 is applied.

22 to 26 are reference diagrams for explaining other modified examples of the present invention.

Domestic deposit information (please note in the order of deposit institution, date and number) without Foreign hosting information (please note in the order of hosting country, institution, date, and number) without

131: Air Supply

132: Supply Conduit

132a: discharge part

132b: boot part

132c: connecting part

132d: Re-enter the part

DH, DH ₁ , DH ₂ : discharge hole

Claims (6)

A test board includes: a board main body configured to load electronic components on the surface of the board main body and having a circuit that relays electrical signals between the electronic components and a testing machine; and a connector coupled to the One side of the board body is electrically connected to the circuit, and is connected to the test machine, thereby electrically connecting the circuit to the test machine; and a mask material, in order to block the electronic components located in the circuit from being External heat forms a heat-insulating space together with the board main body at the opposite surface of the surface on which the electronic component is loaded, wherein the electronic components located in the circuit are exposed to the side of the heat-insulating space. According to the test board of claim 1, wherein the circuit includes at least any one of the following configurations: an auxiliary test machine is electrically connected to the electronic component loaded on the board main body, and then executes and in-places the electronic component The test machine is responsible for different auxiliary tests from the main test; or an amplifier, which is electrically connected to the electronic component mounted on the board body, and then amplifies the response signal from the electronic component to the test machine and sends it to In the testing machine, the response signal is a feedback to the test signal applied from the testing machine to the electronic component. The test board according to claim 1, wherein the mask material has: a supply hole for supplying the heat-insulating space A fluid for temperature adjustment; and a recovery hole for recovering the fluid for temperature adjustment used for temperature adjustment of the electronic component located in the circuit from the heat-insulating space. The test board according to claim 1, wherein the mask material includes a transfer board for transferring cold air to the electronic component. According to the test board of claim 4, wherein the transfer plate is made of a metal material with good thermal conductivity, and in the mask material, the periphery of the transfer plate is made of an insulator, so that the cold air existing in the transfer plate is concentrated Conduction toward the electronic components located in the circuit. A test board includes: a board main body configured to load electronic components on the surface of the board main body and having a circuit that relays electrical signals between the electronic components and a testing machine; and a connector coupled to the board One side of the board main body is electrically connected to the circuit, and is also electrically connected to the testing machine, thereby electrically connecting the circuit to the testing machine, wherein the circuit includes an electronic component, and the electronic component It includes at least any one of the following configurations: an auxiliary testing machine, which is electrically connected to the electronic component mounted on the board main body, and then performs an auxiliary test for the electronic component that is different from the main test performed by the testing machine Test; or an amplifier, which is electrically connected to the electronic components mounted on the board main body, Furthermore, the response signal from the electronic component to the testing machine is amplified and sent to the testing machine, and the response signal is a feedback to the test signal applied from the testing machine to the electronic component.

Images