TWM584543U - Elastic locking structure of heat dissipation module - Google Patents

Abstract

This creation relates to an elastic locking structure of a heat dissipation module, which includes a carrier circuit board, a main circuit board, a heat dissipation module and a plurality of elastic locking members, which are used to lock the bearing circuit in series. A plurality of lock holes of the board and a plurality of lock slots of the heat sink module, so that the carrier circuit board, the main circuit board and the heat sink module are fixed, and the elastic locking members provide the heat conduction of the heat sink module The components are bonded to the upper surface of the heat source device to cushion the stress and have good adhesion.

Description

Elastic locking structure of heat dissipation module

This creation is to provide an elastic locking structure of a heat dissipation module, and in particular to use an elastic locking member to provide cushioning stress and good fit of the heat conduction element of the heat dissipation module joined to the upper surface of the heat source element.

According to the press, today's electronic technology is growing at a rapid rate of innovation, so that various types of computer equipment such as personal computers (PCs), notebook computers or tablet computers exist in all corners, moving toward the direction of strong computing power and light weight. With the open architecture of computer equipment and the standardization of software and hardware, supplemented by continuous expansion and upgrade of functions, industrial computers suitable for various patent industries have been born. The main applications of industrial computers include industrial control / automation equipment, networking And communication equipment, image detection and identification and intelligent transportation systems. Going to a higher level, it can also be used in military, transportation, and aerospace fields, such as related industrial applications that require high reliability and stability. Industrial computers need to meet specific specifications and perform various high-efficiency in harsh environments. Functional requirements.

Furthermore, industrial computers also include single board computers (SBC), embedded computer modules (COM), and backplane modules (BPM), among which embedded computer modules (COM) is equipped with heat source components (CPU), chipset (chipset), input / output port (I / O Port) and built-in power supply (Power Supply), and through the memory module and hard drive to combine all system interfaces And design functions, providing a plug-and-play (PNP) hardware platform and additional function expansion slots, which are smaller in size than a personal computer motherboard, allowing embedded computer modules to be used in a variety of fixed and mobile embedded systems and More flexible in industrial applications. However, due to the small size and fast operating speed of the embedded computer module, the accumulated heat is more than that of a general motherboard, and a good heat dissipation structure is needed.

The conventional method of locking embedded computer modules is to use a plurality of mechanisms to lock the heat dissipation module, the embedded computer module, and the Carrier Board. These screws tightly lock the three and divide them into upper locks. (Top Mounting) and Bottom Mounting. In order to absorb the tolerance between the heat sink module and the CPU, a thermal pad is used as a tolerance buffer between the heat sink module and the heat source component. Because the heat sink patch cannot be closely attached to the heat source component at the micro level, As a result, the contact thermal resistance between the heat dissipation module and the heat source element becomes larger, which further affects the overall heat dissipation capability. Therefore, this heat dissipation structure has a great disadvantage. If a thermal paste is used as the thermally conductive material between the heat dissipation module and the heat source element, although it has the advantage of low contact thermal resistance, it will lose the ability to buffer the stress between the heat dissipation module and the heat source element. The heat dissipation module is separated from the heat source element, and the heat dissipation effect on the heat source element is lost. Therefore, how to use a thermal paste as a thermally conductive material and have stress buffering capacity remains to be improved by those engaged in this industry.

Therefore, in view of the above problems and deficiencies, the creator collects relevant information. After multiple evaluations and considerations, and with years of experience accumulated in this industry, through continuous trial and modification, a new patent for the elastic locking structure of this cooling module was born.

The main purpose of this creation is to provide an elastic locking structure of a heat sink module, which includes a carrier circuit board, a main circuit board, a heat sink module, and a plurality of elastic locking members, which are used for series locking. The plurality of locking holes of the bearing circuit board and the plurality of locking slots of the heat dissipation module are used to fix the bearing circuit board, the main circuit board and the heat dissipation module, and the elastic locking members provide the heat dissipation module. The thermally conductive element is bonded to the upper surface of the heat source element to cushion the stress and has good adhesion.

The secondary purpose of this creation is that the heat-conducting element of the heat-dissipating module is joined between the upper surfaces of the heat-source elements, and a heat-dispersing paste or a phase change material is applied to conduct heat.

Another purpose of this creation is that the preferred implementation structure of the polygonal head of the elastic lock is hexagonal, and the lock slot provided by the elastic lock is also hexagonal, so that the elastic lock The outer edge of the hexagonal head of the composite is fixed to the lock groove.

1‧‧‧ bearing circuit board

10‧‧‧ keyhole

2‧‧‧ main circuit board

21‧‧‧ heat source element

3‧‧‧ Thermal Module

30‧‧‧lock slot

300‧‧‧through hole

301‧‧‧stop

31‧‧‧heat exchange element

32‧‧‧ thermal conductive element

33‧‧‧ Thermal Paste

34‧‧‧phase change material

4‧‧‧ Elastic Lock

40‧‧‧ spiral

41‧‧‧Polygonal head

42‧‧‧ shaft

421‧‧‧Thread

43‧‧‧ Elastomer

44‧‧‧ limit pieces

5‧‧‧ mechanism screws

The first figure is a three-dimensional appearance structure diagram of the elastic locking structure of the creative cooling module.

The second figure is a three-dimensional exploded structural view of the elastic locking structure of the creative cooling module.

The third figure is another three-dimensional exploded structure view of the elastic locking structure of the creative cooling module.

The fourth figure is a side cross-sectional structural diagram of the elastic locking structure of the creative cooling module.

The fifth figure is a three-dimensional cross-sectional structural view of the lock groove of the creative cooling module.

In order to achieve the above-mentioned purpose and effect, the technical methods used in this creation, its structure, and implementation methods, etc., are described in detail below with regard to the preferred embodiments of this creation, and their features and functions are fully understood.

Please refer to the first to fifth figures, which are the three-dimensional appearance structure diagram, the three-dimensional exploded structure diagram, the other three-dimensional exploded structure diagram, the side sectional structure diagram, and the lock groove of the elastic locking structure of the creative cooling module. It can be clearly seen from the figure that the elastic locking structure of the cooling module of this creation mainly includes a carrier circuit board 1, a main circuit board 2, a cooling module 3, an elastic locking member 4 and a mechanism. The connection relationship of each structure of the screw 5 is as follows: The carrier circuit board 1 includes a plurality of lock holes 10.

The main circuit board 2 is disposed on and electrically connected to the carrier circuit board 1. The main circuit board 2 includes at least one heat source element 21.

The heat dissipating module 3 is disposed on the main circuit board 2. The heat dissipating module 3 includes at least one heat exchange element 31, a plurality of heat conducting elements 32, and a plurality of lock grooves 30. One surface of the heat conducting elements 32 is bonded to the heat. One surface of the exchange element 31 and the other surface of the heat-conducting elements 32 are bonded to the upper surface of the heat source element 21 of the main circuit board 2. Each bottom of the lock grooves 30 is provided with a stop portion 301, and A through hole 300 is provided at the center of the blocking portion 301. The heat-conducting element 32 of the heat-dissipating module 3 is bonded between the upper surfaces of the heat-source elements 21, and is further coated with a heat-dissipating paste 33 or a phase-change material 34 to conduct heat. A preferred implementation component of the heat exchange element 31 is a Vapor Chamber (VC) or a heat sink (Heat Sink). The preferred implementation components of the heat conducting elements 32 are copper blocks. The heat source element 21 refers to a central processing unit (CPU) or a chipset (Chipset), for example, a north-south bridge chip and a power chip.

The plurality of elastic locking members 4 are used to serially lock the lock holes 10 of the carrier circuit board 1 and the through holes 300 of the lock slots 30 of the heat sink module 3 so that the carrier circuit board 1 and the main circuit The plate 2 and the heat dissipation module 3 are fixed, and the single elastic locking member 4 has a polygonal head 41, a rod body 42, and a screw channel 40 passing through the polygonal head 41 and the rod body 42. The channel 40 is used for a screwing of a mechanism screw 5 and an elastic body 43 is provided outside the rod body 42. A preferred implementation member of the elastic body 43 is a spring, and the two ends of the elastic body 43 respectively resist the Between the angled head 41 and the stop portion 301 of the lock slot 30, a limiting piece 44 is provided at the through hole 300 of the rod body 42 protruding from the lock slot 30. The elastic lock pieces 4 provides cushioning stress and good adhesion of the heat-conducting element 32 of the heat-dissipating module 3 joined to the upper surface of the heat-source element 21.

The preferred implementation structure of the polygonal head 41 of the elastic lock piece 4 is hexagonal, and the lock slot 30 provided by the elastic lock piece 4 is also a hexagonal space, so that the elastic lock piece The outer edge of the hexagonal head of 4 is fixed to the lock groove 30 and is lower than the upper edge of the lock groove 30. A thread 421 is provided on the end surface of the rod body 42 of the elastic locking member 4. The screw channel 40 of the elastic locking member 4 is used for screwing the mechanism screw 5 from the end of the rod body 42.

The limiting member 44 is formed by a nut, an O-ring or an E-ring. The limiting member 44 is configured to limit the elastic locking member 4 in the locking slot 30 of the heat dissipation module 3.

This creation is different from the conventional one in that the plurality of locking grooves 30 of the heat dissipation module 3 are hexagonal spaces, and the elastic locking member 4 has a polygonal head (also hexagonal) 41, a rod body 42 and a through polygon The screw path 40 at the center of the head 41 and the rod 42 is matched with a stopper 44 such as a nut, an O-ring or an E-ring to prevent the polygonal head 41 and the rod 42 from coming out of the locking groove 30. Because the polygonal head 41 of the elastic locking member 4 is limited to as many as the heat dissipation module 3 The angular lock groove 30 does not rotate to form a fixed structure. The load-carrying circuit board 1, the main circuit board 2 and the heat dissipation module 3 are locked in series using the aforementioned components, but will not be in a tightly locked state, but elastic. The elastic body 43 on the outside of the locking member 4 has the effect of absorbing assembly tolerances, and can generate a certain pressure on the surface of the heat source element 21 to tightly combine the heat dissipation module 3 with the heat conduction element 32 of the heat dissipation module 3 and join the heat source element 21 Between the upper surfaces, a thermal paste 33 or a phase change material 34 is applied to conduct heat to reduce contact thermal resistance and improve the overall heat dissipation effect. This elastic locking structure does not need to change the original bearing circuit board 1 The locking holes and the locking structure of the main circuit board 2 and the heat dissipation module 3 have the problem of improving the joint surface of the heat dissipation module 3 and the heat source element 21 at the lowest cost without elasticity and large tolerances, and cannot be closely connected.

Through the disclosure of the first to fifth figures, the elastic locking structure of the cooling module can be understood. The main purpose is to provide an elastic locking structure of the cooling module, which includes a carrier circuit board and a main circuit board. The circuit board, a heat dissipation module and a plurality of elastic locking members, the elastic locking members are used to serially lock the first lock holes of the carrier circuit board and the lock slots of the heat sink module, so that the bearing The circuit board, the main circuit board and the heat dissipation module are fixed, and the elastic locking members provide cushioning stress and good adhesion of the heat conduction element of the heat dissipation module to the upper surface of the heat source element. This creation is applied to the structure of the heat source element when the heat dissipation module is attached, which has a good effect of solving the problem. Therefore, a patent application is filed to seek the protection of the patent right.

However, the above is only a preferred embodiment of the creation, and it does not limit the scope of the patent of the creation. Therefore, all simple modifications and equivalent structural changes made by using the description and the contents of the drawings should be the same. It is included in the scope of the patent of this creation and is conferred to Chen Ming.

In summary, the elastic locking structure of the above-mentioned heat dissipation module of this creation is actually implemented and implemented in order to achieve its efficacy and purpose. Therefore, this creation is an excellent practicability. Research and development, in order to meet the application requirements for new patents, apply in accordance with the law, and hope that the review committee will grant this case at an early date to protect the hard research and development and creation of the creator. I must do my best to cooperate, and I really feel virtuous.

Claims (10)

An elastic locking structure of a heat dissipation module includes: a carrier circuit board including a plurality of lock holes; a main circuit board disposed on the carrier circuit board and electrically connected thereto, the main circuit board including at least one heat source element; A heat dissipation module is disposed on the main circuit board. The heat dissipation module includes at least one heat exchange element, a plurality of heat conduction elements, and a plurality of lock slots. One surface of the heat conduction elements is bonded to one surface of the heat exchange element. And the other surface of the heat-conducting elements is bonded to the upper surface of the heat source element of the main circuit board, a stopper is provided at the bottom of each of the lock grooves, and a through hole is provided at the center of the stopper; plural elasticity The locking component is used to lock the lock holes of the carrier circuit board and the through holes of the lock slots of the heat dissipation module in series, so that the carrier circuit board, the main circuit board, and the heat dissipation module make one. Fixed, a single elastic lock has a polygonal head, a rod body, and a screw thread that runs through the polygonal head and the center of the rod. The screw thread is used to screw a mechanism screw into the rod. An elastic body is provided on the outside of the body. The two ends of the body are respectively abutted between the polygonal head and the stop portion of the lock groove, and a stopper is provided at the through hole of the rod body that extends out of the lock groove, and the elastic locks The assembly provides buffer stress and good adhesion of the heat-conducting element of the heat-dissipating module to the upper surface of the heat-source element. According to the elastic locking structure of the heat dissipation module described in item 1 of the scope of patent application, wherein the heat conducting element of the heat dissipation module is joined between the upper surfaces of the heat source elements, and is further coated with a heat dissipation paste or a lamination Phase change material to conduct heat. The elastic locking structure of the heat dissipation module according to item 1 of the scope of patent application, wherein the elasticity A preferred implementation structure of the polygonal head of the locking member is hexagonal, and the lock groove provided by the elastic locking member also has a hexagonal space, so that the hexagonal head of the elastic locking member is outside The edge is fixed to the lock slot and is lower than the upper edge of the lock slot. According to the elastic locking structure of the heat dissipation module described in item 1 of the scope of the patent application, the end surface of the rod body of the elastic locking member is provided with threads. For example, the elastic locking structure of the heat dissipation module described in item 1 of the patent application scope, wherein the limiting member is formed by a nut, an O-ring or an E-ring, and the limiting member is the elastic locking member. Limited to the lock slot of the heat dissipation module. According to the elastic locking structure of the heat dissipation module described in item 1 of the scope of patent application, a preferred implementation member of the elastic body is a spring. According to the elastic locking structure of the heat dissipation module described in item 1 of the scope of the patent application, a preferred implementation component of the heat exchange element is a heat equalizing plate or a heat dissipation fin. According to the elastic locking structure of the heat dissipation module described in item 1 of the scope of the patent application, a preferred implementation member of the heat conducting elements is a copper block. According to the elastic locking structure of the heat dissipation module described in item 1 of the scope of the patent application, the screw channel of the elastic locking member is used for screwing the mechanism screw from the end of the rod body. The elastic locking structure of the heat dissipation module according to item 1 of the scope of the patent application, wherein the heat source component refers to a central processing unit or a chipset that is easy to generate heat.