KR101806147B1 - A system for exchanging capillary automatically - Google Patents
A system for exchanging capillary automatically Download PDFInfo
- Publication number
- KR101806147B1 KR101806147B1 KR1020150171753A KR20150171753A KR101806147B1 KR 101806147 B1 KR101806147 B1 KR 101806147B1 KR 1020150171753 A KR1020150171753 A KR 1020150171753A KR 20150171753 A KR20150171753 A KR 20150171753A KR 101806147 B1 KR101806147 B1 KR 101806147B1
- Authority
- KR
- South Korea
- Prior art keywords
- capillary
- clamping
- loader
- unit
- air supply
- Prior art date
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
- H01L2224/78308—Removable capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
A clamping loader installed on the system main body and having a loader clamping portion for clamping the capillary at a front end; a capillary supply and recovery unit for supplying and recovering the capillary by air pressure with a clamping loader; And a capillary releasing device for unclamping the capillary from the capillary.
Description
The present invention relates to a capillary automatic replacement system capable of automatically replacing a capillary.
A wire bond process is one of the processes for fabricating a semiconductor package. A semiconductor chip and a substrate are connected by a gold wire so that electrical signals can flow Refers to a process in which a semiconductor has electrical characteristics.
The capillary used in the wire bonding process is a tool used to directly bond the gold wire and to make a wire loop. As an example of a sewing machine used for making clothes, a capillary that acts like a needle is a gold wire that corresponds to a thread.
The capillary is a consumable item that has a limit on usage and needs to be replaced in accordance with the usage limit. In the conventional capillary replacement process, when the capillary usage limit value is inputted to the wire bond equipment and the usage limit value is reached, the wire bond equipment generates an alarm and calls the operator. Thereafter, the operator initializes the amount of capillary used in the warning wire bond equipment, removes the fixing screw fixing the capillary, and mounts the new capillary. That is, the conventional capillary replacement is performed manually Which is a substantial part of the process.
Actually, in the actual semiconductor packaging process field, the number of the wire bond equipment reaches hundreds because of the characteristic of the wire bond process. Therefore, it is necessary to replace the capillaries of the various equipment in the wire bond process. In addition, since the fixing screw for fixing the capillary is removed and reinstalled, it takes a lot of time, which leads to a lot of time and cost loss in the capillary replacement process.
SUMMARY OF THE INVENTION It is an object of the present invention to provide a system capable of automatically and automatically replacing a capillary.
According to an aspect of the present invention, there is provided a capillary automatic replacement system comprising: a clamping loader installed on a system body and having a loader clamping part for clamping a capillary at a tip end; A capillary supply and recovery unit for supplying and recovering the capillary by the air pressure with the clamping loader; And a capillary releasing device for unclamping the clamped capillary of the clamping loader.
Here, the capillary releasing device may include a release pin for changing the loader clamping portion to a release position when the capillary releasing device is pivoted while being inserted into a release pin engaging portion formed adjacent to the loader clamping portion of the clamping loader; An x-axis driving unit installed in an apparatus frame installed on an upper portion of the system body, for driving the releasing pin toward and away from the clamping loader in the x-axis; A y-axis driving unit installed in the x-axis driving unit for driving the releasing pin in the y-axis direction so as to be inserted into and separated from the releasing pin engaging portion; A rotation bar having one end rotatably connected to the y-axis drive unit; A pin support bar rotatably connected to the other end of the rotation bar and coupled to the release pin; And a spring connecting the pin support bar and the rotation bar.
The capillary supply and recovery unit may further include: a capillary transfer tube connected to a lower portion of the clamping loader; A capillary loading and unloading unit for moving the capillary to be supplied to the capillary transfer tube and collecting the capillary collected through the capillary transfer tube recovered from the clamping loader; An air supply and suction unit for providing discharge pressure and suction pressure to the capillary transfer tube; And a drive unit for connecting and disconnecting the capillary transfer tube and the air supply and suction unit from each other based on the capillary loading and unloading unit.
The clamping loading and unloading unit may include a capillary loading and unloading jig rotatably installed in a support housing fixed to a vertical frame installed in the system body, A jig rotation driving unit for rotationally driving the capillary loading and unloading jig; A plurality of capillary mounts installed at regular intervals along the circumferential direction on an upper portion of the capillary loading and unloading jig and having capillaries to be fed and capillaries to be collected; And a lower contact member located at a lower portion of the capillary loading and unloading jig corresponding to the capillary mounting portion and communicating with the capillary mounting portion, And the air supply and suction unit is capable of contacting and separating from the lower tight contact member.
The capillary conveying pipe may include a fixing pipe supported by a supporting bar provided on the system body and corresponding to a lower portion of the clamping unit of the clamping loader, A movable tube supported by the drive unit and driven to move toward and away from the capillary mount; And a connection pipe connecting between the fixed pipe and the movable pipe.
The air supply and suction unit may include an air supply nozzle installed in contact with and spaced from the lower close contact member in the support housing; A vacuum pump for supplying and sucking vacuum pressure to the air supply nozzle; And an air supply pipe connecting the air supply nozzle and the vacuum pump.
The driving unit may further include: a first movable member movably installed in the vertical frame to move the capillary transfer tube in contact with and spaced from the capillary mounting portion; A second movable member having the vertical frame movably installed to move the air supply nozzle in close contact with and away from the lower contact member; A connecting member connecting the first and second movable members; And an actuator installed in the vertical frame to reciprocate the first and second movable members.
According to the capillary automatic replacement system of the present invention, since the capillary is supplied or recovered by using the air pressure, the capillary can be supplied and recovered in a clamped state, It is possible to reduce the risk of malfunction due to the occurrence of an error or interruption of the operation.
Further, the releasing device of the present invention is advantageous in that the system is simple, miniaturized, and lightweight because the releasing device of the present invention is made by simple configuration and operation.
1 is a schematic plan view showing a capillary automatic replacement system according to an embodiment of the present invention.
FIGS. 2 to 12 are views for explaining a process of automatically replacing the capillary using the capillary automatic replacement system shown in FIG. 1. FIG.
13 is a partially enlarged view for explaining an enlarged view of the clamping loader shown in Fig.
14 and 15 are front views for explaining the operation of the capillary supplying and collecting unit.
16 is a left side view of the capillary feeding and collecting unit shown in Fig.
17 and 18 are schematic plan views for explaining the operation of the capillary feeding and collecting unit shown in Fig.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a capillary automatic exchange system according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.
1 to 18, the capillary automatic replacement system according to the embodiment of the present invention includes a
The
The capillary supply and
The
The capillary loading and
The capillary loading and unloading
Therefore, as shown in Figs. 14 and 16, the
The air supply and
The
One end of the
The
The
The first
The second
The connecting
The
According to the capillary supplying and collecting
When the
In this state, when the
When the
In the capillary loading and
The capillary releasing
The
The y-
The y-
One end of the
According to the capillary automatic replacement system of the present invention having the above-described configuration, the
In this state, the
8, the capillary 10, which has been coupled to the
Then, the
After the
Then, as shown in FIG. 11, the y-
According to the capillary automatic replacement system of the present invention having the above-described configuration, the capillary can be supplied or recovered using the air pressure. In this case, the capillary supplied or recovered by the air pressure is not precisely controlled in position, compared with the case where the capillary is conventionally loaded and unloaded by a mechanical clamper to be supplied and recovered, It can enter the
Therefore, it is possible to solve the malfunction, the failure, and the pause operation of the apparatus due to the mechanical operation error during the operation of the system, so that the reliability of the product can be improved and the workability can be improved.
While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. Those skilled in the art will readily appreciate that many modifications and variations of the present invention are possible without departing from the spirit and scope of the appended claims.
10.
100 ..
200 ..
220 ..y
240 ..
260 .. Release pin
Claims (7)
A capillary supply and recovery unit for supplying and recovering the capillary by the air pressure with the clamping loader; And
And a capillary releasing device for unclamping the clamped capillary of the clamping loader,
The capillary supply and recovery unit includes:
A capillary transfer pipe connected to a lower portion of the clamping loader;
A capillary loading and unloading unit for moving the capillary to be supplied to the capillary transfer tube and collecting the capillary collected through the capillary transfer tube recovered from the clamping loader;
An air supply and suction unit for providing discharge pressure and suction pressure to the capillary transfer tube;
And a drive unit for connecting and disconnecting the capillary transfer tube and the air supply and suction unit to each other based on the capillary loading and unloading unit.
A release pin for changing the loader clamping portion to a release posture when it is pivoted while being inserted into a release pin engagement portion formed adjacent to the loader clamping portion of the clamping loader;
An x-axis driving unit installed on an apparatus frame installed on an upper portion of the system body, for driving the releasing pin toward and away from the clamping loader in the x-axis;
A y-axis driving unit installed in the x-axis driving unit for driving the releasing pin in the y-axis direction so as to be inserted into and separated from the releasing pin engaging portion;
A rotation bar having one end rotatably connected to the y-axis drive unit;
A pin support bar rotatably connected to the other end of the rotation bar and coupled to the release pin; And
And a spring connecting the pin support bar and the pivot bar.
A capillary loading and unloading jig rotatably installed in a support housing fixed to a vertical frame installed in the system body;
A jig rotation driving unit for rotationally driving the capillary loading and unloading jig;
A plurality of capillary mounts installed at regular intervals along the circumferential direction on an upper portion of the capillary loading and unloading jig and having capillaries to be fed and capillaries to be collected; And
And a lower contact member located at a lower portion of the capillary loading and unloading jig corresponding to the capillary mounting portion and communicating with the capillary mounting portion,
The capillary transfer tube being accessible and spaced to receive a capillary mounted on the capillary mount,
Wherein the air supply and suction portions are in contact with and spaced from the lower contact member.
A fixing pipe supported on a support bar installed in the system body and corresponding to a lower portion of a clamping portion of the clamping loader;
A movable tube supported by the drive unit and driven to move toward and away from the capillary mount; And
And a connection pipe connecting the fixed pipe and the movable pipe.
An air supply nozzle installed in the support housing so as to be in contact with and spaced from the lower close contact member;
A vacuum pump for supplying and sucking vacuum pressure to the air supply nozzle; And
And an air supply pipe connecting the air supply nozzle and the vacuum pump.
A first movable member movably installed on the vertical frame so as to move the capillary transfer tube in contact with and spaced from the capillary mount;
A second movable member having the vertical frame movably installed to move the air supply nozzle in close contact with and away from the lower contact member;
A connecting member connecting the first and second movable members; And
And an actuator installed in the vertical frame to reciprocate the first and second movable members.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020150129419 | 2015-09-14 | ||
KR20150129419 | 2015-09-14 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20170032145A KR20170032145A (en) | 2017-03-22 |
KR101806147B1 true KR101806147B1 (en) | 2017-12-11 |
Family
ID=58497226
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020150171753A KR101806147B1 (en) | 2015-09-14 | 2015-12-03 | A system for exchanging capillary automatically |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR101806147B1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102338722B1 (en) * | 2017-04-05 | 2021-12-15 | 삼성전자주식회사 | Method for exchanging capillary |
KR102451574B1 (en) * | 2018-01-30 | 2022-10-06 | 가부시키가이샤 신가와 | Wire bonding device |
JP7321492B2 (en) * | 2018-01-30 | 2023-08-07 | 株式会社新川 | wire bonding equipment |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101352586B1 (en) | 2011-11-10 | 2014-01-20 | 주식회사 일원 | A system for exchanging capillary automatically |
-
2015
- 2015-12-03 KR KR1020150171753A patent/KR101806147B1/en active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
KR20170032145A (en) | 2017-03-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR101806147B1 (en) | A system for exchanging capillary automatically | |
US8672210B2 (en) | Capillary exchange system of semiconductor wire bonding | |
US7370895B2 (en) | Work transfer device and method of transferring work | |
KR100609356B1 (en) | Conclusion of lens and assembly device for mobile phon | |
KR20150010629A (en) | Cutting machine | |
KR20150010586A (en) | Cutting device | |
TWI673806B (en) | Apparatus of thermocompression bonding | |
US20140109398A1 (en) | Automatic capillary replacement system | |
JP5278370B2 (en) | Electronic component mounting apparatus and electronic component mounting method | |
KR20140056730A (en) | Method of mounting a collet to a pickup head | |
KR20190049229A (en) | Hose fastening band automatic assembling device and its process | |
KR101352586B1 (en) | A system for exchanging capillary automatically | |
JP5410388B2 (en) | Chip holding device, chip supply device and chip mounting machine | |
JP6467622B2 (en) | Component crimping device | |
TWI656243B (en) | Automated substrate support carrier | |
JP2015056574A (en) | Mount head and part mounting apparatus | |
KR100411299B1 (en) | Nozzle assembly for device picker in semiconductor test handler | |
CN104956785A (en) | Die supply device | |
JP2000334628A (en) | Assembly device for vehicuiar lighting fixture | |
JP5652868B2 (en) | Wafer pallet, component mounter, and dicing sheet mounting method | |
KR101624698B1 (en) | Apparatus to supply welding tips | |
CN108142002B (en) | Electronic component mounting device and barrel member for electronic component mounting device | |
KR102346556B1 (en) | Automated device for fastening washer of backboard for vehicle seat | |
KR101368900B1 (en) | Bonding Apparatus for Flexible Display Panel | |
JP2015056573A (en) | Mount head and part mounting apparatus |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant |