TWI723426B - 基板組裝裝置及基板組裝方法 - Google Patents

基板組裝裝置及基板組裝方法 Download PDF

Info

Publication number
TWI723426B
TWI723426B TW108121043A TW108121043A TWI723426B TW I723426 B TWI723426 B TW I723426B TW 108121043 A TW108121043 A TW 108121043A TW 108121043 A TW108121043 A TW 108121043A TW I723426 B TWI723426 B TW I723426B
Authority
TW
Taiwan
Prior art keywords
substrate
elevator
platform
lower platform
adhesive
Prior art date
Application number
TW108121043A
Other languages
English (en)
Chinese (zh)
Other versions
TW202005738A (zh
Inventor
海津拓哉
市村久
眞鍋仁志
齊藤正行
Original Assignee
日商艾美柯技術股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商艾美柯技術股份有限公司 filed Critical 日商艾美柯技術股份有限公司
Publication of TW202005738A publication Critical patent/TW202005738A/zh
Application granted granted Critical
Publication of TWI723426B publication Critical patent/TWI723426B/zh

Links

Images

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/185—Joining of semiconductor bodies for junction formation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Nonlinear Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Liquid Crystal (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mathematical Physics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Die Bonding (AREA)
TW108121043A 2018-07-09 2019-06-18 基板組裝裝置及基板組裝方法 TWI723426B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-129801 2018-07-09
JP2018129801A JP6733966B2 (ja) 2018-07-09 2018-07-09 基板組立装置及び基板組立方法

Publications (2)

Publication Number Publication Date
TW202005738A TW202005738A (zh) 2020-02-01
TWI723426B true TWI723426B (zh) 2021-04-01

Family

ID=69151494

Family Applications (2)

Application Number Title Priority Date Filing Date
TW110106311A TWI826773B (zh) 2018-07-09 2019-06-18 基板組裝裝置及基板組裝方法
TW108121043A TWI723426B (zh) 2018-07-09 2019-06-18 基板組裝裝置及基板組裝方法

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW110106311A TWI826773B (zh) 2018-07-09 2019-06-18 基板組裝裝置及基板組裝方法

Country Status (4)

Country Link
JP (1) JP6733966B2 (ko)
KR (3) KR102307344B1 (ko)
CN (2) CN110703469B (ko)
TW (2) TWI826773B (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111822991A (zh) * 2020-06-22 2020-10-27 宁波市鄞州特尔斐电子有限公司 一种液晶显示屏acf压贴设备的治具装置及其使用方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009122666A (ja) * 2007-10-26 2009-06-04 Shibaura Mechatronics Corp 基板貼り合わせ装置及び方法
WO2010095215A1 (ja) * 2009-02-17 2010-08-26 信越エンジニアリング株式会社 ワーク搬送装置及び真空貼り合わせ方法
JP2012247507A (ja) * 2011-05-25 2012-12-13 Shibaura Mechatronics Corp 基板の貼り合せ装置
JP2013055093A (ja) * 2011-09-01 2013-03-21 Creative Technology:Kk 粘着チャック装置及びワークの粘着保持方法
WO2014157082A1 (ja) * 2013-03-29 2014-10-02 東京応化工業株式会社 貼付方法

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5523941A (en) 1978-08-09 1980-02-20 Agency Of Ind Science & Technol Immobilization of enzyme using water-soluble photo- crosslinkable resin
JPS5654155U (ko) 1979-10-02 1981-05-12
JPS56112958A (en) 1980-02-12 1981-09-05 Mitsubishi Rayon Co Ltd Impact-resistant resin composition
JPS6255546U (ko) 1985-09-28 1987-04-06
JP2002365644A (ja) * 2001-06-08 2002-12-18 Display Technologies Inc 液晶表示装置の製造方法及び製造装置
JP3819797B2 (ja) 2002-03-27 2006-09-13 株式会社 日立インダストリイズ 基板組立装置
JP4131164B2 (ja) 2002-11-27 2008-08-13 セイコーエプソン株式会社 基板固定方法および表示装置製造方法
JP3848942B2 (ja) 2003-10-31 2006-11-22 株式会社 日立インダストリイズ 基板の組立方法およびその装置
WO2005069366A1 (en) * 2004-01-16 2005-07-28 Sharp Kabushiki Kaisha Substrate adsorption device and substrate bonding device
KR100869088B1 (ko) * 2004-04-09 2008-11-18 신에츠 엔지니어링 가부시키가이샤 점착 척 장치
KR100920384B1 (ko) * 2005-12-28 2009-10-07 주식회사 에이디피엔지니어링 평판표시소자 제조장치의 리프트 핀 모듈
JP4078487B2 (ja) * 2005-05-25 2008-04-23 株式会社日立プラントテクノロジー 基板組立装置及び方法
JP4379435B2 (ja) * 2006-05-17 2009-12-09 株式会社日立プラントテクノロジー 基板組立装置とそれを用いた基板組立方法
JP2008034435A (ja) * 2006-07-26 2008-02-14 Shin-Etsu Engineering Co Ltd 基板保持用チャック装置
KR101247900B1 (ko) * 2010-02-23 2013-03-26 가부시키가이샤 히타치플랜트테크놀로지 액정 기판 접합 시스템
KR102215641B1 (ko) * 2013-12-18 2021-02-16 주성엔지니어링(주) 리프트 핀 어셈블리 및 이를 구비하는 기판 처리 장치
JP5654155B1 (ja) * 2014-04-04 2015-01-14 信越エンジニアリング株式会社 ワーク貼り合わせ装置
JP5810207B1 (ja) * 2014-11-14 2015-11-11 株式会社日立製作所 基板組立装置とそれを用いた基板組立方法
WO2016084703A1 (ja) * 2014-11-25 2016-06-02 旭硝子株式会社 基板の貼合装置及び貼合方法並びに電子デバイスの製造方法
CN115284718A (zh) * 2015-04-09 2022-11-04 信越工程株式会社 贴合设备的制造装置
JP6737575B2 (ja) * 2015-09-30 2020-08-12 Ａｉメカテック株式会社 基板組立システム、そのシステムに用いる基板組立装置、及び、そのシステムを用いた基板組立方法
JP6659307B2 (ja) 2015-10-30 2020-03-04 Ａｉメカテック株式会社 基板組立装置、その装置を用いた基板組立システム、及び、そのシステムを用いた基板組立方法
JP6255546B1 (ja) * 2016-10-17 2017-12-27 信越エンジニアリング株式会社 貼合デバイスの真空貼り合わせ装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009122666A (ja) * 2007-10-26 2009-06-04 Shibaura Mechatronics Corp 基板貼り合わせ装置及び方法
WO2010095215A1 (ja) * 2009-02-17 2010-08-26 信越エンジニアリング株式会社 ワーク搬送装置及び真空貼り合わせ方法
JP2012247507A (ja) * 2011-05-25 2012-12-13 Shibaura Mechatronics Corp 基板の貼り合せ装置
JP2013055093A (ja) * 2011-09-01 2013-03-21 Creative Technology:Kk 粘着チャック装置及びワークの粘着保持方法
WO2014157082A1 (ja) * 2013-03-29 2014-10-02 東京応化工業株式会社 貼付方法

Also Published As

Publication number Publication date
CN115079451A (zh) 2022-09-20
TW202133986A (zh) 2021-09-16
KR102307344B1 (ko) 2021-09-30
JP6733966B2 (ja) 2020-08-05
JP2020008725A (ja) 2020-01-16
KR20230152637A (ko) 2023-11-03
KR20210120946A (ko) 2021-10-07
CN110703469B (zh) 2022-06-14
CN115079451B (zh) 2024-02-13
KR102691362B1 (ko) 2024-08-05
TW202005738A (zh) 2020-02-01
CN110703469A (zh) 2020-01-17
KR20200006008A (ko) 2020-01-17
TWI826773B (zh) 2023-12-21

Similar Documents

Publication Publication Date Title
JP4078487B2 (ja) 基板組立装置及び方法
TWI437320B (zh) A substrate mounting apparatus, and a substrate mounting method using the same
TWI507770B (zh) 顯示裝置的基板接合設備及製造接合基板的方法
KR100479691B1 (ko) 기판조립장치와 기판조립방법
KR102691362B1 (ko) 기판 조립 장치 및 기판 조립 방법
JP5337620B2 (ja) ワーク粘着保持装置及び真空貼り合わせ機
JP3694691B2 (ja) 大型基板の組立装置及び組立方法
JP2004102215A (ja) 基板組立装置
JP7553152B2 (ja) 基板組立装置
JP4449932B2 (ja) 基板組立装置と基板組立方法
JP4470923B2 (ja) 基板組立て装置
JP3796491B2 (ja) 基板貼り合わせ装置
KR101007996B1 (ko) 기판합착장치
JP2004205865A (ja) 基板組立装置及び基板組立方法
JP2007011396A (ja) 基板組立て装置と組立て方法
JP2010145533A (ja) 基板合着装置