TWM580850U - Fixing structure of cooling module - Google Patents

Abstract

The present invention relates to a fixed structure of a heat dissipation module, which comprises a first group of vertical frames on at least one pair of sides of a heat dissipation module, the first group of vertical frames are provided with a plurality of fixing holes, and a circuit board includes at least one a heat source component, wherein at least one pair of sides of the circuit board are respectively provided with a second group of vertical frames, and the second group of vertical frames are provided with a plurality of through holes, and the second group of the vertical frame sleeves are disposed at the first of the heat dissipation modules The plurality of the fixing holes of the first group of the first group of the first group of the first group of the first group of the first set of the plurality of the first set of the plurality of the first and second sets of The space in which the fixing members are longitudinally moved to form a floating position, and the heat source member is abutted against the bottom of the heat dissipation module to form a fixing structure of the heat dissipation module and the circuit board, thereby achieving flexibility Overcome the purpose of vibration.

Description

Fixed structure of heat dissipation module

The present invention provides a fixed structure of a heat dissipation module, in particular, a floating positioning structure between a heat dissipation module and a motherboard on which a heat source component is disposed, thereby achieving a structure that is both elastic and overcomes vibration.

According to today's electronic technology, it is growing at a rapid pace of innovation, and various types of computer devices such as personal computers (PCs), notebook computers, or tablet computers exist in various corners, moving toward a computing power and a compact size. With the open architecture of computer equipment and the standardization of software and hardware, with the continuous expansion and upgrade of functions, industrial computers suitable for various patent industries have been born, and industrial computer main applications include industrial control/automation equipment and networks. And communication equipment, image detection and identification and intelligent transportation system. To the higher classes, it can also be used in military, transportation and aerospace fields, and other related industries that require high reliability and stability. Industrial computers need to meet specific specifications and perform high efficiency in harsh environments. The requirement to operate.

Furthermore, industrial computers include, for example, Single Board Computer (SBC), Computer On Module (COM), and Back Plane Module (BPM), among which embedded computer modules (COM) is equipped with a heat source component (CPU), a chipset (Chipset), an input/output port (I/O Port), and a built-in power supply (Power Supply), and combines all system interfaces with a hard disk drive through a memory module. And design features, a plug-and-play (PNP) hardware platform and additional expansion slots, and smaller than the PC motherboard, allowing embedded computer modules in a variety of fixed and mobile embedded systems More flexible in industrial applications. However, due to the small size and fast operation speed of the embedded computer module, the accumulated heat is more than the general motherboard, and a better heat dissipation structure is needed.

The current embedded computer module (COM) often uses Thermal Interface Materials (TIM) as a thermal pad, which acts to transfer waste heat from the central processing unit or the wafer during operation. The copper block and the heat dissipation module are due to the use of the thermal conductive patch as the thermal interface material, and the thermal resistance is larger than that of the thermal grease. In addition, the heat dissipation module is fixed on the circuit board, and the locking manner between the two is not an elastic structure, but in order to avoid wafer damage caused by vibration or overvoltage, a thermal conductive patch with a buffer stress function and an absorption assembly tolerance is still needed. Therefore, the thermal resistance between the central processing unit and the heat dissipation module cannot be reduced, thereby affecting the operational efficiency. Because of the great shortcomings of the above heat dissipation structure, it is necessary to develop and improve the industry.

Therefore, in view of the above-mentioned problems and deficiencies, the creators have collected relevant information, evaluated and considered through various parties, and have accumulated many years of experience in the industry, and through continuous trial and modification, the fixed structure of such a heat dissipation module has been established. The new patent was born.

The main purpose of the present invention is to provide a fixed structure of a heat dissipation module, which is provided on at least one pair of sides of a heat dissipation module, and a first group of vertical frames, the first group of vertical A plurality of fixing holes are disposed on the frame; a circuit board includes at least one heat source component, and a second group of vertical frames are disposed on at least one pair of the tops of the circuit board, and the plurality of through holes are disposed on the second group of the vertical frames, and the second set of the vertical frame Nesting the opposite sides of the first group of vertical frames of the heat dissipation module, and the plurality of fixing holes of the first group of frames are corresponding to the holes of the second group of frames, and then the plurality of fixing members are used to pass the holes a fixing hole and the perforations, and the perforations have a space for longitudinally moving the fixing members to form a floating positioning, and the heat source component is abutted against the bottom of the heat dissipation module to form the heat dissipation module and the The fixed structure of the circuit board achieves the purpose of both elasticity and vibration.

The second purpose of the present invention is to provide a screw mount between the heat dissipation module and the circuit board. The screw mount is fixed to the bottom of the heat dissipation module and is provided with a plurality of screw bases for corresponding plural The elastic locking member is fixed by a plurality of through holes at the bottom of the circuit board to form an elastic buffer structure between the heat dissipation module and the circuit board.

Another object of the present invention is that at least one heat conducting component is disposed between the heat source component of the circuit board and the heat dissipation module, and one of the heat conducting components is in contact with the bottom of the heat dissipation module and the other surface is attached to the heat source. On the upper surface of the component, the heat conducting component of the heat dissipation module is bonded between the upper surface of the heat source component, and is further coated with a thermal grease or a phase change material to conduct heat.

1‧‧‧ Thermal Module

11‧‧‧thermal element

12‧‧‧ Thermal grease

13‧‧‧ phase change materials

2‧‧‧First set of stand

20‧‧‧Fixed holes

3‧‧‧Circuit board

30‧‧‧through hole

31‧‧‧First heat source element

32‧‧‧Second heat source element

4‧‧‧Second set of stand

40‧‧‧Perforation

5‧‧‧Fixed parts

6‧‧‧Spiral mount

61‧‧‧ screw seat

62‧‧‧Flexible locks

The first figure is a three-dimensional appearance structure diagram of the fixed structure of the creative heat dissipation module.

The second figure is a three-dimensional exploded structure diagram of the fixed structure of the creative heat dissipation module.

The third figure is another perspective exploded structural view of the fixed structure of the creative heat dissipation module.

The fourth figure is a side cross-sectional structural view of the fixed structure of the creative heat dissipation module.

The fifth figure is another side cross-sectional structural view of the fixed structure of the creative heat dissipation module.

The sixth figure is a floating positioning structure diagram between the first group of vertical frames and the second group of vertical frames.

In order to achieve the above objectives and effects, the technical means used in the creation, its construction, the method of implementation, etc., are described in detail in the preferred embodiment of the present invention, and the features and functions are as follows.

Please refer to the first to sixth figures, which are the three-dimensional appearance structure diagram, the three-dimensional exploded structure diagram, the other three-dimensional exploded structure diagram, the side-view structure diagram, and the other side view of the fixed structure of the heat dissipation module. A cross-sectional structure diagram and a floating positioning structure diagram are formed between the first group of vertical frames and the second group of vertical frames. As can be clearly seen from the figure, the fixed structure of the heat dissipation module of the present invention mainly includes a heat dissipation module 1 and a first group of vertical frames. 2. The circuit board 3, the second group of the vertical frame 4, the fixing member 5 and the screw base frame 6 are connected as follows: the bottom of the heat dissipation module 1 is provided with a first group of vertical frames 2 on at least one pair of sides, and is familiar with the item. The first group of the stand 2 can also be disposed on the two opposite sides of the bottom of the heat dissipation module 1. The first embodiment of the frame 2 is provided with a plurality of fixing holes 20, The preferred implementation of the heat dissipation module 1 is a Vapor Chamber (VC) or a heat sink (Heat Sink).

The circuit board 3 includes at least one heat source element. The implementation structure includes a first heat source element 31 and a second heat source element 32. The first and second heat source elements (31, 32) are referred to as a central processing unit (CPU) or a heat-prone chip. A set (Chipset, for example, a north-south bridge chip, a power chip), a second set of stand 4 is disposed on at least one pair of the tops of the circuit board 3, and the skilled person can also have two pairs on the top of the circuit board 3. Set the second group on the side The frame 4 is also within the scope of the present invention. The second group of frames 4 are provided with a plurality of perforations 40, the perforations 40 being formed by an elliptical hole, and the second group of stands 4 The plurality of first holes 2 of the first group of the vertical frames 2 are disposed on the opposite sides of the first group of the vertical frames 2, and the plurality of the second holes The plurality of fixing members 5 are disposed through the fixing holes 20 and the through holes 40, and the through holes 40 have a space for longitudinally moving the fixing members 5 to form a floating positioning (as shown in FIG. 6), and the first The first and second heat source components (31, 32) are in contact with the bottom of the heat dissipation module 1 to form a fixed structure of the heat dissipation module 1 and the circuit board 3.

At least one heat conducting component 11 is further disposed between the first and second heat source components (31, 32) of the circuit board 3 and the heat dissipation module 1. The preferred component of the heat conducting component 11 is a copper block. The thickness can be adjusted by the distance between the heat dissipation module 1 and the first and second heat source elements (31, 32). One of the heat conducting elements 11 abuts against the bottom of the heat dissipation module 1 and the other surface abuts against the upper surfaces of the first and second heat source elements (31, 32). The heat conducting component 11 of the heat dissipation module 1 is bonded between the upper surfaces of the first and second heat source components (31, 32), and further coated with a thermal grease 12 or a phase change material 13 for heat conduction. The phase change material 13 is a heat-deformable polymer (non-silicone material), which is a bendable solid at room temperature, and has adhesiveness and non-conductivity. When the temperature reaches the phase change temperature of the material, it will quickly soften and form a paste. The gap between the heat source components (31, 32) and the heat dissipation module 1 can be effectively filled to improve the heat conduction performance, so that the phase change material 13 can replace the heat conduction of the heat dissipation paste 12.

A screw mount 6 is further disposed between the heat dissipation module 1 and the circuit board 3, and the screw mount 6 is fixed to the bottom of the heat dissipation module 1 and is provided with a plurality of screw bases 61. The elastic locking member 62 is fixed by the plurality of through holes 30 at the bottom of the circuit board 3 to An elastic buffer structure is formed between the heat dissipation module 1 and the circuit board 3. The elastic lock member 62 is formed by a spring screw.

When the heat dissipation module 1 and the circuit board 3 are to be assembled, the heat conduction element 11 is first disposed on the bottom of the heat dissipation module 1, and a heat dissipation paste or a phase change material is applied on the surface of the heat conduction element 11 in the heat dissipation mode. A screw mount 6 is disposed at the bottom of the group 1, and a first set of the stand 2 is disposed on a pair of sides of the bottom of the heat dissipation module 1. A second group of vertical frames 4 are disposed on a pair of sides of the circuit board 3, and the second group of vertical frames 4 are sleeved on opposite sides of the first group of the second frame 2 of the heat dissipation module 1 and the first group of the first group The fixing holes 20 of the frame 2 correspond to the through holes 40 of the second group of the vertical frames 4, and the fixing holes 20 and the through holes 40 are inserted through the plurality of fixing members 5, and the through holes 40 have the fixing holes The piece 5 moves longitudinally to form a floating position. The first and second heat source components (31, 32) are abutted against the bottom of the heat dissipation module 1 to form a fixed structure of the heat dissipation module 1 and the circuit board 3. The plurality of elastic locking members 62 are fixed by the plurality of through holes 30 at the bottom of the circuit board 3 to the screw base 61 of the screw mount 6, thereby completing the overall assembly. This structure can prevent the wafer from being generated due to vibration or overvoltage ( Refers to the damage condition of the first and second heat source components (31, 32) to achieve both elasticity and vibration.

The disclosure of the first to sixth embodiments shows that the present invention is a fixed structure of a heat dissipation module, which mainly includes a first group of vertical frames disposed on at least one pair of sides of a heat dissipation module. The first set of vertical frames is provided with a plurality of fixing holes; a circuit board includes at least one heat source component, and at least one pair of sides of the circuit board is provided with a second set of vertical frames, and the second set of vertical frames are provided with a plurality of through holes, and the second The set of racks are disposed on opposite sides of the first group of the racks of the heat dissipating module, and the fixing holes of the first group of racks are corresponding to the perforations of the second group of racks, and the plurality of fixing members are used Wearing the fixing hole and the perforations, and the perforations have the The longitudinal movement of the fixing member forms a floating position, and the heat source component is abutted against the bottom of the heat dissipation module to form a fixing structure of the heat dissipation module and the circuit board, thereby achieving both elasticity and vibration resistance. purpose. The present invention solves the problem that the thermal resistance between the conventional central processing unit and the heat dissipation module cannot be reduced, thereby affecting its performance, and has good practicability, so a patent application is filed to seek patent protection.

However, the above description is only a preferred embodiment of the present invention, and thus does not limit the scope of the patent of the present invention. Therefore, all the simple modifications and equivalent structural changes using the present specification and the schema should be the same. It is included in the scope of this creation patent and is given to Chen Ming.

In summary, the fixed structure of the above-mentioned heat-dissipating module is actually implemented and implemented, so as to achieve its efficacy and purpose, the creation is an excellent research and development, and is in conformity with the application requirements of the new patent.提出 Submit an application in accordance with the law, and hope that the trial committee will grant the case as soon as possible to protect the creators' hard work in research and development and creation. If there is any doubt in the ruling committee, please do not hesitate to give instructions, the creators will try their best to cooperate and feel good.

Claims (9)

The fixing structure of the heat dissipation module comprises: a heat dissipation module, wherein at least one pair of sides of the bottom portion is provided with a first group of vertical frames, the first group of vertical frames are provided with a plurality of fixing holes; and a circuit board comprising at least one heat source a second set of vertical frames is disposed on at least one pair of the tops of the circuit board, and the plurality of through holes are disposed on the second set of vertical frames, and the second set of the vertical sets are disposed on the first group of the heat dissipation module The opposite sides of the frame, and the fixing holes of the first group of the first frame are corresponding to the through holes of the second group of the frames, and the plurality of fixing members are used to pass the fixing holes and the through holes, and the through holes have The space in which the fixing members move longitudinally forms a floating position, and the heat source member is abutted against the bottom of the heat dissipation module to form a fixing structure of the heat dissipation module and the circuit board. The fixed structure of the heat dissipation module of claim 1, wherein the heat dissipation module and the circuit board are further provided with a screw mount, the screw mount is fixed to the bottom of the heat dissipation module and is provided with a plurality of The screw bases are provided for the corresponding plurality of elastic locking members to be fixed by the plurality of through holes at the bottom of the circuit board to form an elastic buffer structure between the heat dissipation module and the circuit board. The fixing structure of the heat dissipation module according to claim 2, wherein the elastic locking component is formed by a spring screw. The fixing structure of the heat dissipation module of claim 1, wherein at least one heat conducting component is further disposed between the heat source component of the circuit board and the heat dissipation module, and one of the heat conducting components is in contact with the heat dissipation The bottom of the module and the other side are attached to the upper surface of the heat source element. The fixing structure of the heat dissipation module according to claim 4, wherein the heat dissipation module The heat conducting element is bonded between the upper surface of the heat source element, and is further coated with a heat dissipating paste or a phase change material to conduct heat. The fixing structure of the heat dissipation module according to claim 4, wherein the preferred implementation member of the heat conduction element is a copper block. The fixing structure of the heat dissipation module according to claim 1, wherein the perforation is formed by an elliptical hole. The fixing structure of the heat dissipating module according to claim 1, wherein the heat dissipating module is preferably a heat equalizing plate or a heat dissipating fin. The fixing structure of the heat dissipation module according to claim 1, wherein the heat source component refers to a central processing unit or a heat generating chip set.