TWI728539B - 安裝構造體 - Google Patents

安裝構造體 Download PDF

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TWI728539B
TWI728539B TW108140269A TW108140269A TWI728539B TW I728539 B TWI728539 B TW I728539B TW 108140269 A TW108140269 A TW 108140269A TW 108140269 A TW108140269 A TW 108140269A TW I728539 B TWI728539 B TW I728539B
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package
hole
motherboard
voltage regulator
regulator module
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TW202040763A (zh
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服部誠司
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日商京瓷股份有限公司
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Abstract

本揭示的安裝構造體係包含：於上表面搭載有電子零件的封裝件；電壓調整器模組；於上表面搭載封裝件的母板；驅動器；用以將母板的導體層與封裝件的導體層電性連接的複數個連接器；以及散熱器。

Description

安裝構造體
本揭示係關於安裝構造體。
如專利文獻1的記載，將半導體元件安裝於封裝基板而得的安裝構造體中，如運算元件(CPU、GPU等)等的半導體元件有動作電壓的低電壓化、消耗電力增加的傾向。例如，為了以此種低電壓使大電力的運算元件穩定地動作，必須經由基板及封裝件，以大電流將電壓變動較小的低電壓供給至運算元件。
[先前技術文獻]
[專利文獻]
(專利文獻1)日本特許第4644717號公報
本揭示的安裝構造體係具備：於上表面搭載有電子零件的封裝件；搭載於封裝件的下表面之與電子零件相對立的位置的電壓調整器模組 (Voltage Regulator Module；VRM)；於上表面搭載封裝件的母板；搭載於母板的下表面之與電子零件相對立的位置的驅動器；以及用以將母板的導體層與封裝件的導體層電性連接的複數個連接器。母板係具有用以收容電壓調整器模組的貫穿孔、及用以使一部分的連接器從母板的上表面連通至下表面的貫穿孔。通過貫穿孔的連接器的一側的端部係連接在驅動器附近，另一側的端部係連接在電壓調整器模組附近。電壓調整器模組係經由用以收容電壓調整器模組的貫穿孔而連接有散熱器。
1、2:安裝構造體
11、21:封裝件
12、22:電子零件
13、23:電壓調整器模組(VRM)
14、24:母板
15:接著劑
25:IC座
16、26:驅動器
17、27:連接器
18、28:散熱器
第1圖係本揭示之一實施形態之安裝構造體的概略剖面圖。
第2圖係本揭示之另一實施形態之安裝構造體的概略剖面圖。
為了以大電流將電壓變動較小的低電壓供給至運算元件等電子零件，而會使用電壓調整器模組(VRM)。使用VRM時，為了抑制電壓的降低、電力的損失，以縮短電子零件與VRM之間的電流路徑為宜。同樣地，驅動器與VRM之間的電流路徑也以較短為宜。然而，VRM為了對電子零件供給較大的電力，動作時會發熱而易成為高溫。因此，必須將所產生的熱有效率地散發至安裝構造體的外部，而使熱所造成的不良影響不會波及電子零件、驅動器等。
本揭示的安裝構造體中，搭載於封裝件的電子零件與VRM之間，以及VRM與驅動器之間，以較短的電流路徑連接。結果，本揭示的安裝構造體 能夠使電子裝置穩定地動作。再者，本揭示的安裝構造體中，散熱器係連接於VRM。結果，能夠將VRM動作時產生的熱有效率地散發到安裝構造體的外部，電子裝置、驅動器等不易受到熱所造成的不良影響。
如第1圖所示，本揭示之一實施形態的安裝構造體1中，封裝件11係搭載於母板14。封裝件11係包含核心層、以及積層於核心層的兩面的絕緣層。核心層若是以具有絕緣性的材料來形成則無特別限制。具有絕緣性的材料例如可舉出環氧樹脂、雙馬來醯亞胺三嗪樹脂、聚醯亞胺樹脂、聚苯醚樹脂等樹脂等樹脂。該等樹脂也可混合兩種以上來使用。再者，核心層可含有玻璃纖維、玻璃不織布、醯胺不織布、醯胺纖維、聚酯纖維等絕緣性布料作為補強材料，也可分散有氧化矽、硫酸鋇、滑石、黏土、玻璃、碳酸鈣、氧化鈦等無機絕緣性填料。
為了電性連接核心層的上下面，核心層係形成有通孔導體。通孔導體係形成於貫穿核心層的上下面的通孔(through hole)。通孔導體係例如以銅鍍敷層等金屬鍍敷層構成的導體所形成。
核心層的兩面積層有絕緣層。第1圖所示的封裝件11中，絕緣層係分別於核心層之兩面各積層二層。與核心層同樣地，絕緣層若是以具有絕緣性的材料來形成則無特別限制。各絕緣層可由相同的樹脂來形成，也可由不同的樹脂來形成。絕緣層與核心層可由相同的樹脂來形成，也可由不同的樹脂來形成。
絕緣層通常形成有供用以將層間電性連接的連通孔導體充填的連通孔(via hole)。連通孔係藉由例如CO2雷射、UV-YAG雷射等的雷射加工而形成。
絕緣層的表面形成有導體層。導體層係包含電源用、接地用、信號用等的配線導體、焊墊等。此種導體層係例如藉由下述方法形成：例如藉由半 加成法使無電解銅鍍敷層及電解銅鍍敷層於絕緣層的表面析出之方法。或者，也可使用表面形成有導體(例如銅箔等)的絕緣板，進行曝光、顯像及蝕刻，而於絕緣層的表面形成導體層。
封裝件11的上表面搭載有電子零件12。就電子零件12而言，可舉出有例如運算元件(CPU、GPU等)、半導體元件、電容器等。一實施形態的安裝構造體中，例如可搭載動作電壓為低電壓而消耗電力較大的電子零件12。此種電子零件12的動作電壓可為0.65至0.8V左右，消耗電力可為500至1000W左右。特別是就電子零件12而言，可使用動作電壓為0.65至0.8V左右，消耗電力為500至1000W左右的運算元件。
在封裝件11的下表面，亦即電子零件12之搭載面的相反側的表面，於與電子零件12相對立的位置，搭載有電壓調整器模組(VRM)13。所謂「相對立的位置」，若是電子零件12與VRM13相對立而至少一部分重疊的位置即可，也可為電子零件12及VRM13相對立而未完全重疊的位置。VRM13係使用於將供給自母板14的高電壓(例如24至48V左右)降壓至電子零件12的動作電壓，並在電壓變動少的狀態下，將電壓提供至電子零件12。
搭載有電子零件12與VRM13的封裝件11係以接著劑15固定在母板14的上表面。於母板14的下表面，亦即封裝件11之搭載面的相反側的面係搭載有驅動器16。驅動器16係使用於監視VRM13的溫度、電流等，而對電子零件12適切地供給電流。驅動器16與VRM13以較短的電流路徑連接為宜。因此，驅動器16係搭載於與封裝件11相對立的位置。所謂「相對立的位置」，若是封裝件11與驅動器16相對立而至少一部分重疊的位置即可，也可為封裝件11及驅動器16相對立而未完全重疊的位置。
形成在封裝件11的導體層與形成在母板14的導體層係藉由連接器17而電性連接。一部分的連接器17係將搭載於母板14之上面的封裝件11的導體層與形成在母板14之下表面的導體層電性連接。因此，母板14係形成有用以使一部分的連接器17從母板的上表面貫穿至下表面的貫穿孔。該連接器17係於該貫穿孔內至少具有直徑小於該貫穿孔的孔徑而以不接觸於該貫穿孔的方式插通的部分。通過該貫穿孔的連接器17係一側的端部連接在驅動器16附近，另一側的端部連接在VRM13附近。如此地通過貫穿孔而連接時，驅動器16與VRM13係以較短的電流路徑連接。再者，藉由通過貫穿孔，能夠降低VRM13動作時產生的熱的影響。
封裝件11的下表面所搭載的VRM13係收容在形成於母板14之用以收容VRM13的貫穿孔。VRM13無須完全收容於貫穿孔，如第1圖所示，若至少VRM13的一部分進入貫穿孔即可。藉此，能夠確保VRM13的下側與後述的散熱器18的連接性，同時能夠在封裝件11與母板14之間設有固定的間隔，而容易確保連接器17的配置區域。
為了使VRM的動作時產生的熱散發到外部，一實施形態的安裝構造體係包含散熱器18。散熱器18係經由形成於母板14之用以收容VRM13的貫穿孔而與VRM13連接。具體而言，如第1圖所示，散熱器18的一部分係收容於母板14所形成的貫穿孔，VRM13與散熱器18係於此貫穿孔之中相連接。如此，由於母板14具有用以收容VRM13的貫穿孔，可容易連接VRM13與散熱器18，而能夠有效率地將VRM13的動作時產生的熱散發到外部。
本揭示的安裝構造體係不限於上述的實施形態。例如，上述的安裝構造體1中，為了將封裝件11搭載於母板14的上表面而使用了接著劑15。然而，將封裝件搭載於母板之上表面的方法並無限定。
例如，第2圖所示之另一實施形態的安裝構造體2中，搭載有電子零件22與VRM23的封裝件21係使用IC座25來固定於母板24的上表面。具體而言，首先，將搭載有電子零件22與VRM23的封裝件21收容於IC座25。再將收容了封裝件21的IC座25與母板24電性連接即可。關於安裝構造體2所包含的IC座25以外的構件，亦即封裝件21、電子零件22、VRM23、母板24、驅動器26、連接器27、及散熱器28，因與上述共通而省略詳細的說明。
1:安裝構造體
11:封裝件
12:電子零件
13:電壓調整器模組(VRM)
14:母板
15:接著劑
16:驅動器
17:連接器
18:散熱器

Claims (5)

  1. 一種安裝構造體，係具備：封裝件，係於上表面搭載有電子零件；電壓調整器模組，係搭載於前述封裝件的下表面之與前述電子零件相對立的位置；母板，係於上表面搭載前述封裝件；驅動器，係搭載於前述母板的下表面之與前述封裝件相對立的位置；以及複數個連接器，係用以將前述母板的導體層與前述封裝件的導體層電性連接；前述母板係具有用以收容前述電壓調整器模組的第一貫穿孔、及用以使一部分的前述連接器從前述母板的上表面連通至下表面的第二貫穿孔；通過前述第二貫穿孔的前述連接器的一側的端部係連接在前述驅動器附近，另一側的端部係連接在前述電壓調整器模組附近；前述電壓調整器模組係經由用以收容前述電壓調整器模組的第一貫穿孔而連接有散熱器；前述連接器係於前述第二貫穿孔內至少具有直徑小於前述第二貫穿孔的孔徑而以不接觸於前述第二貫穿孔的方式插通的部分。
  2. 如申請專利範圍第1項所述之安裝構造體，其中，前述電壓調整器模組僅有一部分位於用以收容前述電壓調整器模組的前述第一貫穿孔。
  3. 如申請專利範圍第1或2項所述之安裝構造體，其中，前述封裝件係使用IC座而固定於前述母板。
  4. 如申請專利範圍第1或2項所述之安裝構造體，其中，前述電子零件為運算元件。
  5. 如申請專利範圍第4項所述之安裝構造體，其中，前述運算元件的動作電壓為0.65至0.8V，消耗電力為500至1000W。
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