TWI712787B - 熱處理方法及熱處理裝置 - Google Patents

熱處理方法及熱處理裝置 Download PDF

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Publication number
TWI712787B
TWI712787B TW107106076A TW107106076A TWI712787B TW I712787 B TWI712787 B TW I712787B TW 107106076 A TW107106076 A TW 107106076A TW 107106076 A TW107106076 A TW 107106076A TW I712787 B TWI712787 B TW I712787B
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TW
Taiwan
Prior art keywords
substrate
flash
temperature
semiconductor wafer
front surface
Prior art date
Application number
TW107106076A
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English (en)
Chinese (zh)
Other versions
TW201839382A (zh
Inventor
北澤貴宏
大森麻央
布施和彦
Original Assignee
日商斯庫林集團股份有限公司
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Application filed by 日商斯庫林集團股份有限公司 filed Critical 日商斯庫林集團股份有限公司
Publication of TW201839382A publication Critical patent/TW201839382A/zh
Application granted granted Critical
Publication of TWI712787B publication Critical patent/TWI712787B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/0003—Radiation pyrometry, e.g. infrared or optical thermometry for sensing the radiant heat transfer of samples, e.g. emittance meter
    • G01J5/0007—Radiation pyrometry, e.g. infrared or optical thermometry for sensing the radiant heat transfer of samples, e.g. emittance meter of wafers or semiconductor substrates, e.g. using Rapid Thermal Processing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like

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  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW107106076A 2017-03-03 2018-02-23 熱處理方法及熱處理裝置 TWI712787B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2017-040210 2017-03-03
JP2017040210 2017-03-03
JP2017-235948 2017-12-08
JP2017235948A JP7265314B2 (ja) 2017-03-03 2017-12-08 熱処理方法および熱処理装置

Publications (2)

Publication Number Publication Date
TW201839382A TW201839382A (zh) 2018-11-01
TWI712787B true TWI712787B (zh) 2020-12-11

Family

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Family Applications (2)

Application Number Title Priority Date Filing Date
TW107106076A TWI712787B (zh) 2017-03-03 2018-02-23 熱處理方法及熱處理裝置
TW109138456A TWI830964B (zh) 2017-03-03 2018-02-23 熱處理方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW109138456A TWI830964B (zh) 2017-03-03 2018-02-23 熱處理方法

Country Status (3)

Country Link
JP (2) JP7265314B2 (ja)
KR (3) KR102354609B1 (ja)
TW (2) TWI712787B (ja)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
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KR102401862B1 (ko) * 2018-06-25 2022-05-25 가부시키가이샤 스크린 홀딩스 열처리 방법 및 열처리 장치
JP7245675B2 (ja) * 2019-03-07 2023-03-24 株式会社Ｓｃｒｅｅｎホールディングス 熱処理方法および熱処理装置
JP7307563B2 (ja) * 2019-03-18 2023-07-12 株式会社Ｓｃｒｅｅｎホールディングス 熱処理方法および熱処理装置
JP7312020B2 (ja) * 2019-05-30 2023-07-20 株式会社Ｓｃｒｅｅｎホールディングス 熱処理方法および熱処理装置
JP7372066B2 (ja) 2019-07-17 2023-10-31 株式会社Ｓｃｒｅｅｎホールディングス 熱処理方法および熱処理装置
JP7372074B2 (ja) * 2019-08-07 2023-10-31 株式会社Ｓｃｒｅｅｎホールディングス 熱処理方法
JP7370763B2 (ja) * 2019-08-22 2023-10-30 株式会社Ｓｃｒｅｅｎホールディングス 熱処理方法および熱処理装置
JP7460394B2 (ja) * 2020-02-28 2024-04-02 株式会社Ｓｃｒｅｅｎホールディングス 熱処理方法
US12020958B2 (en) 2020-02-28 2024-06-25 SCREEN Holdings Co., Ltd. Light irradiation type heat treatment method
JP7461214B2 (ja) 2020-05-19 2024-04-03 株式会社Ｓｃｒｅｅｎホールディングス 熱処理装置
CN113034480B (zh) * 2021-04-01 2023-12-19 艾德领客(上海)数字技术有限公司 一种基于人工智能及图像处理的高炉损坏分析方法
CN113984779B (zh) * 2021-12-24 2022-04-19 苏州康代智能科技股份有限公司 一种pcb通孔检测设备
JP2024041146A (ja) 2022-09-14 2024-03-27 株式会社Ｓｃｒｅｅｎホールディングス 熱処理方法および熱処理装置
KR102602641B1 (ko) * 2023-02-15 2023-11-16 (주)아인테크놀러지 기판 크랙 검사장치

Citations (4)

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US20040038455A1 (en) * 2002-06-05 2004-02-26 Kla-Tencor Technologies, Corporation Use of overlay diagnostics for enhanced automatic process control
JP2005340591A (ja) * 2004-05-28 2005-12-08 Dainippon Screen Mfg Co Ltd 熱処理装置
TW201324618A (zh) * 2011-12-07 2013-06-16 Dainippon Screen Mfg 熱處理方法及熱處理裝置
US20150092814A1 (en) * 2013-10-01 2015-04-02 Infineon Technologies Ag Method of examining a substrate and corresponding device

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US5759424A (en) * 1994-03-24 1998-06-02 Hitachi, Ltd. Plasma processing apparatus and processing method
JP4940635B2 (ja) * 2005-11-14 2012-05-30 東京エレクトロン株式会社 加熱装置、熱処理装置及び記憶媒体
JP4531690B2 (ja) * 2005-12-08 2010-08-25 東京エレクトロン株式会社 加熱処理装置
JP2009231697A (ja) 2008-03-25 2009-10-08 Dainippon Screen Mfg Co Ltd 熱処理装置
JP5875759B2 (ja) * 2010-10-14 2016-03-02 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ 熱処理方法および熱処理装置
JP5819633B2 (ja) * 2011-05-13 2015-11-24 株式会社Ｓｃｒｅｅｎホールディングス 熱処理装置および熱処理方法
JP2013247128A (ja) 2012-05-23 2013-12-09 Dainippon Screen Mfg Co Ltd 熱処理装置、およびその処理基板の形状不良の有無の判定方法
JP6266352B2 (ja) 2014-01-08 2018-01-24 株式会社Ｓｃｒｅｅｎホールディングス 熱処理装置および熱処理方法
JP6083404B2 (ja) * 2014-03-17 2017-02-22 信越半導体株式会社 半導体基板の評価方法
KR101939590B1 (ko) * 2015-12-30 2019-01-17 맷슨 테크놀로지, 인크. 열처리 시스템 내의 기판 파손 검출

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040038455A1 (en) * 2002-06-05 2004-02-26 Kla-Tencor Technologies, Corporation Use of overlay diagnostics for enhanced automatic process control
JP2005340591A (ja) * 2004-05-28 2005-12-08 Dainippon Screen Mfg Co Ltd 熱処理装置
TW201324618A (zh) * 2011-12-07 2013-06-16 Dainippon Screen Mfg 熱處理方法及熱處理裝置
US20150092814A1 (en) * 2013-10-01 2015-04-02 Infineon Technologies Ag Method of examining a substrate and corresponding device

Also Published As

Publication number Publication date
TWI830964B (zh) 2024-02-01
KR102354609B1 (ko) 2022-01-21
JP2022081666A (ja) 2022-05-31
TW201839382A (zh) 2018-11-01
JP7403566B2 (ja) 2023-12-22
KR102452243B1 (ko) 2022-10-07
JP7265314B2 (ja) 2023-04-26
JP2018148201A (ja) 2018-09-20
KR20220012389A (ko) 2022-02-03
TW202120916A (zh) 2021-06-01
KR20180101225A (ko) 2018-09-12
KR102412541B1 (ko) 2022-06-23
KR20210038527A (ko) 2021-04-07

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