JPS61229730A - General purpose type vacuum head for electronic parts - Google Patents

Abstract

PURPOSE:To give versatility among kinds of machines by piping each of blocks like a vacant box, said blocks formed by a number of orthogonally arranged minute holes at a spacing based on the minimum dimension of a part and by partitions for preventing vacuum leak and arranged over the holes. CONSTITUTION:Vacuum inputted through a vacuum inlet 1 is inputted by vacuum separation hoses 3 to some blocks like vacant boxes constituted by partition plates 7. An etching plate 8 has a drilling dimensional pitch 15 made smaller than the minimum dimension of an electronic part 10 and holes 14 are cut so as to have dimensions smaller than the drilling dimensional pitch. The position in which the electronic part 10 is placed is changed from a number of the orthogonally arranged minute holes 14 and absorption from any position becomes to be enabled even when the position is different among various kinds of machines, enabling to intend versatility among the absorbing heads of the various kinds of machines.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a general-purpose vacuum head for electronic components used when electronic components are also mounted all at once.

[Background of the invention]

When electronic components are to be mounted all at once on a printed circuit board, for example, ρ1, the electronic components are arranged in advance at predetermined relative positions, and then transferred all at once by a pachyme head and placed on the printed circuit board.

At this time, if there is a change in the model of electronic equipment made up of electronic components, the relative arrangement of the electronic components will also change, so it is necessary to make arrangements accordingly on the side of the vacuum head that transfers them all at once. Yes, and setup time is required.

As a method of shortening the time required for such setup, there is a basic board as shown in Japanese Patent Application Laid-Open No. 56-4300.
A method is known in which a dedicated control board is attached to the intersection (suction hole), and when the model is changed, the control board is simply replaced, thereby reducing setup time.

However, this method does not eliminate the setup time required for attaching and detaching a control board specific to each model, and does not take into account versatility between models.

FIG. 4 is a sectional view showing a conventional Paquiame head.

In the figure, 1 is a paquim intake, 2 is a vacuum intake mount, 11 is a suction nozzle holding plate, and 12 is a suction nozzle.

In FIG. 4, a structure corresponding to the above-mentioned basic plate is shown, and a structure corresponding to the dedicated control board is not shown, but the dedicated control board basically has holes corresponding to all the suction nozzles 12. G! This plate has holes only at locations corresponding to the required suction nozzles, depending on the arrangement of the electronic components to be mounted.

The setup time required to replace the dedicated control board was necessary. Note that if 11 is a dedicated control board, it goes without saying that this will need to be replaced.

[Purpose of the invention]

The present invention provides a system that allows immediate bulk transfer even if there is a change in one model, that is, even if the relative arrangement position of electronic components changes, without requiring special setup time. An object of the present invention is to provide a parka system head with versatility.

[Summary of the invention]

The Paquième head according to the present invention has a large number of microholes arranged orthogonally at intervals based on the minimum dimensions of the electronic component to which it is mounted, and is located on a thin plate whose surface is coated with a rubber coating to prevent misalignment. An empty box-like block is formed with a vacuum leak prevention partition plate, and a vacuum port is piped to each block, making it possible to accommodate changes in the mounting position of electronic components depending on the model. Embodiments Next, the present invention will be described in detail with reference to the drawings.

FIG. 1 is a sectional view showing one embodiment of the present invention, and FIG.
FIG. 3 is a perspective view showing a cross section along the a-al line in the figure, and FIG. 3 is a perspective view of an electronic component chip element to be sucked.

In these figures, vacuum inlet 1° Paquième inlet cradle 21 vacuum isolation hose 3° manifold 4. Pillar 5. Vacuum separation plate6. Vacuum partition plate7. Etching plate 8. A configuration consisting of an etching plate retainer 9 and an electronic component 10 are shown.

16 is a surface rubber coating for reliably suction-chucking electronic components. A vacuum source for sucking and holding electronic components is input from a vacuum pump through the Paquim intake port 1.

The input vacuum is transferred to the partition plate 7 by the vacuum separation hose 3.
It is input into several empty box-like blocks made up of.

For the etching plate 8, the hole dimension pitch 15 is determined to be P(W) for the jll small dimension 13 of the electronic component 10,
The dimension A of the hole 14 is processed to be A(P).

The mounting position of the electronic component 10 is changed through these multiple orthogonally arranged microholes, and even if the position differs between models, suction can be made from any position, and the suction head can be used in common between different models. .

However, in order to minimize vacuum leaks, the most important point is to form a large number of empty box-like blocks using partition plates. In addition, it is preferable to make the holes of the etching plate round based on the minimum dimensions of the electronic parts to be sucked in terms of density and processing, and it is more effective to prevent position scratches than applying a surface rubber coating.

According to this embodiment, there is no need to replace the suction nozzle holding plate 11 (which is regarded as a dedicated control plate) to which the suction nozzle 12 shown in FIG. 4 is attached every time the model is changed.

〔Effect of the invention〕

According to the present invention, it is possible to establish a general-purpose head that can reduce the setup time by eliminating the need for setup work for changing the suction head when changing the model of the finger-attached type.

Furthermore, it is possible to reduce the manufacturing costs incurred for each model. In order to prevent vacuum leaks, by forming an empty box-shaped block with a partition plate, individual vacuum can be achieved, regardless of the number of holes.
Adsorption can be stabilized.

[Brief explanation of the drawing]

Fig. 1 is a cross-sectional view showing an embodiment of the present invention, Fig. 2 is a perspective view showing a cross-section taken along line a-a' in Fig. 1, and Fig. 3 is a cross-sectional view showing an electronic component chip element to be sucked. The perspective view and FIG. 4 are cross-sectional views of a conventional vacuum head. Description of symbols 1... Vacuum intake port, 2... Frame, 3... Vacuum separation hose, 4... Manifold, 5... Support column, 6... Vacuum separation plate, 7...・Vacuum partition plate, 8...Etching plate, 9...
- Holding plate, 10...electronic component.

Claims (1)

[Claims] 1) In a vacuum head for suctioning electronic components, fine holes are orthogonally arranged at predetermined intervals on a plate-like member constituting the suction surface, and the suction surface on which the fine holes of the plate-like member are arranged is further It is divided into small sections, each section is connected to a vacuum source independently, and the micro holes and the dimensions of the sections are determined appropriately for the dimensions of the electronic components to be sucked, so that any arrangement can be made. A general-purpose vacuum head for electronic components that is capable of suctioning electronic components.