TWI418822B - Test apparatus - Google Patents

Description

Test Equipment

The present invention relates to a test apparatus, and more particularly to a test apparatus having overall and local temperature control capabilities.

In order to control the quality of the output, after the electronic product is finished, it is subject to the test procedure; and the tested electronic products can enter the next stage of the process. In order to stabilize the test results, usually the electronic product to be tested is placed in an environmental control box to test the temperature to control the ambient temperature of the electronic product and its own temperature.

The general environmental control box has an internal space, and a plurality of electronic products to be tested are placed in the internal space for testing. The environmental control box is equipped with a temperature control system and a humidity control system to control the air temperature and humidity of the interior space. When a plurality of electronic products to be tested are tested, their self-heating will be radiated into the air in the internal space. Since the air in the internal space is controlled, the electronic product to be tested can maintain a stable temperature during testing. However, due to the air heat transfer performance, when the electronic product to be tested is tested, there is a difference between the temperature and the air in the internal space.

The electronic product to be tested with low power has less self-heating, so when tested, the heat can be well dissipated, and its temperature is close to the air temperature of the internal space, so the electron to be tested can be achieved by controlling the temperature of the internal space air. Product temperature control. Relatively speaking, the electronic product to be tested with high power is self-heating, and the heat of the electronic product to be tested is not easy to dissipate. The heat accumulation causes the temperature of the electronic product to be quite different from the air temperature of the internal space, so that the temperature of the electronic product to be tested is difficult to be based on the internal space. Air temperature control is controlled at the target temperature.

One object of the present invention is to provide a test device having a temperature control system that can temperature-control the test environment within the test device as a whole and locally temperature-control the electronic component to be tested. Thereby, the electronic component to be tested can be maintained at a target temperature range during testing.

According to the above object, an embodiment of the invention discloses a testing device, which comprises a box body, a temperature control device, a carrier board and a heat dissipation module. The cabinet contains an accommodation space. The temperature control device is configured to control the temperature of the air within the housing space. The carrier board has a circuit and a placement area. The resettlement area is used to house an electronic component to be tested. The circuit is electrically connected to the electronic component to be tested, and transmits a signal when the electronic component to be tested is tested. When the carrier board is inserted into the box, the placement area is located in the accommodating space. The heat dissipation module is placed next to the carrier. The heat dissipation module includes a thermoelectric cooler, and the thermoelectric cooler is thermally coupled to the electronic component to be tested to cool the electronic component to be tested.

The technical features and advantages of the present disclosure have been broadly described above, and the detailed description of the present disclosure will be better understood. Other technical features and advantages of the subject matter of the claims of the present disclosure will be described below. It will be appreciated by those skilled in the art that the present invention may be practiced with the same or equivalents. It is also to be understood by those of ordinary skill in the art that this invention is not limited to the spirit and scope of the disclosure as defined by the appended claims.

Referring to FIG. 1 , FIG. 5 , FIG. 8 and FIG. 12 , the test apparatus 1 of one embodiment of the present invention comprises a carrier module 10 , a test module 30 and a box 11 . The carrier module 10 includes a carrier 12 and a heat dissipation module 13. The housing 11 includes an accommodating space 112, wherein the accommodating space 112 is configured to provide a test environment for the electronic component to be tested. Test module 30 is configured to measure the optical characteristics of the component under test.

The carrier 12 includes a circuit 124 and a placement area 121, wherein the placement area 121 is configured to dispose at least one electronic component to be tested, and the circuit 124 is electrically connected to the at least one electronic component 23 to be tested to provide the at least one to be The electrical energy or signal required for testing the electronic component 23 or the test signal of at least one electronic component 23 to be tested is measured. When the carrier 12 is inserted into the casing 11, the seating area 121 is located in the accommodating space 112.

Referring to Figures 1 to 3, the test apparatus 1 can include a plurality of carrier holders 14. A plurality of grooves may be formed in each of the carrier holding members 14, wherein the grooves of the carrier holding members 14 are correspondingly disposed, and are configured to guide the movement of the carrier 12 when the carrier 12 is inserted into the case 11. And supporting the carrier 12 when the carrier 12 is inserted into the positioning.

Furthermore, referring to FIGS. 2 to 4, the test apparatus 1 can include a temperature control device 2 configured to globally control the temperature within the accommodating space 112.

In one embodiment of the present invention, the test device 1 can include a circulation passage 15 and the temperature control device 2 includes a flow device (e.g., a fan) 16. The circulation passage 15 is configured to open the accommodating space 112, and the flow device 16 is configured to control the flow of air within the accommodating space 112 and allow the air to flow through the circulation passage 15 for circulation.

The temperature control device 2 may further comprise a plurality of fins 17 and a line 18. The plurality of fins 17 are disposed on the circulation path of the air in the accommodating space 112, so that the air in the accommodating space 112 can be cooled. The plurality of fins 17 are fixed to the pipe 18 formed by the turns, and the cooling water is allowed to flow through the pipes 18, thereby cooling the plurality of fins 17.

In particular, as shown in FIGS. 2, 5 and 6, the test apparatus 1 includes a partition 19 that divides a portion of the space within the casing 11 into an accommodation space 112 and a circulation passage 15. In an embodiment of the present invention, the partitioning member 19 partitions a portion of the space in the casing 11 from above and below, and the partitioning member 19 is configured to cover the accommodating space 112, and a plurality of openings 191 may be formed thereon, and the openings are formed. The 191 is inserted through the partitioning member 19 so that the circulation passage 15 and the accommodating space 112 can be connected at the openings 191. In an embodiment of the present invention, the openings 191 are adjacent to the opening 111 of the casing 11. In one embodiment of the present invention, the spacer 19 can be a plate member.

Referring to FIGS. 2, 5 and 6, the casing 11 includes a half-closed space 113, and the semi-closed space 113 communicates with the outside through the opening 111. The accommodation space 112 and the circulation passage 15 are located in the semi-closed space 113 and close to the opening 111. A stencil 20 is disposed behind the accommodating space 112, and the flow device 16 is disposed in the semi-closed space 113 and behind the stencil 20. The flow device 16 and the partition member 19 are disposed in cooperation, so that the air in the semi-closed space 113 can circulate, thereby driving the air in the accommodating space 112 to circulate.

Referring to FIG. 2 again, the temperature control device 2 can further include a heater 21, a thermometer 22, and a proportional-integral-derivative controller (PID) device (not shown), wherein the heater 21 and the thermometer 22 The PID device is coupled to control the temperature of the housing space 112 of the cabinet 11.

Referring to FIGS. 7-9 and 15, in one embodiment of the present invention, the heat dissipation module 13 is disposed adjacent to the carrier 12 and includes a thermoelectric cooler 131. The plurality of electronic components 23 to be tested are disposed on the mounting area 121 of the carrier 12, and the thermoelectric coolers 131 are thermally coupled to the plurality of electronic components 23 to be tested to cool the plurality of electronic components 23 to be tested. The plurality of electronic components 23 to be tested are cooled by the thermoelectric cooler 131, and the temperature of the plurality of electronic components 23 to be tested can be controlled to a target temperature in the vicinity of the test, especially when the plurality of electronic components 23 to be tested are high-power. When the electronic components.

In one embodiment of the present disclosure, the heat dissipation module 13 may further include a passive heat sink 132. The passive heat sink 132 is thermally coupled to the thermoelectric cooler 131 to dissipate the heat generated by the thermoelectric cooler 131 to the circulating air in the tank 11.

In one embodiment of the present invention, the heat dissipation module 13 may further include a heat conducting component 133 disposed between the plurality of electronic components 23 to be tested and the thermoelectric cooler 131, and thermally coupled to the plurality of components to be tested. The electronic component 23 is interposed between the thermoelectric cooler 131 so that the thermoelectric cooler 131 can cool a plurality of electronic components 23 to be tested.

In one embodiment of the present invention, the carrier module 10 can further include a pivoting member 134. The pivoting member 134 can pivot the heat dissipation module 13 relative to the carrier 12 (as indicated by the arrow).

In particular, as shown in FIGS. 7 and 9, the carrier module 10 includes a frame 101, and the frame 101 is configured to fix the heat dissipation module 13, and the heat dissipation module 13 can be opposed to the heat dissipation module 13 by the frame 101. The carrier 12 is pivoted. In detail, the carrier 12 and the frame 101 are connected by a pivoting member 134, the heat conducting member 133 is fixed on the passive heat sink 132, and the thermoelectric cooler 131 is clamped between the heat conducting member 133 and the passive heat sink 132, and is passive. The heat sink 132 is fixed to the frame 101. In this manner, the heat dissipation module 13 can be attached to the plurality of electronic components 23 to be tested or moved away from the plurality of electronic components 23 to be tested by pivoting the frame 101.

In addition, referring to FIGS. 1, 7, and 9, the carrier module 10 can include a front panel 103 and a connection circuit board 104. The connection circuit board 104 is disposed parallel to the carrier board 12, and the two are electrically connected. The front panel 103 is disposed to cover a portion of the opening 111 of the casing 11, and the connecting circuit board 104 is fixed to the front panel 103 in a vertical manner. The frame body 101 can be fixed to the front panel 103, and the carrier board 12 and the front panel 103 can be locked by the locking member 24. The connection structure can firmly fit the heat dissipation module 13 and the plurality of electronic components 23 to be tested. In order to achieve better heat transfer effect.

Furthermore, referring to FIGS. 9 through 12, the carrier module 10 can include a cover member 102. The cover member 102 is circumferentially disposed on the heat conducting member 133 and shields the periphery of the plurality of electronic components 23 to be tested. The cover member 102 can also be fixed to the passive heat sink 132. In addition, the connection circuit board 104 includes a plurality of electrical connection points 109 that are configured to electrically receive the electronic component 23 and the connector 110 of the front panel 103.

In one embodiment of the present invention, the passive heat sink 132 includes a plurality of heat radiating fins, and the plurality of heat radiating fins are disposed to be parallel to each other and extend in a circulating flow direction of the air in the accommodating space 112, so that the flowing air can be in phase Flow between adjacent fins to increase heat dissipation efficiency.

Referring to FIG. 12, a plurality of positioning members 122 may be protruded from the mounting area 121 of the carrier 12, and the electronic components 23 to be tested may be fixed at a position by the positioning members 122.

Further, referring to FIGS. 12, 13, 14, and 15, in one embodiment of the present invention, the electronic component 23 to be tested may include a light emitting diode 232. The heat sink of the LED 232 is thermally coupled to an interposer 231. The interposer 231 can form a plurality of notches 233. The notches 233 are matched with the positioning member 122 to allow the LED 232 to be placed. Put it in a fixed position.

Referring to FIG. 13, a plurality of through holes 123 may be formed in the carrier 12. The through hole 123 is disposed at a fixed position of the corresponding light emitting diode 232. When the interposer 231 is placed at a corresponding fixed position on one side of the carrier 12, the LEDs 232 are located in the corresponding through holes 123. Thus, the LED 232 can be exposed on the other side of the carrier 12 so that the light emitted during the test can be measured.

Referring to FIGS. 13 and 14, an electrode pad 234 may be disposed on each of the interposers 231, and the electrode pads 234 are electrically connected to the electrodes corresponding to the LEDs 232. The carrier module 10 can include a plurality of probes 105. The plurality of probes 105 protrude from the carrier 12 and are configured to electrically connect the circuitry on the carrier 12, and when the interposer 231 is disposed, the electrode pads 234 on the interposer 231 are accessible. Through the probes 105, the signals required for the LED 232 test can be provided, and/or the voltage-current characteristic curve of the LEDs 232 can be measured.

As shown in FIG. 7, the carrier module 10 can further include an opaque cover 106. The cover 106 can form a plurality of openings 107. The openings 107 cooperate with the through holes 123 of the carrier 12. The openings 107 are isolated from each other such that the LEDs 232 do not interfere with each other during testing. In addition, referring to FIG. 14 , the carrier module 10 further includes two heat insulating members 108 respectively disposed on opposite sides of the carrier 12 , adjacent to the connecting circuit board 104 , and inserted transversely to the carrier 12 . The direction is extended to reduce the external environment from the opening 111 of the box 11 to affect the temperature control of the accommodating space 112.

Briefly, one embodiment of the present disclosure discloses a test device including a case, a temperature control device, and a heat dissipation module. The temperature control device controls the overall air temperature inside the box, and the heat dissipation module controls the temperature of the electronic component to be tested. Therefore, the test apparatus of the present invention can control the temperature of the low-power or high-power electronic component to the target temperature while maintaining high test stability.

The technical content and the technical features of the present disclosure have been disclosed as above, but those skilled in the art should understand that the teachings and disclosures of the present disclosure are disclosed without departing from the spirit and scope of the disclosure as defined by the appended claims. Can be used for various substitutions and modifications. For example, many of the processes disclosed above may be implemented in different ways or in other processes, or a combination of the two.

Moreover, the scope of the present invention is not limited to the particular process, machine, manufacture, composition, means, method or method of the particular embodiments disclosed. It should be understood by those of ordinary skill in the art that, based on the teachings of the present disclosure, the process, the machine, the manufacture, the composition of the material, the device, the method, or the steps, whether present or future developers, The revealer performs substantially the same function in substantially the same manner, and achieves substantially the same result, and can also be used in the present disclosure. Accordingly, the scope of the following claims is intended to cover such <RTIgt; </ RTI> processes, machines, manufactures, compositions, devices, methods or steps.

1. . . Test Equipment

2. . . Temperature control device

10. . . Carrier module

11. . . Box

12. . . Carrier board

13. . . Thermal module

14. . . Carrier retainer

15. . . Circulation channel

16. . . Mobile device

17. . . heat sink

18. . . Pipeline

19. . . Separator

20. . . Stencil

twenty one. . . Heater

twenty two. . . thermometer

twenty three. . . Electronic component

twenty four. . . Lock firmware

30. . . Test module

101. . . framework

102. . . Cover piece

103. . . Front panel

104. . . Connecting circuit board

105. . . Probe

106. . . Cover

107. . . Opening

108. . . Thermal insulation

109. . . Electrical connection point

110. . . Connector

111. . . Opening

112. . . Housing space

113. . . space

121. . . Resettlement area

122. . . Positioning member

123. . . Through hole

124. . . Circuit

131. . . Thermoelectric cooler

132. . . Passive heat sink

133. . . Heat conductive member

134. . . Pivot

191. . . Opening

231. . . Intermediary board

232. . . Light-emitting diode

233. . . Notch

234. . . Electrode pad

1 is a perspective view showing a test apparatus according to an embodiment of the present invention;

Figure 2 illustrates the interior of the test apparatus of Figure 1;

FIG. 3 illustrates an accommodation space of the test device of FIG. 1;

4 illustrates a heat sink and a pipe according to an embodiment of the present invention;

Figure 5 is a side view of the test apparatus of Figure 2;

Figure 6 is a plan view of the test device of Figure 2;

Figure 7 illustrates a carrier module of an embodiment of the present invention;

FIG. 8 illustrates a heat dissipation module according to an embodiment of the present invention;

9 is a schematic view showing a combination of a heat conductive member, a thermoelectric cooler, and a passive heat sink according to an embodiment of the present invention;

Figure 10 is a schematic view showing the combination of a heat conducting member and a thermoelectric cooler according to an embodiment of the present invention;

Figure 11 illustrates a heat conductive member in accordance with an embodiment of the present invention;

12 is a schematic view showing the arrangement of electronic components to be tested according to an embodiment of the present invention;

Figure 13 illustrates a carrier plate and a through hole therethrough according to an embodiment of the present invention;

14 is a schematic diagram of a probe coupling interposer according to an embodiment of the present invention; and

Figure 15 is a side elevational view showing the combination of a carrier plate, a heat conducting member, a thermoelectric cooler, and a passive heat sink according to an embodiment of the present invention.

10. . . Carrier module

12. . . Carrier board

13. . . Thermal module

14. . . Carrier retainer

16. . . Mobile device

17. . . heat sink

18. . . Pipeline

30. . . Test module

111. . . Opening

112. . . Housing space

121. . . Resettlement area

Claims (14)

A test device comprising: a box body comprising an accommodating space; a temperature control device configured to control air temperature in the accommodating space; a carrier board having a circuit and a arranging area, the arranging area Configuring to mount an electronic component to be tested; the circuit is electrically connected to the electronic component to be tested, and transmits a signal when the electronic component to be tested is tested, wherein the placement area is located when the carrier is inserted into the housing And a heat dissipation module is disposed on the carrier, the heat dissipation module includes a thermoelectric cooler, the thermoelectric cooler is thermally coupled to the electronic component to be tested to cool the electronic component to be tested; The heat dissipation module includes a passive heat sink that is thermally coupled to the thermoelectric cooler to dissipate the thermoelectric cooler. The test device of claim 1, wherein the passive heat sink comprises a plurality of heat sink fins. The test device of claim 1, wherein the heat dissipation module comprises a heat conductive member, wherein the thermoelectric cooler is interposed between the heat conductive member and the passive heat sink. The test device of claim 3, further comprising a frame and a pivoting member, the heat dissipation module being fixed to the frame, and the pivoting member connecting the frame and the carrier. The testing device of claim 4, wherein the heat conducting member is fixed to the passive heat sink, the thermoelectric cooler is clamped between the heat conducting member and the passive heat sink, and the passive heat sink is fixed to the frame on. The test device according to claim 4, further comprising a front panel and a connection Connected to the circuit board, wherein the connecting circuit board is disposed in parallel with the carrier board, the connecting circuit board and the frame body are fixed to the front panel, and the carrier board is locked to the connecting circuit board. The test apparatus of claim 1, wherein the heat dissipation module is configured to pivot relative to the carrier. The test device according to any one of claims 1 to 7, wherein the electronic component to be tested is a light emitting diode, the carrier comprises a uniform through hole, and the through hole is configured to receive the light emitting diode. The test device of claim 1, further comprising a plurality of probes protruding from the carrier and electrically connected to the circuit of the carrier, the complex probe configured to test the light emitting diode body. The testing device of claim 1, further comprising two heat insulating members disposed on opposite sides of the carrier and configured to isolate the receiving space from the environment outside the box. The test apparatus of claim 1, further comprising a circulation passage connecting the accommodating space, wherein the temperature control device comprises a flow device configured to drive air flow in the accommodating space, and The air in the accommodating space is circulated by the circulation passage. The test apparatus according to claim 11, comprising a partitioning member, wherein the partitioning member separates the accommodating space and the circulation passage in the casing. The testing device of claim 12, wherein the spacer comprises a plurality of openings, the plurality of openings communicating with the accommodating space and the circulation channel, wherein the air of the accommodating space is circulated through the openings flow. The test apparatus of claim 1, wherein the temperature control device further comprises: a conduit configured to deliver a cooling liquid; A plurality of fins are fixed on the pipeline, wherein air of the accommodating space circulates through the plurality of fins to cool the air.