CN102539946A - Test equipment - Google Patents
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- CN102539946A CN102539946A CN2010106091171A CN201010609117A CN102539946A CN 102539946 A CN102539946 A CN 102539946A CN 2010106091171 A CN2010106091171 A CN 2010106091171A CN 201010609117 A CN201010609117 A CN 201010609117A CN 102539946 A CN102539946 A CN 102539946A
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- testing apparatus
- support plate
- accommodation space
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Abstract
The invention discloses test equipment, which comprises a case body, a temperature control device, a carrying plate and a radiating module, wherein the case body comprises an accommodation space; the temperature control device is configured so as to control the temperature of the air in the accommodation space; the carrying plate is provided with a circuit and an arrangement area; the arrangement area is used for arranging a electronic element to be tested; the circuit is electrically connected with the electronic element to be tested and transmits a signal when the electronic element to be tested is tested; when the carrying plate is inserted into the case body, the arrangement area is located in the accommodation space; the radiating module is arranged beside the carrying plate; the radiating module comprises a thermoelectric cooler; and the thermoelectric cooler is thermally coupled with the electronic element to be tested so as to cool the electronic element to be tested. The test equipment can maintain high test stability.
Description
Technical field
The present invention relates to a kind of testing apparatus, particularly a kind of testing apparatus with integral body and local temperature control capacity.
Background technology
Be control output quality, electronic product all need pass through test procedure after accomplishing and making; And the electronic product of process test passes, the next stage process of being allowed for access.Be the steady testing result, common electronic product to be measured is positioned over a canister build-in test temperature, during with the test of control electronic product, and its residing environment temperature and the temperature of itself.
General environment control box tool one inner space, a plurality of electronic products to be measured are positioned in this inner space, to test.Canister disposes temperature control system and MCS, with the air themperature and the humidity of control inner space.A plurality of electronic products to be measured are when test, and its spontaneous heating meeting is distributed in the air in the inner space.Because the air of inner space is controlled, therefore electronic product to be measured can be kept stable temperature when test.So, be subject to air heat transfer property ability, when electronic product to be measured is tested, can be variant between the air of its temperature and inner space.
The electronic product spontaneous heating to be measured that power is little is few, so in when test, heat can be well by dissipation, and make the air themperature of its temperature near the inner space, therefore can reach the temperature control of electronic product to be measured through the control of inner space air themperature.Relatively; High-power electronic product spontaneous heating to be measured is many, and electronic product heat to be measured is difficult for dissipation, and heat history makes the air themperature of its temperature and inner space produce suitable gap; Let the temperature difficulty of electronic product to be measured control, be controlled on the target temperature according to the air themperature of inner space.
Summary of the invention
A purpose of the present invention is to provide a testing apparatus, and this testing apparatus has a temperature control system, the test environment in this testing apparatus of this temperature control system temperature control integrally, and temperature control measured electronic elements partly.Whereby, make measured electronic elements when test, can maintain a target temperature range.
According to above-mentioned purpose, one embodiment of the invention discloses a kind of testing apparatus, and it comprises a casing, an attemperating unit, a support plate and a radiating module.Casing comprises an accommodation space.Attemperating unit is through being configured to control the air themperature in the accommodation space.Support plate has a circuit and a settlement.The settlement is used to settle a measured electronic elements.Circuit electrically connects measured electronic elements, and when measured electronic elements is tested, transmits signal, and wherein when support plate inserted casing, the settlement was arranged in accommodation space.The other support plate of being located at of radiating module.Radiating module comprises a thermoelectric cooling module, and thermoelectric cooling module heat couples this measured electronic elements, to cool off this measured electronic elements.
Beneficial effect of the present invention is no matter testing apparatus of the present invention is used to test low-power or high-power electronic component, all can its temperature be controlled on the target temperature, keeps high stable testing degree.
Preceding text are summarized technical characterictic of the present invention and advantage quite widely, are able to obtain preferable understanding so that the present invention of hereinafter describes in detail.Other technical characterictic and the advantage that constitute claim target of the present invention will be described in hereinafter.Under the present invention in the technical field technician should be appreciated that the notion that can quite easily utilize hereinafter to disclose can be used as modification with specific embodiment or designs other structure or technology and realize the purpose identical with the present invention.The technician also should be appreciated that the equivalent construction of this type can't break away from the spirit and scope of the present invention that accompanying Claim defines in the affiliated technical field of the present invention.
Description of drawings
Fig. 1 shows the schematic perspective view of the testing apparatus of one embodiment of the invention;
The inside of the testing apparatus of Fig. 2 illustrated view 1;
The accommodation space of the testing apparatus of Fig. 3 illustrated view 1;
The heat radiator and the pipeline of Fig. 4 illustration one embodiment of the invention;
Fig. 5 is the side view of the testing apparatus of Fig. 2;
Fig. 6 is the vertical view of the testing apparatus of Fig. 2;
The carrier plate module of Fig. 7 illustration one embodiment of the invention;
The radiating module of Fig. 8 illustration one embodiment of the invention;
The combination synoptic diagram of heat-conducting piece, thermoelectric cooling module and the passive radiating piece of Fig. 9 illustration one embodiment of the invention;
The heat-conducting piece of Figure 10 illustration one embodiment of the invention and the combination synoptic diagram of thermoelectric cooling module;
The heat-conducting piece of Figure 11 illustration one embodiment of the invention;
Figure 12 is the arrangement synoptic diagram of the measured electronic elements of one embodiment of the invention;
The support plate of Figure 13 illustration one embodiment of the invention and on through hole;
Figure 14 couples the synoptic diagram of intermediate plate for the probe of one embodiment of the invention; And
Figure 15 shows the combination schematic side view of support plate, heat-conducting piece, thermoelectric cooling module and the passive radiating piece of one embodiment of the invention.
Wherein, description of reference numerals is following:
1 testing apparatus
2 attemperating units
10 carrier plate modules
11 casings
12 support plates
13 radiating modules
14 support plate retaining pieces
15 circulation passages
16 flow devices
17 heat radiator
18 pipelines
19 separators
20 web plates
21 well heaters
22 thermometers
23 electronic components
24 locking parts
30 test modules
101 frameworks
102 outer cover parts
103 front panels
104 CC plates
105 probes
106 hide
107 perforates
108 thermal insulation barriers
109 electric connection points
110 connectors
111 openings
112 accommodation spaces
113 spaces
121 settlements
122 keepers
123 through holes
124 circuit
131 thermoelectric cooling modules
132 passive radiating pieces
133 heat-conducting pieces
134 articulated parts
191 perforates
231 intermediate plates
232 light emitting diodes
233 recesses
234 electronic padses
Embodiment
With reference to Fig. 1, Fig. 5, Fig. 8 and shown in Figure 12, the testing apparatus 1 of one embodiment of the invention comprises a carrier plate module 10, test module 30 and a casing 11.Carrier plate module 10 comprises a support plate 12 and a radiating module 13.Casing 11 comprises an accommodation space 112, and wherein this accommodation space 112 is through being configured to provide measured electronic elements one test environment.Test module 30 is through being configured to measure the optical characteristics of element under test.
Referring to figs. 1 through shown in Figure 3, testing apparatus 1 can comprise a plurality of support plate retaining pieces 14.Can form a plurality of grooves on each support plate retaining piece 14; Said a plurality of groove relative set of wherein said a plurality of support plate retaining pieces 14, and through being configured to when support plate 12 inserts casing 11, to guide moving of support plate 12; And when support plate 12 is inserted to the location, support this support plate 12.
Moreover to shown in Figure 4, testing apparatus 1 can comprise an attemperating unit 2 with reference to Fig. 2, and this attemperating unit 2 is controlled the temperature in this accommodation space 112 through being configured to integrally (globally).
In one embodiment of this invention, proving installation 1 can comprise a circulation passage 15, and this attemperating unit 2 comprises a mobile device (for example fan) 16.Circulation passage 15 is through being configured to lead to this accommodation space 112, and flow device 16 is through being configured to control the air flow in the accommodation space 112, and makes this air can be through circulation passage 15 to circulate.
The spy's, with reference to Fig. 2, Fig. 5 and shown in Figure 6, testing apparatus 1 comprises a separator 19, and separator 19 is divided into accommodation space 112 and circulation passage 15 with the segment space in the casing 11.In one embodiment of this invention; Separator 19 is done the segment space in the casing 11 up and down and is separated; Separator 19 is through being configured to cover accommodation space 112; Also can form a plurality of perforates 191 on it, said a plurality of perforates 191 run through separator 19, so that circulation passage 15 can lead in said a plurality of perforates 191 places with accommodation space 112.In one embodiment of this invention, said a plurality of perforate 191 is near the opening 111 of casing 11.In one embodiment of this invention, separator 19 can be a plate-like piece.
With reference to Fig. 2, Fig. 5 and shown in Figure 6, casing 11 comprises half confined space 113, and lead to through opening 111 and outside in semi-hermetic space 113, and accommodation space 112 is positioned at semi-hermetic space 113 with circulation passage 15, near opening 111.The rear of accommodation space 112 is provided with a web plate 20, and flow device 16 is located in the semi-hermetic space 113, web plate 20 rears.Both are equipped with flow device 16 and separator 19, thereby make capable of circulation the flowing of air in the semi-hermetic space 113, and then the air circulation that drive in the accommodation space 112 flow.
Join shown in Figure 2 again; Attemperating unit 2 can also comprise a well heater 21, a thermometer 22 and a proportional-integral derivative controller (PID) device (not being shown among the figure); Wherein well heater 21 couples the PID device with thermometer 22, so as to the temperature of the accommodation space 112 of control casing 11.
With reference to Fig. 7～Fig. 9 and shown in Figure 15, one embodiment of the invention, support plate 12 is located on radiating module 13 sides, and it comprises a thermoelectric cooling module (thermoelectric cooler) 131.A plurality of measured electronic elements 23 are placed in the settlement 121 on the support plate 12, and thermoelectric cooling module 131 heat couple said a plurality of measured electronic elements 23, to cool off said a plurality of measured electronic elements 23.Utilize a plurality of measured electronic elements 23 of thermoelectric cooling module 131 cooling, can be when test nearby the temperature of a plurality of measured electronic elements 23 be controlled on the target temperature, especially when a plurality of measured electronic elements 23 are high-power electronic component.
In one embodiment of this invention, radiating module 13 also can comprise a passive radiating piece 132.Passive radiating piece 132 heat couple thermoelectric cooling module 131, dissipate to the circulating air in the casing 11 with the heat production with this thermoelectric cooling module 131.
In one embodiment of this invention; Radiating module 13 can also comprise a heat-conducting piece 133; Heat-conducting piece 133 is arranged between a plurality of measured electronic elements 23 and this thermoelectric cooling module 131; And heat couples between a plurality of measured electronic elements 23 and this thermoelectric cooling module 131, so that thermoelectric cooling module 131 can cool off a plurality of measured electronic elements 23.
In one embodiment of this invention, carrier plate module 10 can also comprise an articulated part 134, can make radiating module 13 with respect to support plate 12 pivots (shown in arrow) through articulated part 134.
Special speech, with reference to Fig. 7 and shown in Figure 9, carrier plate module 10 comprises a framework 101, and framework 101 is through being configured to fixedly radiating module 13, and can let radiating module 13 with respect to support plate 12 pivots through framework 101.In detail, support plate 12 is connected with articulated part 134 with framework 101, and heat-conducting piece 133 is fixed on the passive radiating piece 132, and thermoelectric cooling module 131 is clamped between heat-conducting piece 133 and the passive radiating piece 132, and passive radiating piece 132 is fixed on framework 101.So, radiating module 13 can pass through pivot framework 101, to fit a plurality of measured electronic elements 23 or move away said a plurality of measured electronic elements 23.
In addition, with reference to Fig. 1, Fig. 7 and Fig. 9, carrier plate module 10 can comprise a front panel 103 and a CC plate 104.CC plate 104 is parallel to support plate 12 and is provided with, and both electrically connect.Front panel 103 is provided with the mode of the part opening 111 of covering casing 11, and CC plate 104 then is fixed on front panel 103 with vertical mode.Framework 101 can be fixed in front panel 103, and 103 locking part 24 lockings capable of using of support plate 12 and front panel, syndeton can firmly be fitted radiating module 13 and a plurality of measured electronic elements 23 whereby, passes effect to reach preferable heat.
Moreover to shown in Figure 12, carrier plate module 10 can comprise an outer cover part 102 with reference to Fig. 9.102 weeks of outer cover part are located at heat-conducting piece 133, and with covering around a plurality of measured electronic elements 23.Outer cover part 102 also can be fixed on the passive radiating piece 132.In addition, CC plate 104 comprises a plurality of electric connection points 109, through being configured to be electrically connected the reception survey electronic component 23 of settlement 121 and the connector 110 of front panel 103.
In one embodiment of this invention; Passive radiating piece 132 comprises a plurality of radiating fins; A plurality of radiating fins so can make moving air between adjacent radiating fin, flow, to increase radiating efficiency through being configured to parallel and extending along the direction that circulates of this air of this accommodation space 112.
With reference to shown in Figure 12, can be convexly equipped with a plurality of keepers 122 on the settlement 121 of support plate 12, and, can each measured electronic elements 23 be fixed on the position through said a plurality of keepers 122.
Again, with reference to Figure 12, Figure 13, Figure 14 and shown in Figure 15, in one embodiment of this invention, measured electronic elements 23 can comprise light emitting diode 232.The radiating seat of light emitting diode 232 (heat sink) heat couples an intermediate plate 231, can form a plurality of recesses 233 on the intermediate plate 231, and said a plurality of recesses 233 cooperate keeper 122, so that light emitting diode 232 can be seated on the fixed position.
With reference to shown in Figure 13, can form a plurality of through holes 123 on the support plate 12.The fixed position of through hole 123 corresponding light emitting diodes 232 is provided with.When intermediate plate 231 was placed on the corresponding fixed position of support plate 12 1 sides, light emitting diode 232 was positioned at corresponding through hole 123.So, light emitting diode 232 can expose in the opposite side of support plate 12, and its light that when test, is sent can be measured.
With reference to Figure 13 and shown in Figure 14, can be provided with electronic pads 234 on each intermediate plate 231, each electronic pads 234 electrically connects with light emitting diode 232 corresponding electrode.Carrier plate module 10 can comprise a plurality of probes 105.A plurality of probes 105 protrude from support plate 12, and through being configured to electrically connect the circuit on the support plate 12, and after intermediate plate 231 is settled, can touch the electronic pads 234 on the intermediate plate 231.Through said a plurality of probes 105, can provide light emitting diode 232 tests required signal, and/or measure light emitting diode 232 voltage-current characteristic curves.
Join shown in Figure 7ly again, carrier plate module 10 can comprise a lighttight covering 106 again, hides on 106 and can form a plurality of perforates 107, and perforate 107 cooperates with through hole 123 on the support plate 12.Perforate 107 is isolated from each other, so that light emitting diode 232 is in when test, and can the phase mutual interference.In addition; With reference to Figure 14; Carrier plate module 10 also can comprise two thermal insulation barriers 108; Two thermal insulation barriers 108 are arranged at the relative both sides of support plate 12 respectively, near CC plate 104, and extend transverse to the direction of insertion of support plate 12, influence the temperature control of accommodation space 112 from the opening 111 of casing 11 to reduce external environment condition.
In brief, one embodiment of the invention disclose a kind of testing apparatus, and it comprises a casing, an attemperating unit and a radiating module.Integrated air temperature in the attemperating unit control casing, radiating module is then controlled the temperature of measured electronic elements nearby.Therefore, no matter testing apparatus of the present invention is used to test low-power or high-power electronic component, all can its temperature be controlled on the target temperature, keeps high stable testing degree.
Technology contents of the present invention and technical characterstic disclose as above, however under the present invention in the technical field technician should be appreciated that, in the spirit and scope of the invention that does not deviate from claim and defined, teaching of the present invention and disclose and can do all replacements and modification.For example, many technologies that preceding text disclose can diverse ways be implemented or are replaced with other technology, perhaps adopt the combination of above-mentioned dual mode.
In addition, interest field of the present invention is not limited to technology, board, the manufacturing of the specific embodiment that preceding text disclose, composition, device, method or the step of material.The technician should be appreciated that in the affiliated technical field of the present invention; Based on teaching of the present invention and disclose composition, device, method or the step of technology, board, manufacturing, material; No matter existed now or developer in the future; It carries out the essence identical functions with embodiment of the invention announcement person system with the identical mode of essence, and reaches the identical result of essence, also can be used in the present invention.Therefore, claim is in order to contain composition, device, method or the step in order to this type of technology, board, manufacturing, material.
Claims (15)
1. testing apparatus comprises:
One casing comprises an accommodation space;
One attemperating unit is through being configured to control the air themperature in this accommodation space;
One support plate, tool one circuit and a settlement, this settlement is through being configured to settle a measured electronic elements; This circuit electrically connects this measured electronic elements, and when this measured electronic elements is tested, transmits signal, and wherein when this support plate inserted this casing, this settlement was arranged in this accommodation space; And
One radiating module, side are located at this support plate, and this radiating module comprises a thermoelectric cooling module, and this thermoelectric cooling module heat couples this measured electronic elements to cool off this measured electronic elements.
2. testing apparatus according to claim 1 is characterized in that, this radiating module comprises a passive radiating piece, and this passive radiating piece heat couples this thermoelectric cooling module, with this thermoelectric cooling module that dispels the heat.
3. testing apparatus according to claim 2 is characterized in that, this passive radiating piece comprises a plurality of radiating fins.
4. testing apparatus according to claim 2 is characterized in that this radiating module comprises a heat-conducting piece, and wherein this thermoelectric cooling module is located between this heat-conducting piece and this passive radiating piece.
5. testing apparatus according to claim 4 is characterized in that, this testing apparatus also comprises a framework and an articulated part, and this radiating module is fixed in this framework, and this articulated part connects this framework and this support plate.
6. testing apparatus according to claim 5 is characterized in that, this heat-conducting piece is fixed on this passive radiating piece, and this thermoelectric cooling module is clamped between this heat-conducting piece and this passive radiating piece, and this passive radiating piece is fixed on this framework.
7. testing apparatus according to claim 5; It is characterized in that this testing apparatus also comprises a front panel and a CC plate, wherein this CC plate and this support plate laterally arrange; This CC plate and this framework are fixed in this front panel, and this support plate is locked in this CC plate.
8. testing apparatus according to claim 1 is characterized in that, this radiating module is through being configured to respect to this support plate pivot.
9. according to the arbitrary described testing apparatus of claim 1 to 8, it is characterized in that this measured electronic elements is a light emitting diode, this support plate comprises a through hole, and this through hole is through being configured to accommodate this light emitting diode.
10. testing apparatus according to claim 1 is characterized in that this testing apparatus also comprises a plurality of probes, and said a plurality of probes protrude from this support plate and electrically connect this circuit of this support plate, and said a plurality of probes are through being configured to test this light emitting diode.
11. testing apparatus according to claim 1 is characterized in that, this testing apparatus also comprises two thermal insulation barriers, and this two thermal insulation barriers is arranged at the relative both sides of this support plate, and through being configured to isolate the environment outside this accommodation space and this casing.
12. testing apparatus according to claim 1; It is characterized in that; This testing apparatus also comprises a circulation passage, leads to this accommodation space, and wherein this attemperating unit comprises a mobile device; This flow device is through being configured to drive the air flow of this accommodation space, and this air of this accommodation space is circulated through this circulation passage.
13. testing apparatus according to claim 12 comprises a separator, wherein this separator is separated out this accommodation space and this circulation passage in this casing.
14. testing apparatus according to claim 13 is characterized in that, this separator comprises a plurality of perforates, and this accommodation space and this circulation passage are led in said a plurality of perforates, and wherein this air of this accommodation space circulates via said a plurality of perforates.
15. testing apparatus according to claim 1 is characterized in that, this attemperating unit also comprises:
One pipeline is through being configured to carry a cooling liquid; And
A plurality of heat radiator are fixed on this pipeline, and the air circulation of this accommodation space said a plurality of heat radiator of flowing through wherein is to cool off this air.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010106091171A CN102539946A (en) | 2010-12-23 | 2010-12-23 | Test equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010106091171A CN102539946A (en) | 2010-12-23 | 2010-12-23 | Test equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102539946A true CN102539946A (en) | 2012-07-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010106091171A Pending CN102539946A (en) | 2010-12-23 | 2010-12-23 | Test equipment |
Country Status (1)
| Country | Link |
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| CN (1) | CN102539946A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016197672A1 (en) * | 2015-06-09 | 2016-12-15 | 中兴通讯股份有限公司 | Testing tooling |
| WO2017075557A1 (en) * | 2015-10-31 | 2017-05-04 | Newport Corporation | High power laser diode test system and method of manufacture |
| CN109655238A (en) * | 2019-02-22 | 2019-04-19 | 上海市计量测试技术研究院 | Endoscope detecting device |
| CN110875555A (en) * | 2018-08-31 | 2020-03-10 | 泰连公司 | Communication system including receptacle cage with airflow channels |
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| TW201011848A (en) * | 2008-09-04 | 2010-03-16 | Star Techn Inc | Apparatus for testing integrated circuits |
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| US6498899B2 (en) * | 1998-07-14 | 2002-12-24 | Delta Design, Inc. | Apparatus, method and system of liquid-based, wide range, fast response temperature control of electric devices |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016197672A1 (en) * | 2015-06-09 | 2016-12-15 | 中兴通讯股份有限公司 | Testing tooling |
| WO2017075557A1 (en) * | 2015-10-31 | 2017-05-04 | Newport Corporation | High power laser diode test system and method of manufacture |
| US10161996B2 (en) | 2015-10-31 | 2018-12-25 | Newport Corporation | High power laser diode test system and method of manufacture |
| EP3338100A4 (en) * | 2015-10-31 | 2019-09-11 | Newport Corporation | High power laser diode test system and method of manufacture |
| CN110875555A (en) * | 2018-08-31 | 2020-03-10 | 泰连公司 | Communication system including receptacle cage with airflow channels |
| CN109655238A (en) * | 2019-02-22 | 2019-04-19 | 上海市计量测试技术研究院 | Endoscope detecting device |
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Application publication date: 20120704 |