JP2010099637A - Apparatus and method for cleaning substrate - Google Patents

Apparatus and method for cleaning substrate Download PDF

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JP2010099637A
JP2010099637A JP2008275901A JP2008275901A JP2010099637A JP 2010099637 A JP2010099637 A JP 2010099637A JP 2008275901 A JP2008275901 A JP 2008275901A JP 2008275901 A JP2008275901 A JP 2008275901A JP 2010099637 A JP2010099637 A JP 2010099637A
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substrate
cleaning
cleaning liquid
immersion tank
holder
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Ryuji Sakaguchi
竜二 坂口
Tomoo Shigeru
智雄 茂
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Resonac Holdings Corp
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Showa Denko KK
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<P>PROBLEM TO BE SOLVED: To provide an apparatus and a method for cleaning a substrate, in each of which dust or the like stuck to the surface of the substrate can be removed efficiently and the removed dust is prevented from being stuck again to the surface of the substrate after the substrate is cleaned. <P>SOLUTION: The substrate W is cleaned by immersing a substrate W-held holder 50 in a cleaning liquid L in an immersion tank 2 while making the cleaning liquid L flow horizontally in a laminar flow state in the immersion tank 2. In other words, the substrate W is cleaned by arranging the holder 50 in the immersion tank 2 so that the main surface of the substrate W becomes parallel to the flow direction of the cleaning liquid L while forcing a part of the cleaning liquid L flowing on the upstream side of the holder 50 to form a turbulent flow. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

本発明は、例えば磁気記録媒体用基板などの基板の洗浄を行う基板洗浄装置及び基板洗浄方法に関する。   The present invention relates to a substrate cleaning apparatus and a substrate cleaning method for cleaning a substrate such as a magnetic recording medium substrate.

例えば、ハードディスクドライブなどに用いられる磁気記録媒体用の基板には、中心孔が形成された円盤状のアルミニウム基板やガラス基板などが用いられている。このような磁気記録媒体用基板は、表面に研磨加工などの様々な表面処理工程を経て作製されるため、表面処理工程等の後には、基板の表面に付着した塵埃などを除去する基板洗浄工程が行われている。   For example, as a substrate for a magnetic recording medium used for a hard disk drive or the like, a disk-shaped aluminum substrate or a glass substrate having a central hole is used. Since such a magnetic recording medium substrate is manufactured through various surface treatment processes such as polishing on the surface, a substrate cleaning process for removing dust and the like adhering to the surface of the substrate after the surface treatment process and the like. Has been done.

また、磁気記録媒体の更なる高記録密度化が要求に伴って、磁気記録媒体の高い平坦度が求められる一方で、基板の表面に付着した塵埃などを除去するための高度な洗浄技術が求められている。   In addition, with the demand for higher recording density of magnetic recording media, high flatness of magnetic recording media is required, while advanced cleaning technology for removing dust and the like adhering to the surface of the substrate is required. It has been.

このような磁気記録媒体用基板の洗浄には、浸漬槽の底部から洗浄液を供給して、この洗浄液を浸漬槽の上部からオーバーフローさせながら、浸漬槽内の洗浄液に基板を保持したホルダを浸漬させて基板の洗浄を行う基板洗浄装置が、精密洗浄の分野で一般的に用いられている(例えば、特許文献1などを参照。)。   In cleaning such a magnetic recording medium substrate, a cleaning liquid is supplied from the bottom of the immersion tank, and the holder holding the substrate is immersed in the cleaning liquid in the immersion tank while overflowing the cleaning liquid from the top of the immersion tank. In general, a substrate cleaning apparatus that cleans a substrate is used in the field of precision cleaning (see, for example, Patent Document 1).

しかしながら、浸漬槽の下方から上方に向かって洗浄液を流す基板洗浄装置では、基板の表面から剥離した塵埃等を含むダストが浸漬槽の上部から洗浄液と共に排出されずに一部が浸漬槽内に滞留してしまうことがあり、この浸漬槽内に洗浄液の淀みを生じさせることがあった。この場合、ホルダを浸漬槽から引き上げる際に、洗浄液内に滞留したダストが基板の表面に再付着することがある。   However, in the substrate cleaning apparatus that flows the cleaning liquid from the bottom to the top of the immersion tank, the dust, including dust that has peeled off the surface of the substrate, is not discharged from the upper part of the immersion tank together with the cleaning liquid, but a part of the dust stays in the immersion tank. In some cases, stagnation of the cleaning liquid may occur in the immersion bath. In this case, when the holder is pulled up from the immersion tank, dust staying in the cleaning liquid may reattach to the surface of the substrate.

一方、浸漬槽内に洗浄液を層流の状態で水平方向に流しながら、この浸漬槽内の洗浄液に基板を保持したホルダを浸漬させることによって、基板の洗浄を行う基板洗浄装置が提案されている(例えば、特許文献2などを参照。)。   On the other hand, there has been proposed a substrate cleaning apparatus for cleaning a substrate by immersing a holder holding a substrate in the cleaning liquid in the immersion tank while flowing the cleaning liquid in a laminar flow in a horizontal direction in the immersion tank. (See, for example, Patent Document 2).

このような洗浄液を層流の状態で水平方向に流す基板洗浄装置では、ダストを含む洗浄液を浸漬槽の外へと速やかに排出することができるため、基板の表面にダストが再付着することを防止することができる。   In such a substrate cleaning apparatus that allows the cleaning liquid to flow in the horizontal direction in a laminar state, the cleaning liquid containing dust can be quickly discharged out of the immersion tank, so that the dust reattaches to the surface of the substrate. Can be prevented.

しかしながら、洗浄液を層流の状態で流す基板洗浄装置を用いて、磁気記録媒体用基板のような平板状の被洗浄物を洗浄する場合には、基板の表面に対する洗浄液の当たりがスムーズ過ぎて、洗浄能力が低下するといった欠点がある。
特開2008−135109号公報 特開平11−76956号公報
However, when using a substrate cleaning apparatus that flows the cleaning liquid in a laminar flow state to clean a flat object to be cleaned such as a magnetic recording medium substrate, the cleaning liquid hits the surface of the substrate too smoothly, There is a disadvantage that the cleaning ability is lowered.
JP 2008-135109 A JP 11-76956 A

そこで、本発明は、このような従来の事情に鑑みて提案されたものであり、基板の表面に付着した塵埃などを効率良く除去すると共に、洗浄後にこれらが基板の表面に再付着することを防止した基板洗浄装置及び基板洗浄方法を提供することを目的とする。   Therefore, the present invention has been proposed in view of such conventional circumstances, and efficiently removes dust and the like adhering to the surface of the substrate and reattaches them to the surface of the substrate after cleaning. An object of the present invention is to provide a substrate cleaning apparatus and a substrate cleaning method which are prevented.

本発明は、以下の手段を提供する。
(1) 基板を保持したホルダを洗浄液に浸漬させる浸漬槽と、
前記浸漬槽内に洗浄液を層流の状態で水平方向に流す層流発生機構と、
前記層流の状態で流れる洗浄液の一部に乱流を発生させる乱流発生機構とを備え、
前記基板の主面が前記洗浄液の流れる方向と平行となるように前記浸漬槽内に前記ホルダが配置され、このホルダよりも上流側に前記乱流発生機構が配置されていることを特徴とする基板洗浄装置。
(2) 前記乱流発生機構は、前記浸漬槽内の洗浄液に浸漬された状態で往復操作されるポールを有することを特徴とする前項(1)に記載の基板洗浄装置。
(3) 前記ポールは、少なくとも前記洗浄液の流れる方向と交差する方向に往復操作されることを特徴とする前項(2)に記載の基板洗浄装置。
(4) 前記ポールは、前記洗浄液の流れる方向と交差する方向に複数並んで配置されて、互いに同期して操作されることを特徴とする前項(2)又は(3)に記載の基板洗浄装置。
(5) 前記ホルダには、前記基板が互いに平行な状態で複数並んで保持されることを特徴とする請求項1〜4の何れか一項に記載の基板洗浄装置。
(6) 前記基板は、磁気記録媒体用基板であることを特徴とする前項(1)〜(5)の何れか一項に記載の基板洗浄装置。
(7) 浸漬槽内に洗浄液を層流の状態で水平方向に流しながら、この浸漬槽内の洗浄液に基板を保持したホルダを浸漬させることによって、前記基板の洗浄を行う基板洗浄方法であって、
前記基板の主面が前記洗浄液の流れる方向と平行となるように前記浸漬槽内に前記ホルダを配置し、前記ホルダよりも上流側を流れる洗浄液の一部に乱流を発生させながら、前記基板の洗浄を行うことを特徴とする基板洗浄方法。
(8) 前記浸漬槽内の洗浄液に浸漬されたポールを往復操作することによって、前記洗浄液の一部に乱流を発生させることを特徴とする前項(7)に記載の基板洗浄方法。
(9) 前記ポールを、少なくとも前記洗浄液の流れる方向と交差する方向に往復操作することを特徴とする前項(8)に記載の基板洗浄方法。
(10) 前記ポールを、前記洗浄液の流れる方向と交差する方向に複数並べて配置して、互いに同期させて操作することを特徴とする前項(8)又は(9)に記載の基板洗浄方法。
(11) 前記ホルダに互いに平行な状態で複数並んで保持された基板に対して洗浄を行うことを特徴とする前項(7)〜(10)の何れか一項に記載の基板洗浄方法。
(12) 前記基板として、磁気記録媒体用基板を洗浄することを特徴とする前項(7)〜(11)の何れか一項に記載の基板洗浄方法。
The present invention provides the following means.
(1) an immersion tank in which a holder holding a substrate is immersed in a cleaning solution;
A laminar flow generating mechanism for flowing a cleaning solution in a laminar flow in the horizontal direction in the immersion tank;
A turbulent flow generating mechanism for generating turbulent flow in a part of the cleaning liquid flowing in the laminar flow state,
The holder is disposed in the immersion tank so that the main surface of the substrate is parallel to the direction in which the cleaning liquid flows, and the turbulent flow generation mechanism is disposed upstream of the holder. Substrate cleaning device.
(2) The substrate cleaning apparatus according to (1), wherein the turbulent flow generation mechanism includes a pole that is reciprocated while being immersed in the cleaning liquid in the immersion tank.
(3) The substrate cleaning apparatus according to (2), wherein the pole is reciprocated at least in a direction crossing a direction in which the cleaning liquid flows.
(4) The substrate cleaning apparatus according to (2) or (3), wherein a plurality of the poles are arranged side by side in a direction intersecting with a direction in which the cleaning liquid flows and are operated in synchronization with each other. .
(5) The substrate cleaning apparatus according to any one of claims 1 to 4, wherein a plurality of the substrates are held side by side in the holder in parallel with each other.
(6) The substrate cleaning apparatus according to any one of (1) to (5), wherein the substrate is a substrate for a magnetic recording medium.
(7) A substrate cleaning method for cleaning the substrate by immersing a holder holding the substrate in the cleaning liquid in the immersion tank while flowing the cleaning liquid horizontally in a laminar flow in the immersion tank. ,
The substrate is disposed in the immersion tank so that the main surface of the substrate is parallel to the flow direction of the cleaning liquid, and turbulence is generated in a part of the cleaning liquid flowing upstream from the holder, while the substrate is A method for cleaning a substrate, comprising:
(8) The substrate cleaning method according to (7), wherein a turbulent flow is generated in a part of the cleaning liquid by reciprocating a pole immersed in the cleaning liquid in the immersion tank.
(9) The substrate cleaning method according to (8), wherein the pole is reciprocated at least in a direction intersecting with a direction in which the cleaning liquid flows.
(10) The substrate cleaning method according to (8) or (9) above, wherein a plurality of the poles are arranged side by side in a direction intersecting with the direction in which the cleaning liquid flows, and are operated in synchronization with each other.
(11) The substrate cleaning method according to any one of (7) to (10) above, wherein cleaning is performed on a plurality of substrates held side by side in parallel with the holder.
(12) The substrate cleaning method according to any one of (7) to (11), wherein a magnetic recording medium substrate is cleaned as the substrate.

以上のように、本発明によれば、基板の表面に付着した塵埃などを効率良く除去すると共に、洗浄後にこれらが基板の表面に再付着することを防止した高度な基板洗浄を行うことが可能である。   As described above, according to the present invention, it is possible to efficiently remove dust and the like adhering to the surface of the substrate, and to perform advanced substrate cleaning that prevents them from reattaching to the surface of the substrate after cleaning. It is.

以下、本発明を適用した基板洗浄装置及び基板洗浄方法について、図面を参照して詳細に説明する。なお、以下の説明で用いる図面は、特徴をわかりやすくするために、便宜上特徴となる部分を模式的に示している場合があり、各部の寸法比率などが実際と同じであるとは限らない。   Hereinafter, a substrate cleaning apparatus and a substrate cleaning method to which the present invention is applied will be described in detail with reference to the drawings. In the drawings used in the following description, in order to make the features easy to understand, the portions that become the features may be schematically shown for convenience, and the dimensional ratios of the portions are not always the same as the actual ones.

本実施形態では、例えば図1及び図2に示すような本発明を適用した基板洗浄装置1を用いて、ハードディスクドライブに搭載される磁気記録媒体用の基板Wを洗浄する場合を例に挙げて説明する。   In the present embodiment, for example, a case where a substrate W for a magnetic recording medium mounted on a hard disk drive is cleaned using a substrate cleaning apparatus 1 to which the present invention is applied as shown in FIGS. explain.

なお、基板Wを洗浄する洗浄液Lとしては、基本的に純水が使用されるが、それ以外にも化学的な処理等が施された処理水などを使用することができ、これらの洗浄液Lは、洗浄対象となる基板Wに応じて適宜選択して使用することが可能である。   In addition, as the cleaning liquid L for cleaning the substrate W, pure water is basically used, but other than that, treated water subjected to chemical treatment or the like can be used. Can be appropriately selected and used according to the substrate W to be cleaned.

本発明を適用した基板洗浄装置1は、図1及び図2に示すように、基板Wを保持したホルダ50を洗浄液Lに浸漬させる浸漬槽2と、浸漬槽2内に洗浄液Lを層流の状態で水平方向に流す層流発生機構3と、層流の状態で流れる洗浄液Lの一部に乱流を発生させる乱流発生機構4とを備えている。   As shown in FIGS. 1 and 2, the substrate cleaning apparatus 1 to which the present invention is applied includes an immersion tank 2 in which a holder 50 holding a substrate W is immersed in the cleaning liquid L, and a laminar flow of the cleaning liquid L in the immersion tank 2. A laminar flow generating mechanism 3 that flows horizontally in a state, and a turbulent flow generating mechanism 4 that generates turbulent flow in a part of the cleaning liquid L that flows in a laminar state.

ホルダ50には、中心孔が形成された円盤状の基板Wが互いに平行な状態で複数並んで保持されている。また、各基板Wは、ホルダ50に設けられた一対の支持プレート51a,51bによって、その中心孔を通る鉛直方向の中心線を挟んだ両側の外周部が支持されている。なお、これら一対の支持プレート51a,51bには、各基板Wの外周部が係合されるV字状の溝部(図示せず。)が設けられている。   The holder 50 holds a plurality of disk-shaped substrates W formed with a center hole in parallel with each other. In addition, each substrate W is supported by a pair of support plates 51 a and 51 b provided on the holder 50 at outer peripheral portions on both sides across a vertical center line passing through the center hole. The pair of support plates 51a and 51b are provided with V-shaped grooves (not shown) with which the outer peripheral portions of the respective substrates W are engaged.

各基板Wは、これら一対の支持プレート51a,51bに支持されることによって、縦置き状態(基板Wの主面が鉛直方向と平行となる状態)でホルダ50に保持されている。そして、このホルダ50は、各基板Wの主面が洗浄液Lの流れる方向と平行となるようにして、浸漬槽2の底面上に配置されている。なお、本例では、直径2.5インチの基板Wを約5mm間隔で1列に50枚程度並べてホルダ50に保持している。   Each substrate W is supported by the pair of support plates 51a and 51b, and is held by the holder 50 in a vertically placed state (a state where the main surface of the substrate W is parallel to the vertical direction). And this holder 50 is arrange | positioned on the bottom face of the immersion tank 2 so that the main surface of each board | substrate W may become parallel to the direction through which the washing | cleaning liquid L flows. In this example, about 50 substrates W having a diameter of 2.5 inches are arranged in a row at intervals of about 5 mm and held in the holder 50.

浸漬槽2は、長方形を為す底壁2aと、底壁2aの周囲から立ち上がる4つの側壁2b,2c,2d,2eと、底壁2aと対向する上面の開口部2fとを有して、全体が略直方体状に形成されている。また、浸漬槽2の底壁2aには、洗浄液Lを供給する供給口5aと、洗浄液Lを排出する排出口5bとが設けられている。このうち、供給口5aは、洗浄液Lの流れる長手方向の上流側の側壁2bの近傍に沿って複数並んで設けられている。一方、排出口5bは、洗浄液Lの流れる長手方向の下流側の側壁2dの近傍に沿って複数並んで設けられている。   The immersion tank 2 has a rectangular bottom wall 2a, four side walls 2b, 2c, 2d, and 2e that rise from the periphery of the bottom wall 2a, and an opening 2f on the upper surface that faces the bottom wall 2a. Is formed in a substantially rectangular parallelepiped shape. The bottom wall 2a of the immersion tank 2 is provided with a supply port 5a for supplying the cleaning liquid L and a discharge port 5b for discharging the cleaning liquid L. Among these, a plurality of supply ports 5a are provided side by side along the vicinity of the upstream side wall 2b in the longitudinal direction in which the cleaning liquid L flows. On the other hand, a plurality of discharge ports 5b are provided side by side along the vicinity of the side wall 2d on the downstream side in the longitudinal direction in which the cleaning liquid L flows.

また、浸漬槽2の上流側には、後述する層流発生機構3が、上記供給口5aから供給された洗浄液Lが貯留される貯留空間S1と、上記ホルダ50が浸漬される浸漬空間S2との間を仕切るように設けられている。一方、浸漬槽2の下流側には、上記浸漬空間S2と、上記排出口5bから洗浄液Lが排出される排出空間S3との間を仕切る仕切り壁6が設けられている。この仕切り壁6には、上記基板Wを洗浄した洗浄液Lを通す複数の貫通孔6aが設けられている。また、仕切り壁6の高さは、洗浄液Lの一部を上部からオーバーフローさせるように、上記4つの側壁2b,2c,2d,2eよりも低く設定されている。   Further, on the upstream side of the immersion tank 2, a laminar flow generating mechanism 3 described later includes a storage space S1 in which the cleaning liquid L supplied from the supply port 5a is stored, and an immersion space S2 in which the holder 50 is immersed. It is provided so as to partition the space. On the other hand, on the downstream side of the immersion tank 2, a partition wall 6 is provided that partitions the immersion space S2 and the discharge space S3 from which the cleaning liquid L is discharged from the discharge port 5b. The partition wall 6 is provided with a plurality of through holes 6a through which the cleaning liquid L that has cleaned the substrate W passes. The height of the partition wall 6 is set lower than the four side walls 2b, 2c, 2d, and 2e so that a part of the cleaning liquid L overflows from the upper part.

層流発生機構3は、例えば多孔質板や不織布などの通水抵抗を有した緩衝材等を用いて、貯留空間S1から浸漬空間S2に向かって流れる洗浄液Lの流れを整流し、浸漬空間S2内の洗浄液Lを層流の状態で水平方向に流すためのものである。   The laminar flow generating mechanism 3 rectifies the flow of the cleaning liquid L flowing from the storage space S1 toward the immersion space S2 using a buffer material having water flow resistance such as a porous plate or a nonwoven fabric, for example, and the immersion space S2 This is for flowing the cleaning liquid L in the horizontal direction in a laminar flow state.

なお、層流とは、流れの流線が線状を為して整然と流れる状態のことを言う。本例では、このような層流状態の洗浄液Lを一定の流速(例えば10mm/sec程度)で水平方向に流している。また、層流発生機構3の構成については、洗浄液Lを層流の状態で水平方向に流すことができるものであれば、特に制限されるものではなく、適宜変更して実施することが可能である。   In addition, a laminar flow means the state in which the flow line of a flow flows orderly. In this example, the laminar flow cleaning liquid L is flowed in the horizontal direction at a constant flow rate (for example, about 10 mm / sec). The configuration of the laminar flow generating mechanism 3 is not particularly limited as long as the cleaning liquid L can flow in the horizontal direction in a laminar flow state, and can be appropriately changed and implemented. is there.

乱流発生機構4は、浸漬空間S2内の洗浄液Lに浸漬された状態で、この洗浄液Lの流れる方向と交差する方向に往復操作される複数本のポール7を有している。具体的に、ポール7は、上記ホルダ50よりも上流側の浸漬空間S2内に、洗浄液Lの流れる方向と直交する方向に一定間隔で複数並んで配置されている。   The turbulent flow generation mechanism 4 has a plurality of poles 7 that are reciprocated in a direction crossing the direction in which the cleaning liquid L flows while being immersed in the cleaning liquid L in the immersion space S2. Specifically, a plurality of poles 7 are arranged in the immersion space S <b> 2 upstream of the holder 50 in a direction perpendicular to the direction in which the cleaning liquid L flows at regular intervals.

また、これら複数のポール7は、図示を省略する駆動機構に連結されて、この駆動機構の駆動により互いに同期しながら、洗浄液Lの流れる方向と直交する方向に一定のストロークで往復移動(振動)される。これにより、乱流発生機構4では、浸漬空間S2内を層流の状態で流れる洗浄液Lの一部に乱流を発生させることができる。なお、乱流とは、流れの流線が乱れて混合しながら流れる状態のことを言う。   The plurality of poles 7 are connected to a drive mechanism (not shown), and are reciprocated (vibrated) with a constant stroke in a direction orthogonal to the direction in which the cleaning liquid L flows while being synchronized with each other by the drive of the drive mechanism. Is done. Thereby, in the turbulent flow generation mechanism 4, turbulent flow can be generated in a part of the cleaning liquid L that flows in a laminar flow in the immersion space S2. The turbulent flow refers to a state in which the flow line of the flow is disturbed and flows while mixing.

なお、本例では、ポール7の太さは2〜3mm程度であり、1枚の基板Wにつき1本のポール7を配置して、各ポール7のストロークを10mm程度としながら、各ポール7を0.5秒程度の周期で往復操作しているが、ポール7のストロークを大きくした場合には、2〜3枚の基板Wにつき1本のポール7を配置した構成とすることも可能である。   In this example, the thickness of the pole 7 is about 2 to 3 mm, and one pole 7 is arranged for one substrate W, and the stroke of each pole 7 is about 10 mm, and each pole 7 is Although the reciprocating operation is performed with a period of about 0.5 seconds, when the stroke of the pole 7 is increased, a configuration in which one pole 7 is arranged for two to three substrates W is also possible. .

また、基板洗浄装置1には、浸漬槽2内を流れる洗浄液Lを循環的に再使用するため、排出口5bから排出された洗浄液Lが貯留されるリザーバータンク8と、リザーバータンク8に貯留された洗浄液Lを供給口5aに圧送するためのポンプ9と、ポンプ9により圧送された洗浄液Lを浄化するフィルタ10とが設けられている。   In the substrate cleaning apparatus 1, since the cleaning liquid L flowing in the immersion tank 2 is reused cyclically, the cleaning liquid L discharged from the discharge port 5 b is stored in the reservoir tank 8 and the reservoir tank 8. A pump 9 for pumping the cleaning liquid L to the supply port 5a and a filter 10 for purifying the cleaning liquid L pumped by the pump 9 are provided.

本発明を適用した基板洗浄方法は、以上のような構造を有する基板洗浄装置1を用いて、ホルダ50に保持された複数の基板Wに対する洗浄を行う。具体的に、この基板洗浄装置1を用いた基板洗浄方法では、浸漬槽2の浸漬空間S2内で洗浄液Lを層流の状態で水平方向に流しながら、この浸漬空間S2内の洗浄液Lに複数の基板Wを保持したホルダ50を浸漬させる。   In the substrate cleaning method to which the present invention is applied, the plurality of substrates W held by the holder 50 are cleaned using the substrate cleaning apparatus 1 having the above structure. Specifically, in the substrate cleaning method using the substrate cleaning apparatus 1, a plurality of cleaning liquids L in the immersion space S <b> 2 are supplied to the cleaning liquid L in the immersion space S <b> 2 while flowing the cleaning liquid L in the laminar flow in the horizontal direction. The holder 50 holding the substrate W is immersed.

このとき、浸漬槽2内では、ホルダ50に保持された各基板Wの主面が洗浄液Lの流れる方向と平行とされて、これら各基板Wの間を層流状態の洗浄液Lが流れることになる。さらに、この浸漬槽2内では、ホルダ50よりも上流側を流れる洗浄液Lの一部に乱流を発生させることによって、各基板Wの間に乱流状態の洗浄液Lが流れ込むことになる。これにより、本発明では、各基板Wの間を層流状態の洗浄液Lのみが流れる場合よりも、各基板Wの表面に付着した塵埃などのダストを効率良く除去することが可能である。   At this time, in the immersion tank 2, the main surface of each substrate W held by the holder 50 is parallel to the flowing direction of the cleaning liquid L, and the laminar cleaning liquid L flows between the substrates W. Become. Furthermore, in this immersion tank 2, turbulent cleaning liquid L flows between the substrates W by generating turbulent flow in a part of the cleaning liquid L flowing upstream from the holder 50. Accordingly, in the present invention, dust such as dust attached to the surface of each substrate W can be efficiently removed as compared with the case where only the laminar cleaning liquid L flows between the substrates W.

また、この基板洗浄装置1では、洗浄液Lを水平方向に流すことによって、上述したダストを含む洗浄液Lを浸漬槽2の外へと速やかに排出することができる。したがって、本発明では、ホルダ50を浸漬槽2から引き上げる際に、基板Wの表面にダストが再付着することを防ぐことが可能である。   Further, in the substrate cleaning apparatus 1, the cleaning liquid L containing dust can be quickly discharged out of the immersion tank 2 by flowing the cleaning liquid L in the horizontal direction. Therefore, in the present invention, dust can be prevented from reattaching to the surface of the substrate W when the holder 50 is pulled up from the immersion bath 2.

以上のように、本発明によれば、基板の表面に付着した塵埃などを効率良く除去すると共に、洗浄後にこれらが基板の表面に再付着することを防止した高度な基板洗浄を行うことが可能である。   As described above, according to the present invention, it is possible to efficiently remove dust and the like adhering to the surface of the substrate, and to perform advanced substrate cleaning that prevents them from reattaching to the surface of the substrate after cleaning. It is.

なお、本発明は、上記実施形態のものに必ずしも限定されるものではなく、本発明の趣旨を逸脱しない範囲において種々の変更を加えることが可能である。   In addition, this invention is not necessarily limited to the thing of the said embodiment, A various change can be added in the range which does not deviate from the meaning of this invention.

例えば、上記乱流発生機構4では、層流の状態で流れる洗浄液Lの一部に乱流を発生させるため、上記ポール7を洗浄液Lの流れる方向と交差する方向に移動操作する構成となっているが、この操作方向以外にも、例えば、上記ポール7を洗浄液Lの流れる方向に往復操作したり、上記ポール7を上下方向(軸方向)に往復操作したりすることも可能である。さらに、これらの操作を組み合わせたりすることも可能である。   For example, the turbulent flow generation mechanism 4 is configured to move the pole 7 in a direction crossing the direction in which the cleaning liquid L flows in order to generate turbulent flow in a part of the cleaning liquid L that flows in a laminar state. However, in addition to this operation direction, for example, the pole 7 can be reciprocated in the direction in which the cleaning liquid L flows, or the pole 7 can be reciprocated in the vertical direction (axial direction). Further, these operations can be combined.

また、上記ポール7の形状や数、配置等については、洗浄対象となる基板Wに応じて適宜変更して実施することが可能である。   Further, the shape, number, arrangement, and the like of the pole 7 can be appropriately changed according to the substrate W to be cleaned.

さらに、本発明では、基板Wに対する洗浄能力を高めるため、浸漬空間S2内の洗浄液Lに超音波振動(例えば、200kHzで500W程度)を加えることも可能である。   Furthermore, in the present invention, in order to enhance the cleaning ability for the substrate W, it is also possible to apply ultrasonic vibration (for example, about 500 W at 200 kHz) to the cleaning liquid L in the immersion space S2.

また、上記ホルダ50は、一対の支持プレート51a,51bにより各基板Wの外周部を2点で支持する構成となっているが、このような構成に限らず、各基板Wを支持する外周部の位置や点数などについては、適宜変更して実施することが可能であり、例えば各基板Wの外周部を3点で支持したり、4点で支持したりすることが可能である。   Further, the holder 50 is configured to support the outer peripheral portion of each substrate W at two points by the pair of support plates 51a and 51b. However, the configuration is not limited to this configuration, and the outer peripheral portion supporting each substrate W. The position, the number of points, and the like can be appropriately changed and implemented. For example, the outer peripheral portion of each substrate W can be supported at three points or supported at four points.

また、各基板Wの外周部を支持する部材についても、上記支持プレート51a,51bのようなものに限定されるものではなく、浸漬槽2内を流れる洗浄液Lの流れを乱さないものであれば、その形状等については適宜変更して実施することが可能である。   Further, the members that support the outer peripheral portion of each substrate W are not limited to the support plates 51a and 51b as long as they do not disturb the flow of the cleaning liquid L flowing in the immersion bath 2. The shape and the like can be changed as appropriate.

また、本発明は、上述した磁気記録媒体用の基板Wについて、表面処理工程等の後に表面に付着した塵埃などを除去する工程とは別に、例えば磁性膜等を成膜した後や、潤滑剤を塗布する前の磁気記録媒体の洗浄にも適用することが可能である。さらに、本発明は、上述した磁気記録媒体用の基板Wを洗浄する場合に限らず、平板状の被洗浄物を洗浄する場合に好適に用いることが可能である。   Further, the present invention provides a lubricant for the magnetic recording medium substrate W described above, for example, after forming a magnetic film or the like separately from the step of removing dust and the like adhering to the surface after the surface treatment step or the like. The present invention can also be applied to cleaning of a magnetic recording medium before coating. Furthermore, the present invention is not limited to the case of cleaning the above-described magnetic recording medium substrate W, but can be suitably used for cleaning a flat object to be cleaned.

以下、実施例により本発明の効果をより明らかなものとする。なお、本発明は、以下の実施例に限定されるものではなく、その要旨を変更しない範囲で適宜変更して実施することができる。   Hereinafter, the effects of the present invention will be made clearer by examples. In addition, this invention is not limited to a following example, In the range which does not change the summary, it can change suitably and can implement.

(実施例1)
実施例1では、上記図1,2に示す基板洗浄装置1を用いて、実際に基板Wの洗浄を行った。浸漬槽2は、長さ約300mm、奥行き約200mm、高さ約200mmである。洗浄液Lには純水を使用し、洗浄液Lの層流の流速は5cm/秒とした。基板Wは、外径65mm、内径20mm、厚さ0.8mmの円盤状のガラス基板である。ホルダ50には、この基板Wを7mm間隔で25枚平行に並べて載置した。そして、このホルダ50を浸積層2内の中央付近に浸漬させ、各基板Wの主面が各洗浄液Lの流れる方向と平行となるように配置した。浸積層2内のホルダ50から上流側に20mm離れた位置には、太さ3mmのポール7を洗浄液Lの流れる方向と直交する方向に7mm間隔で25本並べて設けた。そして、洗浄中は、これらのポール7を洗浄液Lの流れる方向と直交する方向に±5mmの範囲で移動させながら、1秒周期で往復運動させた。なお、洗浄中は、浸積槽2の底部から洗浄液Lに200kHz、500Wの超音波振動を印加した。洗浄時間は2分間とし、洗浄後は基板Wをスピン乾燥させた。このような洗浄を1000枚の基板Wに対して行った。
Example 1
In Example 1, the substrate W was actually cleaned using the substrate cleaning apparatus 1 shown in FIGS. The immersion tank 2 has a length of about 300 mm, a depth of about 200 mm, and a height of about 200 mm. Pure water was used as the cleaning liquid L, and the laminar flow rate of the cleaning liquid L was 5 cm / second. The substrate W is a disk-shaped glass substrate having an outer diameter of 65 mm, an inner diameter of 20 mm, and a thickness of 0.8 mm. On the holder 50, 25 substrates W were arranged in parallel at intervals of 7 mm. Then, the holder 50 was immersed in the vicinity of the center in the immersion laminate 2 and arranged so that the main surface of each substrate W was parallel to the direction in which each cleaning liquid L flows. At a position 20 mm away from the holder 50 in the immersion layer 2, 25 poles 7 having a thickness of 3 mm were arranged side by side at intervals of 7 mm in a direction orthogonal to the direction in which the cleaning liquid L flows. During cleaning, these poles 7 were reciprocated at a cycle of 1 second while moving within a range of ± 5 mm in a direction orthogonal to the direction in which the cleaning liquid L flows. During the cleaning, ultrasonic vibration of 200 kHz and 500 W was applied to the cleaning liquid L from the bottom of the immersion tank 2. The cleaning time was 2 minutes, and after cleaning, the substrate W was spin-dried. Such cleaning was performed on 1000 substrates W.

そして、実施例1の各基板Wについて、レーザー光散乱式の表面検査機を用いて、その表面に残留する埃を調べた。その結果、洗浄した1000枚の基板Wから埃は検出されなかった。   And about each board | substrate W of Example 1, the dust which remains on the surface was investigated using the laser light scattering type surface inspection machine. As a result, no dust was detected from the 1000 washed substrates W.

(比較例1)
比較例1では、浸漬槽2内に乱流を発生させるポール7は設けなかった以外は、実施例1と同様に1000枚の基板Wに対して洗浄を行った。そして、比較例1の各基板Wについて、その表面に残留する埃を調べたところ、洗浄した1000枚の基板Wのうち5枚の基板Wから、大きさが1〜5μm程度の埃が検出された。
(Comparative Example 1)
In Comparative Example 1, 1000 substrates W were cleaned in the same manner as in Example 1 except that the pole 7 that generates turbulent flow in the immersion tank 2 was not provided. Then, when the dust remaining on the surface of each substrate W in Comparative Example 1 was examined, dust having a size of about 1 to 5 μm was detected from five of the 1000 substrates W that were cleaned. It was.

以上のように、本発明によれば、基板の表面に付着した塵埃などを効率良く除去すると共に、洗浄後にこれらが基板の表面に再付着することを防止した高度な基板洗浄を行うことが可能である。   As described above, according to the present invention, it is possible to efficiently remove dust and the like adhering to the surface of the substrate, and to perform advanced substrate cleaning that prevents them from reattaching to the surface of the substrate after cleaning. It is.

図1は、本発明を適用した基板洗浄装置の構成を示す断面図である。FIG. 1 is a cross-sectional view showing a configuration of a substrate cleaning apparatus to which the present invention is applied. 図2は、本発明を適用した基板洗浄装置の構成を示す平面図である。FIG. 2 is a plan view showing the configuration of the substrate cleaning apparatus to which the present invention is applied.

符号の説明Explanation of symbols

1…基板洗浄装置 2…浸漬槽 3…層流発生機構 4…乱流発生機構 5a…供給口 5b…排出口 6…仕切り壁 6a…貫通孔 7…ポール 8…リザーバータンク 9…ポンプ 10…フィルタ 50…ホルダ W…基板 L…洗浄液   DESCRIPTION OF SYMBOLS 1 ... Substrate cleaning apparatus 2 ... Immersion tank 3 ... Laminar flow generation mechanism 4 ... Turbulence generation mechanism 5a ... Supply port 5b ... Discharge port 6 ... Partition wall 6a ... Through-hole 7 ... Pole 8 ... Reservoir tank 9 ... Pump 10 ... Filter 50 ... Holder W ... Substrate L ... Cleaning liquid

Claims (12)

基板を保持したホルダを洗浄液に浸漬させる浸漬槽と、
前記浸漬槽内に洗浄液を層流の状態で水平方向に流す層流発生機構と、
前記層流の状態で流れる洗浄液の一部に乱流を発生させる乱流発生機構とを備え、
前記基板の主面が前記洗浄液の流れる方向と平行となるように前記浸漬槽内に前記ホルダが配置され、このホルダよりも上流側に前記乱流発生機構が配置されていることを特徴とする基板洗浄装置。
An immersion tank for immersing the holder holding the substrate in the cleaning liquid;
A laminar flow generating mechanism for flowing a cleaning solution in a laminar flow in the horizontal direction in the immersion tank;
A turbulent flow generating mechanism for generating turbulent flow in a part of the cleaning liquid flowing in the laminar flow state,
The holder is disposed in the immersion tank so that the main surface of the substrate is parallel to the direction in which the cleaning liquid flows, and the turbulent flow generation mechanism is disposed upstream of the holder. Substrate cleaning device.
前記乱流発生機構は、前記浸漬槽内の洗浄液に浸漬された状態で往復操作されるポールを有することを特徴とする請求項1に記載の基板洗浄装置。   The substrate cleaning apparatus according to claim 1, wherein the turbulent flow generation mechanism includes a pole that is reciprocated while being immersed in a cleaning liquid in the immersion tank. 前記ポールは、少なくとも前記洗浄液の流れる方向と交差する方向に往復操作されることを特徴とする請求項2に記載の基板洗浄装置。   The substrate cleaning apparatus according to claim 2, wherein the pole is reciprocated at least in a direction intersecting a direction in which the cleaning liquid flows. 前記ポールは、前記洗浄液の流れる方向と交差する方向に複数並んで配置されて、互いに同期して操作されることを特徴とする請求項2又は3に記載の基板洗浄装置。   4. The substrate cleaning apparatus according to claim 2, wherein a plurality of the poles are arranged side by side in a direction intersecting with a direction in which the cleaning liquid flows, and are operated in synchronization with each other. 前記ホルダには、前記基板が互いに平行な状態で複数並んで保持されることを特徴とする請求項1〜4の何れか一項に記載の基板洗浄装置。   5. The substrate cleaning apparatus according to claim 1, wherein a plurality of the substrates are held in parallel in the holder in a state parallel to each other. 前記基板は、磁気記録媒体用基板であることを特徴とする請求項1〜5の何れか一項に記載の基板洗浄装置。   The substrate cleaning apparatus according to claim 1, wherein the substrate is a magnetic recording medium substrate. 浸漬槽内に洗浄液を層流の状態で水平方向に流しながら、この浸漬槽内の洗浄液に基板を保持したホルダを浸漬させることによって、前記基板の洗浄を行う基板洗浄方法であって、
前記基板の主面が前記洗浄液の流れる方向と平行となるように前記浸漬槽内に前記ホルダを配置し、前記ホルダよりも上流側を流れる洗浄液の一部に乱流を発生させながら、前記基板の洗浄を行うことを特徴とする基板洗浄方法。
A substrate cleaning method for cleaning the substrate by immersing a holder holding the substrate in the cleaning liquid in the immersion tank while flowing the cleaning liquid horizontally in a laminar flow state in the immersion tank,
The substrate is disposed in the immersion tank so that the main surface of the substrate is parallel to the flow direction of the cleaning liquid, and turbulence is generated in a part of the cleaning liquid flowing upstream from the holder, while the substrate is A method for cleaning a substrate, comprising:
前記浸漬槽内の洗浄液に浸漬されたポールを往復操作することによって、前記洗浄液の一部に乱流を発生させることを特徴とする請求項7に記載の基板洗浄方法。   The substrate cleaning method according to claim 7, wherein a turbulent flow is generated in a part of the cleaning liquid by reciprocating a pole immersed in the cleaning liquid in the immersion tank. 前記ポールを、少なくとも前記洗浄液の流れる方向と交差する方向に往復操作することを特徴とする請求項8に記載の基板洗浄方法。   The substrate cleaning method according to claim 8, wherein the pole is reciprocated at least in a direction intersecting a direction in which the cleaning liquid flows. 前記ポールを、前記洗浄液の流れる方向と交差する方向に複数並べて配置して、互いに同期させて操作することを特徴とする請求項8又は9に記載の基板洗浄方法。   10. The substrate cleaning method according to claim 8, wherein a plurality of the poles are arranged side by side in a direction crossing a direction in which the cleaning liquid flows, and are operated in synchronization with each other. 前記ホルダに互いに平行な状態で複数並んで保持された基板に対して洗浄を行うことを特徴とする請求項7〜10の何れか一項に記載の基板洗浄方法。   The substrate cleaning method according to claim 7, wherein cleaning is performed on a plurality of substrates held side by side in parallel to the holder. 前記基板として、磁気記録媒体用基板を洗浄することを特徴とする請求項7〜11の何れか一項に記載の基板洗浄方法。   The substrate cleaning method according to claim 7, wherein a substrate for a magnetic recording medium is cleaned as the substrate.
JP2008275901A 2008-10-27 2008-10-27 Apparatus and method for cleaning substrate Pending JP2010099637A (en)

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013016215A (en) * 2011-06-30 2013-01-24 Konica Minolta Advanced Layers Inc Process for producing glass substrate for hdd, glass substrate for hdd, and magnetic recording medium for hdd
CN103959379A (en) * 2011-06-30 2014-07-30 Hoya株式会社 Production method for glass substrate for hdd, glass substrate for hdd, magnetic recording medium for hdd, and cleaning carrier used in production method for glass substrate for hdd
CN111167788A (en) * 2019-12-10 2020-05-19 何学苏 Ultrasonic cleaning device
CN111906077A (en) * 2020-06-29 2020-11-10 广州国显科技有限公司 Cleaning device
WO2023029203A1 (en) * 2021-09-02 2023-03-09 长鑫存储技术有限公司 Semiconductor structure cleaning device and cleaning method

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0631253A (en) * 1992-07-15 1994-02-08 Fuji Electric Co Ltd Method and device for washing disk-shaped object
JPH10144645A (en) * 1996-11-11 1998-05-29 Kaijo Corp Cleaning tank
JP2008159709A (en) * 2006-12-21 2008-07-10 Tokyo Electron Ltd Substrate-treating device, substrate treatment method, substrate treatment program, and program recording medium

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0631253A (en) * 1992-07-15 1994-02-08 Fuji Electric Co Ltd Method and device for washing disk-shaped object
JPH10144645A (en) * 1996-11-11 1998-05-29 Kaijo Corp Cleaning tank
JP2008159709A (en) * 2006-12-21 2008-07-10 Tokyo Electron Ltd Substrate-treating device, substrate treatment method, substrate treatment program, and program recording medium

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013016215A (en) * 2011-06-30 2013-01-24 Konica Minolta Advanced Layers Inc Process for producing glass substrate for hdd, glass substrate for hdd, and magnetic recording medium for hdd
CN103959379A (en) * 2011-06-30 2014-07-30 Hoya株式会社 Production method for glass substrate for hdd, glass substrate for hdd, magnetic recording medium for hdd, and cleaning carrier used in production method for glass substrate for hdd
CN103959379B (en) * 2011-06-30 2017-06-27 Hoya株式会社 The manufacture method and cleaning support of HDD glass substrates
CN111167788A (en) * 2019-12-10 2020-05-19 何学苏 Ultrasonic cleaning device
CN111906077A (en) * 2020-06-29 2020-11-10 广州国显科技有限公司 Cleaning device
CN111906077B (en) * 2020-06-29 2022-03-25 广州国显科技有限公司 Cleaning device
WO2023029203A1 (en) * 2021-09-02 2023-03-09 长鑫存储技术有限公司 Semiconductor structure cleaning device and cleaning method

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