TWM410977U - Test apparatus - Google Patents

Abstract

A test apparatus includes a case having an accommodation space, a temperature control device for controlling the air temperature of the accommodation space, a circuit board having a placement area for disposition of an electronic component prepared for testing and a circuit for electrically coupling to the electronic component for transmitting signals during the test of the electronic component, and a heat dissipation module disposed adjacent to the circuit board and including a thermoelectric device thermally coupled to the electronic component for cooling the electronic component. The placement area of the circuit board is in the accommodation space when the circuit board is inserted to the case.

Description

M410977 V. New description: [New technical field] This creation is about a test equipment, especially for a test equipment with overall and local temperature control capabilities. [Prior Art]

In order to control the quality of the output, after the electronic product is finished, it is subject to the test procedure; and the tested electronic products can enter the next stage of the process. In order to stabilize the test results, the electronic product to be tested is usually placed in an environmental control box to test the temperature to control the ambient temperature of the electronic product and its own temperature. The general environmental control box has an internal space, and a plurality of electronic products to be tested are placed in the internal space for testing. The environmental control box is equipped with a temperature control system and a humidity control system to control the air temperature and humidity of the interior space. When the plurality of electronic products to be tested are tested, they are in the air in the internal space. Due to the air in the internal space: The electronic product to be tested can maintain a stable temperature during testing, and is limited by the heat transfer performance of the air. When testing the electronic product to be tested, there will be a difference between the temperature and the air in the internal space. difference. The electronic product to be tested with low power has less self-heating, so when it is tested, it can be well dissipated, and its temperature is close to the air temperature of the internal space, so the electronic space to be tested can be achieved by controlling the temperature of the internal space air. Product temperature control. In contrast, the high-power electronic products to be tested are not easy to dissipate from the heat generated by the electronic heat to be tested, and the heat accumulation causes the temperature to be quite different from the air temperature in the internal space, making the temperature of the electronic product to be tested difficult to comply with 4 M4.10977 According to the air temperature control of the internal space, it is controlled at the target temperature. [New content] One of the purposes of this creation is to provide a test device having a temperature control system that can temperature-control the test environment in the test device and locally temperature-control the electronic components to be tested. . Thereby, the electronic component to be tested can be maintained at a target temperature range during testing. According to the above object, an embodiment of the present disclosure discloses a test device,

The utility model comprises a box body, a temperature control device, a carrier board and a heat dissipation module. The cabinet contains an accommodation space. The temperature control device is configured to control the air temperature within the housing space. The carrier board has a circuit and a placement area. The resettlement area is used to house a waiting electronic component. The circuit is electrically connected to the electronic component to be tested, and transmits a signal when the electronic component to be tested is tested. When the carrier board is inserted into the box, the placement area is located in the accommodating space. The heat dissipation module is disposed adjacent to the carrier board. The heat dissipation module includes a thermoelectric cooler, and the thermoelectric cooler is thermally coupled to the electronic component to be tested to cool the electronic component to be tested. 7

The technical features and advantages of the present disclosure have been broadly described above, and the detailed description of the present disclosure will be better understood. Other technical features and advantages of the subject matter of the claims of the present disclosure will be described below. It will be appreciated by those of ordinary skill in the art that the present disclosure may be utilized as a modification. Or the purpose of the disclosure is to achieve the same purpose as the disclosure. It should be understood by those of ordinary skill in the art that the equivalent construction method is removed from the attached Shenshi Lord Kui Lizhen. The spirit and scope of the present disclosure defined in the scope of the patent application of the present invention is as follows: Referring to FIG. 1, FIG. 5, FIG. 8 and FIG. 12, the test apparatus 1 of one embodiment of the present invention comprises a carrier mode. The group module 10 includes a carrier board 12 and a heat dissipation module 13. The box body 11 is provided with a housing space 112, wherein the housing space 112 is configured. To provide a test environment for the electronic component to be tested. The test module 30 is configured to measure the optical characteristics of the component to be tested. The carrier 12 includes a circuit 124 and a placement area 121, wherein the placement area 121 is configured to position at least one Wait The electronic component is electrically connected to the at least one electronic component 23 to be tested to provide the electrical energy or signal required for testing the electronic component 23 to be tested, or to measure at least one to be tested. The test signal of the electronic component 23. When the carrier 12 is inserted into the casing 11, the seating area 121 is located in the accommodating space 112. Referring to Figures 1 to 3, the testing apparatus 1 may include a plurality of carrier holding members J 4 . A plurality of grooves may be formed in each of the carrier holding members 14 , wherein the grooves of the carrier holding members 14 are correspondingly disposed, and are configured to 'guide the carrier 12 when the carrier 12 is inserted into the case 11 Moving, and supporting the carrier 12 when the carrier 12 is inserted into the positioning. Further, as shown in FIGS. 2 to 4, the testing device 1 may include a temperature control device 2' The temperature within the accommodating space 112 is controlled gl〇bally. In one embodiment of the present invention, the testing device 1 may include a circulation channel 15' and the temperature control device 2 includes a flow device (e.g., a fan) 16 The circulation passage 15 is configured to communicate with the accommodating space 112, and the flow device 16 is configured to The air flow in the upper chamber 112 is controlled, and the air can be circulated by the circulation passage 15. The shirt control device 2 can further include a plurality of fins 17 and a pipe 18. The plurality of fins 17 are disposed in the capacity. Locating the circulation path of the air in the space 112 so that

The air between TO and ^ 112 can be cooled. The plurality of fins 17 are fixed to the pipe 18 which is formed by the winding back, and the cooling water is allowed to flow through the pipe 18, thereby cooling the plurality of fins 17. Specifically, as shown in Figs. 2, 5 and 6, the test apparatus i includes a partition member 19 which divides a portion of the space inside the casing into the accommodation space U2 and the circulation passage 15. In an embodiment of the present invention, the partitioning member 19 partitions a portion of the space in the casing 11 from above and below, and the partitioning member 19 is configured to cover the accommodating space 112, and a plurality of openings 191 may be formed thereon, and the openings are formed. The 191 is inserted through the partitioning member 19 so that the circulation passage 15 and the accommodating space 112 can be connected at the openings 191. In one embodiment of the present invention, the openings 191 are adjacent to the opening 111 of the case 11. In one embodiment of the present invention, the spacer member 9 may be a plate member. Referring to FIGS. 2, 5 and 6, the housing 11 includes a half of the enclosed space I, and the semi-closed space 113 communicates with the outside through the opening 111. The receiving space i丨2 and the circulation passage 15 are located in the semi-closed space 113. Close to the opening lu. A stencil 20 is disposed behind the accommodating space 112, and the flow device 16 is disposed in the semi-closed space ι 3 and behind the stencil 20. The flow device 16 is disposed in cooperation with the partition member 19, so that the air in the semi-closed space 113 can circulate, thereby causing the air in the accommodating space 112 to circulate. The temperature can be further referred to in Figure 2. The control unit 2 can further include _-heater 21, M4.109.77 degree meter 22 and proportional-integral-derivative controller (PID) device (not shown in the figure). The heater 21 and the thermometer 22 are lightly connected to the PID device to control the temperature of the accommodation space H2 of the casing 11. Referring to FIGS. 7 to 9 and 15, in the embodiment of the present invention, the heat dissipation module 13 is disposed adjacent to the carrier 12, and includes a thermoelectric cooler (the heart of the coffee cooieOUi. The plurality of electronic components 23 to be tested are disposed in The thermoelectric cooler 131 is thermally coupled to the plurality of electronic components 23 to be tested,

To cool the plurality of electronic components 23 to be tested. The plurality of electronic components 23 to be tested are cooled by the thermoelectric cooler ,3ι, and the temperature of the plurality of electronic components 23 to be tested can be controlled to a target temperature in the vicinity of the test, especially when the plurality of electronic components 23 to be tested are high-power. When the electronic components. In one embodiment of the present invention, the heat dissipation module 13 may further include a passive heat dissipation member 132. The passive heat sink 132 is thermally connected to the thermoelectric cooler I] to dissipate the heat generated by the thermoelectric cooler 131 to the circulating air in the tank 11.

In one embodiment of the present invention, the heat dissipation module 13 may further include a heat conducting component 133 disposed between the plurality of electronic components 23 to be tested and the thermoelectric cooler 131, and thermally coupled to the plurality of components to be tested. The electronic component 23 is electrically connected to the thermoelectric cooler 13 1 so that the thermoelectric cooler 13 1 can cool a plurality of electronic components 23 to be tested. In one embodiment of the present invention, the carrier module 10 can further include a pivoting member 134. The pivoting member 134 can pivot the heat dissipation module 13 relative to the carrier 12 (as indicated by the arrow). In particular, as shown in FIGS. 7 and 9, the carrier module 1 〇 includes a frame 1 , and the frame 101 is configured to fix the heat dissipation module 13 and is slidable by the frame 1 8 M410977 The heat dissipation module 13 is pivoted relative to the carrier plate 12. In detail, the carrier 12 and the frame 101 are connected by a pivoting member 134. The heat conducting member 133 is fixed on the passive heat sink 132. The thermoelectric cooler 131 is clamped between the heat conducting member 133 and the passive heat sink 132, and is passive. The heat sink 132 is fixed to the frame ίο!. Thus, the heat dissipation module 13 can be attached to or removed from the plurality of electronic components 23 to be tested by pivoting the frame 10 1 '. In addition, referring to FIGS. 1, 7, and 9, the carrier module 1 〇 can include a front panel j 〇 3 and a connection circuit board 104. The connection circuit board 1 〇 4 is disposed parallel to the carrier board 12, and the two are electrically connected. . The front panel 103 is disposed to cover a portion of the opening 111 of the casing U, and the connecting circuit board 104 is fixed to the sill panel 103 in a vertical manner. The frame body 1〇1 can be fixed to the front panel 丨〇3, and the carrier board 12 and the front panel 103 can be locked by the locking member 24, whereby the heat dissipation module 13 and the plurality of electronic components to be tested can be connected by the connection structure. 23 firmly fit to achieve better heat transfer. Further, the 'carrier module 1' shown in Figs. 9 to 12 may include an outer cover member 102. The cover member is disposed on the heat conducting member 133 at a circumference of 1 〇 2 and is shielded by a plurality of surrounding electronic components 23 to be tested. The cover member 1〇2 can also be fixed to the passive heat sink. In addition, the connection circuit board 104 includes a plurality of electrical connection points 1〇9 that are configured to electrically connect the electronic component 23 and the front panel 1〇3 to the connection benefit 110. In one embodiment of the present disclosure, the passive heat sink 2 includes a plurality of heat sink fins. The plurality of heat sink fins are disposed to be parallel to each other and extend in a circulating flow direction of the air in the housing space i丨2, so that the flowing air can be Flow between adjacent heat dissipation dies to increase heat dissipation efficiency. 9 M4.10977 Referring to FIG. 12, a plurality of positioning members 122 may be protruded from the seating area 121 of the carrier 12, and the positioning members 22 may be used to fix the electronic components 23 to be tested to a position. . 12, 13, Μ and I5, in one embodiment of the present invention, the electronic component 23 to be tested may include a heat sink hot face of the light emitting diode 232 <J light emitting diode 232 Connected to the interposer 231, the interposer 231 can form a plurality of notches 233'. The notches 233 cooperate with the positioning members 122 to allow the LEDs 23 to be placed in a fixed position. Referring to FIG. 13, a plurality of through holes 123 may be formed in the carrier 12. The through hole 123 is disposed at a fixed position of the corresponding light emitting diode 232. When the interposer 231 is placed at a corresponding fixed position on the side of the carrier 12, the LEDs 232 are located in the corresponding through holes 123. Thus, the LED 232 can be exposed on the other side of the carrier 12 so that the light emitted during the test can be measured. Referring to Figures 13 and 14, each of the interposer 231 may be provided with electrode pads 234'. The electrode pads 234 are electrically connected to the electrodes corresponding to the LEDs 232. The carrier module 10 can include a plurality of probes 105. The plurality of probes 1〇5 protrude from the carrier 12 and are configured to electrically connect the circuitry on the carrier 12 and to the electrode pads 23 on the interposer 231 when the interposer 231 is disposed. Through the probes 105, the signals required for the LED 232 test can be provided, and/or the voltage-current characteristics of the LEDs 232 can be measured. Referring to FIG. 7 , the 'carrier module 1 〇 can further include a opaque cover 106 , and a plurality of openings 1 〇 7 , openings 1 〇 7 and through holes in the carrier 12 can be formed on the cover 106 . 123 cooperation. The openings 1 〇 7 are isolated from each other so that the light-emitting diodes 232 do not interfere with each other during the test. In addition, referring to FIG. 4, the carrier module 10 M4'1 09.77 group 10 may further include two heat insulating members 108 respectively disposed on opposite sides of the carrier board 12, adjacent to the connecting circuit board 104, and laterally. The insertion direction of the carrier 12 extends to reduce the temperature of the external environment from the opening of the cabinet. Jane Luzhi, an embodiment of the present invention discloses a testing device comprising a box, a temperature control device and a heat dissipation module. The temperature control device controls the overall air temperature inside the box, while the heat dissipation module controls the temperature of the electronic component to be tested nearby.

degree. Therefore, the test equipment of this creation can control its temperature to the target temperature regardless of the low-power or high-power electronic components, maintaining high test stability. The technical content and the technical features of the present disclosure have been disclosed as above, but those skilled in the art should understand that the teachings and disclosures of the present disclosure are disclosed without departing from the spirit and scope of the disclosure as defined by the appended claims. Can be used for various substitutions and modifications. For example, many of the above

The process can be carried out in different ways or by other processes, or a combination of the two. Further, the scope of the present invention is not limited to the process, machine, manufacture, composition of matter, apparatus, method or procedure of the particular application of the above disclosed embodiments. It should be understood by those skilled in the art that, based on the teachings of the present disclosure, the process, the machine, the manufacture, the composition of the material, the device, the method, or the steps, whether existing or future developers, especially The same way to perform substantially the same two-pass quality can also be used in the present disclosure. Therefore, the following patent application scope is intended to cover the components, devices, methods, or steps used in such processes, machines, manufacturing, and M10Q77 substances. [Simplified Schematic Description] FIG. 1 shows a test of an embodiment. Figure 2 illustrates the interior of the test apparatus of Figure 1; Figure 3 illustrates the housing space of the test apparatus of Figure 1; Figure 4 illustrates the heat sink and conduit of an embodiment of the present invention; Figure 6 is a plan view of the test device of Figure 2; Figure 7 illustrates a carrier module of an embodiment of the present invention; Figure 8 illustrates a heat dissipation module of an embodiment of the present invention; FIG. 10 illustrates a combination of a heat-conducting member and a thermoelectric cooler according to an embodiment of the present invention; FIG. 10 illustrates a group of heat-conducting members and thermoelectric coolers 矣 · 口 口 & & & & & & & & & & & & & & & & & & & & & & & & & & & & & & 11 shows a heat-conducting member according to an embodiment of the present invention; FIG. 12 is a schematic view showing the arrangement of an electronic component to be tested according to an embodiment of the present invention; FIG. 13 illustrates a carrier plate of the present embodiment and a through-hole thereof; Probe coupling of an embodiment of the present invention A schematic view of the intermediate plate; and Figure 15 shows the carrier plate embodiment of the present embodiment creation of a thermally conductive member, a combination of the thermoelectric actuator device and the passive heat sink side view of the main element REFERENCE NUMERALS [Test apparatus 12 M410977.

2 Temperature control device 10 Carrier module 11 Box 12 Carrier 13 Thermal module 14 Carrier holder 15 Circulating channel 16 Flow device 17 Heat sink 18 Pipe 19 Separator 20 Stencil 21 Heater 22 Thermometer 23 Electronic components 24 Locking 30 Test module 101 Frame 102 Cover part 103 Front panel 104 Connecting circuit board 105 Probe 106 Covering 107 Opening 108 Insulation · 13 M410977

109 Electrical connection point 110 Connector 111 Opening 112 accommodating space 113 Space 121 Placement area 122 Locating member 123 Through hole 124 Circuit 131 Thermoelectric cooler 132 Passive heat sink 133 Thermally conductive member 134 Pivot member 191 Opening 231 Interposer 232 Illumination Diode 233 notch 234 electrode pad 14

Claims (1)

No. 99224386 Patent Xiaoli Fan Shangyu, β Jinshouzheng/祠无Λ VI. Application Patent Range: 1. A test equipment comprising a box containing an accommodation space; a temperature control device configured to control The air in the accommodating space is temperature-produced. A carrier board has a circuit and a arranging area, the arranging area is configured to be disposed with an electronic component to be tested; the circuit is electrically connected to the electronic component to be tested and is to be tested The electronic component transmits a signal when the test is performed, wherein the resetting area is located in the accommodating space when the box is inserted into the accommodating space; the heat radiating module is inserted into the V carrier board, and the heat dissipating module includes a thermoelectric And a thermostat, the thermoelectric cooler is thermally coupled to the electronic component to be tested to cool the electronic component to be tested. 2) The test apparatus according to claim 1, wherein the heat dissipation module comprises a passive heat sink, the passive heat sink being thermally coupled to the thermoelectric cooler to dissipate the thermoelectric cooler. 3. The test device of claim 2, wherein the passive heat sink comprises a plurality of heat sink fins. 4. The test device of claim 2, wherein the heat dissipation module comprises a heat conductive member, wherein the thermoelectric cooler is interposed between the heat conductive member and the passive heat sink. 5. The test device of claim 4, further comprising a frame and a pivotal member, the heat dissipation module being fixed to the frame, and the pivoting member connecting the frame and the carrier. 6. The test apparatus according to claim 5, wherein the heat conducting member is fixed to the passive heat sink. The thermoelectric cooler is clamped between the heat conducting member and the passive heat sink. The passive heat sink is fixed at the On the frame. Wj[〇977 _:_^ • . Λ. The test apparatus according to claim 5, further comprising a front panel and a connecting circuit board, wherein the connecting circuit board is disposed in parallel with the carrier board, and the connecting circuit board and the frame body are fixed to the front side The panel is locked to the connection 'board'. The test device of claim 1, wherein the heat dissipation module is configured to pivot relative to the carrier. The test apparatus according to any one of claims 1 to 8, wherein the electronic component to be tested is a light-emitting diode, the carrier comprises a uniform perforation, and the through hole is configured by φ to accommodate the light-emitting diode Polar body. 10. The test device of claim 1, further comprising a plurality of probes protruding from the carrier and electrically connected to the circuit of the carrier, the plurality of probes configured to test the Measuring electronic components. 11. The test device of claim 1, further comprising two thermal insulation members disposed on opposite sides of the carrier plate and configured to isolate the accommodation space from the environment outside the enclosure . 12. The test apparatus according to claim 1, further comprising a circulation passage connecting the accommodating space, wherein the temperature control device comprises a flow device configured to drive the accommodating space t air flow And circulating the air in the accommodating space through the circulation passage. 13. The test device of claim 12, comprising a spacer, wherein the spacer separates the housing space and the circulation passage in the housing. The test device of claim 1 , wherein the partition comprises a plurality of openings, the plurality of openings communicating with the accommodating space and the circulation channel, wherein the air of the accommodating space is opened by the opening The hole circulates. The test device according to claim 1, wherein the temperature control device further comprises: 16 M410977 \〇〇年±户斗 A conduit configured to deliver a cooling liquid; and a plurality of fins fixed to the conduit, wherein air in the housing space circulates through the plurality of fins to cool the air. 17