TWM334597U - Chemical processing device of thin plate material having vertical flow-guide type - Google Patents

Chemical processing device of thin plate material having vertical flow-guide type Download PDF

Info

Publication number
TWM334597U
TWM334597U TW96213187U TW96213187U TWM334597U TW M334597 U TWM334597 U TW M334597U TW 96213187 U TW96213187 U TW 96213187U TW 96213187 U TW96213187 U TW 96213187U TW M334597 U TWM334597 U TW M334597U
Authority
TW
Taiwan
Prior art keywords
solution
flow
chemical
thin sheet
tank
Prior art date
Application number
TW96213187U
Other languages
Chinese (zh)
Inventor
Jin-Kuen Guan
Original Assignee
Jin-Kuen Guan
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jin-Kuen Guan filed Critical Jin-Kuen Guan
Priority to TW96213187U priority Critical patent/TWM334597U/en
Publication of TWM334597U publication Critical patent/TWM334597U/en

Links

Landscapes

  • Manufacturing Of Printed Circuit Boards (AREA)
  • Cleaning By Liquid Or Steam (AREA)

Description

M334597 八、新型說明: 【新型所屬之技術領域】 本創作係有關一種薄板材化學處理裝置,尤指一種以垂 •直導流方式處理薄板材之設計。 【先前技術】 ’ 按,隨著資訊代的來臨,印刷電路板(PCB)係為各種電 子產品重要的組件,並主導著精密電子產品在功能上及任何 ^ 周邊部分作精密設計之關鍵地位。習知上,印刷電路板之製 作流程包含··表面處理、壓膜、曝光、顯影(Developing)、 水洗、蝕刻(Etching)、除膜(Stripping)等處理。亦即其包 括有化學處理及清洗等之流程。傳統上印刷電路板在作上述 化學處理過程大都以水平型的設備為主。 然,隨著印刷電路板向薄形化發展,以符合現今高科技 產品所需,所以印刷電路板的厚度愈來愈薄,常見的規格約 〇.〇6mm〜1.2mm左右,銅皮厚度則為18〜70um。再者,薄板材的 線路愈來愈精細,也極易受損。因此,傳統用來化學處理之 水平型設儳’無論是輸送方式及對薄板材喷灑化學溶液(例如 顯影液)的方式,已無法達到預期之處理品質,甚至易使薄板 材受到極大損傷。 緣是’針對薄板材的化學處理及清洗流程,已有業者嘗 5式改變為第一圖所示之垂直型設備來處理,亦即該薄板材(13) 被失固在掛架(Rack)(14)上,藉吊車移動到各個指定的處理 槽(11)進行清洗或化學處理。惟查,該處理槽(11)内之化學 溶液(12)雖然有在循環,但是其流動性仍嫌不足,而為使槽 -5 -M334597 VIII. New description: [New technical field] This creation is about a thin sheet chemical processing device, especially a design for processing thin sheets by vertical flow. [Prior Art] </ br> With the advent of information generation, printed circuit boards (PCBs) are important components of various electronic products, and they are leading the precise design of precision electronic products in terms of functions and any peripheral parts. Conventionally, the manufacturing process of a printed circuit board includes processes such as surface treatment, lamination, exposure, development, water washing, etching, and stripping. That is, it includes processes such as chemical treatment and cleaning. Traditionally, printed circuit boards have been dominated by horizontal devices in the above chemical processing. However, as the printed circuit board is thinner to meet the needs of today's high-tech products, the thickness of the printed circuit board is getting thinner and thinner. The common specifications are about 〇6mm~1.2mm, and the thickness of the copper is It is 18~70um. Moreover, the thinner plates are more and more fine and are easily damaged. Therefore, the conventional horizontal design used for chemical treatment has not been able to achieve the desired treatment quality in terms of the conveying method and the spraying of chemical solutions (e.g., developing solutions) on the thin sheets, and even the sheet material is greatly damaged. The edge is 'chemical processing and cleaning process for thin sheets. The manufacturer has changed the type 5 to the vertical type equipment shown in the first figure, that is, the thin sheet (13) is detached on the rack (Rack). (14) On the crane, move to each designated treatment tank (11) for cleaning or chemical treatment. However, it is checked that although the chemical solution (12) in the treatment tank (11) is in circulation, its fluidity is still insufficient, and in order to make the tank -5 -

M334597 内之化學溶液(12)具有較高的流動性,許多方法乃被使用, 例如利用一鼓風機將空氣輸入處理槽(11 )底端,使溶液可受 到氣泡的作用,或是在處理槽(11)内設有注水管,幫助溶液 的流動性,藉以達到增加薄板材(13)之表面交換及反應速度。 然查,在上揭先前技術中(Pri〇r Art) ’其對於幫助化 學溶液流動雖具有一定的效果,但隨著印刷電路板、鋁板材 等薄板的品質要求愈來愈高,且對於處理槽(11)的體積要求 愈來愈小,以達不佔空間之目的’是以’目前使用之化學處 理槽仍有其未盡完善之處。 本創作人有鑑於此,乃再接再勵’以其先前在電鍍等濕 製程之經驗,不斷研究改進’期能提供PCB或紹板等薄板材 在顯影、蝕刻、除膜等化學處理及清洗流程一種更佳的方法。 【新型内容】 本創作之主要目的,係在提供一種垂直導流式薄板材化 學處理裝置,其設計原理係在一個狹窄之處理槽上開口兩側 提供溶液向下流動,如果溶液之供應大於處理槽底端所出之 溶液,則槽内必然充滿溶液,甚至溢流至槽侧,故當待處理 之板材置入處理槽時,因前後導流影響,係呈趨向處理槽中 央而懸浮於槽内,進而使板材表面不易接觸到槽壁,具有不 傷害板材表面之功效增進。 再者,由於溶液往下快速流動,利用該導流效應提供攪 拌及沖刷板材表面,獲致良好之溶液交換,增加化學反應速 度,而且可以透過左右搖擺、振動及超音波輔助,提供更大 化學溶液於板材之表面交換及反應速度,以達到更佳效果, 進而提升處理品質。 •6- M334597The chemical solution (12) in M334597 has a high fluidity, and many methods are used, for example, using a blower to feed air into the bottom end of the treatment tank (11), so that the solution can be subjected to bubbles or in the treatment tank ( 11) A water injection pipe is provided to help the fluidity of the solution, thereby increasing the surface exchange and reaction speed of the thin plate (13). However, in the previous technology (Pri〇r Art), it has a certain effect on helping the flow of chemical solutions, but with the quality requirements of printed circuit boards, aluminum sheets and other thin plates, and for processing The volume requirement of the trough (11) is getting smaller and smaller, so as to achieve the purpose of not occupying space, the chemical treatment tank currently used is still incomplete. In view of this, the creator has continued to work on the development, etching, and film removal of thin sheets such as PCB or slabs. A better way to process. [New content] The main purpose of this creation is to provide a vertical flow-through thin sheet chemical processing device. The design principle is to provide a downward flow of solution on both sides of the opening of a narrow treatment tank, if the supply of the solution is greater than the treatment. The solution from the bottom end of the tank is filled with the solution and even overflows to the side of the tank. Therefore, when the sheet to be treated is placed in the treatment tank, it is inclined to the center of the treatment tank and suspended in the tank due to the influence of the front and rear flow. In addition, the surface of the sheet is not easily contacted to the groove wall, and the effect of not damaging the surface of the sheet is enhanced. Moreover, due to the rapid flow of the solution, the flow guiding effect is used to provide agitation and flushing of the surface of the sheet, thereby achieving good solution exchange, increasing the chemical reaction speed, and providing a larger chemical solution through left and right rocking, vibration and ultrasonic assistance. The surface exchange and reaction speed of the sheet are used to achieve better results, thereby improving the processing quality. •6- M334597

為達上述目的,本創作所採用之技術手段包含:i -處理槽’係上方呈開D之狹長型體,底部設有流出口; 一薄板材,係被夾固在-掛架(Rad〇上,並由上而下垂 直置入該處理槽,以及 -導流單70 ’係裝設在該處理槽開口的前後兩側,用以 導入化學溶液,並使該溶液呈流體束噴向該薄板材的前後兩 侧表面而向下快速流動,且令該導人之溶液流量大於該處理 槽底部之流出$ ’俾使該槽内充滿溶液,使該薄板材懸浮於 該處理槽内。 【實施方式】 首先,請參閱第二圖〜第四圖所示,本創作較佳實施例 所揭示之化學處理裝置包含有: 一處理槽(20),係上方呈開口(21)之狹長型體,底部設 有一個以上之流出口(22)。所述處理槽(2〇)係呈上下等寬之 型體為較佳,但不限定於此,亦即特殊狀況時,亦可設製成 上寬下窄之型態。再者,本實施例中該開口(21)上前後兩侧 設有向外擴張之斜板(23),且於該二片前後斜板(23)的左、 右兩侧形成溢流通道(24)。藉此,一薄板材(3〇)係被夾固在 一掛架(31)上,並可由上而下垂直置入該處理槽(2〇)。 一導流單元(40),係裝設在該處理槽(2〇)之開口(21)的 前後兩侧,本實施例中係將其裝設在該前後斜板(23)上,用 以導入化學溶液,其包括二支前、後喷流管(41)、(42)係分 別設置在該開口前後兩侧之斜板(23)上,其相向對應之内側 設有多數之喷嘴(411)、(421),由該喷嘴(411)、(421)向該 薄板材(30)兩側及處理槽(20)内注入化學溶液。並使該溶液 M334597 呈流體束噴向該薄 板材(30)的前後兩側表面而向下快速流In order to achieve the above objectives, the technical means adopted in the creation include: a narrow-shaped body with an open D on the i-treatment tank, and an outflow port at the bottom; a thin plate that is clamped on the pylon (Rad〇) And vertically placed into the processing tank from top to bottom, and a flow guiding sheet 70' is installed on the front and rear sides of the opening of the processing tank for introducing a chemical solution, and spraying the solution as a fluid beam The front and rear surfaces of the thin plate flow rapidly downward, and the flow rate of the guide solution is larger than the outflow of the bottom of the treatment tank, so that the tank is filled with the solution, so that the thin plate is suspended in the treatment tank. Embodiments First, referring to the second to fourth figures, the chemical processing apparatus disclosed in the preferred embodiment of the present invention comprises: a processing tank (20), which is an elongated body having an opening (21) above. More than one flow outlet (22) is provided at the bottom. The treatment tank (2〇) is preferably a body having an upper and lower width, but is not limited thereto, that is, in a special case, it may be made. The upper width and the lower narrow shape. Further, in the embodiment, the opening (21) The rear side is provided with an outwardly expanding sloping plate (23), and an overflow passage (24) is formed on the left and right sides of the two front and rear slanting plates (23). Thereby, a thin plate (3 〇) The utility model is clamped on a hanger (31) and can be vertically placed into the processing tank (2〇) from top to bottom. A flow guiding unit (40) is installed in the opening of the processing tank (2〇) The front and rear sides of (21) are mounted on the front and rear sloping plates (23) for introducing a chemical solution, which includes two front and rear spray pipes (41), (42) They are respectively disposed on the swash plates (23) on the front and rear sides of the opening, and a plurality of nozzles (411) and (421) are disposed on opposite sides of the opening, and the nozzles (411) and (421) are directed to the thin plate ( 30) Inject chemical solution into both sides and the treatment tank (20), and spray the solution M334597 onto the front and rear surfaces of the thin plate (30) as a fluid beam to flow downwardly.

動’且令該導入之溶液大於該處理槽(20)底部之流出口 (22) ’俾使該槽内充滿溶液,使該薄板材(3〇)懸浮於該處理 槽(20)内。 於是’如第四圖所示,當待處理之薄板材(30)置入該處 理槽(20)時’藉由該導流單元(40)之作用,前侧溶液(80)及 後侧溶液(90)分別於前後兩側流動,形成前導流(81)及後導 流(91)兩股流力,進而得薄板件(3〇)趨向處理槽(2〇)中央, 而懸浮於槽内,且該化學溶液的流體導流係前後皆在進行, 可達平衡效果,並在流動狀態中,仍可使薄板材(3〇)左右搖 擺、振動及使用超音波等其中任一或其組合式所構成之輔助 裝置,提供更大化學溶液於薄板材(30)之表面交換及反應速 度,以達更佳效果。 當然,前述導流單元(40)所導入處理槽(2〇)或溢流之化 學溶液,係可藉由一設在處理槽(2〇)下方之回收裝置(5〇)予 以回收,並不會浪費。該回收裝置(50)更包括與一泵浦(6〇) 及一過濾器(70)連接,可將回收之化學溶液送至該導流單元 (40)之二支前、後喷流管(41)、(42),使化學溶液不斷循環 過濾,可常保清潔,且化學溶液由上方流向下方,此—導济 過程中,可使待處理之薄板件(30)表面上產生之粉塵或顇教 帶走,使板件表面乾淨平滑。 前揭導流式處理方法及裝置可以廣泛應用於薄板持之 化學處理及清洗之流程。例如PCB之顯影(Developing)、麵 刻(Etching)、除膜(Stri卯ing)、清洗等流程。此外鋁板柯 等其他等效材質相關之處理亦適用。 M334597And the resulting solution is larger than the outlet (22) of the bottom of the treatment tank (20), so that the tank is filled with the solution, and the thin plate (3) is suspended in the treatment tank (20). Thus, as shown in the fourth figure, when the thin plate (30) to be treated is placed in the treatment tank (20), the front side solution (80) and the back side solution are acted upon by the flow guiding unit (40). (90) flowing on the front and rear sides respectively, forming two flow forces of the front guide flow (81) and the rear guide flow (91), thereby obtaining a thin plate member (3〇) which is oriented toward the center of the treatment tank (2〇) and suspended in the groove Inside, and the fluid guiding system of the chemical solution is performed before and after, and the balance effect can be achieved, and in the flowing state, the thin plate (3 〇) can be swayed, vibrated, and ultrasonic waves or the like or The auxiliary device formed by the combination provides a larger chemical solution on the surface exchange and reaction speed of the thin plate (30) for better effect. Of course, the chemical solution introduced into the treatment tank (2〇) or overflowed by the flow guiding unit (40) can be recovered by a recovery device (5〇) disposed under the treatment tank (2〇), and is not It will be wasted. The recovery device (50) further includes a pump (6 〇) and a filter (70), and the recovered chemical solution can be sent to the front and rear spouts of the flow guiding unit (40) ( 41), (42), the chemical solution is continuously circulated and filtered, and can be kept clean at all times, and the chemical solution flows from the upper side to the lower side, which can cause dust or sputum generated on the surface of the thin plate member (30) to be treated during the guiding process. Teach away and make the surface of the board clean and smooth. The previously disclosed flow processing method and apparatus can be widely applied to the chemical processing and cleaning processes of thin sheets. For example, developing, developing, etching, cleaning, cleaning, and the like of a PCB. In addition, the treatment of other equivalent materials such as aluminum plate is also applicable. M334597

1 ί 是以,本創作以一導流原理所設計而成之化學處理裝 置,係充分運用流體力學中液體之流動特性,以及材料力學 中薄板材之特性,使得板材之化學反應係在平衝流動中充分 交換而完成,且不易接觸到槽壁,可防止板件損傷,以達最 佳處理品質。 綜上所述,本創作所揭示之構造,為昔所無,且確能達 到功效之增進,並具可供產業利用性,完全符合新型專利要 件,祈請貴審查委員核賜專利,以勵創新,無任德感。1 ί Therefore, the chemical treatment device designed by the principle of a flow guiding principle is to fully utilize the flow characteristics of liquid in fluid mechanics and the characteristics of thin plates in material mechanics, so that the chemical reaction of the plate is in flat Completely exchanged in the flow to complete, and not easy to contact the groove wall, to prevent damage to the plate, in order to achieve the best processing quality. In summary, the structure revealed by this creation is unprecedented, and it can achieve the improvement of efficacy, and it can be used for industrial utilization. It fully complies with the new patent requirements, and invites your review committee to grant patents. Innovation, no sense of morality.

惟,上述所揭露之圖式、說明,僅為本創作之較佳實施 例,大凡熟悉此項技藝人士,依本案精神範疇所作之修飾或 等效變化,仍應包括在本案申請專利範圍内。However, the above-mentioned drawings and descriptions are only preferred embodiments of the present invention. Modifications or equivalent changes made by those skilled in the art in accordance with the spirit of the case should still be included in the scope of the patent application.

-9--9-

M334597 【圖式簡單說明】 第一圖係習用一種化學處理裝置之示意圖。 第二圖係本創作較佳實施例之側面剖示圖。 第三圖係本創作較佳實施例之正面剖示圖。 第四圖係本創作較佳實施例之導流構架圖及方塊圖 主要元件符號說明 (20) 處理槽 (21) 開口 (22) 流出口 (23) 斜板 (24) 溢流通道 (30) 薄板材 (31) 掛架 (40) 導流單元 (41) 前喷流管 (42) 後喷流管 (411)、(421)喷嘴 (50)回收裝置 (60)泵浦 (70)過濾器 (80) 前側溶液 (81) 前導流 (90) 後側溶液 (91) 後導流 -10-M334597 [Simple description of the diagram] The first figure is a schematic diagram of a chemical treatment device. The second drawing is a side cross-sectional view of a preferred embodiment of the present invention. The third drawing is a front cross-sectional view of a preferred embodiment of the present invention. The fourth drawing is a schematic diagram of the flow guiding structure and block diagram of the preferred embodiment of the present invention. (20) Processing tank (21) Opening (22) Outlet (23) Inclined plate (24) Overflow channel (30) Thin sheet (31) Hanging frame (40) Flow guiding unit (41) Front spray pipe (42) Rear spray pipe (411), (421) Nozzle (50) Recovery device (60) Pump (70) Filter (80) Front side solution (81) Front flow (90) Back side solution (91) Back flow -10-

Claims (1)

M334597 俨卿_ LI ill ·~τ~τττ — ------ --. r i ~ 九、申請專利範圍: 1 ·一種垂直導流式薄板材化學處理裝置,包含: 一處理槽,係上方呈開口之狹長型體,底部設有流出口 一薄板材,係被夾固在一掛架(Rack)上,並由上而下垂 直置入該處理槽;以及 一導流單元,係裝設在該處理槽開口的前後兩側,用以 導入化學溶液,並使該溶液呈流體束喷向該薄板材的前後兩 侧表面而向下快速流動,且令該導入之溶液流量大於該處理 槽底部之流出量,俾使該槽内充滿溶液,使該薄板材懸浮於 該處理槽内。 2 ·如申請專利範圍第1項所述之垂直導流式薄板材化 學處理裝置,其中,該處理槽上更包括設有左右搖擺、振動 及超音波其中任一或其組合式所構成之輔助裝置。 3 ·如申請專利範圍第1項所述之垂直導流式薄板材化 學處理裝置,其中,該處理槽包括用以提供該薄板材之化學 處理及清洗流程。 4·如申請專利範圍第1項所述之垂直導流式薄板材化 學處理裝置,其中,該薄板材包括為印刷電路板(PCB)及鋁板 材其中任一。 5 ·如申請專利範圍第1項所述之垂直導流式薄板材化學 處理裝置,其中,該導流單元包括有二支前、後喷流管係分別 -11 - 修止! 評 M334597 設置在該開口的前後兩側之斜板上,其相向對應之内側設有多 數之喷嘴,由該喷嘴向該薄板材兩侧及處理槽内注入化學溶 液0 6·如申請專利範圍第5項所述之垂直導流式薄板材化 學處理裝置,其中,該導流單元導入該處理槽内及溢流之化 學溶液,係藉由一設在該處理槽下方之回收裝置予以回收, 且該回收裝置包括與一泵浦及過濾器連接,可將回收之化學 溶液送至該導流單元之二支前、後喷流管,使化學溶液不斷 循環過濾。 -12- M334597 十、圖式:M334597 俨卿_ LI ill ·~τ~τττ — ------ --. ri ~ IX. Scope of application: 1 · A vertical flow-through thin sheet chemical processing device, comprising: a treatment tank, above a slit-shaped body having an opening, a thin plate at the bottom of the outlet, being clamped to a rack (Rack) and vertically placed into the processing tank from top to bottom; and a flow guiding unit Providing a chemical solution on the front and rear sides of the opening of the treatment tank, and spraying the solution as a fluid beam to the front and rear surfaces of the thin plate to rapidly flow downward, and the flow rate of the introduced solution is larger than the treatment tank The outflow amount of the bottom is filled with the solution to suspend the thin plate in the treatment tank. 2. The vertical flow-through thin sheet chemical processing apparatus according to claim 1, wherein the processing tank further comprises an auxiliary formed by any one of a left-right swing, a vibration, and an ultrasonic wave or a combination thereof. Device. 3. The vertical flow-through thin sheet chemical processing apparatus of claim 1, wherein the processing tank comprises a chemical treatment and cleaning process for providing the thin sheet. 4. The vertical flow-through thin sheet chemical processing apparatus according to claim 1, wherein the thin sheet material comprises any one of a printed circuit board (PCB) and an aluminum sheet. 5. The vertical flow-through thin sheet chemical processing apparatus according to claim 1, wherein the flow guiding unit comprises two front and rear spray pipe systems respectively -11 - repair! Comment M334597 is set in a plurality of nozzles are disposed on opposite sides of the slanting plate on the front and rear sides of the opening, and the chemical solution is injected into the processing plate by the nozzle. The sixth embodiment of the invention is as described in claim 5 The vertical flow-through thin sheet chemical processing device, wherein the flow guiding unit is introduced into the processing tank and overflows the chemical solution, and is recovered by a recycling device disposed under the processing tank, and the recycling device comprises Connected to a pump and filter, the recovered chemical solution can be sent to the front and rear spouts of the flow guiding unit to continuously circulate and filter the chemical solution. -12- M334597 X. Schema: 第一圖First picture M334597 七、指定代表圖: (一)本案指定代表圖為:第(四)圖。 • (二)本代表圖之元件符號簡單說明: (20)處理槽 (30)薄板材 (40)導流單元 &quot; (80)前侧溶液 (81)前導流 &gt; (90)後侧溶液 (91)後導流M334597 VII. Designated representative map: (1) The representative representative of the case is: (4). • (b) A brief description of the symbol of the representative figure: (20) Treatment tank (30) Thin plate (40) Diversion unit &quot; (80) Front side solution (81) Front flow > (90) Rear side After the solution (91) -4--4-
TW96213187U 2007-08-10 2007-08-10 Chemical processing device of thin plate material having vertical flow-guide type TWM334597U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW96213187U TWM334597U (en) 2007-08-10 2007-08-10 Chemical processing device of thin plate material having vertical flow-guide type

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW96213187U TWM334597U (en) 2007-08-10 2007-08-10 Chemical processing device of thin plate material having vertical flow-guide type

Publications (1)

Publication Number Publication Date
TWM334597U true TWM334597U (en) 2008-06-11

Family

ID=44327729

Family Applications (1)

Application Number Title Priority Date Filing Date
TW96213187U TWM334597U (en) 2007-08-10 2007-08-10 Chemical processing device of thin plate material having vertical flow-guide type

Country Status (1)

Country Link
TW (1) TWM334597U (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI395700B (en) * 2010-05-10 2013-05-11
TWI407858B (en) * 2008-07-10 2013-09-01 Unimicron Technology Corp Apparatus for manufacturing pcb
TWI412481B (en) * 2010-09-27 2013-10-21
TWI461131B (en) * 2013-05-03 2014-11-11 Unimicron Technology Corp Plating and etching system and plating and etching method

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI407858B (en) * 2008-07-10 2013-09-01 Unimicron Technology Corp Apparatus for manufacturing pcb
TWI395700B (en) * 2010-05-10 2013-05-11
TWI412481B (en) * 2010-09-27 2013-10-21
TWI461131B (en) * 2013-05-03 2014-11-11 Unimicron Technology Corp Plating and etching system and plating and etching method

Similar Documents

Publication Publication Date Title
TWM334597U (en) Chemical processing device of thin plate material having vertical flow-guide type
CN107333398B (en) Large scale circuit board etching method and apparatus
JP2009249276A (en) Downward substrate slimming device and slimming system using the same
TW202009332A (en) Plating device and plating method
TW200849373A (en) Substrate etching apparatus
WO2011105072A1 (en) Substrate treating method and substrate treating apparatus
US10099262B2 (en) Specific device for cleaning electronic components and/or circuits
JP2010099637A (en) Apparatus and method for cleaning substrate
JP2011176085A (en) Substrate treating method, and substrate treating apparatus
CN201097102Y (en) Chemical processing device for vertical stream guide thin plate
JP3501747B2 (en) Plating solution jet nozzle system with adjustable flow rate of plating equipment
JP3079698B2 (en) Surface treatment equipment for printed wiring boards
TW556459B (en) Substrate processing equipment
JP3137488U (en) Equipment for chemical treatment of vertical shunt type thin plate materials
TW200305357A (en) Three-dimensional swinging spray device of acid cleaning machine in PCB process
JP2000256891A (en) Electroplating method and anode structural body
CN101815407B (en) Sheet immersing treatment method and device
TWI663293B (en) Gaseous agitating device of electroplating system
TWI415693B (en) Apparatus for cleaning substrate
JP2002273354A (en) Method and apparatus for treating substrate with chemical liquid
JP2008171994A (en) Flow-dip soldering machine
TWI598471B (en) Non-contact vertical continuous plating equipment
CN220043786U (en) Novel etching device
CN219851105U (en) Bernoulli rinse residue liquid removal apparatus
KR20190108033A (en) Vertical continuous plating apparatus

Legal Events

Date Code Title Description
MK4K Expiration of patent term of a granted utility model