CN118226177A

CN118226177A - Test chamber

Info

Publication number: CN118226177A
Application number: CN202410481648.9A
Authority: CN
Inventors: 罗闰成; 卢锺基; 许成旭; 孙昇杓
Original assignee: Techwing Co Ltd
Current assignee: Techwing Co Ltd
Priority date: 2019-06-19
Filing date: 2020-06-15
Publication date: 2024-06-21
Also published as: TW202104916A; CN112114207A; TWI783652B; TWI782680B; CN118226176A; TW202311766A; TWI742726B; CN112114207B; TW202238153A; CN118226175A; TWI812250B; TW202212846A; TW202201023A

Abstract

The invention relates to a test chamber comprising: a chamber body having an accommodation space for accommodating a test board on which electronic components are loaded, the chamber body comprising: and a transmission device for transmitting the cool air of the temperature adjusting fluid to the electronic components constituting the circuit of the test board.

Description

Test chamber

The application relates to a division application of a test board and a test chamber, which are the patent application of the application with the application number 202010541666.3, wherein the application date is 2020, 6, 15 and the application number is 202010541666.3.

Technical Field

The present invention relates to a test board capable of loading electronic components to be electrically connected to a tester and a test chamber capable of adjusting the temperature of the electronic components electrically connected to the tester after housing the test board.

Background

The produced electronic components are separated into good products and defective products after being tested by the testing machine, and then the good products are only delivered.

Since electronic components can be used in various environments, it is necessary to maintain a state of creating a severe high-temperature environment when testing electronic components. Therefore, the electronic component is accommodated in the accommodating space in the sealable test chamber, and the accommodating space is maintained in a severe temperature environment, so that thermal stress is applied to the electronic component. Of course, the electronic component is electrically connected to the test machine in a state of being located in the housing space. Of course, since the severe temperature environment is not necessarily a high temperature environment but may be a low temperature environment, and the daily temperature environment may be an ordinary temperature, all the devices capable of performing the test for each case are required.

In addition, the shorter the electrical connection distance between the tester and the electronic component is, the better. The reason for this is that if the electrical connection distance between the tester and the electronic component is long, distortion or noise of the electrical signal may occur accordingly, and data may be lost, so that it is difficult to ensure the reliability of the test.

Of course, there is a test in which no particular problem occurs even if the electrical connection distance between the tester and the electronic component is long, but there is a problem that the above-described problem may occur if the electrical connection distance between the tester and the electronic component is long and a test that is performed at high speed is required.

For example, in the case of performing Burn-In test (Burn In test) for a long test time, no particular problem has occurred so far even if the electrical connection distance between the tester and the electronic component is long. Here, the burn-in test refers to a test performed in a state in which a stress of high temperature (85 degrees to 125 degrees) is applied to an electronic component in order to find a potential failure of the electronic component. The reason for this is that the test requiring high speed is not performed in the burn-in test process, and the need for the performance is not generated.

Burn-in tests are performed for a long period of time while applying not only high temperatures but also electrical stresses such as voltages and currents higher than the actual conditions of use of electronic components. For such burn-in testing, a tester, a burn-in board, and a burn-in chamber are required.

The burn-in board has, as one type of test board capable of loading a plurality of electronic components to be electrically connected to a tester, a set-up socket, a circuit, and a connector for electrically connecting the electronic components to the tester.

The burn-in chamber, which is one type of test chamber, has an accommodating space that accommodates a test board on which electronic components are mounted, and can create a temperature environment for applying thermal stress to the electronic components accommodated in the accommodating space.

Fig. 1 shows a structure in which a burn-in board BIB accommodated in a burn-in chamber is electrically connected to a TESTER.

As shown in fig. 1, in order to electrically connect the electronic component D to the TESTER test, it is necessary to provide terminals, a circuit EC, a connector C, and a connection member CE (a connection portion existing on a path passing through the wall surface of the burn-in chamber) of the mounting socket S (see fig. 2). That is, the distance of the connection circuit for connecting the electronic component D to the TESTER test is long, and a plurality of connection elements are interposed. Therefore, it is impossible to perform a test that may be problematic if the electrical connection distance between the TESTER test and the electronic component D is long or a test that requires a quick and immediate response by the existing burn-in TESTER.

For example, unlike the past, an electronic component such as a memory semiconductor device is added with a test item for the electronic component, and it is necessary to perform not only a test ON the level of whether a simple ON/OFF (ON/OFF) operation is performed, but also a test ON how fast data (for example, large-capacity data such as video) can be read or stored, how fast data can be displayed ON a screen, and whether normal operation is possible. Moreover, these tests need to be performed in a short time, for which the connection distance between the electronic component and the tester must be short. Therefore, in addition to the burn-in test system, other additional test systems are required, which results in waste of resources, waste of time and labor.

Also, with the development of electronic components, the possibility that the circuit EC of the burn-in board has various electronic components required for testing cannot be excluded, and in this case, the various electronic components are exposed to a severe temperature environment created in the housing space of the test chamber, and thus damage or a reduction in life may be caused.

In addition, testing that requires a shorter time or testing due to upgrades or additional test items of the electronic component may require more precise control of the temperature of the electronic component. Since the temperature of the tested electronic components is related to the reliability of the test, the temperature conditions for the individual electronic components required in the various tests need to be accurately managed so as not to exceed the allowable error range.

[ Prior Art literature ]

[ Patent literature ]

Korean patent No. 10-1164116

Korean laid-open patent No. 10-2003-0029266

Korean laid-open patent No. 10-2005-0055685

Disclosure of Invention

The present invention has the following objects.

First, a technique is provided that can prevent the circuitry of a test board from being subjected to ambient thermal stimulus.

Second, a technique is provided for a test chamber in which an electronic component can be subjected to an auxiliary test different from a main test performed by a tester in a state of being accommodated in the test chamber.

Third, a technique is provided that enables a response signal to be appropriately transmitted from an electronic component to a tester even if noise or the like may occur in a connection circuit that electrically connects the tester and the electronic component.

Fourth, a technique is provided that enables immediate temperature control with respect to electronic components in consideration of the case where testing is performed quickly in a short time.

Fifth, a technique is provided that enables testing of all electronic components housed in a test chamber at as uniform a temperature adjustment as possible even if the electronic components are located in separate spaces.

The test board according to the first aspect of the present invention includes: a board main body on which electronic components are mounted, and having a circuit for relaying an electrical signal between the electronic components and the tester; a connector coupled to one side of the board body to be electrically connected to the circuit and electrically connected to the tester, thereby electrically connecting the circuit to the tester; and a shielding material for blocking heat from the outside of the electronic component located in the circuit, wherein the electronic component located in the circuit is exposed to the heat-insulating space side, and forming a heat-insulating space on a surface opposite to a surface on which the electronic component is mounted.

The circuit comprises at least any one of the following components: an auxiliary testing machine electrically connected to the electronic component mounted on the board main body, and configured to perform an auxiliary test for the electronic component, the auxiliary test being different from a main test performed in charge of the testing machine; or an amplifier electrically connected to the electronic component mounted on the board main body, and further amplifying a response signal from the electronic component to the tester and transmitting the response signal to the tester, wherein the response signal is feedback for a test signal applied from the tester to the electronic component.

The shielding material has: a supply hole for supplying a temperature-adjusting fluid to the heat-insulating space; and a recovery hole for recovering a temperature adjustment fluid used for adjusting the temperature of the electronic component located in the circuit from the heat insulation space.

The shielding material may include a transfer plate for transferring cool air to the electronic component.

The transmission plate is made of a metal material having excellent heat conductivity, and in the shielding material, the periphery of the transmission plate is made of an insulator, so that the cold air existing in the transmission plate is concentrated and conducted toward the electronic component located in the circuit.

The test board according to the second aspect of the present invention includes: a board main body on which electronic components are mounted, and having a circuit for relaying an electrical signal between the electronic components and the tester; and a connector coupled to one side of the board body to be electrically connected to the circuit and also electrically connected to the tester, thereby electrically connecting the circuit to the tester, wherein the circuit includes at least any one of the following: an auxiliary testing machine electrically connected to the electronic component mounted on the board main body, and configured to perform an auxiliary test for the electronic component, the auxiliary test being different from a main test performed in charge of the testing machine; or an amplifier electrically connected to the electronic component mounted on the board main body, and further amplifying a response signal from the electronic component to the tester and transmitting the response signal to the tester, wherein the response signal is feedback for a test signal applied from the tester to the electronic component.

The test chamber according to the first aspect of the present invention includes: a chamber body having an accommodation space opened at one side for accommodating a test board on which electronic components are mounted; and a temperature adjusting device for adjusting a temperature of an electronic component mounted on the test board housed in the chamber body, wherein the chamber body has: a support rail for supporting the test board accommodated in the accommodation space, the support rail being provided so as to be divided into: a first region in which the temperature of the accommodating space is adjusted by the temperature adjusting device if the test board is accommodated in the accommodating space; and a second region separated from the first region, wherein the electronic component mounted on the test board is exposed to the first region side, and the second region is blocked from air exchange with the first region by the test board.

The chamber body further includes: an injection pipe for injecting a temperature adjustment fluid for adjusting the temperature of the second region into the second region; and a suction pipe for sucking the temperature adjustment fluid supplied through the injection pipe from the second region.

The test plate is the test plate mentioned above, the chamber body further comprising: a supply pipe for supplying a temperature-adjusting fluid at a predetermined temperature to the heat-insulating space located in the test plate; and a recovery pipe for recovering the temperature-adjusting fluid supplied to the heat-insulating space through the supply pipe.

The temperatures of the first region, the insulating space, and the second region can be controlled to be different from each other. Or when the temperature is tested at a high temperature, the temperature of the first area can be controlled to be the highest, the temperature of the heat insulation space is lower than the temperature of the second area, and when the temperature is tested at a low temperature, the temperature of the first area can be controlled to be the lowest, and the temperature of the heat insulation space is higher than or equal to the temperature of the second area.

Further comprises: and an opening/closing door for opening or closing the housing space by opening/closing one side of the chamber body, wherein the first region and the second region are opened to the opening/closing door side, and the first region and the second region are opened or closed to the opening/closing door side by opening/closing the opening/closing door.

The chamber body further includes: and the buffer plate divides the second area into two parts, and further forms a heat insulation space towards the side of the test plate and forms a buffer space towards the side opposite to the side of the test plate.

The chamber body further comprises at least any one of the following: the auxiliary testing machine is electrically connected with the testing board accommodated in the accommodating space, and further executes auxiliary tests which are different from main tests which are carried out in charge of the testing machine on the electronic components; or an amplifier electrically connected to the test board accommodated in the accommodation space, for amplifying a response signal from the electronic component to the tester and transmitting the response signal to the tester, wherein the response signal is feedback to the test signal applied from the tester to the electronic component, and the auxiliary tester or the amplifier is exposed to the second area side.

The chamber body further includes: and the transmission device is used for transmitting the cold air of the temperature regulating fluid to the electronic element positioned on the test board, and the transmission device is positioned in the second area.

The transfer device includes: a cooling plate for delivering cool air to the electronic components located on the test board; and an elevator for elevating the cooling plate so that the cooling plate is in a state capable of transmitting cool air to the electronic component or releasing contact between the cooling plate and the test plate so that the test plate is in a state capable of being removed from the housing space.

The cooling plates are provided in plural so that plural cooling plates correspond to one test plate.

A test chamber according to a fifth aspect of the invention comprises: a chamber body having an accommodation space for accommodating a test board on which electronic components are loaded, the chamber body comprising: and a transmission device for transmitting the cool air of the temperature adjusting fluid to the electronic components constituting the circuit of the test board.

The present invention has the following effects.

First, the circuit of the test board or other electronic components required for the test can be protected from the surrounding thermal stimulus, so that damage thereof can be prevented and the life can be prolonged.

Second, the auxiliary test can be performed together with the main test, thereby saving resources, and shortening the overall test time, thereby improving the processing capacity.

Third, even if noise occurs, a response signal fed back from the electronic component can be appropriately input to the tester, thereby improving the reliability of the tester.

Fourth, the temperature of the electronic components can be rapidly and properly controlled through the duct structure, and the electronic components located on the test board are cooled by heat conduction without impeding the path into and out of the test chamber, so that instant and precise temperature control for the electronic components such as the auxiliary tester can be achieved, so that the test process time is short, and further reliability regarding the test that needs to be rapidly performed is ensured.

Fifth, since the electronic components are cooled by the cooling plate, the conductive bumps corresponding to the respective electronic components, and the like, the thermal state of all the electronic components can be made uniform, and the reliability of the test can be further improved.

Drawings

Fig. 1 is a reference diagram for explaining a connection structure of a tester and an electronic component in a burn-in test.

Fig. 2 is a plan perspective view of a test plate.

Fig. 3 is a bottom perspective view of the test plate of fig. 2.

Fig. 4 is an exploded perspective view of the test plate of fig. 2.

Fig. 5 is a conceptual side view of the test plate of fig. 2.

Fig. 6 is a front perspective view of a test chamber according to one embodiment.

Fig. 7 is a reference diagram for explaining the independent space in the test chamber of fig. 6.

Fig. 8 and 9 are reference diagrams for explaining a test chamber according to another embodiment.

Fig. 10 and 11 are reference diagrams for explaining modifications of the test board and the test chamber.

Fig. 12 is a reference diagram for explaining a related art related to temperature adjustment of electronic components.

Fig. 13 is a partial perspective view of a temperature adjusting device equipped in a test chamber according to the present invention.

Fig. 14 is a partial view of a supply conduit applied to the temperature adjusting device of fig. 13.

Fig. 15 and 16 are reference diagrams for explaining advantages of the supply conduit of fig. 14.

Fig. 17 is a reference diagram for explaining the position of the supply conduit of fig. 14.

Fig. 18 is a partially exploded perspective view of the supply conduit of fig. 14.

Fig. 19 is a reference diagram for explaining the arrangement relationship between the supply conduit and the accommodating space of fig. 14.

Fig. 20 is a partially exploded perspective view of a spray duct applied to the temperature adjusting device of fig. 13.

Fig. 21 is a reference diagram for explaining another example of a test chamber with respect to the temperature adjustment device of fig. 13 applied thereto.

Fig. 22 to 26 are reference diagrams for explaining another modification of the present invention.

Symbol description

TB: test panel BB: plate body

EC: circuit AT: auxiliary testing machine

C: connector SE: shielding material

DP: transfer board IS: thermal insulation space

100: Test chamber 110: chamber body

ES: accommodation space SS: independent space

120: Opening and closing door 130: temperature regulating device

131: Air supply 132: supply conduit

132A: the discharge portion 132b: guide portion

132C: the connection portion 132d: reentrant portion

DH: the discharge hole 134: jet catheter

134A: guide member TP: conversion plate

GP: ensure plate IH: injection hole

135: Branch conduit 140: transmission device

Detailed Description

The preferred embodiments according to the present invention will be described with reference to the accompanying drawings, and for simplicity of description, descriptions for repeated or substantially identical configurations will be omitted or compressed as much as possible.

< Description about test plate-example of being equipped with insulation space at test plate >

Fig. 2 is a plan perspective view of a test board TB capable of being received in a test chamber according to the present invention, fig. 3 is a bottom perspective view of the test board TB of fig. 2, fig. 4 (a) and (b) are a plan exploded perspective view and a bottom exploded perspective view, respectively, of the test board TB of fig. 2, and fig. 5 is a conceptual side view of the test board TB of fig. 2.

As shown in fig. 2 to 5, the test board TB includes a board main body BB, a connector C, an auxiliary tester AT, and a shielding material SE.

The board main body BB may house electronic components, and includes a set socket S and a circuit board CB.

The mounting sockets S mount electronic components to be tested and are provided in a row and column form. In the present embodiment, the set sockets S are provided in 8 columns with 12 per column. Accordingly, a total of 96 electronic components are mounted on the board main body BB in a manner that one electronic component is mounted on each mounting socket S. Of course, the number of the set sockets S may be differently presented at each test board TB according to the embodiment.

The circuit board CB has a circuit EC (refer to fig. 5) that relays an electrical signal between the electronic component and the tester, and the above-described set socket S is electrically connected to the circuit EC, so that the electronic component set in the set socket S can be electrically connected to the tester through the circuit EC.

The connector C is coupled to one side of the board body BB to be electrically connected to the circuit EC and also to the tester, thereby electrically connecting the circuit EC to the tester. Therefore, if the connector C is electrically connected to the tester, the electronic component is electrically connected to the tester by the mounting socket S, the circuit EC, the connector C, and the connection member (refer to the background art).

The auxiliary tester AT is provided on the bottom surface side of the circuit board CB so as to be exposed downward, and is electrically connected to the electronic component mounted on the mounting socket S through the circuit EC, thereby performing an auxiliary test different from the main test performed by the tester. The main test may be, for example, a burn-in test, and the auxiliary test may be, for example, a test with respect to the electrical operating characteristics of the electronic component, which has a short test time. Such an auxiliary tester AT may generate and apply signals for auxiliary testing to the electronic components and be implemented to directly transmit response signals from the electronic components to the tester or to amplify and transmit response signals to the tester. The auxiliary tester AT is therefore preferably equipped with one for each of the placement sockets S. However, according to the embodiment, as shown with reference to fig. 4 (b), it is also possible to sufficiently consider a case where one auxiliary tester AT corresponds to a plurality of set sockets S. Of course, as shown in fig. 4 (b), in the case where one auxiliary tester AT corresponds to a plurality of seating sockets S, in order to make the test conditions all the same, it is preferable to make the distances between the auxiliary tester AT and the plurality of seating sockets all the same. Further, since the auxiliary tester AT is electrically connected to the circuit EC, it can be interpreted as one electronic component constituting the circuit EC.

The shielding material SE IS provided to form a heat insulating space IS to the surface side where the auxiliary tester AT IS located. Here, although the auxiliary tester AT IS provided on the circuit board CB, it IS provided on the surface opposite to the surface on which the electronic component IS mounted on the socket S, and therefore the heat insulating space IS formed by the shielding material SE IS located on the surface opposite to the surface on which the electronic component IS mounted. Such a shielding material SE has a supply hole SH and a recovery hole RH for supplying a temperature adjustment fluid to the heat insulation space IS and recovering the temperature adjustment fluid from the heat insulation space IS in order to adjust the temperature of the heat insulation space IS. Here, the temperature adjustment fluid may be normal temperature air, normal temperature dry air, a gas obtained by mixing normal temperature dry air with low temperature gas (LN 2 gas), or a low temperature gas alone. The reason why the types of fluids are set variously is that the test temperature may be various types such as high temperature, normal temperature, low temperature, etc., and the types of temperature adjustment fluids and the temperature of the temperature adjustment fluids may be different depending on the test temperature conditions of the various types. For example, if dew condensation is expected, dry air should be supplied, or ordinary air may be put in. In addition, if the temperature is normal, the same fluid at the same temperature may be supplied at all injection sites, or fluids at different temperatures may be supplied at injection sites. That is, the injection position (region) may have a temperature difference or may have no temperature difference.

For reference, although a supply device for supplying a temperature-adjusting fluid may be provided to the test chamber 100, a fluid supply system constructed in a factory with a main apparatus may be used.

The supply hole SH IS divided into two arrangements, and IS formed for supplying the temperature-adjusting fluid to the heat insulating space IS.

The recovery holes RH are arranged in such a manner that 4 are allocated per supply hole SH, dividing a total of 8 into 4 each, and are formed for recovering the temperature-adjusting fluid used for adjusting the temperature of the auxiliary testing machine AT to the supply device after flowing into the insulating space IS through the supply hole SH.

In view of the design of the piping for supplying and recovering the temperature-adjusting fluid, the connection structure of the supply hole SH and the recovery hole RH with the piping (the structure in which the supply hole and the recovery hole can be connected to the respective piping together by one installation operation), and the like, the supply hole SH and the recovery hole RH are preferably formed in the same direction. Therefore, in order that the temperature adjustment fluid supplied to the heat insulation space IS through the supply hole SH IS not directly recovered to the supply device through the recovery hole RH, the test plate TB IS preferably additionally provided with a supply pipe ST capable of being recovered after the temperature adjustment fluid supplied through the supply hole SH IS supplied so as to extend over the entire heat insulation space IS.

The supply tube ST may be provided on the opposite side of the supply hole SH and the recovery hole RH to spray the temperature-adjusting fluid. The supply pipe ST may be provided with a plurality of injection holes formed along the longitudinal direction of the supply pipe ST so that the temperature control fluid IS uniformly injected into the heat insulation space IS. Here, it is preferable to consider that the plurality of injection holes are formed AT positions where the injection can be directly concentrated toward the auxiliary tester AT (or the electronic component such as an amplifier). Of course, it is also possible to design the device by indirect injection as follows: the temperature control fluid supplied through the supply pipe ST IS sprayed toward the bottom surface of the heat insulating space IS, thereby assimilating the temperature of the entire heat insulating space IS and controlling the temperature of the electronic component.

Also, the supply hole SH and the recovery hole RH are preferably formed in the connector C-side direction. The reason for this is that: when the test board TB accommodated in the test chamber is pressurized to electrically connect the test board TB to the tester, the supply hole SH and the recovery hole RH are also connected to the flow path of the pipe located in the test chamber, so that two operations (an electrical connection operation and a flow path connection operation) can be performed at once, thereby being convenient and structurally stable. That is, it is preferable to have the following arrangement: when the test board TB is mounted in the test chamber, the test board TB is pushed so that the connector C is electrically connected to the tester, and at this time, the supply hole SH and the recovery hole RH can also be closely connected to the flow path of the piping located in the test chamber.

According to the test board TB of the above-described structure, the auxiliary test performed by the auxiliary tester AT is performed AT a certain interruption time (when the time required for the auxiliary test is ensured) before or after the main test is performed, or during the main test. In the case of performing the auxiliary test in this way, the auxiliary tester AT generates a test signal and applies it to the electronic component, and transmits a response signal fed back from the electronic component to the tester through the circuit EC and the connector C. AT this point, the auxiliary tester AT may amplify and send the response signal to the tester. Of course, according to the embodiment, a case where the auxiliary tester AT only plays a role of generating a test signal and applying the test signal to the electronic component, and the circuit EC is configured such that a response signal fed back from the electronic component is directly transmitted to the tester can be fully considered.

For reference, the power required to drive the auxiliary tester AT may be received from the tester.

Next, description will be made regarding the use of the test board TB. When a plurality of test boards TB on which electronic components are mounted are accommodated in the test chamber, the supply hole SH and the recovery hole RH are closely connected to a flow path of a pipe provided in the test chamber, and the electronic components are electrically connected to the test machine through the circuit EC and the connector C. In the state described above, the main test can be performed by the tester, and as described above, the auxiliary test can also be performed by the auxiliary tester AT. In addition, in order to apply thermal stress to the electronic component, for example, since the accommodation space in the test chamber maintains a high-temperature environment, the temperature adjustment fluid IS recovered after being continuously supplied to the heat insulation space IS. Thus, the auxiliary tester AT can maintain a proper temperature regardless of the temperature environment of the receiving space in the test chamber. For example, in the case of referring to the burn-in test, the temperature of the electronic component IS constituted to be high for the main test, and since the auxiliary test machine AT may itself generate heat during the auxiliary test, it may be preferable to consider supplying a low-temperature-adjusting fluid including LN2 gas to the insulating space IS in order to cope with such a situation.

In addition, the above embodiment describes the case where the auxiliary tester AT generates the test signal. However, depending on the type of test, it is also conceivable to receive an auxiliary test signal for auxiliary test from the tester, and instead, to form an amplifier in the circuit, so that a response signal fed back from the electronic component in response to the auxiliary test signal is amplified and transmitted to the tester. That is, it is also possible to sufficiently consider that the circuit EC of the test board TB is provided with an amplifier, and the auxiliary tester AT is not provided.

< Description about test Chamber-example of being equipped with an insulating space in a test Chamber >

Although the case where the insulating space is formed at the test board TB is described in the above description about the test board TB, the insulating space or the buffer space for protecting the electronic components of the auxiliary tester or the like may be formed by a structure located at the test chamber. In this case, the test board TB may be provided with a heat insulating space, but may not be provided. Such a test chamber according to the present invention is described in the following embodiments.

1. First embodiment concerning the test Chamber

As shown in the schematic diagram of fig. 6, the test chamber 100 according to the present embodiment includes a chamber body 110, an opening/closing door 120, and a temperature adjusting device 130.

The chamber body 110 has a housing space ES (dotted line inner area) for housing the test board TB on which the electronic components are mounted. One side (front side in fig. 6) of the accommodation space ES is opened, so that the test board TB can be supplied to or recovered from the accommodation space ES. In addition, the test board TB accommodated in the accommodation space ES is electrically connected to the test machine by the connection member, and in this case, the test board TB needs to be pushed and appropriately mounted in the accommodation space ES for tight connection between the test board TB and the test machine. Such a chamber body 110 is equipped with a support rail 111 and a dividing plate 112.

The support rail 111 performs a function of guiding movement of the test board TB when the test board TB is carried into or out of the storage space ES, and also performs a function of supporting the test board TB stored in the storage space ES.

The partition plate 112 divides the accommodation space ES into a plurality of independent spaces SS. The plurality of independent spaces SS formed by such dividing plates 112 can block air movement between each other, and can accommodate one test board TB in one independent space SS.

In addition, since the support rail 111 is provided between the dividing plates 112 on both upper and lower sides, as shown in the reference diagram of fig. 7, if the test board TB is installed in the independent space SS, the independent space SS may be divided into the upper first region 1S and the lower second region 2S with the test board TB interposed therebetween. In this case, it is preferable that the first region 1S and the second region 2S are separated into regions thermally isolated from each other in which exchange of air between each other is blocked. That is, each independent space SS is separated into the first region 1S and the second region 2S by the test board TB, the support rail 111, and the partition board 112, and the second region 2S located below the test board TB functions as a heat insulating space. Of course, the electronic components (auxiliary tester or amplifier, etc.) located on the test board TB are exposed to the second area 2S side.

In the present embodiment, since the second region 2S formed below the test board TB by the partition board 112 is opened toward the opening/closing door 120 side, the opening/closing door 120 should be able to be closed when the opening/closing door 120 is closed. For this purpose, the loading member 121 is provided to the opening/closing door 120, so that the independent space SS can be closed by closing the opening/closing door 120, and the first region 1S and the second region 2S are separated to shut off the heat transfer by the mutual convection. Accordingly, in a state where the test board TB is arranged in the independent space SS and the opening/closing door 120 is closed, the air movement between the first area 1S and the second area 2S is blocked, so that the first area 1S can function as a setting space for setting the temperature of the electronic component, and the second area 2S can function as a heat insulating space or a buffer space to an extent that is not affected by the temperature of the setting space or is affected only by conduction or the like.

In order to regulate the temperature of the second region 2S functioning as a heat insulating space or a buffer space, the chamber body 110 is formed with an injection hole IH and a suction hole OH for supplying a temperature regulating fluid on an inner wall constituting the accommodation space ES. Accordingly, the chamber body 110 is provided with the injection pipe IP and the suction pipe OP.

Of course, the injection pipe IP is provided for injecting the temperature adjustment fluid for adjusting the temperature of the second region 2S into the second region 2S, and the suction pipe OP is provided for enabling the supply device to suck the temperature adjustment fluid supplied to the second region 2S through the injection pipe IP from the second region 2S.

For reference, in the present embodiment, since the partition plate 112 is provided in the test chamber 100, the flow path formed by the pipes IP and OP located in the test chamber 100, the injection hole IH and the suction hole OH can be maintained in a stable connection state, and the design of the formation position thereof can be freely performed. That is, the injection hole IH and the suction hole OH may be formed in opposite directions to each other, or may be provided in any direction in consideration of the design with other structures. Further, since the flow paths of the pipes IP and OP are fixedly connected to the injection hole IH and the suction hole OH, a stable flow path for recovering the heat-insulating space or the buffer space serving as the second region 2S after supplying the temperature-adjusting fluid thereto can be ensured.

As described above, the opening/closing door 120 opens or closes the accommodation space ES by opening/closing the open side of the chamber body 110. Of course, the storage space ES must be opened when the test board TB is carried into or out of the storage space ES, and the storage space ES must be closed when the electronic component is tested. In the present embodiment, the independent space SS is separated into the first region 1S and the second region 2S by the test board TB, and the first region 1S and the second region 2S are opened to the opening/closing door 120 side, and the first region 1S and the second region 2S are opened or closed to the opening/closing door 120 side by opening/closing the opening/closing door 120.

The temperature adjusting device 130 adjusts the temperature of the electronic component exposed to the first region side by supplying temperature adjusting air to the first region. Such a temperature adjustment device 130 will be described in detail later.

The present embodiment as described above can be suitably applied to a case where an electronic component such as the auxiliary tester AT, which constitutes the circuit EC, is provided to be exposed toward one (lower) side of the test board TB. The circuit EC or the auxiliary tester AT here is the same as described above with respect to the test board TB.

2. Second embodiment

The test chamber 100 according to the present embodiment also includes a chamber body 110, an opening/closing door 120, and a temperature adjusting device 130.

As in the first embodiment, the chamber body 110 includes a support rail 111 and a dividing plate 112, and further includes an auxiliary tester 113.

The test chamber 100 and the opening and closing door 120 in the present embodiment are identical in configuration to the support rail 111 and the partition plate 112 in the first embodiment, and thus the description thereof is omitted.

However, in the present embodiment, as shown with reference to fig. 8, the difference from the first embodiment is that the auxiliary tester 113 is provided in the test chamber 100. Therefore, for the case according to the present embodiment, the circuit EC of the test board TB is not equipped with electronic components such as the auxiliary tester AT. However, when the test board TB is mounted to the test chamber 100, the auxiliary tester 113 located in the test chamber 100 should have a connection structure capable of electrically connecting with the circuits EC of the test board TB.

As an example of the connection structure, the following structure may be used: the circuit EC of the test board TB is provided with terminals that can be elastically advanced and retracted, so that the circuit EC of the test board TB is electrically connected to the auxiliary tester 113 when the test board TB is completely mounted in the housing space ES. Such a structure may be considered as a terminal or the like using a Ball plug (Ball plug). Of course, it is also conceivable to provide the auxiliary tester 113 with a terminal that can be advanced and retracted elastically.

As another example of the connection structure, the following structure may be used: as schematically shown in fig. 8, when the test board TB is mounted on the support rail 111 and enters the independent space SS, the auxiliary tester 113 is lifted by the lifter 114 such as a cylinder or a motor, and the circuit EC of the test board TB is electrically connected to the auxiliary tester 113. Thus, for the case according to the present example, the test chamber 100 needs to be equipped with a separate elevator 114 for elevating the auxiliary tester 113.

As described above with respect to the additional description of test board TB, auxiliary tester 113 may also be replaced with an amplifier in this embodiment.

3. Third embodiment

The test chamber 100 according to the present embodiment also includes a chamber body 110, an opening/closing door 120, and a temperature adjusting device 130. And, the chamber body 110 includes a support rail 111 and a dividing plate 112. This embodiment IS identical to the first embodiment described above, but as shown in the schematic conceptual diagram of fig. 9, it differs in that the test board TB has an auxiliary tester AT and an insulating space IS according to the examples of fig. 2 to 5.

Therefore, for the case according to the present embodiment, the second region 2S formed between the test plate TB and the partition plate 112 functions as a buffer space for reinforcing the heat insulating function of the heat insulating space IS. That IS, the auxiliary tester AT provided to the test board TB IS not exposed to the buffer space as the second area 2S, but IS exposed to the insulating space IS located AT the test board TB.

The second region 2S as the buffer space performs a function of blocking movement of heat transferred from the lower independent space SS to the test board TB of the independent space SS mounted on the upper side by heat transfer or the like once. Here, a structure capable of conducting heat from the lower independent space SS to the upper independent space SS will be described later.

In addition, in the case according to the present example, the test chamber 100 has a supply pipe SP and a recovery pipe RP for supplying or recovering the temperature adjustment fluid to or from the heat insulation space IS of the test plate TB, and has a spray pipe IP and a suction pipe OP for supplying or recovering the temperature adjustment fluid to or from the second region 2S functioning as a buffer space. Of course, for convenience of explanation, the conceptual diagram of fig. 9 is illustrated in which the respective pipes SP, RP, IP, OP are all visible, but it is preferable that the supply pipe SP and the recovery pipe RP are provided toward the connector C side of the test board TB in correspondence with the supply hole SH and the recovery hole RH of the test board TB of fig. 2.

According to an example, the temperature of the insulation space IS exposed to the auxiliary tester AT IS controlled to about 5 degrees, and the second area 2S functioning as the buffer space IS controlled to about normal temperature or 25 degrees, so that energy can be saved. That IS, the temperature of the temperature adjustment fluid injected into the second region 2S as the buffer space through the injection pipe IP IS set lower than the temperature of the first region 1S and higher than the temperature of the temperature adjustment fluid supplied to the heat insulation space IS through the supply pipe SP. Of course, even if the temperatures of the plurality of regions separated from each other are the same or different from each other depending on the temperature conditions used for the test or the heat generation conditions of the electronic components such as the auxiliary tester AT or the amplifier, the kinds of the supplied temperature adjustment fluid may be appropriately mixed depending on the conditions.

Of course, although the partition plate 112 may be omitted and the heat insulating space IS and the buffer space AS may be provided in the test plate TB AS in the modification of fig. 10, in this case, the thickness of the test plate TB becomes too thick, and therefore, it may be difficult in terms of mobility, management, design of the positions of the pipes to be provided in the test chamber 100, and the like.

As shown in the modification of fig. 11, the following configuration may be considered: instead of providing the insulating space IS in the test board TB, the partition board 112 and the buffer board 115 are placed in the test chamber 100, so that the insulating space IS and the buffer space AS can be provided in their entirety.

< Description of temperature control technology for electronic Components >

The above examples have been described centering on techniques for adjusting the temperature of electronic components such as the auxiliary test machines AT, 113. The temperature of the electronic component is closely related to the temperature regulation of the electronic component mounted on the mounting socket S. The temperature adjustment of the electronic components is performed by the temperature adjustment device 130, which will be described in more detail.

As mentioned in the background, the electronic component is tested in a state where a predetermined temperature environment is maintained. However, with the high integration and advancement of electronic components, more and more self-heating occurs in the electronic components, and thus, the need to adjust the temperature of the electronic components is increasing even during testing. Further, as described above, in the case where the additional auxiliary tester AT, 113 or the amplifier is constituted, a phenomenon in which heat generated in the electronic component affects the electronic component by conduction or the like is expected to occur. Further, the accommodation space ES needs to be divided into separate spaces SS in which movement of heat due to mutual convection is blocked, and thus the temperatures of the accommodated electronic components need to be controlled within the same range. Therefore, new techniques for more precise temperature control for electronic components under test need to be considered.

In general, electronic components mounted on the test board TB mounted in the storage space ES should be tested in a state governed by a temperature environment created manually. Therefore, the test chamber 100 should be equipped with a temperature adjusting device 130 for adjusting the temperature of the electronic components mounted on the test board TB mounted on the chamber body 110. By such a temperature control device 130, a manually controlled temperature environment is established in the accommodation space ES, and for this purpose, as shown in the schematic diagram of fig. 12, the following means have been conventionally adopted: the temperature-adjusting air supplied by the temperature adjusting device 130 is sprayed from one side wall of the test chamber 100 toward the accommodation space ES (refer to an arrow), so that the air passes between the respective test boards TB to uniformly control the temperature of the entire accommodation space ES (refer to patent publication No. 10-2010-0093896). However, in the configuration shown in fig. 12, since the temperature adjustment air cannot be directly injected to the electronic component mounted on the mounting socket S but moves upward of the electronic component, there is a disadvantage in that the temperature adjustment cannot be directly and instantaneously performed, but only indirectly performed.

In addition, according to the test chamber 100 described as an embodiment regarding the above-described test chamber 100, the accommodation space ES is divided into a plurality of independent spaces SS, and the independent spaces SS divide the test board TB into the upper first region 1S and the lower second region 2S with the test board TB interposed therebetween. The electronic component mounted on the mounting socket S is exposed to the first region 1S on the upper side. Therefore, the temperature adjustment of the electronic component must be performed through the first region 1S. Therefore, the test chamber 100 described above can provide the temperature adjusting device 130 of the new form, which constitutes an important feature of the present invention, by the configuration in which the storage space ES is divided into the plurality of independent spaces SS and the independent spaces SS are divided again by the test plate TB.

Fig. 13 shows a new form of temperature regulating device 130 that can be applied to the test chamber 100.

Referring to fig. 13, the temperature adjusting device 130 provided in the test chamber 100 according to the present invention has an air supplier 131, a supply duct 132, an adjusting plate, a spray duct 134, and a branch duct 135.

The air supplier 131 supplies temperature-adjusting air for adjusting the temperature of the accommodating space ES. Such an air supply device 131 supplies temperature-adjusting air from one side P ₁ and sucks temperature-adjusting air passing through the storage space ES from the other side P ₂.

The supply duct 132 is provided for distributing and supplying the temperature-adjusting air supplied from the air supplier 131 to a plurality of positions of the accommodation space ES, that is, positions corresponding to the respective independent spaces SS. As shown in the partial view of fig. 14, such a supply conduit 132 may be divided into a discharge portion 132a, a guide portion 132b, a connection portion 132c, and a re-entry portion 132d.

The discharge portion 132a has a discharge hole DH for discharging temperature-adjusting air: DH ₁、...、DH₂, the drain holes DH are formed at positions corresponding to the respective independent spaces SS. For reference, the temperature-adjusting air discharged through the discharge hole DH is supplied to the injection duct 134 through a branch duct 135 described later.

The guide portion 132b guides the temperature-adjusting air from the air supply 131 to the discharge portion 132a.

The connection portion 132c connects the discharge portion 132a and the guide portion 132b such that the moving direction of the air moving at the discharge portion 132a is converted by 180 degrees from the moving direction of the air moving at the guide portion 132 b.

For reference, as described in the example of fig. 15, the guide portion 132b may not be provided, but may be configured such that the temperature-adjusting air supplied from the air supplier 131 directly enters the linear type discharge portion 132a of the tip blockage. However, in the case of the example of fig. 15, according to the bernoulli's theorem, the air pressure difference occurring between the region where the air discharge holes DH ₁ near the air supply 131 are located and the region where the air discharge holes DH ₂ far from the air supply 131 are located is large, and thus it may be difficult to uniformly distribute the temperature-adjusting air to the respective injection ducts 134. That is, in the example of fig. 15, since the speed of the temperature-adjusting air is smaller and the air pressure is larger as it is farther from the air supplier 131, a large difference occurs in the discharge amount of the temperature-adjusting air through the respective discharge holes DH ₁、……、DH₂. Of course, in the case of fig. 15, if the discharge holes DH ₁、……、DH₂ are formed differently in size or the adjustment plate is configured to adjust the size of the discharge holes DH ₁、……、DH₂, the discharge amount can be controlled to some extent, but it may be difficult to control the flow of complicated temperature-adjusting air simply by adjusting the size of the discharge holes DH ₁、……、DH₂.

Therefore, as shown in fig. 14, in the present embodiment, it is designed to: by utilizing the phenomenon that the movement direction of the temperature-adjusting air is switched 180 degrees at the connection portion 132c and the movement of the temperature-adjusting air stagnates in this region, the air pressures of the region where the first discharge hole DH ₁ is located and the region where the last discharge hole DH ₂ is located can be made as uniform as possible on the movement line of the temperature-adjusting air.

The re-entry portion 132d is provided for allowing the temperature-adjusting air to pass through the last discharge hole DH ₂ and then enter the guide portion 132b to circulate the temperature-adjusting air in the supply duct 132. By providing the reentrant portion 132d in such a manner that the end of the exhaust portion 132a is not closed as described above, the air pressure difference between the area where the air pressure first exhaust hole DH ₁ is located and the area where the air pressure last exhaust hole DH ₂ is located, and thus all the exhaust holes DH, is further reduced on the moving line of the air: the air pressure in the region of DH ₁、……、DH₂ can be more uniform. For reference, as shown in fig. 16, even when the supply duct 132 is formed in a U shape, stagnation of air occurs in the connection portion 132c for switching the moving direction of air, but since the air pressure of the area where the last discharge hole DH ₂ is located is the largest, the amount of air discharged from the last discharge hole DH ₂ is the largest, and in this case, there is a possibility that temperature deviation occurs in the electronic components respectively accommodated in the independent spaces SS. Therefore, as shown in fig. 14, in the present embodiment, the end of the discharge portion 132a is opened to be connected to the guide portion 132b, so that the air pressure of the area where the last discharge hole DH ₂ is located is reduced according to the bernoulli's theorem, and all the discharge holes DH: the air pressure in the region of DH ₁、……、DH₂ can be uniform with each other.

In addition, the discharging portion 132a and the guiding portion 132b are provided together on one side with the accommodation space ES as a reference, so that not only the entire width of the apparatus can be reduced, but also the design of the re-entry portion 132d can be simply solved. Of course, in terms of reducing the overall width of the apparatus, it is preferable that the distance between the side discharge portion 132a and the accommodation space ES is the same as the distance between the guide portion 132b and the accommodation space ES. That is, as shown in fig. 17, the distance from the center line C ₁ of the discharge portion 132a to the center line C ₂ of the storage space ES and the distance from the center line C ₁ of the guide portion 132b to the center line C ₂ of the storage space ES are designed to be the same when viewed from the plane. However, depending on the implementation, the distance between the discharge portion 132a and the accommodation space ES and the distance between the guide portion 132b and the accommodation space ES may be made different by making the areas of the flow paths of the discharge portion 132a and the guide portion 132b different.

Next, referring to a partial view of fig. 18 in which a part of the supply conduit 132 is exploded, the adjustment plate 133 is provided for performing a function of a valve for adjusting the size of the discharge hole DH. The reason for this is that, in consideration of the fact that even with the various arrangements mentioned above, there is a possibility that there is a pressure difference in the respective areas of the discharge portion 132a, the temperature-adjusting air is uniformly distributed to the injection duct 134 by individually adjusting the size of the discharge hole DH. That is, the air pressure difference in each section may occur in the discharge holes DH due to complicated fluid mechanics in the discharge portion 132a, and the amounts of the temperature-adjusting air discharged from the respective discharge holes DH may be different from each other for this reason. Therefore, the size of the discharge holes DH (specifically, the discharge area of the air passing through the discharge holes) is adjusted by the adjustment plate 133, so that the temperature-adjusting air can be uniformly distributed to the injection duct 134. Of course, if the size of the discharge hole DH is formed differently depending on the position in consideration of the fluid mechanics, the adjustment plate 133 may be omitted. However, in the case where the discharge holes DH are formed differently in size, it is necessary to consider various variables such as flow rate, cross-sectional area of the flow path, and the like, and depending on the test temperature environmental conditions, the flow rate, and the like may act as variables, resulting in occurrence of a test failure. Therefore, it may be more preferable and easier to consider the case of adjusting the size of the discharge hole DH with the adjusting plate 133.

In the present embodiment, the size of the discharge hole can be set by the operator operating the adjustment plate 133 in a sliding manner, and thus for such setting, as shown in fig. 18, a case where one side surface F of the supply conduit 132 is detachably provided is exemplified. However, according to the implementation, a case where the supply duct 132 is provided as one body and the adjustment plate 133 is provided to be automatically operated by a separate driving source may also be considered.

As shown with reference to fig. 19, the ejection ducts 134 are located at the accommodation space ES at predetermined intervals from each other, and are arranged in a one-to-one facing manner with the plurality of test boards TB. In the present embodiment, one adjustment plate 133 is accommodated in one independent space SS so as to face the test plate TB located in the independent space SS. That is, the ejection surface of the ejection duct 134 for ejecting the temperature-adjusting air faces the surface of the electronic component on which the test board TB is mounted (the surface on which the mounting socket is mounted). Such a jet duct 134 must jet the temperature-adjusting air from the supply duct 131 and the branch duct 135 toward the test board TB. For this reason, as shown in fig. 20, the injection holes IH are formed in the injection duct 134 in a one-to-one correspondence with the electronic components loaded on the test board TB. According to the present embodiment, as described with reference to fig. 19, since the ejection duct 134 is located on the upper side of the independent space SS, if the independent space SS is separated by the test board TB, it will be located in the first area 1S and face the electronic components loaded on the test board TB. Accordingly, the air ejected from the ejection duct 134 is ejected directly toward the electronic component, and the temperature of only the first region 1S of the independent space SS is adjusted. Since the air ejected from the ejection duct 134 is ejected directly toward the electronic component, the temperature of the electronic component can be controlled at a higher speed than in the related art. Further, since the first region 1S, which is a space where the temperature must be adjusted, is narrowed as compared with the conventional one, the temperature adjustment can be performed more quickly, and the energy consumption can be reduced accordingly. Then, the air ejected to the first region 1S through the ejection duct 134 moves to the recovery chamber RR located outside the independent space SS, and is then recovered to the air supplier 131.

As shown in fig. 20, the injection duct 134 is provided with a guide member 134a, and the guide member 134a guides the movement of the temperature adjustment air, so that the inflow temperature adjustment air is uniformly distributed to the injection holes IH and injected.

The guide member 134a includes a switching plate TP and a securing plate GP.

The switching plate TP is provided to switch the direction of the temperature adjustment air flowing in the direction indicated by the arrow a.

The ensuring plate GP blocks the temperature-adjusting air from passing through the corresponding position, and thereby ensures a moving path (see arrow b) so that the temperature-adjusting air having been converted by the conversion plate TP in the direction is passed over the entire area of the injection duct 134.

As described above, the guide member 134a is provided, and as shown in fig. 20, the injection hole IH is formed in a region other than a path (see arrow a) through which the temperature adjustment air flows into the injection duct 134 to reach the changeover plate TP. That is, the injection hole IH is not formed on the path (arrow a) where the temperature adjustment air flowing into the injection duct 134 reaches the switching plate TP. Therefore, the temperature adjustment air flowing into the injection duct 134 is changed in moving direction by the changeover plate TP, and further flows back through the entire injection surface where the injection holes IH are located by bypassing the path blocked by the securing plate GP as shown by the arrow b, so that the temperature adjustment air can be injected relatively uniformly through the respective injection holes IH.

The branch duct 135 is provided to provide a path for moving the temperature control air discharged from the supply duct 132 through the discharge hole DH to the injection duct 134, and is provided in a plurality to form a flow path branched from the supply duct 132 by the number of the discharge holes DH.

According to the temperature adjusting device 130 as described above, the temperature adjusting air supplied from the air supplier 131 flows into the injection duct 134 through the supply duct 132 and the branch duct 135, and is then injected into the independent space SS through the injection hole IH. The temperature-adjusting air injected into the independent space SS creates a temperature environment of the independent space SS while adjusting the temperature of the electronic components, and then flows out to the outside and is recovered again to the air supplier 131 through the recovery chamber RR.

From the above description, the case where the insulating space IS of the test plate TB or the second region 2S (serving as an insulating space or buffer space) provided in the test chamber 100 IS separated from the first region 1S by the test plate TB has been described. But the insulating space IS or the second region 2S IS also affected by the thermal environment of the first region 1S created by the temperature adjusting device 130 or the temperature state of the electronic components due to a minute gap or heat conduction or the like that may exist in the test board TB. Therefore, as mentioned above, in order to protect electronic components such as the auxiliary test machines AT, 113, it IS necessary to control the temperature of the insulating space IS or the second region 2S to be different from the temperature of the first region 1S.

For reference, the second region 2S of the independent space SS located at the upper side is separated from the first region 1S of the independent space SS located at the lower side by the dividing plate 112, but the heat of the high temperature of the first region 1S of the independent space SS located at the lower side may also be moved to the second region 2S of the independent space SS located at the upper side by conduction or the like. Therefore, it is preferable that the buffer space described above is provided so as not to be directly affected by the high temperature created by the first region 1S of the independent space SS located at the lower side. At this time, in order to save energy, the temperature of the buffer space may be preferably considered to be higher than the temperature of the insulating space IS and lower than the temperature of the first region 1S.

According to the present embodiment described above, as shown in fig. 19, a structure is adopted in which one injection duct 134 is arranged for each independent space SS. However, as shown in fig. 21, in the case where the storage space ES is not divided into the individual spaces SS by the individual dividing plates 112, the temperature adjusting device 130 according to the present invention having a structure of directly injecting the temperature adjusting air toward the electronic components may be applied.

Further, as a result of further examining the features of the test chamber 100 according to the present invention with reference to fig. 19 and 21, it is understood that the plurality of test plates TB may be accommodated in the accommodation space ES in a state of being arranged in the up-down direction with being spaced apart from each other, and the ejection ducts 134 may be arranged to face the plurality of test plates TB one to one. Therefore, the injection ducts 134 other than the injection duct 134 located at one side (upper side in the present embodiment) are located between the test boards TB adjacent to each other.

In addition, the temperature-adjusting air passing through the discharging portion 132a by the re-entering portion 132d may merge again into the guiding portion 132b after passing through the discharging portion 132 a. Therefore, a deviation may occur between the temperature of the temperature-adjusting air supplied from the air supplier 131 and the temperature of the temperature-adjusting air injected from the injection duct 134. If the temperature of the temperature adjustment air varies between the two positions as described above, the electronic component may not be tested under the temperature conditions actually required. To prevent this, as shown with reference to fig. 13, it is preferable to be equipped with a first temperature sensor TS ₁ for sensing the temperature of the temperature-adjusting air supplied from the air supply 131 and a second temperature sensor TS ₂ for sensing the temperature of the temperature-adjusting air injected from the injection duct 134. In this case, the temperature deviation sensed at the two temperature sensors TS ₁、TS₂ is continuously monitored, and the temperature of the temperature-adjusting air supplied from the air supplier 131 is adjusted whenever necessary, so that the temperature of the electronic component can be more precisely controlled.

< Reference matters >

As described above, the first region 1S should be created for a temperature environment for adjusting the temperature of the electronic component, and the insulating space IS should be created for a temperature environment for adjusting the temperature of the heat-generating electronic component such as the auxiliary tester AT, 113 or the amplifier. Also, the buffer space AS (including an example in which the second region functions AS a buffer space) needs to create a temperature environment such that the thermal state of the first region 1S on the lower side does not affect the insulating space IS.

Therefore, when considering various test temperature conditions, the first region 1S, the insulating space IS, and the buffer space AS (when the second region functions AS a buffer space), must be able to be controlled to mutually different temperatures.

For example, the temperatures of the respective spaces 1S, IS, AS may be controlled to various forms according to the test temperature conditions.

The temperature of the first region 1S may be highest and the temperature of the insulation space IS lowest when testing at high temperature. At this time, the temperature of the buffer space AS has a value between the temperature of the first region 1S and the temperature of the insulating space IS.

But when testing at low temperature, the temperature of the first region 1S IS the lowest, and in order to prevent dew condensation, the temperature of the insulating space IS should be controlled to be higher than the temperature of the first region 1S. At this time, since the buffer space AS IS in contact with the lower first region 1S, the temperature of the heat insulating space IS needs to be controlled to be higher than the temperature of the buffer space AS or at least to be the same AS each other. Of course, in order to prevent the dew condensation phenomenon at the time of the low temperature test, it IS necessary to supply the dry temperature adjusting fluid to the heat insulating space IS.

In the above description, the method of injecting the temperature adjusting fluid into the electronic component is adopted for adjusting the temperature of the electronic component. But may require more precise temperature control for the electronic components, in which case deformations such as those described below with respect to the test board TB and the test chamber 100 may be required.

< Modification >

1. Modification to test plate

As described with reference to the perspective view of fig. 22 and the sectional view of fig. 23, the test board TB according to the present modification takes an example having the heat insulating space IS itself.

The test board TB according to the present modification has the following structure: the upper side of the circuit board CB has a mounting socket S, and the lower side of the circuit board CB is equipped with an auxiliary tester AT (or other electronic components as well). According to such a basic structure, the test board TB according to the present modification also includes the heat conductor TE and the conductive bump CP, and the shielding material SE is also characterized.

The heat conductor TE is provided below the auxiliary tester AT as a heat conductive pad made of a nonmetallic material excellent in heat conductivity. Such a heat conductor TE is nonmetallic and soft, and can compensate for errors caused by manufacturing tolerances, design tolerances, and the like of the corresponding structure of the test chamber 100, which will be described later.

The conductive bump CP is made of a metallic material having excellent thermal conductivity, and is provided on the lower side of the heat conductor.

The heat conductor TE and the conduction protrusion CP are configured to conduct cool air from a cooling plate 141 (see fig. 24) described later to the auxiliary tester AT. Therefore, although a single structure of a single conductive member may be provided, as described later, in order to add the function of absorbing and buffering the impact, it is preferable to additionally constitute a nonmetallic material and a soft heat conductor TE. Also, the up-down thickness of the heat conductor TE and the conductive bumps CP may be reduced or increased corresponding to the up-down thickness of the auxiliary tester AT of the pair of test boards TB. For example, as mentioned above, an amplifier AP may be provided instead of the auxiliary tester AT in comparison with (a) and (b) of fig. 23, different electronic components may be used according to the kind of electronic components to be tested, according to the kind of tester, or according to the range of amplification, and since the sizes and heights thereof may all be different accordingly, problems caused by the dimensional change of the electronic components may be prevented by changing the upper and lower thicknesses of the heat conductor TE and the conductive bump CP.

The shielding material SE IS basically provided for forming the insulating space IS in the area where the auxiliary tester AT IS located, and also has a function of transferring the cool air from the cooling plate 141 to the conductive bump CP. For this purpose, the shielding material SE includes a transfer plate DP, an outer wall plate EP, and a partition plate GP.

The transfer plate DP transfers the cold air from the cooling plate 141 to the conductive protrusion CP, thereby finally transferring the cold air to the auxiliary tester AT, and is constructed using a metallic material having good thermal conductivity. Accordingly, the conductive bumps CP may also have a structure integrally formed at the transfer plate DP. In this example, the reason why the heat conductor TE and the conductive protrusion CP are added without adopting a structure in which the transfer plate DP directly contacts the lower surface of the auxiliary tester AT is to prevent damage (function of the heat conductor) of the auxiliary tester AT due to impact occurring when the cooling plate contacts the shielding material SE and to minimize loss of cool air (function of the conductive protrusion) by intensively conducting cool air. These reasons will be described in detail later.

The outer wall plate EP forms a heat insulation space IS together with the transfer plate DP and the partition plate GP, and IS preferably formed of a metal material for maintaining rigidity.

The partition plate GP is interposed between the transfer plate DP and the outer wall plate EP, thereby performing a function of preventing cold air of the transfer plate DP from being conducted to the outer wall plate EP. For this purpose, the partition plate GP is preferably constructed with a nonconductive insulator material. That is, the shielding material SE is provided with the partition plate GP formed by an insulator around the transfer plate DP, so that the cold air existing in the transfer plate DP is not escaped to other positions and is concentrated toward the auxiliary tester AT as the electronic component via the conductive bumps CP.

For reference, the shielding material SE is provided in a form in which the facing groove FG is formed such that the transfer plate DP side in contact with the cooling plate 141 at the lower side portion is located at the upper side with respect to the lower end, and the cooling plate 141 has a structure to be inserted into or removed from the facing groove FG. This will be described in detail later.

2. Description of additional Components of the test Chamber

Fig. 24 illustrates a portion of the test chamber 100 paired with the test plate TB of fig. 22.

The test chamber 100 of fig. 24 is equipped with a transfer device 140 for transferring cool air of the temperature-adjusting fluid from the supply device to the auxiliary test machine AT of the test board TB. The transfer device 140 is located in the second region 2S among the first region 1S and the second region 2S in which the independent space SS is divided by the test board TB. The supply device may be a cooler, and the temperature adjusting fluid may be low-temperature nitrogen gas.

The transfer device 140 includes a cooling plate 141, an elastic member 142, a support frame 143, and an elevator 144.

The cooling plate 141 is formed with a movement path MR through which the temperature adjustment fluid passes, and the cooling plate 141 is made of a metal material having good thermal conductivity. Therefore, the cooling plate 141 is cooled by passing the low-temperature control fluid through the movement path MR. Here, one side of the movement path MR is connected to the injection pipe IP, and the other side is connected to the suction pipe OP. At this time, the injection pipe IP and the suction pipe OP are preferably provided to have flexibility capable of being flexibly bent. The reason for this is that the lifting operation by the lifter 144 should not be disturbed.

The upper end of the elastic member 142 contacts the cooling plate 141 and the lower end contacts the support frame 143, thereby elastically supporting the cooling plate 141 with respect to the support frame 143.

The support frame 143 supports the elastic member 142. And, the upper surface of the support frame 143 is spaced apart from the lower surface of the cooling plate 141 by a predetermined distance d. Therefore, the lower surface of the cooling plate 141 is not in direct contact with the upper surface of the support frame 143.

The lifter 144 lifts the supporting frame 143, thereby finally lifting the spaced cooling plates 141 by the elastic member 142.

3. Description of the work

First, as shown in fig. 24, if the test board TB is inserted into the test chamber 100, the independent space SS is divided into a first region 1S and a second region 2S. At this time, the state in which the cooling plate 141 is lowered is maintained during the insertion of the test plate TB into the test chamber 100, and thus the test plate TB can be properly inserted into the separate space SS of the test chamber 100 without the interference of the cooling plate 141.

Then, when the electronic component is tested, the lifter 144 is operated to raise the cooling plate 141, and as shown in fig. 25, the cooling plate 141 is brought into contact with the transfer plate DP. In this process, the elastic member 142 absorbs the contact impact of the cooling plate 141 and the transfer plate DP, thus preventing damage to the auxiliary tester AT or other structures located on the test board TB. Also, even in the case where the levelness of the transfer plate DP is reduced due to assembly manufacturing tolerances, the elastic member 142 compensates for the levelness, thereby achieving close contact of the transfer plate DP and the cooling plate 141, and further enabling an increase in the transfer force of the cold air.

When the temperature of the auxiliary tester AT increases due to the test of the electronic component, the supply device supplies the cooling fluid in response thereto, and when the cooling plate 141 is cooled by the cooling fluid, the cold air of the cooling plate 141 is transferred to the auxiliary tester AT through the transfer plate DP, the conductive bump CP, and the heat conductor TE. Accordingly, the temperature of the auxiliary tester AT drops to a suitable level.

After that, when the test is completed, the lifter 144 operates to lower the cooling plate 141, and the test board TB is detached from the independent space SS and removed from the test board TB.

In addition, the case where one test board TB is provided with one cooling board 141 is exemplified in the above embodiment, however, as shown in fig. 26, a case where one test board TB is provided with a corresponding plurality of small cooling boards 141a, 141b, 141c, 141d, 141e, 141f may be considered. That is, the respective plane areas of the plurality of small cooling plates 141a, 141b, 141c, 141d, 141e, 141f are smaller than the plane area of the test board TB, however by being provided with the plurality of small cooling plates 141a, 141b, 141c, 141d, 141e, 141f corresponding to one test board TB as described above, the plurality of small cooling plates 141a, 141b, 141c, 141d, 141e, 141f can be elastically supported by the elastic members 142, respectively, even if there are various mechanical tolerances, so that the close contact between the transfer plate DP and the cooling plates 141a, 141b, 141c, 141d, 141e, 141f is more compact.

As described above, although the present invention has been specifically described based on the embodiments with reference to the accompanying drawings, the above embodiments merely illustrate the preferred embodiments of the present invention, and thus the present invention should not be construed as being limited to the above embodiments, and the scope of the claims should be construed according to the scope of the claims and their equivalents.

Claims

1. A test chamber, comprising:

a chamber body having an accommodation space for accommodating a test board on which electronic components are mounted,

The chamber body includes:

And a transmission device for transmitting the cool air of the temperature adjusting fluid to the electronic components constituting the circuit of the test board.

2. The test chamber of claim 1, wherein,

The transfer device includes:

a cooling plate for delivering cool air to the electronic components located on the test board; and

And an elevator for elevating the cooling plate to enable the cooling plate to transmit cold air to the electronic component or to release contact between the cooling plate and the test plate.

3. The test chamber of claim 2, wherein,

4. The test chamber of claim 2, wherein,

The transfer device further includes:

And an elastic member elastically supporting the cooling plate.