TWI738642B - 熱塑性樹脂薄膜層合體、及含有熱塑性樹脂薄膜層合體之成形品 - Google Patents
熱塑性樹脂薄膜層合體、及含有熱塑性樹脂薄膜層合體之成形品 Download PDFInfo
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- TWI738642B TWI738642B TW105109227A TW105109227A TWI738642B TW I738642 B TWI738642 B TW I738642B TW 105109227 A TW105109227 A TW 105109227A TW 105109227 A TW105109227 A TW 105109227A TW I738642 B TWI738642 B TW I738642B
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- thermoplastic resin
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- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
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- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
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- B32—LAYERED PRODUCTS
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Abstract
藉由熱塑性樹脂薄膜與熱塑性樹脂成形品之超音波熔接,而提供高的熔接強度及熔接痕較少之具有優異外觀之熱塑性樹脂薄膜層合體。
藉由將厚度0.4mm以下之熱塑性樹脂薄膜(A)與具有熔接擋邊(margin)(C)之厚度0.5mm以上之熱塑性樹脂成形品(B)之前述熔接擋邊(C)進行超音波熔接而得的熱塑性樹脂層合體,且該熔接擋邊(C)之高度為該熱塑性樹脂薄膜(A)之厚度之72~130%的熱塑性樹脂薄膜層合體,可解決上述課題。
Description
本發明有關使薄壁之熱可塑性樹脂薄膜與熱塑性樹脂成形品進行超音波熔接而得之樹脂層合體等。
近年來,關於電氣電子機器之構件,由於進展為製品之小型化與零件之薄壁化,故要求進一步之高設計性。其中內建小型充電池之電池堆用之框體,基於高容量化之目的已進展至塑膠成形品之薄壁化。日後亦因構件之薄壁化進展,一般認為電池堆用框體之厚度為0.4mm以下之部分成為佔成形品表面積中之40%以上。
作為獲得此種薄壁成形品之方法迄今所採用者,舉例為通常之射出成形法、及專利文獻1中記載之使用預先將薄壁薄膜設置於模具內進行射出成形之模內(in mold)薄膜之射出成形法等。然而通常之射出成形法中,樹脂難以對薄壁部填充,而有製品成為填充不足(short shot)之問題,且以高射出壓力填充時有成形品之薄壁部翹曲之問題。又,專利文獻1中記載之利用模內薄膜之射出
成形法,於具有開口部之成形品時,因成形品與薄膜之接觸部與非接觸部之熱收縮差,會使被覆開口部之薄膜撓曲之問題。
又此外,雖有經由接著劑或兩面膠帶貼合薄膜與射出成形品之方法等,但藉由任一方法,由於局部之接著部之厚度增加而無法獲得外觀良好者。
作為成形品等之其他接合方法,舉例有專利文獻2、3中記載之利用成形品間之摩擦之超音波熔接方法。然而,關於利用超音波熔接方法之樹脂間之接合,一般係以使厚壁之射出成形品彼此之接合為主流,以薄膜與厚壁之某射出成形品進行熔接試驗時,會有容易因薄膜接觸成形品時之熔接痕而產生外觀不良之問題。
[先前技術文獻]
[專利文獻]
專利文獻1:日本特開2013-129077號公報
專利文獻2:日本專利第4558374
專利文獻3:日本特開62-54757號公報
本發明之課題在於藉由熱塑性樹脂薄膜與熱塑性樹脂成形品之超音波熔接,而提供高的熔接強度及熔
接痕較少之具有優異外觀之熱塑性樹脂薄膜層合體。
本發明人等為解決上述課題而重複檢討之結果,而著眼於熱塑性樹脂薄膜與熱塑性樹脂成形品之熱變形溫度之差、及設置於熱塑性樹脂成形品表面之熔接擋邊(導能角(energy director))之高度,而可能過去為困難之薄膜熔接品之良好外觀與熔接強度之兼具。
亦即,本發明係關於以下所示之使熱塑性樹脂薄膜與熱塑性樹脂成形品進行超音波熔接而得之熱塑性樹脂薄膜層合體者,以下為主旨。
[1]一種熱塑性樹脂薄膜層合體,其係將厚度0.4mm以下之熱塑性樹脂薄膜(A)與具有熔接擋邊(C)之厚度0.5mm以上之熱塑性樹脂成形品(B)之前述熔接擋邊(C)進行超音波熔接而得的熱塑性樹脂層合體,該熔接擋邊(C)之高度為該熱塑性樹脂薄膜(A)之厚度之72~130%,熱塑性樹脂薄膜(A)與熱塑性樹脂成形品(B)之熱變形溫度之差為20℃以下。
[2]如[1]記載之熱塑性樹脂薄膜層合體,其中熱塑性樹脂薄膜(A)與熱塑性樹脂成形品(B)為以同種的樹脂材料形成。
[3]如[1]或[2]記載之熱塑性樹脂薄膜層合體,其中熱塑性樹脂薄膜(A)之厚度為0.2mm~0.3mm。
[4]如[1]~[3]中任一項記載之熱塑性樹脂薄膜層合
體,其中熱塑性樹脂成形品(B)具有至少一個3cm2以上之開口部,熱塑性樹脂薄膜(A)覆蓋前述開口部之至少一部分。
[5]一種成形品,其係含有如[1]~[4]中任一項記載之熱塑性樹脂薄膜層合體。
將熱塑性樹脂薄膜與熱塑性樹脂成形品進行超音波熔接之本發明之熱塑性樹脂薄膜層合體具有優異之熔接強度及良好外觀。因此,本發明之熱塑性樹脂薄膜層合體可較好地使用作為例如電氣電子OA機器用框體、電池堆框體、透明窗/窗框一體成形品。
10‧‧‧熱塑性樹脂薄膜
10T‧‧‧熱塑性樹脂薄膜厚度
20‧‧‧熱塑性樹脂成形品
20H‧‧‧開口部
20S‧‧‧熔接面
24‧‧‧熔接擋邊
24H‧‧‧熔接擋邊高度
圖1為熱塑性樹脂薄膜與熱塑性樹脂成形品之簡略剖面圖。
圖2為顯示熱塑性樹脂薄膜被覆熱塑性樹脂成形品之開口部之狀態之平面圖(圖2(A))、沿圖2(A)之II-II線切斷而顯示熱塑性樹脂成形品之側面形狀之剖面圖(圖2(B))。
圖3為與圖2不同之熱塑性樹脂成形品之平面圖。
圖4係放大顯示圖3中之熱塑性樹脂成形品之區域I及II之平面圖。
以下詳細說明本發明。又,本發明不限於以下之實施形態,在具有發明效果之範圍內可實施任意變更。
[熱塑性樹脂薄膜(A)、熱塑性樹脂成形品(B)及熱塑性樹脂成形品之熔接擋邊(導能角)(C)之組成]
本發明之樹脂組成物中所含之熱塑性樹脂並未特別限制,可自過去作為成形材料使用者中任意選擇使用。舉例為例如苯乙烯系樹脂、聚苯醚系樹脂、聚烯烴系樹脂、聚氯乙烯系樹脂、聚醯胺系樹脂、聚酯系樹脂、聚碳酸酯系樹脂及丙烯酸系樹脂等。
作為苯乙烯系樹脂舉例為例如苯乙烯、α-甲基苯乙烯等之均聚物或該等之共聚物,或該等與共聚合之不飽和單體之共聚物等。具體舉例為一般用聚苯乙烯(GPPS)、耐衝擊性聚苯乙烯(HIPS)、耐熱性聚苯乙烯(例如α-甲基苯乙烯聚合物或共聚物等)、丙烯腈.丁二烯.苯乙烯共聚物(ABS)、丙烯腈.丁二烯.苯乙烯.α-甲基苯乙烯共聚物(α-甲基苯乙烯系耐熱ABS)、丙烯腈.丁二烯.苯乙烯.苯基馬來醯亞胺共聚物(苯基馬來醯亞胺系耐熱ABS)、丙烯腈-苯乙烯共聚物(AS)、丙烯腈-氯化聚苯乙烯.苯乙烯系共聚物(ACS)、丙烯腈.乙烯丙烯橡膠.苯乙烯共聚物(AES)、丙烯酸橡膠.丙烯腈.苯乙烯共聚物(AAS)或間規(syndiotactic)聚苯乙烯(SPS)等。且苯乙烯
系樹脂亦可為聚合物摻合者。
作為聚苯醚系樹脂(PPE)舉例為例如聚(2,6-二甲基-1,4-伸苯基)醚、聚(2-甲基-6-乙基-1,4-伸苯基)醚等之均聚物,亦可使用該等以苯乙烯系樹脂改質者。
作為聚烯烴系樹脂代表性舉例為乙烯、丙烯、丁烯-1、3-甲基丁烯-1、3-甲基戊烯-1、4-甲基戊烯-1等之α-烯烴之均聚物或該等之共聚物,或該等與其他可共聚合不飽和單體之共聚物等。作為代表例可舉例高密度聚乙烯、中密度聚乙烯、低密度聚乙烯、直鏈狀低密度聚乙烯、超高分子量聚乙烯、乙烯.乙酸乙烯酯共聚物、乙烯.丙烯酸乙酯共聚物、苯乙烯.辛烯-1共聚物等之茂金屬系乙烯.α-烯烴共聚物等之聚乙烯類、無規聚丙烯、間規聚丙烯、等歸聚丙烯或丙烯.乙烯嵌段共聚物或無規共聚物等聚丙烯類、聚甲基戊烯-1等。
作為聚氯乙烯系樹脂舉例為例如氯乙烯均聚物或氯乙烯與可共聚合之不飽和單體之共聚物。具體舉例為氯乙烯.丙烯酸酯共聚物、聚乙烯.甲基丙烯酸酯共聚物、氯乙烯.乙烯共聚物、氯乙烯.丙烯共聚物、氯乙烯.乙酸乙烯酯共聚物、氯乙烯.偏氯乙烯共聚物等。又,亦可使用將該等聚氯乙烯系樹脂氯化而提高氯含量者。
作為聚醯亞胺系樹脂(PA)可舉例例如6-耐綸(聚醯胺6)或12-耐綸等為代表之環狀脂肪族內醯胺開環聚合者、6,6-耐綸、6,10-耐綸、6,12-耐綸等之脂肪族二胺與
脂肪族二羧酸進行聚縮合者,或視情況使芳香族二胺、芳香族二羧酸共聚縮合者等。
作為聚酯系樹脂舉例為例如芳香族二羧酸與乙二醇、丙二醇、丁二醇等之烷二醇聚縮合者。作為具體例,舉例為聚對苯二甲酸乙二酯(PET)、聚對苯二甲酸丙二酯(PPT)、聚對苯二甲酸丁二酯(PBT)等。
作為聚碳酸酯系樹脂舉例為例如4,4’-二羥基二芳基烷烴系聚碳酸酯等。作為具體例可舉例為雙酚A系聚碳酸酯(PC)、改質雙酚系聚碳酸酯、該等之共聚物等。
作為丙烯酸系樹脂舉例為例如甲基丙烯酸酯、丙烯酸酯均聚物或該等之共聚物、或該等與其他可共聚合之不飽和單體之共聚物等。作為甲基丙烯酸酯、丙烯酸酯單體,舉例為甲基丙烯酸或丙烯酸之甲酯、乙酯、正丙酯、異丙酯、丁酯之各種酯體等。代表性舉例為聚甲基丙烯酸甲酯(PMMA)。
[熱塑性樹脂薄膜(A)]
本發明中,熱塑性樹脂薄膜(A)之厚度為0.4mm以下。此意指熱塑性樹脂薄膜中,厚度為0.4mm以下之區域的表面積佔薄膜全體表面積之70%以上者。熱塑性樹脂薄膜(A)之厚度大於0.4mm時,通常射出成形之成形變容易。且由於具有充分厚度故未觀察到因導能角之押入所致之外觀不良,因此無法充分得到本發明效果。熱塑性樹脂薄膜(A)之較佳厚度為自0.01mm至0.4mm以下,更好為
自0.1mm至0.4mm,最好為自0.2mm至0.3mm。熱塑性樹脂薄膜(A)之厚度若小於0.01mm,則由於薄膜過薄,故無法獲得超音波熔接後之良好外觀,且作為框體使用時,可能產生內部零件之保護不充分之問題。又,本發明之熱塑性樹脂薄膜(A)可使用自利用T模嘴之熔融擠出法、溶劑澆鑄法、吹塑成形法製造之薄膜。
[熱塑性樹脂成形品(B)]
本發明中,熱塑性樹脂成形品(B)厚度之平均為0.5mm以上。熱塑性樹脂成形品(B)之成形方法舉例為射出成形品、加壓成形品、吹塑成形品、擠出成形品、真空成形品、壓空成形品等,但基於生產性之觀點較好使用射出成形品。
本發明之熱塑性樹脂薄膜層合體中,熱塑性樹脂成形品(B)不限於平板狀,亦可為三次元形狀。作為特別有效之形狀,熱塑性樹脂成形品(B)為具有3cm2以上之開口部之三次元成形品,例如框體,且該開口部以熱塑性樹脂薄膜(A)覆蓋之構成於本發明中可較好地使用。藉由以熱塑性樹脂薄膜(A)覆蓋熱塑性樹脂成形品(B)之開口部,可使構件輕量化例如可使框體的成形品(B)之內部中之零件高填充化。
[熱塑性樹脂成形品之熔接擋邊(導能角)(C)]
熔接擋邊(導能角)(C)係為了接合熱塑性樹脂薄膜(A)
與熱塑性樹脂成形品(B)而設置於熱塑性樹脂成形品(B)之熔接面。作為接合方法係使用超音波熔接。超音波熔接中,將超音波能集中於設置於熱塑性樹脂成形品(B)之熔接擋邊(導能角),藉由熱塑性樹脂成形品(B)之熔接擋邊(導能角)(C)與熱塑性樹脂薄膜(A)之摩擦產生之發熱,使熔融之熔接擋邊(導能角)與熱塑性樹脂薄膜(A)接合。
導能角係朝向所接合之熱塑性樹脂薄膜(A)側亦即上側之凸形狀,較好薄膜厚度之剖面形狀為三角形。關於該剖面之三角形,係使用頂點角度為40度至120度之導能角,較好頂點角度為50~70度,最好為60度。亦即,特佳剖面形狀為正三角形。如此,若熔接擋邊(導能角)(C)之剖面形狀為三角形,特別是正三角形,則超音波熔接時,超音波能量可集中於上端部亦即三角形頂點,且可確保熱塑性樹脂成形品(B)側亦即三角形底邊側之熔接擋邊之區域。基於此等觀點,熔接擋邊(導能角)(C)之剖面形狀應避免四角形,較好亦避免圓形。熔接擋邊(導能角)(C)之形狀可藉由射出成形或熱加壓成形後以模具轉印之方法、成形品之機械切削、印刷等之加工而賦予。
又,熔接擋邊(C)較好於熱塑性樹脂成形品(B)之熔接面以連續行狀(線狀)配置。尤其熔接擋邊(C)較好於熱塑性樹脂成形品(B)之熔接面設為一行。係因為熱塑性樹脂成形品(B)之熔接面之熔接擋邊(C)設置複數行例如平行之複數行時,超音波能量分散至複數行。
熔接擋邊((C)導能角)之高度亦即如圖1所示
般,自熱塑性樹脂成形品(B)20之熔接面20S至例如剖面為三角形之熔接擋邊24之頂點之長度24H,較好為熱塑性樹脂薄膜(A)10之厚度10T之72%~130%。亦即,熱塑性樹脂薄膜(A)之厚度設為A(mm)、熔接擋邊(C)之高度設為C(mm)時,C(mm)/A(mm)×100(%)之值較好為72%~130%,(1-C(mm)/A(mm))×100(%)之值較好為-28%~30%。
又較好,熔接擋邊24之高度24H為熱塑性樹脂薄膜(A)10之厚度10T之75~125%,更好為80~120%,特佳為85~115%。熔接擋邊(導能角)之高度24H超過上限時,雖獲得熔接強度但可能產生易因導能角之押入引起外觀不良之問題。且熔接擋邊(導能角)之高度24H未達下限時,雖獲得良好外觀之層合體,但可能產生熔接強度降低之問題。
如圖1所示,以熱塑性樹脂薄膜10與熱塑性樹脂成形品20相互對向之狀態,藉由如箭頭所示之熔接之超音波熔接,形成熱塑性樹脂薄膜10與熱塑性樹脂成形品20之層合體。如此獲得之層合體之熱塑性樹脂薄膜10與熱塑性樹脂成形品20之間,熔接擋邊24因超音波熔接而熔化成為與熱塑性樹脂薄膜10熔融混合之接合部。因此,所製造之層合體之熱塑性樹脂薄膜10與熱塑性樹脂成形品20之接合區域,於該等構件之表面均實質平滑,不會產生外觀上之問題。
[熱塑性樹脂薄膜(A)、熱塑性樹脂成形品(B)之熱變形溫度]
本發明之熱塑性樹脂薄膜(A)、熱塑性樹脂成形品(B)之熱變形溫度,於該等樹脂為非晶性樹脂時設為玻璃轉移溫度,該等樹脂為結晶性樹脂時設為熔點。熱變形溫度可藉由DSC(示差熱掃描熱量分析計)測定。非相溶系之聚合物合金材時,設為基質樹脂之熱變形溫度。
熱塑性樹脂薄膜(A)與熱塑性樹脂成形品(B)之組合較好使用熱變形溫度之差為20℃以下者。更好熱變形溫度之差為15℃以下,特佳為10℃以下。其中較好使用熱塑性樹脂薄膜(A)與熱塑性樹脂成形品(B)樹脂之種類為相溶性高者,或反應性高者。特別是熱塑性樹脂薄膜(A)與熱塑性樹脂成形品(B)較好由同種樹脂材料形成。此處所謂同種材料意指段落[0013]以下所示之樹脂之系統為相同者,更具體而言為具有同種化學鍵之熱塑性樹脂材料。因此,若為具有同種分子構造之樹脂材料,則可為分子量不同者,亦可為共聚合種類、共聚合組成比、添加劑之調配量不同者,定義為本發明中之同種樹脂材料。
熱塑性樹脂薄膜(A)與熱塑性樹脂成形品(B)之熱變形溫度之差超過20℃時,於外觀優先時,樹脂熔接強度不充分,於其熔接強度優先時由於需要更高的超音波能量,故可能產生所得熱塑性樹脂薄膜層合體(成形品)之外觀劣化之問題。
[熱塑性樹脂薄膜層合體之製造方法]
本發明之熱塑性樹脂薄膜層合體之製造方法中,使用超音波熔接。亦即,熱塑性樹脂薄膜層合體係藉由使上述之熱塑性樹脂薄膜(A)與上述之熱塑性樹脂成形品(B)之熔接擋邊(C)進行超音波熔接而製造。例如於熱塑性樹脂成形品(B)之開口部周圍設置熔接擋邊(C),以覆蓋開口部之方式使熱塑性樹脂薄膜(A)接合,獲得熱塑性樹脂薄膜層合體。
如以上,藉由將熱塑性樹脂薄膜(A)之厚度調整為特定範圍內之值,進而於熱塑性樹脂成形品(B)之熔接表面設置特定高度之熔接擋邊(C)之製法,可獲得熔接強度及外觀良好之層合體,進而藉由抑制熱塑性樹脂薄膜(A)與熱塑性樹脂成形品(B)之熱變形溫度之差,可確實兼具高的熔接強度與良好外觀。
本發明所用之熱塑性樹脂組成物只要不顯著損及期望之諸物性,則亦可根據需要含有上述者以外之成分。作為其他成分舉例為例如磷酸酯、亞磷酸酯為代表之熱安定劑,以受阻酚化合物為代表之抗氧化劑,以苯并三唑系化合物為代表之紫外線吸收劑、防霧劑、抗黏連劑、流動性改良劑、衝擊強度改良劑、滑動性改質劑、可塑劑、分散劑、抗菌劑、難燃劑、玻璃纖維、碳纖維等之各種樹脂添加劑等。該等樹脂添加劑可含有1種,亦可以任意組合及比例含有2種以上。
圖2所示之本發明之一實施形態中,對於具
有開口部20H之熱塑性樹脂成形品20,以熱塑性樹脂薄膜10覆蓋開口部20H之方式,可形成抑制熱塑性樹脂薄膜10與熱塑性樹脂成形品20之層合體。該情況下,熱塑性樹脂薄膜10之熔接面10S與熱塑性樹脂成形品20之熔接面20S(參考圖1)接觸之區域,亦即圖2之交界面30S中,熱塑性樹脂薄膜10與熱塑性樹脂成形品20藉由超音波熔接而熔接。
如此製造之框體的層合體40中,與由厚度大於熱塑性樹脂薄膜10之熱塑性樹脂成形品20之壁構件20W全面形成之情況相比,可確保更廣的內部空間40A,例如收容電子等之內部零件之空間增加。
[實施例]
以下,顯示實施例對本發明更具體說明。惟,本發明不限定於以下之實施例者,在不脫離本發明主旨之範圍內,可任意實施變更。
<熱變形溫度之測定>
熱塑性樹脂之熱變形溫度(Tg)係以示差掃描熱量分析計SEIKO電子工業(股)製之SSC-5200(DSC)測定。測定中,在氮氣氛圍下以20℃/min升溫至使樹脂成分熔融之溫度(260℃),急冷至-30℃後,再度以10℃/min升溫(第二輪)。自所得DSC曲線利用起點法求出玻璃轉移溫度及熔點。
<熔接強度>
作為超音波熔接強度之評價,係以手指自成形品側押入薄膜層合體之熔接後之成形品之成形品開孔部。
特別良好:於熔接部未見到破壞。
良好:一部分熔接部見到破壞。
不良:熔接之薄膜剝離。
<外觀評價>
目視進行薄膜層合體之超音波熔接後之成形品層合體之外觀評價。目視觀察係對薄膜側進行。薄膜表面幾乎無因熔接擋邊(導能角)之押入導致之表面損傷之特別優異狀態設為特別良好,表面損傷較少之良好狀態設為良好,表面傷痕稍明顯者設為稍不良。表面損傷大外觀劣化之狀態設為不良。
<撓曲性評價>
如圖3所示,使具有2個開口部之圖1及圖2所示之成形品以薄膜層合體熔接於形狀不同之平板狀成形品後,以目視確認成形品層合之撓曲程度。幾乎無撓曲之狀態設為良好,撓曲較大之狀態設為不良。
[使用材料]
<熱塑性樹脂>
聚碳酸酯樹脂以表1之調配實施混合化,聚對苯二甲酸丁二酯係使用市售品。
(a-1)三菱工程塑膠(股)製「UPILON(註冊商標)S-3000F」,雙酚A型芳香族聚碳酸酯樹脂,熱變形溫度(玻璃轉移溫度)145℃
(a-2)三菱工程塑膠(股)製「NOVADURAN(註冊商標)5020」,聚對苯二甲酸丁二酯樹脂,熱變形溫度(熔點)224℃
(a-3)三菱工程塑膠(股)製「NOVADURAN(註冊商標)5510S」,聚對苯二甲酸丁二酯樹脂,熱變形溫度(熔點)219℃
<難燃劑>
(b-1)大八化學工業(股)製「PX-200」,芳香族縮合磷酸酯系難燃劑,1,3-伸苯基雙(二-2,6-二甲苯磷酸酯)
[實施例1~10、比較例1~4]
<樹脂顆粒之製造>
聚碳酸酯樹脂組成物之混合化時,使用具備1個排放口之日本製鋼所公司製雙軸擠出機TEX30α(C18 block)。接著,以螺桿轉數200rpm、噴出量20kg/小時、滾筒溫度270℃之條件,混練各成分,將擠出為線股狀之熔融樹脂於水槽中急冷,使用切粒機顆粒化,獲得聚碳酸酯樹脂組成物之混合物。
<熱塑性樹脂薄膜(A)>
使用由滾筒直徑32mm、螺桿之L/D=35之雙軸擠出機所成之T模嘴熔融擠出機,以噴出量20kg/h、螺桿旋轉數200rpm成形寬度400mm之薄片。汽缸.模頭溫度之設定,於聚碳酸酯係於260℃進行,於聚對苯二甲酸丁二酯係於235℃進行。使用薄膜表面係一者為鏡面,另一者轉印有表面粗糙度Ra=1.5μm之墊子形狀者。使用薄膜厚度示於表1者。超音波熔接試驗所用之薄膜大小為了覆蓋圖3所示之熱塑性樹脂成形品(B)而使用切成150mm×40mm者。
<熱塑性樹脂成形品(B)>
以射出成形成形表1所記載之組成品之150mm×100mm×1.2mm厚平板之樹脂板。藉由切削加工所得射出成形品,製造圖3所示之尺寸、及具有圖1概略所示之形狀之熔接擋邊(ED,導能角)(C)24之熱塑性樹脂成形品(B)20。又,圖3及4中與符號中不同之數值表示各構件之尺寸(mm)。該等數值為各構件尺寸之一例,各構件之尺寸並非限定者。
<具備層合體之樹脂成形品>
上述熱塑性樹脂成形品(B)20與熱塑性樹脂薄膜(A)10成為一體而製作熔接擋邊一體型熱塑性樹脂成形品。熔接
擋邊(ED,導能角)(C)之高度設為表1所示之0.1~0.4mm之值。而且使用具有圖3所示形狀之熱塑性樹脂成形品(B)20,以熱塑性樹脂薄膜完全覆蓋2個開口部20H之方式,使熱塑性樹脂薄膜10與熱塑性樹脂成形品20熔接。熱塑性樹脂成形品(B)20之厚度為1.0mm,縱及橫之長度分別為4.0cm及15.0cm,各開口部20H之縱及橫之長度分別為1.0cm及12.5cm,各開口部20H之面積為12.5cm2(參考圖3)。而且,於熱塑性樹脂成形品(B)20之熔接面20S上,以包圍開口部20H周圍之方式,將熔接擋邊(C)24設於以虛線表示之位置。圖4中,放大顯示圖3所示之熔接面20S之區域I及II。
如此,以包圍開口部20H之實質全周之方式設置熔接擋邊(C)24進行超音波熔接,可將熱塑性樹脂薄膜(A)10對於熱塑性樹脂成形品(B)20強固地固定。又,於熔接面20S之區域I中,藉由設置熔接擋邊(C)24之中斷區域20D(參考圖4),可使設置熔接擋邊之加工變容易。
<模內薄膜成形>
針對覆蓋成形品開口部之薄膜撓曲狀態,為了對超音波熔接品與藉由模內薄膜之射出成形品進行比較,藉由模內薄膜成形射出成形品。預先於模具內設置與超音波熔接用成形品同尺寸(150mm×40mm)之聚碳酸酯樹脂薄膜,以未雕入超音波熔接用模具之熔接擋邊(C)之模具進行聚碳酸酯樹脂之射出成形。以下之成形條件亦即汽缸溫度320℃、模具溫度95℃之條件成形。以模內薄膜成形所得之結果示於比較例4。
<超音波熔接方法>
超音波熔接係使用日本EMERSON公司製之Branson 2000×dt(20kHz 2200W),使用配合成形品形狀之鈦合金製之熔接角(horn)。熔接試驗係於熱塑性樹脂薄膜(A)之鏡面側與熱塑性樹脂成形品(B)之形成熔接擋邊之面進行,將熱塑性樹脂成形品(B)固定於上部角側,熱塑性樹脂薄膜(A)固定於下部角承台進行熔接試驗。為了保護熱塑性樹脂薄膜(A)之墊子花樣,於薄膜接觸厚度0.03mm之聚乙烯製保護薄膜進行試驗。超音波熔接試驗中之參數設定係如下。亦即,以照射時間0.3秒(聚對苯二甲酸丁二酯樹脂時為0.45秒),固定時間0.3秒,汽缸壓力200kPa,觸發力250N,及振幅100%之條件實施超音波溶接試驗。
上述實施例1~10中,熔接強度、薄膜外觀及形狀任一者均為良好以上,相對於此,比較例1~4中,至少一評價項目成為比實施例差之結果。由以上,確認藉由於熱塑性樹脂成形品之熔接面設置適當大小之熔接擋邊,將熱塑性樹脂薄膜與形成熱塑性樹脂成形品之樹脂之熱變形溫度調整為較小而藉由超音波熔接,可製造比模內成形所得者具有更高熔接強度及優異外觀之層合體。
10‧‧‧熱塑性樹脂薄膜
10S‧‧‧熔接面
10T‧‧‧熱塑性樹脂薄膜之厚度
20‧‧‧熱塑性樹脂成形體
20S‧‧‧熔接面
24‧‧‧熔接擋邊
24H‧‧‧熔接擋邊之高度
Claims (4)
- 一種熱塑性樹脂薄膜層合體,其係將厚度為0.1mm至0.4mm之熱塑性樹脂薄膜(A)與具有熔接擋邊(Margin)(C)之厚度0.5mm以上之熱塑性樹脂成形品(B)之前述熔接擋邊(C)進行超音波熔接而得的熱塑性樹脂層合體,該熔接擋邊(C)之高度為該熱塑性樹脂薄膜(A)之厚度的72~130%,前述熱塑性樹脂薄膜(A)與前述熱塑性樹脂成形品(B)之熱變形溫度之差為20℃以下,前述熱塑性樹脂成形品(B)具有至少一個3cm2以上的開口部,前述熱塑性樹脂薄膜(A)覆蓋前述開口部之至少一部分,前述熱塑性樹脂層合體具有內部空間,前述熔接擋邊(C)設置於前述熱塑性樹脂成形品(B)之前述開口部的周圍。
- 如申請專利範圍第1項之熱塑性樹脂薄膜層合體,其中前述熱塑性樹脂薄膜(A)與前述熱塑性樹脂成形品(B)以相同種類的樹脂材料所形成。
- 如申請專利範圍第1項之熱塑性樹脂薄膜層合體,其中前述熱塑性樹脂薄膜(A)的厚度為0.2mm~0.3mm。
- 一種成形品,其係含有如申請專利範圍第1~3項中任一項之熱塑性樹脂薄膜層合體。
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KR102561388B1 (ko) * | 2023-04-17 | 2023-08-01 | 김병진 | 골판지 인쇄용 조판지 제조방법 및 이에 의해 제조된 조판지 |
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- 2016-03-24 US US15/559,184 patent/US20180071995A1/en not_active Abandoned
- 2016-03-24 CN CN201680015816.9A patent/CN107405890B/zh active Active
- 2016-03-24 KR KR1020177027781A patent/KR102427367B1/ko active IP Right Grant
- 2016-03-24 JP JP2017508421A patent/JP6718863B2/ja active Active
- 2016-03-24 TW TW105109227A patent/TWI738642B/zh active
- 2016-03-24 WO PCT/JP2016/059387 patent/WO2016152974A1/ja active Application Filing
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US20140326391A1 (en) * | 2011-11-08 | 2014-11-06 | Dai Nippon Printing Co., Ltd. | Method for producing cell culture vessel |
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KR20170131477A (ko) | 2017-11-29 |
JPWO2016152974A1 (ja) | 2018-01-18 |
WO2016152974A1 (ja) | 2016-09-29 |
CN107405890B (zh) | 2020-09-29 |
CN107405890A (zh) | 2017-11-28 |
JP6718863B2 (ja) | 2020-07-08 |
KR102427367B1 (ko) | 2022-07-29 |
US20180071995A1 (en) | 2018-03-15 |
TW201702075A (zh) | 2017-01-16 |
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