TWI712453B - Application apparatus and application method - Google Patents

Abstract

An objective of this invention is to provides an application apparatus capable of efficiently and quickly applying film-forming liquid on the edge-surface of a through hole and edge-surface of an out peripheral of a work, wherein a film formation liquid flow path connecting to the edge-surface of the hole is formed by under mold holding the work, and an upper mold covering the work, and the work, the upper mold having a guiding path guiding the film formation liquid into the film formation liquid flow path, a releasing path for releasing the film formation liquid from the film formation liquid flow path, and a connecting flow path for connecting the formation liquid flow path, and allowing the film formation liquid flow guided from the guiding path flows through the film formation liquid path and the connecting flow path, and released from the releasing path, so as to form the connecting path.

Description

Coating device and coating method

The present invention relates to a coating device and a coating method, and more specifically to a hole end surface and an outer peripheral edge end surface of a through hole formed in a substrate such as a printed wiring board, a plate-shaped resin molded product, a glass molded product, etc. Film forming liquid coating device and coating method.

Generally, printed wiring boards using glass epoxy materials, synthetic materials, paper phenol materials, etc. are used as substrates for mounting electronic components. Glass epoxy material is a material in which epoxy resin is impregnated on a material laminated with glass fiber cloth. Synthetic materials use glass cloth on the surface, cellulose paper and non-woven fabric for the core material. The paper phenol material is made of kraft paper impregnated with phenol resin.

When these epoxy glass materials, synthetic materials, and paper phenol materials are cut, fine dust composed of epoxy resin or glass fiber will be generated in the cut part. These fine dusts become the cause of poor substrate circuit contact and poor quality. Therefore, it is preferable to remove dust generated when the substrate is cut when the printed wiring board is manufactured.

In addition, even if dust is temporarily removed from the end surface of the cut portion of the printed wiring board, since the end surface of the printed wiring board is very fragile, there is still a possibility that it will collapse during use after removal and generate more dust.

Therefore, the applicant of the present invention proposes a coating device and a coating method that can prevent the end surface from being broken by applying a film forming liquid to the peripheral edge portion including the end surface of the substrate to form a film (Patent Document 1).

In the coating device described in Patent Document 1, a pair of coating rollers that can sandwich the end of the substrate are moved along the peripheral edge of the substrate to apply the film forming liquid to the peripheral edge of the substrate. .

Furthermore, the applicant of the present invention has also proposed a coating device and a coating method that can coat the end surface of the hole formed in the substrate with the film forming liquid by the inkjet method in addition to the end surface of the peripheral edge of the substrate, (Patent Document 2).

In addition, there is also a demand for forming a coating film on the hole end surface and the outer peripheral edge end surface of the plate-shaped resin molded product, glass molded product, etc.

However, in the case of the aforementioned coating roller method and the inkjet method, it takes time to move the aforementioned coating roller or the inkjet portion along the peripheral edge of the product, so that the situation cannot adequately cope with a large number of products that need to be processed.

Patent Document 1 JP 2015-3303 No.

Patent Document 2 JP 2018-008210 A

(Means to solve the problem and the effect of the invention)

In view of the above-mentioned problems, the object of the present invention is to provide a coating device and a coating method that can efficiently and quickly coat the end surface of the through hole and the peripheral edge end surface of the product with the film forming liquid.

In order to achieve the above-mentioned object, the coating device (1) of the present invention is a coating device for coating a film forming liquid on the hole end surface formed on a product, wherein the lower product mold is placed, the upper product mold is covered, and the product Product, forming a film forming liquid flow path in contact with the end face of the hole; the upper mold is equipped with an introduction path for introducing the film forming liquid into the film forming liquid flow path, and discharging the film forming liquid from the film forming liquid flow path The discharge path and the connection flow path connecting the aforementioned membrane forming liquid flow path; so that the membrane forming liquid introduced from the aforementioned introduction path flows continuously through the aforementioned membrane forming liquid flow path and the aforementioned connection flow path from the aforementioned discharge path The way of discharge forms the aforementioned connection flow path.

According to the above coating device (1), the film forming liquid introduced from the introduction path passes through the entire film forming liquid flow path through the connection flow path, and is discharged from the discharge path, so that the film forming liquid enters the hole of the product The end surface flows uninterruptedly, and the film forming liquid can be applied reliably and quickly.

In addition, since the upper surface of the product is covered with the upper mold and the lower surface is covered with the lower mold, it is possible to prevent the film forming liquid from being applied to the upper surface and the lower surface of the peripheral edge of the penetration hole.

In addition, it is possible to reliably and quickly apply the film forming liquid to the hole end surfaces of large products such as plate-shaped resin molded products and glass molded products.

In addition, the coating device (2) of the present invention, wherein, in the coating device (1), a casing surrounding the outer peripheral edge of the product is further provided, and the lower mold, the casing, and the upper mold are used to It is constructed to form a liquid flow path in contact with the outer peripheral edge of the aforementioned product.

According to the aforementioned coating device (2), with a simple structure and low manufacturing cost, the film forming liquid can be applied not only to the hole end surface of the product, but also to the outer peripheral edge end surface of the product, reliably and quickly.

In addition, the coating device (3) of the present invention, wherein, in the coating device (1) or (2), the upper mold is provided with a tunnel as the introduction path, the discharge path, and the connection flow path. It is constructed by connecting flow paths.

According to the coating device (3), the film forming liquid introduced from the introduction path is formed by the tunnel-type connection flow path, passes through all the film forming liquid flow paths, and is discharged from the discharge path, so that the film forming liquid The uninterrupted flow can reliably and quickly apply the film-forming liquid on the hole end surface of the product or the hole end surface and the peripheral edge end surface of the product.

In addition, since the introduction path, the discharge path, and the tunnel-type connection flow path are provided inside the upper mold, the upper mold can be easily operated.

In addition, in the coating device (4) of the present invention, in the coating device (1) or (2), the upper mold is provided with an upper mold substrate covering the product and connected to the upper mold substrate as the introduction path The tubular introduction path, the tubular discharge path as the discharge path, and the tubular connection flow path as the connection flow path.

According to the coating device (4) described above, the film forming liquid flows through the tubular introduction path, the tubular discharge path, and the tubular connection flow path, so that the flow of the film forming liquid in the upper mold is smooth. In addition, the upper mold can be easily manufactured by a method of inserting a tube into the through hole of the upper mold substrate, a method of bonding or brazing a pipe on the upper mold substrate, or the like.

In addition, the present invention relates to a coating device (5), wherein, in the coating device (1) or (2), the upper mold has the introduction path and the discharge path inside, and is further on the lower surface facing the product It is provided with a groove-type connection flow path as the aforementioned connection flow path.

According to the above coating device (5), the connecting flow path of the upper mold is constituted by the groove-shaped connecting flow path, and the groove-shaped connecting flow path can be formed on the lower surface of the upper mold to form a groove, thereby making it easy to manufacture The aforementioned upper mold.

In addition, the coating device (6) of the present invention, wherein, in any one of the coating devices (1) to (5), the lower mold or the upper mold is provided at a position corresponding to the product penetration hole The island-shaped portion is configured by forming the film-forming liquid flow path between the hole end surface and the island-shaped portion.

According to the above coating device (6), even if the width of the penetration hole is very wide, since the film-forming liquid flow path with a suitable width is formed along the end face of the hole, it can be reliably and quickly applied to the end face of the hole of the product. Ground coating film forming liquid.

In addition, the coating device (7) of the present invention is provided in any one of the coating devices (1) to (6), between the upper mold and the product, and between the product and the lower mold A gasket to prevent the film forming liquid from immersing into the upper and lower surfaces of the product.

According to the coating device (7) described above, it is possible to reliably prevent the film forming liquid from penetrating into the lower surface and the upper surface of the product. Therefore, it can effectively prevent the formation of unnecessary coating film on the peripheral edge and outer peripheral edge of the penetration hole of the aforementioned products such as the substrate.

In addition, the coating device (8) of the present invention, wherein, in any one of the coating devices (3), (6), (7), the upper mold including the tunnel-type connecting flow path uses 3D printing Table machine and maker.

According to the coating device (8) described above, a 3D printer can be used to easily manufacture an upper mold with a complicated structure including the aforementioned tunnel-type connecting flow path. In addition, even if the position, number, form, etc. of the aforementioned tunnel-type connection flow paths are different, it can be easily handled.

In addition, the coating device (9) of the present invention, wherein, in any one of the coating devices (3), (6), (7), the upper mold including the tunnel-type connecting flow path is formed with The upper half of the upper half of the tunnel-type connecting flow path is formed by adhering to the lower half of the lower half of the tunnel-type connecting flow.

According to the above-mentioned coating device (9), high-end technology is not required, and an upper mold with a complicated structure including the aforementioned tunnel-type connecting flow path can be easily manufactured by using a power tool available around.

The coating method (1) of the present invention is a method of applying a film-forming liquid to the product using any one of the above-mentioned coating devices (1) to (9), wherein the product is attracted by the side of the discharge path The film forming liquid introduced by the introduction path is applied to the end surface of the product.

According to the above-mentioned coating method (1), since the film-forming liquid is introduced in a reduced pressure state in the coating device, it is possible to effectively prevent the film-forming liquid from entering the upper and lower surfaces of the product from the film-forming liquid flow path. Therefore, it can effectively prevent the formation of unnecessary coating film on the peripheral edge and outer peripheral edge of the penetration hole of the aforementioned product.

In addition, due to the uninterrupted flow of the film forming liquid, the film forming liquid can be applied to each end surface of the aforementioned product, so the film forming liquid can be applied quickly and reliably.

In addition, the coating method (2) of the present invention is a method of applying a film-forming liquid to the product using any one of the coating devices (1) to (9), wherein, by pressing in from the introduction path The film forming liquid is discharged from the discharge path, and the film forming liquid is applied to the end surface of the product.

According to the above-mentioned coating method (2), since the film forming liquid is fed into the coating device in a press-fit state, the end surface of the product can be reliably coated with the film forming liquid.

In addition, the coating method (3) of the present invention, wherein, in the above-mentioned coating method (1) or (2), the film forming liquid is applied to the end surface of the product, and after the film forming liquid is discharged, the film forming liquid Air for drying the film forming liquid is introduced into the flow path.

According to the above-mentioned coating method (3), after coating/discharging the film-forming liquid, the removal/drying of the film-forming liquid in the film-forming liquid flow path can be quickly and efficiently performed.

1, 2‧‧‧Coating device

10‧‧‧Substrate

11、12、13、14‧‧‧Through hole

11a, 12a, 13a, 14a‧‧‧hole end surface

15‧‧‧Outer peripheral edge

15a‧‧‧peripheral edge end face

21, 21A, 21B‧‧‧Upper mold

21Aa‧‧‧Upper mold substrate

21a‧‧‧Upper plate

21b‧‧‧Lower plate

22‧‧‧Die

23, 23b‧‧‧Introduction

23a‧‧‧Tube type introduction path

23c‧‧‧Connecting hole

24, 24b‧‧‧Exhaust path

24a‧‧‧Tube type discharge path

25a, 25b, 25c, 25d‧‧‧Tunnel type connection flow path

25ab, 25bb, 25cb, 25db‧‧‧Connecting hole

26a, 26b, 26c, 26d‧‧‧Pipe connection flow path

27a, 27b, 27c, 27d‧‧‧Trench type connection flow path

28‧‧‧Shell

28a, 31ab, 31bb, 31cb‧‧‧ dyke

31a, 31b, 31c‧‧‧island

32, 32A‧‧‧ Washer

33a, 33b, 33c‧‧‧Island hole

33aa, 33ba, 33ca‧‧‧recess

40、50‧‧‧Coating system

41、51‧‧‧Film forming liquid tank

42‧‧‧Suction part

43、53‧‧‧Three-way cock

44‧‧‧Capture Tank

45‧‧‧Attracting device

46a, 46b, 46c, 46d, 46e: hose

47: Coating head

47a: Import side

47b: discharge side

52: pressure device

54: drain tank

55: Aspiration Department

56a, 56b, 56c, 56d, 56e, 56f: hose

A to D, F, H to J, L to O, Q to T: Film forming liquid flow path

E, G, K, P: connecting flow path

P1, P2, P3: position

Fig. 1 is a side view showing a printed wiring board for mounting electronic components, which is an example of a product to be coated according to the present invention.

Fig. 2 is a side view showing the basic configuration of the coating device according to the embodiment, and shows a state in which the film forming liquid is applied to the hole end surface of the printed wiring board.

Fig. 3 is a side view showing the basic configuration of the coating device according to the embodiment, and shows how the film forming liquid is applied to the hole end surface and the outer peripheral edge end surface of the printed wiring board.

Fig. 4 is a side view separately showing the upper mold and the lower mold of the coating device according to the embodiment, (a) shows the upper mold and (b) shows the lower mold.

Fig. 5 shows that the printed wiring board shown in Fig. 1 is placed on the coating device shown in Fig. 4 related to the embodiment, in the state shown in Fig. 3, on the hole end surface and outer peripheral edge end surface of the printed wiring board A side view of the flow of the film forming liquid when the film forming liquid is applied.

Figure 6 is a cross-sectional view taken along line X-X in Figure 3.

Figure 7 is a cross-sectional view taken along line Y-Y in Figure 3.

Figure 8 is a side view showing the method of manufacturing the upper mold of the coating device according to the embodiment by mechanical processing, (a) shows a bottom view of the upper half of the upper mold, and (b) shows a top view of the lower half.

Fig. 9 is a side view showing the upper mold of the tubular connecting flow path equipped with the coating device according to the embodiment.

Fig. 10 is a side view of the upper mold provided with the trench-shaped connection flow path of the coating device according to the embodiment viewed from below.

Figure 11 is a side view showing an example of using a gasket on the coating device according to the embodiment, (a) shows the gasket used between the upper mold and the substrate, and (b) shows the gasket used between the substrate and the lower mold .

Fig. 12 is a system configuration diagram showing an example of a suction coating system using the coating device according to the embodiment.

Figure 13 is a system configuration diagram showing an example of a press-in coating system using the coating device according to the embodiment.

Fig. 14 is a side view showing an example of continuous coating of the film forming liquid on the substrate arranged on the coating device according to the embodiment.

The coating device and coating method according to the embodiment of the present invention will be described below based on the drawings.

Fig. 1 is a side view showing a printed wiring board for electronic component mounting (hereinafter referred to as a board) as an example of a product to be coated according to the present invention.

Four through holes 11, 12, 13, 14 are formed on the substrate 10, and a film forming liquid is applied to the respective end surfaces 11a, 12a, 13a, and 14a of the through holes 11, 12, 13, 14. In addition, there are cases where the film forming liquid is applied to the end surface 15 a of the outer peripheral edge portion 15 of the substrate 10.

FIG. 2 is a side view showing the basic configuration of the coating device 1 according to the embodiment, and shows a state in which the film forming liquid is applied to the end surface of the through hole of the substrate 10.

The coating device 1 includes an upper mold 21 for covering the substrate 10 and a lower mold 22 for placing the substrate 10. The upper mold 21, the substrate 10, and the lower mold 22 are used to form the hole end faces 11a, 12a, 13a, 14a of the substrate 10 (Fig. 1) The film forming liquid flow paths F, H to J, L to O, and Q to T (Fig. 5) of the up-flowing film forming liquid are constructed.

In addition, the upper mold 21 is illustrated in order to facilitate understanding of its internal structure, and is assumed to be displayed as a transparent body.

The upper mold 21 is provided with an introduction path 23 for introducing the film forming liquid into the film forming liquid flow paths F, H to J, L to O, and Q to T, and a discharge path 24 for discharging the film forming liquid, as a connecting film forming liquid flow path F , H to J, L to O, Q to T between the tunnel-type connecting flow paths 25b, 25c, 25d, the film forming liquid introduced from the introduction path 23 passes through the film forming liquid flow paths F, H to J, The L to O, Q to T, and tunnel-type connecting flow paths 25b, 25c, and 25d are configured as a continuous flow and discharged from the discharge path 24.

In addition, to the outside connected to the introduction path 23 and the discharge path 24, a connecting pipe (not shown) for connecting a pipe for introducing or discharging the film forming liquid is installed.

Fig. 3 is a side view showing the basic structure of the coating device 2 according to the embodiment.

The coating device 2 is used for coating the film forming liquid on the hole end faces 11a to 14a (Figure 1) of the substrate 10 and the peripheral edge end face 15a (Figure 1). Compared with the coating device 1, the upper surface of the lower mold 22 of the coating device 2 is also formed with a casing 28 having the same thickness as the substrate 10 surrounding the outer peripheral edge 15 a of the substrate 10. Therefore, the coating device 2 is constructed by forming the film forming liquid channels A to D (FIG. 5) for flowing the film forming liquid on the outer peripheral edge end surface 15a of the substrate 10 by the upper mold 21, the lower mold 22, and the substrate 10 .

In the side views shown in Figs. 2 and 3, the liquid flow paths A to D are formed by the film formed by the through holes 11, 12, 13, and 14 of the upper mold 21, the lower mold 22, and the substrate 10 , F, H to J, L to O, Q to T are located at the lower part of the upper mold 21, so they are not shown.

Taking the coating device 2 as an object, the coating structure of the film forming liquid according to the embodiment will be described.

The coating device 2 is formed with the end surface of the film forming liquid applied to the film forming liquid along the end surface of the substrate 10, that is, the end surface 15a of the outer peripheral edge portion 15 and the end surfaces 11a, 12a, 13a, 14a of the penetration holes 11, 12, 13, 14 The flowing film-forming liquid flow path A to D, F, H to J, L to O, Q to T (Figure 5). By flowing the film forming liquid on the film forming liquid channels A to D, F, H to J, L to O, and Q to T, the film forming liquid can be applied to each end surface of the substrate 10. Since the upper surface of the substrate 10 is covered by the upper mold 21 and the lower surface is covered by the lower mold 22, the upper and lower surfaces of the substrate 10 will not be coated with the film forming liquid.

In addition, after the film-forming liquid is introduced through the introduction path 23, the fluid of the film-forming liquid flows through the film-forming liquid flow paths A to D, F, H to J, L to O, Q to T, and the connecting flow paths E, G, K. , P (Figure 5) until it is discharged from the discharge path 24, forming an uninterrupted flow. In other words, from the introduction path 23 to the discharge path 24, the film forming liquid flow paths A to D, F, H to J, L to O, Q to T and the connecting flow paths E, G, K, and P form The flow path can be drawn in one stroke.

Fig. 4 is a side view showing the coating device 2 divided into an upper mold 21 and a lower mold 22, and (a) shows the upper mold 21 and (b) shows the lower mold 22.

The lower mold 22 is formed with a housing 28 for forming film forming liquid flow paths A to D (FIG. 5) for coating the outer peripheral edge end surface 15 a of the substrate 10 with the film forming liquid.

In addition, the lower mold 22 is formed with islands 31a, 31b, and 31c. The islands 31a, 31b, and 31c are used to confirm the hole end faces 12a, 13a, and 14a of the wide penetration holes 12, 13, 14 The film forming liquid is applied to the ground; these island portions 31a, 31b, and 31c are provided with dams 31ab, 31bb, and 31cb that control the flow of the film forming liquid, respectively.

A gap is formed between the island-shaped portions 31a, 31b, 31c and the hole end surfaces 12a, 13a, 14a of the penetration holes 12, 13, 14 corresponding to these island-shaped portions 31a, 31b, 31c, and these gaps are formed Film forming liquid flow paths H to J, L to O, and Q to T (Figure 5).

In the coating device 2, a housing 28 is formed on the lower mold 22, and a substrate 10 is provided inside the housing 28. When the substrate 10 is placed in the lower mold 22, the upper mold 21 shown in Fig. 4(a) is placed on the upper surface of the substrate 10, and the substrate 10 is clamped between the upper surface of the lower mold 22 and the lower surface of the upper mold 21 to be fixed .

In addition, FIG. 4 shows an example in which the island-shaped portions 31a, 31b, and 31c are formed on the lower mold 22, but the island-shaped portions 31a, 31b, and 31c may also be formed on the upper mold 21.

As the constituent material of the upper mold 21 and the lower mold 22, for example, ABS resin, acrylic resin, polycarbonate, polypropylene resin, etc. can be cited, and among them, ABS resin is most preferred. ABS resin has excellent advantages such as chemical resistance, mechanical properties, heat resistance, processability, and moldability. In addition, when manufacturing the upper mold 21, it is also preferable as a material when using a 3D printer.

FIG. 5 is a side view showing the uninterrupted flow path formed when the substrate 10 is set on the coating device 2 and the film forming liquid is applied to each end surface of the substrate 10. In the case of the coating device 2, the film forming liquid is introduced from the introduction path 23 (Figure 4) and flows through the film forming liquid channels A to D, F, H to J in the order of symbols A, B, C, ..., T , L to O, Q to T, and connecting flow paths E, G, K, and P are discharged from the discharge path 24 (FIG. 4).

The four connecting flow paths E, G, K, and P shown by broken lines are formed by tunnel-type connecting flow paths 25a, 25b, 25c, 25d (FIG. 4) provided in the upper mold 21.

The introduction path 23 is connected to the membrane forming liquid flow path F by the tunnel-type connecting flow path 25a (connection flow path E), and the membrane forming liquid flow path F is connected to the membrane by the tunnel type connecting flow path 25b (connection flow path G). The formation liquid flow path H is connected by the tunnel type connection flow path 25c (connection flow path K), the membrane forming liquid flow path J is connected to the membrane formation liquid flow path L, and the tunnel type connection flow path 25d (connection flow path P ), the film forming liquid channel O is connected to the film forming liquid channel Q.

By the formation of these connecting flow paths E, G, K, P, the film forming liquid flow paths A to D constituted by the upper mold 21, the lower mold 22, the through holes 12, 13, and 14 of the substrate 10, and the housing 28 , F, H to J, L to O, Q to T and the connecting flow paths E, G, K, P generate an uninterrupted flow of the film forming liquid, thereby coating the film forming liquid on each end surface of the substrate 10.

In the case of the substrate 10, the width of the through hole 11 is narrow, while the width of the through holes 12, 13, and 14 are wide. Like the through hole 11, when the width is narrow, the film forming liquid flows from one of the longitudinal directions to the other, so that the film forming liquid can be easily applied to the hole end surface 11a. However, when the width of the penetration holes 12, 13, and 14 are wide, when the film forming liquid flows from one of the longitudinal directions to the other, the flow on both sides tends to stay with respect to the flow of the center portion, which causes There is a possibility that the film-forming liquid cannot be applied to the end surfaces of both sides reliably.

Therefore, with regard to the wide penetration holes 12, 13, and 14, in order to make the film forming liquid flow along the respective end surfaces 12a, 13a, and 14a, islands 31a, 31b, and 31c are formed on the lower mold 22 of the coating device 2 ( Figure 4(b)) and dams 31ab, 31bb, and 31cb. The dams 31ab, 31bb, and 31cb are in contact with the end faces 12a, 13a, and 14a of the through holes 12, 13, and 14 of the substrate 10, and are configured to block the flow of the film forming liquid.

In this way, by forming the island-shaped portions 31a, 31b, 31c and the dam portions 31ab, 31bb, 31cb, it is possible to connect the end faces 12a, 13a, 14a of the through holes 12, 13, 14 and the island-shaped portions 31a, 31b, 31c. In the meantime, film forming liquid flow paths H to J, L to O, and Q to T are formed.

Therefore, in each of the through holes 12, 13, 14, the film forming liquid flows smoothly around the islands 31a, 31b, 31c between the islands 31a, 31b, 31c and the end faces 12b, 13b, 14b. The end faces 12a, 13a, and 14a of the holes 12, 13, and 14 are penetrated to reliably supply the film forming liquid.

In this way, the film forming liquid channels A to D can reliably provide the film forming liquid to the outer peripheral edge end surface 15a of the substrate 10, and the film forming liquid channel F can reliably provide the film to the end surface 11a of the through hole 11 The forming liquid can be reliably supplied to the end surface 12a of the through hole 12 by the film forming liquid channels H, I, J, and the film forming liquid channel L, M, N, O can be reliably provided as through holes The end surface 13a of 13 is supplied with the film forming liquid, and the end surface 14a of the through hole 14 can be reliably supplied with the film forming liquid through the flow paths Q, R, S, and T.

In addition, the islands 31a, 31b, and 31c are not only integrally formed on the lower mold 22 or the upper mold 21 as described above, but also can be formed by adhering parts formed into respective shapes to the lower mold 22 or the upper mold 21 at designated positions And formed.

In addition, the dams 31ab, 31bb, and 31cb may not be integrally formed on the island-shaped portions 31a, 31b, 31c as part of the island-shaped portions 31a, 31b, and 31c as described above, but a block-shaped non-integrated member may be used as the dam. 31ab, 31bb, and 31cb are formed.

Depending on the substrate, it may not be necessary to apply the film forming liquid to the end surface 15a of the outer peripheral edge portion 15. In this case, the flow paths A to D can be omitted, the housing 28 is not required, and the coating device 1 can be used.

Figure 6 is a cross-sectional view taken along line X-X in Figure 3, and Figure 7 is a cross-sectional view taken along line Y-Y in Figure 3. Figures 6 and 7 show the use of washers 32 and 33 (Figure 11) described later.

Fig. 6 shows the tunnel-type connection flow path 25a (connection flow path E) through the upper mold 21 described above. When the film-forming liquid flow path D and the film-forming liquid flow path F are connected.

Figure 7 shows the formation of a gap between the outer peripheral edge end surface 15a of the substrate 10 and the housing 28 to form a film forming liquid flow path B. It also shows the formation between the island portion 31a and the hole end surface 12a of the substrate 10 In the case of gaps and film forming liquid channels H and J.

As a method of manufacturing the upper mold 21 provided with the tunnel-type connecting flow paths 25a, 25b, 25c, and 25d, there is a method using a 3D printer as described above. When using a 3D printer to manufacture the upper mold 21, prepare the 3D CAD data of the upper mold 21, read it in by the 3D printer, and provide ABS resin as the material for modeling. Therefore, in the case of using a 3D printer, even if the upper mold 21 is provided with tunnel-type connection flow paths 25a, 25b, 25c, 25d, it can be easily manufactured.

Only the tunnel-type connecting flow paths 25a, 25b, 25c, 25d may have a small diameter of about 1 mm. Therefore, in order to smooth the flow of the film forming liquid, it is preferable to process the tunnel-type connecting flow paths 25a, 25b, and 25a as smoothly as possible. 25c, 25 inside. For this reason, it is preferable to perform modeling under high-definition conditions with small height differences caused by lamination.

In addition, in other embodiments, the upper mold 21 provided with the tunnel-type connection flow paths 25a, 25b, 25c, and 25d can also be manufactured by machining.

Fig. 8 shows a side view of the upper mold 21 of the coating device according to the embodiment manufactured by machining, (a) shows the upper half of the upper mold, and (b) shows the lower half of the upper mold.

Figure 8 shows the center line of the horizontal part of the tunnel-type connecting flow paths 25a, 25b, 25c, 25d, the plane cut from the top and bottom, (a) is the bottom view of the upper part of the upper mold 21 and the upper plate 21a Figure (b) is a plan view of the lower plate 21b of the lower half of the upper mold. The upper plate 21a shown in Fig. 8(a) is turned upside down and overlaps with the lower plate 21b to form tunnel-type connection flow paths 25a, 25b, 25c, and 25d.

The upper plate 21a and the lower plate 21b are cut up and down at the center line of the level part of the tunnel-shaped connection flow path 25a, 25b, 25c, 25 of the upper mold 21. Therefore, on the surfaces of the upper plate 21a and the lower plate 21b, the cross-sections of the leveling portions of the tunnel-type connecting flow passages 25a, 25b, 25c, and 25d become semicircular, angular, and other concave shapes. That is, concave groove shape.

Concave groove-shaped parts such as semi-circular shapes can be easily formed by using electric tools such as wood processing machines and hemming machines without using highly mechanical devices.

In addition, in the tunnel-type connecting flow passages 25a, 25b, 25c, and 25d, the longitudinal flow passages, the introduction passage 23, and the discharge passage 24 can be formed by drilling holes.

Thereby, the upper plate 21a and the lower plate 21b can be easily manufactured by machining with an electric tool or the like in the vicinity. By adhering the manufactured upper plate 21a and the lower plate 21b face to face, it is possible to easily manufacture the upper mold 21 provided with the tunnel-type connecting flow paths 25a, 25b, 25c, and 25d.

The upper mold 21 equipped with tunnel-type connecting flow paths 25a, 25b, 25c, and 25d can be easily manufactured by mechanical processing in addition to a 3D printer method.

Fig. 9 is a side view showing another upper mold 21A of the coating device according to the embodiment. The upper mold 21A includes an upper mold substrate 21Aa covering the substrate 10, a tubular introduction path 23a as an introduction path provided on the upper mold substrate 21Aa, a tubular discharge path 24a as a discharge path, and a tubular connection flow path as a connection flow path. Roads 26a, 26b, 26c, and 26d are formed.

These tubular introduction passage 23a, tubular discharge passage 24a, and tubular connection flow passages 26a, 26b, 26c, and 26d are formed of pipes made of metal such as aluminum, steel, stainless steel, and resin such as ABS resin and acrylic resin. These tubular introduction passages 23a, tubular discharge passages 24a, and tubular connection flow passages 26a, 26b, 26c, 26d and upper mold substrate 21Aa are joined by brazing when they are metal, and when they are resin, Adhesive bonding with adhesive. When the upper mold base 21Aa is joined to the tubular introduction path 23a, the tubular discharge path 24a, and the tubular connection flow paths 26a, 26b, 26c, 26d, it is preferable to insert a tubular introduction into the through hole formed in the upper mold base 21Aa The path 23a, the tubular discharge path 24a, and the tubular connection flow paths 26a, 26b, 26c, and 26d are joined.

Fig. 10 shows a side view of another upper mold 21B on the coating device according to the embodiment. Fig. 10 shows a side view of the upper mold 21B viewed from the lower surface.

The upper mold 21B is provided with an introduction path 23b and a discharge path 24b inside, and groove-shaped connection flow paths 27a, 27b, 27c, and 27d are formed as connection flow paths on the lower surface of the substrate 10 of the upper mold 21B. The connection flow path is different from the tunnel type connection flow path of the upper mold 21 and the pipe type connection flow path of the upper mold 21A, and is a groove type connection flow path 27a, 27b, 27c, 27d provided on the lower surface of the upper mold 21B. The cross-sectional shape of the groove-shaped connection flow passages 27a, 27b, 27c, and 27c is a shape corresponding to the flow of the film forming liquid, such as a semicircle or an angle.

In the case of the upper mold 21B, the connection flow paths are formed between the groove-type connection flow paths 27a, 27b, 27c, 27d and the upper surface of the substrate 10. In addition, when a gasket (Fig. 11) is used, it is formed between the groove-shaped connection flow paths 27a, 27b, 27c, 27d and the upper surface of the gasket.

As with the upper mold 21B, when the connecting flow paths formed on the upper mold 21B are groove-shaped connecting flow paths 27a, 27b, 27c, 27d, as long as the bottom surface of the upper mold 21B is formed with a groove having a semicircular or angular cross-sectional shape. can. Since the groove can be easily processed by a milling machine or the like, the manufacture of the upper mold 21B is easy.

Figure 11 (a) (b) is a side view showing an example of the gasket used in the coating device according to the embodiment, (a) shows the gasket used between the upper mold and the substrate, and (b) shows the difference between the substrate and the lower mold Washers used between.

As shown in Figure 11(a), the gasket 32 used on the lower surface of the upper mold 21 is formed with a tunnel in addition to the connecting hole 23c leading to the introduction path 23 and the connecting hole 24c leading to the discharge path 24 Connection holes 25aa, 25ab, 25ba, 25bb, 25ca, 25cb, 25da, 25db corresponding to the type connection flow paths 25a, 25b, 25c, 25d.

In addition, as shown in Fig. 11(b), the gasket 32A used on the upper surface of the lower mold 22 is formed with island-shaped portion holes corresponding to the island-shaped portions 31a, 31b, and 31c shown in Fig. 4(b) 33a, 33b, 33c. The island-shaped portion holes 33a, 33b, and 33c are formed to have the same size and shape as the island-shaped portions 31a, 31b, and 31c of the lower mold 22, respectively. In other words, the island-shaped portions 31a, 31b, and 31c of the lower mold 22 and the island-shaped portion holes 33a, 33b, and 33c of the gasket 32A are in an exactly fitting relationship. The island holes 33a, 33b, and 33c of the gasket 32A are further formed with recesses 33aa, 33ba, and 33ca corresponding to the dams 31ab, 31bb, and 31cb (Figure 4(b)).

Regarding the gasket 32, the relationship with the upper mold 21 shown in Figs. 3 and 4 is shown. The relationship between the gasket 32 and the upper mold 21A shown in Fig. 9 and the upper mold 21B shown in Fig. 10 is related to the upper mold 21 The situation is the same. That is, the gasket 32 can be used in the same manner for the upper mold 21A and the upper mold 21B.

In addition, the gasket 32A used on the upper surface of the lower mold 22 can also be used in common with any of the different upper molds 21, 21A, and 21B.

The gaskets 32 and 32A can be formed using sheets such as natural rubber or resin-based synthetic resin.

The coating device 1 that does not apply the film forming liquid on the outer peripheral edge end surface 15a of the substrate 10 and the application device 2 that applies the film forming liquid on the outer peripheral edge end surface 15a of the substrate 10 are both preferable. In order to arrange gaskets 32 and 32A between the substrate 10 and the upper mold 21 and between the lower mold 22 and the substrate 10.

The gaskets 32 and 32A can prevent the film forming liquid from penetrating the upper surface or the lower surface of the substrate 10.

When the substrate 10 is placed in the coating device 1 or the coating device 2, the lower mold 22, the gasket 32A, the substrate 10, the gasket 32, and the upper mold 21 are placed in the order, and the upper mold is tightly fixed without misalignment between them. Between 21 and the lower mold 22. The method of fixing the outer periphery with bolts, the method of fixing with spring clips, hand pliers, etc., including other methods, can be appropriately selected.

Fig. 12 shows a system configuration diagram of an example of a coating system constructed by the coating device 2.

The coating system 40 adopts a suction method, and the coating system 40 includes a coating device 2, a film forming liquid tank 41, a suction portion 42, a three-way cock 43, a collection tank 44, a suction device 45, and the like.

The film forming liquid tank 41 and the three-way cock 43 are connected by a hose 46a, between the suction portion 42 and the three-way cock 43, between the three-way cock 43 and the coating device 2, and between the coating device 2 and the catch tank 44 Meanwhile, the collection tank 44 and the suction device 45 are similarly connected by hoses 46b, 46c, 46d, and 46e.

The suction device 45 is composed of a vacuum pump.

The film forming liquid introduced from the introduction path 23 of the coating device 2 is sucked by the suction device 45 and introduced into the coating device 2, and the film forming liquid is applied to each end surface of the substrate 10 contained in the coating device 2.

The film forming liquid tank 41 stores a film forming liquid. The air suction part 42 is an air suction part and is provided with a filter membrane (not shown) for purifying air. The three-way cock 43 is used to switch the film forming liquid and air supplied to the coating device 2, and the trap tank 44 has a gas-liquid separation function to allow the film forming liquid to flow into the suction device 45 to absorb the film forming liquid.

When the film forming liquid is applied to each end surface of the substrate 10 contained in the coating device 2, the suction device 45 is operated, and the three-way cock 43 is placed on the side of the suction portion 42 to suck out dust and the like in the system. Next, the three-way cock 43 is switched to the side of the film forming liquid tank 41, and the film forming liquid sucked by the suction device 45 is introduced into the coating device 2 and allowed to flow through each flow path in the coating device 2, thereby forming the substrate 10 Coating film forming liquid on each end surface.

In order to provide sufficient film-forming liquid to each end surface of the substrate 10 as required, the film-forming liquid can be kept flowing for a certain period of time. Instead of keeping the membrane forming liquid flowing, the three-way cock 43 can be closed to keep the membrane forming liquid retained in each flow path.

After the film forming liquid is spread over each end surface of the substrate 10, the three-way cock 43 is switched to the suction side to suck the film forming liquid in the system and absorb it in the trap tank 44. Furthermore, by the suction device 45 continuously sucking the vacuum, the unnecessary film forming liquid that may remain may be discharged from the coating device 2 and the drying of the coating film formed on each end surface of the substrate 10 can be promoted. However, when it takes a certain amount of time for the coating film formed on each end surface of the substrate 10 to adhere to each end surface, it is better to vacuum again after a certain period of time after the film forming liquid is discharged.

Thus, by operating the coating system 40, the film forming liquid introduced from the introduction path 23 can be discharged from the discharge path 24 side, so that it can be on the outer peripheral edge end surface 15a, hole end surfaces 11a, 12a of the substrate 10 shown in FIG. , 13a, 14a coating film forming liquid.

In addition, after the film forming liquid is applied and the film forming liquid is discharged, the drying of the applied film forming liquid can be accelerated by further introducing air for drying the film forming liquid from the suction portion 42.

In Fig. 12, only one coating device 2 is connected, but a plurality of coating devices 2 may be connected in series, and the film forming liquid can be applied to a plurality of substrates 10 by one process.

FIG. 13 is a system configuration diagram showing another example of the coating system constructed by the coating device 2.

The coating system 50 adopts a press-fit method, and the coating system 50 includes a coating device 2, a film forming liquid tank 51, a pressurizing device 52, a three-way cock 53, a drain tank 54, an air supply unit 55, and the like.

The pressurizing device 52 and the three-way cock 53 are connected by a hose 56a, between the three-way cock 53 and the film forming liquid tank 51, between the three-way cock 53 and the air supply unit 55, and the film forming liquid tank 51 and the coating device Between 2, the air supply unit 55 and the coating device 2, and between the coating device 2 and the drain tank 54 are similarly connected by hoses 56b, 56c, 56d, 56e, and 56f, respectively.

The film forming liquid introduced from the introduction path 23 of the coating device 2 is pressed by the pressurizing device 52 and introduced into the coating device 2, and the film forming liquid is applied to each end surface of the substrate 10 contained in the coating device 2.

The film forming liquid tank 51 stores a film forming liquid. The pressurizing device 52 is a device that pressurizes the inside of the film forming liquid tank 51, and is composed of a compressor, and can pressurize to the extent that the film forming liquid is fed into the coating device 2.

The pressurizing device 52 also functions to send air into the coating device 2 by the air supply unit 55 provided with a filter membrane (not shown) for air purification. The three-way cock 53 is used to switch between introducing the film forming liquid into the coating device 2 and introducing air, and the drain tank 54 is used to store the film forming liquid discharged from the coating device 2.

When the film forming liquid is applied to each end surface of the substrate 10 contained in the coating device 2, the pressurizing device 52 is operated, and the three-way cock 53 is placed on the side of the air supply unit 55 to discharge dust and the like in the system. Next, the three-way cock 53 is switched to the side of the film forming liquid tank 51 to pressurize the inside of the film forming liquid tank 51. The film forming liquid extruded by pressure is introduced into the coating device 2, and the film forming liquid is applied to each end surface of the substrate 10 by supplying the film forming liquid to each flow path in the coating device 2.

In order to sufficiently apply the film-forming liquid to each end surface of the substrate 10 as needed, the film-forming liquid is kept flowing for a certain period of time. Instead of keeping the membrane forming liquid flowing, the three-way cock 53 can be closed to keep the membrane forming liquid retained in each flow path.

After the film forming liquid spreads to each end surface of the substrate 10, the three-way cock is switched to the side of the air supply unit 55, and air is sent to each flow path in the coating device 2 to discharge the film forming liquid in the flow path. Furthermore, by continuous air supply, drying of the coating film formed on each end surface of the substrate 10 is promoted.

As a method of introducing the film forming liquid into the coating device 2 under pressure, a tube pump can be used without using a compressor. The film forming liquid is supplied from the upstream side of the tube pump and connected to the introduction path 23 of the coating device 2 on the downstream side, and the film forming liquid flowing through each flow path of the coating device 2 is discharged from the discharge path 24 side , The film forming liquid can be applied to each end surface of the substrate 10.

As described above, there are various methods for applying the film forming liquid to each end surface of the substrate 10 by using the coating device 2. It is preferable to make an appropriate selection in consideration of conditions such as the size of the substrate 10, the length of the flow path in the coating device 2, and the number of substrates 10 to be processed.

FIG. 14 is a side view showing an example of continuous processing of substrates 10 installed in a plurality of coating devices 2. At position P1, the coating device 2 provided with the substrate 10 is placed on a conveying device such as a conveyor. Next, the coating device 2 is transported to the position P2. At the position P2, the supply side 47a of the coating head 47 is connected to the connecting pipe 23d of the coating device 2, and the discharge side 47b of the coating head 47 is connected to the connecting pipe 24d of the coating device 2. To the supply side 47a of the coating head 47, a hose 46c (Figure 12) or a hose 56d (Figure 13) on the supply side of the film forming liquid is connected. In addition, a hose 46d (FIG. 12) or a hose 56f (FIG. 13) on the discharge side of the film forming liquid is connected to the discharge side 47b of the coating head 47.

After applying the film forming liquid to each end surface of the substrate 10 in this state, the coating device 2 is moved to the position P3 to complete the application of the film forming liquid.

By repeating this operation, it is possible to continuously implement the treatment of coating the film forming liquid on the end surface of the substrate 10 provided on the plurality of coating devices 2.

Therefore, in addition to moving the coating device 2 and coating the film forming solution, the method of applying the film forming solution by the coating device 2 for the assembly of the coating device 2 sets and the coating of the film forming solution at one position is preferably Make appropriate selections in accordance with the processing quantity, product shape, size, and other various conditions.

Fig. 14 shows a state where the connecting pipes 23d and 24d of the coating device 2 protrude from the upper surface of the upper mold 21 (Fig. 3). Since the diameter of the flow path of the introduction path 23 (FIG. 3) and the discharge path 24 (FIG. 3) may be as small as about 1 mm, it is preferable that the connecting pipes 23d and 24d have a certain degree of strength.

Regarding the connecting pipes 23d and 24d, it is preferable to insert the pipes into the through holes formed in the upper mold 21 and fix them. By fixing the connecting pipe 23d to the upper mold 21, the hoses 46c and 56d can be reliably connected. By fixing the connecting pipe 24d to the upper mold 21, the hoses 46d and 56f can be reliably connected.

Figures 12 to 14 illustrate the use of the coating device 2 to form the coating systems 40 and 50. However, if the coating device 2 in Figures 12 to 14 is replaced with the coating device 1, the same configuration can be used The coating system of the coating device 1.

In the above, the substrate 10 shown in FIG. 1 is used as a product, and the coating apparatus and coating method according to the embodiment have been described. Regarding products, there are various sizes, shapes, number of penetration holes, and shapes. In addition, the products targeted by the present invention include printed wiring boards formed from glass epoxy materials, synthetic materials, paper phenol materials, etc., as well as resin, glass, and metal plate-shaped molded products, etc. .

In addition, in the case of small products, multiple products can be placed between a set of upper and lower molds with gaskets, and the film forming solution can be applied to multiple products at the same time.

In the case of using a coating device in which the upper mold of the connection flow path is formed, the film forming liquid can be quickly, reliably and easily applied to the end surface of the product. The coating device described above includes an upper mold with a connecting flow path, and can be manufactured inexpensively because of the simple structure of the coating device. Therefore, even if there are many types of products, it can be handled easily.

In addition, in the case of the coating system of the suction method, the pressure in each flow path of the coating device is in a reduced pressure state. Therefore, when the film forming liquid is applied, it is difficult for the film forming liquid to penetrate from the flow path to the upper and lower surfaces of the product. In addition, after coating/discharging the film forming liquid, air is introduced into the flow path to quickly and effectively carry out the film in the flow path. Removal and drying of the formed liquid.

[Possibility of industrial use]

The present invention can be widely used in the electronic equipment industry and other fields using various substrates such as printed wiring substrates, metal substrates, packaging substrates, and glass substrates.

1‧‧‧Coating device

10‧‧‧Substrate

21‧‧‧Upper die

22‧‧‧Die

23‧‧‧Introduction

24‧‧‧Exhaust Path

25b, 25c, 25d‧‧‧Tunnel type connection flow path

Claims (13)

A coating device is a coating device for applying a film forming liquid to the end face of a hole formed on a product, wherein the lower mold of the product, the upper mold of the product, and the product are placed in contact with the end of the hole A film forming liquid flow path that can be drawn with a single stroke; the upper mold is equipped with a single introduction path for introducing the film forming liquid into the film forming liquid flow path, and a single discharge for discharging the film forming liquid from the film forming liquid flow path And the connecting flow path connecting the film forming liquid flow path; so that the film forming liquid introduced from the single introduction path flows through the film forming liquid flow path and the connecting flow path uninterruptedly, from the single discharge path The way of discharge forms the aforementioned connection flow path. The coating device described in the first item of the scope of patent application further includes a shell surrounding the outer peripheral edge end surface of the aforementioned product, and the lower mold, the aforementioned shell, and the aforementioned upper mold are used to form the outer peripheral edge end surface of the aforementioned product. The connected film forms a liquid flow path. According to the coating device described in claim 1 or 2, wherein the upper mold includes the single introduction path, the single discharge path, and the tunnel-type connection flow path as the connection flow path. The coating device described in item 1 or item 2 of the scope of patent application, wherein the upper mold includes a tube-shaped introduction path that covers the upper mold substrate of the product, and is connected to the upper mold substrate as the single introduction path, as The tubular discharge path of the single discharge path and the tubular connection flow path as the connection flow path are constituted. The coating device described in claim 1 or 2, wherein the upper mold is provided with the single introduction path and the single discharge path inside, and is further included on the lower surface facing the product as the connecting flow The groove of the road is formed by connecting the flow paths. The coating device described in item 1 or item 2 of the scope of patent application, wherein the lower mold or the upper mold is provided with an island at a position corresponding to the penetration hole of the product, so that the end surface of the hole and It is configured to form the film forming liquid flow path between the island-shaped portions. The coating device described in item 1 or item 2 of the scope of patent application, wherein a gasket is provided between the upper mold and the product and between the product and the lower mold to prevent the film-forming liquid from immersing into the product The upper surface and the lower surface. The coating device described in claim 3, wherein the upper mold equipped with the tunnel-type connecting flow path is manufactured by a 3D printer. The coating device described in claim 3, wherein the upper mold system having the tunnel-type connecting flow path is formed with the upper half of the upper half of the tunnel-type connecting flow path and the upper plate formed with the tunnel type It is formed by bonding the lower plate of the lower half of the connecting flow path. A coating method that uses the coating device described in item 1 or item 2 of the scope of patent application to coat a product with a film forming liquid, wherein the suction is introduced by the single introduction path due to one side of the single discharge path. The aforementioned film-forming liquid is applied to the end surface of the aforementioned product. A coating method that uses the coating device described in item 1 or item 2 of the scope of the patent application to coat a product with a film forming liquid, wherein The film forming liquid is pressed into the introduction path, the film forming liquid is discharged from the single discharge path, and the film forming liquid is applied to the end surface of the product. The coating method described in claim 10, wherein after coating the film forming liquid on the end surface of the aforementioned product and discharging the film forming liquid, air for drying the film forming liquid is also introduced into the aforementioned film forming liquid flow path . The coating method described in item 11 of the scope of the patent application, wherein the film forming liquid is applied to the end surface of the aforementioned product and the film forming liquid is discharged, and then air for drying the film forming liquid is introduced into the film forming liquid flow path .

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