WO2017204055A1 - 脆性基板の分断方法 - Google Patents

脆性基板の分断方法 Download PDF

Info

Publication number
WO2017204055A1
WO2017204055A1 PCT/JP2017/018536 JP2017018536W WO2017204055A1 WO 2017204055 A1 WO2017204055 A1 WO 2017204055A1 JP 2017018536 W JP2017018536 W JP 2017018536W WO 2017204055 A1 WO2017204055 A1 WO 2017204055A1
Authority
WO
WIPO (PCT)
Prior art keywords
line
tip
brittle substrate
blade edge
cutting
Prior art date
Application number
PCT/JP2017/018536
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
曽山 浩
淳史 井村
Original Assignee
三星ダイヤモンド工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三星ダイヤモンド工業株式会社 filed Critical 三星ダイヤモンド工業株式会社
Priority to KR1020187033990A priority Critical patent/KR102167941B1/ko
Priority to CN201780032003.5A priority patent/CN109219505B/zh
Priority to JP2018519215A priority patent/JP6645577B2/ja
Publication of WO2017204055A1 publication Critical patent/WO2017204055A1/ja

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033Apparatus for opening score lines in glass sheets
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/027Scoring tool holders; Driving mechanisms therefor
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/037Controlling or regulating
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/10Glass-cutting tools, e.g. scoring tools
    • C03B33/105Details of cutting or scoring means, e.g. tips
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00Technologies relating to the processing of minerals
    • Y02P40/50Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57Improving the yield, e-g- reduction of reject rates

Definitions

  • the present invention relates to a method for dividing a brittle substrate.
  • a crack line is formed on a brittle substrate.
  • “crack line” means that a crack partially progressing in the thickness direction of the brittle substrate extends in a line shape on the surface of the brittle substrate.
  • a so-called break process is performed. Specifically, by applying a stress to the brittle substrate, the cracks in the crack line are completely advanced in the thickness direction. Thereby, a brittle board
  • substrate is parted along a crack line.
  • Patent Document 1 a depression on the upper surface of a glass plate is generated during scribing.
  • this indentation is referred to as a “scribe line”.
  • a crack extending in the downward direction from the scribe line is generated.
  • the crack line is formed simultaneously with the formation of the scribe line.
  • Patent Document 2 a cutting technique that is significantly different from the above-described typical cutting technique has been proposed.
  • this technique first, by generating plastic deformation by sliding the blade edge on the brittle substrate, a groove shape called “scribe line” in Patent Document 2 is formed.
  • this groove shape is referred to as a “trench line”.
  • the crack line is formed by extending the crack along the trench line. That is, unlike a typical technique, a trench line without a crack is once formed, and then a crack line is formed along the trench line. Thereafter, a normal breaking process is performed along the crack line.
  • the trench line without cracks used in the technique of Patent Document 2 can be formed by sliding the blade edge with a lower load than a typical scribe line with simultaneous crack formation. When the load is small, the damage applied to the cutting edge is reduced. Therefore, according to this cutting technique, the life of the cutting edge can be extended.
  • a cutting tool having a blade edge and a shank as its holder is used.
  • the cutting instrument has an axial direction, and the shank extends along the axial direction.
  • the trench line is formed by sliding the blade edge on the brittle substrate.
  • the cutting edge is held by a holder extending along the axial direction.
  • the axial direction is inclined with respect to the upper surface of the brittle substrate. The direction in which the axial direction is projected onto the brittle substrate corresponds to the sliding direction of the blade edge.
  • the direction in which the axial direction is projected onto the glass substrate corresponds to the sliding direction of the blade edge.
  • the sliding direction of the cutting edge is not constant, it is necessary to provide a mechanism for controlling the attitude of the cutting edge.
  • the necessity of adjusting and controlling the posture of the cutting edge can lead to disadvantages such as an increase in the cost of the cutting device, an increase in time required for the process, and a decrease in the accuracy of the scribe position.
  • the present invention has been made to solve the above-described problems, and an object thereof is to provide a method for cutting a brittle substrate that does not require adjustment of the posture of the blade edge according to the sliding direction of the blade edge. It is.
  • the method for cutting a brittle substrate includes the following steps a) to e). a) A brittle substrate having one surface and a thickness direction perpendicular to the one surface is prepared. b) A cutting edge provided with a tip having axial symmetry in the axial direction is prepared. c) By sliding the tip of the blade edge on one surface while making the axial direction of the blade edge perpendicular to one surface of the brittle substrate, the trench line having a groove shape is deformed by one of the brittle substrates by plastic deformation. Formed on the surface. The trench line is formed so as to obtain a crackless state in which the brittle substrate is continuously connected in the direction intersecting the trench line below the trench line.
  • a crack line is formed by extending a crack of the brittle substrate in the thickness direction along the trench line.
  • the brittle substrate is disconnected continuously in the direction crossing the trench line below the trench line by the crack line.
  • the brittle substrate is divided along the crack line.
  • the axial direction of the cutting edge is perpendicular to the one surface.
  • the relationship between the axial direction and the sliding direction is constant without depending on the sliding direction. Therefore, it is not necessary to adjust the posture of the blade edge according to the sliding direction of the blade edge.
  • FIG. 1 It is a perspective view which shows roughly the structure of the cutting tool used for the cutting method of the brittle board
  • FIG. 6 is a schematic end view taken along line VI-VI in FIG. 5. It is a top view which shows roughly the 2nd process of the cutting method of a brittle board
  • FIG. 8 is a schematic end view taken along line VIII-VIII in FIG. 7. It is a top view which shows roughly the 1st process of the cutting method of the brittle board
  • FIG. 1 It is a top view which shows roughly 1 process of the cutting method of the brittle board
  • FIG. 22 is a schematic end view taken along line XXII-XXII in FIG. 21. It is a top view which shows roughly the 2nd process of the cutting method of a brittle board
  • FIG. 27 is a schematic cross-sectional view taken along line XXVII-XXVII in FIG. 26.
  • FIG. 27 is a schematic sectional view taken along line XXVIII-XXVIII in FIG. 26.
  • FIG. 27 is a schematic cross-sectional view taken along line XXIX-XXIX in FIG. 26. It is a top view which shows roughly 1 process of the cutting method of the brittle board
  • FIG. 31 is a schematic cross-sectional view taken along line XXXI-XXXI in FIG. 30.
  • FIG. 31 is a schematic cross-sectional view taken along line XXXII-XXXII in FIG. 30.
  • FIG. 34 is a schematic cross-sectional view taken along line XXXIV-XXXIV in FIG. 33.
  • FIG. 34 is a schematic cross-sectional view taken along line XXXV-XXXV in FIG. 33.
  • FIG. 38 is a schematic sectional view taken along line XXXVIII-XXXVIII in FIG. 37.
  • FIG. 39 is an example of the surface shape of the tip of the blade edge along line AA in FIG.
  • FIG. 39 is an example of the surface shape of the tip of the blade edge along line AA in FIG.
  • FIG. 1 and FIG. 2 are perspective view schematically showing a configuration of a cutting instrument 50 used in the method for cutting glass substrate 4 (brittle substrate) in the present embodiment.
  • FIG. 3 is a partial cross-sectional view of the vicinity of the tip 51N of the blade edge 51 of FIGS.
  • the cutting instrument 50 has a cutting edge 51 and a support part 52.
  • the cutting edge 51 and the support portion 52 may be an integral member made of the same material.
  • the blade edge 51 is provided with a tip 51N having axial symmetry in the axial direction AX. That is, the surface of the tip 51N is a surface obtained by rotating a curve around the axial direction AX.
  • the surface of the tip 51N is a curved surface having a convex shape toward the outside.
  • the surface of the tip 51N may be a part of a spherical surface.
  • the radius of curvature of the tip 51N is preferably 3 ⁇ m or more and 40 ⁇ m or less.
  • the surface of the tip 51N may be a conical surface, and the apex of this conical surface may be rounded.
  • the dimension of the tip 51N along the axial direction AX is typically 0.5 ⁇ m or more, and usually 1.0 ⁇ m or more is sufficient, and preferably 2.0 ⁇ m or more.
  • the “axial symmetry” described above is preferably ideal geometric axial symmetry, but may be substantial axial symmetry in view of the action on the glass substrate 4. The latter is referred to as “pseudo axial symmetry” in the present specification, and details thereof will be described in a tenth embodiment to be described later.
  • the entire cutting edge 51 including the tip 51N has axial symmetry in the axial direction AX.
  • the blade edge 51 includes a right cone shape having axial symmetry in the axial direction AX, and a tip 51N is provided at the apex of the right cone shape.
  • the angle of the apex of the right cone shape is preferably 120 ° or more, and more preferably 130 ° or more. Moreover, this angle is preferably 160 ° or less, and more preferably 150 ° or less.
  • the support part 52 preferably extends along the axial direction AX.
  • the entire cutting instrument 50 may have axial symmetry in the axial direction AX.
  • a glass substrate 4 (FIG. 2) to be divided is prepared.
  • the glass substrate 4 has an upper surface SF1 (one surface) and an opposite lower surface SF2 (other surface).
  • An edge ED is provided on the upper surface SF1.
  • the upper surface SF1 is typically flat. In the example shown in FIG. 5, the edge ED has a rectangular shape.
  • the glass substrate 4 has a thickness direction DT perpendicular to the upper surface SF1.
  • the above-described cutting tool 50 (FIGS. 1 to 3) having the blade edge 51 is prepared.
  • step S30 (FIG. 4), a trench line TL having a linear shape is formed. Specifically, the following steps are performed.
  • the tip 51N of the blade edge 51 (FIGS. 1 to 3) is pressed against the upper surface SF1 at the position N1. As a result, the tip 51N comes into contact with the glass substrate 4.
  • the position N1 is preferably away from the edge ED of the upper surface SF1 of the glass substrate 4 as shown. In that case, it is possible to avoid the cutting edge 51 from colliding with the edge ED of the upper surface SF ⁇ b> 1 of the glass substrate 4 at the start of sliding of the cutting edge 51.
  • the tip 51N of the blade edge 51 is slid on the upper surface SF1 while making the axial direction AX of the blade edge 51 perpendicular to the upper surface SF1 of the glass substrate 4 (see the arrow in FIG. 5).
  • a load is applied to the blade edge 51 from the outside during sliding. This load direction is perpendicular to the upper surface SF1. Plastic deformation is generated on the upper surface SF1 by sliding.
  • the trench line TL having a groove shape is formed on the upper surface SF1 of the glass substrate 4 by this plastic deformation.
  • the trench line TL is a crackless state in which the glass substrate 4 is continuously connected in the direction DC (FIG. 6) intersecting the extending direction (lateral direction in FIG. 5) of the trench line TL below the trench line TL. It is formed so that a state is obtained.
  • the trench line TL is formed by plastic deformation, but no crack is formed along the trench line TL.
  • the load applied to the cutting edge 51 is so small that cracks do not occur at the time of forming the trench line TL, and creates an internal stress state that can generate cracks in a later process. It is adjusted so as to be large enough to cause plastic deformation.
  • the trench line TL is preferably generated only by plastic deformation of the glass substrate 4, and in this case, no scraping occurs on the upper surface SF ⁇ b> 1 of the glass substrate 4.
  • the load on the blade edge 51 should not be excessively increased. By not scraping, it is possible to avoid undesirable fine fragments on the upper surface SF1. However, some shaving is usually acceptable.
  • the formation of the trench line TL is performed between the position N1 and the position N3e by sliding the tip 51N of the blade edge 51 from the position N1 to the position N3e via the position N2.
  • the position N2 is away from the edge ED of the upper surface SF1 of the glass substrate 4.
  • the position N3e is located at the edge ED of the upper surface SF1 of the glass substrate 4. Therefore, the blade edge 51 slid to form the trench line TL finally reaches the position N3e.
  • the crackless state is maintained when the cutting edge 51 is located at the position N2, and further maintained until the moment when the cutting edge 51 reaches the position N3e.
  • the blade edge 51 cuts down the edge ED of the upper surface SF1 of the glass substrate 4.
  • the above-mentioned cut-down causes a fine breakage at position N3e.
  • a crack is generated so as to release the internal stress in the vicinity of the trench line TL.
  • a crack in the glass substrate 4 in the thickness direction DT extends from the position N3e located at the edge ED of the upper surface SF1 of the glass substrate 4 along the trench line TL (see the arrow in FIG. 7).
  • the formation of the crack line CL is started.
  • step S50 (FIG. 4)
  • the crack line CL is formed from the position N3e to the position N1.
  • the direction in which the crack line CL extends along the trench line TL (arrow in FIG. 7) is opposite to the direction in which the trench line TL is formed (arrow in FIG. 5).
  • the speed at which the blade edge 51 slides from the position N2 to the position N3e may be smaller than the speed from the position N1 to the position N2.
  • the load applied to the blade edge 51 from the position N2 to the position N3e may be larger than the load from the position N1 to the position N2 within a range in which the crackless state is maintained.
  • continuous connection is broken in the direction DC (FIG. 8) where the glass substrate 4 intersects the extending direction (lateral direction in FIG. 7) of the trench line TL below the trench line TL by the crack line CL.
  • continuous connection means a connection that is not interrupted by a crack.
  • the portions of the glass substrate 4 may be in contact with each other through the cracks of the crack line CL. Further, a slightly continuous connection may be left immediately below the trench line TL.
  • step S60 the glass substrate 4 is divided along the crack line CL. That is, a so-called break process is performed.
  • the breaking process can be performed by applying an external force to the glass substrate 4. For example, by pressing a stress applying member (for example, a member called “break bar”) on the lower surface SF2 toward the crack line CL (FIG. 8) on the upper surface SF1 of the glass substrate 4, cracks in the crack line CL are obtained. Is applied to the glass substrate 4.
  • a stress applying member for example, a member called “break bar”
  • the glass substrate 4 is divided.
  • the crack line CL forming process described above is essentially different from a so-called break process.
  • the breaking process the already formed cracks are further extended in the thickness direction to completely separate the substrate.
  • the formation process of the crack line CL brings about a change from a crackless state obtained by forming the trench line TL to a state having cracks. This change is considered to be caused by the release of internal stress that the crackless state has.
  • the axial direction AX of the cutting edge 51 is relative to the upper surface SF1. It is assumed to be vertical (FIG. 2). Thereby, the relationship between the axial direction AX and the sliding direction DA becomes constant without depending on the direction DA in which the tip 51N of the blade edge 51 is slid. Therefore, it is not necessary to adjust the posture of the blade edge 51 according to the sliding direction DA of the blade edge 51.
  • the axial direction AX of the blade edge 51 is relative to the upper surface SF1. It is assumed to be vertical. Therefore, effects similar to those of the present embodiment can be obtained in other embodiments.
  • the trench line TL has a linear shape.
  • the trench line TL includes a curved shape.
  • the process of forming the trench line TL will be described in detail.
  • trench line TL has a curved shape.
  • the step of forming the trench line TL includes the step of sliding the tip 51N of the blade edge 51 in the direction DA1 (first direction), and then the tip 51N in the direction DA2 (second). Sliding in the direction).
  • direction DA2 is different from direction DA1. Further, the sliding direction DA of the tip 51N of the blade edge 51 continuously changes between the direction DA1 and the direction DA2, as indicated by a broken line in the figure.
  • a crack line is formed along the trench line TL. Referring to FIG. 11, glass substrate 4 is divided along this crack line.
  • the sliding direction DA changes between the direction DA1 and the direction DA2.
  • the tip 51N of the blade edge 51 has axial symmetry, and the axial direction AX of the blade edge 51 is perpendicular to the upper surface SF1 (FIG. 2).
  • the relationship between the direction AX and the sliding direction DA is not affected. Therefore, it is not necessary to adjust the posture of the blade edge 51 according to the sliding direction DA of the blade edge 51. In other words, even when the trench line TL including the curved portion is formed, it is not necessary to adjust the posture of the blade edge 51 according to the sliding direction DA of the blade edge 51.
  • trench line TL substantially includes a closed curve.
  • the sliding direction DA changes in all directions as shown by the broken line in the figure.
  • the tip 51N of the blade edge 51 is slid in all directions. Since the configuration other than the above is substantially the same as the configuration of the second embodiment described above, the same or corresponding elements are denoted by the same reference numerals, and description thereof will not be repeated.
  • a crack line is formed along the trench line TL. Referring to FIG. 16, glass substrate 4 is divided along this crack line.
  • the cutting edge 51 is almost stopped relative to the glass substrate 4. If the posture of the blade edge 51 is adjusted in such a stopped state, the tip 51N of the blade edge 51 or the glass substrate 4 is likely to be damaged. According to the present embodiment, it is not necessary to adjust the posture of the blade edge 51, and thus the above-described damage can be avoided.
  • trench line TL formed in the present embodiment includes a trench line TL1 and a trench line TL2 that are parallel to each other.
  • the trench line TL1 and the trench line TL2 are alternately formed.
  • the direction DA toward the front end 51N is set as the direction DA1 while the front end 51N of the blade edge 51 is brought into contact with the upper surface SF1 of the glass substrate 4.
  • the direction DA toward the front end portion 51N is set as the direction DA2 while the front end portion 51N of the blade edge 51 is brought into contact with the upper surface SF1 of the glass substrate 4.
  • the direction DA1 and the direction DA2 are opposite to each other. Accordingly, as shown in FIG. 18, the direction DA toward which the tip 51N is directed is either the direction DA1 or the direction DA2. In the formation of the trench line TL, the sliding direction DA is discontinuously changed between the direction DA1 and the direction DA2.
  • both the trench line TL1 and the trench line TL2 are formed by sliding in the direction DA1, the cutting edge 51 is moved from one edge (left edge in the figure) to the other edge (right edge in the figure). After the trench line TL1 is formed by being moved to, an operation only for returning the blade edge 51 toward the one edge is required. On the other hand, according to the present embodiment, the trench line TL2 is formed during this operation. This reduces the time required for the process. Therefore, productivity can be improved.
  • the blade edge 51 when the trench line TL is formed, the blade edge 51 may be rotated around the axial direction AX (see the rotation RT in the figure).
  • the rotation RT may be performed while sliding the tip 51N of the blade edge 51 on the upper surface SF1 of the glass substrate 4.
  • the rotation RT may be performed constantly during sliding or may be performed intermittently.
  • the rotation RT may be performed without sliding the tip 51N of the blade edge 51 on the upper surface SF1 of the glass substrate 4.
  • the cutting edge 51 is rotated with the cutting edge 51 stopped or with the cutting edge 51 separated from the glass substrate 4.
  • the lubricant when the trench line TL is formed, the lubricant may be supplied to a position where the tip portion 51N of the blade edge 51 slides on the upper surface SF1 of the glass substrate 4. .
  • the cutting edge 51 is slid at the position where the lubricant is supplied and at the position where the lubricant is supplied.
  • Step S32 may be included.
  • the lubricant for example, a lubricating oil that is liquid at normal temperature or a solid lubricant that is normal at normal temperature can be used.
  • the blade edge 51 that slides on the upper surface SF1 of the glass substrate 4 is likely to be worn when the trench line TL is formed. According to the present embodiment, such wear can be suppressed.
  • step S10 glass substrate 4 similar to that in the first embodiment is prepared.
  • an assist line AL is provided in advance on the upper surface SF1 of the glass substrate 4.
  • assist line AL has an assist trench line TLa and an assist crack line CLa.
  • the assist trench line TLa has a groove shape.
  • the assist crack line CLa is configured by a crack in the glass substrate 4 in the thickness direction DT extending along the assist trench line TLa.
  • the assist line AL is provided by the process of simultaneously forming the assist trench line TLa and the assist crack line CLa on the upper surface SF1 of the glass substrate 4.
  • Such an assist line AL can be formed by a conventional typical scribing method.
  • such an assist line AL can be formed when the cutting edge rides on the edge ED of the upper surface SF1 of the glass substrate 4 and moves on the upper surface SF1, as indicated by an arrow in FIG.
  • the cutting edge is preferably one that is rotatably held (wheel type). In other words, it is preferable that the cutting edge is not sliding but rotating on the glass substrate 4.
  • the starting point of the assist line AL is the edge ED in FIG. 21, it may be separated from the edge ED.
  • the assist line AL may be formed by a method similar to the method of forming the crack line CL in any of the first to seventh embodiments. Further, the assist line AL may be formed using a blade edge that is slid on the glass substrate 4. Alternatively, the assist line AL may be formed using the cutting edge 51 in order to facilitate the preparation of the cutting edge for the assist line AL described above.
  • step S20 (FIG. 4), the same blade edge 51 as that of the first embodiment is prepared.
  • trench line TL is formed in step S30 (FIG. 4).
  • the trench line TL is formed by sliding the blade edge 51 from the position N1 to the position N3a via the position N2 between the position N1 and the position N3a.
  • the position N3a is disposed on the assist line AL.
  • the position N2 is disposed between the position N1 and the position N3a.
  • the blade edge 51 is further slid to the position N4 beyond the position N3a on the assist line AL.
  • the position N4 is preferably away from the edge ED.
  • the cutting edge 51 slid as described above to form the trench line TL intersects the assist line AL at the position N3a. This intersection causes a fine breakdown at the position N3a. Starting from this breakdown, a crack is generated so as to release the internal stress in the vicinity of the trench line TL. Specifically, a crack in the glass substrate 4 in the thickness direction extends from the position N3a located on the assist line AL along the trench line TL (see the arrow in FIG. 24). In other words, the formation of the crack line CL (FIG. 24) is started. Thereby, as step S50 (FIG. 4), the crack line CL is formed from the position N3a to the position N1.
  • the blade edge 51 is separated from the glass substrate 4 after reaching the position N3a.
  • the blade edge 51 is separated from the glass substrate 4 after sliding to the position N4 beyond the position N3a.
  • step S60 the glass substrate 4 is divided along the crack line CL as in the first embodiment.
  • the method for dividing the glass substrate 4 of the present embodiment is performed.
  • the blade edge 51 cuts down the glass substrate 4 at a position N3e (FIG. 5).
  • such cut-down is not necessary. Thereby, the damage to the blade edge
  • the glass substrate 4 may be divided along the assist line AL after the trench line TL intersecting with the assist line AL is formed. Thereby, an opportunity to start the formation of the crack line CL can be obtained.
  • the tip 51N of the blade edge 51 is slid on the upper surface SF1 while the axial direction AX of the blade edge 51 is perpendicular to the upper surface SF1 of the glass substrate 4.
  • This sliding is performed from the start point N1 to the end point N3 via the intermediate point N2.
  • plastic deformation is generated on the upper surface SF1 of the glass substrate 4.
  • a trench line TL extending from the start point N1 to the end point N3 via the midpoint N2 is formed on the upper surface SF1 (FIG. 4: step S30).
  • the process of forming each of the trench lines TL includes a process of forming a low load section LR as a part of the trench line TL (FIG. 25: Step S30L) and a process of forming a high load section HR as a part of the trench line TL. (FIG. 25: Step S30H).
  • a low load section LR is formed from the start point N1 to the midpoint N2
  • a high load section HR is formed from the midpoint N2 to the end point N3.
  • the load applied to the cutting edge 51 in the process of forming the high load section HR is higher than the load used in the process of forming the low load section LR.
  • the load applied to the cutting edge 51 in the process of forming the low load section LR is lower than the load used in the process of forming the high load section HR, for example, 30 to 50 of the load in the high load section HR. %. Therefore, the width of the trench line in the high load section HR is larger than the width of the low load section LR. Moreover, as shown in FIG. 27, the depth of the high load section HR is larger than the depth of the low load section LR.
  • the cross section of the trench line TL has, for example, a V shape with an angle of about 150 °.
  • the distance of the high load section HR is small considering the life of the cutting edge 51.
  • the scribe speed is reduced in the high load section HR in order to sufficiently increase the load in the high load section HR at a smaller distance. That is, since it is difficult to control to increase the load of the cutting edge 51 instantaneously, in practice, scribing is performed while increasing the load until a predetermined load is reached in a certain section starting from the position N2. . Therefore, by reducing the speed in the high load section HR, the load can be increased at a smaller distance, and the entire distance of the high load section HR can be reduced.
  • a crackless state is obtained in which the glass substrate 4 is continuously connected in the direction DC (FIGS. 28 and 29) intersecting the trench line TL immediately below the trench line TL.
  • the load applied to the blade edge is made large enough to cause plastic deformation of the glass substrate 4 and small enough not to generate cracks starting from this plastic deformation part.
  • step S50 the process of forming a crack line
  • an assist line AL that intersects the high load section HR is formed on the upper surface SF1 of the glass substrate 4.
  • the assist line AL is accompanied by a crack that penetrates in the thickness direction of the glass substrate 4.
  • the assist line AL can be formed by a normal scribing method.
  • the glass substrate 4 is separated along the assist line AL. This separation can be performed by a normal break process. As a result of this separation, the crack of the glass substrate 4 in the thickness direction is extended along the trench line TL only in the high load section HR of the trench line TL.
  • the crack line CL is formed along a part of the trench line TL as described above. Specifically, the crack line CL is formed in a portion between the side newly generated by the separation and the midpoint N2 in the high load section HR. The direction in which the crack line CL is formed is opposite to the direction DA (FIG. 26) in which the trench line TL is formed.
  • the glass substrate 4 is continuously disconnected in the direction DC intersecting the extending direction of the trench line TL immediately below the high load section HR of the trench line TL by the crack line CL.
  • continuous connection means a connection that is not interrupted by a crack.
  • the portions of the glass substrate 4 may be in contact with each other through the cracks of the crack line CL.
  • Step S60 a breaking process for dividing the glass substrate 4 along the trench line TL is performed.
  • the crack is extended along the low load section LR starting from the crack line CL.
  • the direction in which the crack extends (arrow PR in FIG. 36) is opposite to the direction DA (FIG. 26) in which the trench line TL is formed.
  • the glass substrate 4 is divided.
  • the cutting edge in the low load section LR as compared with the high load section HR.
  • the load applied to 51 (FIG. 1) is reduced. Thereby, damage to the blade edge 51 can be reduced.
  • the trench line TL does not have a crack that is a starting point at which the glass substrate 4 is divided. Therefore, when arbitrary processing is performed on the glass substrate 4 in this state, even if an unexpected stress is applied to the trench line TL, unintentional division of the glass substrate 4 is unlikely to occur. Therefore, the above process can be performed more stably.
  • the trench line TL is formed before the assist line AL is formed. Thereby, it is possible to avoid the influence of the assist line AL when the trench line TL is formed. In particular, the formation abnormality immediately after the cutting edge 51 passes over the assist line AL for forming the trench line TL can be avoided.
  • FIG. 37 is a perspective view schematically showing the configuration of the cutting instrument 150 in the present embodiment.
  • the cutting instrument 150 has a cutting edge 151 provided with a tip 151N instead of the cutting edge 51 (FIG. 2) provided with a tip 51N.
  • the blade edge 151 has a polygonal pyramid shape having rounded vertices.
  • the polygonal pyramid has a side surface SD and a ridge line RG.
  • a tip 151N is provided at the apex of the polygonal pyramid.
  • Line XXXVIII-XXXVIII corresponds to a cross section perpendicular to the axial direction AX in the vicinity of the boundary between the tip portion 151N and the other portion of the blade edge 151.
  • FIG. 37 corresponds to a cross section perpendicular to the axial direction AX in the vicinity of the boundary between the tip portion 151N and the other portion of the blade edge 151.
  • the tip portion 151N has n points PT corresponding to the n ridge lines RG (FIG. 37), and each of the points PT is in contact with the circumscribed circle CC.
  • the tip portion 151N has n sides SD corresponding to n side surfaces SD (FIG. 37), and each of the sides SD has a dimension DS. As the size of the circumscribed circle CC is constant and n increases, the dimension DS decreases, and as a result, the cross-sectional shape of the tip portion 151N approaches a circle.
  • n As n increases, the axial symmetry of the tip 151N in the axial direction AX approaches ideal geometric symmetry. Therefore, if n is large to some extent, it can be said that the tip portion 151N has axial symmetry in terms of its function. That is, it can be said that the tip portion 151N has the pseudo-axisymmetric property described above. According to the study of the present inventor, if the dimension DS is 1 ⁇ m or less, it can be said that the tip portion 151N has pseudo-axisymmetric property. For example, n satisfying this condition can be calculated from the angle of the tip portion 151N and the radius of curvature of the tip portion 151N near the axis AX. An example of this calculation will be described below.
  • Each of the tip portions 151Na to 151Nc has tip angles of 120 °, 130 °, and 140 °. Since the radius of curvature R in the vicinity of the axis AX is 3 ⁇ m, when the dimension along the axial direction AX of the tip 51N is 1 ⁇ m, each of the tips 151Na to 151Nc has a diameter of 5.08 ⁇ m, 5.62 ⁇ m, and 6.56 ⁇ m.
  • each of the tip portions 151Na to 151Nc has a circumference of 15.96 ⁇ m, 17.65 ⁇ m, and 20.60 ⁇ m. Therefore, n that makes the dimension DS (FIG. 38) 1 ⁇ m or less is 16 or more in the case of the tip portion 151Na, 18 or more in the case of the tip portion 151Nb, and 21 or more in the case of the tip portion 151Nc.
  • Each of the tip portions 151Ni to 151Nk has tip angles of 120 °, 130 °, and 140 °. Since the radius of curvature R in the vicinity of the axis AX is 5 ⁇ m, when the dimension along the axial direction AX of the tip 51N is 1 ⁇ m, each of the tips 151Ni to 151Nk has a diameter of 6.17 ⁇ m, 6.51 ⁇ m, and 7.26 ⁇ m.
  • each of the tip portions 151Ni to 151Nk has a circumference of 19.38 ⁇ m, 20.45 ⁇ m, and 22.80 ⁇ m. Therefore, n which sets the dimension DS (FIG. 38) to 1 ⁇ m or less is 20 or more in the case of the tip portion 151Ni, 21 or more in the case of the tip portion 151Nj, and 23 or more in the case of the tip portion 151Nk.
  • n is preferably 16 or more. If n ⁇ 25, pseudo axial symmetry can be obtained while using an arbitrary tip angle and radius of curvature within the range normally used. In view of workability and processing time for forming the tip, n is preferably not unnecessarily large, and therefore n is preferably 25 or less.
  • the tip of a diamond piece may be given a substantially polygonal pyramid shape by polishing the tip of a piece of material having a polygonal column shape (for example, a diamond piece) a plurality of times.
  • R chamfering may be performed on the ridgeline RG (FIG. 37).
  • the straight portion of the side SD (FIG. 38) is shortened, so that the shape of the tip portion 151N is closer to a circle. That is, the axial symmetry of the distal end portion 151N is closer to an ideal one. In this case, pseudo axial symmetry can be obtained even with smaller n.
  • the edge of the upper surface SF1 is rectangular is illustrated, but other shapes may be used.
  • the upper surface may be curved.
  • the trench line TL is linear has been described, the trench line TL may be curved.
  • the glass substrate 4 was used as a brittle board
  • substrate may be made from brittle materials other than glass, for example, may be made from ceramics, silicon, a compound semiconductor, sapphire, or quartz.
  • AL assist line CL crack line AX axial direction SF1 upper surface (one surface) HR High load section LR Low load section TL, TL1, TL2 Trench line 4 Glass substrate (brittle substrate) 50, 150 Cutting tool 51, 151 Cutting edge 51N, 151N, 151Na to 151Nc, 151Ni to 151Nk Tip 52 Support

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
PCT/JP2017/018536 2016-05-25 2017-05-17 脆性基板の分断方法 WO2017204055A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020187033990A KR102167941B1 (ko) 2016-05-25 2017-05-17 취성 기판의 분단 방법
CN201780032003.5A CN109219505B (zh) 2016-05-25 2017-05-17 脆性基板的分断方法
JP2018519215A JP6645577B2 (ja) 2016-05-25 2017-05-17 脆性基板の分断方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016103952 2016-05-25
JP2016-103952 2016-05-25

Publications (1)

Publication Number Publication Date
WO2017204055A1 true WO2017204055A1 (ja) 2017-11-30

Family

ID=60412293

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2017/018536 WO2017204055A1 (ja) 2016-05-25 2017-05-17 脆性基板の分断方法

Country Status (5)

Country Link
JP (1) JP6645577B2 (ko)
KR (1) KR102167941B1 (ko)
CN (1) CN109219505B (ko)
TW (1) TWI740945B (ko)
WO (1) WO2017204055A1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022100469A (ja) * 2020-12-24 2022-07-06 三星ダイヤモンド工業株式会社 脆性材料基板の加工方法及び分断方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108428728B (zh) * 2018-05-14 2019-07-02 云谷(固安)科技有限公司 阵列基板及制作方法、显示面板及制作方法、显示装置
US10840267B2 (en) 2018-05-14 2020-11-17 Yungu (Gu'an) Technology Co., Ltd. Array substrates and manufacturing methods thereof, and display panels

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006007677A (ja) * 2004-06-29 2006-01-12 National Institute For Materials Science ダイヤモンド多結晶体スクライバー
JP2014031292A (ja) * 2012-08-03 2014-02-20 Mitsuboshi Diamond Industrial Co Ltd 強化ガラス基板のスクライブ方法
JP2014088295A (ja) * 2012-10-31 2014-05-15 Amagasaki Kosakusho:Kk 硬質脆性板の割断装置
JP2016069195A (ja) * 2014-09-26 2016-05-09 三星ダイヤモンド工業株式会社 基板分断方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3074143B2 (ja) 1995-11-06 2000-08-07 三星ダイヤモンド工業株式会社 ガラスカッターホイール
CN100528507C (zh) * 2002-11-06 2009-08-19 三星钻石工业股份有限公司 划线形成设备和划线形成方法
JP5060880B2 (ja) * 2007-09-11 2012-10-31 三星ダイヤモンド工業株式会社 脆性材料基板の分断装置および分断方法
JP5597327B2 (ja) * 2010-06-29 2014-10-01 学校法人東京理科大学 ダイヤモンド被覆工具およびその製造方法
JP2015191999A (ja) * 2014-03-28 2015-11-02 三星ダイヤモンド工業株式会社 シリコン基板の分断方法
TWI680106B (zh) 2014-03-31 2019-12-21 日商三星鑽石工業股份有限公司 脆性材料基板之分斷方法
EP3199499A4 (en) * 2014-09-25 2018-06-06 Mitsuboshi Diamond Industrial Co., Ltd. Method for cutting brittle substrate

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006007677A (ja) * 2004-06-29 2006-01-12 National Institute For Materials Science ダイヤモンド多結晶体スクライバー
JP2014031292A (ja) * 2012-08-03 2014-02-20 Mitsuboshi Diamond Industrial Co Ltd 強化ガラス基板のスクライブ方法
JP2014088295A (ja) * 2012-10-31 2014-05-15 Amagasaki Kosakusho:Kk 硬質脆性板の割断装置
JP2016069195A (ja) * 2014-09-26 2016-05-09 三星ダイヤモンド工業株式会社 基板分断方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022100469A (ja) * 2020-12-24 2022-07-06 三星ダイヤモンド工業株式会社 脆性材料基板の加工方法及び分断方法
JP7255890B2 (ja) 2020-12-24 2023-04-11 三星ダイヤモンド工業株式会社 脆性材料基板の加工方法及び分断方法

Also Published As

Publication number Publication date
TW201808840A (zh) 2018-03-16
JPWO2017204055A1 (ja) 2019-01-17
CN109219505A (zh) 2019-01-15
TWI740945B (zh) 2021-10-01
CN109219505B (zh) 2021-05-07
KR102167941B1 (ko) 2020-10-20
JP6645577B2 (ja) 2020-02-14
KR20180136528A (ko) 2018-12-24

Similar Documents

Publication Publication Date Title
WO2017204055A1 (ja) 脆性基板の分断方法
KR101912685B1 (ko) 취성 기판의 분단 방법
CN106182467B (zh) 脆性材料基板中垂直裂纹的形成方法及基板断开方法
JP6555354B2 (ja) 脆性基板の分断方法
CN107127899B (zh) 脆性基板的分割方法
TWI605024B (zh) Breaking method of brittle substrate
JP6544149B2 (ja) 脆性材料基板における傾斜クラックの形成方法および脆性材料基板の分断方法
CN107108322B (zh) 脆性衬底的分断方法
CN106466888B (zh) 脆性材料基板中的垂直裂纹形成方法及其分割方法
JP6648817B2 (ja) 脆性基板の分断方法
JP6589381B2 (ja) 脆性材料基板における垂直クラックの形成方法および脆性材料基板の分断方法
KR20180002495A (ko) 취성 기판의 분단 방법
JP2017065006A (ja) 脆性基板の分断方法

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 2018519215

Country of ref document: JP

ENP Entry into the national phase

Ref document number: 20187033990

Country of ref document: KR

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 17802647

Country of ref document: EP

Kind code of ref document: A1

122 Ep: pct application non-entry in european phase

Ref document number: 17802647

Country of ref document: EP

Kind code of ref document: A1