JP3137488U - Equipment for chemical treatment of vertical shunt type thin plate materials - Google Patents

Abstract

A vertical shunt type thin plate chemical processing apparatus which does not damage the surface of a plate material is provided.
A vertical diversion thin plate chemical processing apparatus is an elongated main body having an opening 21 at the top, a processing tank 20 provided with one or more outlets 22 at the bottom, and a rack 31 fitted and fixed, and vertically. In order to introduce the chemical solution into the thin plate material 30 installed vertically in the processing tank 20, it is installed on both the front and rear sides of the opening 21 of the processing tank 20, and the solution exhibits a fluid bundle, to the front and rear side surfaces of the thin plate material 30. The flow is made to flow downward at high speed, and the flow rate of the introduced solution is made to exceed the outflow amount at the bottom of the processing tank 20, the tank is filled with the solution, and the thin plate 30 is floated in the processing tank 20. And a unit 40.
[Selection] Figure 2

Description

  The present invention relates to an apparatus for chemically processing a thin plate material, and more particularly to a design of a thin plate material processing by a vertical diversion method.

  With the advent of the information era, printed circuit boards (PCBs) have become important components of each electronic product, and have become the main key points for precise design in the functions of precision electronic products and in any peripheral parts. As is well known, the printed circuit board manufacturing process includes surface treatment, pressure bonding, exposure, development (developing), washing with water, etching (etching), and stripping. In the process of processing, most of them used horizontal equipment.

  However, as the development of printed circuit boards has become thinner, the thickness of printed circuit boards has gradually decreased in order to meet the recent demand for high-technology products. The standard often seen is about 0.06 mm to 1.2 mm and the thickness of the copper foil (UTC) is 18 to 70 μm. However, the circuit of the thin plate material has become more precise and extremely susceptible to damage. Therefore, the conventional horizontal processing equipment used in chemical processing cannot achieve the expected high processing quality, whether it is a transport method or a method in which a chemical solution (developer, etc.) is sprayed on a thin plate material. It has become easy to do very big damage to.

  Therefore, an attempt has been made to change the thin plate material chemical treatment and cleaning step so that the treatment is performed by the vertical equipment shown in FIG. That is, the thin plate material 13 is fitted and fixed in a rack 14 and moved to a treatment tank 11 individually designated by a crane to perform cleaning or chemical treatment. Although 12 was circulating, its fluidity seemed insufficient. Therefore, in order to provide the chemical solution 12 in the tank with higher fluidity, a method is used in which air is sent to the bottom end of the processing tank 11 using a blower and the solution can receive the action of bubbles, or in the processing tank 11. A number of methods were used, such as providing a water injection pipe to support the fluidity of the solution, thereby achieving surface exchange of the thin plate 13 and increasing the reaction rate.

However, although the above-mentioned prior art (Prior Art) provided some effects in supporting the flow of chemical solutions, the quality requirements for thin plates such as printed circuit boards and aluminum plates have become higher, and processing The volume of the tank 11 is smaller, and a tank that does not occupy space has been demanded. Therefore, the chemical treatment tank currently used is not perfect and there is room for further improvement.
The main object of the present invention is to provide a vertical chemical flow type thin plate chemical processing apparatus.
In view of the above, the inventor of the present invention has repeatedly studied and improved based on the experience of conventional wet processing processes such as electroplating, in chemical processing and cleaning processes such as development, etching, and peeling of thin plate materials such as PCBs or aluminum plates. The aim was to provide a better method.

The design principle of the present invention is to provide an opening for the solution to flow downward in a narrow processing tank, and when the supply of the solution exceeds the solution flowing out from the bottom end of the processing tank, the tank is filled with the solution, Furthermore, it flows out to the tank side. Therefore, even when a plate material waiting for processing is placed in the processing tank, the solution is directed toward the center of the processing tank due to the influence of the front and rear diversion, and the plate material is in a floating state in the tank. Thus, the plate material surface is less likely to contact the tank wall, and the effect of preventing the plate material surface from being damaged is enhanced.

  Further, since the solution flows at high speed downward, good solution exchange can be obtained by using the stirring and purification action of the plate material surface by the diversion effect, and the speed of the chemical reaction is increased. Furthermore, surface exchange and reaction rate in a larger chemical solution plate material are provided through left / right swinging / vibration and ultrasonic support, and the processing quality is improved by achieving further excellent effects.

  In order to achieve the above object, a vertical flow-dividing type thin plate chemical processing apparatus according to the present invention is an elongated main body having an opening at the top, a processing tank provided with one or more outlets at the bottom, and fitted into a rack. In order to introduce a chemical solution and a thin plate material fixed and vertically installed in the treatment tank, the chemical solution is installed on both front and rear sides of the opening of the treatment tank, the solution presents a fluid bundle, It blows to the front and rear side surfaces and flows downward at high speed, and the flow rate of the introduced solution exceeds the outflow amount of the bottom of the treatment tank, fills the tank with the solution, and fills the thin plate material in the treatment tank And a diversion unit to be floated on.

Embodiments of the present invention will be described below with reference to the drawings.
First, reference will be made to FIGS. A chemical processing apparatus according to an embodiment of the present invention includes the following.
The treatment tank 20 is an elongated main body having an opening 21 on the upper side, and includes one or more outlets 22 at the bottom. The treatment tank 20 preferably has a main body shape having a wide vertical width, but is not limited to this, and in a special situation, the upper part can be wide and the lower part can be narrow. In the present embodiment, swash plates 23 that extend outward are provided on both front and rear sides of the opening 21, and outflow passages 24 are formed on the left and right sides of the two front and rear swash plates 23. Thus, the thin plate material 30 is fitted and fixed to the rack 31 and can be installed vertically in the processing tank 20.

  The diversion unit 40 is provided on both front and rear sides of the opening 21 of the processing tank 20. In the present embodiment, in order to introduce a chemical solution, two front and rear ejection pipes 41 and 42 are provided on the front and rear swash plates 23 and are respectively installed on the front and rear swash plates 23 of the opening. A large number of nozzles 411 and 421 are provided inside corresponding to each other, and a chemical solution is injected from the nozzles 411 and 421 into both sides of the thin plate material 30 and into the treatment tank 20. And the said solution exhibits a fluid bundle | flux, it ejects to the front-and-rear both-sides surface of the thin board | plate material 30, and flows at high speed to the downward direction. Further, the introduced solution exceeds the outflow amount at the outlet 22 at the bottom of the processing tank 20 to fill the tank with the solution, and the thin plate 30 is floated in the processing tank 20.

  As shown in FIG. 4, when the thin plate material 30 waiting for processing is placed in the processing tank 20, the front-side solution 80 and the rear-side solution 90 flow on both the front and rear sides by the action of the diversion unit 40. Then, by forming two flow forces of the front branch 81 and the rear branch 91, the thin plate member 30 can move toward the center of the processing tank 20 and float in the tank. In addition, the fluid solution diversion of the chemical solution is performed before and after all, and an equilibrium effect can be achieved. In a flowing state, in order to achieve a further excellent effect by an auxiliary device configured by swinging / vibrating the thin plate material 30 left and right, using one of the methods using ultrasonic waves, or a combination thereof. Provides surface exchange and reaction rate in the sheet 30 of larger chemical solutions.

  Naturally, the chemical solution in the processing tank 20 introduced by the diversion unit 40 or the chemical solution that has flowed out can be recovered by the recovery device 50 provided below the processing tank 20 and is not wasted. . The recovery device 50 further includes a pump 60 and a filter 70 that are connected to each other, and transports the recovered chemical solution to the two front and rear ejection pipes 41 and 42 of the flow dividing unit 40 and continues the chemical solution. Filtration can be performed, and cleanliness can always be maintained. Then, the chemical solution flows from the upper side to the lower side, and in this diversion step, the dust or granules generated on the surface of the thin plate material 30 waiting for processing can be removed, and the surface of the plate material can be made clean and smooth.

The above-described shunt type processing method and apparatus can be widely applied in the thin plate material chemical processing and cleaning steps. For example, PCB development (developing), etching (etching), stripping, cleaning, and the like. In addition, treatments related to other equivalent materials such as an aluminum plate can also be applied.
In order to achieve the best processing quality, the present invention uses a chemical processing device designed and built based on the principle of diversion, and fully utilizes the fluid flow characteristics in fluid dynamics, while at the same time, The properties are used so that the chemical reaction of the plate material can be sufficiently exchanged and completed in the flow equilibrium state. In addition, it is difficult to contact the tank wall, and damage to the plate material can be prevented.

It is the schematic of the conventional chemical processing apparatus. It is side surface sectional drawing which shows the chemical processing apparatus by one embodiment of this invention. It is front sectional drawing which shows the chemical processing apparatus by one embodiment of this invention. It is a flow-dividing structure figure and block diagram in the chemical processing apparatus by one embodiment of this invention.

Explanation of symbols

  20: treatment tank, 21: opening, 22: outlet, 23: swash plate, 24: outflow passage, 30: thin plate material, 31: rack, 40: diversion unit, 41: front ejection pipe, 42: rear ejection pipe, 411, 421: Nozzle, 50: Recovery device, 60: Pump, 70: Filter, 80: Front side solution, 81: Front side diversion, 90: Back side solution, 91: Back side diversion

Claims (6)

In vertical shunt type thin plate chemical processing equipment,
An elongate body having an opening upward, a treatment tank having a plurality of outlets at the bottom;
A thin plate material that is fitted and fixed in a rack and installed vertically in the processing tank;
In order to introduce the chemical solution, it was installed on both the front and rear sides of the opening of the treatment tank, the solution exhibited a fluid bundle, sprayed to the front and rear side surfaces of the thin plate material, and flowed downward at high speed, and further introduced. A flow dividing unit that causes the flow rate of the solution to exceed the outflow amount at the bottom of the processing tank, fills the tank with the solution, and floats the thin plate material in the processing tank;
An apparatus for chemically treating a vertical shunt type thin plate material characterized by comprising:   The vertical shunt type thin film according to claim 1, wherein the treatment tank further includes an auxiliary device configured by any one or a combination of swinging to the left and right, vibration and ultrasonic waves. Equipment for chemical processing of plate materials.   The apparatus for chemically treating a vertical shunt type thin plate material according to claim 1, wherein the processing tank is provided for a chemical treatment and cleaning process of the thin plate material.   2. The apparatus for chemically treating a vertical shunt type thin plate material according to claim 1, wherein the thin plate material is made of a printed board or an aluminum plate material.   Each of the diversion units has two front and rear jet pipes installed on swash plates on both sides before and after the opening, and is provided with a number of nozzles facing each other on both sides of the thin plate material and inside the processing tank. The apparatus for chemically treating a vertical shunt type thin plate material according to claim 1, wherein a chemical solution is injected into the substrate.   The chemical solution in the processing tank introduced by the diversion unit or the chemical solution that has flowed out can be recovered by a recovery device provided below the processing tank, and the recovery device is connected to a pump connected to the processing tank. 6. The vertical shunt system according to claim 5, further comprising a filter, wherein the recovered chemical solution is conveyed to two front and rear jet pipes of the shunt unit, and the chemical solution is continuously circulated and filtered. For chemical processing of thin plate materials.

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