TWI740945B - 脆性基板之分斷方法 - Google Patents

脆性基板之分斷方法 Download PDF

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Publication number
TWI740945B
TWI740945B TW106117305A TW106117305A TWI740945B TW I740945 B TWI740945 B TW I740945B TW 106117305 A TW106117305 A TW 106117305A TW 106117305 A TW106117305 A TW 106117305A TW I740945 B TWI740945 B TW I740945B
Authority
TW
Taiwan
Prior art keywords
brittle substrate
line
tip
breaking
crack
Prior art date
Application number
TW106117305A
Other languages
English (en)
Chinese (zh)
Other versions
TW201808840A (zh
Inventor
曽山浩
井村淳史
Original Assignee
日商三星鑽石工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商三星鑽石工業股份有限公司 filed Critical 日商三星鑽石工業股份有限公司
Publication of TW201808840A publication Critical patent/TW201808840A/zh
Application granted granted Critical
Publication of TWI740945B publication Critical patent/TWI740945B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/027—Scoring tool holders; Driving mechanisms therefor
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/037—Controlling or regulating
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • C03B33/105—Details of cutting or scoring means, e.g. tips
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
TW106117305A 2016-05-25 2017-05-25 脆性基板之分斷方法 TWI740945B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016103952 2016-05-25
JPJP2016-103952 2016-05-25

Publications (2)

Publication Number Publication Date
TW201808840A TW201808840A (zh) 2018-03-16
TWI740945B true TWI740945B (zh) 2021-10-01

Family

ID=60412293

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106117305A TWI740945B (zh) 2016-05-25 2017-05-25 脆性基板之分斷方法

Country Status (5)

Country Link
JP (1) JP6645577B2 (ko)
KR (1) KR102167941B1 (ko)
CN (1) CN109219505B (ko)
TW (1) TWI740945B (ko)
WO (1) WO2017204055A1 (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108428728B (zh) * 2018-05-14 2019-07-02 云谷（固安）科技有限公司 阵列基板及制作方法、显示面板及制作方法、显示装置
US10840267B2 (en) 2018-05-14 2020-11-17 Yungu (Gu'an) Technology Co., Ltd. Array substrates and manufacturing methods thereof, and display panels
JP7255890B2 (ja) * 2020-12-24 2023-04-11 三星ダイヤモンド工業株式会社 脆性材料基板の加工方法及び分断方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101386467A (zh) * 2007-09-11 2009-03-18 三星钻石工业股份有限公司 脆性材料基板的分割装置和分割方法
JP2016069195A (ja) * 2014-09-26 2016-05-09 三星ダイヤモンド工業株式会社 基板分断方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3074143B2 (ja) 1995-11-06 2000-08-07 三星ダイヤモンド工業株式会社 ガラスカッターホイール
CN100528507C (zh) * 2002-11-06 2009-08-19 三星钻石工业股份有限公司 划线形成设备和划线形成方法
JP2006007677A (ja) * 2004-06-29 2006-01-12 National Institute For Materials Science ダイヤモンド多結晶体スクライバー
JP5597327B2 (ja) * 2010-06-29 2014-10-01 学校法人東京理科大学 ダイヤモンド被覆工具およびその製造方法
JP2014031292A (ja) * 2012-08-03 2014-02-20 Mitsuboshi Diamond Industrial Co Ltd 強化ガラス基板のスクライブ方法
JP5996376B2 (ja) * 2012-10-31 2016-09-21 株式会社尼崎工作所 硬質脆性板の割断装置
JP2015191999A (ja) * 2014-03-28 2015-11-02 三星ダイヤモンド工業株式会社 シリコン基板の分断方法
TWI680106B (zh) 2014-03-31 2019-12-21 日商三星鑽石工業股份有限公司 脆性材料基板之分斷方法
EP3199499A4 (en) * 2014-09-25 2018-06-06 Mitsuboshi Diamond Industrial Co., Ltd. Method for cutting brittle substrate

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101386467A (zh) * 2007-09-11 2009-03-18 三星钻石工业股份有限公司 脆性材料基板的分割装置和分割方法
JP2016069195A (ja) * 2014-09-26 2016-05-09 三星ダイヤモンド工業株式会社 基板分断方法

Also Published As

Publication number Publication date
TW201808840A (zh) 2018-03-16
JPWO2017204055A1 (ja) 2019-01-17
CN109219505A (zh) 2019-01-15
CN109219505B (zh) 2021-05-07
KR102167941B1 (ko) 2020-10-20
WO2017204055A1 (ja) 2017-11-30
JP6645577B2 (ja) 2020-02-14
KR20180136528A (ko) 2018-12-24

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