TWI729076B - 載體系統與製造多層-載體系統的方法 - Google Patents

載體系統與製造多層-載體系統的方法 Download PDF

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Publication number
TWI729076B
TWI729076B TW106105901A TW106105901A TWI729076B TW I729076 B TWI729076 B TW I729076B TW 106105901 A TW106105901 A TW 106105901A TW 106105901 A TW106105901 A TW 106105901A TW I729076 B TWI729076 B TW I729076B
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TW
Taiwan
Prior art keywords
substrate
multilayer
multilayer ceramic
carrier system
ceramic substrate
Prior art date
Application number
TW106105901A
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English (en)
Chinese (zh)
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TW201810451A (zh
Inventor
湯瑪士 費區廷格爾
法蘭司 瑞嫩爾
寬特 波德米奇
威尼爾 羅列特
麥克 維格尼
Original Assignee
德商Ｅｐｃｏｓ Ａｇ集團股份公司
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Publication of TW201810451A publication Critical patent/TW201810451A/zh
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Publication of TWI729076B publication Critical patent/TWI729076B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0257—Overvoltage protection
    • H05K1/0259—Electrostatic discharge [ESD] protection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/073—High voltage adaptations
    • H05K2201/0738—Use of voltage responsive materials, e.g. voltage switchable dielectric or varistor materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
TW106105901A 2016-04-22 2017-02-22 載體系統與製造多層-載體系統的方法 TWI729076B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
??102016107493.4 2016-04-22
DE102016107493.4A DE102016107493B4 (de) 2016-04-22 2016-04-22 Trägersystem, Verfahren zu seiner Herstellung und Verwendung desselben
DE102016107493.4 2016-04-22

Publications (2)

Publication Number Publication Date
TW201810451A TW201810451A (zh) 2018-03-16
TWI729076B true TWI729076B (zh) 2021-06-01

Family

ID=58054127

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106105901A TWI729076B (zh) 2016-04-22 2017-02-22 載體系統與製造多層-載體系統的方法

Country Status (3)

Country Link
DE (1) DE102016107493B4 (de)
TW (1) TWI729076B (de)
WO (1) WO2017182157A1 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113225901B (zh) * 2021-05-12 2023-01-10 四川锐宏电子科技有限公司 一种多层厚膜陶瓷基电路板及其制备工艺

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110044369A1 (en) * 2009-08-20 2011-02-24 International Business Machines Corporation Silicon carrier optoelectronic packaging
US20110261536A1 (en) * 2008-05-21 2011-10-27 Epcos Ag Electronic Component Assembly Comprising a Varistor and a Semiconductor Component

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101199260B1 (ko) * 2004-12-06 2012-11-09 코닌클리즈케 필립스 일렉트로닉스 엔.브이. 소형 컬러 가변 광원으로서의 단일 칩 ｌｅｄ
DE102005033709B4 (de) 2005-03-16 2021-12-16 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Lichtemittierendes Modul
DE102005054955A1 (de) 2005-08-31 2007-04-26 Osram Opto Semiconductors Gmbh Lichtemittierendes Modul, insbesondere zur Verwendung in einem optischen Projektionsgerät und optisches Projektionsgerät
CN102577635B (zh) * 2009-09-17 2015-03-25 皇家飞利浦电子股份有限公司 光源模块和发光设备
KR101619832B1 (ko) * 2009-11-30 2016-05-13 삼성전자주식회사 발광다이오드 패키지, 이를 구비한 발광다이오드 패키지 모듈과 그 제조 방법, 및 이를 구비한 헤드 램프 모듈과 그 제어 방법
DE102011107895B4 (de) * 2011-07-18 2020-11-05 Heraeus Noblelight Gmbh Optoelektronisches Modul mit Linsensystem
US9538590B2 (en) * 2012-03-30 2017-01-03 Cree, Inc. Solid state lighting apparatuses, systems, and related methods
JP5914826B2 (ja) * 2012-11-20 2016-05-11 パナソニックＩｐマネジメント株式会社 発光モジュール、照明装置および照明器具
US9406654B2 (en) * 2014-01-27 2016-08-02 Ledengin, Inc. Package for high-power LED devices
DE102014112673A1 (de) * 2014-09-03 2016-03-03 Epcos Ag Leuchtdiodenvorrichtung

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110261536A1 (en) * 2008-05-21 2011-10-27 Epcos Ag Electronic Component Assembly Comprising a Varistor and a Semiconductor Component
US20110044369A1 (en) * 2009-08-20 2011-02-24 International Business Machines Corporation Silicon carrier optoelectronic packaging

Also Published As

Publication number Publication date
TW201810451A (zh) 2018-03-16
WO2017182157A1 (de) 2017-10-26
DE102016107493B4 (de) 2021-10-14
DE102016107493A1 (de) 2017-10-26

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