CN209911910U - Elastic locking structure of heat radiation module - Google Patents
Elastic locking structure of heat radiation module Download PDFInfo
- Publication number
- CN209911910U CN209911910U CN201920507587.3U CN201920507587U CN209911910U CN 209911910 U CN209911910 U CN 209911910U CN 201920507587 U CN201920507587 U CN 201920507587U CN 209911910 U CN209911910 U CN 209911910U
- Authority
- CN
- China
- Prior art keywords
- heat
- elastic locking
- circuit board
- heat dissipation
- elastic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Abstract
The utility model provides a heat radiation module's elasticity closure structure, including one bear the weight of circuit board, a main circuit board, a heat radiation module and plural elasticity closure, this plural elasticity closure is used for this plural lockhole of bearing the weight of circuit board and this heat radiation module's plural locked groove of cluster lock to it is fixed to make this bear the weight of circuit board, this main circuit board and this heat radiation module form, and this plural elasticity closure provides this heat conduction element of this heat radiation module and joins in the buffer stress and the good laminating nature of the upper surface of this heat source component.
Description
Technical Field
The utility model relates to a heat dissipation module's elasticity closure structure indicates especially that one kind utilizes the elasticity closure to provide this heat conduction element joint of this heat dissipation module and the buffering stress and the good laminating nature of the upper surface of this heat source component.
Background
Nowadays, electronic technology is growing at a rapid innovation speed, so that various types of computer devices such as Personal Computers (PCs), notebook computers or tablet computers exist in all corners, and the electronic technology is moving toward a direction of high computing capability and light weight. With the standardization of software and hardware under the open architecture of computer equipment, and the continuous expansion and upgrade of functions, industrial computers suitable for various patent fields are born, and the main applications of the industrial computers include industrial control/automation equipment, network and communication equipment, image detection and identification and intelligent transportation systems. Going to higher levels, industrial computers are also used in military, transportation and aerospace fields, where high reliability and stability are required, and industrial computers are required to meet specific specifications and requirements for performing high-performance operations in a harsh environment.
Furthermore, the industrial Computer further includes a Single Board Computer (SBC), an embedded Computer Module (COM), and a Back Plane Module (BPM), wherein the COM is configured with a heat source device (CPU), a Chipset (Chipset), an I/O Port (I/O Port), and a Power Supply (Power Supply), and all system interfaces and design functions are combined through a memory Module and a hard disk drive, so as to provide a plug and play (PNP) hardware platform and an expansion slot with additional functions, and the size of the expansion slot is smaller than that of a personal Computer motherboard, thereby making the SBC more flexible in various fixed and mobile embedded systems and industrial applications. However, due to the small size and fast operation speed of the embedded computer module, the accumulated heat is much higher than that of the ordinary motherboard, and a good heat dissipation structure is further required.
The conventional locking method of the embedded computer module is to use a plurality of screws to serially lock the heat dissipation module, the embedded computer module and the Carrier Board, and the screws tightly lock the heat dissipation module, the embedded computer module and the Carrier Board, and the locking method is divided into two locking methods of top locking (topmetering) and Bottom locking (Bottom locking). The heat dissipation module uses a Thermal Pad (Thermal Pad) as tolerance buffer between the heat dissipation module and the heat source element in order to absorb tolerance between the heat dissipation module and the CPU, and the Thermal contact resistance between the heat dissipation module and the heat source element is increased due to the fact that the Thermal Pad cannot be closely attached to the heat source element in a microscopic view, so that the whole heat dissipation capability is influenced, and therefore the heat dissipation structure has a great defect. If the heat dissipation paste is used as the heat conduction material between the heat dissipation module and the heat source element, although the heat dissipation paste has the advantage of small contact thermal resistance, the stress buffering capacity between the heat dissipation module and the heat source element is lost, and if the heat dissipation module and the heat source element are subjected to external vibration stress, the heat dissipation module and the heat source element are easily peeled off, so that the heat dissipation effect on the heat source element is lost. Therefore, how to use the thermal paste as a thermal conductive material and have stress buffering capability is desired to be improved by those skilled in the art.
SUMMERY OF THE UTILITY MODEL
Therefore, in view of the above problems and disadvantages, the present invention provides a new patent for an elastic locking structure of a heat dissipation module, which is created by collecting relevant data, evaluating and considering in many ways, and trying and modifying the accumulated years of experience in the industry.
In order to achieve the above object, the utility model adopts the following technical scheme:
an elastic locking structure of a heat dissipation module, comprising:
a load-bearing circuit board including a plurality of locking holes;
the main circuit board is arranged on the bearing circuit board and electrically connected with the bearing circuit board, and comprises at least one heat source element;
the heat dissipation module is arranged on the main circuit board and comprises at least one heat exchange element, a plurality of heat conduction elements and a plurality of locking grooves, one surface of each heat conduction element is jointed on one surface of the corresponding heat exchange element, the other surface of each heat conduction element is jointed on the upper surface of the corresponding heat source element of the main circuit board, the bottoms of the locking grooves are respectively provided with a stopping part, and the center of each stopping part is provided with a through hole;
the single elastic locking piece is provided with a polygonal head, a rod body and a screw channel penetrating through the centers of the polygonal head and the rod body, the screw channel is used for screwing a mechanism screw, an elastic body is arranged outside the rod body, two ends of the elastic body respectively abut against the stopping part between the polygonal head and the locking groove, a limiting part is arranged at the through hole of the rod body penetrating out of the locking groove, and the plurality of elastic locking pieces provide buffer stress and good fitting performance of the heat conducting element of the heat dissipation module jointed with the upper surface of the heat source element.
The elastic locking structure of the heat dissipation module is characterized in that: the heat conducting element of the heat dissipation module is jointed with the upper surface of the heat source element, and heat is conducted by coating heat dissipation paste or adhering a phase change material.
The elastic locking structure of the heat dissipation module is characterized in that: the polygonal head of the elastic locking piece is hexagonal, and the locking groove for accommodating the elastic locking piece is also hexagonal, so that the outer edge of the hexagonal head of the elastic locking piece is fixed in the locking groove and is lower than the upper edge of the locking groove.
The elastic locking structure of the heat dissipation module is characterized in that: the surface of the tail end of the rod body of the elastic locking piece is provided with threads.
The elastic locking structure of the heat dissipation module is characterized in that: the limiting member is composed of a nut, an O-ring or an E-ring, and the elastic locking member is limited in the locking groove of the heat dissipation module by the limiting member.
The elastic locking structure of the heat dissipation module is characterized in that: the elastic body is a spring.
The elastic locking structure of the heat dissipation module is characterized in that: the heat exchange element is a soaking plate or a radiating fin.
The elastic locking structure of the heat dissipation module is characterized in that: the plurality of heat conducting elements are copper blocks.
The elastic locking structure of the heat dissipation module is characterized in that: the screw channel of the elastic locking piece is used for screwing the mechanism screw from the tail end of the rod body.
The elastic locking structure of the heat dissipation module is characterized in that: the heat source element is a central processing unit.
Compared with the prior art, adopt above-mentioned technical scheme the utility model has the advantages of:
the utility model has the advantages of providing a heat dissipation module's elasticity closure structure, including one bear the circuit board, a main circuit board, a heat dissipation module and plural elasticity closure, this plural elasticity closure is used for the plural lockhole that this bore circuit board and this heat dissipation module's plural locked groove of cluster lock to this bears the circuit board, this main circuit board and this heat dissipation module form fixedly, and this plural elasticity closure provides this heat conduction element joint of this heat dissipation module and in the buffering stress and the good laminating nature of this heat source component's upper surface.
The present invention has the secondary advantage that the heat conducting element of the heat dissipating module is coupled between the upper surfaces of the heat source elements, and is further coated with a heat dissipating paste or a phase change material.
Another advantage of the present invention is that the preferred structure of the polygonal head of the elastic locking member is hexagonal, and the locking groove for accommodating the elastic locking member is also hexagonal space, so that the outer edge of the hexagonal head of the elastic locking member is fixed to the locking groove.
Drawings
Fig. 1 is a three-dimensional appearance structure diagram of the elastic locking structure of the heat dissipation module of the present invention.
Fig. 2 is a three-dimensional exploded structural view of the elastic locking structure of the heat dissipation module of the present invention.
Fig. 3 is another exploded perspective view of the elastic locking structure of the heat dissipating module of the present invention.
Fig. 4 is a side view cross-sectional structure diagram of the elastic locking structure of the heat dissipation module of the present invention.
Fig. 5 is a three-dimensional sectional structure view of the locking groove of the heat dissipation module of the present invention.
Description of reference numerals: 1-a carrier circuit board; 10-a keyhole; 2-a main circuit board; 21-a heat source element; 3-a heat dissipation module; 30-a lock groove; 300-a through hole; 301-a stop; 31-a heat exchange element; 32-a thermally conductive element; 33-thermal grease; 34-a phase change material; 4-an elastic locking element; 40-spiral path; 41-polygonal head; 42-a rod body; 421-screw thread; 43-an elastomer; 44-a stop; 5-mechanism screw.
Detailed Description
To achieve the above objects and advantages, the present invention provides a method and apparatus for constructing and operating a display device, which can be used to explain the features and functions of the preferred embodiments of the present invention as follows.
Please refer to fig. 1 to 5, which are respectively the three-dimensional appearance structure diagram, the three-dimensional decomposition structure diagram, the other three-dimensional decomposition structure diagram, the side-view section structure diagram and the three-dimensional section structure diagram of the locking groove of the elastic locking structure of the heat dissipation module of the present invention can be clearly seen from the diagram, the elastic locking structure of the heat dissipation module of the present invention mainly comprises a bearing circuit board 1, a main circuit board 2, a heat dissipation module 3, an elastic locking element 4 and a mechanism screw 5, and each structural connection relationship is as follows:
the carrier circuit board 1 includes a plurality of locking holes 10.
The main circuit board 2 is disposed on the carrier circuit board 1 and electrically connected thereto, and the main circuit board 2 includes at least one heat source element 21.
The heat dissipation module 3 is disposed on the main circuit board 2, the heat dissipation module 3 includes at least one heat exchange element 31, a plurality of heat conduction elements 32, and a plurality of locking slots 30, one surface of the plurality of heat conduction elements 32 is joined to one surface of the heat exchange element 31, and the other surface of the plurality of heat conduction elements 32 is joined to the upper surface of the heat source element 21 of the main circuit board 2, the bottom of each of the plurality of locking slots 30 is provided with a stop portion 301, and a through hole 300 is disposed at the center of the stop portion 301. The heat conducting element 32 of the heat dissipating module 3 is bonded between the upper surfaces of the heat source elements 21, and further coated with a heat dissipating paste 33 or bonded with a phase change material 34 for heat conduction. The preferred embodiment of the Heat exchange element 31 is a Vapor Chamber (VC) or a Heat Sink. The preferred embodiment of the plurality of thermally conductive elements 32 is a copper block. The heat source element 21 is a Central Processing Unit (CPU) or a Chipset (e.g., a north-south bridge chip, a power supply chip) that is easy to heat.
A plurality of elastic locking elements 4 for serially locking the plurality of locking holes 10 of the carrier circuit board 1 and the through holes 300 of the plurality of locking slots 30 of the heat sink module 3, so that the carrier circuit board 1, the main circuit board 2 and the heat dissipation module 3 are fixed, the single elastic locking member 4 has a polygonal head 41, a rod 42 and a screw passage 40 penetrating through the polygonal head 41 and the rod 42, the screw passage 40 is provided for a mechanism screw 5 to be screwed, and an elastic body 43 is provided outside the rod body 42, the elastic body 43 is preferably implemented as a spring, two ends of the elastic body 43 respectively abut against the polygonal head 41 and the stopping portion 301 of the lock slot 30, and a position limiting member 44 is disposed at the position where the rod 42 extends out of the through hole 300 of the locking groove 30, the elastic locking elements 4 provide a buffer stress and good adhesion for the heat conducting element 32 of the heat dissipation module 3 to be bonded to the upper surface of the heat source element 21.
The preferred embodiment of the polygonal head 41 of the resilient locking element 4 is hexagonal and the locking groove 30 for accommodating the resilient locking element 4 is also hexagonal, so that the outer edge of the hexagonal head of the resilient locking element 4 is fixed to the locking groove 30 and lower than the upper edge of the locking groove 30. The end surface of the rod 42 of the elastic locking element 4 is provided with a thread 421. The screw passage 40 of the elastic locking member 4 is screwed with the mechanism screw 5 from the end of the rod 42.
The position-limiting element 44 is formed by a nut, an O-ring or an E-ring, and the position-limiting element 44 limits the elastic locking element 4 in the locking groove 30 of the heat dissipation module 3.
The present invention is different from the existing plural locking grooves 30 located at the heat dissipation module 3 and having hexagonal space, the elastic locking member 4 has a polygonal head (also having hexagonal shape) 41, a rod 42 and a screw passage 40 penetrating through the centers of the polygonal head 41 and the rod 42, and further cooperates with a position-limiting member 44 such as a nut, an O-ring or an E-ring to prevent the polygonal head 41 and the rod 42 from coming off from the locking groove 30, because the polygonal head 41 of the elastic locking member 4 is limited in the polygonal locking groove 30 of the heat dissipation module 3 and will not rotate, a fixed structure is formed, the bearing circuit board 1, the main circuit board 2 and the heat dissipation module 3 are locked by the aforesaid members and will not be in a tight locking state, and the elastic body 43 outside the elastic locking member 4 has an effect of absorbing assembly tolerance, and can generate a certain pressure to the surface of the heat source element 21 to make the heat dissipation module 3 and the same tightly combined, and then between the heat conducting element 32 of the heat dissipating module 3 and the upper surface of the heat source element 21, a heat dissipating paste 33 is coated or a phase change material 34 is attached to conduct heat, so as to reduce the contact thermal resistance and improve the whole heat dissipating effect, the elastic locking structure does not need to change the locking holes and the locking structure of the original carrying circuit board 1, the main circuit board 2 and the heat dissipating module 3, and has the problem that the joint surface of the heat dissipating module 3 and the heat source element 21 has no elasticity and large tolerance and can not be closely jointed with each other with the lowest cost.
Rely on the disclosure of fig. 1 to 5, can understand the utility model discloses a heat dissipation module's elasticity closure structure, it mainly is for providing a heat dissipation module's elasticity closure structure, including a bearing circuit board, a main circuit board, a heat dissipation module and plural elasticity closure, this plural elasticity closure is used for this plural first lockhole of this bearing circuit board of tandem lock and this plural locked groove of this heat dissipation module to it is fixed to make this bearing circuit board, this main circuit board and this heat dissipation module form, and this plural elasticity closure provides this heat conduction element of this heat dissipation module and joins in the buffer stress and the good laminating nature of the upper surface of this heat source component.
The foregoing description is intended to be illustrative rather than limiting, and it will be appreciated by those skilled in the art that many modifications, variations or equivalents may be made without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (10)
1. An elastic locking structure of a heat dissipation module, comprising:
a load-bearing circuit board including a plurality of locking holes;
the main circuit board is arranged on the bearing circuit board and electrically connected with the bearing circuit board, and comprises at least one heat source element;
the heat dissipation module is arranged on the main circuit board and comprises at least one heat exchange element, a plurality of heat conduction elements and a plurality of locking grooves, one surface of each heat conduction element is jointed on one surface of the corresponding heat exchange element, the other surface of each heat conduction element is jointed on the upper surface of the corresponding heat source element of the main circuit board, the bottoms of the locking grooves are respectively provided with a stopping part, and the center of each stopping part is provided with a through hole;
the single elastic locking piece is provided with a polygonal head, a rod body and a screw channel penetrating through the centers of the polygonal head and the rod body, the screw channel is used for screwing a mechanism screw, an elastic body is arranged outside the rod body, two ends of the elastic body respectively abut against the stopping part between the polygonal head and the locking groove, a limiting part is arranged at the through hole of the rod body penetrating out of the locking groove, and the plurality of elastic locking pieces provide buffer stress and good fitting performance of the heat conducting element of the heat dissipation module jointed with the upper surface of the heat source element.
2. The elastic locking structure of a heat dissipating module according to claim 1, wherein: the heat conducting element of the heat dissipation module is jointed with the upper surface of the heat source element, and heat is conducted by coating heat dissipation paste or adhering a phase change material.
3. The elastic locking structure of a heat dissipating module according to claim 1, wherein: the polygonal head of the elastic locking piece is hexagonal, and the locking groove for accommodating the elastic locking piece is also hexagonal, so that the outer edge of the hexagonal head of the elastic locking piece is fixed in the locking groove and is lower than the upper edge of the locking groove.
4. The elastic locking structure of a heat dissipating module according to claim 1, wherein: the surface of the tail end of the rod body of the elastic locking piece is provided with threads.
5. The elastic locking structure of a heat dissipating module according to claim 1, wherein: the limiting member is composed of a nut, an O-ring or an E-ring, and the elastic locking member is limited in the locking groove of the heat dissipation module by the limiting member.
6. The elastic locking structure of a heat dissipating module according to claim 1, wherein: the elastic body is a spring.
7. The elastic locking structure of a heat dissipating module according to claim 1, wherein: the heat exchange element is a soaking plate or a radiating fin.
8. The elastic locking structure of a heat dissipating module according to claim 1, wherein: the plurality of heat conducting elements are copper blocks.
9. The elastic locking structure of a heat dissipating module according to claim 1, wherein: the screw channel of the elastic locking piece is used for screwing the mechanism screw from the tail end of the rod body.
10. The elastic locking structure of a heat dissipating module according to claim 1, wherein: the heat source element is a central processing unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920507587.3U CN209911910U (en) | 2019-04-15 | 2019-04-15 | Elastic locking structure of heat radiation module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920507587.3U CN209911910U (en) | 2019-04-15 | 2019-04-15 | Elastic locking structure of heat radiation module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209911910U true CN209911910U (en) | 2020-01-07 |
Family
ID=69035267
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920507587.3U Active CN209911910U (en) | 2019-04-15 | 2019-04-15 | Elastic locking structure of heat radiation module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209911910U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113157054A (en) * | 2020-01-22 | 2021-07-23 | 凌华科技股份有限公司 | Memory slot shock-resistant and heat-radiating structure |
-
2019
- 2019-04-15 CN CN201920507587.3U patent/CN209911910U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113157054A (en) * | 2020-01-22 | 2021-07-23 | 凌华科技股份有限公司 | Memory slot shock-resistant and heat-radiating structure |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9705264B2 (en) | Processor loading system | |
| US7480147B2 (en) | Heat dissipation apparatus utilizing empty component slot | |
| US8144469B2 (en) | Processor loading system | |
| US20080013282A1 (en) | Method and apparatus for cooling a memory device | |
| US7391614B2 (en) | Method and apparatus for thermal dissipation in an information handling system | |
| US7403383B2 (en) | Directing airflow for an information handling system | |
| US8045339B2 (en) | Multiple component mounting system | |
| US9261924B2 (en) | Heat pipe assemblies | |
| US7876559B2 (en) | Universal blank for air flow management | |
| US10764990B1 (en) | Heat-dissipating module having an elastic mounting structure | |
| CN209911910U (en) | Elastic locking structure of heat radiation module | |
| US20080310118A1 (en) | CPU Heat Sink Mounting Method And Apparatus | |
| TWM584543U (en) | Elastic locking structure of heat dissipation module | |
| US9600039B2 (en) | Electronic device | |
| CN209879406U (en) | Fixing structure of radiating module | |
| US20220225542A1 (en) | Thin form factor assemblies for cooling dimms | |
| US20100323237A1 (en) | Battery connector coupling | |
| US7385824B2 (en) | Processor module with rigidly coupled processor and voltage-regulator heat sinks | |
| US20220117080A1 (en) | Ball grid array chip (bga) package cooling assembly with bolster plate | |
| TWM580850U (en) | Fixing structure of cooling module | |
| US10681800B1 (en) | Thermal module mounting structure | |
| TWI704861B (en) | Anti-vibration and heat dissipation structure of memory slot | |
| CN115623731A (en) | Stacking system | |
| US20230014898A1 (en) | Methods and apparatus to improve pin contact of a component stack | |
| US20230038805A1 (en) | Methods, systems, apparatus, and articles of manufacture to control load distribution of integrated circuit packages |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |