TWI724179B - 接著膜及切晶黏晶一體型膜 - Google Patents

接著膜及切晶黏晶一體型膜 Download PDF

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Publication number
TWI724179B
TWI724179B TW106119283A TW106119283A TWI724179B TW I724179 B TWI724179 B TW I724179B TW 106119283 A TW106119283 A TW 106119283A TW 106119283 A TW106119283 A TW 106119283A TW I724179 B TWI724179 B TW I724179B
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TW
Taiwan
Prior art keywords
mass
film
adhesive film
polymer
parts
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Application number
TW106119283A
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English (en)
Chinese (zh)
Other versions
TW201742902A (zh
Inventor
頼華子
Original Assignee
日商昭和電工材料股份有限公司
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First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=60577984&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TWI724179(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 日商昭和電工材料股份有限公司 filed Critical 日商昭和電工材料股份有限公司
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
    • C09J171/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C09J171/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Die Bonding (AREA)
  • Dicing (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
TW106119283A 2016-06-10 2017-06-09 接著膜及切晶黏晶一體型膜 TWI724179B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-116225 2016-06-10
JP2016116225 2016-06-10

Publications (2)

Publication Number Publication Date
TW201742902A TW201742902A (zh) 2017-12-16
TWI724179B true TWI724179B (zh) 2021-04-11

Family

ID=60577984

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106119283A TWI724179B (zh) 2016-06-10 2017-06-09 接著膜及切晶黏晶一體型膜

Country Status (5)

Country Link
JP (1) JP6590068B2 (ko)
KR (1) KR102257668B1 (ko)
CN (1) CN109155244A (ko)
TW (1) TWI724179B (ko)
WO (1) WO2017213248A1 (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102568478B1 (ko) * 2019-03-22 2023-08-18 데이진 가부시키가이샤 절연 시트
US20220165457A1 (en) * 2019-03-22 2022-05-26 Teijin Limited Insulation sheet
JP7338413B2 (ja) * 2019-11-11 2023-09-05 味の素株式会社 樹脂組成物

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201336951A (zh) * 2011-10-24 2013-09-16 Shinetsu Chemical Co 導熱性接著劑組成物及使用其之接著用薄片與導熱性切割／固晶薄膜
CN104231958A (zh) * 2013-06-05 2014-12-24 日本化药株式会社 半导体制造工艺用粘合材料
TW201506117A (zh) * 2013-06-04 2015-02-16 Nitto Denko Corp 熱固型晶片接合薄膜、附切割薄片的晶片接合薄膜及半導體裝置的製造方法
JP5931700B2 (ja) * 2012-11-13 2016-06-08 信越化学工業株式会社 半導体ウエハ用保護フィルム及び半導体チップの製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05198701A (ja) 1992-01-22 1993-08-06 Mitsubishi Electric Corp 半導体装置用パッケージ
JP4934284B2 (ja) * 2004-03-15 2012-05-16 日立化成工業株式会社 ダイシングダイボンドシート
JP4495768B2 (ja) * 2008-08-18 2010-07-07 積水化学工業株式会社 絶縁シート及び積層構造体
JP2010062338A (ja) * 2008-09-04 2010-03-18 Sumitomo Electric Ind Ltd 放熱シートの製造方法
JP2011241245A (ja) * 2010-05-14 2011-12-01 Mitsubishi Chemicals Corp エポキシ樹脂組成物および硬化物
KR101856557B1 (ko) * 2011-03-16 2018-05-10 후루카와 덴키 고교 가부시키가이샤 고열전도성 필름상 접착제용 조성물, 고열전도성 필름상 접착제, 및 그것을 사용한 반도체 패키지와 그 제조 방법
JP2013006893A (ja) * 2011-06-22 2013-01-10 Hitachi Chemical Co Ltd 高熱伝導樹脂組成物、高熱伝導性硬化物、接着フィルム、封止用フィルム、及びこれらを用いた半導体装置
JP2015103573A (ja) 2013-11-21 2015-06-04 日東電工株式会社 熱硬化型ダイボンドフィルム、ダイシングシート付きダイボンドフィルム、及び、半導体装置の製造方法
WO2015059950A1 (ja) * 2013-10-23 2015-04-30 日本化薬株式会社 ポリイミド樹脂組成物、及びそれを用いた熱伝導性接着フィルム
JP2015218287A (ja) * 2014-05-19 2015-12-07 古河電気工業株式会社 薄膜研削用粘接着フィルム一体型表面保護テープおよび半導体チップの製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201336951A (zh) * 2011-10-24 2013-09-16 Shinetsu Chemical Co 導熱性接著劑組成物及使用其之接著用薄片與導熱性切割／固晶薄膜
JP5931700B2 (ja) * 2012-11-13 2016-06-08 信越化学工業株式会社 半導体ウエハ用保護フィルム及び半導体チップの製造方法
TW201506117A (zh) * 2013-06-04 2015-02-16 Nitto Denko Corp 熱固型晶片接合薄膜、附切割薄片的晶片接合薄膜及半導體裝置的製造方法
CN104231958A (zh) * 2013-06-05 2014-12-24 日本化药株式会社 半导体制造工艺用粘合材料

Also Published As

Publication number Publication date
TW201742902A (zh) 2017-12-16
JP6590068B2 (ja) 2019-10-16
KR102257668B1 (ko) 2021-05-31
WO2017213248A1 (ja) 2017-12-14
KR20180121581A (ko) 2018-11-07
JPWO2017213248A1 (ja) 2018-12-13
CN109155244A (zh) 2019-01-04

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