TWI708296B - Wire bonding device - Google Patents
Wire bonding device Download PDFInfo
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- TWI708296B TWI708296B TW108103520A TW108103520A TWI708296B TW I708296 B TWI708296 B TW I708296B TW 108103520 A TW108103520 A TW 108103520A TW 108103520 A TW108103520 A TW 108103520A TW I708296 B TWI708296 B TW I708296B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
- H01L2224/78302—Shape
- H01L2224/78305—Shape of other portions
- H01L2224/78307—Shape of other portions outside the capillary
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
- H01L2224/78308—Removable capillary
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78343—Means for applying energy, e.g. heating means by means of pressure by ultrasonic vibrations
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
本發明提供一種打線接合裝置,使將新的焊針安裝於打線接合裝置的作業自動化。打線接合裝置1包括:超音波焊頭7,具有可裝卸地保持焊針8的孔7h;焊針保持部11,可裝卸地保持供插入至孔7h的焊針8;致動器13,以將經焊針保持部11保持的焊針8插入至孔7h的方式,使焊針保持部11移動;及焊針引導部12,伴隨致動器13所致的焊針保持部11的移動而將焊針8引導至孔7h。The invention provides a wire bonding device, which automates the work of installing a new soldering needle on the wire bonding device. The wire bonding device 1 includes: an ultrasonic welding head 7 having a hole 7h for detachably holding a welding pin 8; a welding pin holding portion 11 detachably holding a welding pin 8 for insertion into the hole 7h; an actuator 13 to The solder pin holder 11 is moved by inserting the solder pin 8 held by the solder pin holder 11 into the hole 7h; and the solder pin guide portion 12 is accompanied by the movement of the solder pin holder 11 by the actuator 13 Guide the solder pin 8 to the hole 7h.
Description
本發明是有關於一種打線接合(wire bonding)裝置。 The present invention relates to a wire bonding device.
專利文獻1揭示一種打線接合裝置。打線接合裝置具有作為接合工具(bonding tool)的焊針(capillary)。打線接合裝置藉由使用該焊針對打線賦予熱或超音波振動等,而將打線連接於電極。 Patent Document 1 discloses a wire bonding device. The wire bonding device has a capillary as a bonding tool. The wire bonding device connects the wire to the electrode by applying heat or ultrasonic vibration to the wire using the welding.
[專利文獻1]日本專利特開2018-6731號公報 [Patent Document 1] Japanese Patent Laid-Open No. 2018-6731
於電子設備的製造工廠中,為了製造大量的電子設備而使多個製造裝置運作。若製造裝置之數量增加,則可使生產數增加。另一方面,製造裝置需要各種維護(maintenance)作業。於是,需要同製造裝置的數量的維護作業。因此,生產數的增加與維護作業的負荷處於相悖的關係。因此,若可不依賴於作業者的手而自動進行維護作業,則可減少維護作業的負荷。 In an electronic device manufacturing plant, multiple manufacturing devices are operated in order to manufacture a large number of electronic devices. If the number of manufacturing devices increases, the number of production can be increased. On the other hand, the manufacturing device requires various maintenance operations. Therefore, maintenance work of the same number of manufacturing devices is required. Therefore, the increase in the number of production and the load of maintenance work are in a contradictory relationship. Therefore, if the maintenance work can be performed automatically without relying on the hands of the operator, the load of the maintenance work can be reduced.
打線接合裝置具有作為所述維護作業之一的焊針更換 作業。因此,該技術領域中,期望焊針的更換作業的自動化,具體而言,期望在將已使用的焊針卸除的狀態下,將新的焊針安裝於打線接合裝置的作業的自動化。 The wire bonding device has a welding needle replacement as one of the maintenance tasks operation. Therefore, in this technical field, automation of the replacement work of solder pins is desired. Specifically, automation of the work of attaching a new solder pin to the wire bonding device in a state where the used solder pin is removed is desired.
鑒於所述背景,本發明的目的在於提供一種可實現將新的焊針安裝於打線接合裝置的作業的自動化的打線接合裝置。 In view of the above background, an object of the present invention is to provide a wire bonding device that can automate the work of mounting a new solder pin to the wire bonding device.
本發明的一形態的打線接合裝置包括:焊針保持部,可裝卸地保持焊針;致動器(actuator),以將經焊針保持部保持的焊針插入至接合工具的焊針保持孔的方式,使保持有焊針的焊針保持部沿著規定的方向移動;及焊針引導部,配置於焊針保持部與接合工具之間,伴隨焊針保持部的移動而將焊針引導至焊針保持孔,焊針保持部具有固定於致動器的焊針基底部、及以使焊針相對於焊針基底部的位置可相對移位的方式進行保持的可撓部。 A wire bonding device according to one aspect of the present invention includes: a solder pin holding portion that detachably holds the solder pin; and an actuator for inserting the solder pin held by the solder pin holding portion into the pin holding hole of the bonding tool In the method, the solder pin holder holding the solder pin is moved in a predetermined direction; and the solder pin guide is arranged between the solder pin holder and the bonding tool, and the solder pin is guided by the movement of the solder pin holder Up to the solder pin holding hole, the solder pin holding portion has a solder pin base fixed to the actuator, and a flexible portion that holds the solder pin relative to the position of the solder pin base relatively displaceable.
該打線接合裝置中,經焊針保持部保持的焊針一面經焊針引導部引導一面插入至焊針保持孔中。因此,即便焊針相對於焊針保持孔偏移,亦藉由焊針引導部來修正偏移。進而,焊針保持部中,相對於固定於致動器的焊針基底部,可撓部以可相對移位的方式保持焊針的位置。其結果,即便於除了焊針相對於焊針保持孔的偏移以外,焊針引導部相對於焊針保持孔偏移的情形時,亦能以使焊針追隨焊針引導部及焊針保持孔的方式,一面使焊針的姿勢變化一面插入。因此,可不依賴於作業者的手而將新的焊針自動安裝於打線接合裝置。 In this wire bonding device, the solder pin held by the solder pin holding portion is inserted into the solder pin holding hole while being guided by the solder pin guide portion. Therefore, even if the solder pin is shifted from the solder pin holding hole, the shift is corrected by the solder pin guide. Furthermore, in the solder pin holding portion, the flexible portion retains the position of the solder pin relative to the base of the solder pin fixed to the actuator. As a result, even when the solder pin guide is shifted from the solder pin holding hole in addition to the shift of the solder pin relative to the solder pin holding hole, the solder pin can be made to follow the solder pin guide and the solder pin holder. The method of hole inserts while changing the posture of the solder pin. Therefore, it is possible to automatically attach a new solder pin to the wire bonding device without relying on the operator's hand.
一形態的打線接合裝置中,亦可使致動器具有:基底部;及移動體,配置於基底部上,安裝有焊針保持部並使焊針保持部移動,且焊針引導部固定於基底部。根據該構成,可容易地維持藉由致動器而移動的焊針保持部與焊針引導部的相對位置關係。因此,可藉由焊針引導部可靠地將焊針安裝於接合工具。 In one form of wire bonding device, the actuator may also have: a base part; and a moving body, which is arranged on the base part, is equipped with a solder pin holder and moves the solder pin holder, and the solder pin guide is fixed to Basal part. According to this configuration, the relative positional relationship between the solder pin holding portion and the solder pin guide portion that are moved by the actuator can be easily maintained. Therefore, the solder pin can be reliably attached to the bonding tool by the solder pin guide.
一形態的打線接合裝置中,可撓部亦可具有:彈性部,一端部固定於焊針基底部;及限制部,設於彈性部的另一端部,限制焊針。根據該構成,可使彈性部以焊針基底部為基礎而彈性變形。而且,於彈性部的另一端部設有限制部,該限制部限制焊針。因此,焊針相對於焊針基底部的相對位置可藉由彈性部而移位。因此,可更可靠地將焊針安裝於接合工具。 In one form of the wire bonding device, the flexible part may also have: an elastic part, one end of which is fixed to the base of the welding pin; and a restricting part, which is provided at the other end of the elastic part to restrict the welding pin. According to this configuration, the elastic portion can be elastically deformed based on the base of the solder pin. Furthermore, a restricting portion is provided at the other end of the elastic portion, and the restricting portion restricts the solder pin. Therefore, the relative position of the welding pin with respect to the base of the welding pin can be shifted by the elastic portion. Therefore, the solder pin can be attached to the joining tool more reliably.
一形態的打線接合裝置中,限制部亦可與焊針的錐面進行線接觸。根據該構成,限制部可容許所保持的焊針的傾斜。因此,焊針的姿勢可更靈活地移位,故而可進一步將焊針可靠地安裝於接合工具。 In one form of wire bonding device, the restricting portion may also be in line contact with the tapered surface of the solder pin. According to this configuration, the restriction portion can tolerate the inclination of the held solder pin. Therefore, the posture of the soldering pin can be shifted more flexibly, so that the soldering pin can be further reliably mounted to the bonding tool.
一形態的打線接合裝置中,亦可使限制部為圓環(torus)狀的O形環,且彈性部為線圈彈簧。根據該構成,可利用簡易的構成來構成焊針保持部。 In one form of the wire bonding device, the restricting portion may be a torus-shaped O-ring, and the elastic portion may be a coil spring. According to this structure, the solder pin holding part can be comprised with a simple structure.
一形態的打線接合裝置中,亦可使焊針保持部具有:軟管,包含作為限制部的上端開口緣及作為彈性部的本體部;蓋,將軟管的下端封閉;及筒狀的管道,下端經蓋封閉,收納軟管,且管道的剛性高於軟管,於管道的內周面與軟管的外周面之間設 有間隙。根據該構成,可藉由軟管使焊針的姿勢移位。進而,管道存在於軟管的外側,故而可藉由管道將焊針的移位限制於容許範圍。因此,可將焊針可靠地安裝於接合工具。 In one form of wire bonding device, the welding needle holding part may also have: a hose including an upper end opening edge as a restricting part and a main body part as an elastic part; a cover to close the lower end of the hose; and a cylindrical pipe , The lower end is closed by a cover to accommodate the hose, and the rigidity of the pipe is higher than that of the hose. It is set between the inner circumference of the pipe and the outer circumference of the hose. There are gaps. According to this structure, the posture of the welding needle can be shifted by the hose. Furthermore, the pipe exists on the outside of the hose, so the displacement of the welding needle can be restricted to the allowable range by the pipe. Therefore, the solder pin can be reliably attached to the bonding tool.
另一形態的接合裝置包括:焊針保持部,可裝卸地保持焊針;致動器,以使經焊針保持部保持的焊針插入至接合工具的焊針保持孔的方式,使保持有焊針的焊針保持部沿著規定的方向移動;及焊針引導部,配置於焊針保持部與接合工具之間,伴隨焊針保持部的移動而將焊針引導至焊針保持孔,焊針引導部中,設有將焊針引導至焊針保持孔的引導孔,焊針引導部具有施力構件,該施力構件對插入至引導孔中的焊針提供朝向與引導孔的軸線交叉的方向的力。 Another form of joining device includes: a solder pin holding portion that detachably holds the solder pin; an actuator that inserts the solder pin held by the solder pin holding portion into the pin holding hole of the joining tool to hold the solder pin The solder pin holding portion of the solder pin moves in a predetermined direction; and the solder pin guide portion is arranged between the solder pin holding portion and the joining tool, and guides the solder pin to the solder pin holding hole along with the movement of the solder pin holder, The solder pin guide portion is provided with a guide hole for guiding the solder pin to the solder pin holding hole, and the solder pin guide portion has an urging member that provides an orientation to the solder pin inserted into the guide hole to cross the axis of the guide hole The force of the direction.
根據該構成,焊針一面由施力構件按壓於焊針引導部的壁面,一面朝向規定的方向而經引導。其結果,焊針可不傾斜而以穩定的狀態移動,故而可進一步將焊針可靠地導向接合工具的焊針保持孔。 According to this configuration, the welding pin is pressed against the wall surface of the welding pin guide by the urging member, and is guided in a predetermined direction while being directed. As a result, the welding needle can be moved in a stable state without tilting, so that the welding needle can be more reliably guided to the welding needle holding hole of the bonding tool.
另一形態的接合裝置中,亦可使引導孔包含沿著焊針的插入方向排列的第一孔部及第二孔部,且第一孔部為直徑朝向插入方向減小的錐孔,第二孔部與焊針保持孔同軸地配置,以沿著焊針保持孔的軸線的方式引導焊針。根據該構成,可將焊針更可靠地導向焊針保持孔。 In another form of joining device, the guide hole may include a first hole portion and a second hole portion arranged along the insertion direction of the solder pin, and the first hole portion is a tapered hole whose diameter decreases toward the insertion direction. The two holes are arranged coaxially with the solder pin holding hole, and the solder pin is guided along the axis of the solder pin holding hole. According to this structure, the solder pin can be guided to the solder pin holding hole more reliably.
另一形態的接合裝置中,亦可使焊針引導部包含形成有第一孔部的錐部及形成有第二孔部的引導部,且施力構件設於引 導部。根據該構成,可將焊針更可靠地導向焊針保持孔。 In another form of joining device, the solder needle guide may include a tapered portion formed with a first hole and a guide formed with a second hole, and the urging member may be provided on the guide Guide Department. According to this structure, the solder pin can be guided to the solder pin holding hole more reliably.
根據本發明,提供一種可實現將新的焊針安裝於打線接合裝置的作業的自動化的打線接合裝置。 According to the present invention, there is provided a wire bonding device capable of automating the work of mounting a new solder pin to the wire bonding device.
1:打線接合裝置 1: Wire bonding device
2:基底 2: base
3:接合部 3: Joint
4:搬送部 4: Transport Department
6:接合工具 6: Joining tool
7:超音波焊頭 7: Ultrasonic welding head
7A、8A、12A、16A、17A、18A、19A、42A、L53:軸線 7A, 8A, 12A, 16A, 17A, 18A, 19A, 42A, L53: axis
7h、52h:孔 7h, 52h: hole
8、8N、8U:焊針 8, 8N, 8U: solder pins
8a:錐面 8a: Cone
8b:焊針本體 8b: Solder pin body
8t、38a:外周面 8t, 38a: outer peripheral surface
9:焊針更換部 9: Soldering pin replacement part
11、11A:焊針保持部 11.11A: Solder pin holding part
12、12S:焊針引導部 12.12S: Solder pin guide
12a:上表面 12a: upper surface
12b:下表面 12b: lower surface
12c:前端面 12c: Front face
12e:開口部 12e: opening
12h:引導孔 12h: guide hole
12t:錐孔部(第一孔部) 12t: Taper hole part (first hole part)
12p:平行孔部(第二孔部) 12p: Parallel hole (second hole)
12K:徑向線 12K: radial
12W:壁面 12W: wall surface
13:致動器 13: Actuator
14:固持器 14: Holder
15:裝卸夾具 15: loading and unloading fixture
16:上插座 16: on socket
16a、18a:上端面 16a, 18a: upper end face
16b、18b:下端面 16b, 18b: lower end surface
16c:埋頭孔部 16c: Countersink
16d、18d:階差 16d, 18d: step difference
16e、18e:細徑部 16e, 18e: small diameter part
16h:貫通孔 16h: Through hole
17:線圈彈簧(彈性部) 17: Coil spring (elastic part)
18:下插座(焊針基底部) 18: Lower socket (bottom of solder pin base)
18f:粗徑部 18f: Large diameter part
19:O形環(限制部) 19: O-ring (restriction part)
20:夾具驅動部 20: Fixture drive
21:致動器基底(基底部) 21: Actuator base (base part)
21a、36a:主面 21a, 36a: main side
22A:線性馬達(第一力產生部) 22A: Linear motor (first force generating part)
22B:線性馬達(第二力產生部) 22B: Linear motor (second force generating part)
24:線性引導件 24: Linear guide
24a:平台 24a: Platform
26:滑架(移動體) 26: carriage (moving body)
27:控制裝置(控制部) 27: Control device (control part)
28A、28B:驅動軸 28A, 28B: drive shaft
29A、29B:超音波元件 29A, 29B: Ultrasonic components
31、32:引導件 31, 32: guide
33:前圓盤 33: front disc
34:加壓圓盤 34: Pressurized disc
34b:背面 34b: back
36:後圓盤 36: rear disc
37、38:軸體 37, 38: shaft
39:焊針儲存部 39: Solder pin storage
41:焊針回收部 41: Soldering Needle Recycling Department
42:管道 42: pipe
42a、43a:上端 42a, 43a: upper end
43:軟管 43: hose
44:蓋 44: cover
51:錐部 51: Cone
52:平行引導部 52: Parallel guide
53:線圈彈簧 53: coil spring
C1、C2、P1、P2:接觸部 C1, C2, P1, P2: contact part
CL:接觸線 CL: contact line
E1、E2、E3、E4、E5、E6、E7、E8、E9、E10、E11、E12、E13:電壓 E1, E2, E3, E4, E5, E6, E7, E8, E9, E10, E11, E12, E13: Voltage
E2a、E2b、E3a、E3b:符號 E2a, E2b, E3a, E3b: symbols
G1、G2:間隙 G1, G2: gap
F1:力 F1: Force
F2:反作用力 F2: Reaction force
M1:距離 M1: distance
P12、P53:點 P12, P53: point
S:區域 S: area
圖1為表示實施形態的打線接合裝置的立體圖。 Fig. 1 is a perspective view showing the wire bonding device of the embodiment.
圖2為將圖1所示的打線接合裝置具有的焊針更換部放大表示的立體圖。 Fig. 2 is an enlarged perspective view showing a solder pin replacement part included in the wire bonding device shown in Fig. 1.
圖3為將焊針保持部的一部分剖視表示的立體圖。 Fig. 3 is a perspective view showing a part of a solder pin holding portion in cross section.
圖4(a)部~圖4(c)部為說明焊針保持部的動作的圖。 Fig. 4(a)-Fig. 4(c) are diagrams explaining the operation of the solder pin holding portion.
圖5為將焊針引導部的一部分剖視表示的立體圖。 Fig. 5 is a perspective view showing a part of the solder pin guide in cross section.
圖6(a)部及圖6(b)部為表示由焊針保持部及焊針引導部發揮的焊針的引導功能的圖。 Fig. 6(a) and Fig. 6(b) are diagrams showing the pin guide function performed by the pin holder and the pin guide.
圖7(a)部~圖7(c)部為表示由焊針保持部及焊針引導部發揮的焊針的另一引導功能的圖。 Fig. 7 (a)-Fig. 7 (c) are diagrams showing another guiding function of the solder pin by the solder pin holder and the solder pin guide.
圖8為表示圖2所示的焊針更換部具有的致動器的要部的平面圖。 Fig. 8 is a plan view showing a main part of an actuator included in the solder pin replacement part shown in Fig. 2.
圖9(a)部~圖9(c)部為說明致動器的動作原理的圖。 Fig. 9(a) to Fig. 9(c) are diagrams illustrating the operating principle of the actuator.
圖10(a)部~圖10(c)部為說明致動器的具體控制的圖。 Fig. 10(a) to Fig. 10(c) are diagrams illustrating specific control of the actuator.
圖11(a)部及圖11(b)部為說明致動器的具體控制的圖。 Fig. 11(a) and Fig. 11(b) are diagrams illustrating specific control of the actuator.
圖12(a)部及圖12(b)部為表示焊針更換部的主要動作的 圖。 Figure 12(a) and Figure 12(b) show the main operations of the solder pin replacement part Figure.
圖13(a)部及圖13(b)部為表示繼圖12(a)部及圖12(b)部之後的焊針更換部的主要動作的圖。 Fig. 13 (a) and Fig. 13 (b) are diagrams showing main operations of the solder pin replacement part following Fig. 12 (a) and Fig. 12 (b).
圖14(a)部及圖14(b)部為表示繼圖13(a)部及圖13(b)部之後的焊針更換部的主要動作的圖。 Figs. 14(a) and 14(b) are diagrams showing main operations of the solder pin replacement part following Figs. 13(a) and 13(b).
圖15(a)部及圖15(b)部為表示繼圖14(a)部及圖14(b)部之後的焊針更換部的主要動作的圖。 Fig. 15 (a) and Fig. 15 (b) are diagrams showing the main operation of the solder pin replacement part following Fig. 14 (a) and Fig. 14 (b).
圖16為表示變形例的焊針保持部的剖面的立體圖。 Fig. 16 is a perspective view showing a cross section of a solder pin holding portion of a modification.
圖17為表示另一變形例的焊針引導部的立體圖。 Fig. 17 is a perspective view showing a solder pin guide of another modification.
圖18為圖17所示的焊針引導部的正面圖。 Fig. 18 is a front view of the solder pin guide shown in Fig. 17.
圖19為圖17所示的焊針引導部的平面圖。 Fig. 19 is a plan view of the solder pin guide shown in Fig. 17.
以下,一方面參照隨附圖式一方面對用以實施本發明的形態進行詳細說明。圖式的說明中對相同部件標註相同符號,省略重覆說明。 Hereinafter, the mode for implementing the present invention will be described in detail with reference to the accompanying drawings. In the description of the drawings, the same components are denoted by the same symbols, and repeated descriptions are omitted.
圖1所示的打線接合裝置1例如使用細徑的金屬打線將印刷基板等的電極、與設於該印刷基板的半導體元件的電極加以電性連接。打線接合裝置1對打線提供熱、超音波或壓力而將打線連接於電極。打線接合裝置1具有基底2、用以進行所述連接作業的接合部3、及將作為被處理零件的印刷基板等搬送至接合區域的搬送部4。
The wire bonding apparatus 1 shown in FIG. 1 uses, for example, a thin metal wire to electrically connect electrodes of a printed circuit board or the like and electrodes of a semiconductor element provided on the printed circuit board. The wire bonding device 1 applies heat, ultrasonic waves or pressure to the wire to connect the wire to the electrode. The wire bonding apparatus 1 has a
接合部3含有接合工具6,於接合工具6的前端設有超
音波焊頭7。於該超音波焊頭7的前端,可裝卸地設有用以對打線提供熱、超音波或壓力的焊針8。
The joining
以下的說明中,將超音波焊頭7延伸的方向設為X軸,將由搬送部4搬送印刷基板的方向設為Y軸(第二方向),將焊針8進行接合動作時移動的方向(Z軸方向,第一方向)設為Z軸。
In the following description, the direction in which the
焊針8為定期需要更換的零件。因此,打線接合裝置1具有不經由作業者的操作而自動更換焊針8的焊針更換部9。
The
焊針更換部9將安裝於超音波焊頭7的焊針8回收,並且對超音波焊頭7安裝焊針8。即,所謂焊針8的更換作業,包括回收焊針8的作業及安裝焊針8的作業。該焊針8的更換作業於滿足預先設定的條件的情形時,自動實施。例如,該條件亦可設為接合作業的次數。即,亦可於每當實施規定次數的接合作業時,進行更換焊針8的作業。
The solder
如圖2所示,焊針更換部9具有焊針保持部11、焊針引導部12及致動器13作為主要的構成部件。另外,具有裝卸夾具15及驅動裝卸夾具15的夾具驅動部20作為附加的構成部件。
As shown in FIG. 2, the solder
<焊針保持部> <Solder pin holding part>
焊針保持部11保持焊針8。焊針保持部11經由固持器14而安裝於致動器13。焊針保持部11呈於Z軸方向上延伸的圓柱狀。焊針保持部11的下端保持於固持器14。於焊針保持部11的上端,可裝卸地插入焊針8。
The
如圖3所示,焊針保持部11具有上插座16、線圈彈簧
17(彈性部)、下插座18(焊針基底部)及O形環19(限制部)作為主要的構成部件。上插座16、線圈彈簧17及下插座18配置於共同的軸線上。具體而言,自上而下依次以上插座16、線圈彈簧17及下插座18的順序配置。
As shown in Figure 3, the
上插座16呈大致圓筒狀,具有自上端面16a到達下端面16b的貫通孔16h。上插座16保持焊針8的錐面8a,故而貫通孔16h的內徑對應於焊針8的錐面8a的外徑。例如,貫通孔16h的內徑小於焊針本體8b的外徑。另外,於貫通孔16h的上端面16a側,設有用於O形環19的埋頭孔部16c。埋頭孔部16c具有可收納O形環19的尺寸。即,對於埋頭孔部16c而言,其深度與O形環19的高度為相同程度,其內徑與O形環19的外徑為相同程度。
The
O形環19呈所謂圓環狀的形狀。O形環19與焊針8的錐面8a直接接觸。即,於焊針保持部11中,O形環19保持焊針8。該保持是藉由形成於O形環19的表面的黏著層而達成。O形環19的內徑設為與貫通孔16h的內徑大致相同程度,供焊針8的錐面8a插入。
The O-
進而,上插座16具有設於外周面的階差16d,故而外徑的大小於上端面16a側與下端面16b側不同。具體而言,下端面16b側的外徑略小於上端面16a側的外徑。於該下端面16b側的細徑部16e,嵌入有線圈彈簧17。
Furthermore, the
下插座18呈大致圓筒狀。下插座18的上端面18a面向
上插座16的下端面16b。下插座18具有與上插座16相同的外形形狀。即,下插座18亦於其外周面設有階差18d。與上插座16相反,下插座18將上端面18a側設為細徑部18e。於該上端面18a側的細徑部18e,亦嵌入有線圈彈簧17。下插座18的下端面18b側的粗徑部18f是由固持器14所夾持。
The
線圈彈簧17為壓縮彈簧。對於線圈彈簧17,將其上端側嵌入至上插座16的細徑部16e,將其下端側插入至下插座18的細徑部18e。該些上插座16與線圈彈簧17構成可撓部10。因此,上插座16與下插座18藉由線圈彈簧17而連結。而且,線圈彈簧17於軸線17A的方向及與軸線17A交叉的方向上具有彈性。其結果,上插座16可變更相對於下插座18的相對位置。
The
具有所述構成的焊針保持部11具有圖4(a)部~圖4(c)部所示的保持態樣。圖4(a)部表示初期態樣的焊針保持部11。圖4(b)部表示第一變形態樣的焊針保持部11。圖4(c)部表示第二變形態樣的焊針保持部11。
The solder
如圖4(a)部所示,第一保持態樣的焊針保持部11中,上插座16及下插座18的軸線16A、18A重合。進而,焊針8的軸線8A亦與該軸線16A、18A重合。
As shown in part (a) of FIG. 4, in the
如圖4(b)部所示,第二保持態樣的焊針保持部11中,上插座16及下插座18的軸線16A、18A不重合。具體而言,相對於保持於固持器14而維持其位置的下插座18,上插座16於X軸及Y軸的方向上移動。於該狀態下,上插座16的軸線16A相
對於下插座18的軸線18A而平行。
As shown in part (b) of FIG. 4, in the
如圖4(c)部所示,第三變形態樣的焊針保持部11中,上插座16及下插座18的軸線16A、18A重合。即,該等的構成與第一保持態樣相同。另一方面,焊針8的軸線8A相對於上插座16的軸線16A而傾斜。O形環19具有圓環的形狀,故而供焊針8的錐面8a插入的內周面為曲面。例如,平行於Z軸的剖面中的O形環19的剖面形狀為圓形。於是,若將於O形環19中插入有錐面8a的狀態剖視,則O形環19與錐面8a以兩個接觸部C1、C2接觸。即,O形環19與焊針8為於環狀的接觸線CL(參照圖3)上接觸的線接觸。根據此種接觸狀態,容許焊針8相對於O形環19的軸線19A傾斜。
As shown in part (c) of FIG. 4, in the solder
<焊針引導部> <Solder pin guide>
再次如圖2所示,焊針引導部12於將焊針8插入至超音波焊頭7的孔7h(焊針保持孔)中時,引導焊針8。焊針引導部12設於致動器13。因此,焊針引導部12保持與構成致動器13的零件的相對位置關係。焊針引導部12呈從致動器13向超音波焊頭7延伸的單臂梁狀。
As shown in FIG. 2 again, the
圖5為將焊針引導部12的主要部分剖視的立體圖。如圖5所示,焊針引導部12具有設於其自由端部的引導孔12h。引導孔12h接受焊針8的焊針本體8b,將焊針8導向超音波焊頭7的孔7h。引導孔12h為自焊針引導部12的上表面12a到達下表面12b的貫通孔。再者,引導孔12h於焊針引導部12的前端面12c
亦開口。即,引導孔12h可從下表面12b及前端面12c接受焊針8。
FIG. 5 is a perspective view of the main part of the
引導孔12h包含錐孔部12t及平行孔部12p。錐孔部12t的下端於下表面12b開口。平行孔部12p的上端於上表面12a開口。下表面12b中的錐孔部12t的內徑大於上表面12a中的平行孔部12p的內徑。該內徑大於焊針8的上端的外徑。即,引導孔12h的內徑自下表面12b向上表面12a逐漸減小,於將錐孔部12t與平行孔部12p連結的位置成為內徑的最小值。該內徑與焊針8的上端的外徑大致相同。而且,於平行孔部12p中,其內徑一定。
The
圖6(a)部及圖6(b)部表示藉由焊針引導部12引導焊針8的狀況。於圖6(a)部所示的狀態下,超音波焊頭7的孔7h的軸線7A、與焊針引導部12的引導孔12h的軸線12A重合。另一方面,保持於焊針保持部11的焊針8的軸線8A相對於軸線7A、12A而於X軸方向上平行地偏移。
Part (a) of FIG. 6 and part (b) of FIG. 6 show a situation in which the
使焊針保持部11自圖6(a)部所示的狀態於Z軸方向上移動。於是,如圖6(b)部所示,首先焊針8的上端接觸錐孔部12t的壁面。若進一步使焊針保持部11向上移動,則焊針8沿著壁面移動。該移動除了向上(Z軸方向)的成分以外,亦包含水平方向(X軸方向)的成分。焊針保持部11可藉由線圈彈簧17而使上插座16相對於下插座18移動。即,若使下插座18向上移動,則上插座16一面向上移動,一面藉由線圈彈簧17而亦向水平方向移動。
The
根據該移動,焊針8的軸線8A逐漸接近孔7h的軸線
7A。而且,若焊針8的上端到達平行孔部12p,則焊針8的軸線8A與孔7h的軸線7A重合。因此,將焊針8插入至超音波焊頭7的孔7h中。
According to this movement, the
圖6(a)部所示的例中,超音波焊頭7與焊針引導部12的位置關係為理想狀態。另一方面,圖7(a)部所示的例中,相對於焊針引導部12的軸線12A,超音波焊頭7的孔7h的軸線7A傾斜。
In the example shown in part (a) of FIG. 6, the positional relationship between the
對此種狀態下插入焊針8的動作進行說明。如圖7(b)部所示,相對於孔7h的軸線7A,焊針8的軸線8A相對傾斜。因此,焊針8的上端與孔7h的壁面接觸,故而無法將焊針8更多地向孔7h中插入。為了進一步對孔7h插入焊針8,需要相對於孔7h的軸線7A使焊針8的軸線8A平行,且使軸線8A與軸線7A重合。
The operation of inserting the
如上所述,焊針保持部11中,可使上插座16相對於下插座18偏移,進而焊針8可相對於上插座16的軸線16A而傾斜。根據該些作用,如圖7(c)部所示,隨著使焊針保持部11上升,焊針8的軸線8A可逐漸接近孔7h的軸線7A,最終插入至孔7h中。即,焊針保持部11靈活地保持焊針8,故而可吸收焊針8與焊針引導部12的偏移、及焊針8與超音波焊頭7的孔7h的偏移。因此,根據焊針保持部11及焊針引導部12,能可靠地安裝焊針8。
As described above, in the solder
<致動器> <Actuator>
致動器13使成為更換對象的焊針8或新的焊針8移動,並且
將焊針8保持於規定的位置及姿勢。致動器13可進行沿著規定的並進軸(Z軸)方向的往返移動。本實施形態中,並進軸沿著鉛垂方向(Z軸)。因此,致動器13使焊針8沿著鉛垂方向上下移動。進而,致動器13可進行繞旋轉軸(X軸)的旋轉。本實施形態中,旋轉軸與鉛垂方向(Z軸)正交。即,旋轉軸沿著水平方向(X軸)。因此,致動器13使焊針8繞水平方向旋轉。
The
致動器13具有致動器基底21(基底部)、一對線性馬達22A、22B(第一力產生部、第二力產生部)、線性引導件24、滑架26(移動體)及控制裝置27(控制部,參照圖1等)。
The
致動器基底21呈平板狀,具有主面21a。主面21a的法線方向沿著水平方向(X軸方向)。於主面21a上配置有線性馬達22A、22B、線性引導件24及滑架26。
The
線性馬達22A使滑架26移動。線性馬達22A為以所謂慣性衝擊(impact drive)方式為原理的超音波馬達。線性馬達22A具有驅動軸28A及超音波元件29A(超音波產生部)。驅動軸28A為金屬製的圓棒,以其軸線相對於致動器基底21的主面21a平行的方式配置。滑架26沿著該驅動軸28A移動,故而驅動軸28A的長度決定滑架26的移動範圍。驅動軸28A的下端固定於超音波元件29A。驅動軸28A的上端藉由自致動器基底21的主面21a突出的引導部31而支持。驅動軸28A的上端可相對於該引導部31而固定,亦可僅接觸而不固定。即,驅動軸28A的下端為固定端,上端為固定端或自由端。
The
於超音波元件29A對驅動軸28A提供超音波振動。具體而言,經提供有超音波振動的驅動軸28A沿著Z軸稍許往返移動。超音波元件29A例如亦可採用作為壓電元件的壓電式(piezo)元件。壓電式元件根據所施加的電壓而變形。因此,壓電式元件若被賦予高頻電壓,則根據其頻率及電壓的大小而反覆變形,產生超音波振動。超音波元件29A固定於自致動器基底21突出的引導件32。
The
於超音波元件29A上電性連接有控制裝置27,受到控制裝置27產生的驅動電壓。控制裝置27控制對超音波元件29A提供的交流電壓的頻率及振幅。
A
線性馬達22B的單體構成與線性馬達22A相同。線性馬達22B於與Z軸交叉的Y軸方向上分離地配置。即,線性馬達22B的驅動軸28B相對於線性馬達22A的驅動軸28A而平行。另外,線性馬達22B的上端配置於與線性馬達22A的上端相同的高度。同樣地,線性馬達22B的下端配置於與線性馬達22A的下端相同的高度。
The single structure of the
滑架26為藉由線性馬達22A、22B而平移及旋轉的移動體。滑架26呈圓盤狀,架設於線性馬達22A、22B之間。於致動器基底21與滑架26之間,設有於Z軸方向上引導滑架26的線性引導件24。滑架26是由該線性引導件24於Z軸方向上引導。再者,線性引導件24限制滑架26的移動方向,不產生Z軸方向上的驅動力。
The
滑架26具有前圓盤33、加壓圓盤34及後圓盤36。該些圓盤具有彼此相同的外徑,沿著共同的軸線積層。於前圓盤33與加壓圓盤34之間夾入有軸體37。該軸體37的外徑小於前圓盤33及加壓圓盤34的外徑。因此,於前圓盤33的外周部與加壓圓盤34的外周部之間形成有間隙。同樣地,於後圓盤36與加壓圓盤34之間亦夾入有軸體38。該軸體38的外徑亦小於後圓盤36及加壓圓盤34的外徑。因此,於後圓盤36的外周部與加壓圓盤34的外周部之間亦形成有間隙。
The
後圓盤36連結於線性引導件24的平台24a。此處,後圓盤36相對於平台24a可旋轉地連結。另一方面,加壓圓盤34及前圓盤33機械固定於後圓盤36,故而加壓圓盤34及前圓盤33不相對於後圓盤36而旋轉。因此,包含前圓盤33、加壓圓盤34及後圓盤36的滑架26總體相對於線性引導件24的平台24a而可旋轉。
The
如圖8所示,於加壓圓盤34與後圓盤36的間隙G1中夾入有驅動軸28A、28B。具體而言,一對驅動軸28A、28B以隔著滑架26的重心的方式配置。進而,驅動軸28A、28B與加壓圓盤34的背面34b及後圓盤36的主面36a接觸。再者,驅動軸28A、28B不與軸體38的外周面38a接觸。即,間隙G1小於加壓圓盤34及後圓盤36的外徑,大於軸體38的厚度。另外,軸體38的外徑與後圓盤36的外徑之差量大於驅動軸28A、28B的外徑。同樣地,軸體37的外徑與加壓圓盤34的外徑之差量大於驅動軸28A、
28B的外徑。
As shown in FIG. 8, the
此處,間隙G1的間隔略小於驅動軸28A、28B的外徑。由於在前圓盤33與加壓圓盤34之間形成有間隙G2,故而於加壓圓盤34與後圓盤36之間配置有驅動軸28A、28B時,加壓圓盤34稍向前圓盤33側撓曲。該撓曲產生將驅動軸28A、28B按壓於後圓盤36的力。
Here, the interval of the gap G1 is slightly smaller than the outer diameters of the
以下,一方面參照圖9(a)部~圖9(c)部一方面對致動器13的動作原理進行說明。圖9(a)部、圖9(b)部及圖9(c)部為說明致動器13的動作原理的圖。為了方便說明,於圖9(a)部~圖9(c)部中,表示其中一個線性馬達22A及滑架26,省略另一個線性馬達22B等的圖示。
Hereinafter, the operation principle of the
圖9(a)部表示保持滑架26的位置的態樣。如上所述,對於滑架26而言,於加壓圓盤34與後圓盤36之間夾入有驅動軸28A,藉由該夾入所致的加壓而維持滑架26的位置。更詳細而言,滑架26藉由以加壓為垂直阻力的摩擦阻力而維持其位置。此時,控制裝置27不對超音波元件29A提供電壓(電壓值零,參照電壓E1)。或者,控制裝置27亦可對超音波元件29A提供具有規定電壓值的直流電流。
Part (a) of FIG. 9 shows how the position of the
如上所述,滑架26藉由與驅動軸28A之間的摩擦阻力而維持其位置。此處,於使驅動軸28A移動時,可能產生滑架26伴隨驅動軸28A而移動的態樣與滑架26不伴隨驅動軸28A而藉由其慣性繼續維持位置的態樣。關於該些態樣,根據使驅動軸28A
移動的速度,即超音波振動的頻率而可決定成為哪一態樣。例如,於為相對較低的頻率(15kHz~30kHz)時,滑架26伴隨驅動軸28A而移動。例如,於為相對較高的頻率(100kHz~150kHz)時,滑架26不伴隨驅動軸28A而維持位置。
As described above, the
例如,如圖9(b)部所示,於使驅動軸28A向上(正方向)移動時,滑架26亦伴隨驅動軸28A的移動。即,驅動軸28A與滑架26的相對位置關係不變化。而且,於使驅動軸28A向下(負方向)移動時,使滑架26不伴隨驅動軸28A的向下方的移動。即,驅動軸28A與滑架26的相對位置關係變化。若重覆該些動作,則滑架26逐漸向上方移動。即,藉由使驅動軸28A向上移動的電壓(電壓E2中的符號E2a)的週期長於使驅動軸28A向下移動的電壓的週期(電壓E2中的符號E2b),可使滑架26向上方移動。
For example, as shown in part (b) of FIG. 9, when the
反之,如圖9(c)部所示,於使驅動軸28A向下移動時,滑架26亦伴隨驅動軸28A的移動。即,驅動軸28A與滑架26的相對位置關係不變化。而且,於使驅動軸28A向上移動時,使滑架26不伴隨驅動軸28A的向上方的移動。即,驅動軸28A與滑架26的相對位置關係變化。若重覆該些動作,則滑架26逐漸向下方移動。即,藉由使驅動軸28A向上移動的電壓(電壓E3中的符號E3a)的週期短於使驅動軸28A向下移動的電壓的週期(電壓E3中的符號E3b),可使滑架26向下方移動。
Conversely, as shown in part (c) of FIG. 9, when the
再者,於使滑架26向下移動的情形時,亦可除了所述
控制以外,使滑架26不追隨驅動軸28A的上下移動兩者。即,表面上,於滑架26與驅動軸28A之間摩擦阻力小於作用於滑架26的重力,看起來滑架26落下。於該態樣中,作為使滑架26向下移動的力,利用作用於滑架26的重力。
Furthermore, when the
一方面參照圖10(a)部~圖10(c)部以及圖11(a)部及圖11(b)部,一方面對致動器13的具體動作進行說明。
On the one hand, referring to Fig. 10(a) to Fig. 10(c) and Fig. 11(a) and Fig. 11(b), on the other hand, the specific operation of the
圖10(a)部表示維持滑架26的位置的動作。如上所述,於維持滑架26的位置的情形時,控制裝置27對各超音波元件29A、29B提供一定的電壓(參照圖10(a)部中的電壓E4、E5)。
Part (a) of FIG. 10 shows the operation of maintaining the position of the
圖10(b)部表示使滑架26向上移動的動作。此時,控制裝置27對其中一個超音波元件29A,提供使驅動軸28A向上移動的電壓的週期長於使驅動軸28A向下移動的電壓的週期的交流電壓(參照圖10(b)部中的電壓E6)。同樣地,控制裝置27對另一個超音波元件29B,亦提供使驅動軸28B向上移動的電壓的週期長於使驅動軸28B向下移動的電壓的週期的交流電壓(參照圖10(b)部中的電壓E7)。即,控制裝置27對兩個超音波元件29A、29B提供相同的交流電壓。而且,控制裝置27令使其中一個驅動軸28A向上移動的時序與使另一個驅動軸28B向上移動的時序一致。即,控制裝置27將對其中一個超音波元件29A提供的電壓的相位與對另一個超音波元件29B提供的電壓的相位彼此設為相同相位的關係。於是,將其中一個驅動軸28A按壓於加壓圓盤34及後圓盤36的接觸部P1與將另一個驅動軸28B按壓於加壓
圓盤34及後圓盤36的接觸部P2以相同的距離逐漸向上方移動。其結果,接觸部P1、P2保持平行狀態而向上方移動。即,滑架26不繞重心旋轉,而向上平移。
The part (b) of FIG. 10 shows the operation of moving the
圖10(c)部表示使滑架26向下移動的動作。此時,控制裝置27對其中一個超音波元件29A,提供使驅動軸28A向上移動的電壓的週期短於使驅動軸28A向下移動的電壓的週期的交流電壓(參照圖10(c)部中的電壓E8)。同樣地,控制裝置27對另一個超音波元件29B,亦提供使驅動軸28B向上移動的電壓的週期短於使驅動軸28B向下移動的電壓的週期的交流電壓(參照圖10(c)部中的電壓E9)。於是,將其中一個驅動軸28A按壓於加壓圓盤34及後圓盤36的接觸部P1與將另一個驅動軸28B按壓於加壓圓盤34及後圓盤36的接觸部P2以相同的距離逐漸向下方移動。其結果,接觸部P1、P2保持平行狀態而向下方移動。即,滑架26不繞重心旋轉,而向下平移。
The part (c) of FIG. 10 shows the action of moving the
根據所述控制,於使滑架26向下方移動時,於滑架26與驅動軸28A、28B之間摩擦阻力發揮作用,各自的相對位置不改變。因此,滑架26亦不繞重心旋轉。其結果,例如即便於因保持於滑架26的焊針8的姿勢而產生使滑架26旋轉般的轉矩的情形時,亦可抑制滑架26的旋轉,並且使滑架26向下移動。
According to the above-mentioned control, when the
再者,於使滑架26向上及向下移動的平移時,亦可利用一個線性馬達22A來實現。實施形態的致動器13具有兩個線性馬達22A、22B,故而與具有一個線性馬達22A的構成相比可提高
推進力。
Furthermore, a
圖11(a)部表示使滑架26向順時針方向旋轉的動作。此時,控制裝置27對其中一個超音波元件29A,提供使驅動軸28A向上移動的電壓的週期短於使驅動軸28A向下移動的電壓的週期的交流電壓(參照圖11(a)部中的電壓E10)。另一方面,控制裝置27對另一個超音波元件29B,提供使驅動軸28B向上移動的電壓的週期長於使驅動軸28B向下移動的電壓的週期的交流電壓(參照圖11(a)部中的電壓E11)。即,控制裝置27使對超音波元件29A提供的電壓與對超音波元件29B提供的電壓互不相同。而且,控制裝置27令使其中一個驅動軸28A向上移動的時序與使另一個驅動軸28B向下方移動的時序一致。即,控制裝置27將對其中一個超音波元件29A提供的電壓的相位與對另一個超音波元件29B提供的電壓的相位彼此設為相反相位的關係。於是,將其中一個驅動軸28A按壓於加壓圓盤34及後圓盤36的接觸部P1向下移動,將另一個驅動軸28B按壓於加壓圓盤34及後圓盤36的接觸部P2向上移動。即,接觸部P1、P2彼此向相反方向移動。若該些接觸部的移動量一致,則接觸部P1、P2保持Z軸方向的位置而向順時針方向旋轉。
Part (a) of FIG. 11 shows the operation of rotating the
圖11(b)部表示使滑架26向逆時針方向旋轉的動作。此時,控制裝置27對其中一個超音波元件29A,提供使驅動軸28A向上移動的電壓的週期長於使驅動軸28A向下移動的電壓的週期的交流電壓(參照圖11(b)部中的電壓E12參照)。另一方面,
控制裝置27對另一個超音波元件29B,提供使驅動軸28B向上移動的電壓的週期短於使驅動軸28B向下移動的電壓的週期的交流電壓(參照圖11(b)部中的電壓E13)。於是,將其中一個驅動軸28A按壓於加壓圓盤34及後圓盤36的接觸部P1向上移動,將另一個驅動軸28B按壓於加壓圓盤34及後圓盤36的接觸部P2向下移動。即,接觸部P1、P2彼此向相反方向移動。若該些接觸部的移動量一致,則接觸部P1、P2保持Z軸方向的位置而向逆時針方向旋轉。
The part (b) of FIG. 11 shows the operation of rotating the
<更換動作> <Replacement action>
繼而,對藉由所述焊針更換部9進行的焊針更換動作進行說明。
Next, the solder pin replacement operation performed by the solder
圖12(a)部表示即將更換安裝於超音波焊頭7的焊針8U之前的狀態。焊針更換部9除了所述焊針保持部11、焊針引導部12及致動器13以外,具有焊針儲存部(capillary stocker)39及焊針回收部41作為附加的構成部件。焊針儲存部39收納多個更換用的焊針8N。另外,焊針回收部41收納已使用的焊針8U。
Part (a) of FIG. 12 shows a state just before the
圖12(a)部所示的狀態例如為藉由安裝於超音波焊頭7的焊針8U進行打線接合作業的狀態。因此,焊針更換部9亦可退避至不妨礙該打線接合作業的位置。
The state shown in part (a) of FIG. 12 is, for example, a state where the wire bonding operation is performed by the solder pins 8U attached to the
圖12(b)部表示更換動作中的第一步驟的狀態。首先,焊針更換部9藉由控制裝置27使滑架26向順時針方向旋轉。該旋轉對應於圖11(a)部所示的動作。藉由該旋轉,原退避至不妨
礙打線接合作業的位置的焊針保持部11位於焊針8U的下方。
The part (b) of FIG. 12 shows the state of the first step in the replacement operation. First, the solder
圖13(a)部表示更換動作中的第二步驟的狀態。焊針更換部9藉由控制裝置27使滑架26向上方移動。該移動對應於圖10(b)部所示的動作。藉由該移動,焊針保持部11保持安裝於超音波焊頭7的焊針8U。
Fig. 13(a) shows the state of the second step in the replacement operation. The
圖13(b)部表示更換動作中的第三步驟的狀態。焊針更換部9藉由控制裝置27使滑架26向下方移動。該移動對應於圖10(c)部所示的動作。藉由該移動,將經焊針保持部11保持的焊針8U從超音波焊頭7卸除。
The part (b) of FIG. 13 shows the state of the third step in the replacement operation. The solder
圖14(a)部表示更換動作中的第四步驟的狀態。焊針更換部9藉由控制裝置27使滑架26向順時針方向旋轉。該移動對應於圖11(a)部所示的動作。藉由該移動,將經焊針保持部11保持的焊針8U搬送至焊針回收部41,作為已使用的焊針8U而回收。
Part (a) of FIG. 14 shows the state of the fourth step in the replacement operation. The solder
圖14(b)部表示更換動作中的第五步驟的狀態。焊針更換部9藉由控制裝置27使滑架26向逆時針方向旋轉。該移動對應於圖11(b)部所示的動作。藉由該移動,焊針保持部11保持更換用的新的焊針8N。
Part (b) of FIG. 14 shows the state of the fifth step in the replacement operation. The solder
圖15(a)部表示更換動作中的第六步驟的狀態。焊針更換部9藉由控制裝置27使滑架26向順時針方向旋轉。該移動對應於圖11(a)部所示的動作。藉由該移動,經焊針保持部11保持的新的焊針8N位於超音波焊頭7的孔7h的下方。
Part (a) of FIG. 15 shows the state of the sixth step in the replacement operation. The solder
圖15(b)部表示更換動作中的第七步驟的狀態。焊針更換部9藉由控制裝置27使滑架26向上方移動。該移動對應於圖10(b)部所示的動作。藉由該移動,經焊針保持部11保持的新的焊針8N插入至超音波焊頭7的孔7h中。於該插入中,藉由圖6(a)部及圖6(b)部以及圖7(a)部~圖7(c)部所示的焊針保持部11及焊針引導部12的作用,消除焊針8N與焊針引導部12的偏移及焊針8N與超音波焊頭7的孔7h的偏移,故而能可靠地安裝。
The part (b) of FIG. 15 shows the state of the seventh step in the replacement operation. The
以下,對實施形態的致動器13及打線接合裝置1的作用效果進行說明。
Hereinafter, the effect of the
致動器13具備一對線性馬達22A、22B,各線性馬達22A、22B中產生的力是藉由控制裝置27進行控制。根據該構成,藉由使一對線性馬達22A、22B中產生的力的朝向一致,可使滑架26平移。進而,藉由使線性馬達22A、22B中產生的力的朝向互為反向,而使滑架26產生繞重心的轉矩。其結果,可使滑架26繞其重心旋轉。其結果,致動器13可進行平移及旋轉等多個動作。
The
即,本實施形態的致動器13可進行平移與旋轉,無需分別準備僅用於平移的驅動機構及僅用於旋轉的驅動機構。因此,與分別準備平移用驅動機構及旋轉用驅動機構的構成相比,可實現致動器13的大小的小型化。
That is, the
打線接合裝置1包括具備致動器13的焊針更換部9。該致動器13可進行平移與旋轉該兩個動作。因此,可對打線接合裝
置1賦予焊針8的更換功能,並且抑制焊針更換部9的大型化。因此,可兼顧打線接合裝置1的高功能化與小型化。
The wire bonding device 1 includes a solder
進而,打線接合裝置1中,經焊針保持部11保持的焊針8一面經焊針引導部12引導一面插入至孔7h中。因此,即便焊針8相對於孔7h偏移,亦藉由焊針引導部12來修正偏移。進而,焊針保持部11中,相對於固定於致動器13的下插座18,包含上插座16及線圈彈簧17的可撓部10以可相對移位的方式保持焊針8的位置。其結果,即便於除了焊針8相對於孔7h的偏移以外,焊針引導部12相對於孔7h偏移的情形時,亦能以使焊針8追隨焊針引導部12及孔7h的方式,一面使焊針8的姿勢變化一面插入。因此,可不依賴作業者的手而將新的焊針8自動安裝於打線接合裝置1。
Furthermore, in the wire bonding device 1, the
以上,對本發明的實施形態進行了說明,但不限定於所述實施形態而能以各種形態實施。 As mentioned above, although the embodiment of this invention was described, it is not limited to the said embodiment, It can implement in various forms.
<變形例1> <Modification 1>
於實施形態中,作為第一力產生部及第二力產生部,例示了利用慣性法則的以衝擊驅動方式為原理的超音波驅動馬達。然而,第一力產生部及第二力產生部不限定於該構成,只要可產生沿著規定方向的力,則可用作第一力產生部及第二力產生部。例如,作為第一力產生部及第二力產生部,亦可採用利用滾珠螺桿(ball screw)的線性引導件。 In the embodiment, as the first force generating unit and the second force generating unit, an ultrasonic drive motor based on the principle of an impact drive method using the law of inertia is exemplified. However, the first force generating portion and the second force generating portion are not limited to this configuration, and as long as they can generate a force along a predetermined direction, they can be used as the first force generating portion and the second force generating portion. For example, as the first force generating portion and the second force generating portion, linear guides using ball screws may also be used.
<變形例2>
<
焊針保持部只要能以可靈活地變更焊針8的姿勢的態樣保持即可。因此,不限定於所述焊針保持部的構成,亦可採用圖16所示的變形例的焊針保持部11A。
The solder pin holding part only needs to be held in a state in which the posture of the
焊針保持部11A具有金屬製的管道42、矽酮(silicone)樹脂製的軟管43、及蓋44作為主要的構成部件。管道42呈筒狀,於其內部收納軟管43。管道42的一端及軟管43的一端由蓋44封閉。該蓋44由固持器14保持。軟管43的上端43a(上端開口緣)與管道42的上端42a大致一致。另外,軟管43的外徑小於管道42的內徑。即,於軟管43的外周面與管道42的內周面之間,形成有稍許的間隙。而且,於軟管43的上端43a,保持焊針8的錐面8a。
The solder
根據該焊針保持部11A,軟管43具有規定的可撓性。因此,以形成於軟管43的外周面與管道42的內周面之間的間隙的程度,焊針保持部11A可容許焊針8的姿勢變更。具體而言,可容許與管道42的軸線42A交叉的方向上的偏心及傾斜。
According to this
此處,僅軟管43的情形時,視焊針8的姿勢不同而可能產生軟管43的剛性不足,故而無法保持焊針8的情況。然而,於軟管43的外側,存在剛性高於軟管43的管道42,故而即便於軟管43的剛性不足的情形時,亦可藉由管道42將焊針8的移位限制於容許範圍。
Here, in the case of only the
進而,於軟管43中插入有焊針8的狀態下,該上端43a的內周緣與錐面8a的接觸狀態成為線接觸。因此,與實施形態的
焊針保持部11A同樣地,亦可傾斜地保持焊針8。
Furthermore, in the state in which the
<變形例3>
<
所述焊針引導部12一面使焊針8與錐孔部12t的壁面及平行孔部12p的壁面接觸,一面將焊針8引導至超音波焊頭7的孔7h。錐孔部12t及平行孔部12p如圖17所示,於前端面12c具有開口部12e。根據該形狀,於使焊針8逐漸向上方移動時,焊針8於前方(X軸方向)未經支持,故而有可能焊針8相對於壁面12W(參照圖19)向相反側傾斜。因此,變形例的焊針引導部12S可防止該焊針8的傾斜的產生,進一步向超音波焊頭7的孔7h可靠地插入焊針8。
The solder
如圖17、圖18及圖19所示,焊針引導部12S具有將焊針8引導至孔7h的引導孔12h。引導孔12h包含沿著焊針8的插入方向(Z軸方向)排列的錐孔部12t(第一孔部)及平行孔部12p(第二孔部)。而且,焊針引導部12包含形成有錐孔部12t的錐部51、及形成有平行孔部12p的平行引導部52。
As shown in FIGS. 17, 18, and 19, the
該錐孔部12t為直徑朝向插入方向(Z軸方向)變小的研缽狀的錐孔。所謂此處的插入方向,是指自下表面12b朝向上表面12a的方向。另外,平行孔部12p與孔7h同軸地配置,以沿著平行孔部12p的軸線12A(參照圖18、圖19)的方式引導焊針8。所謂此處的「同軸」,不限定於平行孔部12p的軸線12A與孔7h的軸線7A完全一致(重合)。所謂「同軸」,意指可將焊針8自平行孔部12p插入至孔7h的軸線的位置關係,容許可將焊針8
自平行孔部12p插入至孔7h的構成中的軸線彼此的偏移。
The tapered
然後,焊針引導部12S具有一對線圈彈簧53。線圈彈簧53對插入至平行孔部12p的焊針8提供朝向與軸線12A交叉的方向(XY平面的面內方向)的力。該線圈彈簧53設於平行引導部52。具體而言,插入至設於平行引導部52的孔52h中。線圈彈簧53支持位於平行引導部52的焊針8。
Then, the
線圈彈簧53是以其軸線L53相對於XY平面成平行的方式配置。另外,線圈彈簧53的軸線L53相對於軸線12A位於扭轉的位置。焊針8可抵接的壁面12W的點P12、平行孔部12p的軸線12A、及線圈彈簧53中可與焊針8抵接的點P53配置於經過平行孔部12p的軸線12A的徑向線12K上。
The
線圈彈簧53具有於無外力作用的狀態(以下稱為「自然狀態」)下可維持其形狀的彈性係數。具體而言,線圈彈簧53於以使其軸線L53與水平方向一致的方式保持的情形時,於鉛垂方向上不發生顯著的撓曲。而且,線圈彈簧53若受到朝向與軸線L53交叉的方向的外力,則產生與該外力反向的反作用力。
The
如圖19所示,於由平行孔部12p的壁面12W及線圈彈簧53包圍的區域S中插入焊針8。線圈彈簧53與壁面12W之間的距離M1略小於焊針8的直徑。於是,若於區域S中插入焊針8,則焊針8將線圈彈簧53朝與壁面12W相反側(即,開口部12e側)按壓(力F1)。針對該力F1,線圈彈簧53產生反作用力F2。藉由該反作用力F2,焊針8被按壓於壁面12W。
As shown in FIG. 19, the
因此,平行孔部12p中,焊針8的外周面8t與壁面12W接觸。即,於焊針8的外周面8t與壁面12W接觸的狀態下,焊針8於軸線12A的方向上逐漸滑動。其結果,焊針8可不相對於軸線12A傾斜而以穩定的狀態移動,故而可進一步將焊針8可靠地引導至超音波焊頭7的孔7h。
Therefore, in the
再者,作為圖17、圖18、圖19等所示的施力構件的線圈彈簧53為一例,施力構件的構成不限定於該線圈彈簧53。施力構件只要為可朝向平行孔部12p的壁面12W按壓焊針8的構成,則可適當採用。
Furthermore, the
8‧‧‧焊針 8‧‧‧Solder pin
8A、16A、17A、18A‧‧‧軸線 8A, 16A, 17A, 18A‧‧‧Axis
8a‧‧‧錐面 8a‧‧‧Cone
8b‧‧‧焊針本體 8b‧‧‧Solder pin body
10‧‧‧可撓部 10‧‧‧Flexible part
11‧‧‧焊針保持部 11‧‧‧Solder pin holder
14‧‧‧固持器 14‧‧‧ Holder
16‧‧‧上插座 16‧‧‧on socket
16a、18a‧‧‧上端面 16a, 18a‧‧‧upper end
16b、18b‧‧‧下端面 16b, 18b‧‧‧lower end surface
16c‧‧‧埋頭孔部 16c‧‧‧Counterbore
16d、18d‧‧‧階差 16d, 18d‧‧‧step difference
16e、18e‧‧‧細徑部 16e, 18e‧‧‧small diameter part
16h‧‧‧貫通孔 16h‧‧‧Through hole
17‧‧‧線圈彈簧 17‧‧‧Coil spring
18‧‧‧下插座 18‧‧‧Under socket
18f‧‧‧粗徑部 18f‧‧‧Large diameter part
19‧‧‧O形環 19‧‧‧O-ring
CL‧‧‧接觸線 CL‧‧‧Contact line
Claims (9)
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