TWI708296B - Wire bonding device - Google Patents

Abstract

The invention provides a wire bonding device, which automates the work of installing a new soldering needle on the wire bonding device. The wire bonding device 1 includes: an ultrasonic welding head 7 having a hole 7h for detachably holding a welding pin 8; a welding pin holding portion 11 detachably holding a welding pin 8 for insertion into the hole 7h; an actuator 13 to The solder pin holder 11 is moved by inserting the solder pin 8 held by the solder pin holder 11 into the hole 7h; and the solder pin guide portion 12 is accompanied by the movement of the solder pin holder 11 by the actuator 13 Guide the solder pin 8 to the hole 7h.

Description

Wire bonding device

The present invention relates to a wire bonding device.

Patent Document 1 discloses a wire bonding device. The wire bonding device has a capillary as a bonding tool. The wire bonding device connects the wire to the electrode by applying heat or ultrasonic vibration to the wire using the welding.

[Prior Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2018-6731

In an electronic device manufacturing plant, multiple manufacturing devices are operated in order to manufacture a large number of electronic devices. If the number of manufacturing devices increases, the number of production can be increased. On the other hand, the manufacturing device requires various maintenance operations. Therefore, maintenance work of the same number of manufacturing devices is required. Therefore, the increase in the number of production and the load of maintenance work are in a contradictory relationship. Therefore, if the maintenance work can be performed automatically without relying on the hands of the operator, the load of the maintenance work can be reduced.

The wire bonding device has a welding needle replacement as one of the maintenance tasks operation. Therefore, in this technical field, automation of the replacement work of solder pins is desired. Specifically, automation of the work of attaching a new solder pin to the wire bonding device in a state where the used solder pin is removed is desired.

In view of the above background, an object of the present invention is to provide a wire bonding device that can automate the work of mounting a new solder pin to the wire bonding device.

A wire bonding device according to one aspect of the present invention includes: a solder pin holding portion that detachably holds the solder pin; and an actuator for inserting the solder pin held by the solder pin holding portion into the pin holding hole of the bonding tool In the method, the solder pin holder holding the solder pin is moved in a predetermined direction; and the solder pin guide is arranged between the solder pin holder and the bonding tool, and the solder pin is guided by the movement of the solder pin holder Up to the solder pin holding hole, the solder pin holding portion has a solder pin base fixed to the actuator, and a flexible portion that holds the solder pin relative to the position of the solder pin base relatively displaceable.

In this wire bonding device, the solder pin held by the solder pin holding portion is inserted into the solder pin holding hole while being guided by the solder pin guide portion. Therefore, even if the solder pin is shifted from the solder pin holding hole, the shift is corrected by the solder pin guide. Furthermore, in the solder pin holding portion, the flexible portion retains the position of the solder pin relative to the base of the solder pin fixed to the actuator. As a result, even when the solder pin guide is shifted from the solder pin holding hole in addition to the shift of the solder pin relative to the solder pin holding hole, the solder pin can be made to follow the solder pin guide and the solder pin holder. The method of hole inserts while changing the posture of the solder pin. Therefore, it is possible to automatically attach a new solder pin to the wire bonding device without relying on the operator's hand.

In one form of wire bonding device, the actuator may also have: a base part; and a moving body, which is arranged on the base part, is equipped with a solder pin holder and moves the solder pin holder, and the solder pin guide is fixed to Basal part. According to this configuration, the relative positional relationship between the solder pin holding portion and the solder pin guide portion that are moved by the actuator can be easily maintained. Therefore, the solder pin can be reliably attached to the bonding tool by the solder pin guide.

In one form of the wire bonding device, the flexible part may also have: an elastic part, one end of which is fixed to the base of the welding pin; and a restricting part, which is provided at the other end of the elastic part to restrict the welding pin. According to this configuration, the elastic portion can be elastically deformed based on the base of the solder pin. Furthermore, a restricting portion is provided at the other end of the elastic portion, and the restricting portion restricts the solder pin. Therefore, the relative position of the welding pin with respect to the base of the welding pin can be shifted by the elastic portion. Therefore, the solder pin can be attached to the joining tool more reliably.

In one form of wire bonding device, the restricting portion may also be in line contact with the tapered surface of the solder pin. According to this configuration, the restriction portion can tolerate the inclination of the held solder pin. Therefore, the posture of the soldering pin can be shifted more flexibly, so that the soldering pin can be further reliably mounted to the bonding tool.

In one form of the wire bonding device, the restricting portion may be a torus-shaped O-ring, and the elastic portion may be a coil spring. According to this structure, the solder pin holding part can be comprised with a simple structure.

In one form of wire bonding device, the welding needle holding part may also have: a hose including an upper end opening edge as a restricting part and a main body part as an elastic part; a cover to close the lower end of the hose; and a cylindrical pipe , The lower end is closed by a cover to accommodate the hose, and the rigidity of the pipe is higher than that of the hose. It is set between the inner circumference of the pipe and the outer circumference of the hose. There are gaps. According to this structure, the posture of the welding needle can be shifted by the hose. Furthermore, the pipe exists on the outside of the hose, so the displacement of the welding needle can be restricted to the allowable range by the pipe. Therefore, the solder pin can be reliably attached to the bonding tool.

Another form of joining device includes: a solder pin holding portion that detachably holds the solder pin; an actuator that inserts the solder pin held by the solder pin holding portion into the pin holding hole of the joining tool to hold the solder pin The solder pin holding portion of the solder pin moves in a predetermined direction; and the solder pin guide portion is arranged between the solder pin holding portion and the joining tool, and guides the solder pin to the solder pin holding hole along with the movement of the solder pin holder, The solder pin guide portion is provided with a guide hole for guiding the solder pin to the solder pin holding hole, and the solder pin guide portion has an urging member that provides an orientation to the solder pin inserted into the guide hole to cross the axis of the guide hole The force of the direction.

According to this configuration, the welding pin is pressed against the wall surface of the welding pin guide by the urging member, and is guided in a predetermined direction while being directed. As a result, the welding needle can be moved in a stable state without tilting, so that the welding needle can be more reliably guided to the welding needle holding hole of the bonding tool.

In another form of joining device, the guide hole may include a first hole portion and a second hole portion arranged along the insertion direction of the solder pin, and the first hole portion is a tapered hole whose diameter decreases toward the insertion direction. The two holes are arranged coaxially with the solder pin holding hole, and the solder pin is guided along the axis of the solder pin holding hole. According to this structure, the solder pin can be guided to the solder pin holding hole more reliably.

In another form of joining device, the solder needle guide may include a tapered portion formed with a first hole and a guide formed with a second hole, and the urging member may be provided on the guide Guide Department. According to this structure, the solder pin can be guided to the solder pin holding hole more reliably.

According to the present invention, there is provided a wire bonding device capable of automating the work of mounting a new solder pin to the wire bonding device.

1: Wire bonding device

2: base

3: Joint

4: Transport Department

6: Joining tool

7: Ultrasonic welding head

7A, 8A, 12A, 16A, 17A, 18A, 19A, 42A, L53: axis

7h, 52h: hole

8, 8N, 8U: solder pins

8a: Cone

8b: Solder pin body

8t, 38a: outer peripheral surface

9: Soldering pin replacement part

11.11A: Solder pin holding part

12.12S: Solder pin guide

12a: upper surface

12b: lower surface

12c: Front face

12e: opening

12h: guide hole

12t: Taper hole part (first hole part)

12p: Parallel hole (second hole)

12K: radial

12W: wall surface

13: Actuator

14: Holder

15: loading and unloading fixture

16: on socket

16a, 18a: upper end face

16b, 18b: lower end surface

16c: Countersink

16d, 18d: step difference

16e, 18e: small diameter part

16h: Through hole

17: Coil spring (elastic part)

18: Lower socket (bottom of solder pin base)

18f: Large diameter part

19: O-ring (restriction part)

20: Fixture drive

21: Actuator base (base part)

21a, 36a: main side

22A: Linear motor (first force generating part)

22B: Linear motor (second force generating part)

24: Linear guide

24a: Platform

26: carriage (moving body)

27: Control device (control part)

28A, 28B: drive shaft

29A, 29B: Ultrasonic components

31, 32: guide

33: front disc

34: Pressurized disc

34b: back

36: rear disc

37, 38: shaft

39: Solder pin storage

41: Soldering Needle Recycling Department

42: pipe

42a, 43a: upper end

43: hose

44: cover

51: Cone

52: Parallel guide

53: coil spring

C1, C2, P1, P2: contact part

CL: contact line

E1, E2, E3, E4, E5, E6, E7, E8, E9, E10, E11, E12, E13: Voltage

E2a, E2b, E3a, E3b: symbols

G1, G2: gap

F1: Force

F2: Reaction force

M1: distance

P12, P53: point

S: area

Fig. 1 is a perspective view showing the wire bonding device of the embodiment.

Fig. 2 is an enlarged perspective view showing a solder pin replacement part included in the wire bonding device shown in Fig. 1.

Fig. 3 is a perspective view showing a part of a solder pin holding portion in cross section.

Fig. 4(a)-Fig. 4(c) are diagrams explaining the operation of the solder pin holding portion.

Fig. 5 is a perspective view showing a part of the solder pin guide in cross section.

Fig. 6(a) and Fig. 6(b) are diagrams showing the pin guide function performed by the pin holder and the pin guide.

Fig. 7 (a)-Fig. 7 (c) are diagrams showing another guiding function of the solder pin by the solder pin holder and the solder pin guide.

Fig. 8 is a plan view showing a main part of an actuator included in the solder pin replacement part shown in Fig. 2.

Fig. 9(a) to Fig. 9(c) are diagrams illustrating the operating principle of the actuator.

Fig. 10(a) to Fig. 10(c) are diagrams illustrating specific control of the actuator.

Fig. 11(a) and Fig. 11(b) are diagrams illustrating specific control of the actuator.

Figure 12(a) and Figure 12(b) show the main operations of the solder pin replacement part Figure.

Fig. 13 (a) and Fig. 13 (b) are diagrams showing main operations of the solder pin replacement part following Fig. 12 (a) and Fig. 12 (b).

Figs. 14(a) and 14(b) are diagrams showing main operations of the solder pin replacement part following Figs. 13(a) and 13(b).

Fig. 15 (a) and Fig. 15 (b) are diagrams showing the main operation of the solder pin replacement part following Fig. 14 (a) and Fig. 14 (b).

Fig. 16 is a perspective view showing a cross section of a solder pin holding portion of a modification.

Fig. 17 is a perspective view showing a solder pin guide of another modification.

Fig. 18 is a front view of the solder pin guide shown in Fig. 17.

Fig. 19 is a plan view of the solder pin guide shown in Fig. 17.

Hereinafter, the mode for implementing the present invention will be described in detail with reference to the accompanying drawings. In the description of the drawings, the same components are denoted by the same symbols, and repeated descriptions are omitted.

The wire bonding apparatus 1 shown in FIG. 1 uses, for example, a thin metal wire to electrically connect electrodes of a printed circuit board or the like and electrodes of a semiconductor element provided on the printed circuit board. The wire bonding device 1 applies heat, ultrasonic waves or pressure to the wire to connect the wire to the electrode. The wire bonding apparatus 1 has a base 2, a bonding part 3 for performing the connection work, and a conveying part 4 that conveys a printed circuit board or the like as a part to be processed to the bonding area.

The joining part 3 contains a joining tool 6, and a super Sonic welding head 7. At the front end of the ultrasonic welding head 7, a welding needle 8 for providing heat, ultrasonic or pressure to the wire bonding is detachably provided.

In the following description, the direction in which the ultrasonic welding head 7 extends is set to the X-axis, the direction in which the printed circuit board is conveyed by the conveying section 4 is set to the Y-axis (second direction), and the direction in which the solder pins 8 move during the joining operation ( The Z axis direction, the first direction) is set as the Z axis.

The solder pin 8 is a part that needs to be replaced regularly. Therefore, the wire bonding apparatus 1 has the solder pin replacement part 9 which automatically replaces the solder pin 8 without an operator's operation.

The solder pin replacement part 9 collects the solder pins 8 attached to the ultrasonic solder head 7 and attaches the solder pins 8 to the ultrasonic solder head 7. That is, the replacement work of the solder pin 8 includes the work of collecting the solder pin 8 and the work of installing the solder pin 8. The replacement operation of the solder pins 8 is automatically performed when the conditions set in advance are satisfied. For example, the condition may be the number of joining operations. That is, the work of replacing the solder pin 8 may be performed every time the joining work is performed a predetermined number of times.

As shown in FIG. 2, the solder pin replacement portion 9 has a solder pin holder 11, a solder pin guide 12, and an actuator 13 as main components. In addition, a jig drive unit 20 that has the attachment/detachment jig 15 and the attachment/detachment jig 15 is provided as an additional component.

<Solder pin holding part>

The solder pin holder 11 holds the solder pin 8. The solder pin holder 11 is attached to the actuator 13 via the holder 14. The solder pin holding portion 11 has a cylindrical shape extending in the Z-axis direction. The lower end of the solder pin holding portion 11 is held by the holder 14. At the upper end of the solder pin holding portion 11, the solder pin 8 is detachably inserted.

As shown in Figure 3, the solder pin holder 11 has an upper socket 16, a coil spring 17 (elastic part), lower socket 18 (solder pin base part) and O-ring 19 (restriction part) are the main components. The upper socket 16, the coil spring 17, and the lower socket 18 are arranged on a common axis. Specifically, the upper socket 16, the coil spring 17, and the lower socket 18 are arranged in this order from top to bottom.

The upper socket 16 has a substantially cylindrical shape and has a through hole 16h extending from the upper end surface 16a to the lower end surface 16b. The upper socket 16 holds the tapered surface 8a of the solder pin 8, so the inner diameter of the through hole 16h corresponds to the outer diameter of the tapered surface 8a of the solder pin 8. For example, the inner diameter of the through hole 16h is smaller than the outer diameter of the solder pin body 8b. In addition, a counterbore portion 16c for the O-ring 19 is provided on the upper end surface 16a side of the through hole 16h. The countersunk portion 16c has a size that can accommodate the O-ring 19. That is, the counterbore portion 16c has the same depth as the height of the O-ring 19, and its inner diameter and the outer diameter of the O-ring 19 are the same.

The O-ring 19 has a so-called annular shape. The O-ring 19 is in direct contact with the tapered surface 8a of the solder pin 8. That is, in the solder pin holding portion 11, the O-ring 19 holds the solder pin 8. This retention is achieved by the adhesive layer formed on the surface of the O-ring 19. The inner diameter of the O-ring 19 is approximately the same as the inner diameter of the through hole 16h, and the tapered surface 8a of the solder pin 8 is inserted.

Furthermore, the upper socket 16 has a step 16d provided on the outer peripheral surface, so the size of the outer diameter is different on the upper end surface 16a side and the lower end surface 16b side. Specifically, the outer diameter on the lower end surface 16b side is slightly smaller than the outer diameter on the upper end surface 16a side. The coil spring 17 is fitted into the small diameter portion 16e on the side of the lower end surface 16b.

The lower socket 18 has a substantially cylindrical shape. The upper end surface 18a of the lower socket 18 faces The lower end surface 16b of the upper socket 16. The lower socket 18 has the same outer shape as the upper socket 16. That is, the lower socket 18 is also provided with a step 18d on its outer peripheral surface. Contrary to the upper socket 16, the lower socket 18 has the upper end surface 18a side as a small diameter part 18e. The coil spring 17 is also fitted into the small diameter portion 18e on the upper end surface 18a side. The large diameter portion 18f on the lower end surface 18b side of the lower socket 18 is clamped by the holder 14.

The coil spring 17 is a compression spring. For the coil spring 17, the upper end side is fitted into the small diameter part 16 e of the upper socket 16, and the lower end side is inserted into the small diameter part 18 e of the lower socket 18. The upper socket 16 and the coil spring 17 constitute the flexible portion 10. Therefore, the upper socket 16 and the lower socket 18 are connected by the coil spring 17. Moreover, the coil spring 17 has elasticity in the direction of the axis 17A and the direction crossing the axis 17A. As a result, the upper socket 16 can change the relative position with respect to the lower socket 18.

The solder pin holding portion 11 having the above-mentioned configuration has a holding state as shown in Fig. 4(a) to Fig. 4(c). The part (a) of FIG. 4 shows the solder pin holding part 11 in an initial state. Part (b) of FIG. 4 shows the solder pin holding part 11 of the first modification. The part (c) of FIG. 4 shows the solder pin holding part 11 of the second modification.

As shown in part (a) of FIG. 4, in the pin holding portion 11 of the first holding state, the axes 16A and 18A of the upper socket 16 and the lower socket 18 overlap. Furthermore, the axis 8A of the solder pin 8 also coincides with the axis 16A, 18A.

As shown in part (b) of FIG. 4, in the pin holding portion 11 of the second holding mode, the axes 16A and 18A of the upper socket 16 and the lower socket 18 do not overlap. Specifically, with respect to the lower socket 18 held by the holder 14 to maintain its position, the upper socket 16 moves in the X-axis and Y-axis directions. In this state, the axis 16A of the upper socket 16 is It is parallel to the axis 18A of the lower socket 18.

As shown in part (c) of FIG. 4, in the solder pin holding portion 11 of the third modification, the axes 16A and 18A of the upper socket 16 and the lower socket 18 coincide. That is, these configurations are the same as the first holding aspect. On the other hand, the axis 8A of the solder pin 8 is inclined with respect to the axis 16A of the upper socket 16. The O-ring 19 has the shape of a circular ring, so the inner peripheral surface into which the tapered surface 8a of the solder pin 8 is inserted is a curved surface. For example, the cross-sectional shape of the O-ring 19 in the cross-section parallel to the Z axis is circular. Therefore, when the O-ring 19 is cross-sectionally viewed in a state where the tapered surface 8a is inserted, the O-ring 19 and the tapered surface 8a are in contact with each other at two contact portions C1 and C2. That is, the O-ring 19 and the solder pin 8 are in line contact on the ring-shaped contact line CL (refer to FIG. 3). According to this contact state, the solder pin 8 is allowed to tilt with respect to the axis 19A of the O-ring 19.

<Solder pin guide>

As shown in FIG. 2 again, the solder pin guide 12 guides the solder pin 8 when the solder pin 8 is inserted into the hole 7h (the pin holding hole) of the ultrasonic welding head 7. The solder pin guide 12 is provided on the actuator 13. Therefore, the solder pin guide 12 maintains the relative positional relationship with the parts constituting the actuator 13. The pin guide 12 has a single-arm beam shape extending from the actuator 13 to the ultrasonic welding head 7.

FIG. 5 is a perspective view of the main part of the solder pin guide 12 in section. As shown in FIG. 5, the solder pin guide 12 has a guide hole 12h provided at its free end. The guide hole 12h receives the solder pin body 8b of the solder pin 8, and guides the solder pin 8 to the hole 7h of the ultrasonic welding head 7. The guide hole 12h is a through hole extending from the upper surface 12a of the solder pin guide 12 to the lower surface 12b. Furthermore, the guide hole 12h is on the front end surface 12c of the solder pin guide 12 Also speak. That is, the guide hole 12h can receive the solder pin 8 from the lower surface 12b and the front end surface 12c.

The guide hole 12h includes a tapered hole portion 12t and a parallel hole portion 12p. The lower end of the tapered hole portion 12t opens to the lower surface 12b. The upper end of the parallel hole portion 12p is open on the upper surface 12a. The inner diameter of the tapered hole portion 12t in the lower surface 12b is larger than the inner diameter of the parallel hole portion 12p in the upper surface 12a. The inner diameter is larger than the outer diameter of the upper end of the solder pin 8. That is, the inner diameter of the guide hole 12h gradually decreases from the lower surface 12b to the upper surface 12a, and becomes the minimum value of the inner diameter at the position connecting the tapered hole portion 12t and the parallel hole portion 12p. The inner diameter is approximately the same as the outer diameter of the upper end of the solder pin 8. In addition, the inner diameter of the parallel hole portion 12p is constant.

Part (a) of FIG. 6 and part (b) of FIG. 6 show a situation in which the solder pin 8 is guided by the solder pin guide 12. In the state shown in part (a) of FIG. 6, the axis 7A of the hole 7h of the ultrasonic horn 7 coincides with the axis 12A of the guide hole 12h of the pin guide 12. On the other hand, the axis 8A of the solder pin 8 held by the solder pin holder 11 is offset in parallel in the X-axis direction with respect to the axes 7A and 12A.

The pin holding portion 11 is moved in the Z-axis direction from the state shown in part (a) of FIG. 6. Then, as shown in part (b) of FIG. 6, first, the upper end of the solder pin 8 contacts the wall surface of the tapered hole portion 12t. If the solder pin holding portion 11 is further moved upward, the solder pin 8 moves along the wall surface. This movement includes components in the horizontal direction (X-axis direction) in addition to the upward (Z-axis direction) component. The solder pin holder 11 can move the upper socket 16 relative to the lower socket 18 by the coil spring 17. That is, when the lower socket 18 is moved upward, the upper socket 16 moves upward while moving in the horizontal direction by the coil spring 17.

According to this movement, the axis 8A of the solder pin 8 gradually approaches the axis of the hole 7h 7A. Then, when the upper end of the solder pin 8 reaches the parallel hole portion 12p, the axis 8A of the solder pin 8 and the axis 7A of the hole 7h overlap. Therefore, the soldering pin 8 is inserted into the hole 7h of the ultrasonic soldering head 7.

In the example shown in part (a) of FIG. 6, the positional relationship between the ultrasonic horn 7 and the pin guide 12 is an ideal state. On the other hand, in the example shown in part (a) of FIG. 7, the axis 7A of the hole 7h of the ultrasonic horn 7 is inclined with respect to the axis 12A of the pin guide 12.

The operation of inserting the solder pin 8 in this state will be described. As shown in part (b) of FIG. 7, the axis 8A of the solder pin 8 is relatively inclined with respect to the axis 7A of the hole 7h. Therefore, the upper end of the solder pin 8 is in contact with the wall surface of the hole 7h, so that the solder pin 8 cannot be inserted more into the hole 7h. In order to further insert the solder pin 8 into the hole 7h, it is necessary to make the axis 8A of the solder pin 8 parallel to the axis 7A of the hole 7h, and to make the axis 8A coincide with the axis 7A.

As described above, in the solder pin holding portion 11, the upper socket 16 can be offset with respect to the lower socket 18, and the solder pin 8 can be inclined with respect to the axis 16A of the upper socket 16. According to these actions, as shown in part (c) of FIG. 7, as the solder pin holding portion 11 is raised, the axis 8A of the solder pin 8 can gradually approach the axis 7A of the hole 7h, and finally be inserted into the hole 7h. That is, the solder pin holding portion 11 flexibly holds the solder pin 8 and therefore can absorb the deviation of the solder pin 8 and the solder pin guide 12 and the deviation of the solder pin 8 and the hole 7h of the ultrasonic welding head 7. Therefore, according to the solder pin holding portion 11 and the solder pin guide portion 12, the solder pin 8 can be reliably attached.

<Actuator>

The actuator 13 moves the solder pin 8 to be replaced or a new solder pin 8, and The solder pin 8 is maintained at a predetermined position and posture. The actuator 13 can perform reciprocating movement along a predetermined parallel axis (Z axis) direction. In this embodiment, the parallel axis is along the vertical direction (Z axis). Therefore, the actuator 13 moves the solder pin 8 up and down in the vertical direction. Furthermore, the actuator 13 can perform rotation about a rotation axis (X axis). In this embodiment, the rotation axis is orthogonal to the vertical direction (Z axis). That is, the rotation axis is along the horizontal direction (X axis). Therefore, the actuator 13 rotates the solder pin 8 in the horizontal direction.

The actuator 13 has an actuator base 21 (base part), a pair of linear motors 22A, 22B (first force generating part, second force generating part), linear guide 24, carriage 26 (moving body), and control Device 27 (control unit, refer to Fig. 1 etc.).

The actuator base 21 has a flat plate shape and has a main surface 21a. The normal direction of the main surface 21a is along the horizontal direction (X-axis direction). Linear motors 22A, 22B, linear guides 24, and carriage 26 are arranged on the main surface 21a.

The linear motor 22A moves the carriage 26. The linear motor 22A is an ultrasonic motor based on the principle of the so-called inertial impact (impact drive) method. The linear motor 22A has a drive shaft 28A and an ultrasonic element 29A (ultrasonic wave generator). The drive shaft 28A is a metal round bar and is arranged such that its axis is parallel to the main surface 21 a of the actuator base 21. The carriage 26 moves along the drive shaft 28A, so the length of the drive shaft 28A determines the range of movement of the carriage 26. The lower end of the drive shaft 28A is fixed to the ultrasonic element 29A. The upper end of the drive shaft 28A is supported by a guide portion 31 protruding from the main surface 21 a of the actuator base 21. The upper end of the drive shaft 28A may be fixed with respect to the guide portion 31, or may only contact but not be fixed. That is, the lower end of the drive shaft 28A is a fixed end, and the upper end is a fixed end or a free end.

The ultrasonic element 29A provides ultrasonic vibration to the drive shaft 28A. Specifically, the drive shaft 28A provided with ultrasonic vibration slightly reciprocates along the Z axis. The ultrasonic element 29A may also be a piezo element as a piezoelectric element. The piezoelectric element deforms according to the applied voltage. Therefore, when a piezoelectric element is given a high-frequency voltage, it repeatedly deforms according to its frequency and the magnitude of the voltage, and generates ultrasonic vibration. The ultrasonic element 29A is fixed to a guide 32 protruding from the actuator base 21.

A control device 27 is electrically connected to the ultrasonic element 29A, and receives a driving voltage generated by the control device 27. The control device 27 controls the frequency and amplitude of the AC voltage supplied to the ultrasonic element 29A.

The single structure of the linear motor 22B is the same as that of the linear motor 22A. The linear motor 22B is separately arranged in the Y-axis direction intersecting the Z-axis. That is, the drive shaft 28B of the linear motor 22B is parallel to the drive shaft 28A of the linear motor 22A. In addition, the upper end of the linear motor 22B is arranged at the same height as the upper end of the linear motor 22A. Similarly, the lower end of the linear motor 22B is arranged at the same height as the lower end of the linear motor 22A.

The carriage 26 is a moving body that is translated and rotated by linear motors 22A and 22B. The carriage 26 has a disc shape and is erected between the linear motors 22A and 22B. Between the actuator base 21 and the carriage 26, a linear guide 24 that guides the carriage 26 in the Z-axis direction is provided. The carriage 26 is guided by the linear guide 24 in the Z-axis direction. Furthermore, the linear guide 24 restricts the moving direction of the carriage 26 and does not generate a driving force in the Z-axis direction.

The carriage 26 has a front disc 33, a pressure disc 34 and a rear disc 36. The discs have the same outer diameter as each other and are stacked along a common axis. A shaft 37 is sandwiched between the front disk 33 and the pressure disk 34. The outer diameter of the shaft body 37 is smaller than the outer diameters of the front disc 33 and the pressure disc 34. Therefore, a gap is formed between the outer peripheral portion of the front disk 33 and the outer peripheral portion of the pressure disk 34. Similarly, a shaft 38 is also sandwiched between the rear disk 36 and the pressure disk 34. The outer diameter of the shaft body 38 is also smaller than the outer diameters of the rear disc 36 and the pressure disc 34. Therefore, a gap is also formed between the outer circumference of the rear disk 36 and the outer circumference of the pressure disk 34.

The rear disc 36 is connected to the platform 24 a of the linear guide 24. Here, the rear disc 36 is rotatably connected to the platform 24a. On the other hand, the pressure disc 34 and the front disc 33 are mechanically fixed to the rear disc 36, so the pressure disc 34 and the front disc 33 do not rotate relative to the rear disc 36. Therefore, the carriage 26 including the front disc 33, the pressure disc 34, and the rear disc 36 is generally rotatable relative to the platform 24a of the linear guide 24.

As shown in FIG. 8, the drive shafts 28A and 28B are sandwiched in the gap G1 between the pressure disc 34 and the rear disc 36. Specifically, the pair of drive shafts 28A and 28B are arranged so as to sandwich the center of gravity of the carriage 26. Furthermore, the drive shafts 28A and 28B are in contact with the back surface 34b of the pressure disk 34 and the main surface 36a of the rear disk 36. In addition, the drive shafts 28A and 28B are not in contact with the outer peripheral surface 38a of the shaft body 38. That is, the gap G1 is smaller than the outer diameters of the pressure disc 34 and the rear disc 36 and is larger than the thickness of the shaft body 38. In addition, the difference between the outer diameter of the shaft body 38 and the outer diameter of the rear disc 36 is greater than the outer diameters of the drive shafts 28A and 28B. Similarly, the difference between the outer diameter of the shaft 37 and the outer diameter of the pressure disc 34 is greater than that of the drive shaft 28A, The outer diameter of 28B.

Here, the interval of the gap G1 is slightly smaller than the outer diameters of the drive shafts 28A and 28B. Since a gap G2 is formed between the front disc 33 and the pressure disc 34, when the drive shafts 28A and 28B are arranged between the pressure disc 34 and the rear disc 36, the pressure disc 34 is slightly forward The disk 33 flexes on its side. This deflection generates a force that presses the drive shafts 28A and 28B against the rear disk 36.

Hereinafter, the operation principle of the actuator 13 will be described with reference to the part (a) of FIG. 9 to part (c) of FIG. 9. 9(a), FIG. 9(b), and FIG. 9(c) are diagrams for explaining the principle of operation of the actuator 13. For the convenience of description, in Fig. 9(a) to Fig. 9(c), one of the linear motors 22A and the carriage 26 is shown, and the illustration of the other linear motor 22B and the like are omitted.

Part (a) of FIG. 9 shows how the position of the carriage 26 is maintained. As described above, for the carriage 26, the drive shaft 28A is sandwiched between the pressure disc 34 and the rear disc 36, and the position of the carriage 26 is maintained by the pressure caused by the clamping. In more detail, the carriage 26 maintains its position by frictional resistance using pressurization as the vertical resistance. At this time, the control device 27 does not supply voltage to the ultrasonic element 29A (the voltage value is zero, refer to the voltage E1). Alternatively, the control device 27 may supply a direct current having a predetermined voltage value to the ultrasonic element 29A.

As described above, the carriage 26 maintains its position by frictional resistance with the drive shaft 28A. Here, when the drive shaft 28A is moved, a state in which the carriage 26 moves with the drive shaft 28A and a state in which the carriage 26 does not follow the drive shaft 28A and continues to maintain its position by its inertia may occur. Regarding these aspects, according to the drive shaft 28A The speed of movement, that is, the frequency of ultrasonic vibration, can determine which state it becomes. For example, at a relatively low frequency (15 kHz to 30 kHz), the carriage 26 moves along with the drive shaft 28A. For example, when it is a relatively high frequency (100 kHz to 150 kHz), the carriage 26 does not maintain the position along with the drive shaft 28A.

For example, as shown in part (b) of FIG. 9, when the drive shaft 28A is moved upward (positive direction), the carriage 26 is also accompanied by the movement of the drive shaft 28A. That is, the relative positional relationship between the drive shaft 28A and the carriage 26 does not change. Moreover, when the drive shaft 28A is moved downward (negative direction), the carriage 26 is not accompanied by the downward movement of the drive shaft 28A. That is, the relative positional relationship between the drive shaft 28A and the carriage 26 changes. If these actions are repeated, the carriage 26 gradually moves upward. That is, the period of the voltage (symbol E2a in the voltage E2) for moving the drive shaft 28A upward is longer than the period of the voltage (symbol E2b in the voltage E2) for moving the drive shaft 28A down, so that the carriage 26 can be moved upward mobile.

Conversely, as shown in part (c) of FIG. 9, when the drive shaft 28A is moved downward, the carriage 26 also moves with the drive shaft 28A. That is, the relative positional relationship between the drive shaft 28A and the carriage 26 does not change. Furthermore, when the drive shaft 28A is moved upward, the carriage 26 is not accompanied by the upward movement of the drive shaft 28A. That is, the relative positional relationship between the drive shaft 28A and the carriage 26 changes. If these actions are repeated, the carriage 26 gradually moves downward. That is, the period of the voltage (symbol E3a in the voltage E3) for moving the drive shaft 28A upward is shorter than the period of the voltage (symbol E3b in the voltage E3) for moving the drive shaft 28A down, so that the carriage 26 can be moved to Move down.

Furthermore, when the carriage 26 is moved downwards, the Except for the control, the carriage 26 does not follow both the up and down movement of the drive shaft 28A. That is, on the surface, the frictional resistance between the carriage 26 and the drive shaft 28A is smaller than the gravity acting on the carriage 26, and it appears that the carriage 26 falls. In this aspect, as a force to move the carriage 26 downward, the gravity acting on the carriage 26 is used.

On the one hand, referring to Fig. 10(a) to Fig. 10(c) and Fig. 11(a) and Fig. 11(b), on the other hand, the specific operation of the actuator 13 will be described.

Part (a) of FIG. 10 shows the operation of maintaining the position of the carriage 26. As described above, when the position of the carriage 26 is maintained, the control device 27 supplies a certain voltage to the ultrasonic elements 29A and 29B (refer to the voltages E4 and E5 in part (a) of FIG. 10).

The part (b) of FIG. 10 shows the operation of moving the carriage 26 upward. At this time, the control device 27 supplies one of the ultrasonic elements 29A with an AC voltage whose period of the voltage for moving the drive shaft 28A upwards is longer than the period of the voltage for moving the drive shaft 28A downwards (refer to part (b) of FIG. 10 Voltage E6). Similarly, the control device 27 also supplies the other ultrasonic element 29B with an AC voltage whose period of the voltage for moving the drive shaft 28B upward is longer than the period of the voltage for moving the drive shaft 28B downward (see Fig. 10(b) The voltage E7). That is, the control device 27 supplies the same AC voltage to the two ultrasonic elements 29A and 29B. Furthermore, the control device 27 makes the timing of moving one of the drive shafts 28A upward coincide with the timing of moving the other drive shaft 28B upward. That is, the control device 27 sets the phase of the voltage supplied to one of the ultrasonic element 29A and the phase of the voltage supplied to the other ultrasonic element 29B in the same phase relationship. Then, one of the drive shafts 28A is pressed against the contact portion P1 of the pressure disc 34 and the rear disc 36 and the other drive shaft 28B is pressed against the pressure The contact portion P2 of the disc 34 and the rear disc 36 gradually moves upward at the same distance. As a result, the contact portions P1 and P2 move upward while maintaining the parallel state. That is, the carriage 26 does not rotate about the center of gravity, but translates upward.

The part (c) of FIG. 10 shows the action of moving the carriage 26 downward. At this time, the control device 27 supplies one of the ultrasonic elements 29A with an AC voltage whose period of the voltage for moving the drive shaft 28A upward is shorter than the period of the voltage for moving the drive shaft 28A downward (see Fig. 10(c) The voltage E8). Similarly, the control device 27 also provides the other ultrasonic element 29B with an AC voltage whose period of the voltage for moving the drive shaft 28B upward is shorter than the period of the voltage for moving the drive shaft 28B downward (see Fig. 10(c) The voltage in E9). Therefore, pressing one of the drive shafts 28A on the contact portion P1 of the pressure disc 34 and the rear disc 36 is the same as pressing the other drive shaft 28B on the contact portion P2 of the pressure disc 34 and the rear disc 36 The distance gradually moves downward. As a result, the contact portions P1 and P2 move downward while maintaining the parallel state. That is, the carriage 26 does not rotate about the center of gravity, but translates downward.

According to the above-mentioned control, when the carriage 26 is moved downward, the frictional resistance between the carriage 26 and the drive shafts 28A and 28B acts, and the relative positions of each are not changed. Therefore, the carriage 26 does not rotate around the center of gravity. As a result, for example, even in the case where a torque that rotates the carriage 26 is generated due to the posture of the welding pin 8 held on the carriage 26, the rotation of the carriage 26 can be suppressed and the carriage 26 can be moved downward. .

Furthermore, a linear motor 22A can also be used to implement the translational movement of the carriage 26 upward and downward. The actuator 13 of the embodiment has two linear motors 22A and 22B, so it can be improved compared to a configuration having one linear motor 22A. Propulsion.

Part (a) of FIG. 11 shows the operation of rotating the carriage 26 in the clockwise direction. At this time, the control device 27 supplies one of the ultrasonic elements 29A with an AC voltage whose period of the voltage for moving the drive shaft 28A upward is shorter than the period of the voltage for moving the drive shaft 28A downward (see Fig. 11(a) The voltage E10). On the other hand, the control device 27 supplies the other ultrasonic element 29B with an AC voltage whose period of the voltage for moving the drive shaft 28B upward is longer than the period of the voltage for moving the drive shaft 28B downward (see Fig. 11(a) The voltage E11). That is, the control device 27 makes the voltage supplied to the ultrasonic element 29A and the voltage supplied to the ultrasonic element 29B different from each other. Furthermore, the control device 27 matches the timing of moving one of the drive shafts 28A upward with the timing of moving the other drive shaft 28B downward. That is, the control device 27 sets the phase of the voltage supplied to one of the ultrasonic element 29A and the phase of the voltage supplied to the other ultrasonic element 29B in an opposite phase relationship. Then, one of the drive shafts 28A is pressed against the contact portion P1 of the pressure disc 34 and the rear disc 36 to move downward, and the other drive shaft 28B is pressed against the contact portion P2 of the pressure disc 34 and the rear disc 36 Move up. That is, the contact portions P1 and P2 move in opposite directions to each other. If the amount of movement of these contact parts is the same, the contact parts P1 and P2 will rotate in the clockwise direction while maintaining the position in the Z-axis direction.

The part (b) of FIG. 11 shows the operation of rotating the carriage 26 in the counterclockwise direction. At this time, the control device 27 supplies one of the ultrasonic elements 29A with an AC voltage whose period of the voltage for moving the drive shaft 28A upwards is longer than the period of the voltage for moving the drive shaft 28A downwards (refer to Fig. 11(b) Refer to voltage E12). on the other hand, The control device 27 supplies the other ultrasonic element 29B with an AC voltage whose period of the voltage for moving the drive shaft 28B upward is shorter than the period of the voltage for moving the drive shaft 28B downward (refer to the voltage E13 in part (b) of FIG. 11 ). Then, one of the drive shafts 28A is pressed against the contact portion P1 of the pressure disc 34 and the rear disc 36 to move upward, and the other drive shaft 28B is pressed against the contact portion P2 of the pressure disc 34 and the rear disc 36 toward Move down. That is, the contact portions P1 and P2 move in opposite directions to each other. If the amount of movement of these contact parts is the same, the contact parts P1 and P2 will rotate counterclockwise while maintaining their positions in the Z-axis direction.

<Replacement action>

Next, the solder pin replacement operation performed by the solder pin replacement part 9 will be described.

Part (a) of FIG. 12 shows a state just before the solder pin 8U attached to the ultrasonic welding head 7 is replaced. In addition to the solder pin holder 11, the solder pin guide 12, and the actuator 13, the solder pin replacement portion 9 has a solder pin storage portion 39 and a solder pin recovery portion 41 as additional components. The solder pin storage portion 39 stores a plurality of solder pins 8N for replacement. In addition, the solder pin collection portion 41 stores the used solder pins 8U.

The state shown in part (a) of FIG. 12 is, for example, a state where the wire bonding operation is performed by the solder pins 8U attached to the ultrasonic welding head 7. Therefore, the pin replacement part 9 can also be retracted to the position which does not interfere with this wire bonding operation.

The part (b) of FIG. 12 shows the state of the first step in the replacement operation. First, the solder pin replacement unit 9 uses the control device 27 to rotate the carriage 26 in the clockwise direction. This rotation corresponds to the operation shown in part (a) of FIG. 11. With this rotation, the original retreat as far as possible The solder pin holding portion 11 at a position obstructing the wire bonding operation is located below the solder pin 8U.

Fig. 13(a) shows the state of the second step in the replacement operation. The pin replacement part 9 moves the carriage 26 upward by the control device 27. This movement corresponds to the operation shown in part (b) of FIG. 10. By this movement, the solder pin holder 11 holds the solder pin 8U attached to the ultrasonic welding head 7.

The part (b) of FIG. 13 shows the state of the third step in the replacement operation. The solder pin replacement part 9 moves the carriage 26 downward by the control device 27. This movement corresponds to the operation shown in part (c) of FIG. 10. With this movement, the solder pin 8U held by the solder pin holder 11 is removed from the ultrasonic welding head 7.

Part (a) of FIG. 14 shows the state of the fourth step in the replacement operation. The solder pin replacement part 9 rotates the carriage 26 in the clockwise direction by the control device 27. This movement corresponds to the operation shown in part (a) of FIG. 11. By this movement, the solder pin 8U held by the solder pin holding portion 11 is transported to the solder pin collection portion 41, and is collected as a used solder pin 8U.

Part (b) of FIG. 14 shows the state of the fifth step in the replacement operation. The solder pin replacement part 9 rotates the carriage 26 counterclockwise by the control device 27. This movement corresponds to the operation shown in part (b) of FIG. 11. By this movement, the solder pin holding portion 11 holds the new solder pin 8N for replacement.

Part (a) of FIG. 15 shows the state of the sixth step in the replacement operation. The solder pin replacement part 9 rotates the carriage 26 in the clockwise direction by the control device 27. This movement corresponds to the operation shown in part (a) of FIG. 11. By this movement, the new solder pin 8N held by the solder pin holding portion 11 is located below the hole 7h of the ultrasonic horn 7.

The part (b) of FIG. 15 shows the state of the seventh step in the replacement operation. The pin replacement part 9 moves the carriage 26 upward by the control device 27. This movement corresponds to the operation shown in part (b) of FIG. 10. With this movement, the new solder pin 8N held by the solder pin holder 11 is inserted into the hole 7 h of the ultrasonic horn 7. In this insertion, the function of the solder pin holder 11 and the solder pin guide 12 shown in Fig. 6(a) and Fig. 6(b) and Fig. 7(a) ~ Fig. 7(c) , The offset of the solder pin 8N and the solder pin guide 12 and the offset of the solder pin 8N and the hole 7h of the ultrasonic welding head 7 are eliminated, so that it can be installed reliably.

Hereinafter, the effect of the actuator 13 and the wire bonding device 1 of the embodiment will be described.

The actuator 13 includes a pair of linear motors 22A and 22B, and the forces generated in the linear motors 22A and 22B are controlled by the control device 27. According to this configuration, by aligning the directions of the forces generated by the pair of linear motors 22A and 22B, the carriage 26 can be translated. Furthermore, by reversing the directions of the forces generated in the linear motors 22A and 22B, the carriage 26 generates torque around the center of gravity. As a result, the carriage 26 can be rotated about its center of gravity. As a result, the actuator 13 can perform multiple operations such as translation and rotation.

That is, the actuator 13 of the present embodiment can perform translation and rotation, and there is no need to separately prepare a drive mechanism for translation only and a drive mechanism for rotation only. Therefore, compared with a configuration in which a driving mechanism for translation and a driving mechanism for rotation are separately prepared, the size of the actuator 13 can be reduced in size.

The wire bonding device 1 includes a solder pin replacement part 9 including an actuator 13. The actuator 13 can perform the two actions of translation and rotation. Therefore, it can be Setting 1 provides the replacement function of the solder pin 8 and suppresses the enlargement of the solder pin replacement part 9. Therefore, both high-functionality and miniaturization of the wire bonding device 1 can be achieved.

Furthermore, in the wire bonding device 1, the solder pin 8 held by the solder pin holder 11 is inserted into the hole 7 h while being guided by the solder pin guide 12. Therefore, even if the solder pin 8 is shifted from the hole 7h, the solder pin guide 12 corrects the shift. Furthermore, in the solder pin holding portion 11, the flexible portion 10 including the upper socket 16 and the coil spring 17 holds the position of the solder pin 8 relative to the lower socket 18 fixed to the actuator 13 in a relatively displaceable manner. As a result, even when the solder pin guide 12 is shifted from the hole 7h in addition to the shift of the solder pin 8 with respect to the hole 7h, the solder pin 8 can be made to follow the solder pin guide 12 and the hole 7h. The method is to insert the solder pin 8 while changing the posture. Therefore, the new solder pin 8 can be automatically attached to the wire bonding device 1 without relying on the operator's hand.

As mentioned above, although the embodiment of this invention was described, it is not limited to the said embodiment, It can implement in various forms.

<Modification 1>

In the embodiment, as the first force generating unit and the second force generating unit, an ultrasonic drive motor based on the principle of an impact drive method using the law of inertia is exemplified. However, the first force generating portion and the second force generating portion are not limited to this configuration, and as long as they can generate a force along a predetermined direction, they can be used as the first force generating portion and the second force generating portion. For example, as the first force generating portion and the second force generating portion, linear guides using ball screws may also be used.

<Modification 2>

The solder pin holding part only needs to be held in a state in which the posture of the solder pin 8 can be flexibly changed. Therefore, it is not limited to the configuration of the solder pin holding portion, and the solder pin holding portion 11A of the modified example shown in FIG. 16 may be adopted.

The solder pin holding part 11A has a metal pipe 42, a silicone resin hose 43, and a cover 44 as main components. The pipe 42 has a cylindrical shape, and houses a hose 43 inside. One end of the pipe 42 and one end of the hose 43 are closed by a cover 44. The cover 44 is held by the holder 14. The upper end 43a (upper end opening edge) of the hose 43 is substantially identical to the upper end 42a of the pipe 42. In addition, the outer diameter of the hose 43 is smaller than the inner diameter of the pipe 42. In other words, a slight gap is formed between the outer peripheral surface of the hose 43 and the inner peripheral surface of the pipe 42. In addition, at the upper end 43a of the hose 43, the tapered surface 8a of the welding needle 8 is held.

According to this solder pin holder 11A, the hose 43 has predetermined flexibility. Therefore, to the extent of the gap formed between the outer circumferential surface of the hose 43 and the inner circumferential surface of the pipe 42, the solder pin holder 11A can allow the posture of the solder pin 8 to be changed. Specifically, eccentricity and inclination in the direction crossing the axis 42A of the pipe 42 can be tolerated.

Here, in the case of only the hose 43, depending on the posture of the soldering needle 8, insufficient rigidity of the hose 43 may occur, and the soldering needle 8 may not be held. However, on the outside of the hose 43, there is a pipe 42 with higher rigidity than the hose 43. Therefore, even when the rigidity of the hose 43 is insufficient, the displacement of the welding needle 8 can be restricted to the allowable range by the pipe 42 .

Furthermore, in the state in which the welding needle 8 is inserted in the hose 43, the contact state of the inner peripheral edge of this upper end 43a and the tapered surface 8a becomes a line contact. Therefore, the Similarly, the solder pin holding portion 11A may hold the solder pin 8 obliquely.

<Modification 3>

The solder pin guide portion 12 makes the solder pin 8 contact the wall surface of the tapered hole portion 12t and the wall surface of the parallel hole portion 12p while guiding the solder pin 8 to the hole 7h of the ultrasonic welding head 7. As shown in FIG. 17, the tapered hole part 12t and the parallel hole part 12p have the opening part 12e in the front end surface 12c. According to this shape, when the solder pin 8 is gradually moved upward, the solder pin 8 is not supported in the front (X-axis direction), so the solder pin 8 may be inclined to the opposite side with respect to the wall surface 12W (see FIG. 19). Therefore, the solder pin guide 12S of the modified example can prevent the inclination of the solder pin 8 from occurring, and further reliably insert the solder pin 8 into the hole 7h of the ultrasonic horn 7.

As shown in FIGS. 17, 18, and 19, the solder pin guide 12S has a guide hole 12h that guides the solder pin 8 to the hole 7h. The guide hole 12h includes a tapered hole portion 12t (first hole portion) and a parallel hole portion 12p (second hole portion) arranged along the insertion direction (Z-axis direction) of the solder pin 8. Furthermore, the solder pin guide portion 12 includes a tapered portion 51 in which a tapered hole portion 12t is formed, and a parallel guide portion 52 in which a parallel hole portion 12p is formed.

The tapered hole portion 12t is a mortar-shaped tapered hole whose diameter decreases in the insertion direction (Z-axis direction). The insertion direction here means a direction from the lower surface 12b to the upper surface 12a. In addition, the parallel hole portion 12p is arranged coaxially with the hole 7h, and the solder pin 8 is guided so as to be along the axis 12A of the parallel hole portion 12p (see FIGS. 18 and 19). The "coaxial" here is not limited to the fact that the axis 12A of the parallel hole portion 12p and the axis 7A of the hole 7h are completely coincident (coincident). The so-called "coaxial" means the positional relationship in which the solder pin 8 can be inserted from the parallel hole portion 12p to the axis of the hole 7h, allowing the solder pin 8 to be inserted The axis lines in the configuration of the parallel hole 12p inserted into the hole 7h are offset from each other.

Then, the solder pin guide 12S has a pair of coil springs 53. The coil spring 53 applies a force to the solder pin 8 inserted into the parallel hole portion 12p in the direction intersecting the axis 12A (the in-plane direction of the XY plane). The coil spring 53 is provided in the parallel guide portion 52. Specifically, it is inserted into the hole 52h provided in the parallel guide portion 52. The coil spring 53 supports the solder pin 8 located in the parallel guide 52.

The coil spring 53 is arranged such that its axis L53 is parallel to the XY plane. In addition, the axis L53 of the coil spring 53 is located at a twisted position with respect to the axis 12A. The point P12 of the wall surface 12W that the solder pin 8 can abut, the axis 12A of the parallel hole portion 12p, and the point P53 of the coil spring 53 that can abut the solder pin 8 are arranged on the radial line passing through the axis 12A of the parallel hole portion 12p On 12K.

The coil spring 53 has a coefficient of elasticity that can maintain its shape in a state where there is no external force (hereinafter referred to as a "natural state"). Specifically, when the coil spring 53 is held so that its axis L53 coincides with the horizontal direction, significant deflection does not occur in the vertical direction. Then, when the coil spring 53 receives an external force in a direction intersecting the axis L53, a reaction force opposite to the external force is generated.

As shown in FIG. 19, the solder pin 8 is inserted in the area S surrounded by the wall surface 12W of the parallel hole part 12p and the coil spring 53. The distance M1 between the coil spring 53 and the wall surface 12W is slightly smaller than the diameter of the solder pin 8. Then, when the solder pin 8 is inserted in the region S, the solder pin 8 presses the coil spring 53 toward the side opposite to the wall surface 12W (that is, the opening 12e side) (force F1). In response to this force F1, the coil spring 53 generates a reaction force F2. With this reaction force F2, the solder pin 8 is pressed against the wall surface 12W.

Therefore, in the parallel hole portion 12p, the outer peripheral surface 8t of the solder pin 8 is in contact with the wall surface 12W. That is, in a state where the outer peripheral surface 8t of the solder pin 8 is in contact with the wall surface 12W, the solder pin 8 gradually slides in the direction of the axis 12A. As a result, the welding needle 8 can move in a stable state without being inclined with respect to the axis 12A, and therefore the welding needle 8 can be guided to the hole 7h of the ultrasonic welding head 7 more reliably.

Furthermore, the coil spring 53 as the urging member shown in FIGS. 17, 18, 19, etc. is an example, and the configuration of the urging member is not limited to this coil spring 53. The urging member can be suitably adopted as long as it can press the solder pin 8 toward the wall surface 12W of the parallel hole portion 12p.

8‧‧‧Solder pin

8A, 16A, 17A, 18A‧‧‧Axis

8a‧‧‧Cone

8b‧‧‧Solder pin body

10‧‧‧Flexible part

11‧‧‧Solder pin holder

14‧‧‧ Holder

16‧‧‧on socket

16a, 18a‧‧‧upper end

16b, 18b‧‧‧lower end surface

16c‧‧‧Counterbore

16d, 18d‧‧‧step difference

16e, 18e‧‧‧small diameter part

16h‧‧‧Through hole

17‧‧‧Coil spring

18‧‧‧Under socket

18f‧‧‧Large diameter part

19‧‧‧O-ring

CL‧‧‧Contact line

Claims (9)

A wire bonding device includes: a welding needle holding part that can be detachably held, and an actuator, which inserts the welding needle held by the welding needle holding part into a welding needle holding hole of a bonding tool, Moving the solder pin holding portion holding the solder pin in a predetermined direction; and a solder pin guide portion arranged between the solder pin holding portion and the bonding tool, accompanied by the solder pin holding portion The movement of the solder pin guides the solder pin to the solder pin holding hole, and the solder pin holder has a solder pin base portion fixed to the actuator, and the solder pin is relative to the solder pin The position of the base is a flexible part that can be relatively displaced. The wire bonding device according to claim 1, wherein the actuator has: a base part; and a moving body disposed on the base part, the solder pin holder is mounted and the welding The needle holding part moves, and the soldering needle guide part is fixed to the base part. The wire bonding device according to item 1 or item 2 of the scope of patent application, wherein the flexible portion has: an elastic portion, one end of which is fixed to the base of the solder pin; and The restricting part is provided at the other end of the elastic part and restricts the welding pin. The wire bonding device according to the third item of the scope of patent application, wherein the restricting portion is in line contact with the tapered surface of the welding needle. According to the wire bonding device described in item 3 of the scope of patent application, the restricting portion is an annular O-ring, and the elastic portion is a coil spring. The wire bonding device described in claim 3, wherein the welding needle holding part has: a hose including an upper end opening edge as the restriction part and a main body part as the elastic part; The lower end of the hose is closed; and a cylindrical pipe, the lower end is closed by the cover, and the hose is accommodated. The rigidity of the pipe is higher than that of the hose, and the inner peripheral surface of the pipe is in contact with the soft There is a gap between the outer circumference of the pipe. A wire bonding device includes: a welding needle holding part that can be detachably held, and an actuator, which inserts the welding needle held by the welding needle holding part into a welding needle holding hole of a bonding tool, Moving the solder pin holding portion holding the solder pin in a predetermined direction; and a solder pin guide portion arranged between the solder pin holding portion and the bonding tool, accompanied by the solder pin holding portion To guide the solder pin to the solder pin holding hole, The solder pin guide portion is provided with a guide hole for guiding the solder pin to the solder pin holding hole, and the solder pin guide portion has: an urging member for urging the solder inserted into the guide hole The needle provides a force toward a direction crossing the axis of the guide hole. The wire bonding device according to claim 7, wherein the guide hole includes a first hole portion and a second hole portion arranged along the insertion direction of the solder pin, and the first hole portion has a diameter facing The tapered hole with a smaller insertion direction, the second hole portion is arranged coaxially with the solder pin holding hole, and the solder pin is guided along the axis of the solder pin holding hole. The wire bonding device according to claim 8, wherein the solder needle guide includes a tapered portion formed with the first hole portion and a guide portion formed with the second hole portion, and the force The member is provided in the guide part.

Images