WO2015121953A1

WO2015121953A1 - Data communication-use electronic apparatus

Info

Publication number: WO2015121953A1
Application number: PCT/JP2014/053393
Authority: WO
Inventors: 近藤　義広; 孝船田; 真也浜岸; 信宏玉山
Original assignee: 株式会社日立製作所
Priority date: 2014-02-14
Filing date: 2014-02-14
Publication date: 2015-08-20

Abstract

In order to prevent electrical properties of a data communication-use electronic apparatus from being affected by dirt and dust generated when cooling air is caused to flow within a substrate of the electronic apparatus, this data communication-use electronic apparatus has a structure in which grease or elastomer is interposed below a boiling area of a thermosiphon, and has a configuration in which the phase-change module is divided into sections of heating elements having approximately the same allowable temperature and a condensation area is divided by air paths, for example, a configuration in which end-portion fins of parallel plate fins partition an air path.

Description

Electronic equipment for data communication

The present invention relates to an electronic device such as a network device, a server device, and a storage device, and uses a thermosiphon to transfer heat generated from the electronic substrate of the electronic device to the outside of the substrate and perform high-performance communication using a fiber cable. Further, the present invention relates to an electronic device suitable for mounting such a cooling system.

In recent years, electronic devices such as network devices have optical input / output terminals for high-speed transmission, and optical connectors / fiber cables are being installed. The light in the optical fiber cable travels by colliding at a certain angle with respect to the boundary surface and reflecting at a certain angle. For this reason, when the bending angle of the optical fiber cable is increased, leakage in the cladding of the outer layer of the fiber cable is increased, and communication cannot be performed. Similarly, a communication failure such as unstable communication (waveform fluctuation, malfunction) occurs even when the optical fiber cable is shaken by cooling air. In addition, since the optical connector / fiber cable communicates with other devices, the optical connector / fiber cable is located on the rear side of the housing of the apparatus, and is cooled with cooling air whose air temperature has risen due to heat generated by the control circuit. In addition to network devices, in electronic devices, when cooling air is allowed to flow through a substrate, dust or the like adheres to the terminals of the semiconductor element and is electrically short-circuited, resulting in damage to the electronic device.

Against such a background, in Patent Document 1 below, the inside of the device casing is constituted by a sealed chamber and a wind tunnel, the wind tunnel is ventilated from above to below by a blower, and the semiconductor element in the sealed chamber is cooled by a heat pipe. . Patent Document 2 discloses a boiling cooling device in which condensers are arranged so as to be lined up and down along an air guide path of a wind tunnel, and cooling air is blown to a wind tunnel to cool a semiconductor module. In patent document 3, it is the cooling mounting structure of the board | substrate which mounted the optical connector, the optical wire, etc. In Patent Document 4, in the technical field of servers, a thermosiphon + straight air path structure is used.

JP 2006-050742 A Japanese Patent Laid-Open No. 2005-150489 Japanese Patent Laid-Open No. 06-029676 JP 2010-080507 A

In addition to the optical connector, a control circuit, a power circuit, etc. are mounted on the electronic board on which the optical fiber cable is mounted. Each allowable temperature is different, and particularly the allowable temperature of the optical connector is small. In contrast to the above-described conventional technology, in the technical field of servers, there is a problem that an optical connector having a low allowable temperature cannot be cooled if the conventional thermosiphon + straight air path structure is applied as it is to an optical communication device. Further, since the optical connector is linked to the outside, it is installed on the front or back of the rack for handling, and there is no mention that the back side optical connector located on the downstream side is severe in cooling, and no consideration is given. Furthermore, no consideration is given to the electrical short circuit caused by dust, because there is no mention of cooling by flowing cooling air to a place other than the substrate.

In order to solve the above-described problems, an electronic device for data communication according to the present invention is provided with an electronic substrate portion and a wind for dissipating heat generated from the electronic substrate portion to the outside. Is an electronic device for data communication provided with an air passage portion that forms an air passage that passes linearly avoiding the electronic substrate portion, wherein the electronic substrate portion includes a plurality of semiconductor elements, The semiconductor elements of the present invention have different allowable temperatures, the air passage portion is equipped with a fan for generating the wind, and the electronic substrate portion and the air passage portion are thermally connected to each other by a thermosyphon that is a phase change device. A boiling region that is a heat absorption part of the thermosiphon is disposed in the vicinity of the semiconductor element of the electronic substrate part, and a heat dissipation part of the thermosyphon that includes a radiator in the air passage part. The That the condensation zone are arranged, and the boiling region and the condensation region of the thermo siphon, said separately provided for each allowable temperature section of the semiconductor elements, characterized in that a separate closed space.

According to the present invention, it is possible to cool a semiconductor element, an optical connector, and other components mounted on a data communication electronic device at or below an allowable temperature.

BRIEF DESCRIPTION OF THE DRAWINGS It is the whole conceptual diagram seen from the upper surface of the apparatus which mounts the phase change module using the thermosiphon which becomes one embodiment of this invention. It is the whole structure figure seen from the upper surface of electronic equipments, such as a server carrying the circumference of a phase change module using thermosiphon which becomes one embodiment of the present invention. It is the whole structure figure seen from the upper surface of the electronic equipment for data communications carrying the circumference of the phase change module using the thermosiphon which becomes one embodiment of the present invention. It is AA sectional drawing of the electronic device for data communication of the said FIG. It is BB sectional drawing of the electronic device for data communications of the said FIG. It is CC sectional drawing of the electronic device for data communications of the said FIG. It is the whole structural view which looked at electronic equipments, such as a server which provided the fan of Drawing 2 of the present invention on the front and back of a radiator from the upper surface. 1 is a perspective view of a plurality of electronic devices for data communication mounted on a rack as a representative example of an electronic device to which a phase change module using a thermosiphon of the present invention is applied.

The phase change module according to the present invention and the electronic device on which the phase change module is mounted have a structure in which a grease or an elastomer is interposed under the boiling region of the thermosyphon. Moreover, it is the structure which divides | segments a phase change module for every heating element with substantially the same permissible temperature, and divides | segments a condensation area | region with an air path, for example, the structure which the edge part fin of a parallel plate fin divides an air path. Furthermore, the heat of the semiconductor element is transported to a place other than the substrate by a thermosiphon, and a radiator is provided at a place outside the substrate to radiate heat to the outside air.

With the configuration of the present invention described above, the phase change module and the electronic device on which the phase change module is mounted can be cooled below the allowable temperature of the semiconductor element, the optical connector, and the like. Furthermore, it can be made less susceptible to the rise in air temperature of the upstream control LSI or the like. Further, since the cooling air does not flow in the substrate, the dust is less likely to stay in the semiconductor element, and an electrical short circuit at the node portion of the semiconductor element can be prevented.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

FIG. 1 is an overall conceptual diagram seen from the upper surface of an apparatus equipped with a phase change module using a thermosiphon.

Semiconductor elements

161, 162, and 163 are mounted on the electronic substrate 10 and generate heat.

Semiconductor elements

161, 162, and 163 differ in shape, heat generation, and allowable case temperature. The heat is transferred to the radiator 82 by the thermosiphon 80 that is a phase change device, and is transported by the cooling air 22 by the fan 21.

Semiconductor elements

161, 162, and 163 having different shapes, calorific values, and allowable case temperatures are thermally connected to the thermosiphon 80. A partition wall 100 is provided inside the thermosiphon 80. In order to individually cool the

semiconductor elements

161, 162, and 163 and transport heat, the three chambers A, 801, B 802, and C 803 are provided. It has become. Phase change of the refrigerant is performed individually in the three rooms, and the heat of each of the

semiconductor elements

161, 162, 163 is transported from the individual radiator 82 to the cooling air 22. The air passage 20 of the radiator 82 has a fin structure of the radiator 82 such that each of the A chamber 801, the B chamber 802, and the C chamber 803 is independent. That is, by using parallel plate fins for the radiator 82, the radiator 82 in one room does not affect the radiator 82 in another room. As described above, the cooling air whose temperature has not risen can be supplied to the radiator 82 in the downstream C chamber 803.

FIG. 2 is a top view when the electronic device 500 such as a server is mounted on the rack 1. It is the figure which removed the cover of the upper surface in order to describe a component clearly. Various types of

semiconductor elements

164, 165, 166, an input / output terminal 120 for inputting / outputting electric signals to / from the outside, and a backboard 140 for supplying electric power to the electronic substrate 10 are attached to the end of the electronic substrate 10. Yes. These terminals are male and can be inserted into the female terminals of the backboard 140 attached to the rack to easily supply power within the electronic device 500.

Next, the configuration of the air passage 20 will be described. The cooling air 22 disposed adjacent to the electronic substrate 10 and for releasing the heat generated from the electronic substrate 10 to the outside forms an air passage 20 that passes straight through the electronic substrate 10.

In addition, a fan 21 for generating cooling air 22 is mounted on the air passage 20, and the electronic substrate 10 and the air passage 20 are thermally connected to each other by a thermosiphon 80 that is a phase change device.

The fan 21 is attached to the rack 1, and the fan 21 remains in the rack 1 even when the electronic device 500 is removed.

Further, the thermosiphon 80 has a boiling region 81 of a heat absorption part of the thermosiphon 80 in the vicinity of at least one of the

semiconductor elements

164, 165, 166 of the electronic substrate 10.

Furthermore, the thermosiphon 80 has a condensing region 83 including a radiator 82 of a heat radiating portion in the air passage 20.

Further, a refrigerant is enclosed in the thermosiphon 80, and heat can be transferred from the boiling region 81 to the condensation region 83 by the phase change of the refrigerant. With this thermosiphon 80, heat generated in the

semiconductor elements

164, 165, 166 of the electronic substrate 10 can be transmitted to the radiator 82, transferred to the cooling air 22 by the fan 21, and released to the outside of the rack 1.

Thus, the cooling air 22 does not flow through the electronic substrate 10, and the electronic device 500 can be prevented from being damaged due to short-circuiting of the

semiconductor elements

164, 165, and 166 due to dust.

As described above, the electronic substrate 10 can be cooled using the thermosiphon 80 and the air passage 20.

On the other hand, the allowable temperatures of the

semiconductor elements

164, 165, and 166, which are heating elements of the electronic substrate 10, are different. Therefore, it is necessary to change the vapor temperature of the refrigerant of the thermosiphon 80 for each allowable temperature of the

semiconductor elements

164, 165, 166. Therefore, the partition wall 100 is provided inside the thermosiphon 80, and the boiling region 81 and the condensation region 83 are separated into an A chamber 801, a B chamber 802, and a C chamber 803. In FIG. 2, the boiling region 81 and the condensing region 83 are provided separately for each allowable temperature section, and are divided into three separate sealed spaces (rooms) by the partition wall 100. Of the radiators 82 provided in the condensing regions 83 of the three rooms separated by the partition wall 100, the radiator 82 is not positioned in the condensing region 83 of another room on the upstream side, and no radiator is mounted. As a result, fresh cooling air 22 can be supplied on the downstream side without being affected by an increase in air temperature due to heat generation from the upstream side.

Thereby, the vapor temperature of the refrigerant in each room is controlled, and the

semiconductor elements

164, 165, and 166 having different allowable temperatures can be individually cooled, and can be made lower than the allowable temperature.

FIG. 3 is a top view when the data communication electronic device 5 that performs data communication using an optical signal is mounted on the rack 1. It is the figure which removed the cover of the upper surface in order to describe a component clearly. The electronic board 10 has an optical input / output terminal 30 for inputting / outputting optical signals to / from the outside, an electric input / output terminal 120 for inputting / outputting electric signals to / from the outside, and a power supply terminal 140 for supplying electric power to the electronic board 10. It is attached to the part. These terminals are male and can be inserted into the female terminals of the backboard 140 attached to the rack, so that signal input / output and power supply can be easily performed in the data communication electronic device 5.

Further, the electronic substrate 10 includes a plurality of optical interconnectors 31 that distribute optical signals from the outside, a first control circuit 40 that is a plurality of programmable semiconductor elements (FPGAs), and a user individually uses the optical signals. A plurality of client optical modules 150 that can communicate data, a second control circuit 50 that is a control board circuit that controls the transmission and reception of light and electrical signals, and a power supply circuit 60 that can supply them with necessary voltages and currents are mounted. Has been.

Further, the optical interconnector 31 receives the optical signal input from the optical input / output terminal 30 and transmits it to the electronic substrate 10, and receives the optical signal in the electronic substrate 10 and supplies it to the optical input / output terminal 30. Perform one of the actions to send.

Also, the first control circuit 40 controls the operations received and transmitted by the respective optical interconnectors 31.

The client optical module 150 has the same function as the optical interconnector 31, but the user can individually connect to the client optical module 150 according to the application.

Furthermore, a plurality of first optical fiber cables 70 are provided to connect each optical interconnector 31 and each first control circuit 40 so as to be capable of optical communication with each other.

Also, a plurality of second optical fiber cables 71 are provided for connecting each optical interconnector 31 and the optical input / output terminal 50 so as to be capable of optical communication with each other.

These configurations enable optical communication to be performed at high speed and large capacity.

The fan 21 is attached to the rack 1, and the fan 21 remains in the rack 1 even when the data communication electronic device 5 is removed.

In addition, the thermosiphon 80 is located near at least one of the optical interconnector 31, the first control circuit 40, the second control circuit 50, and the power supply circuit 60 of the electronic substrate 10. There is a boiling region 81.

Further, a refrigerant is enclosed in the thermosiphon 80, and heat can be transferred from the boiling region 81 to the condensation region 83 by the phase change of the refrigerant. The thermosiphon 80 transmits heat generated in the optical interconnector 31, the first control circuit 40, the second control circuit 50, and the power supply circuit 60 of the electronic substrate 10 to the radiator 82, and the cooling air 22 generated by the fan 21 is transmitted to the cooling air 22. Heat can be transferred and discharged out of the rack 1.

Thus, the cooling air 22 does not flow through the plurality of first optical fiber cables 70 and the plurality of second optical fiber cables 71, and the malfunction and delay of the optical signal due to the shaking of the optical fiber cable can be prevented.

In particular, since the user inserts the optical fiber cable individually, the terminal of the optical module 150 for clients is exposed when the optical fiber cable is not inserted. As a result, when cooling air flows through the electronic substrate 10, dust or the like enters the terminal, causing a malfunction of the node portion or a node failure. The same thing can occur with a semiconductor element or device mounted on the electronic substrate 10. However, when the cooling air 22 flows through the air path 20 outside the electronic substrate 10, the cooling air does not flow through the terminals into which the optical fiber cable is not inserted, the semiconductor element mounted on the electronic substrate 10, or the device. For this reason, it is possible to prevent a malfunction of the node portion due to dust or the like and a node failure.

As described above, the electronic substrate 10 can be cooled using the thermosiphon 80 and the air passage 20. On the other hand, when the cooling air that can cool the electronic substrate 10 is supplied directly to the electronic substrate 10, the optical signal conduction in the first optical fiber cable 70 and the second optical fiber cable 71 is obstructed, resulting in malfunction. Invite.

On the other hand, the allowable temperatures of the optical interconnector 31, which is a heating element of the electronic substrate 10, the first control circuit 40, the second control circuit 50, the power supply circuit 60, and the client optical module 150 are different. Since the optical interconnector 31 and the optical module for client 150 incorporate optical elements, the allowable temperature is lower than the allowable temperatures of the other first control circuit 40 and power supply circuit 60. Therefore, it is necessary to keep the vapor temperature of the refrigerant in the thermosiphon 80 lower than the vaporization temperature of the refrigerant in the other first control circuit 40 and the power supply circuit 60 in the optical interconnector 31 and the optical module 150 for clients. Therefore, the partition wall 100 is provided inside the thermosiphon 80, and the boiling region 81 and the condensing region 83 are separated. In FIG. 3, the boiling region 81 and the condensing region 83 are provided separately for each allowable temperature section, and are divided into three separate sealed spaces (rooms) by the partition wall 100. Of the radiators 82 provided in the condensing regions 83 of the three rooms separated by the partition wall 100, the radiator 82 for heat dissipation of the downstream optical interconnector 31 is located in the condensing region 83 of another room on the upstream side. Without a radiator. As a result, the downstream optical interconnector 31 is not affected by the rise in air temperature due to heat generated from the upstream first control circuit 40, second control circuit 50, power supply circuit 60, and client optical module 150. The fresh cooling air 22 can be supplied.

Thereby, the vapor temperature of the refrigerant in each room is controlled, and the allowable temperature is different, the optical interconnector 31, the first control circuit 40, the second control circuit 50, the power supply circuit 60, and the client optical module 150, The optical interconnector 31 and the client optical module 150 whose permissible temperature is lower than that of the first control circuit 40 and the power supply circuit 60 can be made below the permissible temperature.

Next, FIG. 4 shows an AA cross section passing through the second control circuit 50 and the client optical module 150 of the data communication electronic device 5 of FIG.

As described with reference to FIG. 3, the data communication electronic device 5 is mounted with the client optical module 150, the second control circuit 50, and the power supply circuit 60. The client-side optical module 150 and the power supply circuit 60 are provided with a thermosiphon 80 via an elastomer 90. On the client optical module 150 and the power supply circuit 60, a boiling region 81 is provided inside the thermosiphon 80. The boiling region 81 is called a boiling heat transfer surface, and is provided with a heat transfer surface that improves boiling heat transfer. The shape of the boiling heat transfer surface varies depending on the refrigerant, and has a fine fin shape that promotes the formation of boiling nuclei. Further, the partition wall 100 is provided so that the optical module 150 for clients, the second control circuit 50, and the thermosiphon 80 of the power supply circuit 60 are in different rooms.

There is a radiator 82 in the condensation region 83 located outside the electronic substrate 10. The condensation region 83 is a condensation heat transfer surface, and is provided with, for example, flat plate-shaped fins in order to improve the condensation performance. The radiator 82 directly below the condensing region 83 is for heat dissipation of the second control circuit 50 and the optical module 150 for clients. On the other hand, the radiator 82 without the condensing region 83 is for heat dissipation of the optical interconnector located on the downstream side. Thus, when viewed in the flow direction of the cooling air, the air passage 20 can be partitioned by providing the radiator 82 with a flat plate shape. Thereby, in each air path 20, the structure which does not receive the heat radiation from an adjacent radiator is realizable.

In addition, the amount of the coolant 110 that is a refrigerant varies depending on the amount of heat transported in each room of the thermosiphon 80. For example, in the room of the power supply circuit 60 having a high amount of heat, the amount of the refrigerant liquid 110 is large and the liquid level is high. On the other hand, in the second control circuit 50 and the client optical module 150 having a relatively small amount of heat, the liquid level of the refrigerant liquid is low.

As described above, the thermosiphon 80 and the air passage 20 are used to transfer heat of the electronic substrate 10, particularly the second control circuit 50, and the optical module 150 for clients to the outside of the electronic substrate 10, and the second control circuit 50, The optical module 150 for clients can be cooled.

Next, FIG. 5 shows a BB cross section passing through the first control circuit 40 and the power supply circuit 600 of the data communication electronic device 5 of FIG. The first optical fiber cable 70 that connects the optical signal between the first control circuit 40 and the optical interconnector is visible.

As described with reference to FIG. 3, the first electronic control circuit 40 and the power supply circuit 60 are mounted on the data communication electronic device 5. A thermosiphon 80 is attached to the power supply circuit 60 via an elastomer 90. On the first control circuit 40 and the power supply circuit 60, a boiling region 81 is provided inside the thermosiphon 80. This boiling region 81 is called a boiling heat transfer surface, and is provided with a heat transfer surface that improves boiling heat transfer as in the case of FIG. The shape of the boiling heat transfer surface varies depending on the refrigerant, and has a fine fin shape that promotes the formation of boiling nuclei. Further, the thermosiphon 80 of the first control circuit 40 and the power supply circuit 60 are in the same room, but the partition 100 can be seen for partitioning from the room of the optical interconnector 31 in the back.

There is a radiator 82 in the condensation region 83 located outside the electronic substrate 10. The condensation region 83 is a condensation heat transfer surface, and is provided with, for example, flat plate-shaped fins in order to improve the condensation performance. The radiator 82 directly below the condensation region 83 is for heat dissipation of the first control circuit 40 and the power supply circuit 60. On the other hand, the radiator 82 without the condensing region 83 is for heat dissipation of the optical interconnector located on the downstream side. Thus, when viewed in the flow direction of the cooling air, the air passage 20 can be partitioned by providing the radiator 82 with a flat plate shape. Thereby, in each air path 20, the structure which does not receive the heat radiation from an adjacent radiator is realizable.

In addition, the amount of the coolant 110 that is a refrigerant varies depending on the amount of heat transported in each room of the thermosiphon 80. Since it is the same room in FIG. 5, the liquid level of the refrigerant liquid 110 is substantially the same.

As described above, the thermosiphon 80 and the air passage 20 are used to transfer the heat of the electronic substrate 10, particularly the first control circuit 40 and the power supply circuit 60, to the outside of the electronic substrate 10. 60 can be cooled.

Next, FIG. 6 shows a CC cross section passing through the optical interconnector 31 of the data communication electronic device 5 of FIG.

In the data communication electronic device 5, as described with reference to FIG. 3, the optical interconnector 31 and the power supply circuit 60 are mounted. The second optical fiber cable 71 for connecting the optical signal between the optical input / output terminal 30 and the optical interconnector 31, and the electrical input / output terminal 120 on the back side are visible.

A thermosiphon 80 is attached to the optical interconnector 31 and the power supply circuit 60 via an elastomer 90. A boiling region 81 is provided in the thermosiphon 80 on the optical interconnector 31 and the power supply circuit 60. The boiling region 81 is called a boiling heat transfer surface, and is provided with a heat transfer surface that improves boiling heat transfer. The shape of the boiling heat transfer surface varies depending on the refrigerant, and has a fine fin shape that promotes the formation of boiling nuclei. Further, a partition wall 100 is provided so that the optical interconnector 31 and the thermosiphon 80 of the power supply circuit 60 are in different rooms.

There is a radiator 82 in the condensation region 83 located outside the electronic substrate 10. The condensation region 83 is a condensation heat transfer surface, and is provided with, for example, flat plate-shaped fins in order to improve the condensation performance. The radiator 82 directly under the condensation region 83 is for heat dissipation of the optical interconnector 31. Thus, when viewed in the flow direction of the cooling air, the air passage 20 can be partitioned by providing the radiator 82 with a flat plate shape. Thereby, in each air path 20, the structure which does not receive the heat radiation from an adjacent radiator is realizable.

In addition, the amount of the coolant 110 that is a refrigerant varies depending on the amount of heat transported in each room of the thermosiphon 80. For example, in the room of the power supply circuit 60 having a high amount of heat, the amount of the refrigerant liquid 110 is large and the liquid level is high. On the other hand, in the optical interconnector 31 having a relatively small amount of heat, the liquid level of the refrigerant liquid is low.

As described above, using the thermosiphon 80 and the air passage 20, the heat of the electronic substrate 10, particularly the optical interconnector 31, can be transferred to the outside of the electronic substrate 10, and the optical interconnector 31 can be cooled.

Next, FIG. 7 shows an overall structural view of an electronic device 500 such as a server in which the fan 21 according to an embodiment of the present invention is provided on the front surface and the back surface of the radiator 82 as viewed from above. By installing the fan 21 in parallel with the push and pull, the wind pressure of the cooling air 22 can be increased, the clearance between the fins of the radiator 82 can be narrowed, and high performance can be achieved. Further, even when one of the front and rear fans 21 is out of order, the number of operations can be increased without shutting down the electronic device 500 by rotating the other fan 21 at a high speed.

Next, FIG. 8 is an external perspective view showing a plurality of data communication electronic devices 5 equipped with optical input / output equipped with thermosiphons using the phase change according to the present invention. In the figure, a rack 1 includes a housing 2 and lids 3 and 4 (3 is a front door and 4 is a back door), and a plurality of units formed in a predetermined shape and size are provided inside the rack 1. A data communication electronic device 5 is detachably provided. Although not shown, a fan is attached to the rack 1 on the back side as described with reference to FIG. Data communication is performed between a plurality of data communication electronic devices 5, or communication is performed with data communication electronic devices in other racks. By providing optical communication, data transfer can be performed at high speed.

DESCRIPTION OF SYMBOLS 1 ... Rack, 2 ... Rack housing | casing, 3, 4 ... Cover body, 5 ... Electronic equipment for data communication, 500 ... Electronic equipment, 10 ... Electronic board, 20 ... Air path, 21 ... Fan, 22 ... Cooling air, 30 Optical input / output terminals 31 Optical connectors 40 Field-programmable gate array (FPGA) 50 Control board circuit 60 Power circuit 70 Optical fiber cable 71 High-capacity optical fiber cable 80 Thermosiphon, 801 ... A chamber, 802 ... B chamber, 803 ... C chamber, 81 ... boiling region, 82 ... radiator, 83 ... condensing region, 90 ... elastomer, 91 ... metal plate, 100 ... partition wall, 110 ... refrigerant liquid 120 ... Electric signal input / output terminal, 130 ... Power supply terminal, 140 ... Backboard, 150 ... Optical module for clients, 161, 162, 163, 164, 165, 166 ... Semiconductor element.

Claims

An electronic board part is disposed adjacent to the electronic board part, and a wind path is formed through which air for releasing heat generated from the electronic board part passes through the electronic board part in a straight line. An electronic device for data communication provided with an air passage part,
The electronic substrate portion is equipped with a plurality of semiconductor elements, and the plurality of semiconductor elements have different allowable temperatures from each other
The air passage section is equipped with a fan for generating the wind,
The electronic board part and the air path part are thermally connected to each other by a thermosiphon that is a phase change device,
In the vicinity of the semiconductor element of the electronic substrate portion, a boiling region that is a heat absorbing portion of the thermosyphon is disposed,
A condensing region that includes a radiator that is a heat radiating part of the thermosiphon is disposed in the air passage part,
The electronic device for data communication, wherein the boiling region and the condensing region of the thermosyphon are provided separately for each allowable temperature section of the semiconductor element to form separate sealed spaces.
In claim 1,
The electronic device for data communication, wherein the radiator includes parallel plate fins.
An electronic device for data communication that performs data communication using an optical signal,
The electronic device for data communication is
An electronic board part;
An air passage portion that is disposed adjacent to the electronic substrate portion and forms an air passage through which air for discharging heat generated from the electronic substrate portion to the outside avoids the electronic substrate portion and linearly passes therethrough. Prepared,
The electronic substrate part is
An optical input / output terminal;
At least one of an operation of receiving an optical signal input from the optical input / output terminal and transmitting it into the electronic substrate unit, and an operation of receiving an optical signal in the electronic substrate unit and transmitting it to the optical input / output terminal A plurality of optical interconnectors,
A plurality of first control circuits for controlling at least one of the receiving operation and the transmitting operation in each of the plurality of optical interconnectors;
A second control circuit for controlling communication between the plurality of optical interconnectors;
A power supply circuit for supplying power to the optical interconnector, the first control circuit, and the second control circuit;
A plurality of first optical fiber cables connecting the optical interconnectors of the plurality of optical interconnectors and the first control circuits of the plurality of first control circuits so as to be capable of optical communication with each other;
A plurality of second optical fiber cables that connect each optical interconnector and the optical input / output terminal so as to be capable of optical communication with each other; and
The allowable temperature of each optical interconnector is lower than the allowable temperatures of the first control circuit, the second control circuit, and the power supply circuit,
The air passage section is equipped with a fan for generating the wind,
The electronic board part and the air path part are thermally connected to each other by a thermosiphon that is a phase change device,
In the vicinity of at least one of the optical interconnector, the first control circuit, the second control circuit, and the power supply circuit of the electronic board unit, a boiling region that is a heat absorption unit of the thermosyphon is disposed. ,
A condensing region that includes a radiator that is a heat radiating part of the thermosiphon is disposed in the air passage part,
The boiling region and the condensing region of the thermosyphon are provided separately for each allowable temperature section of the optical interconnector, the first control circuit, the second control circuit, and the power supply circuit, and are separately sealed. Become space,
The plurality of first optical fiber cables and the plurality of second optical fiber cables can cool the electronic substrate unit in the same manner as the electronic substrate unit is cooled using the thermosiphon and the air passage unit. An electronic device for data communication, characterized in that when a direct wind is supplied to the electronic substrate part, the optical signal is oscillated to inhibit conduction of the optical signal.
In claim 3,
The electronic device for data communication, wherein the radiator includes parallel plate fins.