TWI728458B - Photoetching equipment and its control method, device and storage medium - Google Patents

Abstract

The embodiment of the present invention discloses a lithography equipment and its control method, device and storage medium. The lithography equipment includes two moving tables; the working area of the two moving tables includes an exposure area and a non-exposure area, and the control method of the lithography equipment includes: Control a moving table to perform the first process in the exposure area, and control another moving table to perform the second process in the non-exposed area; when a moving table completes the first process, control the other moving table in the non-exposed area to move to At the junction of the non-exposed area and the exposed area, the first process includes exposure. Because of the longer exposure time, the movement of the moving table for the second process in the non-exposed area to the exposed area can be slower, which will not cause light. The vibration of the engraving equipment and the guide rails that carry the two moving stages will not cause crosstalk to the moving stage being exposed, which is beneficial to improving the exposure accuracy and the productivity of the lithographic equipment.

Description

Photoetching equipment and its control method, device and storage medium

The embodiment of the present invention relates to the technical field of lithography equipment, for example, to a lithography equipment and its control method, device and storage medium.

With the development of lithography technology, lithography machines with large-generation dual-motion tables have been used more and more widely.

Large-generation lithography machines can be used for exposure of larger substrates, but the larger substrate size causes greater inertia when the moving table carries the substrate when moving, and the high-speed movement of the moving table will cause the vibration of the lithography machine equipment, causing two Crosstalk has occurred on the sports table, which affects the exposure accuracy.

This specification provides a lithography equipment and its control method, device and storage medium, so as to improve the productivity of the lithography equipment, eliminate the crosstalk between the two movement stages of the lithography equipment, and improve the exposure performance.

In the first aspect, an embodiment of the present invention provides a method for controlling a lithography apparatus. The lithography apparatus includes two motion stages; the working areas of the two motion stages include an exposure area and a non-exposure area, and the control method of the lithography apparatus includes: control one During the first step of the moving table in the exposure area, control another moving table to perform the second step in the non-exposed area; when one moving table completes the first step, control the other moving table in the non-exposed area to move to the non-exposed area At the junction of the zone and the exposure zone, the first step includes exposure.

In some embodiments, the lithography equipment includes a first moving table and a second moving table, the non-exposed area includes a first non-exposed area and a second non-exposed area, and the first non-exposed area, the exposed area, and the second non-exposed area Sequentially arranged along the first direction; the working area of the first movement table includes the exposure area and the first non-exposure area, the working area of the second movement table includes the exposure area and the second non-exposure area; controls a movement table to perform the first in the exposure area During the first step, controlling another moving table to perform the second step in the non-exposed area includes: controlling the first moving table to perform the first step in the exposed area, and controlling the second moving table to perform the second step in the second non-exposed area. Two processes.

In some embodiments, during the process of controlling the first moving stage to perform the first process in the exposure zone, and after controlling the second moving stage to perform the second process in the second non-exposed zone, the control method of the lithography apparatus further includes: controlling the first process During the first process of the second moving stage in the exposure zone, the first moving stage is controlled to perform the second process in the first non-exposed zone.

In some embodiments, the first process includes performing leveling and focusing, mask alignment, and exposure in sequence; the second process includes performing substrate transfer and substrate alignment in sequence.

In some embodiments, the control method of the lithography apparatus further includes: controlling the time used for leveling and focusing of the moving table for the first step in the exposure area and the time used by the moving table for the second step in the non-exposed area to transfer the substrate. The time used for aligning and exposing the moving stage mask of the first process in the exposure zone is controlled to be equal to the time used for aligning the substrate of the moving stage in the second process in the non-exposing zone.

In some embodiments, the lithographic apparatus includes a substrate alignment mark detection sensor, the substrate alignment mark detection sensor is disposed in a non-exposed area, and the non-exposed area includes a first non-exposed area and a second non-exposed area. A non-exposure zone, an exposure zone, and a second non-exposure zone are arranged in sequence along the first direction. In the first direction, the distance between the substrate alignment mark detection sensor and the boundary of the exposure zone and the non-exposure zone is greater than or equal to that of the moving platform. The length in the first direction; the control method of the lithography apparatus further includes: by controlling the substrate alignment mark detection sensor to detect an alignment mark on the surface of a motion stage and the substrate to complete the alignment of the motion stage and the substrate.

In some embodiments, in the first direction, the distance between the substrate alignment mark detection sensor and the boundary of the exposed area and the non-exposed area is equal to the length of the moving table in the first direction.

1。 In some embodiments, one side of any motion table close to the other motion table includes a substrate alignment mark, and the substrate alignment mark is configured to be opposite to the n pairs of substrate alignment marks on the motion table carrying material along the first direction. Set up in sequence at equal intervals; controlling another moving stage to perform the second process in the non-exposed area, including: controlling the alignment of the substrate alignment mark of the other moving stage with the substrate alignment mark detection sensor, and then controlling the edge of the other moving stage The first direction is divided into n steps to the exposure area, wherein the moving table moves at a constant speed during each step, where n

1.

In some embodiments, the lithographic apparatus further includes a guide rail for carrying the first movement table and the second movement table arranged along the first direction, and a first movement slider is provided between the guide rail and the first movement table, and the guide rail and the second movement table are There is a second moving slider between the moving tables, the first moving slider is close to the second moving table or the second moving slider is close to the first moving table with a distance sensor; The control method further includes: when the distance sensor detects that the distance between the first moving platform and the second moving platform is less than a preset distance threshold, controlling at least one of the first moving platform and the second moving platform to stop moving.

In the second aspect, the embodiment of the present invention further provides a control device for lithography equipment, which is used in lithography equipment. The lithography equipment includes two motion tables; the working area of the motion table includes an exposure area and a non-exposure area. The control device includes a control module; the control module is configured to control a moving table to perform the first process in the exposure area, and to control another moving table to perform the second process in the non-exposing area, and when a moving table completes the first process During the process, the other moving table in the non-exposed area is controlled to move to the junction of the non-exposed area and the exposed area. The first process includes exposure.

In a third aspect, an embodiment of the present invention further provides a lithography apparatus, including the control device provided in the second aspect, and further including two motion stages, and the working areas of the two motion stages include an exposure area and a non-exposure area.

In some embodiments, the lithography apparatus further includes a substrate alignment mark detection sensor, the substrate alignment mark detection sensor is arranged in a non-exposed area, and the non-exposed area includes a first non-exposed area and a second non-exposed area, The first non-exposed area, the exposed area, and the second non-exposed area are sequentially arranged along the first direction. In the first direction, the distance between the substrate alignment mark detection sensor and the boundary of the exposed area and the non-exposed area is greater than or equal to the moving table The length in the first direction; The substrate alignment mark detection sensor is configured to detect an alignment mark on a moving table and the surface of the substrate.

In some embodiments, in the first direction, the distance between the substrate alignment mark detection sensor and the boundary of the exposed area and the non-exposed area is equal to the length of the moving table in the first direction.

1。 In some embodiments, one side of any movement table close to the other movement table includes a substrate alignment mark; the substrate alignment mark is configured to be opposite to the n pairs of material alignment marks on the movement table carrying substrate along the first direction Set in sequence at equal intervals, where n

1.

In a fourth aspect, an embodiment of the present invention further provides a computer-readable storage medium on which a computer program is stored, and when the program is executed by a processor, the method for controlling the lithography apparatus provided in the first aspect is realized.

According to the lithography equipment and its control method, device and storage medium provided by the embodiments of the present invention, by controlling one moving table to perform the first process in the exposure area, control another moving table to perform the second process in the non-exposed area, And when the first process is completed, the moving table in the non-exposed area moves to the junction of the non-exposed area and the exposed area, and the first process includes exposure. Because the time required for exposure is usually longer, it can take a longer time for the moving table that performs the second process in the non-exposed area to complete the second process, which in turn makes the moving table that performs the second process in the non-exposed area move to the exposed area The slower speed will not cause vibration of the lithography equipment and the guide rails that carry the two motion stages, and will not cause crosstalk to the motion stage being exposed, which is beneficial to improve the exposure accuracy. Moreover, when the first process and the second process are completed at the same time, the movement table in the non-exposure area moves to the junction of the non-exposure area and the exposure area, so that the movement table can realize the seamless connection of the first and second processes, and A movement Performing the first process of the stage in the exposed area and the second process of the other moving stage in the non-exposed area at the same time is beneficial to increase the yield of the lithography equipment.

10: The first sports station

20: The second sports platform

30: Mask template

31: Mask mark

32: Photomask alignment mark detection sensor

33: Align the photomask to the fiducial mark

40: substrate

50: Substrate alignment mark detection sensor

60: substrate alignment mark

70: Material alignment mark

80: detection sensor

90: Rail

100: The first motion slider

101: Distance sensor

200: second motion slider

310: Control Module

A: Exposure area

B1: The first non-exposure zone

B2: The second non-exposure zone

[Fig. 1] is a flowchart of a method for controlling a lithography apparatus according to an embodiment of the present invention.

[Fig. 2] is a schematic diagram of the movement table and the working area of the lithography equipment provided by the embodiment of the present invention.

[Fig. 3] is a top view of a lithography apparatus provided by an embodiment of the present invention.

[Fig. 4] is a time distribution diagram of the completion of the first process and the second process by the two motion tables provided by the embodiment of the present invention.

[Fig. 5] is a schematic structural diagram of another lithography apparatus provided by an embodiment of the present invention.

[Fig. 6] is a flowchart of another method for controlling a lithography apparatus according to an embodiment of the present invention.

[Fig. 7] is a structural block diagram of a control device of a lithography apparatus according to an embodiment of the present invention.

This specification will be further described in detail below in conjunction with the drawings and embodiments. It can be understood that the specific embodiments described here are only used to explain the specification, but not to limit the specification. In addition, it should be further noted that, for ease of description, only a part of the structure related to this specification is shown in the drawings, but not all of the structure.

In order to improve the overall productivity of lithography equipment, lithography equipment with dual motion tables is more and more widely used. However, for large-generation (for example, the 6th generation, the 8.5 generation) dual-motion table lithography machine, the size of the motion table is larger, and the two motion tables move on the same guide rail. When one motion table moves at a high speed, the other motion table is moving at a high speed. Cause disturbance. However, in the existing control method for a double-motion stage lithography machine, usually when one stage is in the exposure area for exposure, the other stage performs high-speed substrate alignment in the non-exposure area, which brings a lot to the moving stage being exposed. Disturbance ultimately affects the exposure accuracy.

Based on the foregoing problems, the embodiment of the present invention provides a method for controlling a lithography apparatus. FIG. 1 is a flowchart of a method for controlling a lithography apparatus according to an embodiment of the present invention. This embodiment is applicable to the control of a lithography apparatus with a large-size dual motion stage. The method can be controlled by a control device of the lithography apparatus. To execute, the control device of the lithography equipment can be realized by software and/or hardware. The lithography equipment includes two motion tables; the working area of the motion table includes the exposure area and the non-exposure area, and the control method of the lithography equipment includes : Step 110, control a moving table to perform the first step in the exposure area, control another moving table to perform the second step in the non-exposed area, and when the first step is completed, the non-exposed area moves to the non-exposure area. At the junction of the exposure zone and the exposure zone, the first step includes exposure.

It should be noted that the movement table of the lithography equipment is used to carry the substrate, and the carrying substrate moves in the exposed area and the non-exposed area. The lithography equipment includes two moving stages, which can be controlled by controlling one moving stage to perform the first process in the exposed area and controlling the other moving stage to perform the second process in the non-exposed area. The first process includes exposure. The exposure time is usually longer. The first process of a moving table in the exposed area and the second process of another moving table in the non-exposed area are completed at the same time, so that the second process can be performed in the non-exposed area. The exercise table takes a long time to complete the second process, which in turn makes the The moving table in the second process of the exposure area moves to the exposure area at a slower speed, which will not cause vibration of the lithography equipment and the guide rails carrying the two moving tables, and will not cause crosstalk to the moving table being exposed, which is beneficial Improve exposure accuracy.

Moreover, when the first process performed by one moving table in the exposure area and the second process performed by another moving table in the non-exposed area are completed at the same time, the moving table in the non-exposed area moves to the junction of the non-exposed area and the exposed area, so that The motion table that completes the second process in the non-exposure area can directly enter the exposure area to perform the first process, and the motion table that completes the first process in the exposure area can directly enter the non-exposure area to perform the second process. For each motion platform, In other words, to realize the seamless connection of the first process and the second process; for two motion tables, the first process of one motion table in the exposure area and the process of the other motion table in the non-exposure area are carried out at the same time, which is conducive to improving Yield of lithography equipment.

In the method for controlling the lithography equipment provided by the embodiment of the present invention, by controlling a moving table to perform the first process in the exposure area, control another moving table to perform the second process in the non-exposed area, and when the first process is completed When the moving stage of the non-exposure zone moves to the junction of the non-exposure zone and the exposure zone, the first step includes exposure. Because the time required for exposure is usually longer, it can take a longer time for the moving table that performs the second process in the non-exposed area to complete the second process, which in turn makes the moving table that performs the second process in the non-exposed area move to the exposed area The slower speed will not cause vibration of the lithography equipment and the guide rails that carry the two motion stages, and will not cause crosstalk to the motion stage being exposed, which is beneficial to improve the exposure accuracy. Moreover, when the first process and the second process are completed at the same time, the movement table in the non-exposure area moves to the junction of the non-exposure area and the exposure area, so that the movement table can realize the seamless connection of the first and second processes, and Simultaneously performing the first process of one moving table in the exposure area and the second process of the other moving table in the non-exposed area is beneficial to increase the yield of the lithography equipment.

Fig. 2 is a schematic diagram of a movement table and its working area of a lithography apparatus provided by an embodiment of the present invention. Referring to FIG. 2, based on the above solution, optionally, the lithography apparatus includes a first moving table 10 and a second moving table 20, and the non-exposed area includes a first non-exposed area B1 and a second non-exposed area B2. A non-exposure area B1, an exposure area, and a second non-exposure area B2 are sequentially arranged along the first direction; the working area of the first moving table 10 includes the exposure area A and the first non-exposing area B1, and the working area of the second moving table 20 Including the exposure area A and the second non-exposure area B2; controlling a moving table to perform the first process in the exposure area and controlling another moving table to perform the second process in the non-exposing area includes: step 111, controlling the first moving table 10 During the first process in the exposure zone A, control the second moving stage 20 to perform the second process in the second non-exposed zone B2.

It should be noted that when the first moving table 10 is controlled to perform the first step in the exposure zone, the second moving table 20 is controlled to perform the second step in the second non-exposure zone B2, so that the first step and the second step of the first moving table 10 are The processes of the two movement stages 20 are carried out at the same time. Compared with the control of the lithography equipment of a single movement stage, the time for the second movement stage 20 to perform the second process can be saved, which is beneficial to improve the productivity of the lithography equipment.

The first moving table 10 and the second moving table 20 usually move on the same guide rail. The working area of the first moving table 10 includes the exposure area A and the first non-exposing area B1, and the working area of the second moving table 20 includes the exposed area. A and the second non-exposure zone B2, and then when the first movement stage 10 is controlled to complete the first process in the exposure zone, it enters the first non-exposure zone B1 in the opposite direction of the first direction, while controlling the second movement stage 20 along the The opposite direction of the first direction enters the exposure area A, so that the first moving table 10 and the second moving table 20 will not collide, and the safety and reliability of the lithography equipment are ensured.

On the basis of the above solution, optionally, controlling the first movement stage 10 to perform the first process in the exposure zone A, and controlling the second movement stage 20 to further include the second process in the second non-exposure zone B2 after the completion of the second process. : Step 112, controlling the second moving table 20 to perform the first process in the exposure zone A, and controlling the first moving table 10 to perform the second process in the first non-exposing zone B1.

It should be noted that after the first process performed by the first motion table 10 in the exposure zone A and the second process performed by the second motion table 20 in the second non-exposure zone B2 are completed at the same time, the first motion table 10 is controlled to enter the first process. A non-exposure zone B1 carries out the second process, and at the same time controls the second moving table 20 to enter the exposure zone A to carry out the first process, that is, the second process of the first moving table 10 and the first process of the second moving table 20 are carried out at the same time. For the control of the lithography equipment with a single motion stage, the time for the first motion stage 10 to perform the second process can be saved, which is beneficial to improve the yield of the lithography device.

On the basis of the above solution, optionally, the first process includes performing leveling and focusing, mask alignment, and exposure in sequence; the second process includes performing substrate transfer and substrate alignment in sequence.

It should be noted that, during the first process performed by the moving table in the exposure zone, the leveling, focusing, and mask alignment are first performed or assisted, so as to ensure the effective progress of the subsequent exposure process. Continuing to refer to FIG. 2, the lithography apparatus further includes a mask template 30, the mask template 30 includes a mask mark 31, and the moving table includes a mask alignment mark detection sensor 32 and a mask alignment reference mark 33. The photomask The alignment includes the following steps: the photomask alignment mark checks the alignment of the sensor 32 and the photomask alignment fiducial mark 33; the photomask alignment mark checks the alignment of the sensor 32 and the photomask mark 31.

In the second step, the transfer of the substrate includes the unloading of the substrate and the upper substrate. In this embodiment The process of homing the motion table is also included in the process of transferring the substrate. The homing of the motion table includes the process of moving the motion table from the exposure area to the non-exposure area to the movement of the motion table to the position of the upper and lower substrates. The substrate alignment includes the alignment of the motion table itself and the alignment of the substrate carried by the motion table.

On the basis of the above solution, optionally, the time used for leveling and focusing of the moving table in the first step in the exposure area is equal to the time used by the moving table in the second step in the non-exposed area to transfer the substrate; The time used for the alignment and exposure of the moving stage mask of the first step in the exposure area is equal to the time used for the substrate alignment of the moving table in the second step in the non-exposed area, so that the first step and the exposure can be guaranteed. The total time of the second process is equal. In addition, because the exposure time is usually longer, the time used for the first step of the moving table mask alignment and exposure in the exposed area and the time used for the second step of the moving table substrate in the non-exposed area Equal, which makes it take longer for the moving table to align the substrate in the non-exposed area, which in turn makes the moving speed of the moving table slow during the substrate alignment process, making it difficult to disturb the moving table that is being exposed in the exposure area. , Which can further improve the exposure accuracy.

Continuing to refer to FIG. 2, based on the above-mentioned technical means, optionally, the lithography apparatus includes a substrate alignment mark detection sensor 50, and the substrate alignment mark detection sensor 50 is arranged in the non-exposed area in the first direction. On x, the distance d between the substrate alignment mark detection sensor 50 and the boundary of the exposed area and the non-exposed area is greater than or equal to the length c of the moving table in the first direction x. The non-exposed area includes a first non-exposed area B1 and a second non-exposed area B2.

It should be noted that the surface of the moving table and the substrate is usually provided with alignment marks, and the substrate alignment mark detection sensor can complete the alignment of the moving table and the substrate by detecting the alignment marks on the surface of the moving table and the substrate, that is, Alignment of the substrate. In the first direction x, the substrate alignment mark The distance d between the detection sensor and the boundary of the exposed area and the non-exposed area is greater than or equal to the length c of the moving table in the first direction x, which can ensure that the moving table will not enter the exposed area after the substrate is aligned, thus ensuring two The moving table will not collide, ensuring the reliability of the lithography equipment. Wherein, the substrate alignment mark detection sensor 50 may be an alignment camera device. In order to ensure that the movement table for the first step in the exposure area and the movement table for the second step in the non-exposure area complete the corresponding steps at the same time, the movement table in the non-exposure area reaches the junction of the non-exposure area and the exposure area, when the substrate When the distance between the alignment mark detection sensor and the boundary of the exposure area and the non-exposure area is greater than the length of the moving table in the first direction, the moving table in the non-exposure area cannot reach the non-exposure area and the exposed area after the substrate alignment is completed. Therefore, the second step further needs to include the movement of the moving table to the junction of the exposed area and the non-exposed area after the substrate is aligned.

Based on the above solution, optionally, in the first direction x, the distance d between the substrate alignment mark detection sensor 50 and the boundary of the exposed area and the non-exposed area is equal to the length c of the moving table in the first direction.

It should be noted that in the first direction x, the distance d between the substrate alignment mark detection sensor 50 and the boundary of the exposure area and the non-exposure area is equal to the length c of the motion table in the first direction, which can make the motion table in the non-exposure After completing the substrate alignment, the zone stops at the junction of the exposed zone and the non-exposed zone. Because the first process performed by one moving table in the exposed area and the second process performed by the other moving table in the non-exposed area are completed at the same time, so After completing the alignment of the substrate, the motion table that performs the second process in the non-exposed area can directly enter the exposure area for exposure, realizing the seamless connection between the second process of the motion table in the non-exposure area and the first process in the exposure area , To further improve the yield.

1，可理解的是，n為整數。 Fig. 3 is a top view of a lithography apparatus provided by an embodiment of the present invention. Referring to Figs. 2 and 3, on the basis of the above solution, optionally, one side of any motion table close to the other includes a substrate alignment mark 60. The substrate 40 carried by the moving table includes n pairs of material alignment marks 70; n pairs of material alignment marks 70 and substrate alignment marks 60 are sequentially arranged along the first direction x at equal intervals, and the other moving table is controlled to perform in the non-exposed area The second process includes: after the substrate alignment mark 60 of the control motion stage is aligned with the substrate alignment mark detection sensor 50, the motion stage is controlled to move stepwise to the exposure area in n times along the first direction, wherein each step During the advancement process, the motion table moves at a constant speed, where n

1. It is understandable that n is an integer.

In some embodiments, a pair of substrate alignment marks 60 is provided on one side of any motion table close to the other motion table, and the substrate alignment mark detection sensor 50 can detect the substrate alignment marks 60 on the motion table. The movement table is aligned. The surface of the substrate carried by the moving table is provided with n pairs of material alignment marks sequentially arranged at equal intervals along the first direction. As the moving table moves from the non-exposed area to the exposed area, the substrate alignment mark detection sensor sequentially detects Each pair of material alignment marks is used for substrate alignment. Referring to FIG. 3, at the junction of the exposure zone and the non-exposure zone, a detection sensor 80 may be further provided for detecting whether the moving table reaches the junction between the exposure zone and the non-exposure zone.

Fig. 4 is a time distribution diagram of the first process and the second process completed by the two motion tables provided by the embodiment of the present invention. With reference to Figures 3 and 4, the length c of the movement table in the first direction is equal to 1.8 meters, and the substrate surface is provided with 10 pairs of material alignment marks as an example. The movement table for the second process in the non-exposed area (Figure 4, the movement stage 2) the time for transferring the substrate, and the movement stage for the first step in the exposure area (the movement table 1 in Figure 4) for leveling and focusing time is t1, and the first step movement is performed in the exposure area The time for the stage to perform photomask alignment is t2, the time for the moving stage for the first step in the exposure area to perform exposure is t3, and the time for the moving stage to perform the second step in the non-exposure area to perform substrate alignment is t2+t3, Then when the movement stage of the second step in the non-exposure area performs substrate alignment, the time for each step movement to the exposure area is (t2+t3)/10, and each step The distance of advance movement is 1.8/10=0.18m, and the speed of each step movement is 1.8/(t2+t3). When performing substrate alignment on the motion stage of the second process in the non-exposure area, the motion stage is controlled to move to the exposure area n times, and the motion stage moves at a constant speed during each stepping process, and the motion is performed in the non-exposure area. The time for the movement stage of the second process to perform substrate alignment is equal to the sum of the time for the mask alignment and exposure of the movement stage for the first process in the exposure zone, so that the moving stage moves slowly toward the exposure zone, and It moves at a constant speed, so it can reduce or even eliminate the vibration generated by the guide rails generated by the moving table for substrate alignment, so that the moving table that is being exposed will not be disturbed, which improves the productivity of the lithography equipment while improving the exposure. Accuracy.

FIG. 5 is a schematic structural diagram of another lithography apparatus provided by an embodiment of the present invention, and FIG. 6 is a flowchart of another control method of a lithography apparatus provided by an embodiment of the present invention. 5, on the basis of the above solution, optionally, the lithography apparatus further includes a guide rail 90 that is arranged along the first direction x to carry the first movement table 10 and the second movement table 20, the guide rail 90 and the first movement table A first moving slider 100 is included between 10, a second moving slider 200 is included between the guide rail 90 and the second moving table 20, and the first moving slider 100 is close to one side of the second moving table 20 or the second moving slider A distance sensor 101 is provided on the side of 200 close to the first movement table 10. Referring to FIG. 6, the control method of the lithography equipment includes:

Step 210: Control a moving table to perform the first step in the exposure area, and control another moving table to perform the second step in the non-exposed area, and when the first step is completed, the moving table in the non-exposed area moves to the non-exposed area At the junction of the zone and the exposure zone, the first step includes exposure.

Step 220: When the distance sensor 101 detects that the distance between the first moving platform 10 and the second moving platform 20 is less than a preset distance threshold, control the first moving platform 10 and/or the second moving platform 20 to stop moving.

It should be noted that the first moving slider 100 drives the first moving table 10 to move on the guide rail 90, and the second moving slider 200 drives the second moving table 20 to move on the guide rail 90. By setting the distance sensor 101 on the side of the first moving slider 100 close to the second moving table 20 or the side of the second moving slider 200 close to the first moving table 10, the distance sensor 101 detects When the distance between the first exercise platform 10 and the second exercise platform 20 is less than the preset distance threshold, the first exercise platform 10 and/or the second exercise platform 20 are controlled to stop moving, which can prevent the first exercise platform 10 and the second exercise platform from moving The collision of stage 20 ensures the safety and reliability of the lithography equipment.

The embodiment of the present invention further provides a control device for lithography equipment, which can execute the control method for lithography equipment provided in any embodiment of this specification. FIG. 7 is a control device for lithography equipment provided by an embodiment of the present invention. The structure block diagram of the lithography equipment includes two motion stages; the working area of the motion stage includes the exposure area and the non-exposure area, and the control device of the lithography equipment includes a control module 310; the control module 310 is used to control a motion stage in During the first process in the exposure area, control another moving table to perform the second process in the non-exposed area, and when the first process is completed, the moving table in the non-exposed area moves to the junction of the non-exposed area and the exposed area. The first step includes exposure.

In the control device of the lithography equipment provided by the embodiment of the present invention, the control module controls one moving table to perform the first process in the exposure area, and controls another moving table to perform the second process in the non-exposed area, and when the first process is performed in the non-exposed area, When the first process and the second process are completed at the same time, the moving table in the non-exposure zone moves to the junction of the non-exposure zone and the exposure zone, and the first process includes exposure. Because the time required for exposure is usually longer, the movement of the movement table for the second process in the non-exposure area to the exposure area can be slower, which will not cause vibration of the lithography equipment and the guide rails that carry the two movement tables. , It will not cause crosstalk to the exposed sports platform, which is conducive to improving the exposure accuracy. Simultaneously performing the first process of the moving stage in the exposed area and the second process of the other moving stage in the non-exposed area is beneficial to increase the yield of the lithography equipment.

On the basis of the above solution, optionally, the lithography equipment includes a first moving table and a second moving table, the non-exposed area includes a first non-exposed area and a second non-exposed area, the first non-exposed area, the exposed area, and the The second non-exposure area is arranged in sequence along the first direction; the working area of the first moving table includes the exposure area and the first non-exposure area, the working area of the second moving table includes the exposure area and the second non-exposure area; the control module includes The first control unit is used for controlling the first moving stage to perform the first process in the exposure zone and controlling the second moving stage to perform the second process in the second non-exposing zone.

Optionally, the control module further includes a second control unit for controlling the first moving stage to perform the first process in the exposure zone and controlling the second moving stage to perform the second process in the second non-exposing zone after the second process is completed. : Control the second moving platform to perform the first process in the exposure area, and control the first moving platform to perform the second process in the first non-exposed area.

On the basis of the above-mentioned technical means, optionally, the time used for leveling and focusing of the first step of the moving table in the exposure area and the alignment of the mask and the transfer of the time used for the second step in the non-exposed area The time used for the substrate is equal; the time used for alignment and exposure of the moving stage mask of the first process in the exposure area is equal to the time used for the substrate alignment of the moving stage of the second process in the non-exposed area ; In the first direction, the distance between the substrate alignment mark detection sensor and the boundary of the exposed area and the non-exposed area is equal to the length of the moving table in the first direction; the side of the moving table close to the boundary of the exposed area and the non-exposed area includes Substrate alignment mark, the substrate carried by the motion table contains n pairs of material alignment marks; n The material alignment marks and substrate alignment marks are arranged in sequence along the first direction at equal intervals. When the control module controls another moving stage to perform the second process in the non-exposed area, the control module is used to control the substrate pairing of the moving stage. After the alignment mark is aligned with the substrate alignment camera device, the movement table is controlled to move stepwise to the exposure area in n times along the first direction, wherein the movement table moves at a constant speed during each stepping process.

The control device of the lithography equipment provided by the embodiment of the present invention can execute the control method of the lithography equipment provided in any embodiment of this specification, and has the corresponding functional modules and advantageous effects of the execution method.

An embodiment of the present invention further provides a lithography apparatus. For a schematic diagram of the lithography apparatus, refer to FIG. 2. The lithography apparatus includes the control device provided in any of the above-mentioned embodiments, and further includes two motion tables. The working area of the motion table includes Exposure area and non-exposure area.

In the lithography equipment provided by the embodiment of the present invention, the control device controls a moving table to perform the first process in the exposure area, and controls another moving table to perform the second process in the non-exposed area, and when the first process and the second process are performed When the two processes are completed at the same time, the moving table in the non-exposure zone moves to the junction of the non-exposure zone and the exposure zone, and the first process includes exposure. Because the time required for exposure is usually longer, the movement of the movement table for the second process in the non-exposure area to the exposure area can be slower, which will not cause vibration of the lithography equipment and the guide rails that carry the two movement tables. , It will not cause crosstalk to the moving platform being exposed, which is beneficial to improve the exposure accuracy. Moreover, the first process of one moving platform in the exposed area and the second process of the other moving platform in the non-exposed area at the same time are beneficial to improve the light. The productivity of the engraving equipment.

Continuing to refer to FIG. 2, on the basis of the above solution, optionally, the lithography apparatus further includes a substrate alignment mark detection sensor 50, and a substrate alignment mark detection sensor 50 It is arranged in the non-exposed area, and in the first direction, the distance between the substrate alignment mark detection sensor and the boundary of the exposed area and the non-exposed area is greater than or equal to the length of the moving table in the first direction.

Based on the above solution, optionally, in the first direction, the distance between the substrate alignment mark detection sensor 50 and the boundary of the exposure area and the non-exposure area is equal to the length of the moving table in the first direction.

1，可理解的是，n為整數。 On the basis of the above-mentioned technical means, one side of any movement table close to the other movement table contains a substrate alignment mark 60, and the substrate 40 carried by the movement table contains n pairs of material alignment marks 70; n pairs of material alignment marks 70 and The substrate alignment marks 60 are sequentially arranged at equal intervals along the first direction x, where n

1. It is understandable that n is an integer.

An embodiment of the present invention provides a computer-readable storage medium on which a computer program is stored. When the program is executed by a processor, the method for controlling a lithography apparatus as provided in the embodiment of the present invention is realized: controlling a moving stage to perform the first step in the exposure area. During the first step, control another moving table to perform the second step in the non-exposed area, and when the first step is completed, the non-exposed area moves to the junction of the non-exposed area and the exposed area. The first step includes exposure.

Any combination of one or more computer-readable media can be used. The computer-readable medium may be a computer-readable signal medium or a computer-readable storage medium. The computer-readable storage medium may be, for example, but not limited to, an electric, magnetic, optical, electromagnetic, infrared, or semiconductor system, device, or device, or a combination of any of the above. More specific examples (non-exhaustive list) of computer-readable storage media include: electrical connections with one or more wires, portable computer disks, hard drives, random access memory (RAM), read-only Memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fiber, portable compact disk read-only memory CD-ROM, optical memory, magnetic memory, or any suitable combination of the above. In this document, the computer-readable storage medium can be any tangible medium that contains or stores a program, and the program can be used by or in combination with an instruction execution system, device, or device.

The computer-readable signal medium may contain a data signal propagated in baseband or as a part of a carrier wave, which carries computer-readable program codes. This transmitted data signal can take many forms, including, but not limited to, electromagnetic signals, optical signals, or any suitable combination of the foregoing. The computer-readable signal medium may further be any computer-readable medium other than a computer-readable storage medium. The computer-readable medium can send, propagate, or transmit a program for use by or in combination with the instruction execution system, device, or device .

The program code contained on the computer-readable medium can be transmitted by any suitable medium, including, but not limited to, wireless, wire, optical cable, RF, etc., or any suitable combination of the above.

The computer program code used to perform the operations of this manual can be written in one or more programming languages or a combination thereof. The aforementioned programming languages include object-oriented programming languages-such as Java, Smalltalk, C++, and further include conventional procedural programming. Design language-such as "C" language or similar programming language. The code can be executed entirely on the user’s computer, partly on the user’s computer, as a stand-alone software package, partly on the user’s computer and partly on the remote computer, or entirely on the remote computer or Execute on the device provided in this embodiment. In the case of a remote computer, the remote computer can be connected to the user’s computer through any kind of network-including a local area network (LAN) or a wide area network (WAN)-or it can be connected to an external computer (for example, using Internet service providers to connect via the Internet).

Claims (11)

A control method of a lithography equipment, characterized in that the aforementioned lithography equipment includes two movement stages; the working areas of the two aforementioned movement tables include an exposure area and a non-exposure area, and the control method of the aforementioned lithography equipment includes: controlling a aforementioned movement During the first step of the stage in the aforementioned exposure area, control another aforementioned movement stage to perform the second step in the aforementioned non-exposed area; when one aforementioned movement stage completes the aforementioned first step, control the other aforementioned non-exposed area The moving table moves to the junction of the aforementioned non-exposure zone and the aforementioned exposure zone; wherein, the aforementioned first process includes performing leveling, focusing, mask alignment, and exposure in sequence; the foregoing second process includes performing substrate transfer and substrate alignment in sequence The control method of the aforementioned lithography apparatus further includes: controlling the time used for leveling and focusing of the moving stage of the first step in the exposure area and the time used for transferring the substrate to the moving stage of the second step in the non-exposed area Equal; and control the time used for alignment and exposure of the moving stage mask in the first process in the aforementioned exposure zone and the time used for aligning the substrate of the moving stage in the aforementioned non-exposed zone to be the same; wherein , The aforementioned photolithography apparatus includes a substrate alignment mark detection sensor, the aforementioned substrate alignment mark detection sensor is disposed in the aforementioned non-exposed area, the aforementioned non-exposed area includes a first non-exposed area and a second non-exposed area, and the aforementioned first non-exposed area A non-exposure zone, the aforementioned exposure zone, and the aforementioned second non-exposure zone are sequentially arranged along a first direction. In the aforementioned first direction, the distance between the substrate alignment mark detection sensor and the boundary of the aforementioned exposure zone and the aforementioned non-exposure zone Greater than or equal to the aforementioned sports platform in the aforementioned The length in the first direction; the control method of the lithography apparatus further includes: by controlling the substrate alignment mark detection sensor to detect an alignment mark on the surface of the motion table and the substrate to complete the alignment of the motion table and the substrate quasi. The control method of the lithography equipment as described in the first item of the scope of patent application, wherein the lithography equipment includes a first moving table and a second moving table, and the non-exposed area includes a first non-exposed area and a second non-exposed area , The first non-exposure zone, the exposure zone, and the second non-exposure zone are arranged in sequence along the first direction; the working area of the first movement stage includes the exposure zone and the first non-exposure zone, and the second movement stage The working area includes the aforementioned exposure area and the aforementioned second non-exposure area; the aforementioned controlling a movement stage to perform the first step in the aforementioned exposure area, and controlling another aforementioned movement table to perform the second step in the aforementioned non-exposure area includes: During the process of controlling the first moving stage to perform the first process in the exposure zone, the second moving stage is controlled to perform the second process in the second non-exposing zone. As the second method of controlling the lithography equipment in the scope of the patent application, during the process of controlling the first moving stage to perform the first process in the exposure zone, the second moving stage is controlling to perform the second process in the second non-exposed zone. After that, the control method of the lithography apparatus further includes: controlling the second moving stage to perform the first process in the exposure zone, and controlling the first moving stage to perform the second process in the first non-exposing zone. The control method of the lithography equipment as described in the first item of the scope of patent application, wherein, in the first direction, the distance between the substrate alignment mark detection sensor and the boundary of the exposure area and the non-exposure area is equal to the movement The length of the stage in the aforementioned first direction. As for the control method of the lithography equipment described in item 4 of the scope of patent application, the side of any one of the motion tables close to the other includes a substrate alignment mark, and the substrate alignment mark is configured to carry with the motion stage. The n pairs of material alignment marks on the substrate are sequentially arranged at equal intervals along the direction opposite to the first direction; the foregoing controlling another moving stage to perform the second process in the non-exposed area includes: controlling the alignment of the substrate of the other moving stage After the mark is aligned with the aforementioned substrate alignment mark detection sensor, the other aforementioned movement stage is controlled to move to the aforementioned exposure area in n times along the aforementioned first direction, wherein the aforementioned movement stage moves at a constant speed during each stepping process. , Where n

1. As for the control method of the lithography apparatus described in the second item of the scope of patent application, the lithography apparatus further includes a guide rail for carrying the first movement table and the second movement table arranged along the aforementioned first direction, and the aforementioned guide rail is the same as the aforementioned guide rail. A first moving slider is provided between the first moving platform, a second moving slider is provided between the guide rail and the second moving platform, and the first moving slider is close to a side of the second moving platform or the first moving platform. A distance sensor is provided on the side of the two moving sliders close to the first moving table; the control method of the lithographic apparatus further includes: detecting the difference between the first moving table and the second moving table by the distance sensor When the distance between the two is less than the preset distance threshold, at least one of the first moving platform and the second moving platform is controlled to stop moving. A control device for lithography equipment, which is characterized by being used for lithography equipment. The aforementioned lithography equipment includes two moving tables; the working area of the aforementioned moving table includes an exposure area and a non-exposure area, and the aforementioned lithography equipment control device includes Control module; the aforementioned control module is configured to control a aforementioned movement stage to perform the first process in the aforementioned exposure zone During the process, control another aforementioned movement stage to perform the second process in the aforementioned non-exposed zone, and when the aforementioned one aforementioned movement stage completes the aforementioned first process, control the other aforementioned movement stage of the aforementioned non-exposure zone to move to the aforementioned non-exposure zone Area and the junction of the aforementioned exposure area; wherein the aforementioned first step includes successively performing leveling, focusing, mask alignment, and exposure; the aforementioned second step includes successively performing transfer of the substrate and substrate alignment; the aforementioned control module is configured In order to control the leveling and focusing of the first step in the aforementioned exposure zone, the time used for leveling and focusing is equal to the time used by the moving table for the second step in the aforementioned non-exposure zone to transfer the substrate, and the second step is controlled in the aforementioned exposure zone. The time used for aligning and exposing the mask of the moving table in one step is equal to the time used for aligning the substrate of the moving table in the second step in the non-exposed area; the aforementioned photolithography equipment further includes substrate alignment mark detection The sensor, the aforementioned substrate alignment mark detection sensor is arranged in the aforementioned non-exposed area, the aforementioned non-exposed area includes a first non-exposed area and a second non-exposed area, the aforementioned first non-exposed area, the aforementioned exposed area, and the aforementioned first non-exposed area The two non-exposure areas are arranged in sequence along the first direction. In the first direction, the distance between the substrate alignment mark detection sensor and the boundary of the exposure area and the non-exposure area is greater than or equal to that of the movement table in the first direction. The upward length; the aforementioned substrate alignment mark detection sensor is configured to detect an alignment mark on the surface of the aforementioned moving table and the substrate. A photolithography equipment is characterized in that it includes the control device described in item 7 of the scope of patent application, and further includes two motion tables. The working areas of the two motion tables include an exposure area and a non-exposure area. Such as the lithography equipment described in item 8 of the scope of patent application, wherein, in the aforementioned first direction, The distance between the substrate alignment mark detection sensor and the boundary of the exposure area and the non-exposure area is equal to the length of the moving table in the first direction. As for the lithography equipment described in item 9 of the scope of patent application, the side of any motion table close to the other motion table includes a substrate alignment mark; the substrate alignment mark is configured to be aligned with the n of the motion stage carrying the substrate. The alignment marks for the materials are sequentially arranged at equal intervals along the opposite direction of the aforementioned first direction, where n

1. A computer-readable storage medium is characterized in that a computer program is stored thereon, and when the program is executed by a processor, it realizes the control method of the lithography equipment described in any one of items 1-6 in the scope of the patent application.

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