TWI713694B - 矽氮烷－矽氧烷無規共聚物、其製法及用途 - Google Patents

矽氮烷－矽氧烷無規共聚物、其製法及用途 Download PDF

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Publication number
TWI713694B
TWI713694B TW106104685A TW106104685A TWI713694B TW I713694 B TWI713694 B TW I713694B TW 106104685 A TW106104685 A TW 106104685A TW 106104685 A TW106104685 A TW 106104685A TW I713694 B TWI713694 B TW I713694B
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Taiwan
Prior art keywords
group
groups
silazane
independently
occurrence
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TW106104685A
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English (en)
Chinese (zh)
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TW201731921A (zh
Inventor
拉福 葛洛坦紐勒
亞伯拉罕 卡沙斯 葛西亞－明奎蘭
北文雄
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德商馬克專利公司
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Publication of TW201731921A publication Critical patent/TW201731921A/zh
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C08G77/54—Nitrogen-containing linkages
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/045—Polysiloxanes containing less than 25 silicon atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/06—Preparatory processes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/14—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/476—Organic materials comprising silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0362—Manufacture or treatment of packages of encapsulations

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Silicon Polymers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Electroluminescent Light Sources (AREA)
TW106104685A 2016-02-15 2017-02-14 矽氮烷－矽氧烷無規共聚物、其製法及用途 TWI713694B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP16000371 2016-02-15
EP16000371.1 2016-02-15

Publications (2)

Publication Number Publication Date
TW201731921A TW201731921A (zh) 2017-09-16
TWI713694B true TWI713694B (zh) 2020-12-21

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW106104685A TWI713694B (zh) 2016-02-15 2017-02-14 矽氮烷－矽氧烷無規共聚物、其製法及用途

Country Status (9)

Country Link
US (1) US10927220B2 (https=)
EP (1) EP3417002B1 (https=)
JP (1) JP6843875B2 (https=)
KR (1) KR20180113579A (https=)
CN (1) CN108699248B (https=)
MY (1) MY190543A (https=)
SG (1) SG11201806774XA (https=)
TW (1) TWI713694B (https=)
WO (1) WO2017140407A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11888095B2 (en) 2017-10-13 2024-01-30 Merck Patent Gmbh Manufacturing process for an optoelectronic device
WO2019233945A1 (en) * 2018-06-05 2019-12-12 Merck Patent Gmbh Method and polymer composition for preparing optoelectronic devices
JP7103245B2 (ja) * 2019-01-29 2022-07-20 信越化学工業株式会社 ポリシロキサザン化合物およびその製造方法並びにこれを含む組成物および硬化物
JP7371592B2 (ja) 2019-09-27 2023-10-31 信越化学工業株式会社 アルコキシシリル基を有するポリシロキサザン化合物およびその製造方法、並びにこれを含む組成物および硬化物

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002068535A1 (en) 2001-02-26 2002-09-06 Kion Corporation Polysilazane/polysiloxane block copolymers
CN102585516A (zh) * 2011-01-07 2012-07-18 第一毛织株式会社 用于形成硅基绝缘层的组合物及其制造方法、硅基绝缘层及其制造方法
US20150188006A1 (en) * 2013-12-30 2015-07-02 Cree, Inc. Silazane-containing materials for light emitting diodes

Family Cites Families (10)

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US4678688A (en) * 1983-12-28 1987-07-07 Shin-Etsu Chemical Co., Ltd. Method for forming a surface film of cured organosilicon polymer on a substrate surface
JPS60145815A (ja) * 1984-01-10 1985-08-01 Shin Etsu Chem Co Ltd 離型剤組成物
JPH04136278A (ja) * 1990-09-20 1992-05-11 Shin Etsu Chem Co Ltd 基布処理剤組成物及びそれを用いたパラグライダー用キャノピー素材
KR100285890B1 (ko) * 1996-12-27 2001-04-16 다마호리 다메히코 폴리오르가노실록사잔및그제조방법
US6274924B1 (en) 1998-11-05 2001-08-14 Lumileds Lighting, U.S. Llc Surface mountable LED package
US6204523B1 (en) 1998-11-06 2001-03-20 Lumileds Lighting, U.S., Llc High stability optical encapsulation and packaging for light-emitting diodes in the green, blue, and near UV range
JP2004077874A (ja) * 2002-08-20 2004-03-11 Clariant (Japan) Kk 層間絶縁膜用感光性組成物及びパターン化層間絶縁膜の形成方法
KR20100071650A (ko) * 2008-12-19 2010-06-29 삼성전자주식회사 가스차단성박막, 이를 포함하는 전자소자 및 이의 제조방법
JP6158921B2 (ja) 2012-07-03 2017-07-05 バーニング ブッシュ グループ、 エルエルシー 高性能ケイ素系コーティング組成物
MY190747A (en) * 2015-10-30 2022-05-12 Merck Patent Gmbh Method for producing silazane-siloxane copolymers and the use of such copolymers

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002068535A1 (en) 2001-02-26 2002-09-06 Kion Corporation Polysilazane/polysiloxane block copolymers
CN102585516A (zh) * 2011-01-07 2012-07-18 第一毛织株式会社 用于形成硅基绝缘层的组合物及其制造方法、硅基绝缘层及其制造方法
US20150188006A1 (en) * 2013-12-30 2015-07-02 Cree, Inc. Silazane-containing materials for light emitting diodes

Also Published As

Publication number Publication date
TW201731921A (zh) 2017-09-16
KR20180113579A (ko) 2018-10-16
EP3417002B1 (en) 2019-11-13
JP2019505645A (ja) 2019-02-28
US10927220B2 (en) 2021-02-23
JP6843875B2 (ja) 2021-03-17
US20200255599A1 (en) 2020-08-13
EP3417002A1 (en) 2018-12-26
CN108699248A (zh) 2018-10-23
CN108699248B (zh) 2021-03-26
SG11201806774XA (en) 2018-09-27
MY190543A (en) 2022-04-27
WO2017140407A1 (en) 2017-08-24

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