TWI704861B - Anti-vibration and heat dissipation structure of memory slot - Google Patents
Anti-vibration and heat dissipation structure of memory slot Download PDFInfo
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Abstract
本發明係提供一種記憶體插槽抗震與散熱結構,係包括電路板、散熱墊片及散熱殼體,該電路板表面設有供複數記憶體模組插置之複數記憶體插槽;該複數散熱墊片設置該些記憶體模組之上、下表面,以使該些記憶體模組所產生熱量經由該散熱墊片向上傳遞,經由複數層該記憶體模組及該散熱墊片交疊結構,傳導至最上層的該散熱墊片,該散熱殼體具有維修窗口及設於維修窗口之蓋板,該蓋板底面抵持於最上層的該散熱墊片以形成垂直限位及抗震結構,並將該些記憶體模組產生熱量經由該蓋板傳導至該散熱殼體以進行散熱,並同時透過該維修窗口達到記憶體模組易於做檢修之目的。 The present invention provides an anti-vibration and heat dissipation structure of a memory slot, which includes a circuit board, a heat dissipation pad and a heat dissipation shell. The surface of the circuit board is provided with a plurality of memory slots for inserting a plurality of memory modules; The heat dissipation pads are arranged on the upper and lower surfaces of the memory modules, so that the heat generated by the memory modules is transferred upward through the heat dissipation pads, and the memory modules and the heat dissipation pads overlap through a plurality of layers Structure, conducted to the heat dissipation gasket on the uppermost layer, the heat dissipation housing has a maintenance window and a cover plate arranged on the maintenance window, and the bottom surface of the cover plate abuts against the heat dissipation gasket on the uppermost layer to form a vertical limit and seismic structure , And conduct the heat generated by the memory modules to the heat dissipation shell through the cover plate for heat dissipation, and at the same time, achieve the purpose of easy maintenance of the memory modules through the maintenance window.
Description
本發明係提供一種記憶體插槽抗震與散熱結構,尤指一種將複數記憶體模組產生熱量經由蓋板傳導至散熱殼體以進行散熱,並同時透過維修窗口達到記憶體模組易於做檢修之目的。 The present invention provides an anti-vibration and heat dissipation structure for a memory slot, in particular, a heat generated by a plurality of memory modules is conducted to a heat dissipation shell through a cover plate for heat dissipation, and at the same time, the memory module can be easily inspected and repaired through a maintenance window. The purpose.
按,現今電子科技以飛快創新速度成長,而使個人電腦(PC)、筆記型電腦或平板電腦之各種型態電腦設備存在於各個角落中,朝向運算能力強及體積輕巧的方向前進。隨著電腦設備開放架構下及軟、硬體之標準化,輔以功能不斷擴充及升級,適用於各個專利業領域之工業電腦便誕生焉,而工業電腦主要應用包括工業控制/自動化設備、網路及通訊設備、影像偵測辨識及智慧運輸系統。往更高的階層走,亦可用於軍事、交通運輸與航太領域等需要高可靠度及穩定度之相關產業應用,而工業電腦皆需滿足相關特定規格及於嚴苛環境中執行各項高效能運作之要求。 According to, electronic technology is growing at a rapid rate of innovation, and various types of computer equipment such as personal computers (PC), notebook computers or tablet computers exist in every corner, moving towards the direction of strong computing power and compact size. With the open architecture of computer equipment and the standardization of software and hardware, supplemented by the continuous expansion and upgrade of functions, industrial computers suitable for various patent fields were born. The main applications of industrial computers include industrial control/automation equipment and networks And communication equipment, image detection and identification and intelligent transportation system. Going to a higher level, it can also be used in military, transportation, and aerospace fields that require high reliability and stability. Industrial computers need to meet specific specifications and perform various efficiently in harsh environments. Requirements for operation.
再者,工業電腦尚包括如單板電腦(Single Board Computer,SBC)、嵌入式電腦模組(Computer On Module,COM)、基板模組(Back Plane Module,BPM),其中嵌入式電腦模組 (COM)為配備熱源元件(CPU)、晶片組(Chipset)、輸入/輸出埠(I/O Port)及內置電源輸入(Power Supply),並通過記憶體模組與硬碟驅動結合所有系統介面與設計功能,提供隨插即用(PNP)的硬體平台及附加功能的擴充槽,且尺寸比個人電腦主機板更小,而使嵌入式電腦模組在各種固定及移動式嵌入式系統與工業級應用中更具有彈性。但因嵌入式電腦模組尺寸小及運作速度快的特性,其所累積的熱量更甚於一般主機板,而更需要良好散熱結構。 Furthermore, industrial computers still include single board computers (SBC), embedded computer modules (Computer On Module, COM), backplane modules (Back Plane Module, BPM), among which embedded computer modules (COM) is equipped with heat source components (CPU), chipset (Chipset), input/output ports (I/O Port) and built-in power input (Power Supply), and integrates all system interfaces through memory modules and hard disk drives And design functions, provide a plug-and-play (PNP) hardware platform and additional function expansion slots, and the size is smaller than the personal computer motherboard, so that the embedded computer module can be used in various fixed and mobile embedded systems and It is more flexible in industrial applications. However, due to the small size and fast operating speed of the embedded computer module, the heat accumulated is more than that of the general motherboard, and a good heat dissipation structure is required.
一般小外型雙列直插式記憶體模組插槽(Small Outline Dual In-line Memory Module Socket,SO-DIMM Socket)常應用於空間受限之工業電腦或軍規電腦中,而該些電腦對於環境抗震與散熱上的要求,相較於一般電腦使用條件更為嚴苛,而如何開發針對SO-DIMM Socket結構進行防震及散熱之結構設計,同時當記憶體模組發生故障時易於做檢修,即為本發明之創作標的。 Generally, the Small Outline Dual In-line Memory Module Socket (SO-DIMM Socket) is often used in industrial computers or military computers with limited space. The environmental shock resistance and heat dissipation requirements are more stringent than the general computer usage conditions. How to develop a structural design for the SO-DIMM Socket structure for shock resistance and heat dissipation, and at the same time, it is easy to perform maintenance when the memory module fails. This is the subject of the invention.
故,發明人有鑑於上述習用之問題與缺失,乃搜集相關資料經由多方的評估及考量,並利用從事於此行業之多年研發經驗不斷的試作與修改,始有此種記憶體插槽抗震與散熱結構發明專利誕生。 Therefore, in view of the above-mentioned conventional problems and deficiencies, the inventor collected relevant information through multiple evaluations and considerations, and used years of research and development experience in this industry to make continuous trials and modifications. The invention patent for heat dissipation structure was born.
本發明之主要目的提出一種記憶體插槽抗震與散熱結構,係包括電路板、散熱墊片及散熱殼體,該電路板表面設有供複數記憶體模組插置之複數記憶體插槽;該複數散熱墊片設置該些記憶體模組之上、下表面,以使該發熱晶片及該些記憶體模組所產生熱量經由該散熱墊片向上 傳遞,經由複數層該記憶體模組及該散熱墊片交疊結構,傳導至最上層的該散熱墊片,該散熱殼體具有維修窗口及設於維修窗口之蓋板,該蓋板底面抵持於最上層的該散熱墊片以形成垂直限位及抗震結構,並將該些記憶體模組產生熱量經由該蓋板傳導至該散熱殼體以進行散熱,並同時透過該維修窗口達到記憶體模組易於做檢修之目的。 The main purpose of the present invention is to provide a memory slot anti-vibration and heat dissipation structure, which includes a circuit board, a heat dissipation pad and a heat dissipation shell. The surface of the circuit board is provided with a plurality of memory slots for inserting a plurality of memory modules; The plurality of heat-dissipating pads are arranged on the upper and lower surfaces of the memory modules, so that the heat generated by the heat-generating chip and the memory modules goes upward through the heat-dissipating pads Transfer, through a plurality of layers of the memory module and the heat-dissipating gasket overlapping structure, to the heat-dissipating gasket of the uppermost layer. The heat-dissipating shell has a repair window and a cover plate arranged on the repair window, and the bottom surface of the cover plate is against The heat dissipating gasket held on the uppermost layer forms a vertical limit and anti-vibration structure, and conducts the heat generated by the memory modules to the heat dissipating shell through the cover plate for heat dissipation, and at the same time reaches the memory through the maintenance window The body module is easy to do for the purpose of maintenance.
本發明之次要目的在於該蓋板之相對二側各向下延伸有一限位懸臂,該些限位懸臂用以抵持限位於該些記憶體插槽二側所設置一旋臂外側,以形成對該些記憶體模組及該些散熱墊片之水平限位結構。 The secondary purpose of the present invention is to extend downwards on two opposite sides of the cover plate with a limiting cantilever, and the limiting cantilevers are used to resist and limit the outer side of a rotating arm provided on the two sides of the memory slots to A horizontal limit structure for the memory modules and the heat dissipation pads is formed.
本發明之另一目的在於該散熱殼體於該維修窗口周邊凹設有至少一個定位槽,該定位槽中設有至少一固定孔,且該定位槽係供該蓋板對應所設置之一固定凸片做一定位,該固定凸片中設有至少一穿孔以供一固定件穿置且固定於該定位槽之該固定孔中,以形該蓋板與該散熱殼體之固定結構。 Another object of the present invention is that the heat dissipation housing is recessed with at least one positioning groove on the periphery of the maintenance window, the positioning groove is provided with at least one fixing hole, and the positioning groove is used for fixing a corresponding one of the cover plates. The convex piece is positioned, and the fixing convex piece is provided with at least one through hole for a fixing member to penetrate and be fixed in the fixing hole of the positioning groove to form a fixing structure of the cover plate and the heat dissipation housing.
本發明之再一目的在於該些記憶體插槽設置於該電路板上係呈一斜向疊置結構。 Another object of the present invention is that the memory slots are arranged on the circuit board in an obliquely stacked structure.
1‧‧‧電路板 1.‧‧Circuit board
11‧‧‧記憶體模組 11‧‧‧Memory Module
12‧‧‧記憶體插槽 12‧‧‧Memory slot
121‧‧‧旋臂 121‧‧‧Spiral arm
13‧‧‧發熱晶片 13‧‧‧Heating chip
2‧‧‧散熱墊片 2‧‧‧Thermal Gasket
3‧‧‧散熱殼體 3‧‧‧Radiating shell
30‧‧‧維修窗口 30‧‧‧Maintenance Window
31‧‧‧蓋板 31‧‧‧Cover
310‧‧‧穿孔 310‧‧‧Perforation
311‧‧‧限位懸臂 311‧‧‧Limiting Cantilever
312‧‧‧固定凸片 312‧‧‧Fixed tab
313‧‧‧固定件 313‧‧‧Fixture
32‧‧‧定位槽 32‧‧‧Locating slot
320‧‧‧固定孔 320‧‧‧Fixed hole
33‧‧‧導熱元件 33‧‧‧Thermal element
34‧‧‧散熱膏 34‧‧‧Thermal paste
第一圖 係為本發明之立體外觀圖。 The first figure is a perspective view of the present invention.
第二圖 係為本發明之立體分解結構圖。 The second figure is a three-dimensional exploded structure diagram of the present invention.
第三圖 係為本發明之另一立體分解結構圖。 The third figure is another three-dimensional exploded structural view of the present invention.
第四圖 係為本發明之立體剖面結構圖。 The fourth figure is a three-dimensional cross-sectional structure diagram of the present invention.
為達成上述目的及功效,本發明所採用之技術手段及其構造,茲繪圖就本發明之較佳實施例詳加說明其構造與功能如下,俾利完全瞭解。 In order to achieve the above-mentioned purpose and effect, the technical means and structure adopted by the present invention are illustrated in detail below to explain the structure and function of the preferred embodiment of the present invention in order to fully understand.
請參閱第一至四圖所示,各為本發明之立體外觀圖、立體分解結構圖、另一立體分解結構圖及立體剖面結構圖,由圖中可看出本發明之記憶體插槽抗震與散熱結構設包括有電路板1、散熱墊片2及散熱殼體3,各構件之較為詳細結構與連接關係解說如下:
Please refer to Figures 1 to 4, each of which is a three-dimensional appearance view, a three-dimensional exploded structure view, another three-dimensional exploded structure view, and a three-dimensional cross-sectional structure view of the present invention. From the figures, it can be seen that the memory slot of the present invention is shock-resistant The heat dissipation structure includes a
該電路板1表面設有供複數記憶體模組11插置之複數記憶體插槽12,該些記憶體插槽12呈一疊置結構,該記憶體模組11係指一小外型雙列直插式記憶體模組(Small Outline Dual In-line Memory Module,SO-DIMM),而該電路板1上於該些記憶體插槽12之一側設有至少一發熱晶片13。
The surface of the
該些記憶體插槽12設置於該電路板1上係呈一斜向疊置結構。
The
該些散熱墊片2設置該些記憶體模組11及該發熱晶片13之上表面,以使該些記憶體模組11所產生熱量經由該散熱墊片2向上傳遞,經由複數層該記憶體模組11及該散熱墊片2交疊結構,傳導至最上層的該散熱墊片2,而該散熱墊片2係由具緩衝性及吸震之材料所構成。
The heat-dissipating
該散熱殼體3組裝於該電路板1之上方,該散熱殼體3對應該些記憶體模組11處設有一維修窗口30,且該散熱殼體3對應於該
維修窗口30組裝有一蓋板31,該蓋板31底面抵持於最上層的該散熱墊片2以形成垂直限位及抗震結構,並將該些記憶體模組11產生熱量經由該蓋板31傳導至該散熱殼體3以進行散熱。
The
該蓋板31之相對二側各向下延伸有一限位懸臂311,該些限位懸臂311用以抵持限位於該些記憶體插槽12二側所設置一旋臂121外側,以形成對該些記憶體模組11及該些散熱墊片2之水平限位結構。
A
該散熱殼體3於該維修窗口30周邊凹設有至少一個定位槽32,該定位槽32中設有至少一固定孔320,且該定位槽32係供該蓋板31對應所設置之一固定凸片312做一定位,該固定凸片312中設有至少一穿孔310以供一固定件313穿置且固定於該定位槽32之該固定孔320中,以形該蓋板31與該散熱殼體3之固定結構。
The
該散熱殼體3底面對應該發熱晶片13位置更係設有一導熱元件33,該導熱元件33係為易於導熱之金屬塊體所構成,該導熱元件33表面更設有抵持於該發熱晶片13上方之一散熱膏34或一相變化材料(Phase Change Material,PCM),以形成該發熱晶片13與該散熱殼體3之間的熱傳導及抗震結構。
A heat-conducting
欲將本發明之記憶體插槽抗震與散熱結構進行組裝及使用時,首先將複數散熱墊片2貼覆複數記憶體模組11之上、下表面,續將該些記憶體模組11插置於電路板1上所設置該些記憶體插槽12後,將記憶體插槽12二側之旋臂由垂直狀態旋動下壓至水平狀態,以形成該些記憶體模組11及該些記憶體插槽12之固定結構,此時該些記憶體模組
11之上表面呈向上斜伸階梯狀結構,而最下方之記憶體模組11上方之散熱墊片2緊貼著上方相鄰記憶體模組11之下表面,利用此種結構即可填補該些記憶體模組11之間隙,並達到緊密傳導熱量之結構,且使該些記憶體模組11所產生熱量經由該散熱墊片2向上傳遞,經由複數層該記憶體模組11及該散熱墊片2交疊結構,傳導至最上層的該散熱墊片2,再將散熱殼體3組裝於該電路板1之上方,該散熱殼體3之蓋板31底面抵持於最上層的該散熱墊片2以形成垂直限位及抗震結構,並將該些記憶體模組11產生熱量經由該蓋板31傳導至該散熱殼體3以進行散熱,且利用蓋板31之二限位懸臂311抵持限位於該些記憶體插槽12之二旋臂121外側,以形成對該些記憶體模組11及該些散熱墊片2之水平限位結構,並同時透過散熱殼體3之維修窗口30達到記憶體模組11易於做檢修之目的,而設置於電路板1上之發熱晶片13,則藉由散熱殼體3底面之導熱元件33及抵持於該發熱晶片13上方之散熱膏34或一相變化材料,以形成該發熱晶片13與該散熱殼體3之間的熱傳導及抗震結構。
To assemble and use the anti-vibration and heat dissipation structure of the memory slot of the present invention, a plurality of
藉由上述第一圖至第四圖之揭露,即可瞭解本發明為一種記憶體插槽抗震與散熱結構,主要包括電路板、散熱墊片及散熱殼體,該電路板表面設有供複數記憶體模組插置之複數記憶體插槽;該複數散熱墊片設置該些記憶體模組之上、下表面,以使該些記憶體模組所產生熱量經由該散熱墊片向上傳遞,經由複數層該記憶體模組及該散熱墊片交疊結構,傳導至最上層的該散熱墊片,該散熱殼體具有維修窗口及設於維修窗口之蓋板,該蓋板底面抵持於最上層的該散熱墊片以形成垂直限位及抗震結 構,並將該些記憶體模組產生熱量經由該蓋板傳導至該散熱殼體以進行散熱,並同時透過該維修窗口達到記憶體模組易於做檢修之目的。而應用於工業電腦或軍規電腦領域中具有極佳的實用性,故提出專利申請以尋求專利權之保護。 According to the disclosure of the first to fourth figures above, it can be understood that the present invention is an anti-vibration and heat dissipation structure of a memory slot, which mainly includes a circuit board, a heat dissipation pad and a heat dissipation shell. The surface of the circuit board is provided with a plurality of A plurality of memory slots into which the memory module is inserted; the plurality of heat dissipation pads are arranged on the upper and lower surfaces of the memory modules, so that the heat generated by the memory modules is transferred upward through the heat dissipation pads, Conducted to the uppermost layer of the heat-dissipating gasket through a plurality of layers of the memory module and the heat-dissipating gasket overlapping structure. The heat-dissipating housing has a repair window and a cover plate arranged on the repair window, and the bottom surface of the cover plate resists The heat dissipation gasket on the top layer forms a vertical limit and anti-vibration junction The heat generated by the memory modules is transferred to the heat dissipation housing through the cover plate to dissipate heat, and at the same time, the memory module can be easily repaired through the repair window. However, it has excellent practicability in the field of industrial computers or military-regulated computers, so a patent application is filed to seek patent protection.
上述詳細說明為針對本發明一種較佳之可行實施例說明而已,惟該實施例並非用以限定本發明之申請專利範圍,凡其他未脫離本發明所揭示之技藝精神下所完成之均等變化與修飾變更,均應包含於本發明所涵蓋之專利範圍中。 The above detailed description is for a preferred and feasible embodiment of the present invention. However, the embodiment is not intended to limit the scope of the patent application of the present invention. All other equal changes and modifications made without departing from the spirit of the technique disclosed in the present invention All changes shall be included in the scope of patent covered by the present invention.
綜上所述,本發明上述之記憶體插槽抗震與散熱結構於使用時為確實能達到其功效及目的,故本發明誠為一實用性優異之發明,實符合發明專利之申請要件,爰依法提出申請,盼 審委早日賜准本案,以保障發明人之辛苦發明,倘若 鈞局有任何稽疑,請不吝來函指示,發明人定當竭力配合,實感德便。 In summary, the above-mentioned anti-vibration and heat dissipation structure of the memory slot of the present invention can indeed achieve its effects and purposes when used. Therefore, the present invention is truly an invention with excellent practicability and meets the requirements of an invention patent. The application is filed in accordance with the law, and I hope that the review committee will grant this case as soon as possible to protect the inventor’s hard work. If there is any doubt, please send me instructions. The inventor will do his best to cooperate, and I feel good.
1‧‧‧電路板 1.‧‧Circuit board
11‧‧‧記憶體模組 11‧‧‧Memory Module
12‧‧‧記憶體插槽 12‧‧‧Memory slot
121‧‧‧旋臂 121‧‧‧Spiral arm
13‧‧‧發熱晶片 13‧‧‧Heating chip
2‧‧‧散熱墊片 2‧‧‧Thermal Gasket
3‧‧‧散熱殼體 3‧‧‧Radiating shell
30‧‧‧維修窗口 30‧‧‧Maintenance Window
31‧‧‧蓋板 31‧‧‧Cover
310‧‧‧穿孔 310‧‧‧Perforation
311‧‧‧限位懸臂 311‧‧‧Limiting Cantilever
312‧‧‧固定凸片 312‧‧‧Fixed tab
313‧‧‧固定件 313‧‧‧Fixture
32‧‧‧定位槽 32‧‧‧Locating slot
320‧‧‧固定孔 320‧‧‧Fixed hole
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TWI785919B (en) * | 2021-12-07 | 2022-12-01 | 索士亞科技股份有限公司 | Anti-vibration heat conduction structure and heat dissipation device thereof |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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EP2947541A2 (en) * | 2014-05-22 | 2015-11-25 | SRC Computers, LLC | System and method for thermally coupling memory devices to a memory controller in a computer memory board |
CN207875431U (en) * | 2018-01-26 | 2018-09-18 | 北京理工华创电动车技术有限公司 | A kind of electric vehicle Power electronics system integration controller |
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EP2947541A2 (en) * | 2014-05-22 | 2015-11-25 | SRC Computers, LLC | System and method for thermally coupling memory devices to a memory controller in a computer memory board |
CN207875431U (en) * | 2018-01-26 | 2018-09-18 | 北京理工华创电动车技术有限公司 | A kind of electric vehicle Power electronics system integration controller |
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---|---|---|---|---|
TWI785919B (en) * | 2021-12-07 | 2022-12-01 | 索士亞科技股份有限公司 | Anti-vibration heat conduction structure and heat dissipation device thereof |
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