CN108699248B - 硅氮烷-硅氧烷无规共聚物、它们的生产和用途 - Google Patents

硅氮烷-硅氧烷无规共聚物、它们的生产和用途 Download PDF

Info

Publication number
CN108699248B
CN108699248B CN201780010344.2A CN201780010344A CN108699248B CN 108699248 B CN108699248 B CN 108699248B CN 201780010344 A CN201780010344 A CN 201780010344A CN 108699248 B CN108699248 B CN 108699248B
Authority
CN
China
Prior art keywords
substituted
alkyl
groups
occurrence
sir
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201780010344.2A
Other languages
English (en)
Chinese (zh)
Other versions
CN108699248A (zh
Inventor
R·格罗腾穆勒
A·卡萨斯卡尔西亚-明吉利安
北文雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wisdom Buy
Merck Patent GmbH
AZ Electronic Materials Japan Co Ltd
Original Assignee
Merck Patent GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Merck Patent GmbH filed Critical Merck Patent GmbH
Publication of CN108699248A publication Critical patent/CN108699248A/zh
Application granted granted Critical
Publication of CN108699248B publication Critical patent/CN108699248B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C08G77/54—Nitrogen-containing linkages
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/045—Polysiloxanes containing less than 25 silicon atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/06—Preparatory processes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/14—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/476—Organic materials comprising silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0362—Manufacture or treatment of packages of encapsulations

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Silicon Polymers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Electroluminescent Light Sources (AREA)
CN201780010344.2A 2016-02-15 2017-01-19 硅氮烷-硅氧烷无规共聚物、它们的生产和用途 Expired - Fee Related CN108699248B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP16000371 2016-02-15
EP16000371.1 2016-02-15
PCT/EP2017/000059 WO2017140407A1 (en) 2016-02-15 2017-01-19 Silazane-siloxane random copolymers, their production and use

Publications (2)

Publication Number Publication Date
CN108699248A CN108699248A (zh) 2018-10-23
CN108699248B true CN108699248B (zh) 2021-03-26

Family

ID=55404558

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201780010344.2A Expired - Fee Related CN108699248B (zh) 2016-02-15 2017-01-19 硅氮烷-硅氧烷无规共聚物、它们的生产和用途

Country Status (9)

Country Link
US (1) US10927220B2 (https=)
EP (1) EP3417002B1 (https=)
JP (1) JP6843875B2 (https=)
KR (1) KR20180113579A (https=)
CN (1) CN108699248B (https=)
MY (1) MY190543A (https=)
SG (1) SG11201806774XA (https=)
TW (1) TWI713694B (https=)
WO (1) WO2017140407A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11888095B2 (en) 2017-10-13 2024-01-30 Merck Patent Gmbh Manufacturing process for an optoelectronic device
WO2019233945A1 (en) * 2018-06-05 2019-12-12 Merck Patent Gmbh Method and polymer composition for preparing optoelectronic devices
JP7103245B2 (ja) * 2019-01-29 2022-07-20 信越化学工業株式会社 ポリシロキサザン化合物およびその製造方法並びにこれを含む組成物および硬化物
JP7371592B2 (ja) 2019-09-27 2023-10-31 信越化学工業株式会社 アルコキシシリル基を有するポリシロキサザン化合物およびその製造方法、並びにこれを含む組成物および硬化物

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2200106A2 (en) * 2008-12-19 2010-06-23 Samsung Electronics Co., Ltd. Gas barrier thin film, electronic device comprising the same, and method of preparing the gas barrier thin film
CN102585516A (zh) * 2011-01-07 2012-07-18 第一毛织株式会社 用于形成硅基绝缘层的组合物及其制造方法、硅基绝缘层及其制造方法
CN104812543A (zh) * 2012-07-03 2015-07-29 伯宁布什集团有限公司 硅基高性能涂料组合物

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4678688A (en) * 1983-12-28 1987-07-07 Shin-Etsu Chemical Co., Ltd. Method for forming a surface film of cured organosilicon polymer on a substrate surface
JPS60145815A (ja) * 1984-01-10 1985-08-01 Shin Etsu Chem Co Ltd 離型剤組成物
JPH04136278A (ja) * 1990-09-20 1992-05-11 Shin Etsu Chem Co Ltd 基布処理剤組成物及びそれを用いたパラグライダー用キャノピー素材
KR100285890B1 (ko) * 1996-12-27 2001-04-16 다마호리 다메히코 폴리오르가노실록사잔및그제조방법
US6274924B1 (en) 1998-11-05 2001-08-14 Lumileds Lighting, U.S. Llc Surface mountable LED package
US6204523B1 (en) 1998-11-06 2001-03-20 Lumileds Lighting, U.S., Llc High stability optical encapsulation and packaging for light-emitting diodes in the green, blue, and near UV range
US6534184B2 (en) 2001-02-26 2003-03-18 Kion Corporation Polysilazane/polysiloxane block copolymers
JP2004077874A (ja) * 2002-08-20 2004-03-11 Clariant (Japan) Kk 層間絶縁膜用感光性組成物及びパターン化層間絶縁膜の形成方法
US9935246B2 (en) 2013-12-30 2018-04-03 Cree, Inc. Silazane-containing materials for light emitting diodes
MY190747A (en) * 2015-10-30 2022-05-12 Merck Patent Gmbh Method for producing silazane-siloxane copolymers and the use of such copolymers

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2200106A2 (en) * 2008-12-19 2010-06-23 Samsung Electronics Co., Ltd. Gas barrier thin film, electronic device comprising the same, and method of preparing the gas barrier thin film
CN102585516A (zh) * 2011-01-07 2012-07-18 第一毛织株式会社 用于形成硅基绝缘层的组合物及其制造方法、硅基绝缘层及其制造方法
CN104812543A (zh) * 2012-07-03 2015-07-29 伯宁布什集团有限公司 硅基高性能涂料组合物

Also Published As

Publication number Publication date
TW201731921A (zh) 2017-09-16
KR20180113579A (ko) 2018-10-16
EP3417002B1 (en) 2019-11-13
JP2019505645A (ja) 2019-02-28
US10927220B2 (en) 2021-02-23
JP6843875B2 (ja) 2021-03-17
US20200255599A1 (en) 2020-08-13
EP3417002A1 (en) 2018-12-26
CN108699248A (zh) 2018-10-23
SG11201806774XA (en) 2018-09-27
MY190543A (en) 2022-04-27
WO2017140407A1 (en) 2017-08-24
TWI713694B (zh) 2020-12-21

Similar Documents

Publication Publication Date Title
TWI729018B (zh) 製造矽氮烷-矽氧烷共聚物之方法及此共聚物之用途
CN108699248B (zh) 硅氮烷-硅氧烷无规共聚物、它们的生产和用途
US20200083416A1 (en) Method for preparing an optoelectronic device from a crosslinkable polymer composition
KR102191894B1 (ko) Led 밀봉 물질용 제형
KR102400691B1 (ko) Led 밀봉 물질용 제형
TW202006023A (zh) 製備光電裝置的方法及聚合物組合物

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
TA01 Transfer of patent application right

Effective date of registration: 20201214

Address after: Lu Senbaolusenbao

Applicant after: AZ Electronic Materials Co.,Ltd.

Address before: Lu Senbaolusenbao

Applicant before: Wisdom Buy

Effective date of registration: 20201214

Address after: Lu Senbaolusenbao

Applicant after: Wisdom Buy

Address before: Lu Senbaolusenbao

Applicant before: AZ ELECTRONIC MATERIALS (LUXEMBOURG) S.A.R.L.

Effective date of registration: 20201214

Address after: Darmstadt, Germany

Applicant after: AZ Electronic Materials Co.,Ltd.

Address before: Lu Senbaolusenbao

Applicant before: AZ Electronic Materials Co.,Ltd.

Effective date of registration: 20201214

Address after: Darmstadt, Germany

Applicant after: MERCK PATENT GmbH

Address before: Darmstadt, Germany

Applicant before: AZ Electronic Materials Co.,Ltd.

TA01 Transfer of patent application right
GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20210326

CF01 Termination of patent right due to non-payment of annual fee